TWI616148B - Article of footwear having a sole structure including a fluid-filled chamber and an outsole, the sole structure, and methods for manufacturing - Google Patents
Article of footwear having a sole structure including a fluid-filled chamber and an outsole, the sole structure, and methods for manufacturing Download PDFInfo
- Publication number
- TWI616148B TWI616148B TW105107253A TW105107253A TWI616148B TW I616148 B TWI616148 B TW I616148B TW 105107253 A TW105107253 A TW 105107253A TW 105107253 A TW105107253 A TW 105107253A TW I616148 B TWI616148 B TW I616148B
- Authority
- TW
- Taiwan
- Prior art keywords
- outsole
- fluid
- chamber
- sole structure
- filled chamber
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D35/00—Producing footwear
- B29D35/12—Producing parts thereof, e.g. soles, heels, uppers, by a moulding technique
- B29D35/14—Multilayered parts
- B29D35/148—Moulds or apparatus therefor
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/02—Soles; Sole-and-heel integral units characterised by the material
- A43B13/12—Soles with several layers of different materials
- A43B13/122—Soles with several layers of different materials characterised by the outsole or external layer
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/02—Soles; Sole-and-heel integral units characterised by the material
- A43B13/12—Soles with several layers of different materials
- A43B13/125—Soles with several layers of different materials characterised by the midsole or middle layer
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
- A43B13/18—Resilient soles
- A43B13/20—Pneumatic soles filled with a compressible fluid, e.g. air, gas
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
- A43B13/22—Soles made slip-preventing or wear-resisting, e.g. by impregnation or spreading a wear-resisting layer
- A43B13/223—Profiled soles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D35/00—Producing footwear
- B29D35/12—Producing parts thereof, e.g. soles, heels, uppers, by a moulding technique
- B29D35/14—Multilayered parts
- B29D35/142—Soles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Abstract
本發明係關於一種包括一鞋面及鞋底結構的鞋類物件、該鞋底結構及一種用於製造該鞋底結構之方法以及一種用於製造該鞋類物件之方法。該鞋底結構包括一流體填充室及至少部分包圍該室之一大底。 The invention relates to an article of footwear including an upper and a sole structure, the sole structure, a method for manufacturing the sole structure, and a method for manufacturing the footwear. The sole structure includes a fluid-filled chamber and an outsole that at least partially surrounds the chamber.
Description
本發明係關於一種用於一鞋類物件之鞋底結構、一種包括鞋底結構的鞋類物件及一種用於製造鞋底結構之方法。 The invention relates to a sole structure for an article of footwear, an article of footwear including a sole structure, and a method for manufacturing a sole structure.
本發明大體上係關於一種具有一鞋面及包括共模製流體填充室及大底的一鞋底結構的鞋類物件。本發明亦係關於鞋底結構、一種用於製造鞋底結構之方法及一種用於製造具有鞋底結構的鞋類物件之方法。 The present invention relates generally to an article of footwear having an upper and a sole structure including a co-molded fluid-filled chamber and an outsole. The present invention also relates to a sole structure, a method for manufacturing a sole structure, and a method for manufacturing an article of footwear having a sole structure.
習知運動鞋類物件包括兩個主要元件:一鞋面及一鞋底結構。鞋面大體上由經縫合或黏著性結合在一起以形成用於牢固地且舒適地接納一腳之一內部空隙之複數個元件(例如,織物、發泡體、皮革、合成皮革)形成。鞋底結構併有習知稱為一鞋墊(sock liner)、一中底及一大底之多個層。鞋墊係定位於鞋面之空隙內且鄰近於腳之一足底(即,下)表面以提高舒適度之一薄的、可壓縮部件。中底固定至鞋面且形成鞋底結構之之一中間層,其在走路、跑步或其他走動活動期間減弱地面反作用力(即,給予緩衝)。大底形成鞋類之一地面接觸元件 且通常由包括紋理以賦予牽引力之一耐用的且耐磨的橡膠材料製成。 The conventional sports footwear article includes two main elements: an upper and a sole structure. The upper is generally formed of a plurality of elements (e.g., fabric, foam, leather, synthetic leather) that are stitched or adhesively bonded together to form a secure and comfortable reception of an internal void of one foot. The sole structure also has multiple layers known as a sock liner, a midsole and a large sole. An insole is a thin, compressible component positioned within a gap in the upper and adjacent to the sole (ie, lower) surface of the foot for improved comfort. The midsole is fixed to the upper and forms one of the middle layers of the sole structure, which attenuates ground reaction forces (ie, provides cushioning) during walking, running, or other walking activities. Outsole forming one of the footwear ground contact elements And is usually made of one of the durable and abrasion-resistant rubber materials that includes texture to impart traction.
形成許多習知中底之主要材料係一聚合物發泡體,諸如聚胺基甲酸酯或乙基乙酸乙烯酯。在一些鞋類物件中,中底亦可併有增加鞋類之耐久性且增強鞋底結構之地面反作用力衰減之一流體填充室。在一些鞋類構形中,如在Potter等人之美國專利第5,755,001號、Rapaport之美國專利第6,837,951號及Tawney等人之美國專利第7,132,032號中,流體填充室可至少部分囊封於聚合物發泡體內。在其他鞋類構形中,如在Dojan等人之美國專利第7,086,132號中,流體填充室實質上可取代聚合物發泡體。一般而言,流體填充室係由經密封且經加壓但實質上亦可未經加壓或由一外源加壓之一聚合物材料形成。在一些構形中,可將織物或發泡體抗拉部件定位於室內,或可將強化結構結合至該室之一外表面以賦予該室以形狀或保持該室之一預期形狀。 The main material that forms many conventional midsoles is a polymer foam, such as polyurethane or ethyl acetate. In some footwear items, the midsole may also have a fluid-filled chamber that increases the durability of the footwear and enhances the ground reaction force attenuation of the sole structure. In some footwear configurations, such as in US Pat. No. 5,755,001 to Potter et al., US Pat. No. 6,837,951 to Rapaport and US Pat. No. 7,132,032 to Tawney et al., The fluid-filled chamber may be at least partially encapsulated in a polymer Foam inside. In other footwear configurations, such as in U.S. Patent No. 7,086,132 to Dojan et al., A fluid-filled chamber can substantially replace a polymer foam. In general, a fluid-filled chamber is formed from a polymer material that is sealed and pressurized, but can also be substantially unpressurized or from an external source. In some configurations, a fabric or foam tensile member may be positioned inside the room, or a reinforcing structure may be bonded to an exterior surface of the room to give the room a shape or maintain one of the desired shapes of the room.
適於鞋類應用之流體填充室可透過各種程序製造,包括一雙膜技術、熱成型及吹氣模製。在雙膜技術中,將兩個平面聚合物材料薄片在各個位置中結合在一起以形成室。為對室加壓,將連接至一流體壓力源之一噴嘴或針插入至形成於室中之一填充入口中。在加壓之後,密封填充入口且移除噴嘴。熱成型類似於雙膜技術,但在製造程序期間利用形成或以其他方式塑形聚合物材料薄片之一經加熱模具。在吹氣模製中,將呈一管之形狀的一熔融或以其他方式軟化之彈性材料(即,一型坯)放置於具有室之所要整體形狀及構形的一模具中。模具在一位置處具有透過其提供加壓空氣之一開口。加壓空氣誘發液化彈性材料符合模具之內表面之形狀,藉此形成室,接著可對該室加壓。 Fluid-filled chambers suitable for footwear applications can be manufactured through a variety of processes, including a double membrane technology, thermoforming, and blow molding. In the double-membrane technology, two sheets of planar polymer material are bonded together in various positions to form a chamber. To pressurize the chamber, a nozzle or needle connected to a fluid pressure source is inserted into a fill inlet formed in the chamber. After pressurization, the fill inlet is sealed and the nozzle is removed. Thermoforming is similar to double film technology, but utilizes a heated mold during the manufacturing process to form or otherwise shape one of the thin sheets of polymer material. In blow molding, a molten or otherwise softened elastic material (ie, a parison) in the shape of a tube is placed in a mold having the desired overall shape and configuration of the chamber. The mold has an opening at one location through which pressurized air is provided. The pressurized air induces the liquefied elastic material to conform to the shape of the inner surface of the mold, thereby forming a chamber, which can then be pressurized.
鞋類物件之製造通常涉及確保相關部分相對於彼此在正確位置中。鞋類物件之製造亦可涉及確保部分在組裝期間(例如,在黏著劑 固化及硬化時)被放置時並不移動。又,消費者需要有吸引力、具良好構造且提供選定性質及特性之產品。 The manufacture of articles of footwear generally involves ensuring that the relevant parts are in the correct position relative to each other. The manufacture of articles of footwear may also involve ensuring that parts are assembled during assembly (e.g., during adhesives) During curing and hardening) does not move when placed. Also, consumers need products that are attractive, well-structured, and provide selected properties and characteristics.
因此,此項技術中需要一種提供一顧客所尋求之性質及特性之鞋類物件。 Therefore, there is a need in the art for an article of footwear that provides the properties and characteristics sought by a customer.
本申請案係於2014年8月21日發表且標題為「Article of Footwear Incorporating a Chamber System and Methods for Manufacturing the Chamber System」之Campos II等人之美國專利申請公開案2014/0230276之一部分接續申請案,該申請案揭示內容之全文以引用的方式併入本文中。 This application is a partial continuation of the U.S. Patent Application Publication No. 2014/0230276 of Campos II et al., Published on August 21, 2014 and titled "Article of Footwear Incorporating a Chamber System and Methods for Manufacturing the Chamber System." , The entire disclosure of that application is incorporated herein by reference.
本發明一方面係一種用於包含一鞋面及一鞋底結構的一鞋類物件之鞋底結構,該鞋底結構包含一組件,其包括一流體填充室,該流體填充室具有一邊緣、一上表面及一下表面,及一大底,其具有一室接合表面及一抓地表面,其中該大底經由一黏著劑層附接至該流體填充室之該下表面之至少一部分及該流體填充室之該邊緣之至少一部分;及其中該大底至少部分與該室之該下表面及與該室之該邊緣之至少一部分共延伸;其中該大底之該室接合表面經紋理化,紋理具有高區域及具有一深度的低區域;及其中該黏著劑之一厚度小於該等低區域之該深度。 One aspect of the present invention is a sole structure for an article of footwear that includes an upper and a sole structure. The sole structure includes a component including a fluid-filled chamber having an edge and an upper surface. And a bottom surface, and a large bottom having a chamber engagement surface and a grip surface, wherein the large bottom is attached to at least a portion of the lower surface of the fluid-filled chamber and an area of the fluid-filled chamber via an adhesive layer At least a portion of the edge; and at least a portion of the outsole coextensive with the lower surface of the chamber and at least a portion of the edge of the chamber; wherein the chamber-engaging surface of the outsole is textured with a high area of texture And a low region having a depth; and one of the adhesives has a thickness smaller than the depth of the low regions.
100‧‧‧鞋類物件/鞋類 100‧‧‧Footwear / Shoes
111‧‧‧前足區 111‧‧‧ Forefoot area
112‧‧‧中足區 112‧‧‧ Midfoot
113‧‧‧腳跟區 113‧‧‧ Heel Zone
114‧‧‧外側 114‧‧‧ outside
115‧‧‧內側 115‧‧‧ inside
120‧‧‧鞋面 120‧‧‧ Upper
121‧‧‧腳踝開口 121‧‧‧ Ankle opening
122‧‧‧鞋帶 122‧‧‧Shoelaces
123‧‧‧鞋舌 123‧‧‧ Tongue
124‧‧‧鞋帶孔隙 124‧‧‧ Shoelaces
125‧‧‧鞋墊 125‧‧‧ insole
130‧‧‧鞋底結構 130‧‧‧ sole structure
131‧‧‧前足結構/前足鞋底結構 131‧‧‧ Forefoot structure / Forefoot sole structure
132‧‧‧腳跟結構/腳跟鞋底結構 132‧‧‧Heel structure / Heel sole structure
135‧‧‧抓地凸塊/部分 135‧‧‧Grasp bumps / parts
140‧‧‧前足組件 140‧‧‧ Forefoot Components
141‧‧‧前足組件之上表面 141‧‧‧ Upper surface of forefoot component
142‧‧‧前足組件下表面 142‧‧‧ Lower surface of forefoot component
143‧‧‧前足組件邊緣 143‧‧‧Forefoot component edge
145‧‧‧前足組件流體填充室 145‧‧‧ Forefoot component fluid filled chamber
150‧‧‧腳跟組件 150‧‧‧ Heel Components
151‧‧‧腳跟組件上表面 151‧‧‧ Heel component upper surface
152‧‧‧腳跟組件下表面 152‧‧‧ Heel component lower surface
153‧‧‧腳跟組件邊緣 153‧‧‧ Heel component edge
155‧‧‧腳跟組件流體填充室 155‧‧‧ Heel component fluid filled chamber
160‧‧‧前足大底 160‧‧‧ Forefoot Outsole
162‧‧‧前足大底外下表面 162‧‧‧ Outer lower surface of forefoot outsole
163‧‧‧前足大底外邊緣 163‧‧‧ Outer edge of forefoot outsole
164‧‧‧內表面/前足大底內邊緣 164‧‧‧Inner surface / inner edge of forefoot outsole
165‧‧‧前足大底隔室 165‧‧‧ Forefoot compartment
166‧‧‧前足大底內下表面 166‧‧‧ Inner and lower surface of forefoot outsole
170‧‧‧腳跟大底 170‧‧‧ Heel outsole
175‧‧‧腳跟大底隔室 175‧‧‧ Heel outsole compartment
900‧‧‧特徵部 900‧‧‧ Feature Department
1131‧‧‧前足鞋底結構/前足結構 1131‧‧‧ Forefoot sole structure / Forefoot structure
1135‧‧‧抓地凸塊/抓地部分 1135‧‧‧Grip bump
1140‧‧‧前足組件 1140‧‧‧ Forefoot Components
1141‧‧‧前足組件上表面 1141‧‧‧ Upper surface of forefoot component
1142‧‧‧前足組件下表面/前足組件流體填充室下表面 1142‧‧‧ Lower surface of forefoot component / lower surface of fluid-filled chamber of forefoot component
1143‧‧‧前足組件邊緣/前足組件流體填充室邊緣 1143‧‧‧Edge of forefoot component / Forefoot component fluid filled chamber edge
1145‧‧‧前足組件流體填充室/流體填充組件 1145‧‧‧ Forefoot component fluid filled chamber / fluid filled component
1146‧‧‧前足組件凸緣 1146‧‧‧Forefoot component flange
1147‧‧‧前足組件網狀區域 1147‧‧‧ Mesh area of forefoot component
1150‧‧‧腳跟組件 1150‧‧‧Heel Kit
1152‧‧‧腳跟組件下表面 1152‧‧‧ Heel component lower surface
1155‧‧‧腳跟組件流體填充室 1155‧‧‧ Heel Assembly Fluid Filled Chamber
1156‧‧‧腳跟組件凸緣 1156‧‧‧ Heel Assembly Flange
1157‧‧‧腳跟組件網狀區域 1157‧‧‧ Heel component mesh area
1160‧‧‧前足大底 1160‧‧‧ Outsole
1163‧‧‧前足大底隔室邊緣 1163‧‧‧Edge of forefoot outsole compartment
1170‧‧‧腳跟大底 1170‧‧‧ Heel outsole
1181‧‧‧第一聚合物層 1181‧‧‧first polymer layer
1182‧‧‧第二聚合物層 1182‧‧‧Second polymer layer
1190‧‧‧模具 1190‧‧‧mould
1191‧‧‧第一模具部分 1191‧‧‧The first mold part
1192‧‧‧第二模具部分 1192‧‧‧The second mold part
1198‧‧‧空隙體積 1198‧‧‧Void volume
1700‧‧‧模具 1700‧‧‧mould
1710‧‧‧第一模具部分 1710‧‧‧The first mold part
1720‧‧‧第二模具部分 1720‧‧‧The second mold part
1730‧‧‧捏縮表面 1730‧‧‧ pinched surface
1740‧‧‧第一縫形成表面 1740‧‧‧First seam forming surface
1750‧‧‧壓縮表面 1750‧‧‧compressed surface
1760‧‧‧捏縮邊緣 1760‧‧‧ pinched edge
1770‧‧‧第二縫形成表面 1770‧‧‧Second seam forming surface
1780‧‧‧凹陷 1780 ‧ ‧ sag
1790‧‧‧空隙體積 1790‧‧‧Void volume
1810‧‧‧第一聚合物層 1810‧‧‧first polymer layer
1820‧‧‧第二聚合物層 1820‧‧‧Second polymer layer
1932‧‧‧腳跟鞋底結構 1932‧‧‧Heel sole structure
1955‧‧‧腳跟組件流體填充室 1955‧‧‧heel component fluid-filled chamber
1957‧‧‧腳跟組件網狀區域 1957‧‧‧ Heel component mesh area
1970‧‧‧腳跟大底部分 1970‧‧‧Heel outsole
2060‧‧‧前足大底部分/前足大底 2060‧‧‧Forefoot outsole part / Forefoot outsole part
2069‧‧‧前足大底部分中之氣體逸出開口 2069‧‧‧ Gas escape opening in forefoot outsole
2070‧‧‧腳跟大底/腳跟大底部分 2070‧‧‧Heel outsole / Heel outsole
2079‧‧‧腳跟大底部分中之氣體逸出開口 2079‧‧‧Gas escape opening in heel outsole
2130‧‧‧鞋底結構 2130‧‧‧sole structure
2131‧‧‧前足鞋底結構 2131‧‧‧ Forefoot sole structure
2132‧‧‧腳跟鞋底結構 2132‧‧‧ Heel sole structure
2135‧‧‧抓地凸塊/部分 2135‧‧‧Grip bumps / parts
2140‧‧‧前足組件 2140‧‧‧ Forefoot Components
2150‧‧‧腳跟組件 2150‧‧‧Heel Components
2170‧‧‧腳跟大底 2170‧‧‧ Heel outsole
2178‧‧‧氣體累積區域 2178‧‧‧Gas accumulation area
2179‧‧‧氣體逸出開口/氣體逸出通路 2179‧‧‧Gas escape opening / gas escape path
2181‧‧‧氣體累積通路 2181‧‧‧Gas accumulation pathway
2182‧‧‧氣體累積區域 2182‧‧‧Gas accumulation area
2189‧‧‧氣體逸出開口 2189‧‧‧Gas escape opening
2270‧‧‧大底 2270‧‧‧Outsole
2278‧‧‧氣體累積通路 2278‧‧‧Gas accumulation path
2279‧‧‧氣體逸出開口/氣體逸出通路 2279‧‧‧Gas escape opening / gas escape path
2732‧‧‧腳跟鞋底結構 2732‧‧‧ Heel sole structure
2755‧‧‧腳跟組件流體填充室 2755‧‧‧ Heel component fluid filled chamber
2770‧‧‧腳跟大底部分 2770‧‧‧Heel outsole
2832‧‧‧腳跟鞋底結構 2832‧‧‧ Heel sole structure
2855‧‧‧腳跟組件流體填充室 2855‧‧‧ Heel Assembly Fluid Filled Chamber
2870‧‧‧腳跟大底部分 2870‧‧‧ Heel outsole
參考以下圖式及描述可更佳理解本發明。圖中之組件不一定按比例,而是將重點置於繪示本發明之原理。此外,在圖中,在不同視圖之各處,相似元件符號指代對應部分。 The invention can be better understood with reference to the following drawings and description. The components in the figures are not necessarily to scale, but rather focus on illustrating the principles of the present invention. Further, in the drawings, like-element symbols refer to corresponding parts throughout the different views.
