TWI610464B - Light emitting diode structure - Google Patents
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Abstract
一種發光二極體結構,包括第一型摻雜半導體層、第二型摻雜半導體層、發光層、第一電極以及第二電極。發光層配置於第一型摻雜半導體層與第二型摻雜半導體層之間。第一電極配置於第一型摻雜半導體層上,且包括多個分支部。第二電極配置於第二型摻雜半導體層上,第二電極圈圍出至少一封閉區域,且封閉區域位於相鄰之二分支部之間。A light emitting diode structure includes a first type doped semiconductor layer, a second type doped semiconductor layer, a light emitting layer, a first electrode, and a second electrode. The light emitting layer is disposed between the first type doped semiconductor layer and the second type doped semiconductor layer. The first electrode is disposed on the first type doped semiconductor layer and includes a plurality of branches. The second electrode is disposed on the second type doped semiconductor layer, the second electrode ring encloses at least one closed region, and the closed region is located between the adjacent two branch portions.
Description
本發明是有關於一種光電元件結構,且特別是有關於一種發光二極體結構。 The present invention relates to a photovoltaic element structure, and more particularly to a light emitting diode structure.
由於發光二極體(light emitting diode,LED)結構具有低功率消耗、環保、使用壽命長及反應速率快等優勢,因此已被廣泛地應用在照明領域及顯示領域中。為了提升發光二極體的亮度,大尺寸的晶粒逐漸被開發出來。然而,習知的發光二極體結構的-電極設計具有造成電流分散性不佳的缺點,而使得此電極設計不適合用於大尺寸的晶粒。 Light-emitting diode (LED) structures have been widely used in the field of illumination and display because of their low power consumption, environmental protection, long service life and fast response rate. In order to increase the brightness of the light-emitting diode, large-sized crystal grains have been gradually developed. However, the conventional electrode design of the light-emitting diode structure has the disadvantage of causing poor current dispersion, making this electrode design unsuitable for large-sized crystal grains.
為改善上述之電流分散性不佳的問題,另一種習知電極被發展出來。此種習知電極包括配置於N型摻雜半導體層上的第一指叉狀電極以及配置於P型摻雜半導體層上的第二指叉狀電極。第一指叉狀電極與第二指叉狀電極分別具有多個第一分支部與多個第二分支部,其中相鄰之二個第一分支部中間僅配置有一個第二分支部。雖然此電極設計可改善電流分散性不佳的問題,但在此電極設計下,由於電子與電洞之遷移率(mobility)不同,電 子的遷移率較電洞的遷移率快,因此自第一分支部發出之電子傳遞至第二分支部時(或第二分支部發出之電洞傳遞至第一分支部時),第二分支部旁(或第一分支部旁)的電子濃度與電洞濃度差異極大,而使電子與電洞復合(recombination)機率較低,進而使得具有此種習知電極之發光二極體結構的發光效率不佳。 In order to improve the above problem of poor current dispersion, another conventional electrode has been developed. Such a conventional electrode includes a first interdigitated electrode disposed on the N-type doped semiconductor layer and a second interdigitated electrode disposed on the P-type doped semiconductor layer. Each of the first interdigitated electrode and the second interdigitated electrode has a plurality of first branch portions and a plurality of second branch portions, wherein only one second branch portion is disposed in the middle of the adjacent two first branch portions. Although this electrode design can improve the problem of poor current dispersion, in this electrode design, due to the mobility of electrons and holes, electricity The mobility of the sub-member is faster than the mobility of the hole, so when the electrons emitted from the first branch portion are transmitted to the second branch portion (or when the hole emitted from the second branch portion is transmitted to the first branch portion), the second sub-point The electron concentration and the hole concentration beside the branch (or beside the first branch) are extremely different, and the electron and hole recombination probability is low, thereby causing the light-emitting diode structure with such a conventional electrode to emit light. Inefficient.
本發明提供一種發光二極體結構,其具有高發光效率。 The present invention provides a light emitting diode structure having high luminous efficiency.
