TWI608786B - Modular cooling - Google Patents

Description

Modular cooling technology

The present invention relates to a modular cooling technique.

Electronic devices have temperature requirements. The heat system generated using these electronic devices is controlled using a cooling system. Examples of cooling systems include air and liquid cooling. These cooling systems are typically designed to work with such electronic devices and weather.

According to an embodiment of the present invention, a connection assembly for use with a modular cooling system is specifically provided, the connection assembly comprising: a liquid connection member disposed at a first position for receiving a liquid cooling And an air connection member disposed in a second position for receiving an air cooling system; the liquid connection member and the air connection member being capable of an electronic system and the liquid cooling system and the electronic system and the air cooling system An interface is provided therebetween, wherein the interface is independent of the liquid cooling system and the air cooling system.

100‧‧‧Connected assembly

120‧‧‧Liquid connectors

140‧‧‧Air connectors

160‧‧‧ interface

222‧‧‧Liquid supply

224‧‧‧Liquid reflux

242‧‧‧Air supply

244‧‧‧Air return

270‧‧‧Power connector

280‧‧‧Control connectors

290‧‧‧Installation components

300‧‧‧Cooling system

310‧‧‧Liquid cooling system

330‧‧‧Air cooling system

352, 655‧‧‧ electronic components

362‧‧‧ first interface

364‧‧‧Second interface

420‧‧‧Liquid Manifold

440‧‧‧Air manifold

450‧‧‧Electronic system

467‧‧‧Power interface

468‧‧‧Control interface

520‧‧‧ Exchangeable liquid connections

540‧‧‧Exchangeable air connectors

620‧‧‧liquid source/cold plate

622‧‧‧ supply line

624‧‧‧Reflow line

640‧‧ Air source

642‧‧‧Air supply line

644‧‧‧Air return line

652‧‧‧Valve/Electronic Components

653‧‧‧Valve

654‧‧‧ Space

657‧‧‧Power cord

658‧‧‧Control line

670‧‧‧Power supply

680‧‧‧Control source

A, B, C, D‧‧‧ cooling modules

L1‧‧‧ first position

L2‧‧‧ first position

The non-limiting examples and the like of the disclosure are described in the following description with reference to the accompanying drawings. In the figures, the same and similar structures, components or components appear in more than one of the above figures Etc., in the figures in which they appear, are generally labeled with the same or similar. The dimensions of the components and features shown in the figures are primarily selected for convenience and clarity of presentation and are not necessarily to scale. Referring to the drawings: FIG. 1 shows a block diagram of a connection assembly according to an example; FIG. 2 shows a top view of the connection assembly of FIG. 1 according to an example; FIG. 3 shows an example according to an example. A block diagram of a system for providing modular cooling of an electronic system; FIG. 4 is a schematic diagram of a cooling system according to an example of FIG. 3; and FIG. 5 is a block diagram of a modular cooling system according to an example. Figure 6 and Figure 6 show a cross-sectional view of the modular cooling system of Figure 5 in accordance with an example.

In the following detailed description, reference will be made to the claims Please be aware that other examples may be utilized and structural or logical changes may be made without departing from the scope of the disclosure.

Electronic system design must balance conflicts between power density, spatial layout, temperature requirements, noise, and other factors. Air cooling systems typically use radiators and fans to remove "waste" heat from the system. The use of heat sinks and fans will increase the need to operate an electronic device in an electronic system. Set the required power and may cause excessive noise and low system density. Liquid cooling is more efficient than air cooling; however, liquid cooling typically includes piping connections within the electronic devices. When the liquid passes through the pipe connectors, the risk of leakage of the liquid within the electronic device may occur.

Customized cooling schemes can be configured to cool electronic systems, such as modular computing devices. Customized cooling schemes may include air cooling systems and/or liquid cooling systems. The connectors used to operate the cooling systems are custom designed for the devices and are typically not interchangeable or compatible with each other. Customized cooling schemes are not cost effective and do not allow for the standardization of equipment or the use of inventory components. Also, using a customized solution can complicate installation and/or delay repair time.