圖1係一鞋類物件之一實施例之一外側立視圖;圖2係鞋類物件之一仰視圖; 圖3係圖2之鞋類物件之一橫截面視圖;圖4係一鞋類物件之一前足鞋底結構之一仰視圖;圖5係具有圖4之前足鞋底結構的一鞋類物件之一橫截面視圖;圖6係圖2之一前足大底之一仰視透視圖;圖7係繪示形成圖2之一前足鞋底結構之一前足大底與一前足組件之間的一關係之一分解視圖;圖8係繪示形成圖2之一腳跟鞋底結構之一腳跟大底與一腳跟組件之間的一關係之一分解視圖;圖9係繪示形成圖4之一前足鞋底結構之一前足大底與一前足組件之間的一關係之一分解視圖;圖10係繪示模具中用於形成圖4之一前足鞋底結構的部分之一關係之一敞模之一橫截面視圖;圖11係繪示形成於模具中之圖4之一前足鞋底結構之一閉模之一橫截面視圖;圖12係繪示模具中用於形成圖2之一腳跟鞋底結構的部分之關係之一敞模之一橫截面視圖;圖13係一部分敞開模具中之圖2之一部分成型腳跟鞋底結構之一橫截面視圖;圖14係繪示形成於模具中之圖2之腳跟鞋底結構之一閉模之一橫截面視圖;圖15係在形成結構之後自敞開之模具移除之圖2之一腳跟鞋底結構之一橫截面視圖;圖16係圖4之一前足大底之內部之一俯視圖;圖17係一腳跟鞋底結構之一實施例之一橫截面視圖;圖18係一腳跟鞋底結構之另一實施例之一橫截面視圖;圖19係一腳跟鞋底結構之另一實施例之一橫截面視圖; 圖20係一鞋類物件之一實施例之一仰視圖;圖21係一腳跟大底之一實施例之一仰視圖;圖22係展示內部結構之一腳跟大底之一實施例之一仰視圖;及圖23係一腳跟大底之另一實施例之一仰視圖。 FIG. 1 is a lateral elevation view of an embodiment of an article of footwear; FIG. 2 is a bottom view of an article of footwear; Fig. 3 is a cross-sectional view of one of the footwear items of Fig. 2; Fig. 4 is a bottom view of one of the forefoot sole structures of an article of footwear; 6 is a bottom perspective view of a forefoot outsole of FIG. 2; FIG. 7 is an exploded view showing a relationship between a forefoot outsole and a forefoot component forming a forefoot sole structure of FIG. 2 8 is an exploded view showing a relationship between a heel outsole and a heel component forming one of the heel sole structure of FIG. 2; FIG. 9 is a front forefoot sole forming one of the forefoot sole structure of FIG. 4 An exploded view of a relationship between the sole and a forefoot component; FIG. 10 is a cross-sectional view of an open mold showing a relationship of a part of the mold used to form a forefoot sole structure of FIG. 4; 4 is a cross-sectional view of a closed mold of a forefoot sole structure of FIG. 4 formed in a mold; FIG. 12 is a view of an open mold of a relationship between a part of the mold used to form a heel sole structure of FIG. 2 A cross-sectional view; Figure 13 is a portion of Figure 2 in a partially open mold A cross-sectional view of a molded heel sole structure; FIG. 14 is a cross-sectional view of a closed mold of the heel sole structure of FIG. 2 formed in a mold; FIG. 15 is removed from an open mold after the structure is formed Figure 2 is a cross-sectional view of a heel sole structure; Figure 16 is a top view of the inside of a forefoot outsole of Figure 4; Figure 17 is a cross-sectional view of an embodiment of a heel sole structure; Figure 18 is a A cross-sectional view of one of another embodiment of a heel sole structure; FIG. 19 is a cross-sectional view of one of another embodiment of a heel sole structure; Figure 20 is a bottom view of one embodiment of a footwear article; Figure 21 is a bottom view of one embodiment of a heel outsole; Figure 22 is a bottom view of one embodiment of a heel outsole showing internal structure Figures; and Figure 23 is a bottom view of another embodiment of a heel outsole.
本發明提供一種提供一顧客所尋求之性質及特性之鞋類物件。本發明之實施例提供一種用於一鞋類物件之鞋底結構,其包含與一大底共模製之一流體填充室,該大底至少部分包圍該室。本發明之實施例亦提供一種包括一鞋面及鞋底結構的鞋類物件。本發明之實施例提供一種用於製造鞋底結構之方法。本發明亦係關於一種用於製造鞋類物件之方法。 The present invention provides an article of footwear that provides the properties and characteristics sought by a customer. An embodiment of the present invention provides a sole structure for an article of footwear, which includes a fluid-filled chamber co-molded with a large sole, the large sole at least partially surrounding the chamber. An embodiment of the present invention also provides an article of footwear including an upper and a sole structure. An embodiment of the present invention provides a method for manufacturing a sole structure. The invention also relates to a method for manufacturing an article of footwear.
在一態樣中,本發明係關於一種用於鞋類物件之鞋底結構。該鞋底結構包括一流體填充室及一大底。該流體填充室具有一邊緣、一上表面及一下表面。該大底共模製至該流體填充室之該下表面之至少一部分及該流體填充室之該邊緣之至少部分。該大底與該流體填充室之該下表面之至少部分及該流體填充室之該邊緣之至少部分共延伸。 In one aspect, the invention relates to a sole structure for an article of footwear. The sole structure includes a fluid-filled chamber and a large sole. The fluid-filled chamber has an edge, an upper surface, and a lower surface. The outsole is co-molded to at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber. The outsole is coextensive with at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber.
在另一態樣中,本發明係關於一種具有一鞋面及一鞋底結構的鞋類物件。該鞋底結構包括一流體填充室及一大底。該流體填充室具有一邊緣、一上表面及一下表面。該大底共模製至該流體填充室之該下表面之至少一部分及該流體填充室之該邊緣之至少一部分。該大底與該流體填充室之該下表面之至少部分及該流體填充室之該邊緣之至少部分共延伸。該鞋面之至少部分固定至該鞋底結構之至少部分。 In another aspect, the present invention relates to an article of footwear having an upper and a sole structure. The sole structure includes a fluid-filled chamber and a large sole. The fluid-filled chamber has an edge, an upper surface, and a lower surface. The outsole is co-molded to at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber. The outsole is coextensive with at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber. At least part of the upper is fixed to at least part of the sole structure.
本發明之一態樣係關於一種用於製造包含一流體填充室及一大底的鞋底結構之方法。該流體填充室具有一邊緣、一上表面及一下表面。根據該方法,將該大底定位於具有一第一模具部分及一第二模具部分的一模具之該第二部分中之適當位置中,使其接觸該室之該邊緣 之至少一部分及該室之該下表面之至少一部分。將一流體填充室前驅物放置於該模具中且閉合該第一模具部分及該第二模具部分。藉由一技術使該流體填充室之該上表面符合該第一模具部分之形狀、使該流-體填充室之該下表面符合其中具有該大底之該第二模具部分之形狀、且使該流體填充室前驅物之邊緣符合其中具有該大底之該模具之形狀,以形成該流體填充室及與其共模製之該大底,該技術係選自由抽吸模具中之一真空、將壓力引入至流體填充室前驅物中及其等之混合組成之群組。 One aspect of the present invention relates to a method for manufacturing a sole structure including a fluid-filled chamber and a large sole. The fluid-filled chamber has an edge, an upper surface, and a lower surface. According to the method, the outsole is positioned in an appropriate position in the second part of a mold having a first mold part and a second mold part so that it contacts the edge of the chamber At least a portion of the chamber and at least a portion of the lower surface of the chamber. A fluid-filled chamber precursor is placed in the mold and the first mold portion and the second mold portion are closed. By a technique, the upper surface of the fluid-filled chamber conforms to the shape of the first mold portion, the lower surface of the fluid-filled chamber conforms to the shape of the second mold portion having the large bottom therein, and The edge of the fluid-filled chamber precursor conforms to the shape of the mold having the outsole therein to form the fluid-filled chamber and the outsole co-molded therewith. The technique is selected from a vacuum in one of the suction molds. Pressure is introduced into the fluid-filled chamber precursor and a mixture thereof.
在另一態樣中,本發明係關於一種用於最小化一流體填充室之結合表面與一大底之結合表面之間的結合中由氣體相關夾雜物引起之不完全結合之有害效應之方法。該等結合表面之至少一者包括具有凸面(land)及凹槽的一紋理以確保該等凸面與另一表面之間的一結合。凹槽比一黏著劑或一部分熔融相對表面之厚度更深。 In another aspect, the invention relates to a method for minimizing the harmful effects of incomplete bonding caused by gas-related inclusions in the bonding between the bonding surface of a fluid-filled chamber and the bonding surface of a large bottom. . At least one of the bonding surfaces includes a texture having a land and a groove to ensure a bond between the convex surfaces and another surface. The groove is deeper than an adhesive or a portion of the molten opposing surface.
在一些實施例中,鞋面之至少部分固定至鞋底結構之至少部分。 In some embodiments, at least a portion of the upper is secured to at least a portion of the sole structure.
在一些實施例中,大底之抓地(ground-engaging)表面之至少部分經紋理化。 In some embodiments, at least a portion of the ground-engaging surface of the outsole is textured.
在一些實施例中,流體填充室之邊緣係與大底齊平。 In some embodiments, the edges of the fluid-filled chamber are flush with the outsole.
在一些實施例中,其中大底藉由部分熔融大底之室接合表面、流體填充室之下表面及流體填充室之邊緣之至少一者而黏著至流體填充室。 In some embodiments, the outsole is adhered to the fluid-filled chamber by partially melting at least one of a chamber joining surface of the outsole, a lower surface of the fluid-filled chamber, and an edge of the fluid-filled chamber.
在一些實施例中,大底藉由具有一厚度之一黏著劑層黏著至流體填充室。 In some embodiments, the outsole is adhered to the fluid-filled chamber by an adhesive layer having a thickness.
在一些實施例中,大底之室接合表面經紋理化,紋理具有高區域及具有深度的低區域,其中黏著劑之厚度小於於該等低區域之深度。 In some embodiments, the chamber bonding surface of the outsole is textured, the texture has high areas and low areas with depth, wherein the thickness of the adhesive is less than the depth of these low areas.
在一些實施例中,大底之室接合表面經紋理化,紋理具有高區域及具有深度的低區域,且大底進一步具有氣體逸出開口。 In some embodiments, the chamber joining surface of the outsole is textured, the texture has high areas and low areas with depth, and the outsole further has gas escape openings.
在一些實施例中,大底之室接合表面經紋理化,紋理具有高區域及具有深度的低區域,且大底進一步具有與氣體累積區域及通路流體連通之氣體逸出開口。 In some embodiments, the chamber junction surface of the outsole is textured, the texture has a high area and a low area with a depth, and the outsole further has a gas escape opening in fluid communication with the gas accumulation area and the passage.
在一些實施例中,大底之室接合表面經紋理化,紋理具有高區域及具有深度的低區域,且大底進一步具有與該等低區域流體連通之氣體逸出開口。 In some embodiments, the chamber junction surface of the outsole is textured, the texture has high areas and low areas with depth, and the outsole further has gas escape openings in fluid communication with the low areas.
在其他態樣中,本發明係關於一種製造用於包含一鞋面及一鞋底結構的一鞋類物件之一鞋底結構之方法。根據該方法,提供包括具有一邊緣、一上表面及一下表面的一流體填充室的一組件。將一大底共模製至該流體填充室之該下表面之至少一部分及該流體填充室之該邊緣之至少一部分。該大底至少部分與該室之該下表面及該室之該邊緣之至少一部分共延伸,且該大底具有一室接合表面及一抓地表面。 In other aspects, the invention relates to a method of manufacturing a sole structure for an article of footwear that includes an upper and a sole structure. According to the method, an assembly is provided that includes a fluid-filled chamber having an edge, an upper surface, and a lower surface. A large bottom is co-molded to at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber. The outsole is at least partially coextensive with the lower surface of the chamber and at least a portion of the edge of the chamber, and the outsole has a chamber engaging surface and a grip surface.
在一些實施例中,該方法進一步包含:將該大底定位於具有一第一模具部分及一第二模具部分的一模具之該第二部分中之適當位置中,使其接觸該室之邊緣之至少一部分及該室之該下表面之至少一部分。將一流體填充室前驅物放置於該模具中且閉合該第一模具部分及該第二模具部分。 In some embodiments, the method further comprises: positioning the outsole in an appropriate position in the second portion of a mold having a first mold portion and a second mold portion such that it contacts the edge of the chamber At least a portion of the chamber and at least a portion of the lower surface of the chamber. A fluid-filled chamber precursor is placed in the mold and the first mold portion and the second mold portion are closed.
使用一技術使該流體填充室之該上表面符合該第一模具部分之形狀、使該流體填充室之該下表面符合其中具有該大底之該第二模具部分之形狀、且使該流體填充室前驅物之邊緣符合其中具有該大底之該模具之形狀,以形成該流體填充室及與其共模製之該大底,該技術係選自由抽吸模具中之一真空、將壓力引入至流體填充室前驅物中及其等之混合組成之群組。 Using a technique to make the upper surface of the fluid-filled chamber conform to the shape of the first mold part, make the lower surface of the fluid-filled chamber conform to the shape of the second mold part with the outsole therein, and fill the fluid The edge of the chamber precursor conforms to the shape of the mold having the outsole therein to form the fluid-filled chamber and the outsole co-molded therewith. The technique is selected from the vacuum in one of the molds to introduce pressure to A group of fluid-filled chamber precursors and their mixtures.
在一些實施例中,鞋面之至少部分連接至鞋底結構之至少部 分。 In some embodiments, at least a portion of the upper is connected to at least a portion of the sole structure Minute.
