TWI611138B - Positioning structure for led substrate and heat dissipation device of lamp - Google Patents

Abstract

The invention relates to a positioning structure of an LED substrate and a heat dissipating device of a lamp, which mainly comprises a groove portion formed integrally with a connecting end face of the assembly platform of the heat dissipating device and the positioning portion, so that the LED substrate is assembled The LED substrate is provided with an LED, and the LED substrate is abutted on the assembled end surface, and the LED substrate is closely abutted with the positioning portion; thereby, the LED substrate and the heat dissipating device can be connected to the platform. The assembly end face and the positioning portion are closely attached to each other, so that the assembled position of the LED substrate does not cause deviation from the original light distribution design, and the situation that does not affect the lighting effect is relatively generated to obtain optimal illumination. The effect is more practical and useful in its overall implementation.

Description

Positioning structure of LED substrate and heat sink of lamp

The invention relates to a positioning structure of an LED substrate and a heat dissipating device of a lamp, in particular to a positioning end face of the assembly platform of the LED substrate and the heat dissipating device and the positioning portion are closely abutted and combined to position the LED substrate. The set position does not cause deviations from the original light distribution design, and the relative effect is not affected, so as to obtain the best lighting effect, and the utility model is more effective in its overall application.

According to the light-emitting diode (LED), since it only needs to consume a very small amount of electric energy in use, it can emit light for illumination, and the power consumed by the light-emitting diode is relatively small, which can effectively reduce the electric energy. The cost and power saving effect make it widely accepted by all walks of life. Therefore, the industry has been working on the development and improvement of the LED, and using the LED as a lighting fixture for various purposes. It can reduce the waste of energy, and it can also save consumers the expense of electricity.

For details, please refer to Bulletin No. M435393 "Structure of Aperture Lamp", M524278 "Vehicle Lighting", M539600 "Lighting Device and Light Source Module", etc., all of which are LEDs [LED] As the illumination source, the general LED is used in the structural design, please refer to the schematic diagram of the existing combination structure shown in the eighth figure. The LED lamp (5) is used to solder the LED (51) to the circuit substrate (52). And the LED (51) generates a high heat during the use of the illuminating illumination, so that a heat dissipating device (53) is also connected to the back surface of the circuit substrate (52), and the heat dissipating device (53) is disposed on the heat dissipating device (53). Forming a platform (531) for setting the circuit substrate (52) group to dissipate heat generated by the LED (51) by using the heat sink (53) to prevent the LED (51) from having Overheating damage occurs.

However, although the above-mentioned LED lamps can utilize the heat dissipating device to achieve the heat dissipation of the heat generated by the LED lighting, and prevent the LED from overheating, affecting the expected effect of the service life, but also found in the actual operation and implementation thereof, the heat dissipating device Due to the mold release design problem of the assembly platform, the joint between the bottom end surface and the side end surface of the assembly platform cannot be in a right angle state, and there will be a concave arc angle (R) (please refer to it again) In the eighth embodiment of the prior art structure, the circuit substrate is attached to the bottom end surface of the assembly platform, and the side end surface of the circuit substrate is subjected to the concave arc angle (R). The obstacle can not be closely attached to the side end surface of the assembled platform, and the optical illumination position and angle of the LED lamp are designed through prior precise light distribution calculation, and some LED lighting fixtures are matched with optical lenses, and if used for the lamp Even the mirror and the optical lens need to be matched for illumination, but the circuit substrate is assembled. If the position is deviated, it will cause the brightness and angle of the light emitted by the LED to deviate from the original design. It is difficult to produce the original preset light distribution effect with the matching mirror or optical lens, resulting in the best result. The lighting effect or the light of the vehicle is projected. Therefore, it is often necessary to form the assembly platform (531) formed on the heat sink (53) before the circuit board (52) is assembled with the heat sink (53). Milling and cutting to eliminate the concave arc angle (R) to make it a right angle, so that time waste and increase in manufacturing cost, so that there is still room for improvement in the overall structural design.

In view of this, the inventor has been in the process of many years of rich experience in design and development of the relevant industries, and has researched and improved the existing structure and defects, and provided a positioning structure of the LED substrate and the heat sink of the lamp, in order to achieve more. The purpose of good practical value.

The main purpose of the present invention is to provide a positioning structure of an LED substrate and a heat dissipating device of a lamp, which mainly enables the assembly end face of the assembly substrate of the LED substrate and the heat dissipating device to be closely attached to the positioning portion, so that the LED substrate is The set position does not cause deviations from the original light distribution design, and the relative effect is not affected, so as to obtain the best lighting effect, and the utility model is more effective in its overall application.

