TWI600693B - White photosensitive resin composition, white hardened film, method for manufacturing white pattern - Google Patents

White photosensitive resin composition, white hardened film, method for manufacturing white pattern Download PDF

Info

Publication number
TWI600693B
TWI600693B TW102141553A TW102141553A TWI600693B TW I600693 B TWI600693 B TW I600693B TW 102141553 A TW102141553 A TW 102141553A TW 102141553 A TW102141553 A TW 102141553A TW I600693 B TWI600693 B TW I600693B
Authority
TW
Taiwan
Prior art keywords
group
resin composition
photosensitive resin
white
mass
Prior art date
Application number
TW102141553A
Other languages
Chinese (zh)
Other versions
TW201420659A (en
Inventor
中村翔一
高桑英希
嶋田和人
Original Assignee
富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士軟片股份有限公司 filed Critical 富士軟片股份有限公司
Publication of TW201420659A publication Critical patent/TW201420659A/en
Application granted granted Critical
Publication of TWI600693B publication Critical patent/TWI600693B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

白色感光性樹脂組成物、白色硬化膜、白色圖案的 製造方法 White photosensitive resin composition, white cured film, white pattern Production method

本發明是有關於一種白色感光性樹脂組成物、使用其的白色硬化膜、白色圖案及其製造方法。 The present invention relates to a white photosensitive resin composition, a white cured film using the same, a white pattern, and a method for producing the same.

印刷配線板通常是藉由蝕刻(etching)將貼合於積層板上的銅箔的無用部分去除且形成電路配線而成,並藉由焊接將電子零件配置於既定的部位。製作此種印刷配線板時,使用抗焊膜(solder resist film)。即,抗焊膜被用作焊接電子零件時的電路的保護膜。抗焊膜於焊接時防止焊料(solder)附著於不需要的部分,並且防止電路導體直接暴露在空氣中而與氧或濕分(moisture content)反應。進而,亦作為電路基板的永久保護膜而發揮功能。因此,要求密接性、電氣絕緣性、焊料耐熱性、耐溶劑性、耐化學品性等各種特性。 The printed wiring board is usually formed by etching and removing unnecessary portions of the copper foil bonded to the laminated board to form circuit wiring, and the electronic component is placed at a predetermined portion by soldering. When such a printed wiring board is produced, a solder resist film is used. That is, the solder resist film is used as a protective film for a circuit when soldering an electronic component. The solder resist prevents solder from adhering to unnecessary portions during soldering and prevents the circuit conductor from being directly exposed to the air to react with oxygen or moisture content. Furthermore, it also functions as a permanent protective film of a circuit board. Therefore, various properties such as adhesion, electrical insulation, solder heat resistance, solvent resistance, and chemical resistance are required.

尤其要求於暴露在回流焊(reflow solder)時的高溫下、或經光照射時,不易由白色發生變色。 In particular, it is required to be discolored from white at a high temperature when exposed to reflow solder or when irradiated with light.

例如,於專利文獻1中記載有一種白色感光性樹脂組成物,其使用士林(threne)系藍色染料,可獲得抑制了由熱歷程所致的變色的硬化物,但要求添加著色劑,且圖案的解析度存在問題。 For example, Patent Document 1 discloses a white photosensitive resin composition which uses a threne blue dye to obtain a cured product which suppresses discoloration caused by a heat history, but requires a coloring agent to be added. And there is a problem with the resolution of the pattern.

印刷配線板正在不斷地推進微細化(精細化)、多層化及單板(one board)化以實現高密度化,而安裝方式亦朝向表面安裝技術(surface mounting technology,SMT)發展。因此,對於抗焊膜而言,精細化、高解析度、高精度、高可靠性的要求亦不斷提高。 The printed wiring board is continually promoting miniaturization (fineness), multi-layering, and one board to achieve high density, and the mounting method is also progressing toward surface mounting technology (SMT). Therefore, for solder resist films, the requirements for refinement, high resolution, high precision, and high reliability are also increasing.

作為形成此種阻焊圖案的技術,可準確地形成微細圖案的光阻法成為主流,尤其考慮到環境方面等,鹼顯影型的光阻法成為主流。 As a technique for forming such a solder resist pattern, a photoresist method capable of accurately forming a fine pattern has become a mainstream, and in particular, an alkali development type resist method has become mainstream.

例如,於專利文獻2中揭示有一種使用了肟酯系光聚合起始劑的白色感光性樹脂組成物,且其中記載了可準確地形成圖案潛像(pattern latent image),但於耐著色性方面存在問題。 For example, Patent Document 2 discloses a white photosensitive resin composition using an oxime ester photopolymerization initiator, and it is described that a pattern latent image can be accurately formed, but coloring resistance is exhibited. There are problems in the aspect.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2012-150461號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-150461

[專利文獻2]日本專利特開2008-134621號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-134621

本發明是鑒於上述現有技術的問題而成,其目的在於提供一種白色感光性樹脂組成物、白色硬化膜、白色圖案及其製造方法,上述白色感光性樹脂組成物可形成即便進行加熱(例如於 265℃下、15分鐘)亦不易發生黃變等著色、且具有孔徑為50μm以下的孔圖案(hole pattern)等微細圖案的白色硬化膜。 The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a white photosensitive resin composition, a white cured film, a white pattern, and a method for producing the same, wherein the white photosensitive resin composition can be formed even if heated (for example, A white cured film having a fine pattern such as a hole pattern having a pore diameter of 50 μm or less and having a color diameter of 50 μm or less is also less likely to occur at 265 ° C for 15 minutes.

用以解決上述問題的具體手段如下。 The specific means for solving the above problems are as follows.

<1>一種白色感光性樹脂組成物,含有(A)黏合劑聚合物(binder polymer)、(B)聚合性單體(polymerizable monomer)、(C)聚合起始劑(polymerization initiator)、(D)平均粒徑為100nm以上的二氧化鈦粒子及(E)防著色劑(coloring preventing agent)。 <1> A white photosensitive resin composition comprising (A) a binder polymer, (B) a polymerizable monomer, (C) a polymerization initiator, (D) a titanium dioxide particle having an average particle diameter of 100 nm or more and (E) a coloring preventing agent.

<2>如<1>所記載的白色感光性樹脂組成物,其中二氧化鈦(D)的平均粒徑為180nm以上。 <2> The white photosensitive resin composition as described in <1>, wherein the titanium dioxide (D) has an average particle diameter of 180 nm or more.

<3>如<1>或<2>所記載的白色感光性樹脂組成物,其中於白色感光性樹脂組成物的固體成分(solid content)中,二氧化鈦(D)的含量為35質量%以上。 <3> The white photosensitive resin composition as described in <1>, wherein the content of the titanium dioxide (D) in the solid content of the white photosensitive resin composition is 35 mass% or more.

<4>如<1>至<3>中任一項所記載的白色感光性樹脂組成物,其中上述防著色劑(E)為酚(phenol)化合物。 The white photosensitive resin composition as described in any one of <1> to <3>, wherein the coloring inhibitor (E) is a phenol compound.

<5>如<1>至<4>中任一項所記載的白色感光性樹脂組成物,其中上述防著色劑(E)為於酚性羥基(phenolic hydroxyl group)的鄰位上具有取代基的酚化合物。 The white photosensitive resin composition as described in any one of <1> to <4> wherein the coloring inhibitor (E) has a substituent at ortho position to a phenolic hydroxyl group. Phenolic compound.

<6>如<1>至<5>中任一項所記載的白色感光性樹脂組成物,更含有分散劑,並且於白色感光性樹脂組成物的固體成分中,黏合劑聚合物(A)與上述分散劑的總含量為24質量%以上、46質量%以下。 <6> The white photosensitive resin composition as described in any one of <1> to <5> further containing a dispersing agent, and in the solid component of the white photosensitive resin composition, the binder polymer (A) The total content of the above dispersant is 24% by mass or more and 46% by mass or less.

<7>如<6>所記載的白色感光性樹脂組成物,其中於白色 感光性樹脂組成物的固體成分中,黏合劑聚合物(A)與上述分散劑的總含量為30質量%以上、46質量%以下。 <7> A white photosensitive resin composition as described in <6>, which is white In the solid content of the photosensitive resin composition, the total content of the binder polymer (A) and the dispersant is 30% by mass or more and 46% by mass or less.

<8>如<6>或<7>所記載的白色感光性樹脂組成物,其中上述分散劑為具有吸附部位的高分子分散劑。 <8> The white photosensitive resin composition as described in <6>, wherein the dispersing agent is a polymer dispersing agent having an adsorption site.

<9>如<8>所記載的白色感光性樹脂組成物,其中上述吸附部位為酸系(acid-based)吸附部位。 <9> The white photosensitive resin composition as described in <8>, wherein the adsorption site is an acid-based adsorption site.

<10>如<9>所記載的白色感光性樹脂組成物,其中上述酸系吸附部位為含磷原子的基團或羧酸基的至少一者。 The white photosensitive resin composition as described in <9>, wherein the acid-based adsorption site is at least one of a phosphorus atom-containing group or a carboxylic acid group.

<11>如<10>所記載的白色感光性樹脂組成物,其中上述高分子分散劑為具有含磷原子的基團作為酸系吸附部位的高分子分散劑,且上述高分子分散劑為索努帕斯(SOLSPERSE)26000、索努帕斯(SOLSPERSE)36000或索努帕斯(SOLSPERSE)41000(均為路博潤(Lubrizol)公司製造)。 The white photosensitive resin composition as described in <10>, wherein the polymer dispersing agent is a polymer dispersing agent having a group containing a phosphorus atom as an acid-based adsorption site, and the polymer dispersing agent is a polymer dispersing agent. SOLSPERSE 26000, SOLSPERSE 36000 or SOLSPERSE 41000 (both manufactured by Lubrizol).

