TWI612162B - Coating Equipment - Google Patents

Abstract

A coating apparatus includes a magnetic device and a magnetoresistive device. The magnetic device includes a plurality of magnetic elements. The magnetic elements form at least a first magnetic region and at least a second magnetic region, and the magnetic force of the first magnetic region is smaller than the magnetic force of the second magnetic region. The magnetoresistive device is located between the magnetic device and the object to be plated. The magnetoresistive device includes at least one first magnetoresistive portion and at least one second magnetoresistive portion. The first magnetoresistive portion corresponds to the first magnetic region, and the second magnetoresistive portion corresponds to the second magnetic region. The magnetoresistance capability of the first magnetic group portion is smaller than the magnetoresistance capability of the second magnetoresistive portion.

Description

Coating equipment

This invention relates to coating techniques, and more particularly to a coating apparatus.

With the rapid development of multimedia technology and information, the development of displays that can be used to display information and serve as a human-machine interface is particularly important. In recent years, environmental awareness has gradually risen. Among many displays, organic light-emitting diode (OLED) displays have received much attention due to their self-luminous characteristics without the need to provide additional backlight characteristics. In addition, the organic light-emitting diode display has the advantages of wide viewing angle, high contrast, simple process, low operating voltage, high reaction rate and full color, and has broad application prospects. Therefore, the organic light emitting diode display is expected to become the mainstream of the display.

In general, the light-emitting structure of an organic light-emitting diode display is composed of a plurality of organic material layers interposed between a pair of electrodes of an anode and a cathode. The illuminating mechanism of the organic light-emitting diode display is that when a voltage is applied to the electrode, the hole and the electron are respectively flowed out from the anode and the cathode and injected into the organic material layer, and the energy recombined by the hole and the electron is used to excite the organic light. The molecules of the material emit photons and emit light.

Conventional organic light-emitting diode displays may use an evaporation method to plate an organic material on a substrate to form a desired layer film, and each pixel in the organic light-emitting diode display is opened by an opening of the mask used. definition. Therefore, the closeness of the mask to the substrate affects the accuracy of each pixel position, and may even cause uneven brightness or color mixing after the subsequent products. In order to make the mask plate fit tightly to the substrate, in the conventional method, a magnetic device is disposed above the substrate to penetrate the magnetic force of the magnetic device to attract the mask plate under the substrate, so that the mask can be attached to the mask. Substrate.

In conventional coating equipment, the configuration of the magnetic components of the magnetic device has been fixed and cannot be changed at will. However, the magnetic field generated by such magnetic elements is not a uniform magnetic field. Even if it is desired to change the adsorption strength of the magnetic device to the mask, the adsorption strength of the magnetic device to the mask can only be changed by adjusting the relative distance between the magnetic device and the mask in the vertical direction. In addition, the inventor found in the coating process that even if the magnetic device is visible to the naked eye, the mask is tightly adsorbed under the substrate, but the mask itself is not completely completely adhered to due to the bending caused by the gravity of the substrate itself. The substrate, and the mask actually has a gap between some parts and the substrate, so that the width and/or length of some of the film blocks subsequently plated on the substrate may not be due to the magnetic force received. Uniform and deviate from the expected value.

In view of this, an embodiment of the present invention provides a coating apparatus. In an embodiment, a coating apparatus includes a magnetic device and a magnetoresistive device. The magnetic device includes a plurality of magnetic elements. The magnetic elements form at least a first magnetic region and at least a second magnetic region, and the magnetic force of the first magnetic region is smaller than the magnetic force of the second magnetic region. The magnetoresistive device includes at least one first magnetoresistive portion and at least one second magnetoresistive portion. The first magnetoresistive portion corresponds to the first magnetic region, and the second magnetoresistive portion corresponds to the second magnetic region. The magnetoresistance capability of the first magnetoresistive portion is smaller than the magnetoresistive capability of the second magnetoresistive portion.

