TWI614138B - Multiple chamber laminating machine of the printed circuit board of the electromagnetic heating - Google Patents

Multiple chamber laminating machine of the printed circuit board of the electromagnetic heating Download PDF

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Publication number
TWI614138B
TWI614138B TW105123693A TW105123693A TWI614138B TW I614138 B TWI614138 B TW I614138B TW 105123693 A TW105123693 A TW 105123693A TW 105123693 A TW105123693 A TW 105123693A TW I614138 B TWI614138 B TW I614138B
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Taiwan
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pressing
induction coil
electromagnetic induction
cooling
cavity
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TW105123693A
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Chinese (zh)
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TW201720660A (en
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沈金明
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蘇州市嘉明機械製造有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/06Control, e.g. of temperature, of power
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/36Coil arrangements
    • H05B6/42Cooling of coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/02Induction heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101Using electrical induction, e.g. for heating during soldering

Abstract

本發明公開了一種電磁加熱的PCB板多腔層壓機,包括:具有一定內部空間的壓合室;設置於所述壓合室內的壓合組件,該壓合組件包括至少三塊壓合板,所述壓合板兩兩相互平行,相鄰兩塊所述壓合板相距一定的距離從而形成有至少兩個壓合腔;所述壓合室內設有電磁加熱組件,所述電磁加熱組件包括能夠產生交變磁場的電磁感應線圈,所述電磁感應線圈設置於加熱板內,至少一塊所述壓合板上設置有所述加熱板,所述電磁感應線圈的內部呈中空狀以形成貫通其兩端的冷卻通道。本發明提供的電磁加熱的PCB板多腔層壓機,可確保在熱壓和冷壓過程中,通過提高溫度傳遞的均勻性及穩定性,來減少壓制過程中PCB板的變形率。 The invention discloses an electromagnetically heated multi-cavity laminating machine for PCB boards, comprising: a compression chamber with a certain internal space; a compression assembly provided in the compression chamber, the compression assembly including at least three compression boards, The pressing plates are parallel to each other, and two adjacent pressing plates are separated by a certain distance so as to form at least two pressing cavities; an electromagnetic heating component is provided in the pressing room, and the electromagnetic heating component includes An electromagnetic induction coil of an alternating magnetic field, the electromagnetic induction coil is arranged in a heating plate, and the heating plate is provided on at least one of the pressing plates, and the inside of the electromagnetic induction coil is hollow to form a cooling through both ends thereof. aisle. The electromagnetically heated PCB multi-cavity laminator provided by the present invention can ensure the uniformity and stability of temperature transmission during hot pressing and cold pressing to reduce the deformation rate of the PCB during pressing.

Description

一種電磁加熱的PCB板多腔層壓機 Multi-cavity laminating machine for electromagnetically heated PCB board

本發明涉及一種PCB板多腔層壓機,更具體地,涉及一種電磁加熱的PCB板多腔層壓機。 The present invention relates to a PCB multi-cavity laminator, and more particularly, to an electromagnetically heated PCB multi-cavity laminator.

PCB板即PCB線路板(Printed circuit board),亦稱為印製電路板或者印刷電路板,是電子元器件電氣連接的提供者。一般來講,印刷電路板:是在非導電基板上面覆蓋一層/二層銅箔(導電層)一一稱之為單/雙面電路板,然後採用印製的方法,將設計好的電路連接需保留的線條印製(耐腐蝕介質)在銅箔上,浸入在腐蝕性液體中腐蝕掉沒有保護塗層的銅箔,清洗掉腐蝕性殘液,定位打孔,塗上助焊劑等,即告完成。PCB板的作用猶如農作物需要生長在土壤中一樣:一是通過銅箔線條為電子元件相互之間提供電氣連接;二是為電子元器件提供物理支撐。採用PCB板的主要優點是大大減少布線和裝配的差錯,提高了自動化水準和勞動生產率。 A PCB is a printed circuit board, which is also called a printed circuit board or a printed circuit board. It is a provider of electrical connections for electronic components. Generally speaking, a printed circuit board: a non-conductive substrate is covered with one or two layers of copper foil (conductive layer), which are called single / double-sided circuit boards, and then the printed circuit is used to connect the designed circuit The lines to be retained are printed (corrosion-resistant media) on the copper foil, immersed in corrosive liquid to etch away the copper foil without protective coating, clean away the corrosive residual liquid, locate and punch holes, and apply flux, etc., that is, It is complete. The role of the PCB is as if a crop needs to grow in the soil: one is to provide electrical connections between electronic components through copper foil lines; the other is to provide physical support for electronic components. The main advantages of using a PCB board are greatly reduced wiring and assembly errors, and improved automation and labor productivity.

現階段,PCB板的壓合工序中,特別是針對2層及2層以上PCB板產品,壓合工序主要包括熱壓和冷壓。熱壓是通過加熱半固化片(如環氧樹脂材料),並施加一定壓力比如200-500PSI/cm2使半固化片融化並凝固成需要的多層線路板。冷壓工藝是在熱壓結束後對線路按照工藝要求的冷卻速度冷卻到需要的溫 度。在現有銅箔導電加熱壓合機中,都是通過連續纏繞銅箔片導電加熱線路板,而在腔體的上下各有一塊加熱盤,其主要作用是對PCB板產品做輔助加熱。現有PCB板層壓機主要存在的缺點有:大多數現有層壓機採用的加熱方式為電熱棒加熱或是熱煤油加熱,使用壽命短,維修難度大,熱滯後較大,不易精確控溫;傳統的銅箔導電式加熱壓合機只是熱壓機,只能做熱壓工藝,不能做冷壓工藝,在壓制過程中容易導致PCB板產品翹曲變形嚴重,最終導致PCB板成品率低,生產成本過高;在傳統冷壓工藝中,中間層產品的溫度變化較小,導致PCB板產品表層與內層的收縮比較大,從而導致PCB板變形翹曲,產生一定報廢,增加報廢成本;在現有電壓機中,使用一個腔體工作,容易導致PCB板壓合後厚度不均勻或存在壓合氣泡的風險,壓合層數越多,累計產生的壓力誤差越大,問題也越明顯。 At this stage, in the pressing process of PCB boards, especially for PCB products with two or more layers, the pressing process mainly includes hot pressing and cold pressing. Hot pressing is to heat the prepreg (such as epoxy resin material) and apply a certain pressure such as 200-500PSI / cm2 to melt and solidify the prepreg into the required multilayer circuit board. The cold pressing process is to cool the circuit to the required temperature after the hot pressing is completed according to the cooling rate required by the process. degree. In the conventional copper foil conductive heating and pressing machine, the conductive foil is heated by continuously winding the copper foil, and there is a heating plate on the upper and lower sides of the cavity, the main function of which is to assist the heating of PCB products. The main disadvantages of the existing PCB laminator are: the heating method used by most existing laminators is electric heating rod heating or hot kerosene heating, short service life, difficult maintenance, large thermal lag, and difficult to accurately control temperature; The traditional copper foil conductive heating and pressing machine is only a hot pressing machine, which can only be used for the hot pressing process, not the cold pressing process. During the pressing process, it is easy to cause serious warpage and deformation of the PCB board products, and eventually lead to low yield of the PCB board. The production cost is too high; in the traditional cold pressing process, the temperature change of the middle layer product is small, which causes the surface layer and inner layer of the PCB board to shrink more, which causes the PCB board to deform and warp, resulting in certain scraps and increasing scrap costs; In the existing voltage machine, using a cavity to work can easily lead to uneven thickness of the PCB after lamination or the risk of lamination bubbles. The greater the number of lamination layers, the greater the cumulative pressure error and the more obvious the problem.

針對上述技術中存在的不足之處,本發明的目的是提供一種電磁加熱的PCB板多腔層壓機,確保在熱壓和冷壓過程中,通過提高溫度傳遞的均勻性及穩定性,來減少壓制過程中PCB板的變形率,減少報廢率,提高成品率,降低生產成本。 In view of the shortcomings in the above technology, the object of the present invention is to provide an electromagnetically heated multi-cavity laminating machine for PCB boards, which can ensure the uniformity and stability of temperature transmission during hot and cold pressing. Reduce the deformation rate of the PCB during the pressing process, reduce the scrap rate, improve the yield, and reduce production costs.

為了實現根據本發明的上述目的和其他優點,提供了一種電磁加熱的PCB板多腔層壓機,包括:具有一定內部空間的壓合室;設置於所述壓合室內的壓合組件,該壓合組件包括至少三塊壓合板,所述壓合板兩兩相互平行,相鄰兩塊所述壓合板相距一定的距離從而形成有至少兩個壓合腔;其中,所述壓合室內設有電磁加熱組件,所述電磁加熱組件包括能夠產生交變磁場的電磁感應線 圈,所述電磁感應線圈設置於加熱板內,至少一塊所述壓合板上設置有所述加熱板,所述電磁感應線圈的內部呈中空狀以形成貫通其兩端的冷卻通道。 In order to achieve the above-mentioned object and other advantages according to the present invention, an electromagnetic heating PCB multi-cavity laminator is provided, comprising: a pressing chamber having a certain internal space; and a pressing assembly provided in the pressing chamber. The pressing component includes at least three pressing plates, the pressing plates are parallel to each other, and two adjacent pressing plates are spaced apart from each other by a certain distance to form at least two pressing chambers; wherein the pressing chamber is provided with Electromagnetic heating component including electromagnetic induction wire capable of generating alternating magnetic field The electromagnetic induction coil is disposed in a heating plate, and the heating plate is provided in at least one of the pressing plates. The electromagnetic induction coil has a hollow interior to form a cooling channel passing through both ends thereof.

優選的,所述壓合板與所述加熱板固定連接或一體成型。 Preferably, the pressing plate and the heating plate are fixedly connected or integrally formed.