In the example, a connection assembly will be provided. The connection assembly includes a liquid connection and an air connection. The liquid connector is disposed in a first position for receiving a liquid cooling system. The air connector is disposed in a second position for receiving an air cooling system. The liquid connector and the air connector provide an electronic system and an interface between the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

The term "liquid cooling system" refers to a cooling system that uses a liquid to cool an electronic system. Examples include direct liquid cooling, component level liquid cooling, dry disconnect liquid cooling, an adiabatic liquid cooler, a "dry cooling" liquid unit, an externally supplied coolant, a heat exchanger, and an external supply cooling unit. Connected to electronic components, and always Connect the expansion liquid cooling device.

The term "air cooling system" refers to a cooling system that uses thermal and mechanical means to cool an electronic system. For example, the air cooling system can include a fan, a radiator, a heat exchanger, an induction device, a direct expansion air cooling device, an adiabatic cooling device, an external air sensing device, an equipment air cooler device, and a device cooling device. Water heat exchanger.

The term "independent connector" refers to a connector that is not limited to the system to which it is connected. For example, the connector is versatile or standard and can be coupled to a variety of cooling systems and/or electronic systems to facilitate interchangeability of components or portions of the various systems.

The term "blind mating connector" refers to a connector that does not require tools to form a joint and that includes a self-aligning topography.

The term "exchangeable" refers to the interchangeability of components. For example, the exchangeable word may include certain components that can be installed and/or replaced with numerous components, such as a plurality of cooling components or systems. Examples include a thermally embedable cooling assembly that can be replaced without having to reconfigure a computer system.

Figure 1 shows a block diagram of a connection assembly in accordance with an example. The connection assembly 100 can be used with a modular cooling system. The connection assembly 100 includes a liquid connection member 120, an air connection member 140, and an interface 160. The liquid connector 120 is disposed in a first position to receive a liquid cooling system. The air connection member 140 is disposed in a second position to receive an air cooling system. The liquid connector 120 and the air connector 140 can provide an electronic system and the liquid cooling system and the electronic system is cooled with the air But the interface 160 between the systems. The interface 160 is independent of the liquid cooling system and the air cooling system.

2 shows a top view of the connection assembly 100 of FIG. 1 in accordance with an example. The connection assembly 100 includes the liquid connection member 120 and the air connection member 140. The liquid connection member 120 is shown to include, for example, a liquid supply 222 and a liquid return 224 disposed in a first position L1. The liquid connector 120, such as the liquid supply 222 and the liquid return 224, can comprise, for example, at least one connector selected from the group consisting of a cable, a hose, and a valve. The cable, hose, or valve may further include a pressure monitor to monitor the pressure and control the liquid. For example, the valve can be kept open by pressure that provides backflow prevention and controls the transfer of liquid between the liquid cooling system and the electronic system. The liquid connector 120 can include a pluggable connector, such as a blind connector that provides a thermally or pluggable connection. The liquid connector 120 can further comprise a liquid seal such as a gasket and/or a drop connector. For example, the drop connector can include a built-in plug that prevents leakage when the fluid connectors are combined and/or disassembled.

The air connector 140 is shown to include, for example, an air supply 242 and an air return 244. The air connection member 140, such as an air supply 242 and an air return 244, may for example comprise a conduit, a tube, a conduit and/or a vent tube. The air connection 140 can be, for example, a gas tight seal using a seal, a gasket, and/or a screw member. The air connector 140 can also have a damper or backflow preventer that prevents improper flow through an opening when an air cooling system is removed.

The interface 160 can include a connecting member, such as a seal, a gasket, a screw member, a plate, a flat member, or an aperture for receiving the liquid connector 120 and the air connector 140. Moreover, the interface 160 can be a separate component or integrated into the electronic system, such as at the top or side of a performance optimized data center (POD or EcoPOD). The interface 160 can be adapted for use with a liquid cooling system, an air cooling system, and/or a liquid cooling system and an air cooling system. If only a liquid cooling system or an air cooling system is used, a plug or other connector can be used to block the opening or portion of the interface 160 when not in use.