In summary, the coating apparatus according to an embodiment of the present invention passes the magnetic resistance portions having different magnetoresistance capabilities to homogenize the magnetic distribution of the magnetic device to the mask, so that the mask can be more conformed to be plated. And improve the quality of the coating.

The detailed features and advantages of the present invention are described in detail in the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art.

1 is a schematic diagram of an embodiment of a coating apparatus. Referring to FIG. 1 , the coating apparatus 100 is used for coating a plating object 200 . The coating apparatus 100 includes a magnetic device 110 and a magnetoresistive device 120. The magnetoresistive device 120 is disposed relative to the magnetic device 110 and below the magnetic device 110. When the object to be plated 200 enters the coating apparatus 100, the object to be plated 200 can be sent to the lower side of the magnetoresistive device 120, in other words, the magnetoresistive device 120 is located between the magnetic device 110 and the object to be plated 200. In addition, the coating apparatus 100 further includes a mask 130 and a coating material source 140. The mask 130 is disposed corresponding to the magnetic device 110 and is located below the magnetoresistive device 120. The coating material source 140 is disposed corresponding to the magnetic device 110 and is located below the mask plate 130. When the object to be plated 200 is introduced into the coating apparatus 100, the mask 130 may be located between the object to be plated 200 and the source of the coating material 140.

2 is a schematic diagram of a first embodiment of the magnetic device of FIG. 1, FIG. 3 is a schematic diagram of a second embodiment of the magnetic device of FIG. 1, and FIG. 4 is a partial perspective view of the magnetic device of FIG. Referring to FIGS. 1 through 4, the magnetic device 110 can be used to attract the mask 130 such that the mask 130 can be attached to the object to be plated 200 located above it by the magnetic attraction of the magnetic device 110.

Magnetic device 110 includes a plurality of magnetic elements 111. The magnetic elements 111 can be configured according to a preset configuration layout and form at least a first magnetic region and at least a second magnetic region. Here, the magnetic strength of the first magnetic region is smaller than the magnetic strength of the second magnetic region.

In an embodiment, the first magnetic region and the second magnetic region may be regions of different magnetic force generated by the magnetic component 111 due to the configuration layout. However, the present invention is not limited thereto. In another embodiment, the first magnetic region and the second magnetic region may be formed by the magnetic component 111 and the object to be plated 200 and/or the mask 130. Different magnetic size areas.

In an embodiment, the magnetic device 110 can be a magnetic plate in the form of a flat plate. Therefore, in some embodiments, the magnetic device 110 further includes a plate body 112, and the magnetic elements 111 can be embedded in the plate body 112.

Each of the magnetic elements 111 may be a rectangular magnetic block and has two opposite first sides 111a and two opposite second sides 111b. In some embodiments, the length of the first side 111a of each of the magnetic elements 111 is different from the length of the second side 111b thereof. For example, the magnetic element 111 may be a strip-shaped magnetic block. However, the present invention is not limited thereto. In other embodiments, the length of the first side 111a of each magnetic element 111 may be the same as the length of the second side 111b thereof. For example, the magnetic element 111 may be a square magnetic block.

Hereinafter, the strip-shaped magnetic element 111 is taken as an example, and the longer side of the magnetic element 111 is the first side 111a, and the shorter side is the second side 111b. However, the present invention does not To be limited, in another embodiment, the shorter side of the magnetic element 111 may be the first side 111a and the longer side being the second side 111b.

In an embodiment, the magnetic elements 111 may be arranged in an array and form a plurality of first junctions and a plurality of second junctions. Here, the extending direction of the first boundary is different from the extending direction of the second boundary. For example, as shown in FIG. 2, each of the first junctions may extend along the first direction D1, and each of the second junctions extends along the second direction D2, and the second direction D2 is orthogonal to the first direction D1. Alternatively, as shown in FIG. 3, each of the first junctions may also extend along the second direction D2, and each of the second junctions extends along the first direction D1.

