TWI608786B - Modular cooling - Google Patents
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Description
本發明係有關一種模組式冷卻技術。 The present invention relates to a modular cooling technique.
電子裝置有溫度要求。使用該等電子裝置產生的熱係被使用冷卻系統來控制。冷卻系統之例包括空氣和液體冷卻。該等冷卻系統典型係被設計成能與該等電子裝置和氣象一起工作。 Electronic devices have temperature requirements. The heat system generated using these electronic devices is controlled using a cooling system. Examples of cooling systems include air and liquid cooling. These cooling systems are typically designed to work with such electronic devices and weather.
依據本發明之一實施例,係特地提出一種可與一模組式冷卻系統一起使用的連接總成,該連接總成包含:一液體連接件置設在一第一位置用以承接一液體冷卻系統;及一空氣連接件置設在一第二位置用以承接一空氣冷卻系統;該液體連接件和該空氣連接件能在一電子系統與該液體冷卻系統及該電子系統與該空氣冷卻系統之間提供一介面,其中該介面係獨立於該液體冷卻系統和該空氣冷卻系統。 According to an embodiment of the present invention, a connection assembly for use with a modular cooling system is specifically provided, the connection assembly comprising: a liquid connection member disposed at a first position for receiving a liquid cooling And an air connection member disposed in a second position for receiving an air cooling system; the liquid connection member and the air connection member being capable of an electronic system and the liquid cooling system and the electronic system and the air cooling system An interface is provided therebetween, wherein the interface is independent of the liquid cooling system and the air cooling system.
100‧‧‧連接總成 100‧‧‧Connected assembly
120‧‧‧液體連接件 120‧‧‧Liquid connectors
140‧‧‧空氣連接件 140‧‧‧Air connectors
160‧‧‧介面 160‧‧‧ interface
222‧‧‧液體供應器 222‧‧‧Liquid supply
224‧‧‧液體回流器 224‧‧‧Liquid reflux
242‧‧‧空氣供應器 242‧‧‧Air supply
244‧‧‧空氣回流器 244‧‧‧Air return
270‧‧‧電源連接件 270‧‧‧Power connector
280‧‧‧控制連接件 280‧‧‧Control connectors
290‧‧‧安裝構件 290‧‧‧Installation components
300‧‧‧冷卻系統 300‧‧‧Cooling system
310‧‧‧液體冷卻系統 310‧‧‧Liquid cooling system
330‧‧‧空氣冷卻系統 330‧‧‧Air cooling system
352、655‧‧‧電子組件 352, 655‧‧‧ electronic components
362‧‧‧第一介面 362‧‧‧ first interface
364‧‧‧第二介面 364‧‧‧Second interface
420‧‧‧液體歧管 420‧‧‧Liquid Manifold
440‧‧‧空氣歧管 440‧‧‧Air manifold
450‧‧‧電子系統 450‧‧‧Electronic system
467‧‧‧電源介面 467‧‧‧Power interface
468‧‧‧控制介面 468‧‧‧Control interface
520‧‧‧可交換液體連接件 520‧‧‧ Exchangeable liquid connections
540‧‧‧可交換空氣連接件 540‧‧‧Exchangeable air connectors
620‧‧‧液體源/冷板 620‧‧‧liquid source/cold plate
622‧‧‧供應線 622‧‧‧ supply line
624‧‧‧回流線 624‧‧‧Reflow line
640‧‧‧空氣源 640‧‧ Air source
642‧‧‧空氣供應線 642‧‧‧Air supply line
644‧‧‧空氣回流線 644‧‧‧Air return line
652‧‧‧閥/電子組件 652‧‧‧Valve/Electronic Components
653‧‧‧閥 653‧‧‧Valve
654‧‧‧空間 654‧‧‧ Space
657‧‧‧電源線 657‧‧‧Power cord
658‧‧‧控制線 658‧‧‧Control line
670‧‧‧電源 670‧‧‧Power supply
680‧‧‧控制源 680‧‧‧Control source
A、B、C、D‧‧‧冷卻模組 A, B, C, D‧‧‧ cooling modules
L1‧‧‧第一位置 L1‧‧‧ first position
L2‧‧‧第一位置 L2‧‧‧ first position
本揭露的非限制例等會參照所附的圖式被描述於以下說明中,而不會限制申請專利範圍。在該等圖中,出現在一個以上圖中之相同和類似的結構、元件或部件 等,在它們所出現的圖中係概括地被標以相同或類似的標號。在該等圖中所示的組件和特徴細構之尺寸主要係為呈現的方便和清楚而被選用,且不一定依照比例。參閱所附圖式:圖1示出一依據一範例之連接總成的方塊圖;圖2示出一依據一範例之圖1的連接總成之頂視圖;圖3示出一依據一範例之用以提供一電子系統的模組式冷卻之系統的方塊圖;圖4示出一依據一範例之圖3的冷卻系統之示意圖;圖5示出一依據一範例之模組式冷卻系統的方塊圖;以及圖6示出一依據一範例之圖5的模組式冷卻系統之截面圖。 The non-limiting examples and the like of the disclosure are described in the following description with reference to the accompanying drawings. In the figures, the same and similar structures, components or components appear in more than one of the above figures Etc., in the figures in which they appear, are generally labeled with the same or similar. The dimensions of the components and features shown in the figures are primarily selected for convenience and clarity of presentation and are not necessarily to scale. Referring to the drawings: FIG. 1 shows a block diagram of a connection assembly according to an example; FIG. 2 shows a top view of the connection assembly of FIG. 1 according to an example; FIG. 3 shows an example according to an example. A block diagram of a system for providing modular cooling of an electronic system; FIG. 4 is a schematic diagram of a cooling system according to an example of FIG. 3; and FIG. 5 is a block diagram of a modular cooling system according to an example. Figure 6 and Figure 6 show a cross-sectional view of the modular cooling system of Figure 5 in accordance with an example.