The connection assembly 100 can further include additional connectors, such as a power connector 270 and/or a control connector 280. The power connector 270 can provide a power connection between the liquid cooling system, the air cooling system, and/or the electronic system. The connection assembly 100 can also include a control connector 280 for providing communication between the liquid cooling system, the air cooling system, and/or the electronic system. For example, the control connector 280 can provide control of input and output signals in addition to network communications. The control connector 280 provides synchronization and communication between the electronic system and the liquid cooling system and the air cooling system, such as the function of the component, the scale of operation, the temperature of the electronic component, the electronic system and/or Communication of the ambient temperature and/or humidity of the cooling system and/or the pressure of the air or liquid.

The connection assembly 100 can further include a mounting member 290 to provide connection between the connection assembly 100 and the electronic system, the liquid cooling system, and/or the air cooling system. The mounting member 290 can comprise, for example, having Plug or pin socket, or slot pin. The mounting member 290 provides the ability to adapt the connection assembly 100 to accommodate a variety of electronic systems, air cooling systems, and liquid cooling systems. Moreover, the mounting members 290 will support the modularization and enable a variety of air cooling and liquid cooling systems to be used with the electronic systems. For example, the design can provide the ability to use an inventory liquid cooling system and an air cooling system that are adapted to the standardized connection assembly 100.

FIG. 3 illustrates a block diagram of a system 300 for providing modular cooling of an electronic system in accordance with an example. The system 300 includes a liquid cooling system 310, an air cooling system 330, and a connection assembly 100. The liquid cooling system 310 can cool the electronic system using a liquid. The air cooling system 330 can cool the electronic system using air.

4 shows a schematic diagram of a cooling system 300 of FIG. 3 in accordance with an example. Referring to Figure 4, four cooling modules A to D are shown. Each of the cooling modules A to D is shown to contain a self-contained liquid and air supply and a connection assembly 100. The connection assembly 100 includes a liquid connection member 120 and an air connection member 140. The liquid connector 120 and the air connector 140 each provide an independent connection at different locations. For example, the liquid connection member 120 is disposed at a first position L1 for connection to the liquid cooling system 310. The liquid connector 120 can provide a first interface 362 between the liquid cooling system 310 and an electronic system. For example, the liquid connector 120 will be coupled to one of the liquid manifolds 420 in the electronic system 450. The air connector 140 is disposed at a second position L2 for connection to the air cooling system 330. The air connector 140 can provide a connection between the air cooling system 330 and the electronic system 450 Second interface 364. For example, the air connection 140 will be coupled to the electronic system to provide air to an air manifold 440 that will distribute air within the electronic system 450. The air manifold 440 can include a set conduit or vent tube within the electronic system or a space between the electronic components 352 that will receive the air.

The cooling systems can be selected based on the data center load and/or the data center environment surrounding the data center. For example, the temperature or humidity of the data center or the environment surrounding the data center can be used to select the liquid cooling system 310 and/or the air cooling system 330, which will optimize power usage and cooling capabilities. Moreover, the modular design enables the various liquid cooling systems 310 and air cooling system 330 to receive liquid and/or air from a separate connector, such as a supply above a cooling system or via a self-contained air. And / or liquid cooling system. Moreover, the modularization enables a portion of the liquid cooling system modules to be received by a supply of liquid, but other portions of the liquid cooling system modules are self-contained. For example, if the electronic system 450 includes a set of electronic components that are densely packed, a different temperature or volume of liquid is required than another set of electronic components that are not so densely packed.

The first interface 362 can receive the liquid cooling system 310 and the second interface 364 can receive the air cooling system 330. For example, the first interface 362 is shown in FIG. 4 as a gasket or seal that can manually receive a pipe, tube, and/or valve. Similarly, the second interface 364 is illustrated in FIG. 4 as a gasket or seal that can receive a conduit, tube, conduit, and/or a vent tube to form a manual connection. Alternative and varied interface The design can also be used.