In one embodiment, the first side 111a of each magnetic element 111 is parallel to the first side 111a of the adjacent magnetic element 111, and the second side 111b of each magnetic element 111 is parallel to the adjacent magnetic element 111. The second side 111b. In other words, the arrangement alignment of the magnetic elements 111 can be identical to each other.

In an embodiment, the length of each of the first junctions formed by the magnetic elements 111 may be greater than the length of each of the second junctions. In other words, at this time, each first boundary is located at the first side 111a of any two adjacent magnetic elements 111, and each second boundary is located at the second side 111b of any two adjacent magnetic elements 111.

In an embodiment, the magnetic elements 111 are arranged in close proximity to one another. At this time, each of the first junctions may be formed by the first side 111a of any two adjacent magnetic elements 111, and each of the second interfaces is formed by the second side 111b of any two adjacent magnetic elements 111.

In one embodiment, the plate body 112 is rectangular in shape and has two opposing first side edges 112a and two opposite second side edges 112b. In some embodiments, as shown in FIG. 2, each of the magnetic elements 111 may have its first side 111a parallel to the first side 112a of the plate body 112 and its second side 111b parallel to the second side of the plate body 112. The alignment of the side 112b is disposed on the plate body 112, and the first side 112a is smaller than the second side 112b. In other embodiments, as shown in FIG. 3, each of the magnetic elements 111 may have its first side 111a parallel to the second side 112b of the board 112, and its second side 111b parallel to the board 112. The alignment of one side 112a is disposed on the plate body 112, and the first side 112a is larger than the second side 112b.

Each of the magnetic elements 111 has a first magnetic pole N and a second magnetic pole S that are different in magnetic properties. In one embodiment, the first magnetic pole N and the second magnetic pole S of each magnetic element 111 are disposed opposite each other in a third direction D3 perpendicular to the first direction D1 and the second direction D2, as shown in FIG.

In one embodiment, each of the magnetic elements 111 is with its first magnetic pole N and the second magnetic pole S of the adjacent magnetic element 111, and each magnetic element 111 is its second magnetic pole S and an adjacent magnetic element. The first magnetic poles N of 111 are opposed to each other. In other words, the first magnetic pole N of each magnetic element 111 can be surrounded by the adjacent magnetic element 111 with its second magnetic pole S, and the second magnetic pole S of each magnetic element 111 can be adjacent to the magnetic element 111 by its first magnetic pole N enveloping, as shown in Figures 2 to 4, but the invention is not limited thereto.

5 is a schematic diagram of a first embodiment of the magnetoresistive device of FIG. 1, FIG. 6 is a schematic diagram of a second embodiment of the magnetoresistive device of FIG. 1, and FIG. 7 is a third embodiment of the magnetoresistive device of FIG. FIG. 8 is a schematic diagram of a fourth embodiment of the magnetoresistive device of FIG. 1, FIG. 9 is a schematic diagram of a fifth embodiment of the magnetoresistive device of FIG. 1, and FIG. 10 is a schematic diagram of the magnetoresistive device of FIG. A schematic diagram of a sixth embodiment. Referring to FIG. 1 to FIG. 10, the magnetoresistive device 120 includes at least one first magnetoresistive portion 121 corresponding to at least one first magnetic region (not labeled) and a second portion corresponding to at least one second magnetic region (not labeled). Magnetoresistive portion 122. Here, the magnetoresistance capability of the first magnetoresistive portion 121 (that is, the ability to reduce the magnetic force) is smaller than the magnetoresistive capability of the second magnetoresistive portion 122.

In one embodiment, the number of the first magnetoresistive portions 121 may be one or more, and the number of the second magnetoresistive portions 122 may also be one or more.

