TWI606248B - Optical alignment device and alignment method - Google Patents

Description

Optical alignment device and alignment method thereof

The invention relates to an optical alignment device and a aligning method thereof; in particular, a light detecting module receives light outputted by an optical module, and displays different values in conjunction with the display to assist a person to operate and adjust the optical module, thereby obtaining The technology of the ideal location.

It is a well-known technique to use an optical lens (for example, a Fresnel lens) to combine a solar cell module or a wafer having a photoelectric conversion function to collect a light collecting module of incident light. Conventional light collection modules include a combination of optical lenses or primary optical components (or concentrators or SILICONE ON GLASS, SOG for short), optical covers, and backplanes. For example, US 7473000 B2 "SHIELD FOR SOLAR RADIATION COLLECTOR", and US 2009/0320923 "PHOTOVOLTAIC CONCENTRATING APPARATUS" patents, etc., provide typical embodiments. Or using a light-emitting chip, a light emitting diode (LED) to form a light source or a lighting device, has also been widely used in many occasions or environments. For example, US 2007/0284563 A1 "LIGHT EMITTING DEVICE INCLUDING RGB LIGHT EMITTING DIODES AND PHOSPHOR" provides a possible embodiment.

The old method also discloses that a plurality of light collecting wafers are fixed on a glass substrate to form an array solar receiver, a combined aluminum base plate, and a mating frame is disposed between the aluminum base plate and the optical cover (or SOG), and the above components are A fixed combination is used to obtain a large number of types of light collecting systems that collect incident light. For example, US 2009/0126794 A1 "Photovoltaic Concentrator Module With Multifunction Frame", US 2009/0199890 "Solar Cell Receiver For Concentrated Photovoltaic System For III-V Semiconductor Solar Cell", and US 2009/0223555 "High Efficiency Concentrating Photovoltaic Module Method And" The Apparatus and the like provide a possible embodiment.

As those skilled in the art are aware, the above-mentioned concentrating systems using a combination of aluminum base plates and frames have cumulative errors in processing; the cumulative error is usually greater than the optical tolerance error, and is greatly It affects or reduces the stability of the conversion efficiency and power generation efficiency of the light collecting system.

In order to reduce the above assembly error, the prior art is to manually adjust the position of the glass substrate in the aluminum base plate and the frame, and position the wafer in the correct position or set position, and align the optical lens as much as possible (or once). Optical components), it is desirable to achieve accurate assembly parallelism.

One subject related to this type of repetitive operation adjustment is that the conventional technique also applies secondary optics or LED output light through an optical lens to see if the light is focused on the center of the wafer, avoiding the incidence of light or the optical path falling on the wafer (or The non-central area of the battery module reduces the efficiency of the light collection.

However, as those skilled in the art know, when a person observes the position of light incident on the wafer from outside the illumination system or the light collection system, the assembly height of the illumination system or the light collection system causes the person to observe the wafer at the bottom position. When, a visual error occurs. The high degree of visual error can affect the accuracy of the person's judgment of the wafer position, which is not what we would expect.

Representatively, these references show the art of assembly, application, and application of light sources, optical components, or illuminating/light concentrating systems; they also reflect the fact that these optical components or concentrating systems are used in certain assembly applications. Some problems, such as processing and assembly errors of the illuminating/collecting module or system, and high visual errors observed by personnel, increase the frequency at which personnel repeatedly operate to adjust the position of the wafer and the glass substrate. Therefore, it is considered to provide a wafer aligning device and a aligning method capable of assisting a person in assembling a illuminating/collecting system to improve the problems of the above-mentioned prior art; and the wafer aligning device and the aligning method can be displayed Scientific data or numerical values to guide personnel in obtaining the correct location or planned location of the wafer. None of these topics have been taught or specifically disclosed in the above references.

