TWI604586B - Semiconductor memory card and its manufacturing method - Google Patents

Description

Semiconductor memory card and method of manufacturing same

Embodiments of the present invention relate to a semiconductor memory card and a method of fabricating the same.

The present application has priority on the application based on Japanese Patent Application No. 2010-194090 (filing date: August 31, 2010). This application contains the entire contents of the basic application by way of this basic application.

A semiconductor memory card in which a semiconductor memory such as a flash memory or the like is mounted on a lead frame and sealed with a sealing resin has been known. In the semiconductor memory card of this configuration, the external terminals for reading and writing data are formed by partially exposing one portion (terminal portion) of the lead frame from the sealing resin.

When the semiconductor memory card having the above structure is manufactured, the terminal portion of the lead frame is connected to the frame portion of the lead frame before the resin sealing. Further, after the resin is sealed, the terminal portion and the frame portion of the lead frame are cut to have a shape as a semiconductor memory card. Therefore, in the state where the semiconductor memory card is completed, there is a possibility that a part of the lead frame is exposed from the terminal portion of the lead frame without being covered with the resin. As a result, there is a possibility that the data stored in the semiconductor memory is damaged.

A semiconductor memory card in which a semiconductor memory is mounted on a lead frame and sealed with a sealing resin is required to prevent damage of data stored in the semiconductor memory.

It is an object of an embodiment of the present invention to provide a semiconductor memory card and a method of fabricating the same that prevent damage to data stored in a semiconductor memory mounted on a lead frame.

According to an embodiment of the present invention, a semiconductor memory card includes a lead frame formed with a memory mounting portion, a plurality of terminals including a power supply terminal and a signal terminal, and a narrower width than the terminal and extending from each terminal to a card front end a plurality of connection portions of the portion; a semiconductor memory device mounted on the memory mounting portion of the lead frame; and a resin for exposing the power supply terminal to a portion closer to the front end surface of the card than the signal terminal, and at the front end portion of the card The lead frame on which the semiconductor memory is mounted is sealed so that a plurality of connection portions are exposed. The semiconductor memory card has a plurality of connection portions from the respective positions in which the plurality of connection portions are exposed at the front end portion of the card from the region where the signal terminals extend toward the card front end surface side toward the longitudinal direction of the card front end surface. The terminal extends.

According to an embodiment of the present invention, it is possible to provide a semiconductor memory card capable of preventing damage of data stored in a semiconductor memory mounted on a lead frame and a method of manufacturing the same.

Hereinafter, a semiconductor memory card according to an embodiment and a method of manufacturing the same will be described in detail with reference to the accompanying drawings. Further, the present invention is not limited to the embodiments.

(First embodiment)

The semiconductor memory card of the first embodiment will be described. As a first embodiment of a semiconductor memory card, microSD ^(TM) memory card in order (hereinafter referred to as microSD card) described as an example. 1-1 is a bottom view of the microSD memory card 10, FIG. 1-2 is a top perspective view of the microSD memory card 10, and FIGS. 1-3 are side perspective views of the microSD memory card 10. Further, Fig. 1-2(a) shows the entirety of the microSD memory card 10, and Fig. 1-2(b) shows an enlarged portion (I-IIb portion) of Fig. 1-2(a). Further, Fig. 1-3 shows the state in which the microSD memory card 10 is viewed from the right side of Fig. 1-2. Here, the paper of FIGS. 1-1 to 1-3 faces the insertion side of the connector in the upward direction, and the end of the direction is defined as the "front end". Further, the direction of the viewpoint of FIG. 1-1, the direction toward the depth of the paper surface of FIG. 1-2, the right direction of the paper surface of FIGS. 1-3 are defined as "lower (bottom side)", and the reverse direction is defined as "upper". Moreover, the left-right direction of the paper of FIGS. 1-1 and 1-2 is defined as "horizontal (side surface side)".