In an embodiment, the first magnetoresistive portion 121 and the second magnetoresistive portion 122 may be arranged in a staggered arrangement due to a distribution corresponding to the first magnetic region and the second magnetic region. For example, as shown in FIG. 4 and FIG. 5, the first magnetoresistive portion 121 may be a block that extends in the first direction D1 and is sequentially arranged in the second direction D2, and is first adjacent to each other. At least one second magnetic resistance portion 122 is interposed between the magnetic resistance portions 121. Alternatively, as shown in FIG. 7, the first magnetoresistive portion 121 may be a block extending in the second direction D2 and sequentially arranged in the first direction D1, and any two adjacent first magnetoresistive portions 121 At least one second magnetic resistance portion 122 is sandwiched therebetween. Alternatively, as shown in FIG. 8 , the first magnetoresistive portions 121 may be interspersed cells, and the first magnetoresistive portions 121 are separated from each other by at least one second magnetoresistive portion 122 .

In an embodiment, as shown in FIG. 9 and FIG. 10, the first magnetoresistive portion 121 and the second magnetoresistive portion 122 may form a first magnetoresistive portion due to a distribution corresponding to the first magnetic region and the second magnetic region. 121 is disposed at a periphery of the second magnetoresistive portion 122. However, the present invention is not limited thereto. In another embodiment, the first magnetoresistive portion 121 and the second magnetoresistive portion 122 may also form a second magnetoresistance due to a distribution corresponding to the first magnetic region and the second magnetic region. The portion 122 is located at the periphery of the first magnetoresistive portion 121.

In an embodiment, when the first magnetic region of the magnetic device 110 is located at the first boundary formed by the magnetic component 111, each of the first magnetoresistive portions 121 of the magnetoresistive device 120 may respectively correspond to the first interface. Set parallel to each other.

The magnetoresistive device 120 further includes a body 123, and the first magnetoresistive portion 121 and the second magnetoresistive portion 122 are a partial block of the body 123 and/or a component disposed on the body 123. In some embodiments, the body 123 can be in the form of a flat plate.

Figure 11 is a cross-sectional view of the embodiment taken along line AA' of Figure 5, Figure 12 is a cross-sectional view of another embodiment taken along line AA' of Figure 5, and Figure 13 is taken along line BB' of Figure 9. A cross-sectional view of one embodiment of a section line, and FIG. 14 is a cross-sectional view of another embodiment of the section taken along line BB' of FIG. Referring to FIG. 1 to FIG. 14 , in an embodiment, the first magnetoresistive portion 121 may have at least one through hole 121H, and the second magnetoresistive portion 122 does not have any through holes 121H. In other words, a portion of the body 123 having the through hole 121H may be the first magnetoresistive portion 121, and the remaining portion of the body 123 may be the second magnetoresistive portion 122.

In an embodiment, when the first magnetic region of the magnetic device 110 is located at the first boundary formed by the magnetic element 111, each of the through holes 121H may be disposed parallel to each other corresponding to the first boundary, as shown in FIG. Figure 7 and Figure 8. In another embodiment, when the first magnetic region of the magnetic device 110 is at the periphery of the magnetic device 110, such as the outermost ring portion of the array formed by the magnetic elements 111 or the outer portion of the plate 112 When the through holes 121H are correspondingly disposed on the outer ring portion of the body 123, as shown in FIG.

In some embodiments, the orthographic projection of each of the first junctions formed by the magnetic elements 111 at the first magnetoresistive portion 121 may be substantially at the center of the corresponding through hole 121H. For example, when each first boundary is formed by the first side 111a of any two adjacent magnetic elements 111, the first side 111a of each magnetic element 111 is substantially corresponding to the orthographic projection of the first magnetoresistive portion 121. The center of the through hole 121H.

In some embodiments, as shown in FIG. 11 and FIG. 13 , the through holes 121H are penetrating through opposite sides of the body 123 such that the magnetic force of the first magnetic region passes through the first magnetoresistive portion 121. The hole 121H is not subjected to attenuation, but the present invention is not limited thereto. In other embodiments, as shown in FIG. 12 and FIG. 14, the through hole 121H may be only a recess provided in the body 123 and not penetrated. The body 123 is such that the magnetic force emitted by the first magnetic region is only slightly attenuated as it passes through the first magnetoresistive portion 121.