在以下詳細說明中,會參照所附圖式其形成本說明的一部份,且其中係藉由本揭露可被實施的特定舉例來示出。請瞭解其它之例亦可被利用,且結構或邏輯上的變化可能被作成而不超出本揭露的範圍。 In the following detailed description, reference will be made to the claims Please be aware that other examples may be utilized and structural or logical changes may be made without departing from the scope of the disclosure.
電子系統設計必須平衡功率密度、空間布局、溫度要求、噪音、及其它因素等之間的抵觸衝突。空氣冷卻系統典型會使用散熱器和風扇來由該系統移除「廢」熱。散熱器和風扇的使用會增加一電子系統中要操作一電子裝 置所需的電力,並可能造成過大的噪音和較低的系統密度。液體冷卻會比空氣冷卻更有效率;但是,液體冷卻典型會在該等電子裝置內包含配管連接件。當該液體通過該等配管連接件時,該液體在該電子裝置內滲漏的風險會產生。 Electronic system design must balance conflicts between power density, spatial layout, temperature requirements, noise, and other factors. Air cooling systems typically use radiators and fans to remove "waste" heat from the system. The use of heat sinks and fans will increase the need to operate an electronic device in an electronic system. Set the required power and may cause excessive noise and low system density. Liquid cooling is more efficient than air cooling; however, liquid cooling typically includes piping connections within the electronic devices. When the liquid passes through the pipe connectors, the risk of leakage of the liquid within the electronic device may occur.
客製化冷卻方案可被構製用於冷卻電子系統,譬如模組化計算設備。客製化冷卻方案可包括空氣冷卻系統及/或液體冷卻系統。被用來使該等冷卻系統操作的連接件對該等設備的設計是客製化的,且典型係不能互相交換或與另一者相容。客製化冷卻方案不符合成本效益,且不容許裝備的標準化或庫存組件的使用。又,使用客製化方案可能會使安裝複雜及/或延遲修理時間。 Customized cooling schemes can be configured to cool electronic systems, such as modular computing devices. Customized cooling schemes may include air cooling systems and/or liquid cooling systems. The connectors used to operate the cooling systems are custom designed for the devices and are typically not interchangeable or compatible with each other. Customized cooling schemes are not cost effective and do not allow for the standardization of equipment or the use of inventory components. Also, using a customized solution can complicate installation and/or delay repair time.
在舉例中,一種連接總成會被提供。該連接總成包含一液體連接件和一空氣連接件。該液體連接件係置設在一第一位置用以承接一液體冷卻系統。該空氣連接件係置設在一第二位置用以承接一空氣冷卻系統。該液體連接件和該空氣連接件能提供一電子系統與該液體冷卻系統及該電子系統與該空氣冷卻系統之間的介面,其中該介面係獨立於該液體冷卻系統和該空氣冷卻系統。 In the example, a connection assembly will be provided. The connection assembly includes a liquid connection and an air connection. The liquid connector is disposed in a first position for receiving a liquid cooling system. The air connector is disposed in a second position for receiving an air cooling system. The liquid connector and the air connector provide an electronic system and an interface between the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
該「液體冷卻系統」乙詞係指一種使用液體來冷卻一電子系統的冷卻系統。範例包括直接液體冷卻、組件層級液體冷卻、乾斷接液體冷卻、一絕熱液體冷卻器、一「乾冷卻式」液體裝置、一外部供應的冷卻劑、一熱交換器、一外部供應冷卻單元直接連接於電子組件、及一直 接膨脹液體冷卻裝置。 The term "liquid cooling system" refers to a cooling system that uses a liquid to cool an electronic system. Examples include direct liquid cooling, component level liquid cooling, dry disconnect liquid cooling, an adiabatic liquid cooler, a "dry cooling" liquid unit, an externally supplied coolant, a heat exchanger, and an external supply cooling unit. Connected to electronic components, and always Connect the expansion liquid cooling device.
該「空氣冷卻系統」乙詞係指一種使用熱和機械裝置來冷卻一電子系統的冷卻系統。例如,該空氣冷卻系統可包括風扇、散熱器、熱交換器、感應裝置、一直接膨脹空氣冷卻裝置、一絕熱冷卻裝置、一外部空氣感應裝置、一設備空氣冷卻器裝置、及一具有設備冷卻水的熱交換器。 The term "air cooling system" refers to a cooling system that uses thermal and mechanical means to cool an electronic system. For example, the air cooling system can include a fan, a radiator, a heat exchanger, an induction device, a direct expansion air cooling device, an adiabatic cooling device, an external air sensing device, an equipment air cooler device, and a device cooling device. Water heat exchanger.