On the lead frame 1, in addition to the NAND type flash memory (hereinafter referred to as NAND) 2 as a semiconductor memory, a passive component 3 (capacitor, fuse, etc.) is also mounted. A redistribution layer is formed over NAND2, and a controller 4 for controlling NAND2 is mounted on the redistribution layer. In addition, although the configuration using the NAND type flash memory is described as an example here, it is not limited to the NAND type flash memory. For example, a NOR type flash memory can also be applied. A wiring 2a for connecting the controller 4 and the lead frame 1 is formed in the heavy wiring layer. The terminal of the controller 4 and the wiring 2a on the redistribution layer, and the wiring 2a on the heavy wiring layer and the lead frame 1 and the wiring 2a on the heavy wiring layer are connected to each other by the bonding wires 5. The lead frame 1 to which the NAND2 or the passive component 3, the controller 4 is mounted, and which is joined by the bonding wires 5 is sealed by the sealing resin 8. Among them, a part of the lead frame 1 (a terminal portion 1b to be described later) is exposed on the bottom surface side in the vicinity of the front end of the card, and an external terminal 6 for electrically connecting to the connector is formed.

The power terminals 6d and 6f, to which the power supply (VDD) and the ground potential (VSS) are respectively assigned to the external terminals 6, are exposed to the signal terminals 6a to 6c, 6e, 6g, and 6h of the signal to be distributed, closer to the card front end surface. The part.

A tapered portion 7 is provided at a front end portion (near the card front end surface) of the microSD memory card 10 as a guide surface for guiding the connector pin to the bottom surface side where the external terminal 6 is formed. The tapered portion 7 is formed such that the thickness of the card becomes thinner as it is closer to the front end surface and the bottom surface of the card and closer to the front end surface side of the card. Here, the configuration in which the tapered surface is provided as the guide surface is exemplified, but a curved surface such as an R surface may be used as the guide surface instead of the tapered surface.

Fig. 2 is a view showing the configuration of the lead frame 1 used for the manufacture of the microSD memory card 10 of the first embodiment. The broken line in Fig. 2 indicates that the range of the microSD memory card 10 is cut out after the resin is sealed, and the lead frame 1 is cut at the portion of the broken line in the broken line. The lead frame 1 includes a wafer mounting portion 1a as a memory mounting portion for mounting electronic components such as the NAND 2 or the passive component 3, and a terminal portion 1b which is exposed to the resin and exposed as an external terminal 6. The terminal portion 1b is coupled to and supported by the frame portion 1d by the connecting portion 1c. The lead frame 1 may be formed of a metal material such as 42 alloy (Fe-Ni) or Cu, but is not limited to these materials. Moreover, the lead frame 1 which becomes each external terminal 6 is fixed by the insulating tape 12.

The structure of the connection portion 1c includes a portion protruding from the terminal portion 1b in a direction intersecting the direction in which the connector is inserted (the card front end side) (the card side surface side) after the microSD memory card 10 is completed (the projection 1g) And a portion (extension portion 1h) that is narrower than the terminal portion 1b and extends from the portion toward the front end surface side of the card to the front end portion of the card. Moreover, the connection part 1c is connected to the outer frame communication part 1i. The width of the outer frame contact portion 1i is wider than the width of the connecting portion 1c. The external terminal 1b and the outer frame 1d can be stably fixed by the outer frame communication portion 1i. Therefore, as shown in FIG. 1-2, the portion of the connecting portion 1c which is cut out as the microSD memory card 10 after the completion of the card is not in the region where the terminal portion 1b is extended toward the card front end side. Therefore, as shown in FIG. 1-1, in the microSD memory card 10 manufactured using the lead frame 1, the cut surface 11 (11a to 11h) of the connecting portion 1c which is cut by the sealing resin 8 resin is cut. A region extending from the external terminals 6a to 6h toward the card distal end surface side (hereinafter sometimes referred to as "external terminal extension region") is exposed in a lateral direction (the longitudinal direction of the card distal end surface). Further, the cut surfaces 11a to 11h correspond to the cut surfaces of the respective connection portions 1c of the external terminals 6a to 6h. Further, here, the connection portion 1c is configured to protrude in a direction orthogonal to the direction in which the connector is inserted. However, the direction in which the connection portion 1c protrudes and the angle to which the connector is inserted are not necessarily at right angles. Furthermore, the outer frame contact portion 1i may not exist in the external terminal extension region.

FIG. 3 is a view showing a state in which the lead frame 1 used in the manufacture of the microSD memory card 10 of the first embodiment is sealed with a resin. Here, for simplification of the description, illustration of the NAND2 or passive component 3, the controller 4, the bonding wires 5, and the like which have been mounted to the lead frame 1 is omitted. Further, although the sealing resin 8 is only shown as being cut out as a part of the microSD memory card 10, in reality, the sealing resin 8 is molded in a shape other than the microSD memory card 10 (the portion surrounded by a broken line in Fig. 2). In a wider range. When the terminal portion 1b is resin-sealed, it is adhered to a mold (not shown) so that the sealing resin 8 does not flow into the bottom surface side of the terminal portion 1b. The bent portion 1e is provided in the range in which the connecting portion 1c is cut out as the microSD memory card 10 (the extending portion 1h), and the frame portion 1d of the lead frame 1 is disposed substantially equal to the dividing line of the mold used for sealing the resin. height.