<12>如<8>所記載的白色感光性樹脂組成物,其中上述高分子分散劑是由下述通式(1)所表示, <12> The white photosensitive resin composition as described in <8>, wherein the polymer dispersing agent is represented by the following general formula (1).

上述通式(1)中,R1表示(m+n)價的連結基(linking group),R2表示單鍵或二價連結基;A1表示一價取代基,上述一價取代基具有至少一種選自由以下基團所組成的組群中的基團:酸基(acid group)、脲基 (urea group)、胺基甲酸酯基(urethane group)、含配位性氧原子(coordinating oxygen atom)的基團、含鹼性氮原子(basic nitrogen atom)的基團、烷氧基羰基(alkyloxycarbonyl)、烷基胺基羰基(alkyl aminocarbonyl)、羧酸鹽基(carboxylate group)、磺醯胺基(sulfonamide group)、雜環基(heterocyclic group)、烷氧基矽烷基(alkoxysilyl group)、環氧基(epoxy group)、異氰酸酯基(isocyanate group)及羥基(hydroxyl group);n個A1及R2分別可相同亦可不同;m表示8以下的正數,n表示1~9,m+n滿足3~10;P1表示聚合物鏈;m個P1可相同亦可不同。 In the above formula (1), R 1 represents a (m+n) valent linking group, R 2 represents a single bond or a divalent linking group; A 1 represents a monovalent substituent, and the above monovalent substituent has At least one group selected from the group consisting of an acid group, a urea group, a urethane group, and a coordinating oxygen atom (coordinating) a group of an oxygen atom), a group containing a basic nitrogen atom, an alkyloxycarbonyl group, an alkylaminocarbonyl group, a carboxylate group, a sulfonium group Sulfonamide group, heterocyclic group, alkoxysilyl group, epoxy group, isocyanate group and hydroxyl group; n A 1 And R 2 may be the same or different, m represents a positive number of 8 or less, n represents 1 to 9, m+n satisfies 3 to 10; P 1 represents a polymer chain; m P 1 may be the same or different.

<13>如<1>至<12>中任一項所記載的白色感光性樹脂組成物,其中聚合起始劑(C)為下述通式(A)所表示的肟酯系化合物, The white light-sensitive resin composition according to any one of the above-mentioned items (A), wherein the polymerization initiator (C) is an oxime ester compound represented by the following formula (A),

上述通式(A)中,R1、R2及R3分別獨立地表示一價取代基。 In the above formula (A), R 1 , R 2 and R 3 each independently represent a monovalent substituent.

<14>一種白色感光性樹脂組成物,含有(A)黏合劑聚合物、(B)聚合性單體、(C)聚合起始劑、(D)平均粒徑為100nm以上的二氧化鈦粒子及分散劑,並且於白色感光性樹脂組成物的固體成分中,黏合劑聚合物(A)與上述分散劑的總含量為24質 量%~46質量%。 <14> A white photosensitive resin composition comprising (A) a binder polymer, (B) a polymerizable monomer, (C) a polymerization initiator, (D) titanium oxide particles having an average particle diameter of 100 nm or more, and dispersion And the total content of the binder polymer (A) and the above dispersing agent is 24 in the solid content of the white photosensitive resin composition. The amount is %~46% by mass.

<15>如<14>所記載的白色感光性樹脂組成物,其中於白色感光性樹脂組成物的固體成分中,黏合劑聚合物(A)與上述分散劑的總含量為30質量%~46質量%。 <15> The white photosensitive resin composition as described in <14>, wherein the total content of the binder polymer (A) and the dispersing agent is 30% by mass to 46 in the solid content of the white photosensitive resin composition. quality%.

<16>如<1>至<15>中任一項所記載的白色感光性樹脂組成物,其可形成於265℃下加熱15分鐘前後的色差△E*ab為3以下的白色硬化膜。 The white photosensitive resin composition as described in any one of <1> to <15> which can be formed as a white cured film which has the color difference ΔE*ab of 3 or less before and after heating at 265 degreeC for 15 minutes.

<17>如<1>至<16>中任一項所記載的白色感光性樹脂組成物,其可形成於265℃下加熱15分鐘前後的色差△E*ab為2以下的白色硬化膜。 The white photosensitive resin composition as described in any one of <1> to <16>, which can be formed as a white cured film having a color difference ΔE*ab of 2 or less before and after heating at 265 ° C for 15 minutes.

<18>如<1>至<17>中任一項所記載的白色感光性樹脂組成物,其可形成具有孔徑為50μm以下的孔圖案的白色硬化膜。 The white photosensitive resin composition as described in any one of <1> to <17> which can form the white hardening film which has the hole pattern of the pore diameter of 50 micrometers or less.

<19>一種白色硬化膜,其是使用如<1>至<18>中任一項所記載的白色感光性樹脂組成物所形成的白色硬化膜。 <19> A white cured film formed by using the white photosensitive resin composition as described in any one of <1> to <18>.

<20>一種白色圖案的製造方法,包括以下步驟:於基板上塗佈如<1>至<18>中任一項所記載的白色感光性樹脂組成物而形成白色膜的步驟;隔著遮罩對上述白色膜進行曝光的步驟;以及對曝光後的上述白色膜進行顯影而形成白色圖案的步驟。 <20> A method of producing a white pattern, comprising the steps of: forming a white film by applying the white photosensitive resin composition according to any one of <1> to <18> on a substrate; a step of exposing the white film to the cover; and a step of developing the exposed white film to form a white pattern.

<21>一種白色圖案,其是藉由如<20>所記載的製造方法而製造。 <21> A white pattern produced by the production method as described in <20>.

根據本發明,可提供一種白色感光性樹脂組成物、白色 硬化膜、白色圖案及其製造方法,上述白色感光性樹脂組成物可形成即便進行加熱(例如於265℃下、15分鐘)亦不易發生黃變等著色、且具有孔徑為50μm以下的孔圖案等微細圖案的白色硬化膜。 According to the present invention, a white photosensitive resin composition can be provided, white In the cured film, the white pattern, and the method for producing the same, the white photosensitive resin composition can be formed into a hole pattern having a pore diameter of 50 μm or less, which is not easily colored by heating (for example, at 265 ° C for 15 minutes). A finely patterned white cured film.

本說明書中的基團(原子團)的表述中,未記載經取代 及未經取代的表述是指包含不具有取代基的基團(原子團),並且亦包含具有取代基的基團(原子團)。例如,所謂「烷基」,不僅包含不具有取代基的烷基(未經取代的烷基),而且亦包含具有取代基的烷基(經取代的烷基)。 In the description of the group (atomic group) in the present specification, the substitution is not described. And the unsubstituted expression means a group (atomic group) containing no substituent, and also a group having a substituent (atomic group). For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).

以下記載的構成要件的說明有時是根據本發明的具代表性的實施形態來進行,但本發明不限定於此種實施形態。再者,本說明書中使用「~」所表示的數值範圍是指包含將「~」的前後所記載的數值作為下限值及上限值的範圍。 The description of the constituent elements described below may be performed according to a representative embodiment of the present invention, but the present invention is not limited to such an embodiment. In addition, the numerical range represented by the "~" in this specification is a range which contains the numerical value of the [~~] and the numerical value as the lower-limit and upper-limit.

再者,本說明書中,“(甲基)丙烯酸酯”表示丙烯酸酯及甲基丙烯酸酯,“(甲基)丙烯酸”表示丙烯酸及甲基丙烯酸,“(甲基)丙烯醯基”表示丙烯醯基及甲基丙烯醯基。另外,本說明書中,“單體”與“單聚物(monomer)”為相同涵義。本發明中的單體是指與低聚物及聚合物相區分、且質量平均分子量為2,000以下的化合物。本說明書中,所謂聚合性化合物,是指具有聚合性基的化合物,可為 單體亦可為聚合物。所謂聚合性基,是指參與聚合反應的基團。 In the present specification, "(meth)acrylate" means acrylate and methacrylate, "(meth)acryl" means acrylic acid and methacrylic acid, and "(meth)acryloyl group" means propylene oxime. And methacryl oxime. In addition, in this specification, "monomer" and "monomer" have the same meaning. The monomer in the present invention means a compound which is distinguished from an oligomer and a polymer and has a mass average molecular weight of 2,000 or less. In the present specification, the term "polymerizable compound" means a compound having a polymerizable group, which may be The monomer can also be a polymer. The polymerizable group refers to a group that participates in a polymerization reaction.

<白色感光性樹脂組成物> <White photosensitive resin composition>

本發明的白色感光性樹脂組成物含有(A)黏合劑聚合物、(B)聚合性單體、(C)聚合起始劑、(D)平均粒徑為100nm以上的二氧化鈦粒子及(E)防著色劑。藉此,例如可形成於265℃下加熱15分鐘前後的色差△E*ab為5以下、較佳為3以下、且具有孔徑為50μm以下的孔圖案的白色硬化膜。 The white photosensitive resin composition of the present invention contains (A) a binder polymer, (B) a polymerizable monomer, (C) a polymerization initiator, (D) titanium oxide particles having an average particle diameter of 100 nm or more, and (E) Anti-coloring agent. Thus, for example, a white cured film having a color difference ΔE * ab of 5 or less, preferably 3 or less, and having a pore pattern of 50 μm or less in a before and after heating at 265 ° C for 15 minutes can be formed.