本發明之一實施例提出一種發光二極體結構,包括N型半導體層、第一電極、P型半導體層、第二電極以及發光層。第一電極配置於N型半導體層上,且第一電極包括多個第一分支部。 第二電極配置於P型半導體層上,且第二電極包括多個第二分支部以及圈圍封閉區域的延伸部。發光層配置於N型半導體層與P型半導體層之間。第二分支部與延伸部分別延伸於兩相鄰第一分支部之間的區域。 An embodiment of the present invention provides a light emitting diode structure including an N-type semiconductor layer, a first electrode, a P-type semiconductor layer, a second electrode, and a light-emitting layer. The first electrode is disposed on the N-type semiconductor layer, and the first electrode includes a plurality of first branch portions. The second electrode is disposed on the P-type semiconductor layer, and the second electrode includes a plurality of second branch portions and an extension portion surrounding the enclosed region. The light emitting layer is disposed between the N-type semiconductor layer and the P-type semiconductor layer. The second branch portion and the extension portion extend respectively between the two adjacent first branch portions.
本發明之一實施例提出一種發光二極體結構,包括N型半導體層、第一電極、P型半導體層、第二電極以及發光層。第一電極包括多個第一分支部。第二電極配置於P型半導體層上,且第二電極包括多個第二分支部以及延伸部。發光層配置於N型半導體層與P型半導體層之間,且N型半導體層被發光層與P型半導體層暴露的區域適於配置第一電極。第一電極的這些第一分支部與第二電極的這些第二分支部及延伸部的延伸方向相反並彼此 交錯,且延伸部圈圍N型半導體層上的一封閉區域。 An embodiment of the present invention provides a light emitting diode structure including an N-type semiconductor layer, a first electrode, a P-type semiconductor layer, a second electrode, and a light-emitting layer. The first electrode includes a plurality of first branch portions. The second electrode is disposed on the P-type semiconductor layer, and the second electrode includes a plurality of second branch portions and an extension portion. The light emitting layer is disposed between the N-type semiconductor layer and the P-type semiconductor layer, and the region where the N-type semiconductor layer is exposed by the light emitting layer and the P-type semiconductor layer is adapted to configure the first electrode. The first branch portions of the first electrode and the second branch portions and the extension portions of the second electrode extend in opposite directions and are opposite to each other Interleaved, and the extension encircles a closed region on the N-type semiconductor layer.
本發明之一實施例提出一種發光二極體結構,包括N型半導體層、第一電極、P型半導體層、第二電極以及發光層。第一電極配置於N型半導體層上,且第一電極包括多個第一分支部。第二電極配置於P型半導體層上,且第二電極包括多個第二分支部以及延伸部。延伸部具有二延伸臂且這些延伸臂的末端相連接而圈圍出一封閉區域。發光層配置於N型半導體層與P型半導體層之間,其中延伸部的這些延伸臂與這些第一分支部之間的距離較這些延伸臂之間的距離遠。 An embodiment of the present invention provides a light emitting diode structure including an N-type semiconductor layer, a first electrode, a P-type semiconductor layer, a second electrode, and a light-emitting layer. The first electrode is disposed on the N-type semiconductor layer, and the first electrode includes a plurality of first branch portions. The second electrode is disposed on the P-type semiconductor layer, and the second electrode includes a plurality of second branch portions and an extension portion. The extension has two extension arms and the ends of the extension arms are connected to enclose a closed area. The light emitting layer is disposed between the N-type semiconductor layer and the P-type semiconductor layer, wherein a distance between the extending arms of the extending portion and the first branch portions is farther than a distance between the extending arms.