For example, the first interface 362 interchangeably accepts a plurality of liquid cooling systems 310 selected from at least one of the following liquid cooling systems: an insulated liquid cooler, a "dry cooled" liquid device, and an externally supplied cold portion. The agent, a heat exchanger, and an externally supplied cooling unit are directly connected to the electronic component and a directly expanding liquid cooling device. The second interface 364 interchangeably receives a plurality of air cooling systems 330 selected from at least one of the following air cooling systems: a direct expansion air cooling device, an adiabatic cooling device, an external air sensing device, and an equipment air cooling device. And a heat exchanger with equipment cooling water. By using separate connectors, the system can be designed to use a variety of liquid cooling systems 310 and air cooling systems 330 that can be interchanged or exchanged as needed by the electronic system and/or the surrounding environment of the equipment.

The interfaces 160, i.e., the first interface 362 and the second interface 364, may be on top of the electronic system 450, as shown in FIG. 6, or may be on one side or the back of the electronic system 450. For example, the interface can be on the top, bottom, side or back of the electronic system 450 as shown in Figures 2 and 4. The interface 160 can receive the liquid connector 120 and the air connector, and/or an interface having the liquid connector 120 and the air connector 140 coupled thereto.

The added interface can be provided. For example, the connection assembly 100 can further include a power supply interface 467 connected to the power bus, that is, the power connection 270 to provide the liquid cooling system 310 and the electronic system 450, and/or the air cooling system 310 and the electronic system. One of the 450 rooms is electrically connected. The company The assembly 100 can further include a control interface 468 coupled to the control connector 280, such as a control bus, to provide the liquid cooling system 310 and the electronic system 450, and/or the air cooling system 330 and the electronic system 450 Communication between. For example, the control bus can provide communication that will coordinate the liquid cooling system 310 and the air cooling system 330. For example, there may be a set of monitors to manage the temperature, power/electrical output, pressure, and/or function of the cooling system and/or the electronic system.

Also, the modular design makes the installation of the cooling system easier and adjustable. For example, the components can be installed in modules relative to larger non-modular systems. A stack of tall or small cranes can be used instead of larger cranes or equipment. In addition, the modular design allows for the adjustment of such leak management and fault management components.

FIG. 5 illustrates a block diagram of a modular cooling system 300 in accordance with an example. The modular cooling system 300 includes a liquid cooling system 310, an air cooling system 330, an exchangeable liquid connection 520, and an exchangeable air connection 540. The liquid cooling system 310 can cool the electronic system 450 using a liquid. The air cooling system 330 can cool the electronic system 450 using air. The exchangeable liquid connection 520 can provide a liquid connection that is compatible with most liquid cooling systems 310. The exchangeable liquid connection 520 can be coupled to the liquid cooling system 310 and the electronic system 450. For example, the exchangeable liquid connection 520 can include a blind mating connector that can be mated with a liquid connection on a liquid cooling system. Alternatively, the connector can be manually formed using a pipe, tube and/or valve manually inserted therein.

The exchangeable air connection 540 can provide an air connection. It is compatible with most air cooling systems 330. The exchangeable air connection 540 can be coupled to the air cooling system 330 and the electronic system 450. The air connector 140 can include a blind mating connector that requires the attachment to be created by bringing the two objects together. Alternatively, a mechanical connector can be used in a manual connection step and/or a lever or other mechanism that requires the user to position the two objects and then join them by an additional step to complete the connection. The use of blind mating connectors or mechanical connectors, etc., depends on the design of the electronic system 450 and/or the air cooling system 330. Again, the exchangeable liquid connection 520 and the exchangeable air connection provide a thermally exchangeable connection to the liquid cooling system 310 and the air cooling system 330. The heat exchangeable connectors enable the cooling systems to be interchangeable without having to change the electronic system. For example, the cooling system can be swapped out for repair, maintenance, and/or replacement.