該「獨立連接件」乙詞係指一種連接件,其不受限於所連接的系統。例如,該連接件係通用的或標準的,並可連接於多種冷卻系統及/或電子系統來促成各系統之組件或部份的可互換性。 The term "independent connector" refers to a connector that is not limited to the system to which it is connected. For example, the connector is versatile or standard and can be coupled to a variety of cooling systems and/or electronic systems to facilitate interchangeability of components or portions of the various systems.
該「盲配連接件」乙詞係指不須要工具來形成一連結且包含自行對準形貌體的連接器。 The term "blind mating connector" refers to a connector that does not require tools to form a joint and that includes a self-aligning topography.
該「可交換的」乙詞係指組件的可互換性。例如,該可交換的乙詞可包含某些組件,其可被以眾多的組件來安裝及/或更換,譬如多數個冷卻組件或系統可被使用。舉例包括熱可栓塞的冷卻組件,其可被更換而不必重整一電腦系統。 The term "exchangeable" refers to the interchangeability of components. For example, the exchangeable word may include certain components that can be installed and/or replaced with numerous components, such as a plurality of cooling components or systems. Examples include a thermally embedable cooling assembly that can be replaced without having to reconfigure a computer system.
圖1示出一依據一範例之連接總成的方塊圖。該連接總成100係可與一模組化冷卻系統一起使用。該連接總成100包含一液體連接件120、一空氣連接件140、及一介面160。該液體連接件120係置設在一第一位置來承接一液體冷卻系統。該空氣連接件140係置設在一第二位置來承接一空氣冷卻系統。該液體連接件120和該空氣連接件140能提供一電子系統與該液體冷卻系統及該電子系統與該空氣冷 卻系統之間的介面160。該介面160係獨立於該液體冷卻系統和該空氣冷卻系統。 Figure 1 shows a block diagram of a connection assembly in accordance with an example. The connection assembly 100 can be used with a modular cooling system. The connection assembly 100 includes a liquid connection member 120, an air connection member 140, and an interface 160. The liquid connector 120 is disposed in a first position to receive a liquid cooling system. The air connection member 140 is disposed in a second position to receive an air cooling system. The liquid connector 120 and the air connector 140 can provide an electronic system and the liquid cooling system and the electronic system is cooled with the air But the interface 160 between the systems. The interface 160 is independent of the liquid cooling system and the air cooling system.
圖2示出依據一範例之圖1的連接總成100之頂視圖。該連接總成100包含該液體連接件120和該空氣連接件140。該液體連接件120係被示為包含,例如,一液體供應器222及一液體回流器224置設在一第一位置L1。該液體連接件120,譬如該液體供應器222和該液體回流器224,可包含例如,至少一種選自下列連接器的連接器:一纜線、一軟管、及一閥。該纜線、軟管、或閥可更包含一壓力監視器來監視壓力並控制該液體。例如,該閥可被壓力保持開放,該壓力差可提供倒流防止,並控制該液體冷卻系統和該電子系統之間的液體傳輸。該液體連接件120可包含一可栓塞的連接件,譬如一盲配連接器其會提供一熱可栓塞或可交換的連接。該液體連接件120可更包含一例如使用一墊圈及/或一不滴連接器的液體密封物。例如該不滴連接器可包含一內裝塞,俾當該等流體連接件被組合及/或卸解時能防止滲漏。 2 shows a top view of the connection assembly 100 of FIG. 1 in accordance with an example. The connection assembly 100 includes the liquid connection member 120 and the air connection member 140. The liquid connection member 120 is shown to include, for example, a liquid supply 222 and a liquid return 224 disposed in a first position L1. The liquid connector 120, such as the liquid supply 222 and the liquid return 224, can comprise, for example, at least one connector selected from the group consisting of a cable, a hose, and a valve. The cable, hose, or valve may further include a pressure monitor to monitor the pressure and control the liquid. For example, the valve can be kept open by pressure that provides backflow prevention and controls the transfer of liquid between the liquid cooling system and the electronic system. The liquid connector 120 can include a pluggable connector, such as a blind connector that provides a thermally or pluggable connection. The liquid connector 120 can further comprise a liquid seal such as a gasket and/or a drop connector. For example, the drop connector can include a built-in plug that prevents leakage when the fluid connectors are combined and/or disassembled.
該空氣連接件140係被示出包含,例如,一空氣供應器242及一空氣回流器244。該空氣連接件140,譬如一空氣供應器242和一空氣回流器244,可例如包含一管道、一管子、一導管及/或一通氣管。該空氣連接件140可為例如使用密封物、墊圈及/或螺合構件的氣密物。該空氣連接件140亦可具有一阻閘或回流防止器,俾當一空氣冷卻系統被移除時能避免不當的流經一開孔。 The air connector 140 is shown to include, for example, an air supply 242 and an air return 244. The air connection member 140, such as an air supply 242 and an air return 244, may for example comprise a conduit, a tube, a conduit and/or a vent tube. The air connection 140 can be, for example, a gas tight seal using a seal, a gasket, and/or a screw member. The air connector 140 can also have a damper or backflow preventer that prevents improper flow through an opening when an air cooling system is removed.