在一些實施例中,在將流體填充室前驅物放置至模具中之前將黏著劑塗敷於大底之室接合表面。 In some embodiments, an adhesive is applied to the chamber-engaging surface of the outsole before placing the fluid-filled chamber precursor into the mold.
在一些實施例中,在將流體填充室前驅物放置於模具中之前使黏著劑乾燥。 In some embodiments, the adhesive is dried before placing the fluid-filled chamber precursor in a mold.
在一些實施例中,該方法進一步包含:共擠製大底與流體填充室前驅物之下表面。 In some embodiments, the method further comprises: coextruding the outsole and the lower surface of the fluid-filled chamber precursor.
在一些實施例中,該方法進一步包含:部分熔融流體填充室之下表面、流體填充室之邊緣及大底之室接合表面之至少一者。 In some embodiments, the method further comprises at least one of a lower surface of the partially filled fluid-filled chamber, an edge of the fluid-filled chamber, and a chamber bottom surface of the outsole.
在一些實施例中,該方法進一步包含:在室接合表面上形成一紋理,該紋理具有高區域及低區域,及在大底中形成氣體逸出開口。 In some embodiments, the method further includes forming a texture on the chamber bonding surface, the texture having high and low areas, and forming a gas escape opening in the outsole.
在一些實施例中,大底之室接合表面經紋理化,紋理具有高區域及具有深度的低區域,且大底進一步具有與氣體累積區域及通路流體連通之氣體逸出開口。 In some embodiments, the chamber junction surface of the outsole is textured, the texture has a high area and a low area with a depth, and the outsole further has a gas escape opening in fluid communication with the gas accumulation area and the passage.
在一些實施例中,大底之室接合表面經紋理化,紋理具有高區域及具有深度的低區域,且大底進一步具有與該等低區域流體連通之氣體逸出開口。 In some embodiments, the chamber junction surface of the outsole is textured, the texture has high areas and low areas with depth, and the outsole further has gas escape openings in fluid communication with the low areas.
在一些實施例中,藉由將壓力引入至流體填充室前驅物中而使流體填充室之邊緣符合模具之邊緣。 In some embodiments, the edge of the fluid-filled chamber conforms to the edge of the mold by introducing pressure into the fluid-filled chamber precursor.
在另一態樣中,本發明係關於一種用於製造具有一鞋面及一鞋底結構的一鞋類物件之方法。根據本發明,該方法包含:將該鞋面之至少部分固定至該鞋底結構之至少部分。該鞋底結構包含具有一邊緣、一上表面及一下表面的一流體填充室。將大底共模製至該流體填充室之該下表面之至少一部分及該流體填充室之該邊緣之至少一部分。該大底與該流體填充室之該下表面之至少部分及該流體填充室之該邊緣之至少部分共延伸。 In another aspect, the present invention relates to a method for manufacturing an article of footwear having an upper and a sole structure. According to the invention, the method includes fixing at least a portion of the upper to at least a portion of the sole structure. The sole structure includes a fluid-filled chamber having an edge, an upper surface, and a lower surface. The outsole is co-molded to at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber. The outsole is coextensive with at least a portion of the lower surface of the fluid-filled chamber and at least a portion of the edge of the fluid-filled chamber.
一般技術者在檢驗以下圖及【實施方式】之後將明白或將變得明白本發明之其他系統、方法、特徵及優點。預期全部此等額外系統、方法、特徵及優點包括在本描述及本概述內、在本發明之範疇內且受以下申請專利範圍保護。 Those skilled in the art will understand or will become aware of other systems, methods, features and advantages of the present invention after examining the following drawings and [Embodiment]. It is contemplated that all such additional systems, methods, features, and advantages are included in this description and this summary, are within the scope of the present invention, and are protected by the scope of the following patent applications.
本發明提供一種提供一顧客所尋求之性質及特性之鞋類物件。本發明之實施例提供一種用於一鞋類物件之鞋底結構,其包含與一大底共模製之一流體填充室,該大底至少部分包圍該室。本發明之實施例亦提供一種包括一鞋面及鞋底結構的鞋類物件。本發明之實施例提供一種用於製造鞋底結構之方法。本發明亦係關於一種用於製造鞋類物件之方法。 The present invention provides an article of footwear that provides the properties and characteristics sought by a customer. An embodiment of the present invention provides a sole structure for an article of footwear, which includes a fluid-filled chamber co-molded with a large sole, the large sole at least partially surrounding the chamber. An embodiment of the present invention also provides an article of footwear including an upper and a sole structure. An embodiment of the present invention provides a method for manufacturing a sole structure. The invention also relates to a method for manufacturing an article of footwear.
以下論述及附圖揭示各種流體填充室。參考適於跑步之鞋類揭示與室有關之概念。然而,室不限於針對跑步設計之鞋類,且可與廣範圍的運動鞋類款式一起使用,該等款式包括例如籃球鞋、交叉訓練鞋、騎行鞋、足球鞋、英式足球鞋、網球鞋及走路鞋。室之各種構形可與一般被視為非運動的鞋類款式一起使用,該等款式包括便鞋、平底便鞋、涼鞋及靴。因此,與室有關之概念可應用於各種鞋類款式。 The following discussion and drawings disclose various fluid-filled chambers. Refer to footwear suitable for running to reveal room related concepts. However, the room is not limited to footwear designed for running and can be used with a wide range of athletic footwear styles including, for example, basketball shoes, cross training shoes, cycling shoes, football shoes, soccer shoes, tennis shoes And walking shoes. The various configurations of the chamber can be used with footwear styles that are generally considered non-sports, including slippers, flats, sandals and boots. Therefore, room-related concepts can be applied to various footwear styles.
大體鞋類結構General footwear structure
一鞋類物件100在圖1及圖2中描繪為包括一鞋面120及一鞋底結構130。鞋面120為一穿著者之一腳提供一舒適的且牢固的覆蓋。因而,可將腳可定位於鞋面120內以將腳有效地固定於鞋類物件100內,或以其他方式聯合腳與鞋類物件100。鞋底結構130固定至鞋面120之一下部區域且在腳與地面之間延伸以例如減弱地面反作用力(即,緩衝腳)、提供牽引力、增強穩定性且影響腳之運動。實際上,鞋底結構130定位於腳下方且支撐腳。 An article of footwear 100 is depicted in FIGS. 1 and 2 as including an upper 120 and a sole structure 130. The upper 120 provides a comfortable and firm covering for one of the wearer's feet. Thus, the foot may be positioned within the upper 120 to effectively secure the foot within the article of footwear 100, or otherwise combine the foot with the article of footwear 100. The sole structure 130 is fixed to a lower region of the upper 120 and extends between the foot and the ground to, for example, reduce ground reaction forces (ie, cushion the foot), provide traction, enhance stability, and affect foot movement. Actually, the sole structure 130 is positioned under the foot and supports the foot.
出於參考目的,可將鞋類100劃分成三個大體區:一前足區111、一中足區112及一腳跟區113。前足區111大體上包括與腳之腳趾及連 接蹠骨與趾骨之關節對應之鞋類物件100之部分。中足區112大體上包括與腳之一足弓區域對應之鞋類100之部分。腳跟區113大體上對應於腳之後部分(包括跟骨)。鞋類物件100亦包括一外側114及一內側115,其等對應於鞋類物件100之相對側且延伸穿過前足區111、中足區112及腳跟區113之各者。更特定言之,外側114對應於腳之一外部區域(即,背對另一腳之表面),且內側115對應於腳之一內部區域(即,面朝另一腳之表面)。前足區111、中足區112、腳跟區113、外側114及內側115並不意欲劃界鞋類100之精確區域。而是,前足區111、中足區112、腳跟區113、外側114及內側115意欲表示鞋類100之大體區域以輔助以下論述。前足區111、中足區112、腳跟區113、外側114及內側115之特性可應用於鞋類物件100,且亦可應用於鞋面120、鞋底結構130、前足結構131、腳跟結構132及其等之個別元件。 For reference purposes, the footwear 100 may be divided into three general regions: a forefoot region 111, a midfoot region 112, and a heel region 113. Forefoot region 111 generally includes toes and joints with the feet The part of the article of footwear 100 corresponding to the joint of the cheekbones and the phalanges. The midfoot region 112 generally includes a portion of the footwear 100 corresponding to one arch region of the foot. The heel region 113 generally corresponds to the posterior part of the foot (including the calcaneus). The article of footwear 100 also includes an outer side 114 and an inner side 115 that correspond to opposite sides of the article of footwear 100 and extend through each of the forefoot region 111, the midfoot region 112, and the heel region 113. More specifically, the outer side 114 corresponds to an outer region of one foot (ie, the surface facing away from the other foot), and the inner side 115 corresponds to an inner region of one foot (ie, the surface facing the other foot). The forefoot region 111, the midfoot region 112, the heel region 113, the outer side 114, and the inner side 115 are not intended to delimit the precise regions of the footwear 100. Instead, the forefoot region 111, the midfoot region 112, the heel region 113, the outer side 114, and the inner side 115 are intended to represent the general regions of the footwear 100 to assist the following discussion. The characteristics of forefoot region 111, midfoot region 112, heel region 113, lateral 114 and medial 115 can be applied to footwear article 100, and can also be applied to upper 120, sole structure 130, forefoot structure 131, heel structure 132, and And other individual components.
將鞋面120描繪為具有一實質上習知構形。鞋面120之絕大部分併有縫合或黏著性結合在一起以形成用於牢固地且舒適地接納一腳之一內部空隙之各種材料元件(例如,織物、發泡體、皮革及合成皮革)。可選擇材料元件且將材料元件定位於鞋面120中以選擇性地賦予例如耐久性、透氣性、耐磨性、可撓性及舒適度之性質。鞋面120中之空隙經塑形以容納腳。因此,當腳定位於該空隙內時,鞋面120沿腳之一外側、沿腳之一內側、在腳上方、圍繞腳跟且在腳下方延伸。腳跟區113中之一腳踝開口121為腳提供至空隙之出入口。一鞋帶122在一鞋舌123上方延伸且延伸穿過鞋面120中之各個鞋帶孔隙124或其他鞋帶接納元件。可以一習知方式利用鞋帶122及由鞋舌123提供之可調整性以修改腳踝開口121及內部空隙之尺寸,藉此將腳固定於內部空隙內且有利於腳伸入內部空隙及自內部空隙抽出。 The upper 120 is depicted as having a substantially conventional configuration. The majority of the upper 120 is stitched or adhesively bonded together to form various material elements (e.g., fabric, foam, leather, and synthetic leather) for firmly and comfortably receiving an internal void of one foot . The material element may be selected and positioned in the upper 120 to selectively impart properties such as durability, breathability, abrasion resistance, flexibility, and comfort. The voids in the upper 120 are shaped to accommodate the feet. Therefore, when the foot is positioned within the gap, the upper 120 extends along the outside of one foot, along the inside of one foot, above the foot, around the heel, and below the foot. One of the ankle openings 121 in the heel region 113 provides an entrance for the foot to the gap. A lace 122 extends above a tongue 123 and extends through each lace aperture 124 or other lace receiving element in the upper 120. The size of the ankle opening 121 and the internal space can be modified in a conventional manner by using the adjustability provided by the shoelace 122 and the tongue 123, thereby fixing the foot in the internal space and facilitating the foot to extend into and from the internal The gap is drawn out.
鞋面120之進一步構形亦可包括以下之一或多者:(a)定位於前足區111中且由一耐磨材料形成之一護趾板(toe guard);(b)定位於腳跟 區113中以增強穩定性之一腳跟穩定器(heel counter);及(c)標誌、商標及具有保養指示及材料資訊之標牌。在本論述之各種態樣主要係關於鞋底結構130之情況下,鞋面120可展現上文論述之大體構形或實際上任何其他習知或非習知鞋面之大體構形。因此,鞋面120之結構可在本發明之範疇內顯著變化。 The further configuration of the upper 120 may also include one or more of the following: (a) a toe guard positioned in the forefoot region 111 and formed of a wear-resistant material; (b) positioned on the heel Zone 113 includes a heel counter for enhanced stability; and (c) logos, trademarks, and signs with maintenance instructions and material information. In the case where the various aspects of this discussion are primarily about the sole structure 130, the upper 120 may exhibit the general configuration discussed above or virtually any other conventional or non-conventional upper configuration. Therefore, the structure of the upper 120 may vary significantly within the scope of the present invention.
鞋底結構Sole structure
鞋底結構130之主要元件係包括一前足組件140及一前足大底160的一前足鞋底結構131,及包括一腳跟組件150及一腳跟大底170的一腳跟鞋底結構。在一些實施例中,前足組件140及腳跟組件150之各者可直接固定至鞋面120之一下部區域。前足組件140及腳跟組件150係由圍封一流體(其可為一氣體、液體或凝膠)之一聚合物材料形成。例如,在走路及跑步期間,前足組件140及腳跟組件150可在腳與地面之間壓縮,藉此減弱地面反作用力。即,前足組件140及腳跟組件150係膨脹的且大體上由流體加壓以緩衝腳。 The main components of the sole structure 130 include a forefoot component 140 and a forefoot sole structure 131, and a heel sole structure including a heel component 150 and a heel sole 170. In some embodiments, each of the forefoot component 140 and the heel component 150 may be directly fixed to a lower region of the upper 120. The forefoot component 140 and the heel component 150 are formed of a polymer material that encloses a fluid (which may be a gas, liquid, or gel). For example, during walking and running, the forefoot component 140 and the heel component 150 may be compressed between the foot and the ground, thereby reducing the ground reaction force. That is, the forefoot component 140 and the heel component 150 are inflated and substantially pressurized by a fluid to cushion the foot.
在一些構形中,鞋底結構130可包括例如在鞋面120與前足組件140及腳跟組件150之一或兩者之間延伸之一發泡體層,或可將一發泡體元件定位於前足組件140及腳跟組件150之下部區域中之壓凹內。在其他構形中,前足鞋底結構131可併有進一步減弱力、增強穩定性或影響腳之運動的板、緩衝體、上楦元件(lasting element)或運動控制部件。腳跟鞋底結構132亦可包括此等部件以進一步減弱力、增強穩定性或影響腳之運動。 In some configurations, sole structure 130 may include, for example, a foam layer extending between upper 120 and one or both of forefoot component 140 and heel component 150, or a foam element may be positioned on the forefoot component. 140 and depressions in the lower region of the heel assembly 150. In other configurations, the forefoot sole structure 131 may be provided with a plate, a cushion, a lasting element, or a motion control component that further weakens the force, enhances stability, or affects the movement of the foot. Heel sole structure 132 may also include these components to further reduce force, enhance stability, or affect the movement of the foot.
除提供鞋類物件100中之一磨損表面之外,前足大底160及腳跟大底170亦可增強鞋底結構130之各種性質及特性。可改變或選擇大底之性質及特性(諸如厚度、可撓性、用以製作大底之材料之性質及特性及拉伸性)以修改或以其他方式調諧鞋底結構130之緩衝響應、可壓縮性、可撓性及其他性質及特性。大底之強化(例如,包括諸如肋之 結構元件)、孔隙、重疊高度、重疊之邊緣之數目及位置或一大底之其他特徵皆可用以調諧鞋底結構之響應。一大底亦可併有賦予牽引力之踏面(tread)元件,諸如突出部、脊或抓地凸塊(lug)或區段。在一些實施例中,一大底可由一板或其他結構元件取代。一板可具有幫助將一大底或其他元件固定至腳跟組件150之特徵部。 In addition to providing one of the wear surfaces of the article of footwear 100, the forefoot outsole 160 and the heel outsole 170 can also enhance various properties and characteristics of the sole structure 130. Can change or select the properties and characteristics of the outsole (such as thickness, flexibility, properties and characteristics of materials used to make outsoles and stretchability) to modify or otherwise tune the cushioning response of the sole structure 130, compressible Flexibility, flexibility and other properties and characteristics. Outsole reinforcement (for example, including Structural elements), porosity, overlapping height, number and location of overlapping edges, or other features of the outsole can be used to tune the response of the sole structure. The outsole can also incorporate traction-reading tread elements, such as protrusions, ridges, or lugs or sections. In some embodiments, the outsole can be replaced by a plate or other structural element. A plate may have features that help secure a large outsole or other element to the heel assembly 150.
特定言之,可使用遠離抓地部分且在一前足組件或一腳跟組件之邊緣之上的一大底之一部分之重疊來調諧所得鞋底結構之彈性響應及緩衝響應。運用本文中提供之導引,使用者可結合組件之流體填充組件之性質及特性考量大底之此等及其他性質及特性,以調整一鞋底結構之響應。 In particular, the elastic response and cushioning response of the resulting sole structure may be tuned using the overlap of a portion of a large sole away from the grip portion and above the edge of a forefoot component or a heel component. Using the guidance provided in this article, users can consider these and other properties and characteristics of the outsole in conjunction with the properties and characteristics of the fluid-filled components of the component to adjust the response of a sole structure.