In some embodiments, the opening pattern of the through hole 121H may be a rectangle, but the invention is not limited thereto. In other embodiments, the opening pattern of the through hole 121H may also be a circular, elliptical, hexagonal, or the like pattern. In addition, the size of the opening of the through hole 121H can be adjusted according to the reluctance capability required of each of the first magnetoresistive portions 121.

In an embodiment, the width W1 of the through hole 121H (or the diameter when the through hole 121H is circular) may be 0.2 times to 0.25 of the width W2 of the magnetic element 111 (ie, the second side 111b of the magnetic element 111). Between times. Further, the center distance I1 of any two adjacent through holes 121H may be substantially equal to the width W2 of the magnetic element 111.

In an embodiment, the through hole 121H may be disposed corresponding to the first boundary and extend along the extending direction of the first boundary. In some embodiments, the length L1 of the through hole 121H is substantially less than or equal to the total length L2 of the array in which the magnetic elements 111 are arranged.

Figure 15 is a cross-sectional view of the embodiment taken along line CC' of Figure 6, and Figure 16 is a cross-sectional view of the embodiment of Figure 10 taken along line DD'. Referring to FIG. 1 to FIG. 16 , in an embodiment, the thickness H1 of the first magnetoresistive portion 121 is smaller than the thickness H2 of the second magnetoresistive portion 122 such that the magnetic force emitted by the first magnetic region of the magnetic device 110 passes through the first The amount of attenuation received by the magnetoresistive portion 121 is lower than the amount of attenuation that the magnetic force emitted from the second magnetic region passes when passing through the second magnetoresistive portion 122.

In some embodiments, the thickness H1 of each of the first magnetoresistive portions 121 and the thickness H2 of each of the second magnetoresistive portions 122 may be adjusted according to individual required magnetoresistance capabilities. In other words, the thickness H1 of each of the first magnetoresistive portions 121 may be different from each other, and the thickness H2 of each of the second magnetoresistive portions 122 may be different from each other.

In some embodiments, the thickness of the first magnetoresistive portion 121 of the magnetoresistive device 120 and the thickness of the second magnetoresistive portion 122 are between 15 millimeters (mm) and 50 millimeters.

In some embodiments, the magnetic resistance device 120 is made of a material having a high magnetic permeability that can shield the magnetic force, for example, soft iron, neodymium steel, permalloy, and the like.

Figure 17 is a flow chart of one embodiment of a coating process. Referring to FIG. 1 to FIG. 17, the coating method includes transferring the object to be plated 200 to the lower side of the magnetic device 110 (step S10), adjusting the corresponding position between the mask plate 130 and the object to be plated 200 (step S20), and adjusting the magnetic resistance. The device 120 (step S30), and the coating material source 140 is started (step S40) to start coating the object to be plated 200.

In an embodiment, the coating apparatus 100 further includes a substrate carrier 150 to be plated. The object to be plated 150 is used to carry the object to be plated 200 and can drive the object to be plated 200 to move. Therefore, in step S10, the coating apparatus 100 can transfer the object to be plated 200 below the magnetic device 110 by controlling the movement of the object to be plated carrier 150.

In an embodiment, the coating apparatus 100 may further include a mask carrier 160. The mask carrier 160 is used to carry the mask 130 and can move the mask 130 to move. Therefore, in step S20, the coating apparatus 100 can transfer the mask 130 to the underside of the object to be plated 200 by the mask carrier 16, and adjust the corresponding position of the mask 130 to the object to be plated 200 for pre-preparation. The operation of the alignment.