該介面160可包含一連接構件,譬如一密封物、一墊圈、一螺合構件、一板、平坦構件、或一孔隙,用以承接該液體連接件120和該空氣連接件140。且,該介面160可為一分開的構件或整合於該電子系統,譬如在一性能最佳化資料中心(POD或EcoPOD)的頂部或側面。該介面160可適合供與一液體冷卻系統,一空氣冷卻系統,及/或一液體冷卻系統和一空氣冷卻系統一起使用。若只有一液體冷卻系統或一空氣冷卻系統被使用,則不在使用時,一栓塞或其它連接件可被用來阻塞該介面160的開孔或一部份。 The interface 160 can include a connecting member, such as a seal, a gasket, a screw member, a plate, a flat member, or an aperture for receiving the liquid connector 120 and the air connector 140. Moreover, the interface 160 can be a separate component or integrated into the electronic system, such as at the top or side of a performance optimized data center (POD or EcoPOD). The interface 160 can be adapted for use with a liquid cooling system, an air cooling system, and/or a liquid cooling system and an air cooling system. If only a liquid cooling system or an air cooling system is used, a plug or other connector can be used to block the opening or portion of the interface 160 when not in use.
該連接總成100可更包含添加的連接件,譬如一電源連接件270及/或一控制連接件280。該電源連接件270能在該液體冷卻系統、該空氣冷卻系統、及/或該電子系統之間提供一電力連接。該連接總成100亦可包含一控制連接件280用以提供該液體冷卻系統、該空氣冷卻系統、及/或該電子系統之間的通訊。例如,該控制連接件280除了網路通訊之外並可提供輸入和輸出訊號的控制。該控制連接件280會提供該電子系統與該液體冷卻系統和該空氣冷卻系統之間的同步化及通訊,譬如有關組件之功能,操作之標度,電子組件之溫度,該電子系統及/或該等冷卻系統之周遭環境的溫度及/或濕度,及/或該空氣或液體之壓力等的通訊。 The connection assembly 100 can further include additional connectors, such as a power connector 270 and/or a control connector 280. The power connector 270 can provide a power connection between the liquid cooling system, the air cooling system, and/or the electronic system. The connection assembly 100 can also include a control connector 280 for providing communication between the liquid cooling system, the air cooling system, and/or the electronic system. For example, the control connector 280 can provide control of input and output signals in addition to network communications. The control connector 280 provides synchronization and communication between the electronic system and the liquid cooling system and the air cooling system, such as the function of the component, the scale of operation, the temperature of the electronic component, the electronic system and/or Communication of the ambient temperature and/or humidity of the cooling system and/or the pressure of the air or liquid.
該連接總成100可更包含一安裝構件290來提供該連接總成100與該電子系統、該液體冷卻系統,及/或該空氣冷卻系統間之一連接。該安裝構件290可包含例如具有 插塞或扣持銷之插座,或槽銷等。該安裝構件290會提供調適該連接總成100來配合多種電子系統、空氣冷卻系統、及液體冷卻系統的能力。且,該等安裝構件290會支持該模組化,並使多種空氣冷卻和液體冷卻系統能與該等電子系統一起使用。例如,該設計可提供能夠使用適配於該標準化的連接總成100之庫存液體冷卻系統和空氣冷卻系統的能力。 The connection assembly 100 can further include a mounting member 290 to provide connection between the connection assembly 100 and the electronic system, the liquid cooling system, and/or the air cooling system. The mounting member 290 can comprise, for example, having Plug or pin socket, or slot pin. The mounting member 290 provides the ability to adapt the connection assembly 100 to accommodate a variety of electronic systems, air cooling systems, and liquid cooling systems. Moreover, the mounting members 290 will support the modularization and enable a variety of air cooling and liquid cooling systems to be used with the electronic systems. For example, the design can provide the ability to use an inventory liquid cooling system and an air cooling system that are adapted to the standardized connection assembly 100.
圖3示出一依據一範例之用以提供一電子系統之模組式冷卻的系統300之方塊圖。該系統300包含一液體冷卻系統310、一空氣冷卻系統330、及一連接總成100。該液體冷卻系統310能使用液體冷卻該電子系統。該空氣冷卻系統330能使用空氣冷卻該電子系統。 FIG. 3 illustrates a block diagram of a system 300 for providing modular cooling of an electronic system in accordance with an example. The system 300 includes a liquid cooling system 310, an air cooling system 330, and a connection assembly 100. The liquid cooling system 310 can cool the electronic system using a liquid. The air cooling system 330 can cool the electronic system using air.
圖4示出一依據一範例之圖3的冷卻系統300之示意圖。請參閱圖4,四個冷卻模組A~D係被示出。每個該等冷卻模組A~D係被示為含有自行含裝的液體和空氣供應器及一連接總成100。該連接總成100包含一液體連接件120及一空氣連接件140。該液體連接件120和該空氣連接件140各可在不同的位置提供獨立的連接。例如,該液體連接件120係置設在一第一位置L1來連接於該液體冷卻系統310。該液體連接件120能在該液體冷卻系統310與一電子系統之間提供一第一介面362。例如,該液體連接件120會連接於該電子系統450中之一液體歧管420。該空氣連接件140係置設於一第二位置L2來連接於該空氣冷卻系統330。該空氣連接件140能在該空氣冷卻系統330與該電子系統450之間提供一 第二介面364。例如,該空氣連接件140會連接於該電子系統來提供空氣至一空氣歧管440,其會分配空氣於該電子系統450內。該空氣歧管440可包含設定的導管或通氣管於該電子系統內,或包含空間於會接受該空氣的電子組件352之間。 4 shows a schematic diagram of a cooling system 300 of FIG. 3 in accordance with an example. Referring to Figure 4, four cooling modules A to D are shown. Each of the cooling modules A to D is shown to contain a self-contained liquid and air supply and a connection assembly 100. The connection assembly 100 includes a liquid connection member 120 and an air connection member 140. The liquid connector 120 and the air connector 140 each provide an independent connection at different locations. For example, the liquid connection member 120 is disposed at a first position L1 for connection to the liquid cooling system 310. The liquid connector 120 can provide a first interface 362 between the liquid cooling system 310 and an electronic system. For example, the liquid connector 120 will be coupled to one of the liquid manifolds 420 in the electronic system 450. The air connector 140 is disposed at a second position L2 for connection to the air cooling system 330. The air connector 140 can provide a connection between the air cooling system 330 and the electronic system 450 Second interface 364. For example, the air connection 140 will be coupled to the electronic system to provide air to an air manifold 440 that will distribute air within the electronic system 450. The air manifold 440 can include a set conduit or vent tube within the electronic system or a space between the electronic components 352 that will receive the air.