鞋底結構130可為半透明的或透明的,且為美感可經著色或經圖案化。 The sole structure 130 may be translucent or transparent, and is aesthetically pleasing and may be colored or patterned.
前足大底160固定至前足組件140之下部區域。在一些實施例中,前足鞋底結構131可延伸至中足區112中。前足大底160亦可固定至中足區112中之前足組件140之下部區域。腳跟大底170固定至腳跟組件150之下部區域。腳跟組件150及腳跟大底170兩者皆可延伸至中足區112中。前足大底160及腳跟大底170可由一耐磨材料形成。耐磨材料可為透明的或半透明的以提供一悅目效果。耐磨材料在抓地部分上可經紋理化以賦予牽引力。在一些實施例中,耐磨材料可具有抓地凸塊或部分135,如圖1及圖2中所繪示。 The forefoot outsole 160 is fixed to a lower area of the forefoot assembly 140. In some embodiments, the forefoot sole structure 131 may extend into the midfoot region 112. The forefoot outsole 160 may also be fixed to the lower region of the forefoot component 140 in the midfoot region 112. The heel outsole 170 is fixed to a lower area of the heel assembly 150. Both the heel assembly 150 and the heel outsole 170 can extend into the midfoot region 112. The forefoot outsole 160 and the heel outsole 170 may be formed of a wear-resistant material. The abrasion resistant material may be transparent or translucent to provide a pleasing effect. The abrasion resistant material may be textured on the grip to impart traction. In some embodiments, the abrasion-resistant material may have grip bumps or portions 135, as shown in FIGS. 1 and 2.
圖3繪示剖面線3-3處之具有包括前足組件140及具有抓地凸塊135的前足大底160的前足鞋底結構131的鞋類物件100之一橫截面視圖。如圖3中所描繪,鞋面120亦包括一鞋墊125,其定位於空隙內且經定位而在腳之一下表面下方延伸以提高鞋類物件100之舒適度。 FIG. 3 illustrates a cross-sectional view of one of the articles of footwear 100 having a forefoot sole structure 131 including a forefoot component 140 and a forefoot outsole 160 with a grip 135 at section line 3-3. As depicted in FIG. 3, the upper 120 also includes an insole 125 positioned in the gap and positioned to extend below a lower surface of one of the feet to improve the comfort of the article of footwear 100.
圖4繪示包括前足組件1140及具有與其相關聯之抓地凸塊1135的前足大底1160的前足鞋底結構1131之另一實施例之一仰視圖。前足組 件1140直接固定至鞋面120之一下部區域,且係由圍封一流體(其可為一氣體、液體或凝膠)之一聚合物材料形成。前足組件1140可延伸至中足區112中。前足組件1140可在腳與地面之間壓縮,藉此減弱地面反作用力。前足組件1140之流體填充室1145可為膨脹的且大體上由一流體加壓以緩衝腳。 FIG. 4 illustrates a bottom view of another embodiment of a forefoot sole structure 1131 including a forefoot component 1140 and a forefoot outsole 1160 associated with the grounding protrusion 1135. Forefoot group The piece 1140 is directly fixed to a lower region of the upper 120 and is formed of a polymer material that encloses a fluid (which may be a gas, liquid, or gel). The forefoot component 1140 may extend into the midfoot region 112. The forefoot assembly 1140 can be compressed between the foot and the ground, thereby reducing ground reaction forces. The fluid-filled chamber 1145 of the forefoot assembly 1140 may be inflated and substantially pressurized by a fluid to cushion the foot.
前足大底1160(其亦可延伸至中足區112中)固定至前足組件1140之下部區域。前足大底1160可包括覆蓋前足組件1140之流體填充室1145之個別下部區域之個別部分。前足大底1160可由耐磨材料形成,且在一些實施例中可包括抓地部分或凸塊1135。前足大底1160可為透明的或半透明的,且在一些實施例中可經紋理化以改良牽引力。 The forefoot outsole 1160 (which can also extend into the midfoot region 112) is fixed to the lower region of the forefoot component 1140. The forefoot outsole 1160 may include individual portions that cover individual lower regions of the fluid-filled chamber 1145 of the forefoot component 1140. The forefoot outsole 1160 may be formed of an abrasion-resistant material, and in some embodiments may include a grip portion or a bump 1135. The forefoot outsole 1160 may be transparent or translucent, and in some embodiments may be textured to improve traction.
圖5繪示剖面線3-3處之用於包括前足組件1140及前足大底1160的前足鞋底結構1130之另一實施例之一鞋類物件100之一橫截面視圖。鞋面120包括鞋帶122、鞋舌123及鞋墊125。 FIG. 5 illustrates a cross-sectional view of an article of footwear 100 at another section of a forefoot sole structure 1130 including a forefoot component 1140 and a forefoot outsole 1160 at section line 3-3. The upper 120 includes a lace 122, a tongue 123, and an insole 125.
前足組件140及腳跟組件150係由界定一上表面、一下表面及一邊緣之一聚合物材料形成。前足組件140可包括複數個前足組件流體填充室145,且腳跟組件150可包括複數個流體填充室155,其等之各者可與組件之至少一其他室流體連通。在圖7中,前足組件140之上表面141面向下,使得各前足組件流體填充室145之前足組件下表面142及前足組件邊緣143清晰可見。類似地,在圖9中,前足組件1140之上表面1141面向下,使得各前足組件流體填充室1145之前足組件下表面1142及前足組件邊緣1143清晰可見。圖8中繪示腳跟組件150之腳跟組件流體填充室155、腳跟組件上表面151、腳跟組件下表面152及腳跟組件邊緣153。 The forefoot component 140 and the heel component 150 are formed of a polymer material defining an upper surface, a lower surface, and an edge. The forefoot assembly 140 may include a plurality of forefoot assembly fluid-filled chambers 145, and the heel assembly 150 may include a plurality of fluid-filled chambers 155, each of which may be in fluid communication with at least one other chamber of the assembly. In FIG. 7, the upper surface 141 of the forefoot component 140 faces downward, so that the forefoot component lower surface 142 and the forefoot component edge 143 of the forefoot component fluid-filled chamber 145 are clearly visible. Similarly, in FIG. 9, the upper surface 1141 of the forefoot component 1140 faces downward, so that the forefoot component fluid-filled chamber 1145 forefoot component lower surface 1142 and the forefoot component edge 1143 are clearly visible. FIG. 8 illustrates the heel component fluid filling chamber 155 of the heel component 150, the heel component upper surface 151, the heel component lower surface 152, and the heel component edge 153.
圖6繪示前足大底160之一例示性底表面。前足大底160包括具有前足大底外下表面162上之抓地凸塊135的前足大底隔室165。前足大底隔室165亦包括前足大底外邊緣163。 FIG. 6 illustrates an exemplary bottom surface of the forefoot outsole 160. The forefoot outsole 160 includes a forefoot outsole compartment 165 having a grip bump 135 on the outer lower surface 162 of the forefoot outsole. The forefoot outsole compartment 165 also includes a forefoot outsole outer edge 163.
圖7中描繪一前足組件140之一實施例與一前足大底160之一實施例之間的一關係。類似地,圖8係腳跟組件150之一實施例與腳跟大底170之一實施例之間的關係之一繪示。 A relationship between an embodiment of a forefoot component 140 and an embodiment of a forefoot outsole 160 is depicted in FIG. 7. Similarly, FIG. 8 illustrates one of the relationships between one embodiment of the heel assembly 150 and one embodiment of the heel outsole 170.
圖7中繪示前足組件140之一實施例與前足大底160之一實施例之間的關係。在此實施例中,各前足組件流體填充室145對應於一類似大小、適合形狀之前足大底隔室165。在此實施例中,各前足大底隔室165與一類似大小、適合形狀之前足組件流體填充室145對準且足夠大以容納該前足組件流體填充室145。在一些實施例中,一前足組件流體填充室145可以一適貼關係與一前足大底隔室165組合。接著,可藉由將前足組件流體填充室145插入至對應前足大底隔室165中而使前足大底160與前足組件140相關聯。在一些實施例中,一前足大底隔室165結合至一前足組件流體填充室145。在一些實施例中,前足組件140係與前足大底160共模製。在一些實施例中,前足大底160與前足組件下表面142或內表面164(參見圖16)之至少一部分共延伸或重疊,且前足組件邊緣1143與前足組件下表面1142或鞋底內表面1164之至少一部分共延伸或重疊。在一些實施例中,前足大底隔室165包圍前足組件流體填充室145。 The relationship between one embodiment of the forefoot assembly 140 and one embodiment of the forefoot outsole 160 is shown in FIG. 7. In this embodiment, each forefoot component fluid-filled chamber 145 corresponds to a similarly sized and shaped forefoot compartment 165. In this embodiment, each forefoot outsole compartment 165 is aligned with a similarly sized and shaped forefoot component fluid filling chamber 145 and is large enough to accommodate the forefoot component fluid filling chamber 145. In some embodiments, a forefoot component fluid-filled chamber 145 may be combined with a forefoot outsole compartment 165 in a suitable relationship. Next, the forefoot outsole 160 can be associated with the forefoot assembly 140 by inserting the forefoot assembly fluid-filled chamber 145 into the corresponding forefoot outsole compartment 165. In some embodiments, a forefoot outsole compartment 165 is coupled to a forefoot component fluid-filled chamber 145. In some embodiments, the forefoot component 140 is co-molded with the forefoot outsole 160. In some embodiments, the forefoot outsole 160 and at least a portion of the forefoot component lower surface 142 or the inner surface 164 (see FIG. 16) extend or overlap, and the forefoot component edge 1143 and the forefoot component lower surface 1142 or the inner sole surface 1164 At least a portion extends or overlaps. In some embodiments, the forefoot outsole compartment 165 surrounds the forefoot component fluid-filled chamber 145.
圖8描繪腳跟組件150之一實施例與腳跟大底170之一實施例之間的關係。在此實施例中,一腳跟組件流體填充室155對應於一腳跟大底隔室175。在圖8中繪示之實施例中,單一腳跟大底隔室175可與一類似大小、適合形狀之腳跟組件流體填充室155相關聯。在另一實施例中,腳跟組件150可包含複數個流體填充室155,且腳跟大底170可包含複數個腳跟大底隔室175。在此等實施例中,各腳跟大底170藉由確保各腳跟大底隔室175與各腳跟組件流體填充室155對準且足夠大以容納該腳跟組件流體填充室155而裝配於類似大小、適合形狀之腳跟組件150上。在一些實施例中,一腳跟組件流體填充室155可以一適貼 關係與一腳跟大底隔室175組合。接著,可藉由將腳跟組件流體填充室155插入至對應腳跟大底隔室175中而使腳跟大底170與腳跟組件150相關聯。在一些實施例中,一腳跟大底隔室175結合至一腳跟組件流體填充室155。在一些實施例中,腳跟組件150隙與腳跟大底170共模製。在一些實施例中,腳跟大底隔室175包圍腳跟組件流體填充室155。在一些實施例中,腳跟大底170與腳跟組件邊緣153之至少一部分共延伸或至少部分重疊。 FIG. 8 depicts the relationship between one embodiment of the heel assembly 150 and one embodiment of the heel outsole 170. In this embodiment, a heel component fluid-filled chamber 155 corresponds to a heel outsole compartment 175. In the embodiment shown in FIG. 8, a single heel outsole compartment 175 may be associated with a similarly sized, shaped heel component fluid-filled chamber 155. In another embodiment, the heel assembly 150 may include a plurality of fluid-filled chambers 155, and the heel outsole 170 may include a plurality of heel outsole compartments 175. In these embodiments, each heel outsole 170 is assembled in a similar size by ensuring that each heel outsole compartment 175 is aligned with each heel component fluid-filled chamber 155 and is large enough to accommodate the heel component fluid-filled chamber 155. The shape fits on the heel assembly 150. In some embodiments, a heel component fluid-filled chamber 155 may be adapted The relationship is combined with a heel outsole compartment 175. Then, the heel outsole 170 can be associated with the heel assembly 150 by inserting the heel assembly fluid-filled chamber 155 into the corresponding heel outsole compartment 175. In some embodiments, a heel outsole compartment 175 is coupled to a heel assembly fluid-filled chamber 155. In some embodiments, the heel assembly 150 gap is co-molded with the heel outsole 170. In some embodiments, the heel outsole compartment 175 surrounds the heel assembly fluid-filled chamber 155. In some embodiments, the heel outsole 170 is coextensive or at least partially overlaps with at least a portion of the heel component edge 153.
圖9繪示前足鞋底結構1131中之前足組件1140與前足大底1160之間的一關係。前足組件流體填充室1145之各者具有與其相關聯之前足大底1160之一區段或隔室1165。前足大底1160之各前足大底區段1165可包繞前足組件1140之各前足組件流體填充室1145的前足組件流體填充室下表面1142與前足組件流體填充室邊緣1143之間的隅角。凸塊1135可附接至前足大底1160之下表面或形成於前足大底1160之下表面上。 FIG. 9 illustrates a relationship between the forefoot component 1140 and the forefoot outsole 1160 in the forefoot sole structure 1131. Each of the forefoot component fluid-filled chambers 1145 has a section or compartment 1165 of the forefoot outsole 1160 associated with it. Each forefoot outsole section 1165 of the forefoot outsole 1160 may surround the corners between the lower surface 1142 of the forefoot component fluid filling chamber 1145 and the edge 1143 of the forefoot component fluid filling chamber 1145 of each forefoot component fluid filling chamber 1145 of the forefoot component 1140. The bump 1135 may be attached to or formed on the lower surface of the forefoot outsole 1160.
圖9繪示一前足鞋底結構之另一實施例。前足鞋底結構1131包括具有由界定前足組件上表面1141、前足組件下表面1142及前足組件邊緣1143之一聚合物材料形成之前足組件流體填充室1145的前足組件1140。在圖9中,前足組件上表面1141面向下。 FIG. 9 illustrates another embodiment of a forefoot sole structure. The forefoot sole structure 1131 includes a forefoot component 1140 having a forefoot component fluid-filled chamber 1145 formed of a polymer material that defines a forefoot component upper surface 1141, a forefoot component lower surface 1142, and a forefoot component edge 1143. In FIG. 9, the upper surface 1141 of the forefoot component faces downward.
圖9亦繪示前足大底1160之一實施例與前足組件1140之一實施例之間的關係。如圖9中繪示,前足大底1160包括其上具有抓地凸塊1135的前足大底外下表面。前足大底1160進一步包括在前足組件邊緣1143之至少部分上方延伸之前足大底隔室邊緣1163。 FIG. 9 also illustrates the relationship between one embodiment of the forefoot outsole 1160 and one embodiment of the forefoot component 1140. As shown in FIG. 9, the forefoot outsole 1160 includes an outer lower surface of the forefoot outsole having a grip bump 1135 thereon. The forefoot outsole 1160 further includes a forefoot outsole compartment edge 1163 extending over at least a portion of the forefoot component edge 1143.
製造方法Production method
可以任何適合方式將一大底附接至一對應組件。在一些實施例中,藉由黏著作為一共模製程序之部分來黏著大底與組件。在一些實施例中,藉由部分熔融作為一共模製程序之部分來黏著大底與對應組 件。 The outsole can be attached to a corresponding component in any suitable manner. In some embodiments, the outsole and the component are glued by glueing as part of a co-molding process. In some embodiments, the outsole and the corresponding group are adhered by partially melting as part of a co-molding process Pieces.
前足組件140及腳跟組件150可由任何適合聚合材料形成。前足組件140及腳跟組件150可由一單一材料層或多個層形成,且可經熱成型或以其他方式塑形。前足組件或一腳跟組件可利用之聚合材料之實例包括以下之任一者:聚胺基甲酸酯、胺基甲酸酯、聚酯、聚酯聚胺基甲酸酯、聚醚、聚醚聚胺基甲酸酯、乳膠、聚己內酯、聚氧丙烯、聚碳酸酯巨乙二醇及其等之摻合物。此等及其他聚合材料、及前足組件140及腳跟組件150以及用於製造其等之一方法之一例示性實施例可在2013年2月21日由Campos II等人申請且標題為ARTICLE OF FOOTWEAR INCORPORATING A CHAMBER SYSTEM AND METHODS FOR MANUFACTURING THE CHAMBER SYSTEM之同在申請中之申請案序號13/773,360中發現,該案之全文特此以引用的方式併入。 The forefoot component 140 and the heel component 150 may be formed of any suitable polymeric material. The forefoot component 140 and the heel component 150 may be formed from a single material layer or multiple layers, and may be thermoformed or otherwise shaped. Examples of polymer materials that can be used for the forefoot component or a heel component include any of the following: polyurethane, polyurethane, polyester, polyester polyurethane, polyether, polyether Polyurethane, latex, polycaprolactone, polyoxypropylene, polycarbonate macrogol, and blends thereof. These and other polymeric materials, and an exemplary embodiment of a forefoot component 140 and a heel component 150, and one of the methods used to manufacture them, may be applied for on February 21, 2013 by Campos II and others under the title ARTICLE OF FOOTWEAR INCORPORATING A CHAMBER SYSTEM AND METHODS FOR MANUFACTURING THE CHAMBER SYSTEM is also found in Application Serial No. 13 / 773,360, which is hereby incorporated by reference in its entirety.