優選的,所述電磁加熱組件還包括與所述電磁感應線圈電連接的電磁加熱控制器,所述電磁加熱控制器分別與所述電磁感應線圈的第一接線點和第二接線點電連接,從而構成電磁加熱回路,以致使電磁感應線圈產生變化的交變磁場。 Preferably, the electromagnetic heating component further includes an electromagnetic heating controller electrically connected to the electromagnetic induction coil, and the electromagnetic heating controller is electrically connected to a first connection point and a second connection point of the electromagnetic induction coil, respectively. As a result, an electromagnetic heating circuit is formed, so that the electromagnetic induction coil generates a changing alternating magnetic field.

優選的,所述電磁感應線圈的一端開設有入液口,所述電磁感應線圈的另一端開設有出液口,所述冷卻通道與所述電磁感應線圈的入液口和出液口相連通;所述電磁感應線圈的入液口和出液口外接連通有冷卻系統,所述冷卻系統、電磁感應線圈的入液口和出液口、冷卻通道構成冷卻循環回路。 Preferably, one end of the electromagnetic induction coil is provided with a liquid inlet, the other end of the electromagnetic induction coil is provided with a liquid outlet, and the cooling channel is in communication with the liquid inlet and the liquid outlet of the electromagnetic induction coil. A cooling system is externally connected to the liquid inlet and the liquid outlet of the electromagnetic induction coil, and the cooling system, the liquid inlet and the liquid outlet of the electromagnetic induction coil, and a cooling channel form a cooling circulation circuit.

優選的,所述電磁感應線圈設置呈多重“S”形折疊狀或螺旋狀。 Preferably, the electromagnetic induction coil is arranged in multiple "S" -shaped folds or spirals.

優選的,所述之電磁加熱的PCB板多腔層壓機還包括外接於所述壓合組件的液壓裝置,所述液壓裝置的驅動部為所述壓合組件提供壓合壓力;所述液壓裝置包括液壓缸和油泵,所述液壓缸的驅動端為位於最下層的所述壓合板提供壓合壓力。 Preferably, the electromagnetically heated PCB multi-cavity laminator further includes a hydraulic device externally connected to the pressing component, and a driving part of the hydraulic device provides a pressing pressure for the pressing component; the hydraulic pressure The device includes a hydraulic cylinder and an oil pump, and a driving end of the hydraulic cylinder provides a pressing pressure for the pressing plate located at the lowest level.

優選的,所述之電磁加熱的PCB板多腔層壓機還包括用於對所述壓合室進行冷卻的冷卻組件,所述冷卻組件為風冷組件,其包括:與所述壓合室構成回路的循環風路管;在所述循環風路管的空氣流動方向上依次設置的主電磁閥、變頻風機單元和冷卻單元;所述變頻風機單元包括第一變頻風機和第二變頻風機,所述循環風路管的出風口處設有第一變頻風機,所述第一變頻風機的出風口處設有第一補充風口,所述第一補充風口上設有第一電磁閥,所述主電磁閥 與第二變頻風機之間設有第二補充風口,所述第二補充風口上設有第二電磁閥;其中,所述循環風路管的出風口設於壓合室的頂部,循環風路管的進風口設於壓合室的底部。 Preferably, the electromagnetically heated PCB multi-cavity laminator further includes a cooling module for cooling the pressing chamber, and the cooling module is an air-cooled module, which includes: A circulating air duct pipe constituting a loop; a main solenoid valve, a variable frequency fan unit and a cooling unit which are sequentially arranged in the air flow direction of the circulating air pipe; the variable frequency fan unit includes a first variable frequency fan and a second variable frequency fan, A first frequency conversion fan is provided at an air outlet of the circulating air duct, a first supplementary air outlet is provided at an air outlet of the first frequency conversion fan, and a first solenoid valve is provided at the first supplementary air outlet. Main solenoid valve A second supplementary air outlet is provided between the second frequency conversion fan and the second supplementary air outlet, and a second solenoid valve is provided on the second supplementary air outlet. The air outlet of the circulating air duct is provided on the top of the compression chamber to circulate the air duct. The air inlet of the tube is set at the bottom of the compression chamber.

優選的,所述壓合室內還設置有至少兩根導柱,所述壓合板均可沿所述導柱上下滑動。所述導柱的內部設置呈中空結構,所述導柱的一端開設有抽氣口,所述抽氣口外接有抽氣裝置,所述導柱的外壁開設有與導柱內部相聯通的通氣孔。 Preferably, at least two guide posts are further provided in the pressing chamber, and the pressing board can slide up and down along the guide posts. The inside of the guide post has a hollow structure. One end of the guide post is provided with an air exhaust port, and the air exhaust port is externally connected with an air extraction device. The outer wall of the guide post is provided with a vent hole communicating with the inside of the guide post.

優選的,所述壓合室設有至少一扇室門,所述室門包括:門板、及設於所述門板兩側的門套,所述門套與通往所述壓合室的門框相固接,所述門板嵌套在兩個所述門套之間且可沿所述門套上下滑動以實現所述壓合室的啟閉。 Preferably, the pressing room is provided with at least one door, and the door includes a door panel and door covers provided on both sides of the door panel, the door cover and a door frame leading to the pressing room. They are fixedly connected, and the door panel is nested between the two door covers and can slide up and down along the door covers to realize the opening and closing of the pressing chamber.

優選的,所述門套包括門套主體、及形成於所述門套主體中的U形槽部,所述U形槽部沿所述門套主體的高度方向延伸;所述門板的兩側均設有至少一個軸承,所述軸承與所述U形槽部相卡接;所述U形槽部設置有兩個端部,分別為靠近所述壓合室門框的內側端部與遠離所述壓合室門框的外側端部,所述外側端部的寬度大於所述內側端部的寬度。 Preferably, the door cover includes a door cover main body and a U-shaped groove portion formed in the door cover main body, the U-shaped groove portion extending in a height direction of the door cover main body; both sides of the door panel At least one bearing is provided, and the bearing is engaged with the U-shaped groove portion; the U-shaped groove portion is provided with two end portions, which are respectively close to the inner end portion of the door frame of the pressing chamber and away from the U-shaped groove portion. The outer end portion of the compression chamber door frame has a width greater than a width of the inner end portion.

本發明與現有技術相比,其有益效果是:1、由於採用電磁加熱的供熱方式,電磁加熱因電磁感應線圈本身基本不會產生熱量,壽命長,檢修及維護更換成本低廉,加熱板或壓合板經可變電磁場作用發熱,熱量利用充分,熱量散失較小,熱量聚集於加熱板或壓合板內部,電磁感應線圈表面溫度略高於室溫,可以安全觸摸,無需熱防護,安全可靠;採用內部發熱的加熱方式,使得所述加熱板或壓合板直接感應磁能而生熱,熱響應快速,平均預熱時間比傳統加熱如電阻圈加熱方式縮短60%以上,同時熱效 率高達90%以上,在同等條件下,比電阻圈加熱節電30~70%,同時提高了生產效率,電磁感應線圈本身不發熱,熱阻滯小,熱慣性低,溫度控制實時准確,明顯改善產品質量;2、由於所述壓合室內設有電磁加熱組件與冷卻組件,可以實現熱壓和冷壓一體,由於不需要轉移到冷壓機或其他冷卻機構裏冷卻,避免了在轉移過程中壓合後的PCB板產品受到環境溫差的作用產生內應力,此外還避免了在轉移過程中失去上下層的所述壓合板的壓力束縛作用導致PCB板產品翹曲變形,並且由於是面接觸冷卻,並通過調節傳導液或是冷卻風的流量、壓力、流速及溫度等,可以有效控制PCB板產品的冷卻速度和冷卻溫度的均勻性(板周圍和內部溫差),進一步減少PCB板產品產生不規則變形等問題,此外,由於冷壓完成後,所述壓合板的溫度直接降到工藝需要的溫度,直接可以開始下一批生產,不需要額外的冷卻時間,設備效率高,進一步提高了生產效率;3、與現有技術中加熱或者冷卻只能從PCB板產品的上下兩端通過熱傳導來進行所不同的是,由於具有加熱與冷卻功能的所述壓合板設於PCB板產品包之間,從而可以在相鄰兩個PCB板產品包間開始實現加熱或冷卻,不管是熱壓過程或是冷壓過程,都大大加快了PCB板產品包的加熱或是冷卻過程,此外,還能進一步控制PCB板產品包的加熱速度與加熱溫度或是冷卻速度與冷卻溫度的均勻性,從而進一步減少PCB板產品發生不規則變形等問題;4、由於相鄰兩塊所述壓合板相隔有一定的距離從而構成至少兩個壓合腔,採用這種多腔式的設計,使得生產板數量控制在10~50層,針對一些特殊內層殘銅分佈不均勻設計的PCB板或多層線路中各層殘銅位置對應設計的PCB板,以及10層以上PCB板,通過每腔體的生產數量的有效控制,就能有效降低或避免了殘 銅累計產生的壓力誤差,很好解決了由於殘銅累計產生的壓力誤差而導致的PCB板壓合後厚度不均勻和壓合氣泡等問題;5、U形槽部具有兩個端部,分別為靠近所述壓合室的門框的內側端部與遠離所述壓合室的門框的外側端部,外側端部的寬度大於內側端部的寬度,對壓合室外部空氣進入壓合室內設置了多重密封;室門與壓合室的門框之間設有的密封圈進一步提高了室門的密封性。 Compared with the prior art, the present invention has the following beneficial effects: 1. Due to the heating method using electromagnetic heating, electromagnetic heating basically does not generate heat due to the electromagnetic induction coil itself, has a long service life, and has low maintenance and replacement costs. The pressing plate generates heat by the action of a variable electromagnetic field, with sufficient heat utilization and small heat loss. The heat is collected inside the heating plate or the pressing plate. The temperature of the surface of the electromagnetic induction coil is slightly higher than room temperature, which can be safely touched without heat protection. It is safe and reliable; The internal heating method is adopted to make the heating plate or pressing plate directly generate magnetic energy and generate heat. The thermal response is fast, and the average preheating time is shortened by more than 60% compared with traditional heating methods such as resistance coil heating. The rate is as high as more than 90%. Under the same conditions, it can save electricity by 30 ~ 70% compared to the resistance coil heating. At the same time, it improves the production efficiency. The electromagnetic induction coil itself does not generate heat, the thermal blockage is small, the thermal inertia is low, and the temperature control is accurate and real-time. Improve product quality; 2. Because the pressing room is provided with an electromagnetic heating component and a cooling component, the hot and cold pressing can be integrated. Since it does not need to be transferred to a cold press or other cooling mechanism for cooling, the transfer process is avoided. The internal pressure of the PCB product after intermediate pressure is affected by the environmental temperature difference, in addition, it also avoids the warping deformation of the PCB product caused by the pressure restraint effect of the pressure plate which has lost the upper and lower layers during the transfer process, and due to the surface contact Cooling, and by adjusting the flow rate, pressure, flow rate and temperature of the conductive liquid or cooling air, it can effectively control the cooling speed and uniformity of the cooling temperature of the PCB board product (the temperature difference between the board and the interior), and further reduce the production of PCB board products Problems such as irregular deformation. In addition, after the cold pressing is completed, the temperature of the plywood is directly reduced to the temperature required by the process, and it can be opened directly. The next batch of production does not require additional cooling time, and the equipment is highly efficient, further improving production efficiency. 3. Unlike the existing technology, heating or cooling can only be performed by heat conduction from the upper and lower ends of the PCB board product. Since the pressing board with heating and cooling functions is provided between the PCB board product packages, heating or cooling can be started between two adjacent PCB board product packages, whether it is a hot pressing process or a cold pressing process. It greatly accelerates the heating or cooling process of the PCB board product package. In addition, it can further control the heating speed and heating temperature of the PCB board product package or the uniformity of the cooling speed and cooling temperature, thereby further reducing the occurrence of irregularities in the PCB board product. Problems such as deformation; 4. At least two pressing cavities are formed due to a certain distance between two adjacent pressing plates. Using this multi-cavity design, the number of production plates is controlled between 10 and 50 layers. Some special-designed PCBs with uneven copper distribution inside the PCB or PCBs with corresponding copper positions on each layer in the multilayer circuit, and PCBs with more than 10 layers Effective control of the production volume of the body, can be effective in reducing or avoiding residual The pressure error caused by the accumulated copper can well solve the problems of uneven thickness and pressure bubbles of the PCB after pressing due to the accumulated pressure error caused by the residual copper; 5. The U-shaped groove has two ends, respectively In order to approach the inner end of the door frame of the compression chamber and the outer end of the door frame remote from the compression chamber, the width of the outer end is greater than the width of the inner end. Multiple seals are provided; the sealing ring provided between the door and the door frame of the compression chamber further improves the tightness of the door.