Therefore, the main object of the present invention is to provide an optical alignment device and a alignment method thereof, which provide functions for facilitating operation, improving visual errors of personnel, and affecting the correct position of the wafer. The invention comprises a combination of a light detecting module and a first optical component; the light detecting module has a sensor and a display connected to the sensor, so that the center of the sensor and the center of the first optical component are correspondingly disposed on the same reference axis. And, an optical module is provided having a wafer for selectively outputting light and a second optical element disposed on the light output path. The first optical component focuses and directs the light outputted by the wafer to the sensor of the light detecting module; according to the position where the light is focused on the sensor, the display displays different values, and provides guidance for the person to adjust the correct position or ideal position of the wafer. .

An optical alignment device according to the present invention comprises a plurality of wafers disposed on a glass substrate; and a frame assembly substrate and an optical array module comprising a plurality of optical lenses (or second optical elements). Moreover, the wafer and the substrate are housed in the frame such that each wafer corresponds to each optical lens (or second optical element) to form a solar array receiving module.

In the embodiment, the optical array module is provided (correspondingly) with a plurality of light detecting modules and first optical elements. When the light outputted by each of the chips passes through the optical array module and the first optical component, the light is focused on the sensor of the light detecting module; and the display displays individual values or numerical sums, and provides guidance to adjust the optical array module. Or the role of the ideal position of the wafer to improve the situation in which human observations produce visual errors.

The optical alignment method according to the present invention comprises: an operation (A), providing a light detecting module, and a first optical component combining optical module; the light detecting module has a sensor and a display connected to the sensor, so that the sensor center and The centers of the first optical elements are correspondingly disposed on the same reference axis. The optical module is a light emitting module or a solar light collecting module having a wafer for selectively outputting light and a second optical component; the second optical component and the first optical component are disposed on a path of the output light of the wafer. In operation (B), the illuminating wafer or the photoelectric conversion function of the wafer outputs light through the second optical element and the first optical element. The first optical component focuses the light output from the wafer to the sensor of the light detecting module; the light spot and the light spot fall on the position of the sensor according to the light focusing, so that the display displays different values. And, in operation (C), the person adjusts the wafer position according to the above numerical values to obtain the correct position or ideal position of the wafer.

Referring to Figures 1, 2 and 3, the optical alignment device of the present invention comprises a combination of a light detecting module and a first optical component; respectively, designated by reference numerals 30, 10. The light detecting module 30 can select an illuminometer that detects illuminance of the illuminance, an integrating sphere that detects the illuminance of the light, or the like. The light detecting module 30 is disposed at a position above the first optical element 10 in cooperation with the bracket 45, and includes an inductor 31 and a display 32 connected to the inductor 31. In the embodiment taken, the first optical element 10 may select a convex optical lens or a Fresnel lens such that its convex or lens rib 11 faces the direction of the inductor 31 and center the inductor 31 It is disposed on the same reference axis X corresponding to the center of the first optical element 10.

In a possible embodiment, the height and positional considerations of the inductor 31 are set at a position where the light is focused after passing through the first optical element 10. And, the spot formed by the focus of the light falls on different positions of the sensor 31, and the display 32 displays different data or values; this portion will be described later.

The light detecting module 30 and the first optical component 10 can also be disposed or combined on an optical module 100. The optical module 100 can select a wafer with photoelectric conversion function to form a light collecting module or a solar receiving module for collecting incident light, or select a light emitting chip, a light emitting diode (LED) to form a light source/ Lighting device or lighting module.

In the embodiment taken, the optical module 100 selects the light collecting module as an illustrative embodiment, including the frame 40, the bottom plate 41, and the second optical element 20. The wafer 50 can be bonded or fixed to the substrate 55; the wafer 50 and/or the substrate 55 are disposed on the substrate 41, and the second optical element 20 is disposed at a position above the wafer 50 in cooperation with the frame 40. The wafer 50 is selectively electrically connected to generate an output light; and the second optical element 20 and the first optical element 10 are disposed correspondingly on the path of the output light of the wafer 50, so that the second optical element 20 is in the A position below the optical element 10. The substrate 55 is selected from a glass material to form a planar sheet structure.