在一共模製程序中,首先可以任何適合方式形成一大底。一大底通常可由任何耐久性材料形成。通常,大底材料係堅韌的、耐用的、耐磨蝕且耐磨損的、可撓的及防滑的。在一些實施例中,聚胺基甲酸酯材料對於地面接觸足夠耐用。適合熱塑性聚胺基甲酸酯彈性體材料包括可購自Bayer之Bayer Texin®285。可購自BASF之Elastollan® SP9339、Elastollan® SP9324及Elastollan® C70S亦係適合的。在一些實施例中,可使用對於直接地面接觸可能並不足夠耐用之聚胺基甲酸酯及其他聚合物形成一大底之部分。在此等實施例中,可將一橡膠大底黏著或膠合至大底上。在實施例中,大底材料係透明的或半透明的。在實施例中,抓地凸塊可一體地形成為一大底之部分,或可分開形成且黏著至大底。大底可具有一經紋理化抓地表面以改良牽引力。 In a co-molding process, first a large bottom can be formed in any suitable manner. The outsole is usually formed from any durable material. Generally, outsole materials are tough, durable, abrasion and wear resistant, flexible and non-slip. In some embodiments, the polyurethane material is sufficiently durable for ground contact. Suitable thermoplastic polyurethane elastomer materials include Bayer Texin® 285 available from Bayer. Elastollan® SP9339, Elastollan® SP9324, and Elastollan® C70S, which are commercially available from BASF, are also suitable. In some embodiments, polyurethane and other polymers that may not be sufficiently durable for direct ground contact may be used to form a large outsole portion. In these embodiments, a rubber outsole can be adhered or glued to the outsole. In an embodiment, the outsole material is transparent or translucent. In an embodiment, the grip bumps may be integrally formed as a part of the outsole, or may be separately formed and adhered to the outsole. The outsole may have a textured grip surface to improve traction.
接著,將一大底放置於容納該大底之一模具中使其與待與其共模製之對應組件成一適當關係。在一些實施例中,可將黏著劑塗敷於 大底、組件或兩者之適當表面。接著可將組件與對應大底共模製以形成一前足鞋底結構或一腳跟鞋底結構。 Next, the outsole is placed in a mold that houses the outsole in a proper relationship with the corresponding component to be co-molded with it. In some embodiments, an adhesive may be applied to Appropriate surface for outsole, component, or both. The component can then be co-molded with the corresponding outsole to form a forefoot sole structure or a heel sole structure.
圖10及圖11描繪用於共模製前足組件1140與其上具有抓地凸塊1135的前足大底1160以形成前足鞋底結構1131之一模具。在一些實施例中,前足大底1160包覆前足組件流體填充室1145上之前足組件邊緣1143之至少一部分。如本文中描述,可使用包覆前足組件邊緣1143之至少一部分之前足大底隔室邊緣1163之此前足大底區段1165來調諧前足鞋底結構1131之緩衝響應。前足大底隔室邊緣1163之包覆部分可提供前足組件流體填充室1145之側壁或邊緣處之額外強度及耐撓曲性。在一些實施例中,前足大底隔室邊緣1163包覆流體填充室邊緣1143之上之一短距離。在其他實施例中,前足大底隔室邊緣1163進一步向上包覆流體填充室邊緣1143以提供額外勁度且更佳保護流體填充室邊緣1143免受損壞或磨損。前足鞋底結構1131係具有包覆前足組件流體填充室1145之一大部分之前足大底1160的一前足鞋底結構之一實施例。 FIGS. 10 and 11 depict a mold for co-molding the forefoot assembly 1140 and the forefoot outsole 1160 with gripping bumps 1135 thereon to form a forefoot sole structure 1131. In some embodiments, the forefoot outsole 1160 covers at least a portion of the forefoot component edge 1143 on the forefoot component fluid-filled chamber 1145. As described herein, the forefoot sole structure 1131 can be tuned using the forefoot outsole section 1165 that covers at least a portion of the forefoot component edge 1143 and the forefoot outsole compartment edge 1163. The covering portion of the forefoot outsole compartment edge 1163 may provide additional strength and flex resistance at the side walls or edges of the forefoot component fluid-filled chamber 1145. In some embodiments, the forefoot outsole compartment edge 1163 covers a short distance above the edge of the fluid-filled compartment 1143. In other embodiments, the forefoot outsole compartment edge 1163 further covers the fluid-filled chamber edge 1143 upwards to provide additional stiffness and better protect the fluid-filled chamber edge 1143 from damage or wear. The forefoot sole structure 1131 is an embodiment of a forefoot sole structure having a forefoot sole 1160 covering most of the forefoot component fluid filling chamber 1145.
圖10及圖11係用於前足組件1140之模具1700之橫截面描繪。如圖10及圖11中展示,前足組件1140係與模具中存在之前足大底1160共模製。黏著劑亦可存在於前足組件1140之適當部分上,特定言之在前足組件流體填充室邊緣1143及前足組件流體填充室下表面1142或將與前足組件1140接觸之前足大底1160之室接合表面上。 10 and 11 are cross-sectional depictions of a mold 1700 for a forefoot component 1140. As shown in FIGS. 10 and 11, the forefoot component 1140 is co-molded with the forefoot outsole 1160 existing in the mold. Adhesives may also be present on appropriate portions of the forefoot component 1140, specifically at the forefoot component fluid-filled chamber edge 1143 and the forefoot component fluid-filled chamber lower surface 1142 or the chamber-engaging surface of the forefoot component 1160 before contacting the forefoot component 1140 on.
可利用多種製造程序來形成前足鞋底結構1131。在一些實施例中,將製造程序中可利用之模具1700描繪為包括一第一模具部分1710及一第二模具部分1720。利用模具1700以由一第一聚合物層1810及一第二聚合物層1820形成前足組件1140,該等聚合物層1810及1820係分別形成前足組件上表面1141及前足組件下表面1142之聚合物層。更特定言之,模具1700藉由以下步驟而有利於製造程序:(a)在對應於前足組件流體填充室1145、前足組件凸緣1146及室之間之導管之區域中 塑形第一聚合物層1810及第二聚合物層1820;及(b)在對應於前足組件凸緣1146及前足組件網狀區域1147之區域中連結第一聚合物層1810及第二聚合物層1820。 A variety of manufacturing procedures may be utilized to form the forefoot sole structure 1131. In some embodiments, the mold 1700 available in the manufacturing process is depicted as including a first mold portion 1710 and a second mold portion 1720. A mold 1700 is used to form a forefoot component 1140 from a first polymer layer 1810 and a second polymer layer 1820. The polymer layers 1810 and 1820 are polymers that form the upper surface 1141 and the lower surface 1142 of the forefoot component, respectively. Floor. More specifically, the mold 1700 facilitates the manufacturing process by: (a) in the area corresponding to the forefoot component fluid-filled chamber 1145, the forefoot component flange 1146, and the conduit between the chambers Shaping the first polymer layer 1810 and the second polymer layer 1820; and (b) joining the first polymer layer 1810 and the second polymer in a region corresponding to the forefoot component flange 1146 and the forefoot component mesh area 1147 Layer 1820.
現將定義模具1700之各個表面或其他區域以於製造程序之論述中使用。現參考圖10及圖11,第一模具部分1710包括一捏縮表面1730、一第一縫形成表面1740及一壓縮表面1750。捏縮表面1730及第一縫形成表面1740相對於彼此成角度,其中與第一縫形成表面1740相比,捏縮表面1730更垂直。第二模具部分1720包括一捏縮邊緣1760及一第二縫形成表面1770。鑒於捏縮邊緣1760係第二模具部分1720中之一相對尖銳隅角或成角度區域,第二縫形成表面1770向下延伸且大體上(但不一定)平行於捏縮表面1730。模具1700內及模具部分1710與1720之間之一空隙體積1790在加壓之前具有前足組件1140之一形狀且形成前足組件1140之各種特徵部。此空隙體積1790之一部分被識別為第二模具部分1720中之一凹陷1780。 Various surfaces or other areas of the mold 1700 will now be defined for use in the discussion of the manufacturing process. 10 and 11, the first mold portion 1710 includes a pinch surface 1730, a first slit forming surface 1740, and a compression surface 1750. The pinch surface 1730 and the first slit forming surface 1740 are angled with respect to each other, wherein the pinch surface 1730 is more vertical than the first slit forming surface 1740. The second mold portion 1720 includes a pinch edge 1760 and a second slit-forming surface 1770. Given that the pinch edge 1760 is one of the relatively sharp corners or angled areas of the second mold portion 1720, the second slit-forming surface 1770 extends downwardly and is generally (but not necessarily) parallel to the pinch surface 1730. A void volume 1790 in the mold 1700 and between the mold portions 1710 and 1720 has a shape of the forefoot component 1140 and forms various features of the forefoot component 1140 before pressurization. A portion of this void volume 1790 is identified as a recess 1780 in the second mold portion 1720.
第一聚合物層1810及第二聚合物層1820之各者最初定位於第一模具部分1710與第二模具部分1720之間,其等呈一隔開或敞開構形,如圖10及圖11中所描繪。在此位置中,第一聚合物層1810定位成鄰近於或較靠近第一模具部分1710,且第二聚合物層1820定位成鄰近於或較靠近第二模具部分1720。可利用一梭架或其他裝置來適當定位第一聚合物層1810及第二聚合物層1820。作為製造程序之部分,將第一聚合物層1810及第二聚合物層1820之一者或兩者加熱至有利於塑形及結合之一溫度。作為一實例,可在將第一聚合物層1810及第二聚合物層1820定位於第一模具部分1710與第二模具部分1720之間之前利用各種輻射加熱器或其他裝置來加熱該第一聚合物層1810及該第二聚合物層1820。作為另一實例,可加熱模具1700使得模具1700與第一聚合物層1810及第二聚合物層1820之間的接觸在製造程序之一稍後部分將溫度 提升至有利於塑形及結合之一位準。 Each of the first polymer layer 1810 and the second polymer layer 1820 is initially positioned between the first mold portion 1710 and the second mold portion 1720, and they are in a separated or open configuration, as shown in Figs. 10 and 11 As described in. In this position, the first polymer layer 1810 is positioned adjacent or closer to the first mold portion 1710, and the second polymer layer 1820 is positioned adjacent or closer to the second mold portion 1720. A shuttle or other device may be used to properly position the first polymer layer 1810 and the second polymer layer 1820. As part of the manufacturing process, one or both of the first polymer layer 1810 and the second polymer layer 1820 are heated to a temperature that is favorable for shaping and bonding. As an example, the first polymer layer 1810 and the second polymer layer 1820 may be heated by various radiant heaters or other devices before the first polymer layer 1810 and the second polymer layer 1820 are positioned between the first mold portion 1710 and the second mold portion 1720. The object layer 1810 and the second polymer layer 1820. As another example, the mold 1700 may be heated such that contact between the mold 1700 and the first polymer layer 1810 and the second polymer layer 1820 will change the temperature later in one of the manufacturing processes Raise to a level that is conducive to shaping and bonding.
第一聚合物層1810及第二聚合物層1820一經適當定位,第一模具部分1710及第二模具部分1720便平移或以其他方式移動朝向彼此且開始圍攏(close upon)第一聚合物層1810及第二聚合物層1820。在第一模具部分1710及第二模具部分1720移動朝向彼此時,可利用各種技術將第一聚合物層1810及第二聚合物層1820拉抵於第一模具部分1710及第二模具部分1720之表面,藉此開始塑形第一聚合物層1810及第二聚合物層1820之程序。例如,可自(a)第一模具部分1710與第一聚合物層1810之間及(b)第二模具部分1720與第二聚合物層1820之間的區域部分抽空空氣。更特定言之,可透過第一模具部分1710及第二模具部分1720中之各種真空端口抽出空氣。藉由移除空氣,牽拉第一聚合物層1810使其與第一模具部分1710之表面接觸,且牽拉第二聚合物層1820使其與第二模具部分1720之表面接觸。作為另一實例,可將空氣注入至第一聚合物層1810與第二聚合物層1820之間的區域中,藉此提高第一聚合物層1810與第二聚合物層1820之間的壓力。在此程序之一準備階段期間,可將一注入針定位於第一聚合物層1810與第二聚合物層1820之間,且接著可自注入針噴射例如一氣體、液體或凝膠使得第一聚合物層1810及第二聚合物層1820接合模具1700之表面。此等技術之各者可一起使用或獨立使用。 Once the first polymer layer 1810 and the second polymer layer 1820 are properly positioned, the first mold portion 1710 and the second mold portion 1720 are translated or otherwise moved toward each other and begin to close upon the first polymer layer 1810. And second polymer layer 1820. When the first mold portion 1710 and the second mold portion 1720 move toward each other, various techniques can be used to pull the first polymer layer 1810 and the second polymer layer 1820 against the first mold portion 1710 and the second mold portion 1720. Surface, thereby starting the process of shaping the first polymer layer 1810 and the second polymer layer 1820. For example, air may be evacuated from areas of (a) between the first mold portion 1710 and the first polymer layer 1810 and (b) between the second mold portion 1720 and the second polymer layer 1820. More specifically, air can be drawn through various vacuum ports in the first mold portion 1710 and the second mold portion 1720. By removing the air, the first polymer layer 1810 is pulled into contact with the surface of the first mold portion 1710, and the second polymer layer 1820 is pulled into contact with the surface of the second mold portion 1720. As another example, air may be injected into a region between the first polymer layer 1810 and the second polymer layer 1820, thereby increasing the pressure between the first polymer layer 1810 and the second polymer layer 1820. During one of the preparation stages of this procedure, an injection needle may be positioned between the first polymer layer 1810 and the second polymer layer 1820, and then a gas, liquid, or gel may be ejected from the injection needle such that the first The polymer layer 1810 and the second polymer layer 1820 are bonded to the surface of the mold 1700. Each of these techniques can be used together or independently.
在第一模具部分1710及第二模具部分1720繼續移動朝向彼此時,第一聚合物層1810及第二聚合物層1820被捏縮於第一模具部分1710與第二模具部分1720之間。更特定言之,第一聚合物層1810及第二聚合物層1820被壓縮於捏縮表面1730與捏縮邊緣1760之間。除開始使第一聚合物層1810及第二聚合物層1820之過量部分與形成前足組件1140之部分分離之程序之外,捏縮第一聚合物層1810及第二聚合物層1820亦開始在前足組件凸緣1146之區域中結合或連結第一聚合物層 1810及第二聚合物層1820之程序。 As the first mold portion 1710 and the second mold portion 1720 continue to move toward each other, the first polymer layer 1810 and the second polymer layer 1820 are pinched between the first mold portion 1710 and the second mold portion 1720. More specifically, the first polymer layer 1810 and the second polymer layer 1820 are compressed between the pinch surface 1730 and the pinch edge 1760. In addition to the process of separating the excess portions of the first polymer layer 1810 and the second polymer layer 1820 from the portion forming the forefoot component 1140, the pinching of the first polymer layer 1810 and the second polymer layer 1820 also began at Bond or join a first polymer layer in the area of the forefoot component flange 1146 1810 and second polymer layer 1820 procedure.