The main purpose and effect of the positioning structure of the LED substrate and the heat dissipating device of the lamp of the invention are achieved by the following specific technical means: The heat sink is mainly provided with a heat sink and an LED substrate. The heat sink is provided with a stacking platform. The assembly platform is formed with an assembly end surface, and a positioning portion is formed on the assembly end surface corresponding to the assembly platform. a groove portion is integrally formed at the junction of the connecting end surface and the positioning portion; the LED substrate is disposed on the assembly platform corresponding to the heat dissipation device, and the LED substrate is provided with an LED, and the LED substrate is placed against the group The LED substrate is closely abutted to the positioning portion of the assembly platform at the assembly end surface of the connection platform.

In a preferred embodiment of the positioning structure of the LED substrate and the heat dissipating device of the lamp of the present invention, the positioning portion is formed with an abutting end surface on a side edge of the connecting end face.

A preferred embodiment of the positioning structure of the LED substrate and the heat dissipating device of the lamp of the present invention, wherein the groove portion of the connecting end face of the assembly platform and the positioning portion is longitudinally formed.

A preferred embodiment of the positioning structure of the LED substrate and the heat dissipating device of the lamp of the present invention, wherein the groove portion of the connecting end face of the assembly platform and the positioning portion is laterally formed.

A preferred embodiment of the positioning structure of the LED substrate and the heat dissipating device of the lamp of the present invention, wherein the positioning portion is provided with a positioning post on the end face of the connecting portion, and the groove portion is attached to the end face of the positioning portion The recessed shape is formed, and the LED substrate is provided with a positioning hole corresponding to the positioning portion.

The positioning structure of the LED substrate and the heat sink of the lamp of the invention is better For example, the assembly end face of the assembly platform is provided with an assembly hole, and the LED substrate is configured to be assembled and coupled with the set of connection holes of the assembly platform.

(1)‧‧‧ Heat sink

(11) ‧ ‧ ‧ connected platform

(111)‧‧‧ Joint end face

(112)‧‧‧ Positioning Department

(113)‧‧‧ Groove

(114)‧‧‧Contact holes

(2) ‧‧‧LED substrate

(21)‧‧‧LED

(22) ‧ ‧ set of connectors

(23) ‧‧‧Positioning holes

(3)‧‧‧Mirror

(4) ‧‧‧ optical lens

(5)‧‧‧LED lamps

(51)‧‧‧LED

(52)‧‧‧ Circuit board

(53)‧‧‧heating device

(531) ‧ ‧ ‧ connected platform

(R)‧‧‧ concave curved corner

First Figure: Schematic diagram of the three-dimensional exploded structure of the present invention

Second: Schematic diagram of the side view combined structure of the present invention

Third: Schematic diagram of a side view combined structure of another embodiment of the present invention

Fourth: Schematic diagram of a three-dimensional exploded structure of another embodiment of the present invention

Figure 5 is a side view of a cross-sectional view of another embodiment of the present invention

Figure 6 is a schematic view showing the structure of the first use state of the present invention

Figure 7: Schematic diagram of the second state of use of the present invention

Figure 8: Schematic diagram of the existing combined structure

For a more complete and clear disclosure of the technical content, the purpose of the invention and the effects thereof achieved by the present invention, the following is a detailed description, and please refer to the drawings and drawings: First, please refer to The first embodiment of the present invention includes a heat dissipating device (1) and an LED substrate (2). The heat dissipating device (1) is provided with a stacking platform (11). The assembly platform (11) is formed with a combined end face (111), and the pair of connected platforms (11) The positioning end surface (111) is formed with a positioning portion (112), and the positioning portion (112) is convexly formed with an abutting end surface on the side edge of the connecting end surface (111), and the connecting end surface (111) is The positioning portion (112) is integrally formed with a groove portion (113) during the die casting process, and the assembly end surface (111) of the assembly platform (11) is provided with a grouping hole (114).

The LED substrate (2) is disposed corresponding to the assembly platform (11) of the heat dissipation device (1), and the LED substrate (2) is provided with an LED (21) for the assembly ( 22) The set of connecting holes (114) of the assembly platform (11) of the heat dissipating device (1) are assembled and combined.

When the invention is positioned and assembled, the LED substrate (2) is correspondingly disposed on the assembly platform (11) of the heat dissipation device (1), and the LED substrate (2) is placed against the group. Connected to the set end surface (111) of the platform (11), at this time, because the assembly end surface (111) of the assembly platform (11) and the positioning portion (112) for abutting the end surface are integrally formed a groove portion (113), which can be longitudinally formed (please refer to the second side view of the side view of the present invention as shown in the schematic view) or to make the groove portion (113) laterally shaped [Please refer to the third embodiment of the present invention as shown in the schematic view of the side view assembly structure], so that the groove portion (113) does not hinder the positioning of the LED substrate (2), so that the LED The side end surface of the substrate (2) can also closely abut the positioning portion (112) of the assembly platform (11) against the end surface, and then the LED substrate is penetrated by the assembly (22) ( 2) After connecting to the platform (11) The set of holes (114) are assembled in combination.