Figures 1, 2 and 3 also depict the second optical element 20 selecting a convex optical lens or a Fresnel lens with its convex or lens tang 21 facing the convex surface opposite the first optical element 10. Or the direction of the lens rib 11 or the direction in which the convex or lens rib 21 of the second optical element 20 faces the wafer 50. The first optical element 10 can be disposed at a set height from the second optical element 20, or the first optical element 10 can be directly fixed to the second optical element 20. And, the range or area of the lens ridges 21 of the second optical element 20 is larger than the range or area of the lens ribs 11 of the first optical element 10.

Referring to FIG. 3, in order to determine the ideal position or the correct position of the wafer 50 in the optical module 100 (or the light collection module), the wafer 50 is electrically connected to output the light 51. When the light ray 51 passes through the second optical element 20, a parallel light beam (or a light beam having a divergent angle) is formed into the first optical element 10; the light ray 51 is focused by the first optical element 10, directed to the inductor 31, and passed through the display. 31 shows the value. In essence, the spot formed by focusing according to the light 51 falls at different positions of the sensor 31, and the display 32 displays different data or values, providing a person to observe the ideal optimal position or correct position of the wafer 50.

In practice, when the spot of light 51 that reaches the sensor 31 falls to the center of the sensor 31, its value (for example, 456 lux) may be higher or larger than the value of the spot falling on other areas of the sensor 31. (for example, 310~435 lux). Therefore, the person can adjust the position of the wafer 50 or the substrate 55, match the value displayed by the display 32, observe and judge whether the light spot falls on the central area of the inductor 31, and obtain the ideal position or the correct position of the wafer 50. The desired or correct position of the wafer 50 allows the wafer 50 to achieve maximum efficiency in collecting sunlight.

That is to say, the light detecting module 30 and the first optical component 10 cooperate with the structural form of the second optical component 20 and the wafer 50, and provide scientific data or numerical values, so that the mechanism for adjusting the position of the wafer 50 can be completely solved. Knowing the skill creates a situation where the person has a high degree of visual error.

Figure 3 also shows the situation where the center of the second optical element 20 and the position of the wafer 50 (center) are located on the reference axis X.

Referring to FIG. 4, the range or area of the lens ridge 21 (or convex surface) based on the second optical element 20 is larger than the range or area of the lens rib 11 (or convex surface) of the first optical element 10, and thus even light detection The module 30 and the reference axis X of the first optical element 10 are offset or not aligned with the position of the second optical element 20 and the wafer 50, and the second optical element 20 can still direct the light 51 output from the wafer 50 to the first optical element 10; The light 51 is focused by the first optical element 10, directed to the sensor 31, and displayed in conjunction with the display 31.

The above embodiment discloses that the optical module 100 and the first optical component 10 are combined with the optical module 100. When the position of the optical module 100 or the second optical component 20 is not aligned with the reference axis X, the user can still reach the display according to the display 32. The displayed value is observed and judged whether or not the spot falls on the central area of the sensor 31 to adjust the position of the wafer 50. This facilitates the combination of the light detecting module 30, the first optical component 10, and the optical module 100, and reduces the number of people in order to align the combined light detecting module 30, the first optical component 10, and the optical module 100. The difficulty also increases the convenience of the application of the optical alignment device.

Referring to FIGS. 5 and 6, in a modified embodiment, a plurality of wafers 50 are respectively disposed on a plurality of substrates 55 such that a plurality of wafers 50 and a plurality of substrates 55 are disposed together on a sub-board 56; The frame 40 combines the bottom plate 41 and a plurality of optical lenses (or second optical elements 20). Moreover, the wafer 50, the substrate 55 and the sub-board 56 are housed in the frame 40 and the bottom plate 41, so that each wafer 50 corresponds to each optical lens (or second optical element 20) to form a solar array receiving mode. Group 500.