100‧‧‧電磁加熱的PCB板多腔層壓機 100‧‧‧ Multi-cavity laminating machine for PCB with electromagnetic heating

110‧‧‧壓合室 110‧‧‧Compression Room

111‧‧‧左側板 111‧‧‧Left plate

111a‧‧‧左底座 111a‧‧‧left base

112a‧‧‧右底座 112a‧‧‧right base

112‧‧‧右側板 112‧‧‧Right plate

113‧‧‧頂板 113‧‧‧Top plate

114‧‧‧中板 114‧‧‧Medium plate

115‧‧‧觀察窗 115‧‧‧observation window

120‧‧‧液壓裝置 120‧‧‧hydraulic device

121‧‧‧液壓缸 121‧‧‧Hydraulic cylinder

130‧‧‧室門 130‧‧‧room door

131‧‧‧門套 131‧‧‧Door Cover

131a‧‧‧內側端部 131a‧‧‧ inside end

131b‧‧‧外側端部 131b‧‧‧outer end

131c‧‧‧U形槽部 131c‧‧‧U-shaped groove

132‧‧‧門板 132‧‧‧Door panel

132a‧‧‧軸承 132a‧‧‧bearing

133‧‧‧驅動氣缸 133‧‧‧Drive cylinder

134‧‧‧密封圈 134‧‧‧Sealing ring

140‧‧‧安全開關組件 140‧‧‧Safety switch assembly

141‧‧‧信號發射器 141‧‧‧Signal transmitter

142‧‧‧信號接收器 142‧‧‧Signal Receiver

150‧‧‧壓合組件 150‧‧‧Compression Assembly

151‧‧‧支撐板 151‧‧‧Support plate

152‧‧‧墊板 152‧‧‧ pad

153‧‧‧下隔熱板 153‧‧‧Lower insulation board

154‧‧‧壓合板 154‧‧‧Plywood

154a‧‧‧滾輪 154a‧‧‧roller

154b‧‧‧壓合腔 154b‧‧‧Compression cavity

154c‧‧‧冷卻管 154c‧‧‧cooling pipe

155‧‧‧上隔熱板 155‧‧‧ Upper heat shield

156‧‧‧導柱 156‧‧‧Guide Post

156a‧‧‧抽氣口 156a‧‧‧Exhaust port

156b‧‧‧滑軌槽 156b‧‧‧Slide rail groove

157‧‧‧限位柱 157‧‧‧ limit post

157a‧‧‧限位塊 157a‧‧‧Limit block

158‧‧‧集油組件 158‧‧‧ Oil collecting assembly

158a、158a’‧‧‧回油柱 158a, 158a’‧‧‧ oil return column

158b、158b’‧‧‧進油柱 158b, 158b’‧‧‧ oil column

159‧‧‧柔性管 159‧‧‧flexible tube

160‧‧‧PCB板包 160‧‧‧PCB board package

161‧‧‧隔板 161‧‧‧ partition

162‧‧‧銅箔 162‧‧‧copper foil

163‧‧‧半固化片 163‧‧‧Prepreg

164‧‧‧內層線路板 164‧‧‧Inner circuit board

170‧‧‧風冷組件 170‧‧‧Air-cooled components

171‧‧‧循環風路管 171‧‧‧Circulation air duct

172‧‧‧主電磁閥 172‧‧‧Main solenoid valve

173‧‧‧第二變頻風機 173‧‧‧Second Variable Frequency Fan

174‧‧‧冷卻單元 174‧‧‧cooling unit

175‧‧‧第二補充風口 175‧‧‧second supplementary air outlet

175a‧‧‧第二電磁閥 175a‧‧‧Second Solenoid Valve

176‧‧‧第一變頻風機 176‧‧‧The first inverter fan

177‧‧‧第一補充風口 177‧‧‧The first supplementary air outlet

177a‧‧‧第一電磁閥 177a‧‧‧The first solenoid valve

180‧‧‧加熱板 180‧‧‧ heating plate

190‧‧‧電磁感應線圈 190‧‧‧ electromagnetic induction coil

191‧‧‧入液口 191‧‧‧Inlet

192‧‧‧出液口 192‧‧‧ Outlet

193‧‧‧第一接線點 193‧‧‧The first connection point

194‧‧‧第二接線點 194‧‧‧Second connection point

195‧‧‧冷卻通道 195‧‧‧cooling channel

圖1所繪示出用於製造PCB板的PCB板包在根據本發明所述之電磁加熱的PCB板多腔層壓機中的結構示意圖;圖2為本發明所述之電磁加熱的PCB板多腔層壓機的軸測圖;圖3為本發明所述之電磁加熱的PCB板多腔層壓機的軸測圖;圖4為本發明所述之電磁加熱的PCB板多腔層壓機的俯視圖;圖5為本發明所述之電磁加熱的PCB板多腔層壓機的正視圖;圖6為本發明所述之電磁加熱的PCB板多腔層壓機的右視圖;圖7是圖4中沿A-A方向剖視圖;圖8是圖4中沿B-B方向剖視圖;圖9是圖4中C處的局部放大圖;圖10為本發明所述壓合組件的第一軸測圖;圖11為本發明所述壓合組件的第二軸測圖;圖12為本發明所述壓合組件的右視圖;圖13為本發明所述壓合組件的正視圖; 圖14為本發明所述壓合組件內部局部示意圖;圖15是圖14中D處的局部放大圖;圖16為本發明所述之電磁加熱的PCB板多腔層壓機中的導柱的結構圖;圖17為本發明所述壓合板的軸測圖;圖18為本發明所述壓合板的正視圖;圖19是圖18中沿E-E方向的剖視圖;圖20是圖1中的PCB板包的結構圖;圖21是用傳統冷壓機壓制後PCB板產品進行冷壓的X-Y方向脹縮圖;圖22是用本發明所述電磁加熱的PCB板多腔層壓機壓制後的PCB板產品進行冷壓的X-Y方向脹縮圖;圖23是用傳統冷壓機對壓制後的PCB板產品進行冷壓的X-Y方向脹縮趨勢圖;圖24是用本發明所述之電磁加熱的PCB板多腔層壓機對壓制後的PCB板產品進行冷壓的X-Y方向脹縮趨勢圖;圖25是用傳統冷壓機冷壓與用本發明所述之電磁加熱的PCB板多腔層壓機冷壓在X方向上的脹縮對比;圖26是用傳統冷壓機冷壓與用本發明所述之電磁加熱的PCB板多腔層壓機冷壓在Y方向上的脹縮對比;圖27是傳統冷壓機冷壓單層PCB板的X-Y方向最大脹縮圖;圖28為本發明所述之電磁加熱的PCB板多腔層壓機冷壓單層PCB板的X-Y方向最大脹縮圖; 圖29為本發明所述之電磁加熱的PCB板多腔層壓機中連通有風冷組件時的剖視圖;圖30為本發明所述電磁感應線圈設置於壓合板中的結構示意圖;圖31為本發明所述電磁感應線圈設置於加熱板中的結構示意圖;圖32為本發明所述電磁感應線圈的結構示意圖。 FIG. 1 is a schematic structural diagram of a PCB board for manufacturing a PCB board enclosed in an electromagnetically heated PCB board multi-cavity laminator according to the present invention; FIG. 2 is an electromagnetically heated PCB board according to the present invention; Axonometric view of a multi-cavity laminator; Figure 3 is an isometric view of an electromagnetically heated PCB board multi-cavity laminator according to the present invention; and FIG. 4 is a multi-cavity laminate of an electromagnetically heated PCB board according to the present invention Top view of the machine; Figure 5 is a front view of the electromagnetically heated PCB board multi-cavity laminator according to the present invention; Figure 6 is a right side view of the electromagnetically heated PCB board multi-cavity laminator according to the present invention; Figure 7 4 is a cross-sectional view along the AA direction in FIG. 4; FIG. 8 is a cross-sectional view along the BB direction in FIG. 4; FIG. 9 is a partially enlarged view at C in FIG. 4; and FIG. 10 is a first isometric view of the compression assembly according to the present invention; FIG. 11 is a second isometric view of the compression assembly according to the present invention; FIG. 12 is a right side view of the compression assembly according to the present invention; FIG. 13 is a front view of the compression assembly according to the present invention; FIG. 14 is a schematic partial internal view of the compression assembly according to the present invention; FIG. 15 is a partially enlarged view at D in FIG. 14; FIG. 16 is a guide post of the electromagnetically heated PCB board multi-cavity laminator according to the present invention Structural drawing; FIG. 17 is an isometric view of the plywood according to the present invention; FIG. 18 is a front view of the plywood according to the present invention; FIG. 19 is a cross-sectional view taken along the EE direction in FIG. 18; and FIG. 20 is the PCB in FIG. Structural diagram of the board package; Figure 21 is a XY direction expansion and contraction diagram of the PCB board product after cold pressing with a conventional cold press; Figure 22 is a result of pressing with a multi-cavity lamination machine for a PCB board with electromagnetic heating according to the present invention Expansion and contraction diagram of XY direction of PCB board products for cold pressing; Fig. 23 is an XY expansion and contraction trend chart of PCB board products after cold pressing by conventional cold press; Fig. 24 is electromagnetic heating according to the present invention The XY direction expansion and contraction trend of the PCB board multi-cavity laminator for cold-pressing the pressed PCB board products; Figure 25 is a conventional multi-cavity PCB board cold-pressing with a conventional cold press and the electromagnetic heating of the present invention. Comparison of the expansion and contraction of the laminator in the X direction; Figure 26 shows the cold pressing of a conventional cold press and the electromagnetic heating of the present invention. Comparison of the expansion and contraction of the PCB board multi-cavity laminator in the Y direction; Figure 27 is the largest expansion and contraction chart of the conventional cold press single layer PCB board in the XY direction; Figure 28 is the electromagnetic heating according to the present invention. XY direction maximum expansion and contraction chart of PCB board multi-cavity laminator cold pressing single layer PCB board; FIG. 29 is a cross-sectional view of an electromagnetically heated PCB board multi-cavity laminator according to the present invention when air-cooled components are connected; FIG. 30 is a schematic structural diagram of an electromagnetic induction coil provided in a pressing board according to the present invention; FIG. 31 is The structure schematic diagram of the electromagnetic induction coil according to the present invention disposed in a heating plate; FIG. 32 is the structure diagram of the electromagnetic induction coil according to the present invention.