FIG. 6 illustrates a cross-sectional view of the modular cooling system 300 of FIG. 5 in accordance with an example. The modular cooling system 300 includes a liquid cooling system 310 that is shown to include a liquid supply 222 and a liquid return 224. The exchangeable liquid connection 520 can include the first interface 362 as a blind mating connector that can be disposed, for example, on the liquid cooling system 310, such as one of the liquid supply 222 and the liquid return 224. A pipe, a pipe, a valve, a gasket and/or a seal are mated. The blind mating connector can connect the liquid cooling system 310 to the electronic system 450 via a conduit, a tube, or a valve 652, 653 that is coupled to the blind mating connector. The exchangeable liquid connection 520 can alternatively include a manual attachment as previously described, depending on the design.

The liquid cooling system 310 is shown to include a liquid source 620 that provides liquid to and receives liquid from the electronic system 450. The liquid source 620 can be coupled to a device to provide a preferential and/or backup liquid supply and liquid reflux in the event of an error or a prioritized need. The liquid source 620 includes a supply line 622 and a return line 624.

The air cooling system 330 is shown to include an air supply 242 and an air return 244. The exchangeable air connector 540 can include a second interface 364 that is shown as a blind mating connector. For example, the air supply 242 and the air return 244 can include a conduit, a tube, a conduit, and/or a vent tube that will connect the blind mating connector to the air cooling system 330. Air from the air cooling system 330 is circulated through the electronic system using a space 654 around the electronic components 655. The exchangeable air connection 540 can alternatively include a manual attachment as previously described, depending on its design.

The air cooling system 330 is shown to include some air source 640 that can provide air to and receive air from the electronic system 450. The air source 640 can be coupled to a device that provides a priority and/or backup system that uses the air supply line 642 and the air return line 644 to distribute the air when there is an error or a priority.

The electronic system 450 is shown, for example, as a performance optimized data center (POD or EcoPOD). The electronic system 450 can include electronic components 652 and the like, such as a high density server. The electronic components 652 are shown as being being cooled using the liquid cooling system 310 and the air cooling system 330. The liquid cooling system 310 is connected to the electronic components by pipes or pipes 652, the tubes transport the liquid along the liquid supply 222 to the cold plates 620. The liquid can be delivered in a different manner, the interface connector providing a standardized position for the liquid to be provided or adapted to be provided to the electronic system 450, and a variety of different liquid cooling systems can be used. The cold plates 620 can be used to remove heat from the electronic components 652. When heat is removed by the electronic components 655, the heat is transferred to the liquid and the liquid is returned to the liquid cooling system 310 via the liquid return 224.

The air cooling system 330 is coupled to the electronic components 652 via the conduits, tubes, conduits, or vents that deliver air to the electronic components 652 and are removed by the electronic system 450. For example, the air can be provided via an air manifold. The air supply 242 and the air return 244 each provide an exchangeable air connection 540 to form a connection between the air cooling system and the electronic system and to transfer the air therethrough.

Referring to Figure 6, a power connector 270 and a control connector 280 are also shown. The power connector 270 is shown as a power bus that provides power to the liquid cooling system 310 and the air cooling system 330. The power bus may include a power interface 467 that connects the power bus to a power line 657 within the electronic system 450. A power source 670 is also shown to be connectable to a device and provides additional power and/or backup power.

The control connector 280 is shown as a control bus that provides communication between the liquid cooling system 310, the air cooling system 330, and the electronic system 450. The control bus can include a control interface 468 that connects the control bus to one of the control lines 658 within the electronic system 450. A control source 680 is also shown to be coupled to a device and provides an additional control signal for backup control, priority status, and/or additional communication options with the device.

The present disclosure has been described by way of non-limiting detailed description, and is not intended to limit the scope of the disclosure. It should be understood that the features and/or operations described for one example may be used in other examples, and not all of the examples disclosed herein have all such features and/or described in one particular figure. operating. Changes in the described examples will occur to the professional. In addition, the terms "including", "including", "having" and "comprising" are used to mean "including but not necessarily limited to" when used in the context of the disclosure and/or claims.