基於上述,本發明之實施例之發光二極體結構藉由在第一電極的相鄰二分支部之間配置圈圍出封閉區域的第二電極,可使得發光二極體結構中上的電子與電洞濃度較為匹配,此可有效促進電子與電洞的復合,進而提高發光二極體結構的發光效率。 Based on the above, the light-emitting diode structure of the embodiment of the present invention can make the electrons in the light-emitting diode structure be arranged by arranging a second electrode enclosing the closed region between adjacent two branch portions of the first electrode. The concentration of the holes is relatively matched, which can effectively promote the recombination of electrons and holes, thereby improving the luminous efficiency of the structure of the light-emitting diode.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
100、100’‧‧‧發光二極體結構 100, 100'‧‧‧Lighting diode structure
102‧‧‧第一型摻雜半導體層 102‧‧‧First type doped semiconductor layer
102a‧‧‧平台部 102a‧‧‧ Platform Department
102b‧‧‧下陷部 102b‧‧‧Sag
104‧‧‧第二型摻雜半導體層 104‧‧‧Second type doped semiconductor layer
106‧‧‧發光層 106‧‧‧Lighting layer
108、108’‧‧‧第一電極 108, 108'‧‧‧ first electrode
108a、108e、110d‧‧‧分支部 Branches 108a, 108e, 110d‧‧
108b‧‧‧第一接墊 108b‧‧‧first mat
108c‧‧‧第一電極之的開口 108c‧‧‧ opening of the first electrode
108d、110c‧‧‧連接段 108d, 110c‧‧‧ connection segment
110‧‧‧第二電極 110‧‧‧second electrode
110a、110a’‧‧‧延伸部 110a, 110a’‧‧‧ Extension
110b‧‧‧第二接墊 110b‧‧‧second mat
112‧‧‧透明導電層 112‧‧‧Transparent conductive layer
200‧‧‧導電凸塊 200‧‧‧conductive bumps
300‧‧‧電路板 300‧‧‧ boards
C‧‧‧封閉區域 C‧‧‧closed area
D1、D2‧‧‧厚度 D1, D2‧‧‧ thickness
H1‧‧‧最短距離 H1‧‧‧ shortest distance
H2‧‧‧最大寬度 H2‧‧‧Max width
T1、T2‧‧‧端點 T1, T2‧‧‧ endpoint
圖1為本發明一實施例之發光二極體結構的上視示意圖。 1 is a top plan view showing a structure of a light emitting diode according to an embodiment of the present invention.
圖2為對應圖1之A-A’線所繪之剖面圖。 Figure 2 is a cross-sectional view taken along line A-A' of Figure 1.
圖3為對應圖1之B-B’線所繪之剖面圖。 Figure 3 is a cross-sectional view taken along line B-B' of Figure 1.
圖4示出本發明一實施例之發光二極體結構接合在電路板上 的情形。 4 shows a light emitting diode structure bonded to a circuit board according to an embodiment of the invention. The situation.
圖5為本發明另一實施例之發光二極體結構的上視示意圖。 FIG. 5 is a top plan view showing a structure of a light emitting diode according to another embodiment of the present invention.
圖1為本發明一實施例之發光二極體結構的上視示意圖。圖2為對應圖1之A-A’線所繪之剖面圖。圖3為對應圖1之B-B’線所繪之剖面圖。 1 is a top plan view showing a structure of a light emitting diode according to an embodiment of the present invention. Figure 2 is a cross-sectional view taken along line A-A' of Figure 1. Figure 3 is a cross-sectional view taken along line B-B' of Figure 1.