After the resin is sealed, the connecting portion 1c is cut in accordance with the shape other than the microSD memory card 10, and the terminal portion 1b is separated from the frame portion 1d. Here, the sealing resin 8 is molded in a range larger than the shape of the microSD memory card 10, and the sealing resin 8 and the connecting portion 1c are cut along the outer shape of the microSD memory card 10 to cut out the microSD memory card. 10 method. However, it is also possible to mold the sealing resin 8 (only a part of the molding sealing resin 8 surrounded by a broken line in FIG. 2) and to cut only the connecting portion 1c by using a mold which is a shape other than the shape of the microSD memory card 10. . Since the connecting portion 1c is provided with a bent portion 1e which is cut out as a portion of the microSD memory card 10, it enters the sealing resin 8. Therefore, as shown in FIG. 1-1 or FIG. 1-3, each of the cut surfaces 11 of the connecting portion 1c is exposed in the vicinity of the upper end of the tapered portion 7 (the end portion of the tapered portion 7 on the card upper side). Since the connecting portion 1c is covered by the sealing resin 8, the connecting portion 1c can be prevented from being wound up from the cut surface 11. Thereby, it is possible to suppress a problem such as a short circuit such as a short circuit in which the connection portion 1c of the winding up is in contact with the adjacent external terminal 6.

Further, the protruding portion 1g extends in the lateral direction from the terminal portion 1b. Therefore, the protruding portion 1g and the terminal portion 1b adjacent to the protruding portion 1g become narrower. Further, the protruding portion 1g is exposed from the bottom surface of the card. As a result, depending on the material of the sealing resin 8, the sealing resin 8 may not enter between the protruding portion 1g and the terminal portion 1b adjacent to the protruding portion 1g. Further, in the connecting portion 1c, the distance from the curved portion 1e to the front end portion of the card is short, and the distance from the bottom surface of the connecting portion 1c (the surface on the bottom surface side of the card) to the bottom surface of the card is short. The sealing resin 8 that has entered the bottom surface side of the connecting portion 1c and solidified is peeled off after the card is completed. Therefore, the terminal portion 1b may be sealed so as to be buried in the sealing resin 8, and then the sealing resin 8 on the bottom surface side of the terminal portion 1b may be removed to form the external terminal 6.

Fig. 4 is a view showing a procedure for exposing the lead frame 1 embedded in the sealing resin 8 to the subsequent exposure. First, the lead frame 1 in which the terminal portion 1b is formed to be larger than the external terminal 6 is formed, and is sealed with a resin so as to be buried in the sealing resin 8 (Fig. 4(a)). Then, in cooperation with the shape exposed as the external terminal 6, the sealing resin 8 is subjected to laser patterning to form a groove 9 deeper into the lead frame 1 (Fig. 4(b)). Thereafter, the sealing resin 8 in the region surrounded by the groove 9 is removed by a water knife or polishing, and the terminal portion 1b is exposed to form the external terminal 6. When the lead frame 1 is buried in the sealing resin 8 and the terminal portion 1b is exposed afterwards, even if the protruding portion 1g is narrower than the terminal portion 1b adjacent to the protruding portion 1g, the sealing resin 8 is buried. Since the protruding portion 1g is provided between the protruding portion 1g and the terminal portion 1b adjacent to the protruding portion 1g, the sealing resin 8 can be buried. Further, the thickness of the sealing resin 8 between the bottom surface of the connecting portion 1c and the bottom surface of the card can be made thick. As a result, peeling of the sealing resin 8 can be prevented.