In the embodiment, the plurality of light detecting modules 30 and the first optical component 10 are correspondingly disposed above the solar array receiving module 500. For example, the light detecting module 30 and the first optical component 10 are respectively disposed at four corners or triangular positions of the solar array receiving module 500, or at the positions of the horizontal axis and the vertical axis of the surface of the solar array receiving module 500. Or a pattern in which each of the light detecting modules 30 and the first optical element 10 is disposed at a position above each of the second optical elements 20.

In a possible embodiment, the sensor 31 of the light detecting module 30 can be connected to the computer 60. After the light output from each of the wafers 50 passes through the second optical component 20 of the solar array receiving module 500, the first optical component 10 focuses the light 51 on the sensor 31 of the light detecting module 30; and, via the computer 60 display Displaying individual values or summation of values, providing guidance to the person to adjust the position of the substrate 55 or the sub-board 56 within the solar array receiving module 500 to obtain the desired position or correct position of the wafer 50, and to achieve accurate assembly parallelism, Improve the situation in which human observations produce visual errors.

Referring to FIG. 7, the present invention further includes an optical alignment method; the optical alignment method includes: an operation (A), providing a light detecting module 30, and combining the optical module 100 of the first optical component 10 (or a solar array) The receiving module 500); the light detecting module 30 has a sensor 31 and a display 32 (or a computer 60) connected to the sensor 31, and the center of the sensor 31 and the center of the first optical element 10 are correspondingly disposed on the same reference axis X. The optical module 100 has a wafer 50 and a second optical element 20 that selectively output light rays 51; the second optical element 20 and the first optical element 10 are disposed on a path of the wafer 50 outputting light 51.

In operation (B), the wafer 50 (electrically connected) outputs light 51 through the second optical element 20 and the first optical element 10. The first optical component 10 focuses the light 51 output from the wafer 50 to the sensor 31 of the light detecting module 30; the light beam 51 is focused according to the light 51 and the light spot falls on the position of the sensor 31, so that the display 32 (or the computer 60) ) shows different values. And, in operation (C), the person adjusts the position of the wafer 50 according to the value displayed by the display 32 (or the computer 60) to obtain the correct position or ideal position of the wafer 50.

Typically, the optical alignment device and its alignment method have the following advantages and considerations in comparison with the old method under the condition of easy operation and adjustment: 1. The optical alignment device Or its associated components in use and structural design, organizational relationships, etc., have been redesigned. For example, the first optical component 10 and the light detecting module 30 are correspondingly disposed on the wafer 50 and the second optical component 20 of the optical module 100. The light detecting module 30 includes a sensor 31, a display 32 connected to the sensor 31, or a computer 60. The inductor 31 and the first optical component 10 are located on the same central reference axis X, and the light rays 51 outputted from the wafer 50 are passed through the second optical component 20 in accordance with the processes (A), (B), and (C). An optical component 10, which focuses on the sensor 31 of the light detecting module 30, displays different values and the like via the display 32 or the computer 60, which is distinct from the old method; and, changes its use type and application range. 2. In particular, when the person adjusts the position of the wafer 50 or the substrate 55, the value can be directly obtained from the light detecting module 30, and the ideal position or the correct position of the wafer 50 can be observed and observed, so that the wafer 50 can obtain the maximum light collecting efficiency mechanism. The processing and assembly errors existing in the prior art are improved, and the high visual errors caused by the observation by the conventional personnel are increased, and the frequency of the position of the wafer and the glass substrate is increased by the personnel repeatedly, and the improvement is obtained.

Therefore, the present invention provides an effective optical alignment device and its alignment method, the structural features of which are different from those of the prior art, and have the advantages unmatched in the old method, which shows considerable progress, and has been fully charged. The parts meet the requirements of the invention patent.