請同時參照圖1、圖2及圖3,本實施例之發光二極體結構100包括第一型摻雜半導體層102、第二型摻雜半導體層104、發光層106、第一電極108以及第二電極110。發光層106配置於第一型摻雜半導體層102與第二型摻雜半導體層104之間。第一電極108配置於第一型摻雜半導體層102上,而第二電極110配置於第二型摻雜半導體層104上。在本實施例中,第一型摻雜半導體層102例如為N型半導體層,而第二型摻雜半導體層104例如為P型半導體層。發光層106例如為氮化鎵(gallium nitride,GaN)層與氮化銦鎵(indium gallium nitride,InGaN)層交替堆疊的多重量子井結構(Multiple Quantum Well,MQW)。然而,在其他實施例中,發光層106亦可以是量子井結構。第一電極108與第二電極110之材質為導電材料,以單一層或是多層導電材料堆疊,其包括金、鈦、鋁、鉻、鉑、其他導電材料或這些材料的組合。但本發明不以上述為限。 Referring to FIG. 1 , FIG. 2 and FIG. 3 , the LED structure 100 of the present embodiment includes a first type doped semiconductor layer 102 , a second type doped semiconductor layer 104 , a light emitting layer 106 , a first electrode 108 , and The second electrode 110. The light emitting layer 106 is disposed between the first type doped semiconductor layer 102 and the second type doped semiconductor layer 104. The first electrode 108 is disposed on the first type doped semiconductor layer 102, and the second electrode 110 is disposed on the second type doped semiconductor layer 104. In the present embodiment, the first type doped semiconductor layer 102 is, for example, an N type semiconductor layer, and the second type doped semiconductor layer 104 is, for example, a P type semiconductor layer. The light-emitting layer 106 is, for example, a multiple quantum well structure (MQW) in which a gallium nitride (GaN) layer and an indium gallium nitride (InGaN) layer are alternately stacked. However, in other embodiments, the luminescent layer 106 can also be a quantum well structure. The first electrode 108 and the second electrode 110 are made of a conductive material and are stacked in a single layer or a plurality of layers of conductive materials, including gold, titanium, aluminum, chromium, platinum, other conductive materials or a combination of these materials. However, the invention is not limited to the above.
更詳細地說,本實施例之第一型摻雜半導體層102具有 相連接之平台部102a與下陷部102b,平台部102a的厚度D1大於下陷部102b的厚度D2。發光層106與第二型摻雜半導體層104配置平台部102a上,且第一電極108配置於下陷部102b上。在一實施例中,發光二極體結構100可利用覆晶(flip chip)的方式來封裝。如圖4所示,本實施例可利用導電凸塊200接合(bonding)第一電極108與電路板300及接合第二電極110與電路板300。如此一來,使用者便可透過電路板300操作本實施例之發光二極體結構100。然而,在另一實施例中,發光二極體結構100亦可採用打線結合的方式來封裝,亦即可利用接合導線來接合第一電極108與電路板300及接合第二電極110與電路板300,而此時第一電極108與第二電極110背對電路板300。 In more detail, the first type doped semiconductor layer 102 of the present embodiment has The platform portion 102a and the depressed portion 102b are connected, and the thickness D1 of the land portion 102a is larger than the thickness D2 of the depressed portion 102b. The light emitting layer 106 and the second type doped semiconductor layer 104 are disposed on the land portion 102a, and the first electrode 108 is disposed on the depressed portion 102b. In an embodiment, the LED structure 100 can be packaged by means of a flip chip. As shown in FIG. 4, the present embodiment can bond the first electrode 108 and the circuit board 300 and the second electrode 110 and the circuit board 300 by using the conductive bumps 200. In this way, the user can operate the LED structure 100 of the embodiment through the circuit board 300. However, in another embodiment, the LED structure 100 can also be packaged by wire bonding, that is, the bonding wires can be used to bond the first electrode 108 and the circuit board 300 and the second electrode 110 and the circuit board. 300, while the first electrode 108 and the second electrode 110 face away from the circuit board 300.
此外,本實施例之發光二極體結構100可進一步包括透明導電層112。透明導電層112可配置於第二電極110與第二型摻雜半導體層104之間。第二型摻雜半導體層104可藉由透明導電層112與第二電極110形成良好之歐姆接觸(ohmic contact)。透明導電層112的材質例如為銦錫氧化物(indium tin oxide,ITO)、銦鋅氧化物(indium zinc oxide,IZO)、氧化鋅(zinc oxide,ZnO)、銦錫鋅氧化物(indium tin zinc oxide,ITZO)、鋁錫氧化物(aluminum tin oxide,ATO)、鋁鋅氧化物(aluminum zinc oxide,AZO)或其他適當的透明導電材質。 In addition, the light emitting diode structure 100 of the embodiment may further include a transparent conductive layer 112. The transparent conductive layer 112 can be disposed between the second electrode 110 and the second type doped semiconductor layer 104. The second type doped semiconductor layer 104 can form a good ohmic contact with the second electrode 110 by the transparent conductive layer 112. The material of the transparent conductive layer 112 is, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (indium tin zinc). Oxide, ITZO), aluminum tin oxide (ATO), aluminum zinc oxide (AZO) or other suitable transparent conductive material.