In addition, referring to the fourth embodiment of the present invention, the heat dissipating device (1) is located on the positioning platform (11) of the positioning device (112). A positioning post is protruded from the set end surface (111), and the positioning portion (112) of the LED substrate (2) corresponding to the positioning post is provided with a positioning hole (23), so that the LED substrate (2) The positioning hole (23) is just sleeved on the outer positioning portion (112) of the positioning post (11), and the positioning hole (23) is just positioned outside the positioning portion (112) of the positioning post. A groove portion (113) is integrally formed with the assembly end surface (111) of the assembly platform (11) and the positioning portion (112) of the positioning post, and the groove portion (113) is positioned for the positioning The periphery of the positioning portion (112) of the column is concavely formed toward the set end surface (111), so that the groove portion (113) does not hinder the positioning of the LED substrate (2), so that the LED substrate (2) The positioning hole (23) can also closely abut the positioning portion (112) of the positioning platform (11) as a positioning post (please refer to the fifth figure again for a side view of another embodiment of the present invention) As shown in the schematic cross-sectional structure diagram, The assembling members (22) runs through the LED substrate (2) assembled with the platform (11) of the set of contact holes (114) assembled with targeting binding.

In this way, the LED substrate (2) is disposed on the assembly platform (11) of the heat dissipation device (1), and the LED substrate (2) can be connected to the assembly platform. (11) The set end surface (111) and the positioning portion (112) are closely coupled to each other, so that the LED substrate (2) is accurate Determining the position such that the light emitted by the LED (21) disposed on the LED substrate (2) is reflected by the mirror (3) (please refer to the sixth figure for the first use state structure diagram of the present invention) Or directly through the optical lens (4) (please refer to the seventh diagram of the second embodiment of the present invention, as shown in the schematic diagram), the preset position deviation is not caused by the assembly tolerance, and the preset is obtained. The headlights project light and the best lighting.

As described above, the implementation of the present invention shows that the present invention is mainly capable of bringing the assembly end face of the assembly platform of the LED substrate and the heat sink to the positioning portion in close contact with the prior art. Combined with the positioning, the position of the LED substrate is not deviated from the original light distribution design, and the relative illumination effect is not generated, so as to obtain the best lighting effect, and in its overall implementation. More practical and effective features.

However, the above-described embodiments or drawings are not intended to limit the structure or the use of the present invention, and any suitable variations or modifications of the invention will be apparent to those skilled in the art.

In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has completely complied with the provisions of the Patent Law. And the request, the application for the invention of a patent in accordance with the law, please forgive the review, and grant the patent, it is really sensible.

(1)‧‧‧ Heat sink

(11) ‧ ‧ ‧ connected platform

(111)‧‧‧ Joint end face

(112)‧‧‧ Positioning Department

(113)‧‧‧ Groove

(114)‧‧‧Contact holes

(2) ‧‧‧LED substrate

(21)‧‧‧LED

(22) ‧ ‧ set of connectors

Claims (5)

The positioning structure of the LED substrate and the heat dissipating device of the lamp mainly comprises a heat dissipating device and an LED substrate; wherein: the heat dissipating device is provided with a grouping platform, the grouping platform is formed with a connecting end face, and the group is connected The platform has a positioning portion formed on the end surface of the assembly, and a groove portion is integrally formed at the joint portion of the assembly end portion and the positioning portion, and the assembly hole is opened on the assembly end surface of the assembly platform; the LED substrate The LED substrate is provided with an LED, and the LED substrate is configured to be coupled to the set of the connection holes of the assembly platform to position the LED substrate. The LED substrate is closely abutted against the positioning portion of the assembly platform at the assembly end surface of the assembly platform. The positioning structure of the LED substrate and the heat dissipating device of the lamp according to the first aspect of the invention, wherein the positioning portion is formed with an abutting end surface on a side edge of the connecting end face. The positioning structure of the LED substrate and the heat dissipating device of the luminaire according to the first or second aspect of the invention, wherein the groove portion of the connecting end surface of the assembly platform and the positioning portion is longitudinally formed. The positioning structure of the LED substrate and the heat dissipating device of the luminaire according to the first or second aspect of the invention, wherein the groove portion of the connecting end surface of the assembly platform and the positioning portion is laterally formed. The locating structure of the LED substrate and the heat dissipating device of the illuminating device according to the first aspect of the invention, wherein the positioning portion is provided with a positioning post on the connecting end surface, and the groove portion is attached to the group at the periphery of the positioning portion The end face is concavely formed, and the LED substrate is provided with a positioning hole corresponding to the positioning portion.