FIG. 5 is a diagram schematically showing the inside of the connector 20 for reading and writing data of the microSD memory card 10. Fig. 6 is a view schematically showing the positional relationship between the microSD memory card 10 and the connector terminal 21. Fig. 5(a) shows a cross section of the connector 20 in a state in which the microSD memory card 10 is not inserted. The structure of the connecting portion 1c of the microSD memory card 10 includes a protruding portion 1g that protrudes from the terminal portion 1b toward the side surface of the card, and a portion that extends from the portion toward the front end side of the card with a narrower width than the terminal portion 1b. Since the extending portion 1h is not exposed to the region where the external terminal 6 extends toward the card front end surface side. That is, the exposed position of the distal end portion of the connecting portion 1c (the position of the cut surface 11) is located in the longitudinal direction of the card distal end surface from the region where the connector pin 21 is abutted when the connector 20 is inserted. region. The exposed position of each of the connecting portions 1c at the front end portion of the card is a position at which the connector pins 21 do not abut. Therefore, when the connector 20 is inserted, even if the front end of the microSD memory card 10 is in contact with the connector pin 21, the connector pin 21 does not come into contact with the connecting portion 1c. That is, the connector pin 21 is not electrically connected to the NAND 2 at the time of abutting against the front end of the microSD memory card 10 (Fig. 5 (b), Fig. 6 (a)), and is guided to the bottom surface side along the tapered portion 7. The point of contact with the external terminal 6 (Fig. 5 (c), Fig. 6 (b)) is electrically connected to the NAND 2. Therefore, the power supply terminals 6d and 6f exposed to the front end surface of the card are in contact with the connector pins 21 earlier than the signal terminals 6a to 6c, 6e, 6g, and 6h.

In order to protect the data stored in the semiconductor memory of the semiconductor memory card, it is preferable that the external terminal for the power supply (VDD) or GND abuts the connector pin earlier than the external terminal for the signal. However, in the case of arranging the external terminals in the vicinity of the front end in the direction in which the connector is inserted, the conventional semiconductor memory card is provided with the connecting portion so as to extend straight from the terminal portion toward the front end side in the insertion direction of the connector. In other words, the cut surface of the connecting portion is exposed in a state in which the external terminals are arranged in a region extending toward the front end surface side. Therefore, when the connector is inserted, there is a possibility that the connection portion for the signal contacts the connector pin earlier than the connection portion for the power source or the GND, and the data is destroyed in the semiconductor memory.

As described above, when the microSD memory card 10 of the present embodiment is inserted into the connector 20, the power terminals 6d and 6f are first brought into contact with the connector pins 21, and the signal terminals 6a to 6c, 6e, 6g, and 6h are connected to the connector. The pin 21 is in contact. Therefore, the data stored in the NAND 2 can be prevented from being damaged.

Further, a case where the switch 23 and the terminal 24 of the microSD memory card 10 are inserted or not are disposed in the card-side end portion 22 of the connector 20. Here, there is a method in which the front end portion (front end surface 13) of the microSD memory card 10 is pressed against the switch 23, and the switch 23 is caused to emit a detection signal when it is in contact with the terminal 24 disposed in the card-side end portion 22 of the connector 20. . Here, when the connection portion 1c is exposed from the most distal end portion, there is a case where the switch 23 comes into contact with the connection portion 1c to cause erroneous detection. On the other hand, when the end portion of the connecting portion 1c is exposed from the tapered portion 7, there is no case where the connecting portion 1c comes into contact with the switch. Therefore, false detection can be prevented.

(Second embodiment)

As a microSD memory card of the semiconductor memory card according to the second embodiment, as in the first embodiment, the NAND or passive component mounted on the lead frame and the rewiring layer mounted on the NAND are connected by a bonding wire, and then It is sealed with a resin. Therefore, only differences from the first embodiment will be described below.

Fig. 7 is a bottom view of the microSD memory card 10 of the second embodiment. In the present embodiment, the sealing portion 8 is not sealed by the sealing resin 8 but is held in the state of the bottom surface and reaches the front end portion of the card. This point is different from that of the first embodiment. Since the connecting portion 1c is disposed on substantially the same surface as the terminal portion 1b (the external terminal 6), the connecting portion 1c and the cut surface 11 thereof are exposed at the lower end of the tapered portion 7 (the end of the tapered portion 7 on the bottom side of the card) unit).

Fig. 8 is a view showing the configuration of the lead frame 1 used in the manufacture of the microSD memory card 10 of the second embodiment. The broken line in Fig. 8 shows the range cut out as the microSD memory card 10, and the lead frame 1 is cut at a portion cross-hatched in a broken line. Similarly to the first embodiment, the lead frame 1 includes a wafer mounting portion 1a as a memory mounting portion for mounting electronic components, and a terminal portion 1b which is exposed as an external terminal 6 after resin sealing. The terminal portion 1b is coupled to the frame portion 1d via the connection portion 1c and the outer frame communication portion 1i. After the resin is sealed, the connecting portion 1c is cut in accordance with the outer shape of the microSD memory card 10, and the terminal portion 1b is separated from the frame portion 1d.