However, the above is only a possible embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent variations and modifications made by the scope of the present invention are covered by the scope of the present invention. .

10‧‧‧First optical component

11, 21‧‧‧ lens lens

20‧‧‧Second optical component

30‧‧‧Light detection module

31‧‧‧ sensor

32‧‧‧ display

40‧‧‧Frame

41‧‧‧floor

45‧‧‧ bracket

50‧‧‧ wafer

51‧‧‧Light

55‧‧‧Substrate

56‧‧‧Sub board

60‧‧‧ computer

100‧‧‧Optical module

500‧‧‧Solar array receiving module

Figure 1 is a schematic view of the structure of the present invention.

Figure 2 is a schematic exploded view of the structure of Figure 1.

Fig. 3 is a plan view showing the planar structure of Fig. 1; the figure also shows the case where the output light of the wafer passes through the second optical element, the first optical element, and the portion of the sensor of the photodetection module.

Figure 4 is a schematic plan view of a possible embodiment of the present invention; showing the situation in which the photodetection module is offset from the second optical component and the wafer.

Figure 5 is a schematic view showing the structure of a modified embodiment of the present invention; the structure of a portion such as a solar array receiving module and a light detecting module is depicted.

Figure 6 is a plan view showing the structure of the modified embodiment of the present invention; showing the structure of the sensor connected to the computer of the photodetection module.

Figure 7 is a flow chart showing the operation of the optical alignment method of the present invention.

10‧‧‧First optical component

11, 21‧‧‧ lens lens

20‧‧‧Second optical component

30‧‧‧Light detection module

31‧‧‧ sensor

32‧‧‧ display

40‧‧‧Frame

41‧‧‧floor

45‧‧‧ bracket

50‧‧‧ wafer

55‧‧‧Substrate

Claims (19)