In an embodiment, the coating device 100 further includes a regulating device 170 , and the regulating device 170 is coupled to the magnetoresistive device 120 . The regulating device 170 is used to move and/or rotate the magnetoresistive device 120. For example, the magnetoresistive device 120 is allowed to perform linear movement and/or rotation of the position on a horizontal plane.

Therefore, in an embodiment of step S30, the coating apparatus 100 can move the magnetoresistive device 120 below the magnetic device 110 by the regulation of the regulating device 170, and cause the first magnetoresistance of the controlled magnetoresistive device 120. The portion 121 may correspond to the first magnetic region of the magnetic device 110, and the second magnetoresistive portion 122 of the magnetoresistive device 120 may correspond to the second magnetic region of the magnetic device 110 to homogenize the magnetic device 110 for the mask 130 The magnetic distribution.

In an embodiment of step S30, the regulating device 170 can finely adjust the position of the magnetoresistive device 120 according to the result of the previous coating, such as by moving and/or rotating the magnetoresistive device 120 relative to the position of the magnetic device 100. The magnetic force received by the mask 130 can be more uniform.

In an embodiment, the coating device 100 can further include the lifting device 180 , and the lifting device 180 is coupled to the magnetic device 110 . The lifting device 180 is used to adjust the relative distance between the magnetic device 110 and the object to be plated 200. Therefore, in an embodiment of the step S30, the coating device 100 can change the magnetic force received by each block of the mask plate 130 by adjusting the reluctance device 120 by the regulating device 170, and can also be used by the lifting device 180. The lifting adjustment of the magnetic device 110 is performed to change the magnetic force received by the entire mask 130. For example, the lifting device 180 can raise the magnetic force received by the mask 130 by lowering the position of the magnetic device 110, and then the mask 130 is evenly adjusted by the adjusting device 170 for the reluctance device 120. The magnetic force is such that the mask 130 can be closely attached to the object to be plated 200.

In summary, the coating device of the embodiment of the present invention passes the magnetic resistance portion having different magnetoresistance capabilities to uniformize the magnetic force distribution of the magnetic device to the mask plate, so that the mask plate can be more closely attached to the object to be plated. Thereby improving the coating quality.

Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

100 ‧‧‧ Coating equipment
110‧‧‧magnetic device
111‧‧‧ magnetic components
111a‧‧‧ first side
111b‧‧‧ second side
112‧‧‧ board
112a‧‧‧ first side
112b‧‧‧Second side
120‧‧‧Magnetoresistive device
121‧‧‧First Magnetoresistance
121H‧‧‧through hole
122‧‧‧Second magnetic reluctance
123‧‧‧Ontology
130‧‧ ‧ mask
140‧‧‧Source of coating material
150‧‧‧Board-bearing carrier
160‧‧‧mask carrier
170‧‧‧Control device
180‧‧‧ lifting device
200‧‧ ‧ to be plated
D1‧‧‧ first direction
D2‧‧‧ second direction
H1‧‧‧ thickness
H2‧‧‧ thickness
I1‧‧‧ distance
L1‧‧‧ length
L2‧‧‧ total length
W1‧‧‧Width
W2‧‧‧Width
N‧‧‧first magnetic pole
S‧‧‧second magnetic pole
D3‧‧‧ third direction
S10-S40‧‧‧Steps