本實施例之第一電極108包括多個分支部108a,而本實施例之第二電極110圈圍出至少一封閉區域C(圖1是以一個封 閉區域C為例)。舉例而言,如圖1所示,本實施例之第一電極108包括二個分支部108a。(圖1中是以二個分支部108a為例,但本發明之發光二極體結構並不限於圖1中所繪,在其他實施例中,亦可以是第一電極108包括三個以上的分支部108a)。 The first electrode 108 of the embodiment includes a plurality of branch portions 108a, and the second electrode 110 of the embodiment encloses at least one closed region C (FIG. 1 is a seal) Closed area C is an example). For example, as shown in FIG. 1, the first electrode 108 of the present embodiment includes two branch portions 108a. (In FIG. 1 , the two branch portions 108 a are taken as an example. However, the structure of the light emitting diode of the present invention is not limited to that shown in FIG. 1 . In other embodiments, the first electrode 108 may include three or more. Branch portion 108a).
在本實施例中,封閉區域C位於相鄰之二個分支部108a之間。在本實施例中,每一分支部108a與相鄰之第二電極110之間的最短距離H1小於或等於封閉區域C的最大寬度H2,但本發明不限於此,距離H1與最大寬度H2皆可視實施的設計需求而調整。此處的最大寬度H2是指在各個不同的方向中,取一個封閉區域C的寬度最大的方向,而在此方向上之封閉區域C的寬度即為最大寬度H2。 In the present embodiment, the closed area C is located between the adjacent two branch portions 108a. In this embodiment, the shortest distance H1 between each branch portion 108a and the adjacent second electrode 110 is less than or equal to the maximum width H2 of the closed region C, but the present invention is not limited thereto, and the distance H1 and the maximum width H2 are both Adjustable to the design needs of the implementation. The maximum width H2 herein refers to the direction in which the width of one closed region C is the largest in each of the different directions, and the width of the closed region C in this direction is the maximum width H2.
上述之電極設計(即封閉區域C位於相鄰之二個分支部108a之間)可改善習知技術中因電子與電洞遷移率(mobility)不同而造成之發光效率不佳的問題。詳細說明如下:由於電子的遷移率較電洞快,因此電子在遠離分支部108a處仍可維持較高的濃度。所以,當電子移動至封閉區域C時,電子的濃度與電洞的濃度會較為接近,如此便能夠使電子與電洞有較佳的復合率,進而提升發光二極體結構100的發光效率。 The electrode design described above (i.e., the closed region C is located between the adjacent two branch portions 108a) can improve the problem of poor luminous efficiency due to the difference in electron and hole mobility in the prior art. The details are as follows: Since the electron mobility is faster than that of the hole, the electrons can maintain a high concentration away from the branch portion 108a. Therefore, when the electrons move to the closed region C, the concentration of the electrons and the concentration of the holes are relatively close, so that the electrons and the holes have a better recombination ratio, thereby improving the luminous efficiency of the light-emitting diode structure 100.
在本實施例中,由於每一分支部108a與相鄰之第二電極110之間的最短距離H1小於或等於封閉區域C的最大寬度H2,因此封閉區域C中的電子濃度便能夠有效提升,而使的電子的濃度與電洞的濃度更為接近,進而藉由提升電子與電洞的復合率來 提升發光二極體結構100的發光效率。 In this embodiment, since the shortest distance H1 between each branch portion 108a and the adjacent second electrode 110 is less than or equal to the maximum width H2 of the closed region C, the electron concentration in the closed region C can be effectively improved. The concentration of the electrons is closer to the concentration of the holes, and the ratio of the electrons to the holes is increased. The luminous efficiency of the light emitting diode structure 100 is improved.