在捏縮第一聚合物層1810及第二聚合物層1820之後,第一模具部分1710及第二模具部分1720繼續移動朝向彼此且成一閉合構形,如圖11中所描繪。在模具閉合時,捏縮表面1730接觸第二縫形成表面1770之一部分且抵靠其滑動。捏縮表面1730與第二縫形成表面1770之間的接觸有效地切斷第一聚合物層1810及第二聚合物層1820之過量部分與形成前足組件1140之部分。另外,滑動移動向下推動形成第一聚合物層1810及第二聚合物層1820之材料之部分且進一步將其等推動至凹陷1780中。此外,形成第一聚合物層1810及第二聚合物層1820之材料壓緊或以其他方式聚集在第一縫形成表面1740與第二縫形成表面1770之間的區域中。在第一縫形成表面1740與第二縫形成表面1770相對於彼此成角度之情況下,經壓緊聚合物材料形成導致前足組件凸緣1146之一大致三角形或漸縮結構。除形成前足組件凸緣1146之外,第一聚合物層1810及第二聚合物層1820亦(a)經塑形以形成前足組件流體填充室1145及(b)經壓縮且經連結以形成網狀區域1147。 After the first polymer layer 1810 and the second polymer layer 1820 are pinched, the first mold portion 1710 and the second mold portion 1720 continue to move toward each other and into a closed configuration, as depicted in FIG. 11. When the mold is closed, the pinch surface 1730 contacts a portion of the second slit-forming surface 1770 and slides against it. The contact between the pinch surface 1730 and the second seam-forming surface 1770 effectively cuts off the excess portions of the first polymer layer 1810 and the second polymer layer 1820 and the portion forming the forefoot component 1140. In addition, the sliding movement pushes down the portions of the material forming the first polymer layer 1810 and the second polymer layer 1820 and further pushes them into the depression 1780. In addition, the materials forming the first polymer layer 1810 and the second polymer layer 1820 are compacted or otherwise gathered in a region between the first slit-forming surface 1740 and the second slit-forming surface 1770. In the case where the first slit-forming surface 1740 and the second slit-forming surface 1770 are angled relative to each other, the compacted polymer material forms a generally triangular or tapered structure that results in one of the forefoot component flanges 1146. In addition to forming the forefoot component flange 1146, the first polymer layer 1810 and the second polymer layer 1820 are (a) shaped to form the forefoot component fluid filling chamber 1145 and (b) compressed and joined to form a web状 地区 1147。 Shaped area 1147.
在圖11中描繪之程序階段處,定位於模具1700內之壓縮表面1750與凹陷1780之間的一空隙體積1790在膨脹或加壓之前有效地具有前足組件1140之形狀。此外,空隙之一周邊部分包括形成第一縫形成表面1740與第二縫形成表面1770之間的前足組件凸緣1146之一區域。第一縫形成表面1740與第二縫形成表面1770之間的非平行構形導致其中聚合物材料聚集以形成前足組件凸緣1146之一漸縮空間。與其中第一縫形成表面1740與第二縫形成表面1770相交之區域(其與形成前足組件流體填充室1145之空隙之一部分隔開)中相比,鄰近於形成流體填充組件1145之空隙體積1790之部分,跨第一縫形成表面1740與第二縫形成表面1770之間的空間之一距離更大。儘管第一縫形成表面1740與第二縫形成表面1770之間的漸縮空間之構形可變化,然第一縫形成表面 1740與第二縫形成表面1770之間所形成之一角度可在介於二十度與四十五度之間之一範圍內。 At the stage of the procedure depicted in FIG. 11, a void volume 1790 positioned between the compression surface 1750 and the depression 1780 within the mold 1700 effectively has the shape of a forefoot component 1140 before expansion or compression. In addition, a peripheral portion of the gap includes a region forming a forefoot component flange 1146 between the first slit forming surface 1740 and the second slit forming surface 1770. The non-parallel configuration between the first seam-forming surface 1740 and the second seam-forming surface 1770 results in a tapered space in which the polymer material aggregates to form one of the forefoot component flanges 1146. Compared to the area where the first slit-forming surface 1740 intersects the second slit-forming surface 1770, which is separated from a portion of the void forming the forefoot component fluid filling chamber 1145, the void volume 1790 adjacent to the forming fluid filling component 1145 In part, the distance across one of the spaces between the first slit-forming surface 1740 and the second slit-forming surface 1770 is greater. Although the configuration of the tapered space between the first slit forming surface 1740 and the second slit forming surface 1770 may vary, the first slit forming surface An angle formed between 1740 and the second slit-forming surface 1770 may be in a range between 20 degrees and 45 degrees.
如上所述,形成第一聚合物層1810及第二聚合物層1820之材料壓緊或以其他方式聚集在第一縫形成表面1740與第二縫形成表面1770之間的區域中。此壓緊有效地增厚第一聚合物層1810及第二聚合物層1820之一或兩者。即,儘管第一聚合物層1810及第二聚合物層1820在圖11中描繪之階段處具有一第一厚度,然凸緣1146內之第一聚合物層1810及第二聚合物層1820之一或兩者在圖11中描繪之階段處可具有一第二、更大厚度。在捏縮表面1730接觸第二縫形成表面1770之一部分且抵靠其滑動時發生之壓緊增加形成第一聚合物層1810及第二聚合物層1820之一或兩者之聚合物材料之厚度。 As described above, the materials forming the first polymer layer 1810 and the second polymer layer 1820 are compacted or otherwise gathered in a region between the first slit-forming surface 1740 and the second slit-forming surface 1770. This compaction effectively thickens one or both of the first polymer layer 1810 and the second polymer layer 1820. That is, although the first polymer layer 1810 and the second polymer layer 1820 have a first thickness at the stage depicted in FIG. 11, the first polymer layer 1810 and the second polymer layer 1820 in the flange 1146 have a first thickness. One or both may have a second, greater thickness at the stage depicted in FIG. 11. The compression that occurs when the pinch surface 1730 contacts a portion of the second seam-forming surface 1770 and slides against it increases the thickness of the polymer material forming one or both of the first polymer layer 1810 and the second polymer layer 1820 .
當形成前足組件1140完成時,敞開模具1700且移除並允許冷卻前足結構1131。接著,可將一流體注入至前足組件1140中以對前足組件流體填充室1145加壓,藉此完成前足鞋底結構1131之製造。作為程序中之一最後步驟,可將前足鞋底結構1131併入至一鞋類物件100之一鞋底結構中。 When forming the forefoot assembly 1140 is complete, the mold 1700 is opened and the forefoot structure 1131 is removed and allowed to cool. Then, a fluid can be injected into the forefoot component 1140 to pressurize the forefoot component fluid filling chamber 1145, thereby completing the manufacturing of the forefoot sole structure 1131. As one of the last steps in the procedure, the forefoot sole structure 1131 may be incorporated into one of the sole structures of an article of footwear 100.
圖10及圖11繪示在前足組件流體填充室1145之前足組件邊緣1143上具有前足大底1160之相對較小重疊的一實施例。圖10及圖11亦繪示其中前足組件1140之流體填充室1145之前足組件邊緣1143形成自前足組件上表面1141至前足組件下表面1142具有一連續、平滑形狀的一前足鞋底結構1131之一實施例。 FIGS. 10 and 11 illustrate an embodiment of a relatively small overlap with a forefoot outsole 1160 on the edge 1143 of the forefoot component before the forefoot component fluid-filled chamber 1145. 10 and FIG. 11 also illustrate the implementation of one of the forefoot sole structures 1131 with a continuous and smooth shape of the forefoot component 1140, and the front foot component edge 1143 is formed from the forefoot component upper surface 1141 to the forefoot component lower surface 1142. example.
圖12及圖13繪示用於一腳跟組件之一模具,其中將腳跟大底1170放置於並非形成以容納大底之一區域中之一模具部分中。接著,腳跟組件1150與腳跟大底1170共模製且環繞腳跟大底1170。此技術產生具有與腳跟大底邊緣齊平之腳跟組件邊緣的一腳跟鞋底結構1132。 FIGS. 12 and 13 illustrate a mold for a heel assembly, in which the heel outsole 1170 is placed in a mold portion that is not formed to accommodate an outsole. Then, the heel component 1150 is co-molded with the heel outsole 1170 and surrounds the heel outsole 1170. This technique produces a heel sole structure 1132 having a heel assembly edge flush with the heel outsole edge.
儘管可利用多種製造程序,然腳跟鞋底結構1132可透過大體上類 似於上文針對前足組件1140及前足鞋底結構1131論述之程序之一程序形成。將製造程序中可利用之模具1190描繪為包括一第一模具部分1191及一第二模具部分1192。利用模具1190以由第一聚合物層1181及第二聚合物層1182之額外元件形成腳跟組件1150,該等聚合物層1181及1182係分別形成腳跟組件上表面1151及腳跟組件下表面1152之聚合物層。更特定言之,模具1190藉由以下步驟而有利於製造程序:(a)在對應於腳跟組件流體填充室1155及腳跟組件凸緣1156之區域中塑形第一聚合物層1181及第二聚合物層1182;及(b)在對應於腳跟組件凸緣1156及腳跟組件網狀區域1157之區域中連結第一聚合物層1181及第二聚合物層1182。另外,模具1190有利於將腳跟大底1170結合至腳跟組件1150。 Although various manufacturing processes are available, the heel sole structure 1132 A procedure is formed similar to one of the procedures discussed above for the forefoot component 1140 and the forefoot sole structure 1131. The mold 1190 available in the manufacturing process is depicted as including a first mold portion 1191 and a second mold portion 1192. A mold 1190 is used to form a heel component 1150 with additional elements from a first polymer layer 1181 and a second polymer layer 1182. These polymer layers 1181 and 1182 form a polymerization of the upper surface 1151 and the lower surface 1152 of the heel component, respectively. Physical layer. More specifically, the mold 1190 facilitates the manufacturing process by: (a) shaping the first polymer layer 1181 and the second polymer in an area corresponding to the heel component fluid filling chamber 1155 and the heel component flange 1156. The physical layer 1182; and (b) the first polymer layer 1181 and the second polymer layer 1182 are connected in a region corresponding to the heel component flange 1156 and the heel component mesh area 1157. In addition, the mold 1190 facilitates coupling the heel outsole 1170 to the heel assembly 1150.
第一聚合物層1181及第二聚合物層1182之各者最初定位於第一模具部分1191與第二模具部分1192之間,如圖12中所描繪。另外,形成大底1170之一或多個元件亦相對於模具1190定位。第一聚合物層1181及第二聚合物層1182一經適當定位且大底1170之元件一定位於第二模具部分1192中之空隙體積1198內,第一模具部分1191及第二模具部分1192便平移或以其他方式移動朝向彼此且開始圍攏第一聚合物層1181及第二聚合物層1182,如圖13中所描繪。如上文論述,可自(a)第一模具部分1191與第一聚合物層1181之間及(b)第二模具部分1192與第二聚合物層1182之間的區域部分抽空空氣。另外,可將流體注入至第一聚合物層1181與第二聚合物層1182之間的區域中。流體可選自由空氣、液體、凝膠及其等之摻合物組成之群組。使用此等技術之一或兩者,誘發第一聚合物層1181及第二聚合物層1182接合模具1190之表面。另外,第一聚合物層1181及第二聚合物層1182亦抵靠腳跟大底1170鋪設。因此,實際上,第一聚合物層1181及第二聚合物層1182經塑形而抵靠模具1190及大底1170之表面,如圖13中所展 示。 Each of the first polymer layer 1181 and the second polymer layer 1182 is initially positioned between the first mold portion 1191 and the second mold portion 1192, as depicted in FIG. 12. In addition, one or more elements forming the outsole 1170 are also positioned relative to the mold 1190. Once the first polymer layer 1181 and the second polymer layer 1182 are properly positioned and the components of the outsole 1170 must be located within the void volume 1198 in the second mold portion 1192, the first mold portion 1191 and the second mold portion 1192 are translated or Moving otherwise toward each other and starting to surround the first polymer layer 1181 and the second polymer layer 1182, as depicted in FIG. 13. As discussed above, air can be evacuated from the area portions (a) between the first mold portion 1191 and the first polymer layer 1181 and (b) between the second mold portion 1192 and the second polymer layer 1182. In addition, a fluid may be injected into a region between the first polymer layer 1181 and the second polymer layer 1182. The fluid may be selected from the group consisting of air, liquid, gel and blends thereof. Using one or both of these techniques, the first polymer layer 1181 and the second polymer layer 1182 are induced to join the surface of the mold 1190. In addition, the first polymer layer 1181 and the second polymer layer 1182 are also laid against the heel outsole 1170. Therefore, in fact, the first polymer layer 1181 and the second polymer layer 1182 are shaped to abut the surfaces of the mold 1190 and the outsole 1170, as shown in FIG. 13 Show.
在第一模具部分1191及第二模具部分1192繼續移動朝向彼此時,第一聚合物層1181及第二聚合物層1182被壓縮於第一模具部分1191與第二模具部分1192之間,如圖14中所描繪。更特定言之,第一聚合物層1181及第二聚合物層1182經壓縮以形成腳跟組件凸緣1156及腳跟組件網狀區域1157。聚合物層1182亦與大底1170結合。 When the first mold part 1191 and the second mold part 1192 continue to move toward each other, the first polymer layer 1181 and the second polymer layer 1182 are compressed between the first mold part 1191 and the second mold part 1192, as shown in the figure. Depicted in 14. More specifically, the first polymer layer 1181 and the second polymer layer 1182 are compressed to form a heel component flange 1156 and a heel component mesh region 1157. The polymer layer 1182 is also bonded to the outsole 1170.
當腳跟鞋底結構1132之製造完成時,敞開模具1190且移除並允許冷卻腳跟鞋底結構1132,如圖15中所描繪。接著,可將一流體注入至腳跟組件1150中以對腳跟組件流體填充室1155加壓,藉此完成腳跟鞋底結構1132之製造。作為程序中之一最後步驟,可將腳跟鞋底結構1132併入至一鞋類物件100之鞋底結構1130中。 When the manufacture of the heel sole structure 1132 is completed, the mold 1190 is opened and the heel sole structure 1132 is removed and allowed to cool, as depicted in FIG. 15. Then, a fluid may be injected into the heel component 1150 to pressurize the fluid filling chamber 1155 of the heel component, thereby completing the manufacture of the heel sole structure 1132. As one of the last steps in the procedure, the heel sole structure 1132 may be incorporated into the sole structure 1130 of an article of footwear 100.
在將第一聚合物層1181及第二聚合物層1182牽拉至模具1190(特定言之第二模具部分1191中之較大體積)中時,第一聚合物層1181及第二聚合物層1182拉伸以符合模具1190之輪廓。當第一聚合物層1181及第二聚合物層1182拉伸時,其等亦變薄或以其他方式縮減厚度。因此,第一聚合物層1181及第二聚合物層1182之初始厚度可大於製造程序之後之所得厚度。 When the first polymer layer 1181 and the second polymer layer 1182 are drawn into the mold 1190 (specifically, the larger volume in the second mold portion 1191), the first polymer layer 1181 and the second polymer layer 1182 is stretched to conform to the contour of mold 1190. When the first polymer layer 1181 and the second polymer layer 1182 are stretched, they are also thinned or otherwise reduced in thickness. Therefore, the initial thickness of the first polymer layer 1181 and the second polymer layer 1182 may be greater than the thickness obtained after the manufacturing process.
圖17、圖18及圖19繪示腳跟鞋底結構之其他實施例。圖17繪示包括腳跟大底部分2770的腳跟鞋底結構2732。在圖17中繪示之實施例中,腳跟大底部分2770在抓地區域(諸如用於牽引凸塊之位置)處具有一第一厚度,且在腳跟組件流體填充室2755之一個或兩個垂直表面之至少部分上具有一第二、較小厚度。厚度可以一漸進方式(諸如藉由一線性漸縮)改變或可為步進式的。與在抓地區域處相比,腳跟大底部分2770在腳跟組件流體填充室2755之外垂直表面上更薄。以此方式,可調諧腳跟鞋底結構2732之彈性響應。 FIG. 17, FIG. 18 and FIG. 19 show other embodiments of the heel sole structure. FIG. 17 illustrates a heel sole structure 2732 including a heel outsole portion 2770. In the embodiment shown in FIG. 17, the heel outsole portion 2770 has a first thickness at a grip area (such as a position for traction bumps), and one or both of the heel component fluid-filled chambers 2755 At least a portion of the vertical surface has a second, smaller thickness. The thickness may be changed in a progressive manner, such as by a linear taper, or may be stepwise. The heel outsole portion 2770 is thinner on the vertical surface outside the heel component fluid-filled chamber 2755 than at the grip area. In this way, the elastic response of the heel sole structure 2732 can be tuned.
圖18繪示具有腳跟大底部分2870的腳跟鞋底結構2832,與在抓 地區域處相比,該等腳跟大底部分2870在腳跟組件流體填充室2855之兩個垂直表面上更薄。在其他實施例中,僅腳跟大底部分2770或2870之內垂直表面可分別在腳跟組件流體填充室2755或2855之垂直表面上變薄。 FIG. 18 shows a heel sole structure 2832 having a heel outsole portion 2870, and The heel outsole portions 2870 are thinner on the two vertical surfaces of the heel component fluid-filled chamber 2855 compared to the ground area. In other embodiments, only the vertical surface within the heel outsole portion 2770 or 2870 may be thinned on the vertical surface of the heel component fluid-filled chamber 2755 or 2855, respectively.