該等冷卻系統可依據該資料中心負載及/或包圍該資料中心的資料中心環境來被選擇。例如,該資料中心的溫度或濕度或包圍該資料中心的環境可被用來選擇該液體冷卻系統310及/或空氣冷卻系統330,其將會最佳化電源使用和冷卻能力。且,該模組式設計能使該各種液體冷卻系統310和空氣冷卻系統330可由一分開的連接件來接受液體及/或空氣,譬如在一冷卻系統上方的供應器或經由一自含式空氣及/或液體冷卻系統。又,該模組化能使該等液體冷卻系統模組的一部份可由一供應器來接受液體,但該等液體冷卻系統模組的其它部份成為自含式的。例如,若該電子系統450包含一組電子組件密集地封裝,而相較於另一組並非如此密集封裝的電子組件需要一不同溫度或容積的液體。 The cooling systems can be selected based on the data center load and/or the data center environment surrounding the data center. For example, the temperature or humidity of the data center or the environment surrounding the data center can be used to select the liquid cooling system 310 and/or the air cooling system 330, which will optimize power usage and cooling capabilities. Moreover, the modular design enables the various liquid cooling systems 310 and air cooling system 330 to receive liquid and/or air from a separate connector, such as a supply above a cooling system or via a self-contained air. And / or liquid cooling system. Moreover, the modularization enables a portion of the liquid cooling system modules to be received by a supply of liquid, but other portions of the liquid cooling system modules are self-contained. For example, if the electronic system 450 includes a set of electronic components that are densely packed, a different temperature or volume of liquid is required than another set of electronic components that are not so densely packed.
該第一介面362能承接該液體冷卻系統310,且該第二介面364能承接該空氣冷卻系統330。例如,該第一介面362在圖4中係被示為一墊圈或密封物,其可人工地承接一管道、管子及/或閥。同樣地,該第二介面364在圖4中係被示為一墊圈或密封物,其可承接一管道、管子、導管,及/或一通氣管來形成一人工連接。該介面之另擇和變化的 設計亦可被使用。 The first interface 362 can receive the liquid cooling system 310 and the second interface 364 can receive the air cooling system 330. For example, the first interface 362 is shown in FIG. 4 as a gasket or seal that can manually receive a pipe, tube, and/or valve. Similarly, the second interface 364 is illustrated in FIG. 4 as a gasket or seal that can receive a conduit, tube, conduit, and/or a vent tube to form a manual connection. Alternative and varied interface The design can also be used.
例如,該第一介面362可互換地承接選自下列液體冷卻系統之至少一者的多數個液體冷卻系統310:一絕熱液體冷卻器、一「乾冷卻式」液體裝置、一外部供應的冷部劑、一熱交換器、一外部供應的冷卻單元直接連接於電子組件、及一直接膨脹液體冷卻裝置。該第二介面364可互換地承接選自下列空氣冷卻系統之至少一者的多數個空氣冷卻系統330:一直接膨脹空氣冷卻裝置、一絕熱冷卻裝置、一外部空氣感應裝置、一設備空氣冷卻裝置、及一具有設備冷卻水的熱交換器。藉使用獨立的連接件,該系統可被設計成能使用多種液體冷卻系統310和空氣冷卻系統330,它們可視該電子系統及/或該裝備之周遭環境的需要而被互換或交換。 For example, the first interface 362 interchangeably accepts a plurality of liquid cooling systems 310 selected from at least one of the following liquid cooling systems: an insulated liquid cooler, a "dry cooled" liquid device, and an externally supplied cold portion. The agent, a heat exchanger, and an externally supplied cooling unit are directly connected to the electronic component and a directly expanding liquid cooling device. The second interface 364 interchangeably receives a plurality of air cooling systems 330 selected from at least one of the following air cooling systems: a direct expansion air cooling device, an adiabatic cooling device, an external air sensing device, and an equipment air cooling device. And a heat exchanger with equipment cooling water. By using separate connectors, the system can be designed to use a variety of liquid cooling systems 310 and air cooling systems 330 that can be interchanged or exchanged as needed by the electronic system and/or the surrounding environment of the equipment.