FIG. 9 is a view showing a state in which the lead frame 1 used in the manufacture of the microSD memory card 10 of the second embodiment is sealed with a resin. Here, for simplification of the description, illustrations of NAND or passive parts, controllers, bonding wires, and the like that have been mounted on the lead frame 1 are omitted. Further, in the same manner as the sealing resin 8, although only the portion cut out as the microSD memory card 10 is shown, in actuality, the sealing resin 8 is molded in a shape other than the microSD memory card 10 (enclosed by the dotted line of Fig. 8). In a wider range, the sealing resin 8 and the connecting portion 1c are cut along the outer shape of the microSD memory card 10, and the microSD memory card 10 is cut out. In the present embodiment, the curved portion 1e is provided outside the range cut out by the microSD memory card 10 (outer frame communication portion 1i). By providing the curved portion 1e in a wide portion of the frame width, the processing of the curved portion 1e is facilitated, and the fixed position of the lead frame 1 is stabilized. As a result, in the resin sealing step, the possibility that the self-sealing resin such as the controller 4 is exposed can be reduced.

Also in the microSD memory card of the present embodiment, when the connector is inserted into the connector, the power terminal is first brought into contact with the connector pin, and thereafter the signal terminal is in contact with the connector pin. Therefore, the data stored in the NAND can be prevented from being damaged.

Other details are the same as those of the first embodiment, and thus the description thereof will not be repeated.

(Third embodiment)

The microSD memory card of the semiconductor memory card according to the third embodiment is similar to the microSD memory card of the second embodiment, and has a NAND or passive component attached to the lead frame by a bonding wire, and a redistribution layer mounted on the NAND. The controller is sealed with a resin. Therefore, only differences from the second embodiment will be described below.

FIG. 10 is a view showing a state in which the lead frame 1 used in the manufacture of the microSD memory card 10 of the third embodiment is sealed with a resin. Here, for simplification of the description, illustrations of NAND or passive parts, controllers, bonding wires, and the like that have been mounted to the lead frame 1 are omitted. Further, in the same manner as the sealing resin 8, although only the portion cut out as the microSD memory card 10 is shown, in actuality, the sealing resin 8 is molded over a wider range than the microSD memory card 10, and the sealing resin is used. 8 and the connecting portion 1c are cut along the outer shape of the microSD memory card 10, and the microSD memory card 10 is cut out. Fig. 11 is an enlarged view showing a front end portion of the microSD memory card 10 of the third embodiment. Similarly to the second embodiment, the curved portion 1e is provided in the outer frame communication portion 1i. In the present embodiment, the half-etched portion 1f in which the connecting portion 1c is half-etched and thinned is provided between the terminal portion 1b and the curved portion 1e. In other words, the portion of the connecting portion 1c between the exposed position of the card front end portion and the terminal portion 1b is thinned by the half etching portion 1f. Since the sealing resin 8 enters on the bottom surface side of the half etching portion 1f, the half etching portion 1f is not exposed on the bottom surface of the microSD memory card 10. Therefore, the cut surface 11 of the connecting portion 1c is exposed at a portion above the lower end of the tapered portion 7.

In the present embodiment, since the half etching portion 1f is covered with the sealing resin 8, it is possible to prevent the connecting portion 1c from being wound up from the cut surface 11. Thereby, it is possible to suppress a problem such as a short circuit such as a short circuit in which the connection portion 1c of the roll is brought into contact with an adjacent external terminal.

Further, by providing the half etching portion 1f also in the protruding portion 1g, even if the protruding portion 1g and the terminal portion 1b adjacent to the protruding portion 1g are narrow, the protruding portion 1g and the terminal portion 1b adjacent to the protruding portion 1g can be provided. The seal resin 8 is used for filling.

Also in the microSD memory card of the present embodiment, when the connector is inserted into the connector, the power terminal is first brought into contact with the connector pin, and the signal terminal is thereafter brought into contact with the connector pin. Therefore, the data stored in the NAND can be prevented from being damaged.

Other details are the same as those of the second embodiment, and therefore the description thereof will not be repeated.