下面結合附圖對本發明做進一步的詳細說明,本發明的前述和其它目的、特徵、方面和優點將變得更加明顯,以令本領域技術人員參照說明書文字能夠據以實施。 The following further describes the present invention in detail with reference to the accompanying drawings. The foregoing and other objects, features, aspects, and advantages of the present invention will become more apparent, so that those skilled in the art can implement the present invention with reference to the description text.

參照圖1和圖20,根據本發明的多腔熱壓機100的每個壓合腔154b中放置有待壓制的PCB板包160,每個待壓制的PCB板包160由至少一塊PCB板依次層疊堆置而成,為了防止PCB板在壓制過程中粘連,相鄰兩塊PCB板之間及PCB板與壓合板154之間設置有導熱並防粘的隔板161。在一實施例中,多腔熱壓機100中設有兩個壓合腔154b,每個壓合腔154b中放置有待壓制的PCB板包160,每個待壓制的PCB板包160由PCB板C1、C2、C3從上至下依次層疊堆置而成。作為一實施例,每層PCB板的結構如圖20所示,主要包括位於最外側的上下兩片銅箔162、與銅箔162鄰接的兩片半固化片163、由半固化片163夾持的內層線路板164。 1 and 20, a PCB board package 160 to be pressed is placed in each pressing cavity 154b of the multi-cavity hot press 100 according to the present invention, and each PCB board package 160 to be pressed is sequentially stacked by at least one PCB board Stacked, in order to prevent the PCB boards from sticking during the pressing process, a thermally conductive and anti-adhesive spacer 161 is provided between two adjacent PCB boards and between the PCB board and the pressing board 154. In an embodiment, the multi-cavity hot press 100 is provided with two pressing cavities 154b, and each pressing cavity 154b has a PCB board package 160 to be pressed, and each PCB board package 160 to be pressed is a PCB board. C1, C2, and C3 are stacked in order from top to bottom. As an example, the structure of each layer of the PCB is shown in FIG. 20, which mainly includes two copper foils 162 located on the outermost side, two copper foils 163 adjacent to the copper foil 162, and an inner layer circuit held by the copper foils 163. Board 164.

參照圖1-32所示,電磁加熱的PCB板多腔層壓機100包括:控制系統(未圖示)、壓合室110、液壓裝置120、室門130、安全開關組件140、以及壓合組件150。其中,壓合室110具有一定的內部空間,且該壓合室110包括用於在其內部產生真空的抽氣裝置(未圖示),壓合室110內設有冷卻組件與電磁加熱組件;壓合組件150設置於壓合室110的內部空間內,且該壓合組件150包括至少三塊壓合板 154,壓合板154相互平行,相鄰兩塊壓合板154之間相隔有一定的距離從而構成至少兩個壓合腔154b,待壓制的PCB板包160放置於每個壓合腔154b中進行熱壓或冷壓,位於最上層的壓合板154的上表面與位於最下層的壓合板154的下表面分別鄰接有上隔熱板155與下隔熱板153,上隔熱板155與下隔熱板153均由具有一定結構強度的絕熱材料製成,所述液壓裝置120、安全開關組件140、電磁加熱組件、冷卻組件均與控制系統電連接。 Referring to Figures 1-32, the electromagnetically heated PCB multi-cavity laminator 100 includes: a control system (not shown), a crimping chamber 110, a hydraulic device 120, a chamber door 130, a safety switch assembly 140, and a crimping Component 150. Wherein, the compression chamber 110 has a certain internal space, and the compression chamber 110 includes an air extraction device (not shown) for generating a vacuum inside the compression chamber 110, and the compression chamber 110 is provided with a cooling component and an electromagnetic heating component; The pressing assembly 150 is disposed in the internal space of the pressing chamber 110, and the pressing assembly 150 includes at least three pressing plates. 154, the pressing plates 154 are parallel to each other, and two adjacent pressing plates 154 are separated by a certain distance to form at least two pressing cavities 154b. The PCB board package 160 to be pressed is placed in each pressing cavity 154b for heating Pressing or cold pressing, the upper surface of the plywood 154 located at the uppermost layer and the lower surface of the plywood 154 located at the lowermost layer are adjacent to the upper heat insulation plate 155 and the lower heat insulation plate 153, and the upper heat insulation plate 155 and the lower heat insulation, respectively. The plates 153 are all made of a heat-insulating material with a certain structural strength. The hydraulic device 120, the safety switch assembly 140, the electromagnetic heating assembly, and the cooling assembly are all electrically connected to the control system.

作為一實施例,所述電磁加熱組件包括能夠產生交變磁場的電磁感應線圈190、與所述電磁感應線圈190電連接的電磁加熱控制器(未圖示)。 As an embodiment, the electromagnetic heating component includes an electromagnetic induction coil 190 capable of generating an alternating magnetic field, and an electromagnetic heating controller (not shown) electrically connected to the electromagnetic induction coil 190.

作為一實施例,至少一塊所述壓合板154內設置有所述電磁感應線圈190,壓合板154由具有一定結構強度的導磁性材料製成。 As an embodiment, the electromagnetic induction coil 190 is disposed in at least one of the pressing plates 154, and the pressing plate 154 is made of a magnetically conductive material with a certain structural strength.

作為一實施例,所述電磁感應線圈190設置於加熱板180內,加熱板180由具有一定結構強度的導磁性材料製成,至少一塊所述壓合板154上設置有所述加熱板180,所述壓合板154與所述加熱板180固定連接或一體成型,所述加熱板180包括基板和罩蓋於所述基板上的蓋板,所述基板上開設有與所述電磁感應線圈190的形狀相匹配的凹槽。 As an example, the electromagnetic induction coil 190 is disposed in a heating plate 180. The heating plate 180 is made of a magnetically permeable material having a certain structural strength. At least one of the pressing plates 154 is provided with the heating plate 180. The pressing plate 154 is fixedly connected or integrally formed with the heating plate 180. The heating plate 180 includes a substrate and a cover covering the substrate. The substrate is provided with a shape corresponding to the electromagnetic induction coil 190. Matching grooves.

作為一實施例,所述電磁加熱控制器分別與所述電磁感應線圈的第一接線點193和第二接線點194電連接,從而構成電磁加熱回路,以致使電磁感應線圈190產生變化的交變磁場;電磁加熱控制器將交流電整流變成直流電,再將直流電轉換成高頻高壓電,高速變化的高頻高壓電流流過電磁感應線圈190會產生高速變化的交變磁場,當磁場內的磁力線通過導磁性的壓合板154或加熱板180時,即使得壓合板154或加熱板180自行高速發熱。 As an example, the electromagnetic heating controller is electrically connected to the first connection point 193 and the second connection point 194 of the electromagnetic induction coil, respectively, so as to form an electromagnetic heating circuit, so that the electromagnetic induction coil 190 changes and changes. Magnetic field; electromagnetic heating controller rectifies AC power into DC power, and then converts DC power into high-frequency high-voltage power. High-speed high-frequency high-voltage current flowing through the electromagnetic induction coil 190 generates a high-speed alternating magnetic field. When the magnetic field lines in the magnetic field When the magnetically-conductive pressing plate 154 or the heating plate 180 is passed, the pressing plate 154 or the heating plate 180 automatically generates heat at high speed.