該等介面160,即該第一介面362和第二介面364,可在該電子系統450的頂部,如圖6中所示,或其可在該電子系統450之一側面或背面。例如,該介面如在圖2和4中所示,可在該電子系統450的頂部、底部、側面或背面。該介面160能承接該液體連接件120和該空氣連接件,及/或一介面具有該等液體連接件120和該空氣連接件140連接於它。 The interfaces 160, i.e., the first interface 362 and the second interface 364, may be on top of the electronic system 450, as shown in FIG. 6, or may be on one side or the back of the electronic system 450. For example, the interface can be on the top, bottom, side or back of the electronic system 450 as shown in Figures 2 and 4. The interface 160 can receive the liquid connector 120 and the air connector, and/or an interface having the liquid connector 120 and the air connector 140 coupled thereto.
添加的介面可被提供。例如,該連接總成100可更包含一電源介面467連接於該電源母線,即電源連接件270來提供該液體冷卻系統310與該電子系統450,及/或該空氣冷卻系統310與該電子系統450間之一電力連接。該連 接總成100可更包含一控制介面468連接於該控制連接件280,譬如一控制母線,來提供該液體冷卻系統310與該電子系統450,及/或該空氣冷卻系統330與該電子系統450之間的通訊。例如,該控制母線可提供通訊,其會協調該液體冷卻系統310和該空氣冷卻系統330。例如,可有一組監視器來管理該冷卻系統及/或該電子系統的溫度、功率/電輸出、壓力、及/或功能。 The added interface can be provided. For example, the connection assembly 100 can further include a power supply interface 467 connected to the power bus, that is, the power connection 270 to provide the liquid cooling system 310 and the electronic system 450, and/or the air cooling system 310 and the electronic system. One of the 450 rooms is electrically connected. The company The assembly 100 can further include a control interface 468 coupled to the control connector 280, such as a control bus, to provide the liquid cooling system 310 and the electronic system 450, and/or the air cooling system 330 and the electronic system 450 Communication between. For example, the control bus can provide communication that will coordinate the liquid cooling system 310 and the air cooling system 330. For example, there may be a set of monitors to manage the temperature, power/electrical output, pressure, and/or function of the cooling system and/or the electronic system.
又,該模組式設計會使該冷卻系統的安裝更容易且可調整。例如,相對於較大的非模組式系統,該等組件可呈模組來被安裝。一堆高機或一小起重機可以取代較大的起重機或設備來被使用。此外,該模組式設計可容許調整該等滲漏管理和故障管理組件。 Also, the modular design makes the installation of the cooling system easier and adjustable. For example, the components can be installed in modules relative to larger non-modular systems. A stack of tall or small cranes can be used instead of larger cranes or equipment. In addition, the modular design allows for the adjustment of such leak management and fault management components.
圖5示出一依據一範例之模組式冷卻系統300的方塊圖。該模組式冷卻系統300包含一液體冷卻系統310、一空氣冷卻系統330、一可交換液體連接件520、及一可交換空氣連接件540。該液體冷卻系統310能使用液體冷卻該電子系統450。該空氣冷卻系統330能使用空氣冷卻該電子系統450。該可交換液體連接件520能提供一液體連接件,其係可與多數的液體冷卻系統310相容。該可交換液體連接件520能配接該液體冷卻系統310與該電子系統450。例如,該可交換液體連接件520可包含一盲配連接器,能與一液體冷卻系統上之一液體連接件配接。或者,該連接件可被使用一以人工插入其中的管道、管子及/或閥來人工地形成。 FIG. 5 illustrates a block diagram of a modular cooling system 300 in accordance with an example. The modular cooling system 300 includes a liquid cooling system 310, an air cooling system 330, an exchangeable liquid connection 520, and an exchangeable air connection 540. The liquid cooling system 310 can cool the electronic system 450 using a liquid. The air cooling system 330 can cool the electronic system 450 using air. The exchangeable liquid connection 520 can provide a liquid connection that is compatible with most liquid cooling systems 310. The exchangeable liquid connection 520 can be coupled to the liquid cooling system 310 and the electronic system 450. For example, the exchangeable liquid connection 520 can include a blind mating connector that can be mated with a liquid connection on a liquid cooling system. Alternatively, the connector can be manually formed using a pipe, tube and/or valve manually inserted therein.
該可交換空氣連接件540能提供一空氣連接件, 其係可與多數的空氣冷卻系統330相容。該可交換空氣連接件540能配接該空氣冷卻系統330與該電子系統450。該空氣連接件140可包含一盲配連接件,其須要該連接係藉將二物體併在一起來造成。或者,一機械連接件可被以一人工連接步驟及/或一槓桿或其它機械來使用,其須要該使用者定位二物體然後藉由一添加的步驟連結它們而來完成該連接。使用盲配連接件或機械連接件等乃視該電子系統450及/或該空氣冷卻系統330的設計而定。又,該可交換液體連接件520和該可交換空氣連接件可提供熱可交換連接給該液體冷卻系統310和該空氣冷卻系統330。該等熱可交換連接件能使該等冷卻系統成為可互換的,而不必改變該電子系統。例如,該冷卻系統可被換出來被修理、保養及/或更換。 The exchangeable air connection 540 can provide an air connection. It is compatible with most air cooling systems 330. The exchangeable air connection 540 can be coupled to the air cooling system 330 and the electronic system 450. The air connector 140 can include a blind mating connector that requires the attachment to be created by bringing the two objects together. Alternatively, a mechanical connector can be used in a manual connection step and/or a lever or other mechanism that requires the user to position the two objects and then join them by an additional step to complete the connection. The use of blind mating connectors or mechanical connectors, etc., depends on the design of the electronic system 450 and/or the air cooling system 330. Again, the exchangeable liquid connection 520 and the exchangeable air connection provide a thermally exchangeable connection to the liquid cooling system 310 and the air cooling system 330. The heat exchangeable connectors enable the cooling systems to be interchangeable without having to change the electronic system. For example, the cooling system can be swapped out for repair, maintenance, and/or replacement.