(Fourth embodiment)

Similarly to the microSD memory card of the first embodiment, the microSD memory card of the semiconductor memory card of the fourth embodiment has a NAND or passive component attached to the lead frame by a bonding wire, and a redistribution layer mounted on the NAND. The controller is sealed with a resin. Therefore, only differences from the first embodiment will be described below.

Fig. 12 is a bottom view of the microSD memory card 10 of the fourth embodiment. In the present embodiment, as in the first embodiment, the connecting portion 1c enters the sealing resin 8. The connecting portion 1c that has entered the sealing resin 8 is formed from the sealing resin 8 substantially flush with the terminal portion 1b, and the cut surface 11 of the connecting portion 1c is exposed at the lower end portion of the tapered portion 7, which is The first embodiment is different.

Fig. 13 is a view showing the configuration of the lead frame 1 used in the manufacture of the microSD memory card 10 of the fourth embodiment. The broken line in Fig. 13 shows the range cut out as the microSD memory card 10, and the lead frame 1 is cut at a portion broken by a broken line. The lead frame 1 includes a wafer mounting portion 1a as a memory mounting portion for mounting electronic components such as NAND or passive parts, and a terminal portion 1b which is exposed as an external terminal 6 after resin sealing. The terminal portion 1b is coupled to the frame portion 1d via the connection portion 1c and the outer frame communication portion 1i. After the resin is sealed, the connecting portion 1c is cut in accordance with the shape of the microSD memory card 10, and the terminal portion 1b is separated from the frame portion 1d.

The structure of the connecting portion 1c includes: a portion protruding from the terminal portion 1b toward the side surface of the card after the completion of the microSD memory card 10 (projecting portion 1g); and a width narrower from the portion than the terminal portion 1b A portion (extension portion 1h) on which the front end side of the card extends. Therefore, the portion cut out as the microSD memory card 10 of the connecting portion 1c does not exist in a region where the terminal portion 1b extends toward the card front end surface side. Therefore, as shown in FIG. 12, in the microSD memory card 10 of the present embodiment, the cut surface 11 of the connecting portion 1c is not exposed in a region where the external terminal 6 extends toward the card front end surface side.

Fig. 14 is a view showing a state after resin sealing of the lead frame 1 used for the manufacture of the microSD memory card 10 of the fourth embodiment. Here, for simplification of the description, illustrations of NAND or passive parts, controllers, bonding wires, and the like that have been mounted to the lead frame 1 are omitted. Further, although the sealing resin 8 only shows a portion cut out as the microSD memory card 10, actually, the sealing resin 8 is molded to be outside the microSD memory card 10 (the portion surrounded by the dotted line of Fig. 13) In a wider range, the sealing resin 8 and the connecting portion 1c are cut in accordance with the shape of the microSD memory card 10, and the microSD memory card 10 is cut out. The portion of the connecting portion 1c which is cut out as the microSD memory card 10 is provided with a bent portion 1e at two places. Therefore, as shown in FIG. 12, after the connection portion 1c enters the sealing resin 8, it is passed through the sealing resin 8 on substantially the same surface as the terminal portion 1b (the lower end portion of the tapered portion 7). The curved portion 1e is provided in addition to the connecting portion 1c, and is also provided on the outer frame accommodating portion 1i. That is, the curved portion 1e is provided at three places between the terminal portion 1b and the frame portion 1d. As a result, the frame portion 1d of the lead frame 1 is disposed at substantially the same height as the dividing line of the mold used for sealing the resin. Moreover, the buried region 1k provided between the two curved portions 1e provided in the connecting portion 1c is also located at substantially the same height as the dividing line of the mold.

In the present embodiment, since the buried portion 1k is covered by the sealing resin 8 in the connecting portion 1c, the connecting portion 1c can be prevented from being wound up from the cut surface 11. Thereby, it is possible to suppress a problem such as a short circuit such as a short circuit in which the connection portion 1c of the winding up is in contact with the adjacent external terminal 6.

In the microSD memory card of this embodiment, when the connector is inserted into the connector, the power terminal is first brought into contact with the connector pin, and the signal terminal is then brought into contact with the connector pin. Therefore, the data stored in the NAND can be prevented from being destroyed.

The other details are the same as in the first embodiment, and thus the description thereof will not be repeated.