本發明的白色感光性樹脂組成物可形成即便進行加 熱(例如於265℃下、15分鐘)亦不易著色、且能形成孔徑為50μm以下(較佳為40μm以下,更佳為30μm以下,進而佳為20μm以下)的微細圖案的白色硬化膜。以下,有時亦將可形成此種具有微細圖案的白色硬化膜的性能簡稱為「解析度(resolution)」。 The white photosensitive resin composition of the present invention can be formed even if added The heat (for example, at 265 ° C for 15 minutes) is also less likely to be colored, and a fine white pattern of a fine pattern having a pore diameter of 50 μm or less (preferably 40 μm or less, more preferably 30 μm or less, and still more preferably 20 μm or less) can be formed. Hereinafter, the performance of the white cured film having such a fine pattern may be simply referred to as "resolution".

本發明的白色感光性樹脂組成物較佳為可形成於265℃下加熱15分鐘前後的色差△E*ab為5以下(較佳為3以下,更佳為2以下,尤佳為1以下)的白色硬化膜。藉此可規定防止白色硬化膜的黃變等著色。 The white photosensitive resin composition of the present invention preferably has a color difference ΔE * ab of 5 or less (preferably 3 or less, more preferably 2 or less, and particularly preferably 1 or less) before and after heating at 265 ° C for 15 minutes. White hardened film. Thereby, it is possible to prevent coloration such as yellowing of the white cured film.

本發明的白色感光性樹脂組成物較佳為如下組成物:於形成膜厚為4.0μm的白色硬化膜時,對該硬化膜的厚度方向的光透射率在400nm~700nm的整個波長範圍內為小於5%的組成物,更佳為小於3%的組成物。 The white photosensitive resin composition of the present invention is preferably a composition in which, when a white cured film having a film thickness of 4.0 μm is formed, the light transmittance in the thickness direction of the cured film is in the entire wavelength range of 400 nm to 700 nm. Less than 5% of the composition, more preferably less than 3% of the composition.

即,本發明的白色硬化膜較佳為於膜厚為4.0μm的情況下,對膜的厚度方向的光透射率在400nm~700nm的整個波長範圍內 為小於5%,更佳為小於3%。 That is, in the white cured film of the present invention, when the film thickness is 4.0 μm, the light transmittance in the thickness direction of the film is in the entire wavelength range of 400 nm to 700 nm. It is less than 5%, more preferably less than 3%.

[(A)黏合劑聚合物] [(A) Binder Polymer]

就提高皮膜特性等觀點而言,本發明的白色感光性樹脂組成物含有黏合劑聚合物。 The white photosensitive resin composition of the present invention contains a binder polymer from the viewpoint of improving film properties and the like.

黏合劑聚合物較佳為使用線性(linear)有機聚合物。此種線性有機聚合物可任意使用公知者。較佳為選擇於水或弱鹼性水中為可溶性或膨潤性的線性有機聚合物,以可進行水顯影或弱鹼性水顯影。線性有機聚合物是根據不僅作為皮膜形成劑而且作為水、弱鹼性水或有機溶劑顯影劑的用途而選擇使用。例如若使用水可溶性有機聚合物,則可進行水顯影。此種線性有機聚合物可列舉:於側鏈上具有羧酸基的自由基聚合物,例如日本專利特開昭59-44615號公報、日本專利特公昭54-34327號公報、日本專利特公昭58-12577號公報、日本專利特公昭54-25957號公報、日本專利特開昭54-92723號公報、日本專利特開昭59-53836號公報、日本專利特開昭59-71048號公報中記載的聚合物,即,使具有羧基的單體進行均聚合或共聚合而成的樹脂、使具有酸酐的單體進行均聚合或共聚合並使酸酐單元水解或半酯化或半醯胺化而成的樹脂、利用不飽和單羧酸及酸酐將環氧樹脂改質而成的環氧丙烯酸酯等。具有羧基的單體可列舉:丙烯酸、甲基丙烯酸、衣康酸、丁烯酸、馬來酸、富馬酸、4-羧基苯乙烯等,具有酸酐的單體可列舉馬來酸酐等。 The binder polymer preferably uses a linear organic polymer. Such a linear organic polymer can be used arbitrarily. It is preferred to select a linear or organic polymer which is soluble or swellable in water or weakly alkaline water for water development or weak alkaline water development. The linear organic polymer is selected for use not only as a film forming agent but also as a developer of water, weakly alkaline water or an organic solvent. For example, if a water-soluble organic polymer is used, water development can be performed. Examples of such a linear organic polymer include a radical polymer having a carboxylic acid group in a side chain, for example, Japanese Patent Laid-Open Publication No. SHO 59-44615, Japanese Patent Publication No. Sho 54-34327, and Japanese Patent Publication No. Sho. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. a polymer, that is, a resin obtained by homopolymerizing or copolymerizing a monomer having a carboxyl group, homopolymerizing or copolymerizing a monomer having an acid anhydride, and hydrolyzing or semi-esterifying or semi-aminating the acid anhydride unit. The resin is an epoxy acrylate which is obtained by modifying an epoxy resin with an unsaturated monocarboxylic acid and an acid anhydride. Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, and 4-carboxystyrene. Examples of the monomer having an acid anhydride include maleic anhydride.

另外,有同樣地於側鏈上具有羧酸基的酸性纖維素衍生物。 此外,有效使用於具有羥基的聚合物上加成環狀酸酐而成者等。 Further, there is an acidic cellulose derivative having a carboxylic acid group in the side chain as well. Further, it is effectively used in the case of adding a cyclic acid anhydride to a polymer having a hydroxyl group.

本發明中,於使用共聚物作為黏合劑聚合物的情形時,進行共聚合的化合物亦可使用除上文所列舉的單體以外的其他單體。其他單體的例子可列舉下述(1)~(12)的化合物。 In the present invention, when a copolymer is used as the binder polymer, the compound to be copolymerized may also use a monomer other than the monomers enumerated above. Examples of the other monomer include the following compounds (1) to (12).

(1)丙烯酸-2-羥乙酯、丙烯酸-2-羥丙酯、丙烯酸-3-羥丙酯、丙烯酸-4-羥丁酯、甲基丙烯酸-2-羥乙酯、甲基丙烯酸-2-羥丙酯、甲基丙烯酸-3-羥丙酯、甲基丙烯酸-4-羥丁酯等具有脂肪族羥基的丙烯酸酯類及甲基丙烯酸酯類。 (1) 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 2-hydroxyethyl methacrylate, methacrylic acid-2 Acrylates and methacrylates having an aliphatic hydroxyl group such as hydroxypropyl ester, 3-hydroxypropyl methacrylate or 4-hydroxybutyl methacrylate.

(2)丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸丁酯、丙烯酸異丁酯、丙烯酸戊酯、丙烯酸己酯、丙烯酸2-乙基己酯、丙烯酸辛酯、丙烯酸苄酯、丙烯酸-2-氯乙酯、丙烯酸縮水甘油酯、甲基丙烯酸-3,4-環氧環己酯、丙烯酸乙烯酯、丙烯酸-2-苯基乙烯酯、丙烯酸-1-丙烯酯、丙烯酸烯丙酯、丙烯酸-2-烯丙氧基乙酯、丙烯酸炔丙酯等丙烯酸烷基酯。 (2) Methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, isobutyl acrylate, amyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, benzyl acrylate, acrylic acid - 2-chloroethyl ester, glycidyl acrylate, 3,4-epoxycyclohexyl methacrylate, vinyl acrylate, 2-phenylvinyl acrylate, 1-propenyl acrylate, allyl acrylate, An alkyl acrylate such as 2-allyloxyethyl acrylate or propargyl acrylate.

(3)甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸 丙酯、甲基丙烯酸丁酯、甲基丙烯酸異丁酯、甲基丙烯酸戊酯、甲基丙烯酸己酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸環己酯、甲基丙烯酸苄酯、甲基丙烯酸-2-氯乙酯、甲基丙烯酸縮水甘油酯、甲基丙烯酸-3,4-環氧環己基甲酯、甲基丙烯酸乙烯酯、甲基丙烯酸-2-苯基乙烯酯、甲基丙烯酸-1-丙烯酯、甲基丙烯酸烯丙酯、甲基丙烯酸-2-烯丙氧基乙酯、甲基丙烯酸炔丙酯等甲基丙烯酸烷基酯。 (3) Methyl methacrylate, ethyl methacrylate, methacrylic acid Propyl ester, butyl methacrylate, isobutyl methacrylate, amyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate , 2-chloroethyl methacrylate, glycidyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, vinyl methacrylate, 2-phenyl vinyl methacrylate, An alkyl methacrylate such as 1-propenyl methacrylate, allyl methacrylate, 2-allyloxyethyl methacrylate or propargyl methacrylate.

(4)丙烯醯胺、甲基丙烯醯胺、N-羥甲基丙烯醯胺、N-乙基丙烯醯胺、N-己基甲基丙烯醯胺、N-環己基丙烯醯胺、N-羥基乙基丙烯醯胺、N-苯基丙烯醯胺、N-硝基苯基丙烯醯胺、N-乙基-N-苯基丙烯醯胺、乙烯基丙烯醯胺、乙烯基甲基丙烯醯胺、N,N-二烯丙基丙烯醯胺、N,N-二烯丙基甲基丙烯醯胺、烯丙基丙烯醯胺、烯丙基甲基丙烯醯胺等丙烯醯胺或甲基丙烯醯胺。 (4) acrylamide, methacrylamide, N-methylol acrylamide, N-ethyl acrylamide, N-hexyl methacrylamide, N-cyclohexyl acrylamide, N-hydroxyl Ethyl acrylamide, N-phenyl acrylamide, N-nitrophenyl acrylamide, N-ethyl-N-phenyl acrylamide, vinyl acrylamide, vinyl methacrylamide , N,N-diallyl acrylamide, N,N-diallyl methacrylamide, allyl acrylamide, allyl methacrylamide, acrylamide or methacryl Guanamine.