圖6示出依據一範例之圖5的模組式冷卻系統300之一截面圖。該模組式冷卻系統300包含一液體冷卻系統310被示為包含一液體供應器222及一液體回流器224。該可交換液體連接件520可包含該第一介面362被示為一盲配連接器,會與例如設在該液體冷卻系統310上,譬如該液體供應器222和該液體回流器224上之一管道、一管子、一閥、一墊圈及/或一密封物等配接。該盲配連接器可更經由連接於該盲配連接器之一管道、一管子、或一閥652、653來將該液體冷卻系統310連接於該電子系統450。該可交換液體連接件520可另擇地包含一如前所述的人工連接件,乃視其設計而定。 FIG. 6 illustrates a cross-sectional view of the modular cooling system 300 of FIG. 5 in accordance with an example. The modular cooling system 300 includes a liquid cooling system 310 that is shown to include a liquid supply 222 and a liquid return 224. The exchangeable liquid connection 520 can include the first interface 362 as a blind mating connector that can be disposed, for example, on the liquid cooling system 310, such as one of the liquid supply 222 and the liquid return 224. A pipe, a pipe, a valve, a gasket and/or a seal are mated. The blind mating connector can connect the liquid cooling system 310 to the electronic system 450 via a conduit, a tube, or a valve 652, 653 that is coupled to the blind mating connector. The exchangeable liquid connection 520 can alternatively include a manual attachment as previously described, depending on the design.
該液體冷卻系統310係被示為包含一液體源620能提供液體至該電子系統450並由之接收液體。該液體源620可連接於一設備,俾在一錯誤或一優先需要的情況下來提供一優先及/或後備的液體供應和液體回流。該液體源620包含一供應線622及一回流線624。 The liquid cooling system 310 is shown to include a liquid source 620 that provides liquid to and receives liquid from the electronic system 450. The liquid source 620 can be coupled to a device to provide a preferential and/or backup liquid supply and liquid reflux in the event of an error or a prioritized need. The liquid source 620 includes a supply line 622 and a return line 624.
該空氣冷卻系統330係被示為包含一空氣供應器242及一空氣回流器244。該可交換空氣連接件540可包含一第二介面364被示為一盲配連接器。例如,該空氣供應器242和該空氣回流器244可包含一管道、一管子、一導管及/或一通氣管,其會將該盲配連接器連接於該空氣冷卻系統330。來自該空氣冷卻系統330的空氣會被使用該等電子組件655周圍的空間654來循環通過該電子系統。該可交換空氣連接件540可另擇地包含一如前所述的人工連接件,乃視其設計而定。 The air cooling system 330 is shown to include an air supply 242 and an air return 244. The exchangeable air connector 540 can include a second interface 364 that is shown as a blind mating connector. For example, the air supply 242 and the air return 244 can include a conduit, a tube, a conduit, and/or a vent tube that will connect the blind mating connector to the air cooling system 330. Air from the air cooling system 330 is circulated through the electronic system using a space 654 around the electronic components 655. The exchangeable air connection 540 can alternatively include a manual attachment as previously described, depending on its design.
該空氣冷卻系統330係被示為包含一些空氣源640能提供空氣至該電子系統450並由之接收空氣。該空氣源640可連接於一設備,俾當有一錯誤或一優先需要時,能提供一優先及/或後備系統,其會使用該空氣供應線642和該空氣回流線644來分配該空氣。 The air cooling system 330 is shown to include some air source 640 that can provide air to and receive air from the electronic system 450. The air source 640 can be coupled to a device that provides a priority and/or backup system that uses the air supply line 642 and the air return line 644 to distribute the air when there is an error or a priority.
該電子系統450係被示為例如一性能最佳化資料中心(POD或EcoPOD)。該電子系統450可包含電子組件652等,譬如高密度伺服器。該等電子組件652係被示為正被使用該液體冷卻系統310和該空氣冷卻系統330來冷卻。該液體冷卻系統310係藉由管子或管道連接於該等電子組件 652,該等管會將該液體沿該液體供應器222輸送至該等冷板620。該液體可被以不同的途徑輸送,該介面連接件會為要被提供或適合被提供至該電子系統450的液體提供一標準化的位置,而能使用各種不同的液體冷卻系統。該等冷板620可被用來由該等電子組件652移除熱。當熱被由該等電子組件655移除時,該熱會移轉至該液體,且該液體會經由該液體回流器224返回至該液體冷卻系統310。 The electronic system 450 is shown, for example, as a performance optimized data center (POD or EcoPOD). The electronic system 450 can include electronic components 652 and the like, such as a high density server. The electronic components 652 are shown as being being cooled using the liquid cooling system 310 and the air cooling system 330. The liquid cooling system 310 is connected to the electronic components by pipes or pipes 652, the tubes transport the liquid along the liquid supply 222 to the cold plates 620. The liquid can be delivered in a different manner, the interface connector providing a standardized position for the liquid to be provided or adapted to be provided to the electronic system 450, and a variety of different liquid cooling systems can be used. The cold plates 620 can be used to remove heat from the electronic components 652. When heat is removed by the electronic components 655, the heat is transferred to the liquid and the liquid is returned to the liquid cooling system 310 via the liquid return 224.