According to each of the above embodiments, the connection portion of all the external terminals includes a portion protruding from the terminal portion toward the card side surface side, and a portion extending from the portion toward the front end surface of the card at a narrower width than the terminal portion The configuration of the part of the structure has been described as an example. However, the connection portion including only the signal terminal of the power supply terminal or the ground terminal may include a portion protruding from the terminal portion toward the side surface of the card, and from the portion. The portion is bent to extend toward the front end side of the card at a width narrower than the terminal portion. Fig. 15 shows a connecting portion 1c including only the signal terminals 6a to 6c, 6e, 6g, and 6h of the power terminal and the ground terminals 6d and 6f, including the portion protruding from the terminal portion 1b toward the side surface of the card, and from the portion A portion of the microSD memory card 10 which is bent toward the front end surface side of the card at a narrower width than the terminal portion 1b. That is, the protruding portion 1g is not provided in the connecting portion 1c of the power supply terminal and the ground terminal. This is because only the cut surfaces 11d and 11f of the connection portions 1c of the power supply terminals 6d and 6f are exposed in the region where the external terminals 6d and 6f extend toward the card front end surface side, even when the connector pins abut against the microSD. At the time point of the front end portion of the memory card 10 (Fig. 5 (b)), it is in contact with the cut surfaces 11d, 11f of the connection portion 1c of the power supply terminals 6d, 6f, and there is no need to worry about data destruction of the NAND. As a result, the width between the power supply terminal and the ground terminals 6d and 6f and the terminals adjacent to the power supply terminal and the ground terminals 6d and 6f are widened. Therefore, it is possible to more easily fill the power supply terminal and the ground terminals 6d and 6f with the sealing resin 8 between the terminals adjacent to the power supply terminal and the ground terminals 6d and 6f.

Further, in each of the above embodiments, a semiconductor memory card having a laminated type in which a controller is mounted on a semiconductor memory has been described as an example, but a flat type semiconductor memory card in which a controller is mounted on a lead frame can be used. Get the same effect. 16-1 is a top perspective view of a microSD memory card 30 as a flat type semiconductor memory card, and Fig. 16-2 is a side perspective view of the microSD memory card 30. Further, Fig. 16-2 shows the state of the microSD memory card 10 as viewed from the right side of Fig. 16-1. The same constituent elements as those of the laminated microSD memory card 10 shown in FIGS. 1-1 to 1-3 are denoted by the same reference numerals. In addition to the NAND2 as a semiconductor memory, the lead frame 1 is also provided with a controller 4 for controlling the action of the passive component 3 (capacitor or fuse, etc.) or NAND2. Such a flat-type microSD memory card 30 can also obtain an effect of preventing data corruption in the NAND2.

Further, in the above embodiments, the microSD memory card has been described as an example. However, the semiconductor memory card in which the external terminal is arranged in the vicinity of the front end in the insertion direction of the connector is also applicable, without being limited to a specific specification.

The embodiments of the present invention have been described above, but are not intended to limit the scope of the invention. The present invention may be embodied in various other forms and various modifications, substitutions and changes may be made without departing from the scope of the invention. The invention and its modifications are intended to be included within the scope and spirit of the invention, and are included in the scope of the invention described in the claims.

1. . . Lead frame

1b. . . Terminal part

1c. . . Connection

1g. . . Protruding

1h. . . Extension

1f. . . Half etching

2. . . NAND

2a. . . Wiring

3. . . Passive part

4. . . Controller

5. . . Bonding wire

6. . . External terminal

8. . . Sealing resin

10. . . microSD memory card

12. . . Insulation Tape

20. . . Connector

twenty one. . . Connector pin

Figure 1-1 is a bottom view of a microSD memory card as a semiconductor memory card according to the first embodiment;

Figure 1-2 is a top perspective view of the microSD memory card of the first embodiment;

1-3 is a side perspective view of the microSD memory card of the first embodiment;

2 is a view showing a configuration of a lead frame used for manufacturing a microSD memory card according to the first embodiment;

3 is a view showing a state after resin sealing of a lead frame used for manufacturing a microSD memory card according to the first embodiment;

4(a)-(c) are process diagrams showing the order in which the lead frame embedded in the sealing resin is exposed afterwards;

5(a)-(c) are diagrams schematically showing the inside of a connector for reading and writing data of a microSD memory card;

6(a) and 6(b) are diagrams schematically showing the positional relationship between the microSD memory card and the connector terminals;

Figure 7 is a bottom plan view showing the microSD memory card of the second embodiment;

8 is a view showing a configuration of a lead frame used for manufacturing a microSD memory card according to a second embodiment;

FIG. 9 is a view showing a state in which the lead frame used in the manufacture of the microSD memory card of the second embodiment is sealed with a resin;