就本實施例之發光二極體結構100的封閉區域C而言,封閉區域C與分支部108a的距離較遠,故由分支部108a發出的電子傳遞至封閉區域C時,電子濃度已下降。另一方面,雖然封閉區域C與第二電極110的距離較近,但由於電洞之遷移率(mobility)較電子小,故由第二電極110發出之電洞傳遞至封閉區域C時,電洞濃度已下降至與電子濃度接近的程度。如此一來,封閉區域C中的電洞濃度便可與封閉區域C中的電子濃度匹配,進而使得電子電洞在封閉區域C中及附近發生復合(recombination)的機率大幅提高,而更進一步地提升發光二極體結構100的發光效率,且亦能夠提升發光二極體結構100的發光均勻性。 In the closed region C of the light-emitting diode structure 100 of the present embodiment, the distance between the closed region C and the branch portion 108a is long, and thus the electron emission from the branch portion 108a is transmitted to the closed region C, and the electron concentration has decreased. On the other hand, although the distance between the closed region C and the second electrode 110 is relatively close, since the mobility of the hole is smaller than that of the electron, when the hole emitted by the second electrode 110 is transmitted to the closed region C, the electricity is generated. The hole concentration has dropped to a level close to the electron concentration. In this way, the concentration of the holes in the closed region C can be matched with the concentration of electrons in the closed region C, thereby further increasing the probability of recombination of the electron holes in and around the closed region C, and further increasing The luminous efficiency of the light emitting diode structure 100 is improved, and the uniformity of light emission of the light emitting diode structure 100 can also be improved.
請繼續參照圖1、圖3及圖4,本實施例之第一電極108可進一步包括至少一第一接墊108b,第一接墊108b連接分支部108a。本實施例之第二電極110可進一步包括至少一第二接墊110b及與第二接墊110b連接之一延伸部110a。在本實施例中,第二接墊110b與延伸部110a圈圍出封閉區域C。此外,在本實施例中,第二接墊110b配置於第一電極108之相鄰的二分支部108a之間。如圖4所示,第一接墊108b與第二接墊110b可透過導電凸塊200與電路板300連接,進而讓使用者可透過電路板300操作發光二極體結構100。 Referring to FIG. 1 , FIG. 3 and FIG. 4 , the first electrode 108 of the embodiment may further include at least one first pad 108 b , and the first pad 108 b is connected to the branch portion 108 a. The second electrode 110 of this embodiment may further include at least one second pad 110b and one extension portion 110a connected to the second pad 110b. In this embodiment, the second pad 110b and the extension portion 110a enclose the closed area C. In addition, in the embodiment, the second pads 110b are disposed between the adjacent two branch portions 108a of the first electrode 108. As shown in FIG. 4, the first pads 108b and the second pads 110b are connected to the circuit board 300 through the conductive bumps 200, thereby allowing the user to operate the LED structure 100 through the circuit board 300.
詳言之,本實施例之分支部108a具有相對的第一端T1與第二端T2,且第一接墊108b連接相鄰分支部108a的第一端 T1。在本實施例中,第一電極108中之二第一分支108a呈U字形,且第二電極110呈環狀。並且,第一電極108之U字形的開口108c朝向第二電極110的第二接墊110b。 In detail, the branch portion 108a of the embodiment has opposite first and second ends T1 and T2, and the first pad 108b connects the first end of the adjacent branch 108a. T1. In the present embodiment, the first one of the first electrodes 108 has a U-shape, and the second electrode 110 has a ring shape. Also, the U-shaped opening 108c of the first electrode 108 faces the second pad 110b of the second electrode 110.