在一些實施例中,可使用此等構形之任何組合,因此提供調諧腳跟鞋底結構之彈性響應之額外機會。 In some embodiments, any combination of these configurations may be used, thus providing an additional opportunity to tune the elastic response of the heel sole structure.
圖19繪示一腳跟鞋底結構之另一實施例。腳跟鞋底結構1932包括腳跟大底部分1970。腳跟大底部分1970在腳跟組件流體填充室1955之內垂直表面之上延伸至腳跟組件網狀區域1957。腳跟大底部分亦包括跨腳跟組件網狀區域1957之一部分延伸之一凸緣。此凸緣提供可變化以調諧腳跟組件之彈性響應之一額外特徵部。腳跟大底部分1970在腳跟組件流體填充室1955之外垂直表面之上延伸一距離。此距離亦可變化以調整腳跟大底部分之彈性響應。 FIG. 19 illustrates another embodiment of a heel sole structure. The heel sole structure 1932 includes a heel outsole portion 1970. The heel outsole portion 1970 extends over the vertical surface within the heel component fluid-filled chamber 1955 to the heel component mesh area 1957. The heel outsole portion also includes a flange extending across a portion of the heel component mesh region 1957. This flange provides an additional feature that can be varied to tune the elastic response of the heel assembly. The heel outsole portion 1970 extends a distance above the vertical surface outside the heel component fluid-filled chamber 1955. This distance can also be changed to adjust the elastic response of the heel outsole.
可使用此等及其他適合製造技術之任一者來形成前足結構及腳跟結構。特定言之,可使用本文中針對一前足結構描述之一製造技術來形成一腳跟結構,且可使用本文中針對一腳跟結構描述之一技術來形成一前足結構。可藉由黏著或藉由部分熔融將各別部分結合至一對應組件。在一些實施例中,可在製造程序期間將一大底熱結合至一對應組件以形成一鞋底結構。例如,當一第二聚合物層及對應大底之各者係由類似或相容聚合物材料形成時,或當大底至少部分由一流體填充室之聚合物材料形成時,加熱該聚合物層/流體填充室及該大底可誘發組件之間的熱結合。類似地,抓地凸塊可與一大底一體地形成,或可使用任何適合技術(諸如黏著或部分熔融)結合至該大底。在一些實施例中,運用熱活化黏著劑可方便地結合部分。 Any of these and other suitable manufacturing techniques can be used to form a forefoot structure and a heel structure. In particular, a heel structure may be formed using one of the manufacturing techniques described herein for a forefoot structure, and a forefoot structure may be formed using one of the techniques described herein for a heel structure. Individual parts can be bonded to a corresponding component by adhesion or by partial melting. In some embodiments, a large sole may be thermally bonded to a corresponding component during the manufacturing process to form a sole structure. For example, when a second polymer layer and each of the corresponding outsoles are formed from similar or compatible polymer materials, or when the outsole is formed at least in part from a fluid-filled chamber polymer material, the polymer is heated The layer / fluid filled chamber and the outsole can induce thermal bonding between the components. Similarly, the grip bumps may be formed integrally with the outsole, or may be bonded to the outsole using any suitable technique, such as adhesion or partial melting. In some embodiments, the portion may be conveniently bonded using a heat activated adhesive.
在一些實施例中,一大底之抓地部分可藉由共模製附接至之一流體填充室之一聚合物層代替性地可與大底抓地部分共擠製。以此方 式,可簡化組件之製造,包括特定言之使模製更簡單。若將增加凸塊,則可將凸塊放置於模具中以與大底之其他部分共模製,如上文所描述。 In some embodiments, the outsole grip portion may be co-extruded with the outsole grip portion by co-molding a polymer layer attached to a fluid-filled chamber. This way Can simplify the manufacture of components, including, in particular, making molding easier. If bumps will be added, the bumps can be placed in a mold to be co-molded with other parts of the outsole, as described above.
在一些實施例中,流體填充室層及大底部分可為可共擠製為在共擠製之後可形成一相互結合之相鄰層之相容組合物。在一些實施例中,可需要一連接層將一大底部分黏著至一流體填充室聚合物層。在一些實施例中,可將形成抓地大底之部分之凸塊放置於模具中且將其等與層之其餘者共模製。 In some embodiments, the fluid-filled chamber layer and the outsole portion may be a compatible composition that can be co-extruded to form a mutually adjacent layer after co-extrusion. In some embodiments, a connection layer may be required to adhere a large bottom portion to a fluid-filled chamber polymer layer. In some embodiments, the bumps forming the portion of the gripping outsole can be placed in a mold and co-molded with the rest of the layer.
運用本文中提供之導引,使用者將能夠識別一適合方法而無需過度實驗。 Using the guidance provided in this article, users will be able to identify a suitable method without undue experimentation.
在其中使用者可看見接合處之本發明之實施例中,例如當形成鞋底結構之件係透明或半透明的時,可將凸塊與大底之間及大底與組件之間的接合處製成美觀的。在一些實施例中,響應於熱量(諸如模製之熱量)而軟化之一黏著劑亦可為適合的。 In embodiments of the present invention in which the joint is visible to a user, for example, when the pieces forming the sole structure are transparent or translucent, the joint between the bump and the outsole and between the outsole and the component Made beautiful. In some embodiments, it may also be suitable to soften one of the adhesives in response to heat, such as the heat of molding.
在一些實施例中,可將可正向彈起之一大底件按壓至一模具中。可將一流體填充室包覆模製(overmolded)至大底件上。儘管熱成型模具可具有切口,然大底件通常不具有切口。在此等實施例中,一無切口大底件可產生大底元件中之變形。特定言之,大底件可拉離模具側壁。然而,接著將流體填充室包覆模製至大底件上。在將壓力引入至模具中之流體填充室時,包覆模製將大底推回至位置中且因此將大底推動成形。在[以引用的方式併入之申請案]中充分闡釋此技術。 In some embodiments, a large bottom piece that can be popped forward can be pressed into a mold. A fluid-filled chamber can be overmolded onto the large base piece. Although thermoform molds can have cutouts, large soles typically do not have cutouts. In these embodiments, a notch-less outsole piece can produce deformation in the outsole element. In particular, the outsole can be pulled away from the mold sidewall. However, the fluid-filled chamber is then overmolded onto the large base piece. When pressure is introduced into the fluid-filled chamber in the mold, overmolding pushes the outsole back into position and thus pushes the outsole into shape. This technique is fully explained in [Applications incorporated by reference].
用於製造一鞋類物件之方法Method for manufacturing an article of footwear
具有一鞋面及一鞋底結構的一鞋類物件可藉由將該鞋面之至少部分固定至該鞋底結構之至少部分而製造。在一些實施例中,該鞋底結構包括一流體填充室,該流體填充室包括一邊緣、一上表面及一下表面。該鞋底結構亦包括一大底。該大底共模製至該流體填充室之該 下表面之至少一部分及該流體填充室之該邊緣之至少一部分。該大底與該室之該下表面之至少部分及該室之該邊緣之至少部分共延伸。可藉由黏著劑或藉由部分熔融待結合之表面之至少一者而結合大底及流體填充室。 An article of footwear with an upper and a sole structure can be manufactured by fixing at least a portion of the upper to at least a portion of the sole structure. In some embodiments, the sole structure includes a fluid-filled chamber including an edge, an upper surface, and a lower surface. The sole structure also includes a large sole. The outsole is co-molded to the fluid-filled chamber. At least a portion of the lower surface and at least a portion of the edge of the fluid-filled chamber. The outsole is coextensive with at least a portion of the lower surface of the chamber and at least a portion of the edge of the chamber. The outsole and the fluid-filled chamber may be combined by an adhesive or by partially melting at least one of the surfaces to be bonded.
最小化氣體夾雜物之方法Method for minimizing gas inclusions
在一些實施例中,特定言之在使用黏著劑將一大底結合至一組件以形成一鞋底結構時,可形成一些使用者可發現在美學上令人反感的一特徵部。如圖4中所展示,特徵部900係一夾雜物之一實例,其係前足大底1160與前足組件流體填充室下表面1142(其等兩者皆可具有平滑表面)之間的一小氣泡。此等夾雜物可能並非在全部情況中可見。然而,尤其在夾雜物集中或普遍存在於一區域中之條件下,夾雜物可使組件與大底之間的結合變弱。 In some embodiments, in particular, when an outsole is bonded to a component to form a sole structure using an adhesive, a feature that some users may find aesthetically offensive may be formed. As shown in FIG. 4, the feature 900 is an example of an inclusion that is a small air bubble between the forefoot outsole 1160 and the lower surface 1142 of the forefoot component fluid-filled chamber (both of which may have a smooth surface) . These inclusions may not be visible in all cases. However, especially under conditions where inclusions are concentrated or ubiquitous in an area, inclusions can weaken the bond between the component and the outsole.
在一些實施例中,可藉由在組件下表面及大底內下表面之至少一者上提供一紋理而使部分之間的結合更為美觀且更強。在一些實施例中,經紋理化表面可具有凸面及凹槽或高區域及低區域。在一些實施例中,一大底中之氣體逸出開口可容許經截獲氣體逸出。 In some embodiments, the bonding between the parts can be more beautiful and stronger by providing a texture on at least one of the lower surface of the component and the inner lower surface of the outsole. In some embodiments, the textured surface may have convexities and grooves or high and low areas. In some embodiments, the gas escape opening in the outsole may allow the trapped gas to escape.
在一些實施例中,黏著劑之厚度小於紋理之凹槽或低區域之深度。過量黏著劑可使結合變弱,此係因為此可藉由填充紋理之低區域之間的體積而妨礙表面之間(即,經紋理化表面之高區域與另一表面之間)之充分接觸。填充紋理之低區域可迫使紋理之凸面或高區域遠離另一表面,因此妨礙良好結合。 In some embodiments, the thickness of the adhesive is less than the depth of the grooves or low areas of the texture. Excessive adhesive can weaken the bond because this can prevent adequate contact between surfaces (i.e., between the high areas of the textured surface and the other surface) by filling the volume between the low areas of the texture . Filling the low areas of the texture can force the convex or high areas of the texture away from the other surface, thus preventing good bonding.
紋理無需為規則的或經圖案化,但如上文描述,應確保高區域具有一致高度且足夠普遍存在,以確保大底與組件下表面之間的適當接觸。在一些實施例中,紋理係一規則的、重複的、經圖案化之紋理,諸如筆直凹槽、交叉凹槽、圓形、三角形或任何其他形狀。在一些實施例中,諸如字、字母、數字、標誌或標語之其他美觀紋理可為 適合紋理。 The texture need not be regular or patterned, but as described above, ensure that high areas have a consistent height and are sufficiently ubiquitous to ensure proper contact between the outsole and the lower surface of the component. In some embodiments, the texture is a regular, repeating, patterned texture, such as a straight groove, a cross groove, a circle, a triangle, or any other shape. In some embodiments, other aesthetic textures such as words, letters, numbers, signs, or slogans can be Suitable for texture.
儘管一紋理化結合表面在結合期間可截獲一定量之氣體,然紋理可用以最小化強度之任何縮減且可促成一美感。在一些實施例中,紋理可用以確保排除任何大夾雜物且將其等分解成分佈於表面上方之較小夾雜物。又,一規則圖案(諸如圖16中繪示之圖案)可更美觀,此係因為低點可包括一氣泡或出現一氣泡,因此呈現一規則外觀。進一步言之,此一圖案可產生一高強度結合,此係因為黏著劑能夠形成高點與另一表面之間的一良好結合。一紋理亦可在鄰近高點之區域上形成極佳結合,此係因為黏著劑可散佈於表面之間以形成一強結合。 Although a textured bonding surface can trap a certain amount of gas during bonding, the texture can be used to minimize any reduction in strength and can contribute to an aesthetic appeal. In some embodiments, the texture can be used to ensure that any large inclusions are excluded and broken down into smaller inclusions distributed above the surface. In addition, a regular pattern (such as the pattern shown in FIG. 16) can be more beautiful, because the low point can include a bubble or a bubble appears, and thus present a regular appearance. Furthermore, this pattern can produce a high-strength bond because the adhesive can form a good bond between the high point and another surface. A texture can also form an excellent bond in the area adjacent to the high point, because the adhesive can be spread between the surfaces to form a strong bond.
圖16繪示具有前足大底隔室165及前足大底內邊緣164的前足大底160之一俯視圖。前足大底內下表面166經紋理化而具有非平行凹槽之一規則圖案,其在該前足大底內下表面166上形成一方形或菱形圖案。在一些實施例中,線指示凸起區域且線之間的區域係一低區域。在一些實施例中,線指示切入至表面中之凹槽。運用本文中提供之導引,使用者可識別用於任一表面之一適合紋理。 FIG. 16 illustrates a top view of one of the forefoot outsoles 160 having a forefoot outsole compartment 165 and an inner edge 164 of the forefoot outsole. The forefoot outsole inner and lower surface 166 is textured to have a regular pattern of non-parallel grooves, which forms a square or diamond pattern on the forefoot outsole inner and lower surface 166. In some embodiments, the lines indicate raised areas and the area between the lines is a low area. In some embodiments, the lines indicate grooves cut into the surface. Using the guidance provided in this article, users can identify a suitable texture for one of any surfaces.
圖20、圖21、圖22及圖23繪示與最小化大底部分與流體填充室下表面之間的空氣夾雜物有關之額外實施例。圖20係根據本發明之一些實施例之一鞋類物件之一仰視圖。圖21繪示一腳跟大底之一實施例。圖22繪示用於增強至一氣體逸出開口之氣體移動之一內部結構。圖23繪示一腳跟大底之另一實施例。此等及其他結構可用以最小化空氣夾雜物。 20, 21, 22, and 23 illustrate additional embodiments related to minimizing air inclusions between the large bottom portion and the lower surface of the fluid-filled chamber. FIG. 20 is a bottom view of an article of footwear according to some embodiments of the invention. FIG. 21 illustrates an embodiment of a heel outsole. FIG. 22 illustrates an internal structure for enhancing gas movement to a gas escape opening. FIG. 23 illustrates another embodiment of a heel outsole. These and other structures can be used to minimize air inclusions.
圖20繪示固定至諸如鞋面120(圖1)之一鞋面之下端之鞋底結構2130。鞋底結構2130定位於腳下方且支撐腳。鞋底結構2130之主要元件係包括一前足組件2140及前足大底部分2060的一前足鞋底結構2131,及包括一腳跟組件2150及一腳跟大底2070的一腳跟鞋底結構。在一些實施例中,前足組件2140及腳跟組件2150之各者可直接固定至 鞋面(未示)之一下部區域。前足組件2140及腳跟組件2150係由圍封一流體(其可為一氣體、液體或凝膠)之一聚合物材料形成。例如,在走路及跑步期間,前足組件2140及腳跟組件2150可在腳與地面之間壓縮,藉此減弱地面反作用力。即,前足組件2140及腳跟組件2150係膨脹的且大體上由流體加壓以緩衝腳。 FIG. 20 illustrates a sole structure 2130 secured to the lower end of an upper such as one of the upper 120 (FIG. 1). The sole structure 2130 is positioned under the foot and supports the foot. The main components of the sole structure 2130 include a forefoot component 2140 and a forefoot sole structure 2131 of a forefoot outsole portion 2060, and a heel sole structure including a heel component 2150 and a heel outsole 2070. In some embodiments, each of the forefoot component 2140 and the heel component 2150 may be directly fixed to A lower area of an upper (not shown). The forefoot component 2140 and the heel component 2150 are formed of a polymer material that encloses a fluid (which may be a gas, liquid, or gel). For example, during walking and running, the forefoot component 2140 and the heel component 2150 may be compressed between the foot and the ground, thereby reducing the ground reaction force. That is, the forefoot component 2140 and the heel component 2150 are inflated and substantially pressurized by a fluid to cushion the foot.
在一些構形中,鞋底結構2130可包括例如在鞋面120與前足組件2140及腳跟組件2150之一或兩者之間延伸之一發泡體層,或可將一發泡體元件定位於前足組件2140及腳跟組件2150之下部區域中之壓凹內。在其他構形中,前足鞋底結構2131可併有進一步減弱力、增強穩定性或影響腳之運動的板、緩衝體、上楦元件或運動控制部件。腳跟鞋底結構2132亦可包括此等部件以進一步減弱力、增強穩定性或影響腳之運動。 In some configurations, the sole structure 2130 may include, for example, a foam layer extending between the upper 120 and one or both of the forefoot component 2140 and the heel component 2150, or a foam element may be positioned on the forefoot component. 2140 and the depressions in the lower area of the heel assembly 2150. In other configurations, the forefoot sole structure 2131 may be provided with a plate, a cushion, a chin element, or a motion control component that further reduces the force, enhances stability, or affects the movement of the foot. Heel sole structure 2132 may also include these components to further reduce force, enhance stability, or affect the movement of the foot.