(5)乙基乙烯醚、2-氯乙基乙烯醚、羥基乙基乙烯醚、 丙基乙烯醚、丁基乙烯醚、辛基乙烯醚、苯基乙烯醚等乙烯醚類。 (5) ethyl vinyl ether, 2-chloroethyl vinyl ether, hydroxyethyl vinyl ether, Vinyl ethers such as propyl vinyl ether, butyl vinyl ether, octyl vinyl ether, and phenyl vinyl ether.

(6)乙酸乙烯酯、氯乙酸乙烯酯、丁酸乙烯酯、苯甲酸乙烯酯等乙烯酯類。 (6) Vinyl esters such as vinyl acetate, vinyl chloroacetate, vinyl butyrate, and vinyl benzoate.

(7)苯乙烯、α-甲基苯乙烯、甲基苯乙烯、氯甲基苯乙烯、對乙醯氧基苯乙烯等苯乙烯類。 (7) Styrene such as styrene, α-methylstyrene, methylstyrene, chloromethylstyrene or p-ethoxylated styrene.

(8)甲基乙烯酮、乙基乙烯酮、丙基乙烯酮、苯基乙烯酮等乙烯酮類。 (8) A ketene such as methyl ketene, ethyl ketene, propyl ketene or phenyl ketene.

(9)乙烯、丙烯、異丁烯、丁二烯、異戊二烯等烯烴類。 (9) Olefins such as ethylene, propylene, isobutylene, butadiene, and isoprene.

(10)N-乙烯基吡咯啶酮、丙烯腈、甲基丙烯腈等。 (10) N-vinylpyrrolidone, acrylonitrile, methacrylonitrile, and the like.

(11)馬來醯亞胺、N-丙烯醯基丙烯醯胺、N-乙醯基甲基丙烯醯胺、N-丙醯基甲基丙烯醯胺、N-(對氯苯甲醯基)甲基丙烯醯胺等不飽和醯亞胺。 (11) Maleic imine, N-propylene decyl acrylamide, N-acetyl methacrylamide, N-propyl methacrylamide, N-(p-chlorobenzoyl) Unsaturated quinone imine such as methacrylamide.

(12)於α位上鍵結有雜原子的甲基丙烯酸系單體。例如可列舉日本專利特開2002-309057號、日本專利特開2002-311569號等各公報中記載的化合物。 (12) A methacrylic monomer having a hetero atom bonded to the α-position. For example, the compounds described in each of the publications such as JP-A-2002-309057 and JP-A-2002-311569 can be cited.

於本發明中,藉由在本發明的範圍內將該些單體無特別 限制地組合,可應用於合成共聚物。例如,下述示出將含有該些單體的單體成分聚合而成的共聚物的一例,但本發明不限定於此。下述所示的例示化合物的組成比為莫耳%。 In the present invention, the monomers are not particularly included within the scope of the present invention. A combination of restrictions can be applied to the synthesis of copolymers. For example, an example of a copolymer obtained by polymerizing a monomer component containing these monomers is shown below, but the present invention is not limited thereto. The composition ratio of the exemplified compounds shown below is mol%.

上述黏合劑聚合物中,較佳為含有將下述通式(ED)所 表示的化合物(以下有時亦稱為「醚二聚物」)的單體成分聚合而成的重複單元。 The above binder polymer preferably contains the following formula (ED) A repeating unit obtained by polymerizing a monomer component of a compound (hereinafter sometimes referred to as "ether dimer").

(式(ED)中,R1及R2分別獨立地表示氫原子或可具有取代基的碳數1~25的烴基) (In the formula (ED), R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent)

藉此,本發明的白色感光性樹脂組成物例如可形成對於265℃下、15分鐘等的加熱而耐著色性優異的白色硬化膜。表示上述醚二聚物的上述通式(ED)中,R1及R2所表示的可具有取代基的碳數1~25的烴基並無特別限制,例如可列舉:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、第三戊基、硬脂 基、月桂基、2-乙基己基等直鏈狀或分支狀的烷基;苯基等芳基;環己基、第三丁基環己基、二環戊二烯基、三環癸基、異冰片基、金剛烷基、2-甲基-2-金剛烷基等脂環式基;1-甲氧基乙基、1-乙氧基乙基等經烷氧基取代的烷基;經苄基等芳基取代的烷基等。該些基團中,尤其就耐熱性的方面而言,較佳為甲基、乙基、環己基、苄基等般的不易因酸或熱而脫離的一級碳或二級碳的取代基。 Thus, the white photosensitive resin composition of the present invention can form, for example, a white cured film which is excellent in coloring resistance when heated at 265 ° C for 15 minutes or the like. In the above formula (ED), the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R 1 and R 2 in the above-mentioned ether dimer is not particularly limited, and examples thereof include a methyl group and an ethyl group. a linear or branched alkyl group such as n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, tert-pentyl, stearyl, lauryl or 2-ethylhexyl; benzene An aryl group; an alicyclic group such as a cyclohexyl group, a tert-butylcyclohexyl group, a dicyclopentadienyl group, a tricyclodecanyl group, an isobornyl group, an adamantyl group or a 2-methyl-2-adamantyl group; An alkyl group substituted with an alkoxy group such as 1-methoxyethyl or 1-ethoxyethyl; an alkyl group substituted with an aryl group such as a benzyl group or the like. Among these groups, in particular, in terms of heat resistance, a substituent of a primary carbon or a secondary carbon which is not easily removed by acid or heat such as a methyl group, an ethyl group, a cyclohexyl group or a benzyl group is preferable.

醚二聚物的具體例可列舉日本專利特開2012-208494號 的段落[0565](對應的美國專利申請公開第2012/235099號說明書的[0694])中記載的醚二聚物的具體例,將該些內容併入至本申請說明書中。 Specific examples of the ether dimer include Japanese Patent Laid-Open No. 2012-208494 Specific examples of the ether dimer described in the paragraph [0565] of the corresponding specification of the U.S. Patent Application Publication No. 2012/235099, the entire contents of which are incorporated herein by reference.

醚二聚物的具體例尤佳為2,2'-[氧雙(亞甲基)]雙-2-丙烯酸二甲酯、2,2'-[氧雙(亞甲基)]雙-2-丙烯酸二乙酯、2,2'-[氧雙(亞甲基)]雙-2-丙烯酸二環己酯、2,2'-[氧雙(亞甲基)]雙-2-丙烯酸二苄酯。該些醚二聚物可僅使用一種,亦可使用兩種以上。另外,對於來源於上述通式(ED)所表示的化合物的結構體而言,亦可使其他單體共聚合。 A specific example of the ether dimer is preferably 2,2'-[oxybis(methylene)]bis-2-acrylic acid dimethyl ester, 2,2'-[oxybis(methylene)]bis-2. - diethyl acrylate, 2,2'-[oxybis(methylene)]bis-2-cyclohexyl acrylate, 2,2'-[oxybis(methylene)]bis-2-acrylic acid Benzyl ester. These ether dimers may be used alone or in combination of two or more. Further, in the structure derived from the compound represented by the above formula (ED), other monomers may be copolymerized.

可與醚二聚物一起共聚合的其他單體例如可列舉:用以導入酸基的單體、用以導入自由基聚合性雙鍵的單體、用以導入環氧基的單體、及該些單體以外的其他可共聚合的單體。此種單體可僅使用一種,亦可使用兩種以上。 Examples of the other monomer copolymerizable with the ether dimer include a monomer for introducing an acid group, a monomer for introducing a radical polymerizable double bond, a monomer for introducing an epoxy group, and Other copolymerizable monomers other than the monomers. These monomers may be used alone or in combination of two or more.

用以導入酸基的單體例如可列舉:(甲基)丙烯酸或衣康酸等具有羧基的單體,N-羥基苯基馬來醯亞胺等具有酚性羥基的 單體,馬來酸酐、衣康酸酐等具有羧酸酐基的單體等。該些單體中,尤佳為(甲基)丙烯酸。 Examples of the monomer for introducing an acid group include a monomer having a carboxyl group such as (meth)acrylic acid or itaconic acid, and a phenolic hydroxyl group such as N-hydroxyphenylmaleimide. Monomer, a monomer having a carboxylic anhydride group such as maleic anhydride or itaconic anhydride. Among these monomers, (meth)acrylic acid is particularly preferred.