作為一實施例,所述電磁感應線圈190的內部呈中空狀以形成貫通其兩端的冷卻通道195,所述電磁感應線圈的一端開設有入液口191,所述電磁感應線圈的另一端開設有出液口192,所述冷卻通道195與所述電磁感應線圈的入液口191和出液口192相連通;所述電磁感應線圈的入液口191和出液口192外接連通有冷卻系統,所述冷卻系統、電磁感應線圈的入液口191和出液口192、冷卻通道195構成冷卻循環回路;通過在冷卻通道195內通入溫度及流量可控的冷卻液(油或水等介質),從而對電磁感應線圈190及壓合板154或加熱板180進行高效快速冷卻,除了能夠進一步提高冷卻速度外,還能夠對電磁感應線圈190及壓合板154或加熱板180起到冷卻保護作用,提高其可靠性,降低更換成本,此外,採用在電磁感應線圈的冷卻通道195內通入冷卻液的方法,能夠最大化地降低結構複雜度且不影響冷卻效率。 As an example, the inside of the electromagnetic induction coil 190 is hollow to form a cooling channel 195 penetrating its two ends. One end of the electromagnetic induction coil is provided with a liquid inlet 191, and the other end of the electromagnetic induction coil is provided. A liquid outlet 192, the cooling channel 195 is in communication with the liquid inlet 191 and the liquid outlet 192 of the electromagnetic induction coil; the liquid inlet 191 and the liquid outlet 192 of the electromagnetic induction coil are externally connected with a cooling system, The cooling system, the liquid inlet 191 and the liquid outlet 192 of the electromagnetic induction coil, and the cooling channel 195 constitute a cooling circulation circuit; a cooling liquid (such as oil or water) with a controllable temperature and flow rate is introduced into the cooling channel 195 Therefore, the electromagnetic induction coil 190 and the pressing plate 154 or the heating plate 180 can be efficiently and rapidly cooled. In addition to further improving the cooling speed, the electromagnetic induction coil 190 and the pressing plate 154 or the heating plate 180 can also be used for cooling and protecting the electromagnetic induction coil 190 and the pressing plate 154 or the heating plate 180. Its reliability reduces the replacement cost. In addition, the method of passing cooling liquid into the cooling channel 195 of the electromagnetic induction coil can minimize the structural complexity and It affects the cooling efficiency.

作為一實施例,所述電磁感應線,190設置呈多重“S”形折疊狀或螺旋狀,以及能夠產生交變磁場的其他形狀。 As an embodiment, the electromagnetic induction line 190 is provided in a multiple “S” -shaped folded or spiral shape, and other shapes capable of generating an alternating magnetic field.

作為一實施例,所述電磁感應線圈190的軸線Z1與所述壓合板154或加熱板180的中心法線Z2相平行。 As an example, the axis Z1 of the electromagnetic induction coil 190 is parallel to the center normal line Z2 of the pressing plate 154 or the heating plate 180.

在一實施例中,還包括銅箔加熱組件,其包括設置在所述壓合腔154b中的銅箔片、及與所述銅箔片電連接的功率控制器,以對銅箔片進行加熱控制,所述銅箔片往複折疊成多重“S”型折疊狀結構,從而使得所述銅箔片內形成有多個間隔設置的容納室(未圖示),待壓制的PCB板包160放置于所述容納室後,再放置於壓合腔154b中。 In one embodiment, a copper foil heating assembly is further included, which includes a copper foil provided in the pressing cavity 154b and a power controller electrically connected to the copper foil to heat the copper foil. Control, the copper foil is folded back and forth into a multiple "S" -shaped folding structure, so that a plurality of spaced accommodation chambers (not shown) are formed in the copper foil, and the PCB board package 160 to be pressed is placed After the receiving chamber, it is placed in the pressing cavity 154b.

在一實施例中,壓合室110包括左側板111、右側板112、頂板113、以及中板114,左側板111、右側板112、頂板113、以及中板114構成了具有一定內部空間 的壓合室110,左側板111的底部設有左底座111a,右側板112的底部設有右底座112a,可以在用螺栓通過將左底座111a與右底座112a固定於地面上從而實現壓合室110與地面的固定連接。左側板111與右側板112上開設有至少一個觀察窗115,在一實施例中,左側板111與右側板112上開設有兩個觀察窗115。在一實施例中,壓合板154設有3片,相互之間距有一定的距離從而構成2個壓合腔154b,如圖1所示,每個壓合腔154b中放置有組裝好的待壓制的PCB板包160。 In one embodiment, the compression chamber 110 includes a left plate 111, a right plate 112, a top plate 113, and a middle plate 114. The left plate 111, the right plate 112, the top plate 113, and the middle plate 114 form a certain internal space. In the pressing room 110, a left base 111a is provided at the bottom of the left side plate 111, and a right base 112a is provided at the bottom of the right side plate 112. The left base 111a and the right base 112a can be fixed to the ground by bolts to realize a pressing room. 110 fixed connection to the ground. The left side plate 111 and the right side plate 112 are provided with at least one observation window 115. In one embodiment, the left side plate 111 and the right side plate 112 are provided with two observation windows 115. In an embodiment, the pressing plates 154 are provided with three pieces, and there is a certain distance from each other to form two pressing cavities 154b. As shown in FIG. 1, each of the pressing cavities 154b has an assembled to be pressed. PCB board package 160.

在一實施例中,壓合室110內還設置有至少兩根導柱156、設置於下隔熱板153之下的墊板152、以及設置於墊板152之下的支撐板151,其中,壓合板154及上隔熱板155、下隔熱板153均被限制於導柱156之間並可沿導柱156上下滑動;液壓裝置120外接於壓合組件150,所述液壓裝置120的驅動部為所述壓合組件150提供壓合壓力。作為一實施例,液壓裝置120包括驅動電機、若幹管路、液壓缸121及由該驅動電機驅動的油泵,所述液壓缸121的驅動端為位於最下層的壓合板154提供壓合動力。在一實施例中,液壓裝置120的液壓缸121的驅動端穿過支撐板151後與墊板152的下表面相抵觸,液壓裝置120與所述控制系統電連接。在一實施方式中,導柱156設有4根,分別設置於壓合板154及上隔熱板155、下隔熱板153的兩側,導柱156貫穿頂板113、墊板152、及支撐板151,從而使得頂板113、墊板152、及支撐板151成為一個穩固的整體,其中,墊板152可在液壓裝置120的液壓缸121的驅動端驅動下沿導柱156上下滑動。 In an embodiment, at least two guide posts 156, a pad plate 152 disposed under the lower heat-insulating plate 153, and a support plate 151 disposed under the pad plate 152 are further disposed in the pressing chamber 110. The compression plate 154, the upper heat insulation plate 155, and the lower heat insulation plate 153 are all restricted between the guide posts 156 and can slide up and down along the guide posts 156; the hydraulic device 120 is externally connected to the press assembly 150, and the driving of the hydraulic device 120 The portion provides a pressing pressure for the pressing component 150. As an embodiment, the hydraulic device 120 includes a driving motor, a plurality of pipelines, a hydraulic cylinder 121 and an oil pump driven by the driving motor. The driving end of the hydraulic cylinder 121 provides pressing power for the pressing plate 154 located at the lowest level. In an embodiment, the driving end of the hydraulic cylinder 121 of the hydraulic device 120 passes through the support plate 151 and interferes with the lower surface of the pad plate 152, and the hydraulic device 120 is electrically connected to the control system. In one embodiment, four guide posts 156 are provided on both sides of the pressing plate 154, the upper heat insulation plate 155, and the lower heat insulation plate 153, and the guide posts 156 penetrate the top plate 113, the backing plate 152, and the support plate. 151, so that the top plate 113, the backing plate 152, and the support plate 151 become a solid whole, wherein the backing plate 152 can slide up and down along the guide post 156 under the driving end of the hydraulic cylinder 121 of the hydraulic device 120.

在一實施方式中,每根導柱156的內側開設有滑軌槽156b,每塊壓合板154的兩側前後端部均設有滾輪154a,壓合板154通過滾輪154a與滑軌槽156b的配合從而實現壓合板154沿導柱156上下滑移。 In one embodiment, a slide rail groove 156b is provided on the inner side of each guide post 156, and rollers 154a are provided on the front and rear ends of each pressing plate 154. The pressing plate 154 cooperates with the slide rail groove 156b through the roller 154a. Thereby, the pressing plate 154 is slid down along the guide post 156.

在一實施方式中,導柱156的內部設置呈中空結構,導柱156的一端開設有抽氣口156a,所述抽氣口156a與抽氣裝置相接,位於壓合室110內部的導柱156的外壁設有與導柱156內部相聯通的通氣孔,通過這種結構可在抽氣口156a處往外抽氣從而製造壓合室110內部的真空環境。在一實施方式中,每個壓合腔154b內設有至少一個壓力傳感器及溫度傳感器(未圖示),所述壓力傳感器及溫度傳感器均與所述控制系統電連接,用於對壓合腔內154b的壓力及溫度進行實時監控。 In one embodiment, the inside of the guide post 156 has a hollow structure, and one end of the guide post 156 is provided with an air exhaust port 156a. The air exhaust port 156a is connected to the air extraction device. The guide post 156 is located inside the compression chamber 110. The outer wall is provided with a vent hole communicating with the inside of the guide post 156. With this structure, air can be sucked out at the suction port 156a to create a vacuum environment inside the compression chamber 110. In one embodiment, at least one pressure sensor and temperature sensor (not shown) are provided in each pressing cavity 154b, and the pressure sensor and temperature sensor are electrically connected to the control system and are used for pressing the cavity. The pressure and temperature inside 154b are monitored in real time.