圖5為本發明另一實施例之發光二極體結構的上視示意圖。請參照圖5,本實施例之發光二極體結構100’與圖1之發光二極體結構100類似,而兩者的差異如下所述。在本實施例中,第一電極108’包括多個第一接墊108b,且第一電極108’更包括至少一連接段108d及多個分支部108e,其中連接段108d連接相鄰二第一接墊108b,而這些分支部108e則分別由這些第一接墊108b延伸而出。此外,在本實施例中,第二電極110’包括多個第二接墊110b、延伸部110a’、多個連接段110c及多個分支部110d。延伸部110a’例如呈環狀,連接段110c連接延伸部110a’與第二接墊110b,且這些第二接墊110b分別延伸出分支部110d。在本實施例中,分支部110d配置於分支部108e與分支部108a之間。或者,在另一實施例中,分支部110d與分支部108e可交替配置。在本實施例中,由於延伸部110a’呈環狀而圈圍出封閉區域C,因此亦具有類似於圖1之發光二極體結構100的功效,在此不再重述。 FIG. 5 is a top plan view showing a structure of a light emitting diode according to another embodiment of the present invention. Referring to Fig. 5, the light emitting diode structure 100' of the present embodiment is similar to the light emitting diode structure 100 of Fig. 1, and the difference between the two is as follows. In this embodiment, the first electrode 108' includes a plurality of first pads 108b, and the first electrode 108' further includes at least one connecting portion 108d and a plurality of branch portions 108e, wherein the connecting portion 108d connects the adjacent two first portions. The pads 108b are extended by the first pads 108b. Further, in the present embodiment, the second electrode 110' includes a plurality of second pads 110b, an extension portion 110a', a plurality of connection segments 110c, and a plurality of branch portions 110d. The extending portion 110a' is, for example, annular, and the connecting portion 110c connects the extending portion 110a' and the second pad 110b, and the second pads 110b extend out of the branch portion 110d, respectively. In the present embodiment, the branch portion 110d is disposed between the branch portion 108e and the branch portion 108a. Alternatively, in another embodiment, the branch portion 110d and the branch portion 108e may be alternately arranged. In the present embodiment, since the extending portion 110a' is annular and encloses the closed region C, it also has an effect similar to that of the light-emitting diode structure 100 of Fig. 1, and will not be repeated here.
綜上所述,本發明之發光二極體結構藉由在第一電極的相鄰二分支部之間配置圈圍出封閉區域的第二電極,而使得發光二極體結構各區域上的電子電洞濃度匹配,此可有效促進電子與電洞的復合,進而提高電子電洞復合之機率。如此一來,本發明 之發光二極體結構的發光效率光提取效率便可有效提高。 In summary, the light-emitting diode structure of the present invention enables electronic electricity on various regions of the light-emitting diode structure by arranging a second electrode surrounding the closed region between adjacent two branch portions of the first electrode. The hole concentration is matched, which can effectively promote the recombination of electrons and holes, thereby increasing the probability of electron hole compounding. As such, the present invention The luminous efficiency of the light-emitting diode structure can be effectively improved.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧發光二極體結構 100‧‧‧Lighting diode structure
102b‧‧‧下陷部 102b‧‧‧Sag
108‧‧‧第一電極 108‧‧‧First electrode
108a‧‧‧分支部 108a‧‧‧ Branch
108b‧‧‧第一接墊 108b‧‧‧first mat
108c‧‧‧第一電極之的開口 108c‧‧‧ opening of the first electrode
110‧‧‧第二電極 110‧‧‧second electrode
110a‧‧‧延伸部 110a‧‧‧Extension
110b‧‧‧第二接墊 110b‧‧‧second mat
112‧‧‧透明導電層 112‧‧‧Transparent conductive layer
C‧‧‧封閉區域 C‧‧‧closed area
H1‧‧‧最短距離 H1‧‧‧ shortest distance
H2‧‧‧最大寬度 H2‧‧‧Max width
T1、T2‧‧‧端點 T1, T2‧‧‧ endpoint
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TW201015744A (en) * | 2008-10-01 | 2010-04-16 | Formosa Epitaxy Inc | Nitride-based semiconductor light-emitting device |
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WO2007032638A1 (en) * | 2005-09-15 | 2007-03-22 | Epiplus Co., Ltd | Arrangement of electrodes for light emitting device |
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