An optical alignment device comprising a combination of a light detection module and a first optical component; the light detection module has a sensor and a display connected to the sensor; the sensor center and the first optical component are centered on the same reference axis; The optical module can output light through the first optical component, the first optical component focuses the light on the sensor, and the display displays a value; the optical module has a frame, a bottom plate, a combined wafer and a second optical component; An optical component and a second optical component are located on the path of the light output; and the sensor matching bracket of the light detecting module is disposed at a position above the first optical component and the second optical component. The optical alignment device of claim 1, wherein the wafer is one of a wafer having a photoelectric conversion function and an illuminating wafer; the wafer is disposed on a substrate, and the substrate is a planar slab structure, such that the wafer It is fixed on the substrate and is disposed on the bottom plate. The optical alignment device of claim 2, wherein the first optical component is a Fresnel optical lens having lens ridges; the lens ridges are oriented toward the inductor; and the second optical component is Fresnel An optical lens having a lens ridge direction opposite to a direction of a lens of the first optical element and facing the wafer; the first optical element is directly fixed to the second optical element and disposed at a height from the second optical element And one of the sensor, the reference axis of the first optical element is one of an alignment of the second optical element, a wafer position, and a deviation from the second optical element, the wafer position. The optical alignment device of claim 2, wherein the first optical component is a convex optical lens having a convex surface facing the direction of the inductor; and the second optical component is a convex optical lens having a convex surface opposite to the first a direction of the convex surface of the optical element toward the wafer; the first optical element is directly fixed to the second optical element and disposed at a height position from the second optical element; and the inductor, the first optical The reference axis of the component is one of the alignment of the second optical component, the wafer position, and the deviation from the second optical component, wafer location. The optical alignment device of claim 2, wherein the second optical component cooperates with the frame to be fixed above the wafer and positions the wafer and the substrate on the substrate. The optical alignment device of claim 2, wherein the light detecting module is one of an illuminometer for detecting illuminance of light and an integrating sphere for detecting a lumen value of light; Passing through the second optical element, entering the first optical element; the first optical element focuses the light to form a light spot and falls on the sensor; and the value of the light spot falling in the central area of the sensor is greater than the light spot falling on other areas of the sensor The value. The optical alignment device of claim 5, wherein the light detecting module is one of an illuminometer for detecting illuminance of light and an integrating sphere for detecting a lumen value of light; the light output by the chip passes through the second optical The element enters the first optical element; the first optical element focuses the light to form a spot of light that falls on the sensor; and the value of the spot that falls in the center of the sensor is greater than the value of the spot that falls on other areas of the sensor. The optical alignment device of claim 2, wherein the optical module is a solar array receiving module; a plurality of second optical elements are combined on the frame; and, the plurality of wafers are respectively disposed on a sub-plate, and the plurality of wafers and the sub-board are housed in the frame and the bottom plate, so that each of the wafers corresponds to each of the second optics The components together form a solar array receiving module; and the plurality of light detecting modules and the first optical component are correspondingly disposed at an upper position of the solar array receiving module; the plurality of light detecting modules and the first optical component are respectively disposed on the solar array The four corners of the receiving module, the triangular position, the horizontal axis of the solar array receiving module surface, the position of the vertical axis, and each of the light detecting modules, and the first optical element correspondingly disposed above each of the second optical elements A sensor of the light detecting module is connected to the computer so that the computer includes the display. The optical alignment device of claim 5, wherein the optical module is a solar array receiving module; the plurality of second optical components are combined on the frame; and the plurality of wafers are respectively disposed in a pair On the board, a plurality of wafers and sub-boards are housed in the frame and the bottom plate, so that each of the chips corresponds to each of the second optical elements to form a solar array receiving module; and a plurality of photo detecting modules and first optical elements Correspondingly disposed at a position above the solar array receiving module; the plurality of light detecting modules and the first optical component are respectively disposed at four corners of the solar array receiving module, the triangular position, the horizontal axis of the solar array receiving module surface, and the vertical axis The position and each of the light detecting modules and the first optical component are correspondingly disposed at one of the positions above each of the second optical components; the sensor of the light detecting module is connected to the computer, so that the computer includes the display. The optical alignment device of claim 6, wherein the optical module is a solar array receiving module; a plurality of second optical elements are combined on the frame; and, the plurality of wafers are respectively disposed on a sub-plate, and the plurality of wafers and the sub-board are housed in the frame and the bottom plate, so that each of the wafers corresponds to each of the second optics The components together form a solar array receiving module; and the plurality of light detecting modules and the first optical component are correspondingly disposed at an upper position of the solar array receiving module; the plurality of light detecting modules and the first optical component are respectively disposed on the solar array The four corners of the receiving module, the triangular position, the horizontal axis of the solar array receiving module surface, the position of the vertical axis, and each of the light detecting modules, and the first optical element correspondingly disposed above each of the second optical elements A sensor of the light detecting module is connected to the computer so that the computer includes the display. The optical alignment device