FIG. 10 is a view showing a state in which the lead frame used in the manufacture of the microSD memory card of the third embodiment is sealed with a resin;

Figure 11 is an enlarged view of a front end portion of a microSD memory card of a third embodiment;

Figure 12 is a bottom plan view of the microSD memory card of the fourth embodiment;

Figure 13 is a view showing the configuration of a lead frame used in the manufacture of the microSD memory card of the fourth embodiment;

Fig. 14 is a view showing a state after resin sealing of a lead frame used in the manufacture of the microSD memory card of the fourth embodiment;

Fig. 15 is a view showing a portion in which a connecting portion having only a signal terminal protrudes from the terminal portion toward the side surface of the card, and a portion which is narrower than the terminal portion and extends toward the front end side of the card to reach a portion of the front end portion of the card. The composition of the memory card;

Figure 16-1 is a top perspective view of a microSD memory card as a flat type semiconductor memory card;

Figure 16-2 is a side perspective view of a flat-type microSD memory card.

1. . . Lead frame

1b. . . Terminal part

1c. . . Connection

1g. . . Protruding

1h. . . Extension

2. . . NAND

2a. . . Wiring

3. . . Passive part

4. . . Controller

5. . . Bonding wire

6. . . External terminal

8. . . Sealing resin

10. . . microSD memory card

12. . . Insulation Tape

Claims (9)

A semiconductor memory card comprising: a lead frame formed with a memory mounting portion, a plurality of terminals including a power terminal and a signal terminal, and a narrower portion than the terminal and extending from the terminals to a front end portion of the card a plurality of connection portions; a semiconductor memory device mounted on the memory device mounting portion of the lead frame; and a resin for exposing the power supply terminal to a portion closer to a card front end surface than the signal terminal, The card front end portion seals the lead frame on which the semiconductor memory body is mounted so that the plurality of connection portions are exposed; and the plurality of connection portions are exposed to the front end portion of the card from each of the signal terminals The region where the front end side of the card is extended is biased toward the longitudinal direction of the card front end surface, and the respective connecting portions are extended from the respective terminals. The semiconductor memory card of claim 1, wherein the plurality of connecting portions are in a position where the front end portion of the card is exposed, and the position at which the pins of the connector of the semiconductor memory card are not abutted. The semiconductor memory card according to claim 1 or 2, wherein the front end portion of the card has a guide surface that is thinner toward the front end surface side of the card; and the plurality of connection portions are exposed at the front end portion of the card Guide surface. The semiconductor memory card according to claim 3, wherein the plurality of connection portions are bent in a card thickness direction such that an exposed position of the card front end portion is an end portion of the guide surface on the card front end surface side. The semiconductor memory card of claim 3, wherein at least one of the plurality of connection portions is such that the exposed position of the front end portion of the card is an end portion of the guide surface opposite to the front end surface of the card The direction is bent. The semiconductor memory card of claim 3, wherein at least one of the plurality of connection portions is exposed at substantially the same position as the terminal portion at an exposed position of the card front end portion. The semiconductor memory card of claim 6, wherein at least one of the plurality of connection portions is partially thinned between an exposed position of the front end portion of the card and the terminal, and the thinned portion of the connection portion Covered by the above sealing resin. The semiconductor memory card of claim 1 or 2, wherein each of the plurality of connection portions includes: a protruding portion that protrudes from the terminal portion toward a side surface side of the card; and the protruding portion extends from the front end surface side of the card to reach To the extension of the front end of the card. A method of manufacturing a semiconductor memory card, comprising: a memory mounting portion; a plurality of terminals including a power supply terminal and a signal terminal; a frame portion supporting the terminal; and a plurality of connection portions connected to the plurality of terminals The semiconductor memory is mounted on the memory mounting portion of the lead frame, and the semiconductor memory is mounted on the sealing resin so that the power terminal is exposed to a portion closer to the front end surface of the card than the signal terminal. The lead frame is sealed with a resin; the sealing resin and the connecting portion are cut in accordance with a predetermined card shape, and the terminal is separated from the frame portion, and the plurality of connecting portions are exposed at a front end portion of the card; The plurality of connecting portions are biased toward the longitudinal direction of the card front end surface from a region where the signal terminal extends toward the card distal end surface side at an exposed position of the card distal end portion, and the plurality of connecting portions are formed from the plurality of connecting portions Each terminal extends.