另外,用以導入酸基的單體亦可為可於聚合後賦予酸基的單體,例如可列舉:(甲基)丙烯酸-2-羥乙酯等具有羥基的單體、(甲基)丙烯酸縮水甘油酯等具有環氧基的單體、(甲基)丙烯酸-2-異氰酸基乙酯等具有異氰酸酯基的單體等。於使用可於聚合後賦予酸基的單體的情形時,可要求進行於聚合後賦予酸基的處理。於聚合後賦予酸基的處理視單體的種類而不同,例如可列舉以下處理。若為使用具有羥基的單體的情形,則例如可列舉:加成琥珀酸酐、四氫鄰苯二甲酸酐、馬來酸酐等酸酐的處理。若為使用具有環氧基的單體的情形,則例如可列舉:加成N-甲基胺基苯甲酸、N-甲基胺基苯酚等具有胺基與酸基的化合物,或者對加成例如(甲基)丙烯酸般的酸後所產生的羥基加成例如琥珀酸酐、四氫鄰苯二甲酸酐、馬來酸酐等酸酐的處理。若為使用具有異氰酸酯基的單體的情形,則例如可列舉:加成2-羥基丁酸等具有羥基與酸基的化合物的處理。 Further, the monomer for introducing an acid group may be a monomer which can impart an acid group after polymerization, and examples thereof include a monomer having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate, and (meth) A monomer having an epoxy group such as a glycidyl acrylate or a monomer having an isocyanate group such as 2-isocyanatoethyl (meth)acrylate. In the case of using a monomer which can impart an acid group after polymerization, treatment for imparting an acid group after polymerization can be required. The treatment for imparting an acid group after the polymerization differs depending on the kind of the monomer, and examples thereof include the following treatments. In the case of using a monomer having a hydroxyl group, for example, a treatment of adding an acid anhydride such as succinic anhydride, tetrahydrophthalic anhydride or maleic anhydride can be mentioned. In the case of using a monomer having an epoxy group, for example, a compound having an amine group and an acid group such as N-methylaminobenzoic acid or N-methylaminophenol may be added, or addition For example, a hydroxyl group produced by an acid such as (meth)acrylic acid is added to an acid anhydride such as succinic anhydride, tetrahydrophthalic anhydride or maleic anhydride. In the case of using a monomer having an isocyanate group, for example, a treatment of a compound having a hydroxyl group and an acid group such as 2-hydroxybutyric acid may be added.

於使含有通式(ED)所表示的化合物的單體成分聚合而 成的聚合物含有用以導入酸基的單體的情形時,該用以導入酸基的單體的含有比例並無特別限制,於所有單體成分中,較佳為5質量%~70質量%,更佳為10質量%~60質量%。 Polymerizing a monomer component containing a compound represented by the general formula (ED) When the formed polymer contains a monomer for introducing an acid group, the content ratio of the monomer for introducing an acid group is not particularly limited, and among all the monomer components, it is preferably 5% by mass to 70% by mass. %, more preferably 10% by mass to 60% by mass.

用以導入自由基聚合性雙鍵的單體例如可列舉:(甲基) 丙烯酸、衣康酸等具有羧基的單體;馬來酸酐、衣康酸酐等具有 羧酸酐基的單體;(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧環己基甲酯、鄰(或間、或對)乙烯基苄基縮水甘油醚等具有環氧基的單體等。於使用用以導入自由基聚合性雙鍵的單體的情形時,必須進行用以於聚合後賦予自由基聚合性雙鍵的處理。用以於聚合後賦予自由基聚合性雙鍵的處理視所使用的可賦予自由基聚合性雙鍵的單體的種類而不同,例如可列舉以下處理。若為使用(甲基)丙烯酸或衣康酸等具有羧基的單體的情形,則可列舉:加成(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧環己基甲酯、鄰(或間、或對)乙烯基苄基縮水甘油醚等具有環氧基與自由基聚合性雙鍵的化合物的處理。若為使用馬來酸酐或衣康酸酐等具有羧酸酐基的單體的情形,則可列舉:加成(甲基)丙烯酸-2-羥乙酯等具有羥基與自由基聚合性雙鍵的化合物的處理。若為使用(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸-3,4-環氧環己基甲酯、鄰(或間、或對)乙烯基苄基縮水甘油醚等具有環氧基的單體的情形,則可列舉:加成(甲基)丙烯酸等具有酸基與自由基聚合性雙鍵的化合物的處理。 Examples of the monomer for introducing a radical polymerizable double bond include (meth) a monomer having a carboxyl group such as acrylic acid or itaconic acid; maleic anhydride, itaconic anhydride, etc. a carboxylic anhydride group-containing monomer; (meth)acrylic acid glycidyl ester, (meth)acrylic acid-3,4-epoxycyclohexylmethyl ester, o- (or m- or p-)vinylbenzyl glycidyl ether, etc. A monomer such as an epoxy group. When a monomer for introducing a radically polymerizable double bond is used, it is necessary to carry out a treatment for imparting a radical polymerizable double bond after polymerization. The treatment for imparting a radically polymerizable double bond after the polymerization differs depending on the type of the monomer capable of imparting a radical polymerizable double bond, and examples thereof include the following treatments. When a monomer having a carboxyl group such as (meth)acrylic acid or itaconic acid is used, an addition of glycidyl (meth)acrylate or a 3,4-epoxycyclohexyl (meth)acrylate may be mentioned. Treatment of a compound having an epoxy group and a radical polymerizable double bond such as a methyl ester, o- (or m- or p-) vinylbenzyl glycidyl ether. When a monomer having a carboxylic anhydride group such as maleic anhydride or itaconic anhydride is used, a compound having a hydroxyl group and a radical polymerizable double bond such as 2-hydroxyethyl (meth)acrylate may be added. Processing. If using glycidyl (meth)acrylate, -3,4-epoxycyclohexylmethyl (meth)acrylate, o- (or m- or p-) vinylbenzyl glycidyl ether, etc. In the case of a monomer, a treatment of a compound having an acid group and a radical polymerizable double bond such as (meth)acrylic acid may be mentioned.

於將含有通式(ED)所表示的化合物的單體成分聚合而 成的聚合物含有用以導入自由基聚合性雙鍵的單體的情形時,該用以導入自由基聚合性雙鍵的單體的含有比例並無特別限制,於所有單體成分中,較佳為5質量%~70質量%,更佳為10質量%~60質量%。 Polymerizing a monomer component containing a compound represented by the general formula (ED) When the formed polymer contains a monomer for introducing a radically polymerizable double bond, the content ratio of the monomer for introducing the radical polymerizable double bond is not particularly limited, and among all the monomer components, Preferably, it is 5 mass% to 70 mass%, more preferably 10 mass% to 60 mass%.

用以導入環氧基的單體例如可列舉:(甲基)丙烯酸縮水 甘油酯、(甲基)丙烯酸-3,4-環氧環己基甲酯、鄰(或間、或對)乙烯基苄基縮水甘油醚等。 Examples of the monomer for introducing an epoxy group include (meth)acrylic acid shrinkage. A glyceride, a 3,4-epoxycyclohexylmethyl (meth)acrylate, an o- (or m- or p-) vinylbenzyl glycidyl ether, and the like.

於將含有通式(ED)所表示的化合物的單體成分聚合而成的聚合物含有用以導入環氧基的單體的情形時,該用以導入環氧基的單體的含有比例並無特別限制,於所有單體成分中,較佳為5質量%~70質量%,更佳為10質量%~60質量%。 In the case where the polymer obtained by polymerizing the monomer component containing the compound represented by the general formula (ED) contains a monomer for introducing an epoxy group, the content ratio of the monomer for introducing the epoxy group is It is not particularly limited, and is preferably 5% by mass to 70% by mass, and more preferably 10% by mass to 60% by mass based on all the monomer components.

其他可共聚合的單體例如可列舉:(甲基)丙烯酸甲酯、 (甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸甲基2-乙基己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸2-羥乙酯等(甲基)丙烯酸酯類;苯乙烯、乙烯基甲苯、α-甲基苯乙烯等芳香族乙烯系化合物;N-苯基馬來醯亞胺、N-環己基馬來醯亞胺等N-取代馬來醯亞胺類;丁二烯、異戊二烯等丁二烯或經取代的丁二烯化合物;乙烯、丙烯、氯乙烯、丙烯腈等乙烯或經取代的乙烯化合物;乙酸乙烯酯等乙烯酯類等。該些單體中,就透明性良好、不易損及耐熱性的方面而言,較佳為(甲基)丙烯酸甲酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、苯乙烯。 Examples of other copolymerizable monomers include methyl (meth)acrylate, Ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, (meth)acrylic acid Tributyl ester, methyl 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, etc. (methyl) Acrylates; aromatic vinyl compounds such as styrene, vinyl toluene, and α-methylstyrene; N-substituted maleates such as N-phenylmaleimide and N-cyclohexylmaleimide Imines; butadiene or substituted butadiene compounds such as butadiene and isoprene; ethylene or substituted ethylene compounds such as ethylene, propylene, vinyl chloride and acrylonitrile; vinyl esters such as vinyl acetate Wait. Among these monomers, methyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, and benzene are preferred in terms of good transparency and resistance to heat resistance. Ethylene.

於將含有通式(ED)所表示的化合物的單體成分聚合而 成的聚合物含有其他可共聚合的單體的情形時,該其他可共聚合的單體的含有比例並無特別限制,較佳為95質量%以下,更佳為85質量%以下。 Polymerizing a monomer component containing a compound represented by the general formula (ED) When the formed polymer contains another copolymerizable monomer, the content ratio of the other copolymerizable monomer is not particularly limited, but is preferably 95% by mass or less, and more preferably 85% by mass or less.

將含有通式(ED)所表示的化合物的單體成分聚合而成的聚合物的重量平均分子量並無特別限制,就白色感光性樹脂組成物的黏度、及藉由該組成物所形成的塗膜的耐熱性的觀點而言,較佳為2000~200000,更佳為5000~100000,進而佳為5000~20000。 The weight average molecular weight of the polymer obtained by polymerizing the monomer component containing the compound represented by the general formula (ED) is not particularly limited, and the viscosity of the white photosensitive resin composition and the coating formed by the composition are not particularly limited. From the viewpoint of heat resistance of the film, it is preferably from 2,000 to 200,000, more preferably from 5,000 to 100,000, and still more preferably from 5,000 to 20,000.