在一實施例中,所述冷卻組件包括冷卻管154c、冷卻箱和輸送泵,所述冷卻管154c設置於所述壓合板154內,所述冷卻管154c的入液口和出液口、輸送泵、冷卻箱構成冷卻循環回路;工作時,冷卻箱中的傳導液(可為油或水等介質)在輸送泵的驅動下,將冷卻後的傳導液輸送入冷卻管154c的入液口,並經冷卻管154c的的出液口回流入冷卻箱中,以此構成冷卻循環回路;在一實施例中,冷卻管154c與所述冷卻箱之間設有集油組件158,該集油組件158包括內部中空的進油柱158b與回油柱158a,所述冷卻管的入液口通過柔性管159與進油柱158b相連通,所述冷卻管的出液口通過柔性管159與回油柱158a相連通,進油柱的進油口158b’與回油柱的回油口158a’分別與所述冷卻箱相連通。 In an embodiment, the cooling assembly includes a cooling pipe 154c, a cooling box, and a delivery pump. The cooling pipe 154c is disposed in the pressing plate 154. The liquid inlet and outlet of the cooling pipe 154c, and the delivery pump. The pump and the cooling tank constitute a cooling circulation circuit; during operation, the conductive liquid (which can be oil or water and other media) in the cooling tank is driven by the transfer pump to send the cooled conductive liquid to the liquid inlet of the cooling pipe 154c. And returning to the cooling box through the liquid outlet of the cooling pipe 154c to form a cooling circulation circuit; in an embodiment, an oil collecting assembly 158 is provided between the cooling pipe 154c and the cooling box, and the oil collecting assembly 158 includes an internal hollow oil inlet column 158b and an oil return column 158a. The liquid inlet of the cooling pipe is connected to the oil inlet 158b through a flexible pipe 159, and the liquid outlet of the cooling pipe is connected to the oil return through the flexible pipe 159. The column 158a communicates, and the oil inlet 158b 'of the oil inlet column and the oil return 158a' of the oil return column communicate with the cooling tank, respectively.

在一實施方式中,所述冷卻管154c設置呈多重“S”型折疊狀結構,及其他利於冷卻管154c均勻排布於壓合板154內的形狀均可,所述壓合板154內設置有兩組冷卻管154c,所述兩組冷卻管154c相對所述壓合板154的對稱中心對稱設置,從而增加了冷卻管154c內的傳導液的流通面積,以提高冷卻管154c在壓合板01內的冷卻效率。 In one embodiment, the cooling pipe 154c is provided with a multiple “S” -shaped folding structure, and other shapes that facilitate the uniform arrangement of the cooling pipes 154c in the pressing plate 154 are provided. Group of cooling tubes 154c, the two groups of cooling tubes 154c are symmetrically arranged with respect to the center of symmetry of the pressing plate 154, thereby increasing the flow area of the conductive liquid in the cooling tube 154c, so as to improve the cooling of the cooling tube 154c in the pressing plate 01 effectiveness.

在一實施例中,如圖29所示,所述冷卻組件包括風冷組件170,所述風冷組件170包括:與所述壓合室110構成回路的循環風路管171;在所述循環風路管171 的空氣流動方向上依次設置的主電磁閥172、變頻風機單元和冷卻單元174;所述變頻風機單元包括第一變頻風機176和第二變頻風機173,所述循環風路管171的出風口處設有第一變頻風機176,所述第一變頻風機176的出風口處設有第一補充風口177,所述第一補充風口177上設有第一電磁閥177a,所述主電磁閥172與第二變頻風機173之間設有第二補充風口175,所述第二補充風口175上設有第二電磁閥175a;所述第二變頻風機173、第一變頻風機176、主電磁閥172、第二電磁閥175a、第一電磁閥177a及冷卻單元174受控制系統的調控,及時的調整送入壓合室110內的風量及風的溫度,從而有效地對壓制後的PCB板包160進行風冷冷卻。 In an embodiment, as shown in FIG. 29, the cooling assembly includes an air-cooled assembly 170, and the air-cooled assembly 170 includes: a circulating air duct 171 forming a circuit with the compression chamber 110; Air duct 171 A main solenoid valve 172, a variable frequency fan unit, and a cooling unit 174 which are sequentially arranged in the direction of air flow; the variable frequency fan unit includes a first variable frequency fan 176 and a second variable frequency fan 173, and an air outlet of the circulation air duct 171 A first frequency conversion fan 176 is provided. A first supplementary air outlet 177 is provided at an air outlet of the first frequency conversion fan 176. The first supplementary air outlet 177 is provided with a first solenoid valve 177a. The main solenoid valve 172 and A second supplementary air outlet 175 is provided between the second frequency conversion fan 173, and a second electromagnetic valve 175a is provided on the second supplementary air outlet 175; the second frequency conversion fan 173, the first frequency conversion fan 176, the main solenoid valve 172, The second solenoid valve 175a, the first solenoid valve 177a, and the cooling unit 174 are controlled by the control system to timely adjust the amount of air and the temperature of the wind sent into the pressing chamber 110, so as to effectively perform the pressed PCB board package 160. Air-cooled cooling.

在一實施例中,所述循環風路管171的出風口設於壓合室110的頂部,循環風路管171的進風口設於壓合室110的底部,以便形成“煙囪效應”,從而使得壓合室110底部的高溫空氣更快、更有效地通過循環風路管171排出。 In an embodiment, the air outlet of the circulation air duct 171 is provided at the top of the compression chamber 110, and the air inlet of the circulation air duct 171 is provided at the bottom of the compression chamber 110 so as to form a "chimney effect", thereby The high-temperature air at the bottom of the compression chamber 110 is discharged more quickly and efficiently through the circulating air path pipe 171.

在一實施例中,壓合室110設有至少一扇與外界相通且可開合的室門130,該室門130包括:門板132;以及設於所述門板兩側的門套131,其中,門套131與通往壓合室110內部的門框相固接,門板132嵌套在兩個門套131之間且可沿門套131上下滑動以實現壓合室110的開啟或閉合。在一實施方式中,壓合室110的前後兩側各設有一扇室門130。 In an embodiment, the pressing chamber 110 is provided with at least one openable and closable chamber door 130 which is in communication with the outside. The chamber door 130 includes: a door plate 132; and door covers 131 provided on both sides of the door plate, wherein The door cover 131 is fixedly connected to the door frame leading to the inside of the pressing room 110, and the door plate 132 is nested between the two door covers 131 and can slide up and down along the door cover 131 to open or close the pressing room 110. In one embodiment, a chamber door 130 is provided on each of the front and back sides of the pressing chamber 110.

在一實施例中,門套131包括:門套主體、以及形成於所述門套主體中的U形槽部131c,其中,U形槽部131c沿所述門套主體的高度方向延伸,門板132的兩側均設有至少一個軸承132a,軸承132a與U形槽部131c相卡接,從而實現門板132沿門套131上下滑動,U形槽部131c具有兩個端部,分別為靠近壓合室110的門框的內側端部131a與遠離壓合室110的門框的外側端部131b,外側端部131b的寬度 大於內側端部131a的寬度。在一實施方式中,門板132的兩側均設有4個軸承132a。在一實施方式中,每個門套131的側面均設置有用於驅動門板132上下滑動的驅動氣缸133。 In an embodiment, the door cover 131 includes a door cover body and a U-shaped groove portion 131c formed in the door cover body, wherein the U-shaped groove portion 131c extends in a height direction of the door cover body, and the door panel Both sides of 132 are provided with at least one bearing 132a, and the bearing 132a is engaged with the U-shaped groove portion 131c, so that the door panel 132 slides up and down along the door cover 131. The U-shaped groove portion 131c has two ends, which are respectively close to the pressure. The width of the inner end portion 131a of the door frame of the bonding chamber 110 and the outer end portion 131b and the outer end portion 131b of the door frame away from the pressing chamber 110 It is larger than the width of the inner end portion 131a. In one embodiment, four bearings 132a are provided on both sides of the door panel 132. In one embodiment, a driving cylinder 133 for driving the door panel 132 to slide up and down is provided on the side of each door cover 131.

在一實施方式中,兩個門套131之間設置有安全開關組件140,具體地,安全開關組件140包括分別設置於門板132兩側門套131上的信號發射器141與信號接收器142,驅動氣缸133及安全開關組件140均與所述控制系統電連接,當門板132處於如圖5所示的開啟狀態時,如信號發射器141與信號接收器142之間有物體或操作人員阻隔時,控制系統發送控制信號,此時門板132不會落下,直到號發射器141與信號接收器142之間沒有其他物體或操作人員,從而防止門板132碰壞或是壓傷操作人員。 In one embodiment, a safety switch assembly 140 is provided between the two door covers 131. Specifically, the safety switch assembly 140 includes a signal transmitter 141 and a signal receiver 142 respectively disposed on the door cover 131 on both sides of the door panel 132, and drives. The air cylinder 133 and the safety switch assembly 140 are both electrically connected to the control system. When the door panel 132 is in the open state as shown in FIG. 5, such as when there is an object or an operator blocking between the signal transmitter 141 and the signal receiver 142, The control system sends a control signal. At this time, the door panel 132 will not fall until there are no other objects or operators between the number transmitter 141 and the signal receiver 142, thereby preventing the door panel 132 from being damaged or crushing the operator.

在一實施例中,室門130與壓合室110的門框之間設有密封圈134,密封圈134由具有一定彈性的絕熱材料製成。門板132上還設有將門板132與密封圈134壓緊以實現對壓合室110進行密封的壓緊裝置(未圖示)。 In an embodiment, a seal ring 134 is provided between the door 130 and the door frame of the compression chamber 110. The seal ring 134 is made of a heat-insulating material with a certain elasticity. The door plate 132 is also provided with a pressing device (not shown) for pressing the door plate 132 and the sealing ring 134 to seal the pressing chamber 110.

