TWI606324B - Electronic device and manufacturing method thereof - Google Patents

Description

Electronic device and method of manufacturing same

The present invention relates to an electronic device, and more particularly to an electronic device and a method of fabricating the same.

The structure of an electronic product can be roughly divided into a skeleton, a casing, a display screen, and a circuit board. In actual production, the board is assembled on the bobbin, and then components such as the display screen and the casing are assembled. However, when all components need to be assembled separately and then assembled, this leads to a cumbersome production process and also increases production time. Therefore, how to simplify the production process is a concern of the manufacturer.

The present invention refers to an electronic device for increasing its production yield.

The present invention refers to an electronic device manufacturing method which has a good production yield.

The electronic device of the present invention comprises a circuit board, at least one electronic component, and a Protective body and a casing. The electronic components are arranged on the circuit board. The protective body is coated on the electronic component and the circuit board. The casing covers the circuit board and the protection body.

The electronic device manufacturing method of the present invention comprises the following steps. A circuit board and at least one electronic component are provided, wherein the electronic component is mounted on the circuit board. A protective body is formed on the circuit board to cover the electronic components on the circuit board. A casing is formed by insert injection molding to cover the circuit board and the protective body.

Based on the above, in the present invention, the protective body is first coated on the electronic component mounted on the circuit board to resist the high temperature and high voltage during the embedding molding process which is later implemented, thereby protecting the electronic components covered in the protective body to avoid Damage or failure of electronic components. Therefore, the present invention can form and cover the circuit board and the electronic component by the embedded injection molding of the housing of the electronic device, thereby saving the time for the housing and the circuit board to be assembled with each other.

The above described features and advantages of the invention will be apparent from the following description.

102‧‧‧PCB

104‧‧‧Electronic components

106‧‧‧Protection

108‧‧‧Shell

110‧‧‧ Display screen

112‧‧‧ button

120‧‧‧Electronic devices

S110, S120, S130‧‧‧ steps

FIG. 1 is a flow chart showing a method of manufacturing an electronic device according to an embodiment of the present invention.

2A is a schematic view of a circuit board in which electronic components are mounted in FIG. 1.

FIG. 2B is a schematic view showing the protective body covering the circuit board and the electronic components in FIG. 1. FIG.

2C is a schematic view showing the casing covered circuit board and the electronic components in FIG.

The electronic device manufacturing method of the present embodiment will be described below in conjunction with the flowchart of FIG. 1 and FIGS. 2A to 2C.

Referring to FIG. 1 and FIG. 2A, in step S100, a circuit board 102 and a plurality of electronic components 104 are provided. These electronic components 104 are mounted on the circuit board 102. The circuit board 102 can be a flexible circuit board or a printed circuit board.

Referring to FIG. 1 and FIG. 2B, in step S200, a protective body 106 is formed on the circuit board 102 to cover the electronic components 104 on the circuit board 102.

Referring to FIG. 1 and FIG. 2C, in step S300, a casing 108 is formed by insert injection molding to cover the circuit board 102 and the protective body 106, wherein the casing 108 constitutes an appearance of the electronic device 120. The material of the housing 108 can be made of plastic or rubber.

It is to be noted that since the protective body 106 can withstand the injection pressure of the insert injection molding for making the casing 108, damage of the electronic components 104 covered by the protective body can be avoided. At the same time, the housing 108 can be formed directly on the periphery of the circuit board 102 and the electronic component 104 by the embedded injection molding, so that the time during which the housing 108 and the wiring board 102 are assembled with each other can be saved.

In the present embodiment, the step S200 of forming the protective body 106 may include thermoforming. The thermoforming working pressure is lower than the working pressure of the embedded injection molding. Moreover, the subsequent operating temperature of the embedded injection molding process does not soften the protective body 106. Thus, the protective body 106 can protect these electronic components 104 in a subsequent process of insert injection molding. For example, thermoformed The working temperature is between 180 degrees Celsius and 240 degrees Celsius, and the working pressure is between 0.01 mpa and 5 mpa, preferably between 0.01 mpa and 1 mpa, and more preferably between 0.01 mpa and 0.1 m. Between mpa. In short, the smaller the working pressure, the less likely it is to cause damage to the electronic component 104.

In the present embodiment, the step S200 of forming the protective body 106 may include the following steps. First, an optical adhesive is applied to the wiring board 102 and the electronic components 104 by dispensing, and then the optical adhesive is cured by irradiating ultraviolet light to the optical adhesive to form a protective body. Likewise, the subsequent operating temperature of the embedded injection molding process does not soften the protective body 106 formed by the dispensing process. Thus, the protective body 106 can protect these electronic components 104 in a subsequent process of insert injection molding.

The process temperature for embedded injection molding is approximately between 170 degrees Celsius and 200 degrees Celsius, and the working pressure is approximately between 40 mPa and 60 mPa.

In the present embodiment, in the step S300 of forming the casing 108 by insert injection molding, the casing 108 partially covers a display screen 110. Meanwhile, in the step of forming the casing 108 by insert injection molding, the casing 108 more partially covers the plurality of keys 112. The display screen 110 can be a flexible display such as an organic light emitting display or an electronic paper display.

In summary, in the present invention, the protective body is first coated on the electronic component mounted on the circuit board to resist the high temperature and high voltage during the embedding molding process which is later implemented, thereby protecting the electronic components covered in the protective body. To avoid damage or failure of electronic components. Therefore, the present invention allows the housing of the electronic device to be formed by embedded injection molding. The circuit board and the electronic components are formed and covered, so that the time for assembling the housing and the circuit board can be saved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

S110, S120, S130‧‧‧ steps

Claims (14)

An electronic device comprising: a circuit board; at least one electronic component disposed on the circuit board; a protective body covering the electronic component and the circuit board; and a casing covering the circuit board and the protection a body, wherein the protective body has a melting point greater than a melting point of the shell. The electronic device of claim 1, wherein the circuit board comprises a flexible circuit board or a printed circuit board. The electronic device of claim 1, wherein the material of the housing comprises plastic or rubber. The electronic device of claim 1, further comprising: a display screen partially covered by the housing. The electronic device of claim 1, further comprising: at least one button, partially covered by the housing. The electronic device of claim 1, wherein the housing is part of the appearance of the electronic device. An electronic device manufacturing method includes: providing a circuit board and at least one electronic component, wherein the at least one electronic component is mounted on the circuit board; forming a protection body on the circuit board to cover the circuit board The at least one electronic component; A casing is formed by insert injection molding to coat the circuit board and the protective body, wherein the protective body has a melting point greater than a melting point of the casing. The method of manufacturing an electronic device according to claim 7, wherein the circuit board comprises a flexible circuit board or a printed circuit board. The method of manufacturing an electronic device according to claim 7, wherein the step of forming the protective body comprises thermoforming. The method of manufacturing an electronic device according to claim 9, wherein the working temperature and pressure of the thermoforming are respectively lower than an operating temperature and a working pressure of the embedded injection molding. The method of manufacturing the electronic device of claim 7, wherein the forming the protective body comprises: coating an optical adhesive on the at least one electronic component and the circuit board by dispensing; The optical glue illuminates the optical glue to illuminate the optical glue. The method of manufacturing an electronic device according to claim 7, wherein the protective body is made of plastic or rubber. The method of manufacturing an electronic device according to claim 7, wherein in the step of forming the protective body by insert injection molding, the protective body partially covers a display screen. The electronic device manufacturing method according to claim 7, wherein in the step of forming the protective body by insert injection molding, the protective body partially covers at least one button.