另外,於將含有通式(ED)所表示的化合物的單體成分聚合而成的聚合物具有酸基的情形時,酸值以較佳為30mgKOH/g~500mgKOH/g、更佳為50mgKOH/g~400mgKOH/g為宜。 In the case where the polymer obtained by polymerizing the monomer component containing the compound represented by the general formula (ED) has an acid group, the acid value is preferably from 30 mgKOH/g to 500 mgKOH/g, more preferably 50 mgKOH/ G~400mgKOH/g is preferred.

將含有通式(ED)所表示的化合物的單體成分聚合而成 的聚合物可藉由將至少含有醚二聚物的上述單體聚合而容易地獲得。此時,於聚合的同時進行醚二聚物的環化反應而形成四氫吡喃環結構。 Polymerization of a monomer component containing a compound represented by the general formula (ED) The polymer can be easily obtained by polymerizing the above monomer containing at least an ether dimer. At this time, the cyclization reaction of the ether dimer is carried out at the same time as the polymerization to form a tetrahydropyran ring structure.

將含有通式(ED)所表示的化合物的單體成分聚合而成的聚合物的合成時所應用的聚合方法並無特別限制,可採用先前公知的各種聚合方法,尤佳為利用溶液聚合法。詳細而言,例如可依據日本專利特開2004-300204號公報中記載的聚合物(a)的合成方法,來合成將含有通式(ED)所表示的化合物的單體成分聚合而成的聚合物。 The polymerization method to be used in the synthesis of the polymer obtained by polymerizing the monomer component containing the compound represented by the general formula (ED) is not particularly limited, and various conventionally known polymerization methods can be employed, and it is particularly preferred to use a solution polymerization method. . Specifically, for example, a polymerization method in which a monomer component containing a compound represented by the general formula (ED) is polymerized can be synthesized according to a method for synthesizing the polymer (a) described in JP-A-2004-300204. Things.

以下,示出將含有通式(ED)所表示的化合物的單體成 分聚合而成的聚合物的例示化合物,但本發明不限定於該些化合物。下述所示的例示化合物的組成比為莫耳%。 Hereinafter, the monomer containing the compound represented by the general formula (ED) is shown. Exemplary compounds of the polymer obtained by partial polymerization, but the present invention is not limited to these compounds. The composition ratio of the exemplified compounds shown below is mol%.

[化5] [Chemical 5]

於本發明中,尤佳為使2,2'-[氧雙(亞甲基)]雙-2-丙烯酸 二甲酯(以下稱為「DM」)、甲基丙烯酸苄酯(以下稱為「BzMA」)、甲基丙烯酸甲酯(以下稱為「MMA」)、甲基丙烯酸(以下稱為「MAA」)、2-羥基丙二醇二甲基丙烯酸酯(以下稱為「X」)共聚 合而成的聚合物。尤佳為DM:BzMA:MMA:MAA:X的莫耳比為5~15:40~50:5~15:5~15:20~30。較佳為構成本發明中所用的共聚物的成分的95質量%以上為該些成分。另外,該聚合物的重量平均分子量較佳為9000~20000。 In the present invention, it is especially preferred to make 2,2'-[oxybis(methylene)]bis-2-acrylic acid. Dimethyl ester (hereinafter referred to as "DM"), benzyl methacrylate (hereinafter referred to as "BzMA"), methyl methacrylate (hereinafter referred to as "MMA"), methacrylic acid (hereinafter referred to as "MAA") ), 2-hydroxypropanediol dimethacrylate (hereinafter referred to as "X") copolymerization The resulting polymer. Youjia is DM:BzMA:MMA:MAA:X has a molar ratio of 5~15:40~50:5~15:5~15:20~30. It is preferred that 95% by mass or more of the components constituting the copolymer used in the present invention are the components. Further, the weight average molecular weight of the polymer is preferably from 9000 to 20,000.

本發明中所用的聚合物較佳為重量平均分子量(由凝膠滲透層析(Gel Permeation Chromatography,GPC)法測定的聚苯乙烯換算值)為1000~2×105,更佳為2000~1×105,進而佳為5000~5×104The polymer used in the present invention preferably has a weight average molecular weight (polystyrene equivalent value measured by Gel Permeation Chromatography (GPC) method) of 1000 to 2 × 10 5 , more preferably 2000 to 1 ×10 5 , and further preferably 5000~5×10 4 .

本發明的白色感光性樹脂組成物中可使用的黏合劑聚 合物的重量平均分子量(由GPC法測定的聚苯乙烯換算值)較佳為5,000以上,更佳為1萬以上、30萬以下的範圍,數量平均分子量較佳為1,000以上,更佳為2,000以上、25萬以下的範圍。分散度(重量平均分子量/數量平均分子量)較佳為1以上,更佳為1.1以上、10以下的範圍。 A binder that can be used in the white photosensitive resin composition of the present invention The weight average molecular weight (polystyrene equivalent value measured by GPC method) of the compound is preferably 5,000 or more, more preferably 10,000 or more and 300,000 or less, and the number average molecular weight is preferably 1,000 or more, more preferably 2,000. Above, the range of 250,000 or less. The degree of dispersion (weight average molecular weight / number average molecular weight) is preferably 1 or more, more preferably 1.1 or more and 10 or less.

該些黏合劑聚合物可為無規聚合物、嵌段聚合物、接枝聚合物等的任一種。 The binder polymer may be any of a random polymer, a block polymer, a graft polymer, and the like.

本發明中可使用的黏合劑聚合物可藉由先前公知的方 法來合成。合成時所用的溶劑例如可列舉:四氫呋喃、二氯乙烯、環己酮、甲基乙基酮、丙酮、甲醇、乙醇、乙二醇單甲醚、乙二醇單乙醚、2-甲氧基乙基乙酸酯、二乙二醇二甲醚、1-甲氧基-2-丙醇、1-甲氧基-2-丙基乙酸酯、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、甲苯、乙酸乙酯、乳酸甲酯、乳酸乙酯、二甲基亞碸、 水等。該些溶劑可單獨使用或混合使用兩種以上。 The binder polymer which can be used in the present invention can be obtained by a previously known method. Method to synthesize. Examples of the solvent used in the synthesis include tetrahydrofuran, dichloroethylene, cyclohexanone, methyl ethyl ketone, acetone, methanol, ethanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and 2-methoxyB. Acetate, diethylene glycol dimethyl ether, 1-methoxy-2-propanol, 1-methoxy-2-propyl acetate, N,N-dimethylformamide, N , N-dimethylacetamide, toluene, ethyl acetate, methyl lactate, ethyl lactate, dimethyl hydrazine, Water, etc. These solvents may be used alone or in combination of two or more.

合成於本發明的白色感光性樹脂組成物中可使用的黏合劑聚合物時所用的自由基聚合起始劑可列舉:偶氮系起始劑、過氧化物起始劑等公知的化合物。 The radical polymerization initiator used in the case of the binder polymer which can be used for the white photosensitive resin composition of the present invention is exemplified by a known compound such as an azo initiator or a peroxide initiator.

本發明的白色感光性樹脂組成物中,黏合劑聚合物可單獨使用一種,或組合使用兩種以上。 In the white photosensitive resin composition of the present invention, the binder polymer may be used alone or in combination of two or more.

相對於白色感光性樹脂組成物的總固體成分,黏合劑聚合物的含量較佳為1質量%以上、60質量%以下,更佳為3質量%以上、50質量%以下,進而佳為5質量%以上、46質量%以下,進而更佳為20質量%以上、46質量%以下,尤佳為24質量%以上、46質量%以下。 The content of the binder polymer is preferably 1% by mass or more and 60% by mass or less, more preferably 3% by mass or more and 50% by mass or less, and further preferably 5% by mass based on the total solid content of the white photosensitive resin composition. % or more and 46% by mass or less, more preferably 20% by mass or more and 46% by mass or less, and particularly preferably 24% by mass or more and 46% by mass or less.

[(B)聚合性單體] [(B) Polymerizable monomer]

(B)聚合性單體較佳為使用具有至少1個乙烯性不飽和雙鍵的加成聚合性化合物,更佳為使用具有至少1個、較佳為2個以上的末端乙烯性不飽和鍵的化合物。此種化合物於該技術領域中廣為人知,本發明中可無特別限定地使用該些化合物。 (B) The polymerizable monomer is preferably an addition polymerizable compound having at least one ethylenically unsaturated double bond, and more preferably has at least one, preferably two or more terminal ethylenically unsaturated bonds. compound of. Such compounds are widely known in the art, and the compounds can be used without particular limitation in the present invention.

另外,(B)聚合性單體亦較佳為具有至少1個可進行加成聚合的乙烯基、且於常壓下具有100℃以上的沸點的具有乙烯性不飽和基的化合物。其例子可列舉:聚乙二醇單(甲基)丙烯酸酯、聚丙二醇單(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基乙酯等單官能的丙烯酸酯或甲基丙烯酸酯;聚乙二醇二(甲基)丙烯酸酯、三羥甲基乙烷三(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇三 (甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、己二醇(甲基)丙烯酸酯、三羥甲基丙烷三(丙烯醯氧基丙基)醚、異三聚氰酸三(丙烯醯氧基乙基)酯及該些化合物的混合物,較佳為季戊四醇四(甲基)丙烯酸酯。 Further, the (B) polymerizable monomer is also preferably a compound having an ethylenically unsaturated group having at least one vinyl group capable of undergoing addition polymerization and having a boiling point of 100 ° C or higher at normal pressure. Examples thereof include monofunctional acrylates or methacrylates such as polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and phenoxyethyl (meth)acrylate; Ethylene glycol di(meth)acrylate, trimethylolethane tri(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol III (Meth) acrylate, pentaerythritol tetra(meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, hexane diol (meth) acrylate, trimethylol Propane tris(propylene methoxypropyl)ether, tris(propylene methoxyethyl) isocyanurate and a mixture of these compounds are preferably pentaerythritol tetra(meth)acrylate.