of claim 7, wherein the optical module is a solar array receiving module; the plurality of second optical components are combined on the frame; and the plurality of wafers are respectively disposed in a pair On the board, a plurality of wafers and sub-boards are housed in the frame and the bottom plate, so that each of the chips corresponds to each of the second optical elements to form a solar array receiving module; and a plurality of photo detecting modules and first optical elements Correspondingly disposed at a position above the solar array receiving module; the plurality of light detecting modules and the first optical component are respectively disposed at four corners of the solar array receiving module, the triangular position, the horizontal axis of the solar array receiving module surface, and the vertical axis The position and each of the light detecting modules and the first optical component are correspondingly disposed at one of the positions above each of the second optical components; the sensor of the light detecting module is connected to the computer, so that the computer includes the display. An optical alignment method includes: an operation (A), providing a light detecting module, and a first optical component combining optical module; The light detecting module has a sensor and a display connected to the sensor, and the center of the sensor and the center of the first optical component are correspondingly disposed on the same reference axis; the optical module has a frame, a bottom plate, a combination of a chip capable of outputting light and a second optical The element, the second optical element and the first optical element are disposed on a path of the output light of the wafer; the operation (B), the light output by the wafer is passed through the second optical element and the first optical element; the first optical element outputs the wafer Light focusing, guiding the sensor of the light detecting module; forming a light spot and a light spot according to the light focus to the position of the sensor, so that the display shows different values; and the operation (C), the person adjusts according to the value displayed by the display The wafer position is used to obtain the ideal position of the wafer. The optical alignment method of claim 12, wherein the first optical component is a Fresnel optical lens having lens ridges; the lens ridges are oriented toward the inductor; and the second optical component is Fresnel An optical lens having a lens ridge direction opposite to a direction of a lens of the first optical element and facing the wafer; the first optical element is directly fixed to the second optical element and disposed at a height from the second optical element And one of the sensor, the reference axis of the first optical element is one of an alignment of the second optical element, a wafer position, and a deviation from the second optical element, the wafer position. The optical alignment method of claim 12, wherein the first optical element is a convex optical lens having a convex surface facing the direction of the inductor; and the second optical element is a convex optical lens having a convex surface opposite to the first a direction of the convex surface of the optical element toward the wafer; the first optical element being directly attached to the second optical element and disposed at a height from the second optical element; The sensor, the reference axis of the first optical element is one of aligned second optical element, wafer position, and offset from the second optical element, wafer position. The optical alignment method of claim 12, wherein the second optical component is coupled to the frame and fixed at a position above the wafer, and the wafer is disposed on a substrate such that the wafer and the substrate are positioned. On the bottom plate; the sensor matching bracket of the light detecting module is disposed at a position above the first optical component and the second optical component; the light detecting module is an illuminometer for detecting the illuminance of the light and an integrating sphere for detecting the lumen value of the light. One. The optical alignment method of claim 12, wherein the light output from the wafer passes through the second optical element and enters the first optical element; the first optical element focuses the light to form a light spot, and falls on On the sensor; and the value of the spot falling in the center of the sensor is greater than the value of the spot falling on other areas of the sensor. The optical alignment method of claim 15, wherein the light outputted by the wafer passes through the second optical element and enters the first optical element; the first optical element focuses the light to form a light spot and falls on the inductor; And the value of the spot falling in the center of the sensor is greater than the value of the spot falling on other areas of the sensor. The optical alignment method of claim 15, wherein the optical module is a solar array receiving module; the plurality of second optical components are combined on the frame; and the plurality of wafers are respectively disposed on a sub-board Upper, the wafer and the sub-board are housed in the frame and the bottom plate, and each wafer corresponds to each of the second optical elements to form a solar array receiving module; The plurality of light detecting modules and the first optical component are disposed at a position above the solar array receiving module; the plurality of light detecting modules and the first optical component are respectively disposed at four corners and a triangular position of the solar array receiving module, The position of the horizontal axis and the vertical axis of the surface of the solar array receiving module and each of the light detecting modules and the first optical component are correspondingly disposed at one of the positions above each of the second optical components; the sensor of the light detecting module is connected to the computer So that the computer includes the display. The optical alignment method of claim 17, wherein the optical module is a solar array receiving module; the plurality of second optical components are combined on the frame; and the plurality of wafers are respectively disposed on a sub-board Upper, the wafer and the sub-board are housed in the frame and the bottom plate, and each of the chips corresponds to each of the second optical elements to form a solar array receiving module; and the plurality of photo detecting modules and the first optical element are correspondingly disposed The upper position of the solar array receiving module; the plurality of light detecting modules and the first optical component are respectively disposed at four corners of the solar array receiving module, the triangular position, the horizontal axis of the solar array receiving module surface, the position of the vertical axis, and Each of the light detecting modules and the first optical component are disposed corresponding to one of the positions above each of the second optical components; the sensor of the light detecting module is connected to the computer, so that the computer includes the display.