在一實施例中,壓合板154的左右兩側設有至少兩根限位柱157,每根限位柱157的內側均設有至少一塊限位塊157a,除去最上一層與最下一層的壓合板154,其餘壓合板154在未壓制時均放置於限位塊157a之上。在一實施方式中,限位元元柱157設有4根,關於壓合板154左右對稱,壓合板154設有5層,最上一層與最下一層壓合板不需要限位元塊157a的支撐,因此,限位塊157a設置成3塊,在未壓制時分別依次支撐中間3層的壓合板154。 In an embodiment, at least two limiting posts 157 are provided on the left and right sides of the pressing plate 154, and at least one limiting block 157a is provided on the inner side of each limiting post 157 to remove the pressure of the uppermost layer and the lowermost layer. The plywood 154 and the rest of the plywood 154 are placed on the limiting block 157a when not pressed. In one embodiment, there are four limiting element columns 157, which are symmetrical about the plywood 154. The plying plate 154 is provided with five layers. The uppermost layer and the lowermost laminated plywood do not require the support of the limiting element block 157a. Therefore, the limiting blocks 157a are provided in three pieces, and when not pressed, the pressing plates 154 in the middle three layers are sequentially supported.

工作原理:工人先將用於製造PCB板的材料如圖20結構進行組成堆疊,最終組裝成如圖1所示的待壓制的PCB板包160;組裝完成後,將待壓制的PCB板包160放入每個壓合腔154b中等待壓制;控制系統控制室門130的門板132落下,閉合壓 合室110,抽氣裝置開始將壓合室110的內部空間抽成真空環境;液壓裝置120的液壓缸121的驅動端開始工作,施加一定的壓力於墊板152之下,從而依次推動最下層的壓合板154開始擠壓壓合腔154b內的待壓制的PCB板包160,與此同時,電磁加熱組件開始工作,對待壓制的PCB板包160進行加熱,壓制過程中的壓力大小、溫度高低、壓制時間由控制系統進行反饋調節;壓制完成後,電磁加熱組件停止工作,此時,液壓裝置120保持壓制時的壓力不變,而冷卻組件開始工作,例如可在壓合板154內的冷卻管154c中通入持續流動的、溫度控制在15℃~35℃之間的傳導液,對壓制完的PCB板包160進行冷卻,此過程由控制系統進行反饋調節,當控制系統檢測到PCB板包160冷卻到設定溫度45℃~65℃時,停止傳導液的供給,液壓裝置120開始逐漸減小壓力,室門130打開後將壓制完的PCB板包160取出等待後續的加工工作。 Working principle: The workers first stack the materials used to manufacture the PCB board as shown in Figure 20, and finally assemble the PCB board package 160 to be pressed as shown in Figure 1. After the assembly is completed, the PCB board package 160 to be pressed is assembled. Put into each pressing cavity 154b and wait for pressing; the door 132 of the control system control room door 130 falls, and closes the pressing Compression chamber 110, the air extraction device starts to evacuate the internal space of the compression chamber 110 into a vacuum environment; the driving end of the hydraulic cylinder 121 of the hydraulic device 120 starts to work, and applies a certain pressure below the pad 152, thereby sequentially pushing the lowermost layer The pressing board 154 starts to press the PCB board package 160 in the pressing cavity 154b. At the same time, the electromagnetic heating component starts to work, and the PCB board package 160 to be pressed is heated. The pressure and temperature during the pressing process The pressing time is adjusted by the control system. After the pressing is completed, the electromagnetic heating component stops working. At this time, the hydraulic device 120 maintains the pressure during pressing and the cooling component starts to work, such as the cooling pipe in the pressing plate 154. 154c is supplied with a continuous flow of conductive liquid whose temperature is controlled between 15 ° C and 35 ° C to cool the pressed PCB board package 160. This process is adjusted by the control system. When the control system detects the PCB board package When 160 is cooled to the set temperature of 45 ° C ~ 65 ° C, the supply of conductive fluid is stopped, the hydraulic device 120 starts to gradually reduce the pressure, and the chamber PCB 130 is opened to take out the pressed PCB board package 160. Wait for subsequent processing work.

參照圖21與圖22,可以看出,傳統冷壓機和根據本發明的電磁加熱的PCB板多腔層壓機100比較,同樣測量X-Y方向(500~620mm距離)漲縮數據,本發明的電磁加熱的PCB板多腔層壓機100生產的產品,上中下層產品的變形量幾乎一致,對比傳統冷壓機有非常明顯的改善,此外,由於冷壓完成後,壓合板154的溫度直接降到工藝需要的溫度,直接可以開始下一批生產,不需要額外的冷卻時間,設備效率高,進一步提高了生產效率。 Referring to FIG. 21 and FIG. 22, it can be seen that, compared with the conventional cold press and the electromagnetically heated PCB board multi-cavity laminator 100 according to the present invention, the expansion and contraction data in the XY direction (a distance of 500 to 620 mm) is also measured. The products produced by the electromagnetically heated PCB multi-cavity laminator 100 have almost the same amount of deformation in the upper, middle and lower layers. Compared with the traditional cold press, the deformation is very obvious. In addition, the temperature of the pressing plate 154 is directly after the cold pressing is completed. The temperature can be lowered to the temperature required by the process, and the next batch of production can be started directly. No additional cooling time is required. The equipment has high efficiency and further improves production efficiency.

參照圖23與圖24,取350片板測量X-Y方向(500~620mm距離)漲縮數據進行統計,可以看出,根據本發明的電磁加熱的PCB板多腔層壓機100與傳統冷壓機相比,本發明的電磁加熱的PCB板多腔層壓機100生產的產品其漲縮數據明顯集中,比傳統冷壓機生產的產品漲縮率降低了有30~40%。 Referring to FIG. 23 and FIG. 24, taking 350 pieces of boards to measure the XY direction (500 ~ 620mm distance) expansion and contraction data for statistics, it can be seen that the electromagnetically heated PCB board multi-cavity laminator 100 and the conventional cold press according to the present invention Compared with the products produced by the electromagnetically heated PCB multi-cavity laminator 100 of the present invention, the expansion and contraction data of the products are obviously concentrated, which is 30% to 40% lower than that of the products produced by the conventional cold press.

參照圖25、圖26、圖27及圖28,可以看出,根據本發明的電磁加熱的PCB板多腔層壓機100與傳統冷壓機相比,根據本發明的電磁加熱的PCB板多腔層壓機100的所生產的單片PCB板漲縮最大變形比傳統電壓機生產的降低了40~50%。 Referring to FIG. 25, FIG. 26, FIG. 27, and FIG. 28, it can be seen that the electromagnetically heated PCB board multi-chamber laminator 100 according to the present invention has more electromagnetically heated PCB boards than the conventional cold press. The maximum deformation of the single-piece PCB board produced by the cavity laminator 100 is 40-50% lower than that of the conventional voltage machine.

盡管本發明的實施方案已公開如上,但其並不僅限於說明書和實施方式中所列運用,它完全可以被適用於各種適合本發明的領域,對於熟悉本領域的人員而言,可容易地實現另外的修改,因此在不背離權利要求及等同範圍所限定的一般概念下,本發明並不限於特定的細節和這裏示出與描述的圖例。 Although the embodiment of the present invention has been disclosed as above, it is not limited to the applications listed in the description and the embodiments, it can be applied to various fields suitable for the present invention, and can be easily implemented by those skilled in the art. Additional modifications are therefore made without departing from the general concepts defined by the claims and equivalents, and the invention is not limited to the specific details and illustrations shown and described herein.

100‧‧‧電磁加熱的PCB板多腔層壓機 100‧‧‧ Multi-cavity laminating machine for PCB with electromagnetic heating

110‧‧‧壓合室 110‧‧‧Compression Room

111‧‧‧左側板 111‧‧‧Left plate

111a‧‧‧左底座 111a‧‧‧left base

112‧‧‧右側板 112‧‧‧Right plate

112a‧‧‧右底座 112a‧‧‧right base

113‧‧‧頂板 113‧‧‧Top plate

114‧‧‧中板 114‧‧‧Medium plate

115‧‧‧觀察窗 115‧‧‧observation window

120‧‧‧液壓裝置 120‧‧‧hydraulic device

121‧‧‧液壓缸 121‧‧‧Hydraulic cylinder

130‧‧‧室門 130‧‧‧room door

131‧‧‧門套 131‧‧‧Door Cover

132‧‧‧門板 132‧‧‧Door panel

132a‧‧‧軸承 132a‧‧‧bearing

133‧‧‧驅動氣缸 133‧‧‧Drive cylinder

Claims (10)