其中,聚合性單體等較佳為季戊四醇四丙烯酸酯(市售品為A-TMMT;新中村化學工業股份有限公司製造)、二季戊四醇三丙烯酸酯(市售品為卡亞拉徳(KAYARAD)D-330;日本化藥股份有限公司製造)、二季戊四醇四丙烯酸酯(市售品為卡亞拉徳(KAYARAD)D-320;日本化藥股份有限公司製造)、二季戊四醇五(甲基)丙烯酸酯(市售品為卡亞拉徳(KAYARAD)D-310;日本化藥股份有限公司製造)、二季戊四醇六(甲基)丙烯酸酯(市售品為卡亞拉徳(KAYARAD)DPHA;日本化藥股份有限公司製造),更佳為季戊四醇四丙烯酸酯。 Among them, the polymerizable monomer or the like is preferably pentaerythritol tetraacrylate (commercially available as A-TMMT; manufactured by Shin-Nakamura Chemical Co., Ltd.) and dipentaerythritol triacrylate (commercially available as KAYARAD). D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (commercial product is KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta (methyl) Acrylate (commercial product is KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth) acrylate (commercial product is KAYARAD DPHA; It is more preferably pentaerythritol tetraacrylate.

聚合性單體等亦可為多官能單體,且具有羧基、磺酸基、磷酸基等酸基。因此,乙烯性化合物只要如上述為混合物的情形般具有未反應的羧基,則可直接利用,視需要亦可使非芳香族羧酸酐與上述乙烯性化合物的羥基反應而導入酸基。於該情形時,所使用的非芳香族羧酸酐的具體例可列舉:四氫鄰苯二甲酸酐、烷基化四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、烷基化六氫鄰苯二甲酸酐、琥珀酸酐、馬來酸酐。 The polymerizable monomer or the like may be a polyfunctional monomer and has an acid group such as a carboxyl group, a sulfonic acid group or a phosphoric acid group. Therefore, the ethylenic compound can be used as it is if it has an unreacted carboxyl group as described above, and if necessary, a non-aromatic carboxylic anhydride can be reacted with a hydroxyl group of the above-mentioned ethylenic compound to introduce an acid group. In this case, specific examples of the non-aromatic carboxylic anhydride to be used include tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and alkylated six. Hydrogen phthalic anhydride, succinic anhydride, maleic anhydride.

於本發明中,具有酸基的單體為脂肪族多羥基化合物與 不飽和羧酸的酯,較佳為使非芳香族羧酸酐與脂肪族多羥基化合物的未反應的羥基反應而具有酸基的多官能單體,尤佳為該酯中脂肪族多羥基化合物為季戊四醇及/或二季戊四醇者。市售品例如可列舉:東亞合成股份有限公司製造的作為多元酸改質丙烯酸系低聚物的亞羅尼斯(Aronix)系列的M-305、M-510、M-520等。 In the present invention, the monomer having an acid group is an aliphatic polyhydroxy compound and The ester of an unsaturated carboxylic acid is preferably a polyfunctional monomer having an acid group by reacting a non-aromatic carboxylic anhydride with an unreacted hydroxyl group of an aliphatic polyhydroxy compound, and particularly preferably an aliphatic polyhydroxy compound in the ester. Pentaerythritol and / or dipentaerythritol. For example, M-305, M-510, M-520, etc. of the Aronix series which are polyacid-modified acryl-type oligomers manufactured by the East Asia Synthetic Co., Ltd. are mentioned.

具有酸基的多官能單體的較佳酸值為0.1mg-KOH/g~40mg-KOH/g,尤佳為5mg-KOH/g~30mg-KOH/g。於併用兩種以上的酸基不同的多官能單體的情形、或併用不具有酸基的多官能單體的情形時,必須以多官能單體總體的酸值在上述範圍內的方式製備。 The preferred acid value of the polyfunctional monomer having an acid group is from 0.1 mg-KOH/g to 40 mg-KOH/g, and more preferably from 5 mg-KOH/g to 30 mg-KOH/g. In the case where a polyfunctional monomer having two or more acid groups is used in combination or a polyfunctional monomer having no acid group is used in combination, it is necessary to prepare in such a manner that the acid value of the entire polyfunctional monomer is within the above range.

關於該些聚合性單體,其結構、單獨使用或併用、添加 量等使用方法的詳細情況可根據白色感光性樹脂組成物的最終的性能設計而任意設定。例如根據如下觀點來選擇。 Regarding the polymerizable monomers, their structures, used alone or in combination, and added The details of the method of use such as the amount can be arbitrarily set according to the final performance design of the white photosensitive resin composition. For example, it is selected according to the following points.

就感度的方面而言,較佳為每一分子的不飽和基含量多的結構,於多數情況下較佳為二官能以上。另外,為了提高硬化膜的強度,以三官能以上者為宜,進而,藉由併用官能數不同、聚合性基不同(例如丙烯酸酯、甲基丙烯酸酯、苯乙烯系化合物、乙烯醚系化合物)者來調節感度與強度兩者的方法亦有效。 In terms of sensitivity, a structure having a large content of unsaturated groups per molecule is preferred, and in many cases, it is preferably a difunctional or higher. In addition, in order to increase the strength of the cured film, it is preferable to use a trifunctional or higher functional group, and further, the functional group is different and the polymerizable group is different (for example, an acrylate, a methacrylate, a styrene compound, or a vinyl ether compound). The method of adjusting both sensitivity and intensity is also effective.

另外,對於與白色感光性樹脂組成物所含有的其他成分(例如聚合起始劑、二氧化鈦粒子等)的相容性、分散性而言,聚合性單體的選擇、使用法為重要的因素,例如有時藉由使用低純度化合物或併用兩種以上的其他成分來提高相容性。另外,亦可為 了提高與基板等硬質表面的密接性而選擇特定的結構。 In addition, the compatibility and dispersibility of other components (for example, a polymerization initiator, titanium dioxide particles, and the like) contained in the white photosensitive resin composition, the selection and use of the polymerizable monomer are important factors. For example, compatibility may be improved by using a low-purity compound or using two or more other components in combination. In addition, it can also be A specific structure is selected by improving the adhesion to a hard surface such as a substrate.

相對於白色感光性樹脂組成物的總固體成分,(B)聚合性單體的含量較佳為1質量%~40質量%的範圍,更佳為3質量%~35質量%的範圍,進而佳為5質量%~30質量%的範圍。 The content of the (B) polymerizable monomer is preferably in the range of 1% by mass to 40% by mass, more preferably in the range of 3% by mass to 35% by mass, even more preferably based on the total solid content of the white photosensitive resin composition. It is in the range of 5 mass% to 30 mass%.

若(B)聚合性單體的含量為該範圍內,則防止著色且硬化性良好而較佳。 When the content of the (B) polymerizable monomer is within this range, coloring is prevented and the curability is good, which is preferable.

[(C)聚合起始劑] [(C) Polymerization initiator]

本發明的白色感光性樹脂組成物含有聚合起始劑(C)。藉此提高硬化性。 The white photosensitive resin composition of the present invention contains a polymerization initiator (C). Thereby the hardenability is improved.

上述聚合起始劑只要具有引發上述聚合性化合物的聚合的能力,則並無特別限制,可自公知的聚合起始劑中適當選擇。 The polymerization initiator is not particularly limited as long as it has the ability to initiate polymerization of the polymerizable compound, and can be appropriately selected from known polymerization initiators.

另外,就使後述利用放射線照射進行的曝光步驟中的硬化良好的觀點等而言,例如較佳為對紫外線範圍至可見的光線具有感放射線性者。另外,亦可為與經光激發的增感劑發生某些作用而生成活性自由基的活性劑,亦可為根據單體的種類而引發陽離子聚合般的起始劑。 In addition, for the viewpoint of good hardening in the exposure step by radiation irradiation described later, for example, it is preferable to have a radiation-sensitive linearity to the visible light in the ultraviolet range. Further, it may be an active agent which generates a living radical by some action with a photo-excited sensitizer, or may be an initiator which initiates cationic polymerization depending on the kind of the monomer.

另外,上述聚合起始劑較佳為含有至少一種於約300nm~800nm(更佳為330nm~500nm)的範圍內具有至少約50的分子吸光係數的化合物。 Further, the above polymerization initiator is preferably a compound containing at least one molecular absorption coefficient of at least about 50 in the range of about 300 nm to 800 nm, more preferably 330 nm to 500 nm.

聚合起始劑較佳為肟系化合物,更佳為肟酯系化合物。 The polymerization initiator is preferably an anthraquinone compound, more preferably an oxime ester compound.

肟系起始劑的具體例可使用日本專利特開2001-233842號公報記載的化合物、日本專利特開2000-80068號公報記載的化合 物、日本專利特開2006-342166號公報記載的化合物。 Specific examples of the oxime-based initiators include the compounds described in JP-A-2001-233842, and the compounds described in JP-A-2000-80068. The compound described in JP-A-2006-342166.