Please note that some of the above examples may include structures, structural acts or details, and actions, etc., which may not be necessary for this disclosure, but are intended as examples. The structures and behaviors described may be replaced by equivalents, which perform the same function even if the structures or acts are different, as is known in the art. Therefore, the scope of the present disclosure is limited only by the elements and limitations used in the claims.

120‧‧‧Liquid connectors

140‧‧‧Air connectors

160‧‧‧ interface

222‧‧‧Liquid supply

224‧‧‧Liquid reflux

242‧‧‧Air supply

244‧‧‧Air return

270‧‧‧Power connector

280‧‧‧Control connectors

290‧‧‧Installation components

L1‧‧‧ first position

L2‧‧‧ first position

Claims (15)

A connection assembly for use with a modular cooling system for cooling an electronic system, the connection assembly comprising: an interface disposed on one side of the electronic system; Intersectably mounted to the at least one cooling module of the interface, the cooling module comprising: a liquid connection member disposed in a first position for receiving a liquid cooling system; and an air connection member disposed in the first The second position is for receiving an air cooling system; the liquid connection member and the air connection member are for providing the interface between the electronic system and the liquid cooling system and between the electronic system and the air cooling system, wherein the interface The interface is independent of the liquid cooling system and the air cooling system. The connection assembly of claim 1, wherein the air connection member comprises an air supply and an air return. The connection assembly of claim 1, wherein the liquid connection comprises a liquid supply and a liquid return. The connection assembly of claim 1, wherein the liquid connector comprises a blind mating connector. The connection assembly of claim 1, wherein the liquid connection member comprises at least one connector selected from the group consisting of: a cable, a hose, and a valve. For example, the connection assembly of claim 1 further includes a control connector. The connection assembly of claim 1 further includes a power connector. The connection assembly of claim 1, further comprising a mounting member for attaching the assembly to the electronic system. A system for providing modular cooling of an electronic system, comprising: a liquid cooling system for cooling the electronic system; an air cooling system for cooling the electronic system; and a connection assembly comprising: An interface on one side of the electronic system; and at least one cooling module interchangeably mounted to the interface, the cooling module comprising: a liquid connection member disposed in a first position for connection to the liquid cooling And an air connection member disposed in a second position for connection to the air cooling system; wherein the interface includes a first interface disposed between the liquid cooling system and the electronic system, and disposed at the A second interface between the air cooling system and the electronic system. The system of claim 9, wherein the first interface interchangeably accepts a plurality of liquid cooling systems selected from at least one of the following liquid cooling systems: an adiabatic liquid cooler, a "dry cooling" a liquid device, an externally supplied coolant, a heat exchanger, a cooling unit directly connected to one of the electronic components, and a direct expansion liquid cooling device. The system of claim 9, wherein the second interface is for interchangeably receiving a plurality of air cooling systems, the air cooling system being selected from at least one of the following air cooling systems: a direct expansion air cooling device, An adiabatic cooling device, an external air sensing device, an equipment air cooler device, and a heat exchanger having equipment cooling water. The system of claim 9, wherein the connection assembly further comprises a power bus. The system of claim 9, wherein the connection assembly further comprises a control bus. A modular cooling system comprising: a liquid cooling system for cooling an electronic system; an air cooling system for cooling the electronic system; an interface disposed on one side of the electronic system; and at least one cooling A module, interchangeably mounted to the interface, the cooling module comprising: an exchangeable liquid connection for providing a liquid connection member compatible with a plurality of liquid cooling systems, the exchangeable liquid connection member for dispensing Connecting the liquid cooling system to the electronic system; and an exchangeable air connection for providing an air connection member compatible with the plurality of air cooling systems, the exchangeable air connection member for mating the air cooling system The electronic system. A modular cooling system according to claim 14 wherein the exchangeable liquid connection and the exchangeable air connection provide separate connections.