除提供鞋類物件100中之一磨損表面之外,前足大底2060及腳跟大底2070亦可增強鞋底結構2130之各種性質及特性。可改變或選擇大底之性質及特性(諸如厚度、可撓性、用以製作大底之材料之性質及特性及拉伸性)以修改或以其他方式調諧鞋底結構2130之緩衝響應、可壓縮性、可撓性及其他性質及特性。大底之強化(例如,包括諸如肋之結構元件)、孔隙、重疊高度、重疊之邊緣之數目及位置或一大底之其他特徵皆可用以調諧鞋底結構之響應。一大底亦可併有賦予牽引力之踏面元件,諸如突出部、脊或抓地凸塊或區段。在一些實施例中,一大底可由一板或其他結構元件取代。一板可具有幫助將一大底或其他元件固定至腳跟組件2150之特徵部。 In addition to providing one of the wear surfaces of the article of footwear 100, the forefoot outsole 2060 and the heel outsole 2070 can also enhance various properties and characteristics of the sole structure 2130. Can change or select the properties and characteristics of the outsole (such as thickness, flexibility, properties and characteristics of materials used to make outsoles and stretchability) to modify or otherwise tune the cushioning response of the sole structure 2130, compressible Flexibility, flexibility and other properties and characteristics. Reinforcement of the outsole (e.g., including structural elements such as ribs), voids, overlap height, number and location of overlapping edges, or other features of the outsole can be used to tune the response of the sole structure. The outsole can also incorporate traction elements, such as protrusions, ridges or grip bumps or sections. In some embodiments, the outsole can be replaced by a plate or other structural element. A board may have features that help secure a large outsole or other element to the heel assembly 2150.
特定言之,諸如上文所描述及至少在圖17、圖18及圖19中所繪示,可使用遠離抓地部分且在一前足組件或一腳跟組件之邊緣之上的一大底之一部分之重疊來調諧所得鞋底結構之彈性響應及緩衝響應。運用本文中提供之導引,使用者可結合組件之流體填充組件之性質及 特性考量大底之此等及其他性質及特性,以調整一鞋底結構之響應。 In particular, such as described above and at least depicted in FIGS. 17, 18, and 19, a portion of the outsole that is away from the grip and above the edge of a forefoot component or a heel component may be used Overlap to tune the elastic response and cushioning response of the resulting sole structure. Using the guidance provided in this article, users can combine the properties of the component's fluid-filled components with The characteristics consider these and other properties and characteristics of the outsole to adjust the response of a sole structure.
鞋底結構2130可為半透明的或透明的,且為美感可經著色或經圖案化。 The sole structure 2130 may be translucent or transparent, and it may be colored or patterned for its aesthetic sense.
前足大底2060固定至前足組件2140之下部區域。在一些實施例中,前足鞋底結構2131可延伸至一中足區中。前足大底2060亦可固定至一中足區中之前足組件2140之下部區域。腳跟大底2070固定至腳跟組件2150之下部區域。腳跟組件2150及腳跟大底2070兩者皆可延伸至一中足區中。前足大底2060及腳跟大底2070可由一耐磨材料形成。耐磨材料可為透明的或半透明的以提供一悅目效果。耐磨材料在抓地部分上可經紋理化以賦予牽引力。在一些實施例中,耐磨材料可具有抓地凸塊或部分2135,如圖20中所繪示。 The forefoot outsole 2060 is fixed to the lower area of the forefoot component 2140. In some embodiments, the forefoot sole structure 2131 may extend into a midfoot area. The forefoot outsole 2060 can also be fixed to the lower area of the forefoot component 2140 in a midfoot area. The heel outsole 2070 is fixed to the lower area of the heel assembly 2150. Both the heel assembly 2150 and the heel outsole 2070 can extend into a midfoot area. The forefoot outsole 2060 and the heel outsole 2070 may be formed of a wear-resistant material. The abrasion resistant material may be transparent or translucent to provide a pleasing effect. The abrasion resistant material may be textured on the grip to impart traction. In some embodiments, the abrasion resistant material may have grip bumps or portions 2135, as illustrated in FIG. 20.
圖20亦繪示前足大底部分2060中之氣體逸出開口2069及腳跟大底部分2070中之氣體逸出開口2079。此等氣體逸出開口容許在組裝期間被截獲於一組件與對應大底之間的空氣或其他氣體逸出。可依可累積經截獲氣體且將裹入氣體引導至一氣體逸出開口之一方式塑形一大底部分之內表面。例如,可在大底部分之內表面上形成小通路,諸如一小隧道或經移除區域。 FIG. 20 also shows the gas escape openings 2069 in the forefoot outsole portion 2060 and the gas escape openings 2079 in the heel outsole portion 2070. These gas escape openings allow air or other gases to be trapped between a component and the corresponding outsole during assembly. The inner surface of the large sole can be shaped in such a way that trapped gas can be accumulated and the trapped gas can be directed to a gas escape opening. For example, small vias may be formed on the inner surface of the outsole portion, such as a small tunnel or removed area.
圖21及圖22繪示一腳跟大底之一實施例。圖21繪示此等氣體逸出開口2179之一實施例。此等開口2179可定位於腳跟大底2170或前足大底2060之底表面上。一些氣體逸出開口可靠近抓地表面(諸如圖21至圖25),而其他氣體逸出開口可定位於抓地部分之間,諸如氣體逸出開口2189。圖21亦繪示抓地凸塊2135及氣體逸出開口2179。 21 and 22 illustrate an embodiment of a heel outsole. FIG. 21 illustrates an embodiment of these gas escape openings 2179. These openings 2179 can be positioned on the bottom surface of the heel outsole 2170 or the forefoot outsole 2060. Some gas escape openings may be close to the grip surface (such as Figs. 21-25), while other gas escape openings may be positioned between the grip portions, such as a gas escape opening 2189. FIG. 21 also illustrates the grip bump 2135 and the gas escape opening 2179.
圖22繪示腳跟大底2170之內表面上之氣體逸出通路及體積之實施例。圖22繪示存在之與氣體逸出開口2179相關聯之氣體累積區域2178。氣體累積區域2178及通路2181用以減少腳跟組件與腳跟大底2170之間的夾雜物。氣體累積通路2181可將氣體逸出開口2189連接至 氣體累積區域2178。作為一繪示,氣體累積系統之各部件無需連接至所有其他部件。例如,氣體累積區域2182與鄰近氣體逸出通路2179並不連續或並未連接至該鄰近氣體逸出通路2179。 FIG. 22 illustrates an embodiment of the gas escape path and volume on the inner surface of the heel outsole 2170. FIG. 22 illustrates the presence of a gas accumulation area 2178 associated with the gas escape opening 2179. The gas accumulation area 2178 and the passage 2181 are used to reduce inclusions between the heel assembly and the heel outsole 2170. A gas accumulation passage 2181 may connect a gas escape opening 2189 to Gas accumulation area 2178. As a illustration, the components of the gas accumulation system need not be connected to all other components. For example, the gas accumulation region 2182 is not continuous with or adjacent to the adjacent gas escape path 2179.
圖23繪示其中氣體累積通路2278在大底2270之內表面上形成為一規則圖案之一實施例。氣體逸出開口2279存在於大底2270中。氣體逸出開口2279之各者與一氣體累積通路2278連通。在一些實施例中,通路2278之各者與其他通路相關聯,因而累積於氣體累積通路2278之圖案中之氣體可透過一氣體逸出開口2279逸出。因此,為了一清晰、乾淨、無瑕疵外觀,可最小化因經捕獲氣泡之缺陷。在一些實施例中,未定位於一抓地表面上之氣體逸出通路2279無需與氣體累積通路2278相關聯。 FIG. 23 illustrates an embodiment in which the gas accumulation passage 2278 is formed as a regular pattern on the inner surface of the outsole 2270. A gas escape opening 2279 is present in the outsole 2270. Each of the gas escape openings 2279 communicates with a gas accumulation passage 2278. In some embodiments, each of the passages 2278 is associated with other passages, so that the gas accumulated in the pattern of the gas accumulation passage 2278 can escape through a gas escape opening 2279. Therefore, for a clear, clean, flawless appearance, defects due to trapped air bubbles can be minimized. In some embodiments, the gas escape path 2279 that is not positioned on a gripping surface need not be associated with the gas accumulation path 2278.
儘管圖21、圖22及圖23僅描繪腳跟相關物體,然在各圖中表達之原理亦可應用於一前足區段以產生一前足區段,類似於本文中之腳跟相關揭示內容。熟練專業人員可容易判定如何擴展用以形成一腳跟大底之原理以形成一前足大底。 Although FIG. 21, FIG. 22, and FIG. 23 depict only heel-related objects, the principles expressed in the figures can also be applied to a forefoot segment to generate a forefoot segment, similar to the heel-related disclosures herein. A skilled professional can easily determine how to extend the principles used to form a heel outsole to form a forefoot outsole.
雖然已描述本發明之各項實施例,但本描述意欲為例示性的而非限制性的,且一般技術者將明白,在本發明之範疇內之更多實施例及實施方案係可行的。例如,在一大底之內部上可使用諸如三角形、五邊形或圓形之另一圖案,而非一方形或菱形紋理。因此,本發明不受限制,惟根據隨附申請專利範圍及其等效物除外。又,在隨附申請專利範圍之範疇內可進行各種修改及改變。 Although various embodiments of the invention have been described, this description is intended to be illustrative, and not restrictive, and one of ordinary skill in the art will understand that many more embodiments and implementations are possible within the scope of the invention. For example, instead of a square or rhombus texture, another pattern such as a triangle, pentagon, or circle may be used on the inside of a large outsole. Therefore, the present invention is not limited except in accordance with the scope of the accompanying patent application and its equivalents. Various modifications and changes can be made within the scope of the attached patent application.
114‧‧‧外側 114‧‧‧ outside
115‧‧‧內側 115‧‧‧ inside
130‧‧‧鞋底結構 130‧‧‧ sole structure
131‧‧‧前足結構/前足鞋底結構 131‧‧‧ Forefoot structure / Forefoot sole structure
132‧‧‧腳跟結構/腳跟鞋底結構 132‧‧‧Heel structure / Heel sole structure
135‧‧‧抓地凸塊/部分 135‧‧‧Grasp bumps / parts
150‧‧‧腳跟組件 150‧‧‧ Heel Components
160‧‧‧前足大底 160‧‧‧ Forefoot Outsole
170‧‧‧腳跟大底 170‧‧‧ Heel outsole
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/641,789 US9750307B2 (en) | 2013-02-21 | 2015-03-09 | Article of footwear having a sole structure including a fluid-filled chamber and an outsole, the sole structure, and methods for manufacturing |
US14/641,789 | 2015-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201642772A TW201642772A (en) | 2016-12-16 |
TWI616148B true TWI616148B (en) | 2018-03-01 |
Family
ID=55543093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105107253A TWI616148B (en) | 2015-03-09 | 2016-03-09 | Article of footwear having a sole structure including a fluid-filled chamber and an outsole, the sole structure, and methods for manufacturing |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI616148B (en) |
WO (1) | WO2016144649A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11974631B2 (en) | 2020-12-30 | 2024-05-07 | Nike, Inc. | Bladder for a footwear sole structure |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI694914B (en) * | 2017-11-08 | 2020-06-01 | 台興塑膠有限公司 | Improved structure of anti-skid rain shoes mold and manufacturing method of anti-skid rain shoes |
TWI744570B (en) * | 2017-12-14 | 2021-11-01 | 荷蘭商耐克創新有限合夥公司 | Sole structure for article of footwear |
TWI737945B (en) * | 2017-12-14 | 2021-09-01 | 荷蘭商耐克創新有限合夥公司 | Sole structure for article of footwear |
TWI737946B (en) * | 2017-12-14 | 2021-09-01 | 荷蘭商耐克創新有限合夥公司 | Sole structure for article of footwear |
TWI715893B (en) * | 2017-12-14 | 2021-01-11 | 荷蘭商耐基創新公司 | Sole structure for article of footwear |
CN113490436A (en) * | 2019-01-02 | 2021-10-08 | 耐克创新有限合伙公司 | Sole structure for an article of footwear |
US20200305549A1 (en) * | 2019-03-28 | 2020-10-01 | Nike, Inc. | Sole structure of an article of footwear |
CN114246393A (en) * | 2020-09-21 | 2022-03-29 | 黄英俊 | Hollow object forming curved surface |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5771606A (en) * | 1994-10-14 | 1998-06-30 | Reebok International Ltd. | Support and cushioning system for an article of footwear |
TW357560U (en) * | 1998-06-12 | 1999-05-01 | wen-zhong Liu | Improvement of air pad used as an insole in shoes |
TW200628085A (en) * | 2005-02-14 | 2006-08-16 | New Balance Athletic Shoe Inc | Insert, shoe product, and method of making an insert |
CN101842028A (en) * | 2007-10-19 | 2010-09-22 | 耐克国际有限公司 | Article of footwear with a sole structure having fluid-filled support elements |
US20140230276A1 (en) * | 2013-02-21 | 2014-08-21 | Nike, Inc. | Article Of Footwear Incorporating A Chamber System And Methods For Manufacturing The Chamber System |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5802739A (en) | 1995-06-07 | 1998-09-08 | Nike, Inc. | Complex-contoured tensile bladder and method of making same |
US6571490B2 (en) | 2000-03-16 | 2003-06-03 | Nike, Inc. | Bladder with multi-stage regionalized cushioning |
KR100421445B1 (en) | 2001-09-28 | 2004-03-09 | 삼성전자주식회사 | Method for rebuild of polishing head and Apparatus for inspecting an air leakage during rebuild of polishing head |
US6837951B2 (en) | 2001-11-26 | 2005-01-04 | Nike, Inc. | Method of thermoforming a bladder structure |
US8991072B2 (en) * | 2010-02-22 | 2015-03-31 | Nike, Inc. | Fluid-filled chamber incorporating a flexible plate |
US10806214B2 (en) * | 2013-03-08 | 2020-10-20 | Nike, Inc. | Footwear fluid-filled chamber having central tensile feature |
-
2016
- 2016-03-02 WO PCT/US2016/020490 patent/WO2016144649A1/en active Application Filing
- 2016-03-09 TW TW105107253A patent/TWI616148B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5771606A (en) * | 1994-10-14 | 1998-06-30 | Reebok International Ltd. | Support and cushioning system for an article of footwear |
TW357560U (en) * | 1998-06-12 | 1999-05-01 | wen-zhong Liu | Improvement of air pad used as an insole in shoes |
TW200628085A (en) * | 2005-02-14 | 2006-08-16 | New Balance Athletic Shoe Inc | Insert, shoe product, and method of making an insert |
CN101842028A (en) * | 2007-10-19 | 2010-09-22 | 耐克国际有限公司 | Article of footwear with a sole structure having fluid-filled support elements |
US20140230276A1 (en) * | 2013-02-21 | 2014-08-21 | Nike, Inc. | Article Of Footwear Incorporating A Chamber System And Methods For Manufacturing The Chamber System |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11974631B2 (en) | 2020-12-30 | 2024-05-07 | Nike, Inc. | Bladder for a footwear sole structure |
TWI844810B (en) * | 2020-12-30 | 2024-06-11 | 荷蘭商耐克創新有限合夥公司 | Article of footwear |
Also Published As
Publication number | Publication date |
---|---|
WO2016144649A1 (en) | 2016-09-15 |
TW201642772A (en) | 2016-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11470915B2 (en) | Article of footwear having a sole structure including a fluid-filled chamber and an outsole, the sole structure, and methods for manufacturing | |
TWI616148B (en) | Article of footwear having a sole structure including a fluid-filled chamber and an outsole, the sole structure, and methods for manufacturing | |
US11974628B2 (en) | Article of footwear with outsole bonded to cushioning component and method of manufacturing an article of footwear | |
US11186073B2 (en) | Fluid-filled body and method for forming the same | |
KR101845028B1 (en) | Article of footwear incorporating a chamber system and methods for manufacturing the chamber system | |
US10271613B2 (en) | Article of footwear with outsole bonded to cushioning component and method of manufacturing an article of footwear | |
CN102655775B (en) | fluid-filled structure | |
CN106942833B (en) | The fluid-filled chamber of belt profile with tensile structure | |
CN104507345B (en) | Fluid-filled chamber with robust structure | |
TWI617433B (en) | Method of co-molding and co-molded article prepared by the method | |
EP3429395B1 (en) | Fluid-filled bladder and method for forming the same |