該空氣冷卻系統330係經由該等管道、管子、導管或通氣管連接於該等電子組件652,該等管會將空氣輸送至該等電子組件652並由該電子系統450移除該空氣。例如,該空氣可經由空氣歧管來被提供。該空氣供應器242和該空氣回流器244各會提供一可交換空氣連接件540來形成該空氣冷卻系統與該電子系統之間的連接,並能通過其中來傳輸該空氣。 The air cooling system 330 is coupled to the electronic components 652 via the conduits, tubes, conduits, or vents that deliver air to the electronic components 652 and are removed by the electronic system 450. For example, the air can be provided via an air manifold. The air supply 242 and the air return 244 each provide an exchangeable air connection 540 to form a connection between the air cooling system and the electronic system and to transfer the air therethrough.
請參閱圖6,一電源連接件270及一控制連接件280亦被示出。該電源連接件270係被示為一電源母線,其會提供電力至該液體冷卻系統310和空氣冷卻系統330。該電源母線可包含一電源介面467,其會將該電源母線連接於該電子系統450內之一電源線657。一電源670亦被示出可連接於一設備,並提供額外的電力及/或備用電力。 Referring to Figure 6, a power connector 270 and a control connector 280 are also shown. The power connector 270 is shown as a power bus that provides power to the liquid cooling system 310 and the air cooling system 330. The power bus may include a power interface 467 that connects the power bus to a power line 657 within the electronic system 450. A power source 670 is also shown to be connectable to a device and provides additional power and/or backup power.
該控制連接件280係被示為一控制母線,其會提供該液體冷卻系統310、該空氣冷卻系統330、及該電子系統450之間的通訊。該控制母線可包含一控制介面468,其會將該控制母線連接於該電子系統450內之一控制線658。 一控制源680亦被示出能連接於一設備,並提供一用於後備控制、優先狀況的額外控制訊號,及/或與該設備的額外通訊選擇。 The control connector 280 is shown as a control bus that provides communication between the liquid cooling system 310, the air cooling system 330, and the electronic system 450. The control bus can include a control interface 468 that connects the control bus to one of the control lines 658 within the electronic system 450. A control source 680 is also shown to be coupled to a device and provides an additional control signal for backup control, priority status, and/or additional communication options with the device.
本揭露已被使用其舉例之非限制性詳細說明來描述,且無意要限制本揭露的範圍。應請瞭解針對一例所述的特徴及/或操作亦可用於其它之例,且並非本揭露的所有各例皆具有在一特定圖中所示或針對一例所述的全部該等特徴及/或操作。所述之例的變化將會發生於該專業人士。又,該「包含」、「包括」、「具有」等措詞及它們的配應用語,當使用於本揭露及/或申請專利範圍中時,應意為「包括但不必然限制於」。 The present disclosure has been described by way of non-limiting detailed description, and is not intended to limit the scope of the disclosure. It should be understood that the features and/or operations described for one example may be used in other examples, and not all of the examples disclosed herein have all such features and/or described in one particular figure. operating. Changes in the described examples will occur to the professional. In addition, the terms "including", "including", "having" and "comprising" are used to mean "including but not necessarily limited to" when used in the context of the disclosure and/or claims.
請注意某些上述之例可能包含結構,結構的行為或細節,及動作等,其對本揭露可能不是必要的,而是意要作為舉例。所述的結構和行為等係可被以等同者替代,其會執行相同的功能,即便該等結構或行為是不同的,而如該技術中所習知者。因此,本揭露的範圍係僅由申請專利範圍中所用的元件和限制等來界限。 Please note that some of the above examples may include structures, structural acts or details, and actions, etc., which may not be necessary for this disclosure, but are intended as examples. The structures and behaviors described may be replaced by equivalents, which perform the same function even if the structures or acts are different, as is known in the art. Therefore, the scope of the present disclosure is limited only by the elements and limitations used in the claims.
120‧‧‧液體連接件 120‧‧‧Liquid connectors
140‧‧‧空氣連接件 140‧‧‧Air connectors
160‧‧‧介面 160‧‧‧ interface
222‧‧‧液體供應器 222‧‧‧Liquid supply
224‧‧‧液體回流器 224‧‧‧Liquid reflux
242‧‧‧空氣供應器 242‧‧‧Air supply
244‧‧‧空氣回流器 244‧‧‧Air return
270‧‧‧電源連接件 270‧‧‧Power connector
280‧‧‧控制連接件 280‧‧‧Control connectors
290‧‧‧安裝構件 290‧‧‧Installation components
L1‧‧‧第一位置 L1‧‧‧ first position
L2‧‧‧第一位置 L2‧‧‧ first position
Claims (15)
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20130233532A1 (en) * | 2012-03-08 | 2013-09-12 | Google Inc. | Controlling data center cooling |
US20140029193A1 (en) * | 2012-07-27 | 2014-01-30 | International Business Machines Corporation | Computer system cooling using an externally-applied fluid conduit |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20130233532A1 (en) * | 2012-03-08 | 2013-09-12 | Google Inc. | Controlling data center cooling |
US20140029193A1 (en) * | 2012-07-27 | 2014-01-30 | International Business Machines Corporation | Computer system cooling using an externally-applied fluid conduit |
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