1 is a schematic diagram of an embodiment of a coating apparatus. 2 is a schematic diagram of a first embodiment of the magnetic device of FIG. 1. 3 is a schematic diagram of a second embodiment of the magnetic device of FIG. 1. Figure 4 is a partial perspective view of the magnetic device of Figure 2. FIG. 5 is a schematic diagram of a first embodiment of the magnetoresistive device of FIG. 1. FIG. FIG. 6 is a schematic diagram of a second embodiment of the magnetoresistive device of FIG. 1. FIG. FIG. 7 is a schematic diagram of a third embodiment of the magnetoresistive device of FIG. 1. FIG. FIG. 8 is a schematic diagram of a fourth embodiment of the magnetoresistive device of FIG. 1. FIG. Figure 9 is a schematic diagram showing the fifth embodiment of the magnetoresistive device of Figure 1. Figure 10 is a schematic diagram showing the sixth embodiment of the magnetoresistive device of Figure 1. Figure 11 is a cross-sectional view of the embodiment of Figure 5 taken along line AA'. Figure 12 is a cross-sectional view showing another embodiment of the line taken along line AA' of Figure 5. Figure 13 is a cross-sectional view of the embodiment of Figure 9 taken along line BB'. Figure 14 is a cross-sectional view showing another embodiment of the line taken along line BB' in Figure 9. Figure 15 is a cross-sectional view of the embodiment of Figure 6 taken along line CC'. Figure 16 is a cross-sectional view of the embodiment of Figure 10 taken along line DD'. Figure 17 is a flow chart of one embodiment of a coating process.

100‧‧‧ Coating equipment

110‧‧‧magnetic device

120‧‧‧Magnetoresistive device

130‧‧ ‧ mask

140‧‧‧Source of coating material

150‧‧‧Board-bearing carrier

160‧‧‧mask carrier

170‧‧‧Control device

180‧‧‧ lifting device

200‧‧ ‧ to be plated

Claims (11)

A coating device comprising: a magnetic device comprising a plurality of magnetic elements, the magnetic elements forming at least a first magnetic region and at least a second magnetic region, wherein a magnetic force of the first magnetic region is smaller than a magnetic force of the second magnetic region And a magnetoresistive device between the magnetic device and a material to be plated, the magnetoresistive device comprising at least a first magnetoresistive portion and at least one second magnetoresistive portion, wherein the at least one first magnetoresistive portion corresponds to The at least one first magnetic region corresponds to the at least one second magnetic region, wherein a magnetic resistance of the first magnetic resistance portion is smaller than a magnetic resistance of the second magnetic resistance portion. The coating device of claim 1, wherein the number of the at least one first magnetoresistive portion is plural, and each of the first magnetoresistive portions has at least one through hole. The coating apparatus according to claim 2, wherein each of the through holes has a width of 0.2 to 0.25 times a width of each of the magnetic elements. The coating apparatus of claim 2, wherein the magnetic elements are arranged in an array to form a plurality of first interfaces and a plurality of second interfaces, wherein the first boundaries extend in a different direction from the second In the extending direction of the junction, the through holes respectively correspond to the first interfaces, and the through holes are arranged in parallel with each other. The coating apparatus of claim 4, wherein a length of each of the first junctions is greater than a length of each of the second junctions. The coating device of claim 1, wherein the number of the at least one first magnetoresistive portion is plural, and the thickness of each of the first magnetoresistive portions is smaller than the thickness of the at least one second magnetoresistive portion. The coating apparatus of claim 1, wherein the magnetic elements are arranged in an array to form a plurality of first interfaces and a plurality of second interfaces, wherein the first boundaries extend in a different direction from the second In the extending direction of the interface, the number of the at least one first magnetoresistive portion is plural, and the first magnetoresistive portions respectively correspond to the first interfaces, and the first magnetoresistive portions are disposed in parallel with each other. The coating apparatus of claim 7, wherein the length of each of the first junctions is greater than the length of each of the second junctions. The coating device of claim 1, wherein the at least one first magnetoresistive portion and the at least one second magnetoresistive portion are plural, the first magnetoresistive portion and the second magnetoresistive portions. The lines are staggered. The coating apparatus of claim 1, wherein the at least one first magnetoresistive portion is on a periphery of the at least one second magnetoresistive portion. The coating device of claim 1, further comprising: a source of coating material under the magnetic device and the magnetoresistive device; a mask plate between the source of the coating material and the magnetoresistive device; and a regulating device The magnetoresistive device is moved or/and rotated, wherein the material of the magnetoresistive device is selected from the group consisting of soft iron, neodymium steel and permalloy.