一種電磁加熱的PCB板多腔層壓機,其中,包括:具有一定內部空間的壓合室;設置於所述壓合室內的壓合組件,該壓合組件包括至少三塊壓合板,所述壓合板兩兩相互平行,相鄰兩塊所述壓合板相距一定的距離從而形成有至少兩個壓合腔;其中,所述壓合室內設有電磁加熱組件,所述電磁加熱組件包括能夠產生交變磁場的電磁感應線圈,所述電磁感應線圈設置於加熱板內,至少一塊所述壓合板上設置有所述加熱板,所述電磁感應線圈的內部呈中空狀以形成貫通其兩端的冷卻通道。 An electromagnetically heated multi-cavity laminating machine for PCB boards, comprising: a compression chamber with a certain internal space; a compression assembly provided in the compression chamber, the compression assembly including at least three compression boards, the The pressing plates are parallel to each other, and two adjacent pressing plates are separated by a certain distance so as to form at least two pressing chambers; wherein the pressing chamber is provided with an electromagnetic heating component, and the electromagnetic heating component includes An electromagnetic induction coil of an alternating magnetic field, the electromagnetic induction coil is arranged in a heating plate, and the heating plate is provided on at least one of the pressing plates, and the inside of the electromagnetic induction coil is hollow to form a cooling through both ends thereof. aisle. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,所述壓合板與所述加熱板固定連接或一體成型。 The electromagnetically heated PCB board multi-cavity laminator according to item 1 of the scope of the patent application, wherein the pressing plate is fixedly connected to the heating plate or is integrally formed. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,所述電磁加熱組件還包括與所述電磁感應線圈電連接的電磁加熱控制器,所述電磁加熱控制器分別與所述電磁感應線圈的第一接線點和第二接線點電連接,從而構成電磁加熱回路,以致使電磁感應線圈產生變化的交變磁場。 The electromagnetic heating PCB multi-cavity laminator according to item 1 of the scope of patent application, wherein the electromagnetic heating component further includes an electromagnetic heating controller electrically connected to the electromagnetic induction coil, and the electromagnetic heating controller It is electrically connected to the first connection point and the second connection point of the electromagnetic induction coil, respectively, so as to form an electromagnetic heating circuit, so that the electromagnetic induction coil generates a changing alternating magnetic field. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,所述電磁感應線圈的一端開設有入液口,所述電磁感應線圈的另一端開設有出液口,所述冷卻通道與所述電磁感應線圈的入液口和出液口相連通;所述 電磁感應線圈的入液口和出液口外接連通有冷卻系統,所述冷卻系統、電磁感應線圈的入液口和出液口、冷卻通道構成冷卻循環回路。 According to the electromagnetically heated PCB board multi-cavity laminator according to item 1 of the patent application scope, wherein one end of the electromagnetic induction coil is provided with a liquid inlet, and the other end of the electromagnetic induction coil is provided with a liquid outlet, The cooling channel is in communication with a liquid inlet and a liquid outlet of the electromagnetic induction coil; The liquid inlet and the liquid outlet of the electromagnetic induction coil are externally connected with a cooling system. The cooling system, the liquid inlet and the liquid outlet of the electromagnetic induction coil, and a cooling channel form a cooling circulation circuit. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,所述電磁感應線圈設置呈多重“S”形折疊狀或螺旋狀。 The electromagnetically heated PCB board multi-cavity laminator according to item 1 of the scope of the patent application, wherein the electromagnetic induction coils are arranged in multiple "S" -shaped folds or spirals. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,還包括外接於所述壓合組件的液壓裝置,所述液壓裝置的驅動部為所述壓合組件提供壓合壓力;所述液壓裝置包括液壓缸和油泵,所述液壓缸的驅動端為位於最下層的所述壓合板提供壓合壓力。 The electromagnetically heated PCB multi-cavity laminator according to item 1 of the patent application scope, further comprising a hydraulic device externally connected to the pressing component, and a driving part of the hydraulic device provides the pressing component. Pressing pressure; the hydraulic device includes a hydraulic cylinder and an oil pump, and a driving end of the hydraulic cylinder provides a pressing pressure for the pressing plate located at the lowest level. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,還包括用於對所述壓合室進行冷卻的冷卻組件,所述冷卻組件為風冷組件,其包括:與所述壓合室構成回路的循環風路管;在所述循環風路管的空氣流動方向上依次設置的主電磁閥、變頻風機單元和冷卻單元;所述變頻風機單元包括第一變頻風機和第二變頻風機,所述循環風路管的出風口處設有第一變頻風機,所述第一變頻風機的出風口處設有第一補充風口,所述第一補充風口上設有第一電磁閥,所述主電磁閥與第二變頻風機之間設有第二補充風口,所述第二補充風口上設有第二電磁閥;其中,所述循環風路管的出風口設於壓合室的頂部,循環風路管的進風口設於壓合室的底部。 The electromagnetically heated PCB multi-cavity laminator according to item 1 of the scope of patent application, further comprising a cooling component for cooling the pressing chamber, wherein the cooling component is an air-cooled component and includes : A circulating air duct forming a circuit with the compression chamber; a main solenoid valve, a frequency conversion fan unit, and a cooling unit arranged in order in the air flow direction of the circulation air duct; the frequency conversion fan unit includes a first frequency conversion A fan and a second frequency conversion fan, a first frequency conversion fan is provided at an air outlet of the circulating air duct, a first supplementary air outlet is provided at an air outlet of the first frequency conversion fan, and the first supplementary air outlet is provided at A first solenoid valve, a second supplementary air outlet is provided between the main solenoid valve and a second frequency conversion fan, and a second solenoid valve is provided on the second supplementary air outlet; wherein the air outlet of the circulating air duct is provided At the top of the compression chamber, the air inlet of the circulating air duct is arranged at the bottom of the compression chamber. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,所述壓合室內還設置有至少兩根導柱,所述壓合板均可沿所述導柱上下滑 動;所述導柱的內部設置呈中空結構,所述導柱的一端開設有抽氣口,所述抽氣口外接有抽氣裝置,所述導柱的外壁開設有與導柱內部相聯通的通氣孔。 According to the electromagnetically heated PCB board multi-cavity laminator according to item 1 of the scope of patent application, wherein the pressing chamber is further provided with at least two guide posts, and the pressing board can slide down along the guide posts. The inside of the guide post is a hollow structure. One end of the guide post is provided with an air suction port, and the air suction port is externally connected with an air suction device. Stomata. 如申請專利範圍第1項所述之電磁加熱的PCB板多腔層壓機,其中,所述壓合室設有至少一扇室門,所述室門包括:門板、及設於所述門板兩側的門套,所述門套與通往所述壓合室的門框相固接,所述門板嵌套在兩個所述門套之間且可沿所述門套上下滑動以實現所述壓合室的啟閉。 The electromagnetically heated PCB board multi-cavity laminator according to item 1 of the scope of patent application, wherein the pressing chamber is provided with at least one chamber door, and the chamber door includes a door panel and the door panel. Door covers on both sides, the door covers are fixedly connected to the door frame leading to the compression chamber, the door panel is nested between the two door covers and can slide up and down along the door covers to achieve all The opening and closing of the pressing room is described. 如申請專利範圍第9項所述之電磁加熱的PCB板多腔層壓機,其中,所述門套包括門套主體、及形成於所述門套主體中的U形槽部,所述U形槽部沿所述門套主體的高度方向延伸;所述門板的兩側均設有至少一個軸承,所述軸承與所述U形槽部相卡接;所述U形槽部設置有兩個端部,分別為靠近所述壓合室門框的內側端部與遠離所述壓合室門框的外側端部,所述外側端部的寬度大於所述內側端部的寬度。 The electromagnetically heated PCB board multi-cavity laminator according to item 9 of the scope of patent application, wherein the door cover includes a door cover body and a U-shaped groove portion formed in the door cover body, and the U The groove portion extends along the height direction of the door cover body; at least one bearing is provided on both sides of the door panel, and the bearing is engaged with the U-shaped groove portion; the U-shaped groove portion is provided with two The end portions are respectively an inner end portion close to the compression chamber door frame and an outer end portion remote from the compression chamber door frame, and the width of the outer end portion is greater than the width of the inner end portion.
TW105123693A 2016-06-03 2016-07-27 Multiple chamber laminating machine of the printed circuit board of the electromagnetic heating TWI614138B (en)

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016119703A1 (en) * 2016-10-17 2018-04-19 Kraussmaffei Technologies Gmbh Method and device for producing molded parts with a semi-finished product
CN107396551B (en) * 2017-07-28 2019-04-30 贵州鑫阳科技股份有限公司 Equipment for controlling slab processing
TWI690417B (en) * 2018-07-31 2020-04-11 國立虎尾科技大學 Manufacturing equipment and manufacturing method of flexible electrode plate
CN108891116A (en) * 2018-08-14 2018-11-27 活跃科技股份有限公司 Gas-liquid cold type trigger squeeze and cooling means for it
CN109514838A (en) * 2019-01-22 2019-03-26 吉林省吉刚新材料科技开发有限公司 A kind of combined type heat forming press
TWI707774B (en) * 2019-05-29 2020-10-21 活全機器股份有限公司 Even temperature pressing equipment
CN110708898B (en) * 2019-11-22 2020-07-17 深圳市兆兴博拓科技股份有限公司 PCB insulation lamination laying processing machine and method
CN112693205B (en) * 2020-12-16 2023-12-29 黎平县雄达木业有限公司 Polyurethane fiber board multilayer hot press and polyurethane fiber board production process
CN113490338B (en) * 2021-07-21 2022-06-14 特创技盟电子(苏州)股份有限公司 New energy automobile sampling subassembly FPC circuit board compression fittings and production line thereof
CN113382567B (en) * 2021-08-13 2021-10-29 江油星联电子科技有限公司 Laminating device for processing printed circuit board
CN113715467B (en) * 2021-09-10 2023-06-16 深圳市晨亿达电子有限公司 Batch pressing device for circuit boards
CN114987031B (en) * 2022-05-23 2023-12-19 广东骏亚电子科技股份有限公司 Multilayer lamination manufacturing method
CN114828319B (en) * 2022-06-29 2022-10-21 秦皇岛晟成自动化设备有限公司 Electromagnetic induction heating device and laminating machine with same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW542781B (en) * 2000-08-11 2003-07-21 Meiki Seisakusho Kk Hot pressing apparatus
TWI225823B (en) * 1998-08-11 2005-01-01 Nikko Materials Usa Inc Resin/copper/metal laminate and method of producing same
CN102625585A (en) * 2012-04-19 2012-08-01 苏州市嘉明机械制造有限公司 Novel controllable inlet air temperature cold press
CN103889154A (en) * 2014-04-03 2014-06-25 苏州市嘉明机械制造有限公司 Cooling and heating integrated copper foil conductive pressing machine

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205667027U (en) * 2016-06-03 2016-10-26 苏州市嘉明机械制造有限公司 Electromagnetic heating's PCB board multicavity laminator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI225823B (en) * 1998-08-11 2005-01-01 Nikko Materials Usa Inc Resin/copper/metal laminate and method of producing same
TW542781B (en) * 2000-08-11 2003-07-21 Meiki Seisakusho Kk Hot pressing apparatus
CN102625585A (en) * 2012-04-19 2012-08-01 苏州市嘉明机械制造有限公司 Novel controllable inlet air temperature cold press
CN103889154A (en) * 2014-04-03 2014-06-25 苏州市嘉明机械制造有限公司 Cooling and heating integrated copper foil conductive pressing machine

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