本發明中,可較佳地用作聚合起始劑的肟衍生物等肟化 合物例如可列舉:3-苯甲醯氧基亞胺基丁烷-2-酮、3-乙醯氧基亞胺基丁烷-2-酮、3-丙醯氧基亞胺基丁烷-2-酮、2-乙醯氧基亞胺基戊烷-3-酮、2-乙醯氧基亞胺基-1-苯基丙烷-1-酮、2-苯甲醯氧基亞胺基-1-苯基丙烷-1-酮、3-(4-甲苯磺醯氧基)亞胺基丁烷-2-酮及2-乙氧基羰氧基亞胺基-1-苯基丙烷-1-酮等。 In the present invention, an antimony derivative or the like which can be preferably used as a polymerization initiator Examples of the compound include 3-benzylideneoxyimidobutan-2-one, 3-ethyloxyiminobutane-2-one, and 3-propoxyaniminobutane. 2-keto, 2-ethoxymethoxyiminopentan-3-one, 2-ethoxymethoxyimino-1-phenylpropan-1-one, 2-benzylideneoxyimine 1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one and 2-ethoxycarbonyloxyimino-1-phenylpropane -1-ketone and the like.

肟酯化合物可列舉:「英國化學會志(Journal of the Chemical Society,J.C.S.)普爾金會刊(Perkin)II(1979年)」pp.1653-1660、「英國化學會志(Journal of the Chemical Society,J.C.S.)普爾金會刊(Perkin)II(1979年)」pp.156-162、「光聚合物科學及技術期刊(Journal of Photopolymer Science and Technology)(1995年)」pp.202-232、「應用聚合物科學期刊(Journal of Applied Polymer Science)(2012年)」pp.725-731、日本專利特開2000-66385號公報記載的化合物,日本專利特開2000-80068號公報、日本專利特表2004-534797號公報、日本專利特開2006-342166號公報的各公報中記載的化合物等。 The oxime ester compound can be listed as: "Journal of the Chemical Society, JCS) Perkin II (1979) pp. 1653-1660, "Journal of the Chemical Society (JCS) Perkin II (1979) Pp. 156-162, Journal of Photopolymer Science and Technology (1995) pp. 202-232, Journal of Applied Polymer Science (2012) Pp. 725-731, Japanese Patent Publication No. 2000-66385, Japanese Patent Laid-Open Publication No. 2000-80068, Japanese Patent Publication No. 2004-534797, and Japanese Patent Laid-Open No. 2006-342166 The compounds and the like described in each of the publications.

另外,亦可使用以下化合物作為上述記載以外的肟酯化 合物:於咔唑N位上連結有肟的日本專利特表2009-519904號公報中記載的化合物、於二苯甲酮部位上導入有雜取代基的美國專利7626957號公報中記載的化合物、於色素部位上導入有硝基的日本專利特開2010-15025號公報及美國專利公開2009-292039號 記載的化合物、國際公開專利2009-131189號公報中記載的酮肟系化合物、於同一分子內含有三嗪骨架與肟骨架的美國專利7556910號公報中記載的化合物、於405nm下具有最大吸收且對g射線光源具有良好的感度的日本專利特開2009-221114號公報記載的化合物等。 Further, the following compounds may also be used as the oxime esterification other than the above description. A compound described in Japanese Patent Laid-Open Publication No. 2009-519904, which is incorporated in the N-position of the carbazole, and a compound described in US Pat. No. 7,626,957, the disclosure of which is incorporated herein by reference. Japanese Patent Laid-Open Publication No. 2010-15025, which incorporates a nitro group, and a US Patent Publication No. 2009-292039 The compound described in Japanese Laid-Open Patent Publication No. 2009-131189, the compound described in U.S. Patent No. 7,556,910, which contains a triazine skeleton and an anthracene skeleton in the same molecule, has maximum absorption at 405 nm and is The compound described in JP-A-2009-221114, which has a good sensitivity, is a g-ray source.

進而,亦可較佳地使用日本專利特開2007-231000號公報及日本專利特開2007-322744號公報中記載的環狀肟化合物。環狀肟化合物中,尤其日本專利特開2010-32985號公報、日本專利特開2010-185072號公報中記載的於咔唑色素上縮環而成的環狀肟化合物具有高的光吸收性,可實現高感度化。 Further, a cyclic ruthenium compound described in JP-A-2007-2310 and JP-A-2007-322744 can be preferably used. Among the cyclic ruthenium compounds, the cyclic ruthenium compound which is condensed on the carbazole dye described in Japanese Patent Laid-Open Publication No. 2010-185072, and the like, has a high light absorbing property. High sensitivity can be achieved.

另外,於肟化合物的特定部位上具有不飽和鍵的日本專利特開2009-242469號公報中記載的化合物由聚合非活性自由基來再生活性自由基,由此亦可達成高感度化。 In addition, the compound described in JP-A-2009-242469, which has an unsaturated bond at a specific site of the ruthenium compound, can regenerate the active radical by polymerizing an inactive radical, thereby achieving high sensitivity.

除此以外,亦可列舉日本專利特開2007-269779號公報中揭示的具有特定取代基的肟化合物、或日本專利特開2009-191061號公報中揭示的具有硫代芳基的肟化合物。 In addition, a ruthenium compound having a specific substituent disclosed in Japanese Laid-Open Patent Publication No. 2007-269779, or a ruthenium compound having a thioaryl group disclosed in JP-A-2009-191061, may be mentioned.

其中,聚合起始劑(C)尤佳為下述通式(A)所表示的肟酯系化合物。 Among them, the polymerization initiator (C) is particularly preferably an oxime ester compound represented by the following formula (A).

[化7] [Chemistry 7]

上述通式(A)中,R1、R2及R3分別獨立地表示一價取代基。 In the above formula (A), R 1 , R 2 and R 3 each independently represent a monovalent substituent.

再者,該化合物可為肟的N-O鍵為(E)體的肟化合物,亦可為(Z)體的肟化合物,亦可為(E)體與(Z)體的混合物。 Further, the compound may be a ruthenium compound in which the N-O bond of ruthenium is (E), a ruthenium compound of the (Z) form, or a mixture of the (E) form and the (Z) form.

關於R1的一價取代基並無特別限制,可列舉芳基、雜環基等。另外,該些基團亦可具有一個以上的進一步的取代基。 The monovalent substituent of R 1 is not particularly limited, and examples thereof include an aryl group and a heterocyclic group. Additionally, the groups may have more than one further substituent.

芳基較佳為碳數6~30的芳基。 The aryl group is preferably an aryl group having 6 to 30 carbon atoms.

雜環基較佳為含有氮原子、氧原子、硫原子或磷原子的芳香族或脂肪族的雜環。 The heterocyclic group is preferably an aromatic or aliphatic heterocyclic ring containing a nitrogen atom, an oxygen atom, a sulfur atom or a phosphorus atom.

關於R1的芳基、雜環基可具有的進一步的取代基可列舉:烷基、芳基、烷氧基、芳氧基、醯氧基、醯基、烷氧基羰基、胺基、雜環基、鹵素原子等。 Further examples of the substituent which the aryl group and the heterocyclic group of R 1 may have include an alkyl group, an aryl group, an alkoxy group, an aryloxy group, a decyloxy group, a decyl group, an alkoxycarbonyl group, an amine group, and a hetero group. A ring group, a halogen atom, or the like.

其中,R1尤佳為以下所示的結構Sub-1~結構Sub-11。 Among them, R 1 is particularly preferably a structure Sub-1 to Sub-11 shown below.

再者,以下所示的基團中,「*」表示與上述通式(A)中的羰基Y的鍵結位置,各基團亦可具有一個以上的進一步的取代基。進一步的取代基如上所述。 Further, in the group shown below, "*" indicates a bonding position with the carbonyl group Y in the above formula (A), and each group may have one or more further substituents. Further substituents are as described above.

[化8] [化8]

關於R2的一價取代基並無特別限制,可列舉烷基、環 烷基、炔基等,較佳為碳數1~12,更佳為烷基。另外,該些基團亦可具有一個以上的進一步的取代基。 The monovalent substituent of R 2 is not particularly limited, and examples thereof include an alkyl group, a cycloalkyl group, and an alkynyl group, and preferably a carbon number of 1 to 12, more preferably an alkyl group. Additionally, the groups may have more than one further substituent.

關於R2的烷基、環烷基、炔基可具有的進一步的取代基可列舉:己基;上文中作為關於R1的芳基、雜環基可具有的進一步的取代基所已述的進一步的取代基等,較佳為芳硫基,就提高感度、抑制由加熱經時所致的著色的方面而言,作為該進一步的取代基的芳硫基更佳為經取代或未經取代的苯硫基,就感度的方面而言,進而佳為以下所示的結構。再者,Me表示甲基,Et表示乙基。 Further substituents which the alkyl group, the cycloalkyl group and the alkynyl group of R 2 may have include a hexyl group; further described above as a further substituent which the aryl group and the heterocyclic group of R 1 may have. The substituent or the like is preferably an arylthio group, and the arylthio group as the further substituent is more preferably substituted or unsubstituted in terms of improving sensitivity and suppressing coloration caused by heating over time. The phenylthio group is preferably a structure shown below in terms of sensitivity. Further, Me represents a methyl group, and Et represents an ethyl group.

[化9] [Chemistry 9]

關於R3的一價取代基並無特別限制,可列舉烷基、芳 基等。另外,該些基團亦可具有一個以上的進一步的取代基。 The monovalent substituent of R 3 is not particularly limited, and examples thereof include an alkyl group and an aryl group. Additionally, the groups may have more than one further substituent.

關於R3的烷基可列舉上文中作為關於R2的一價取代基所已述的烷基。 The alkyl group for R 3 may, for example, be an alkyl group as described above as a monovalent substituent for R 2 .

關於R3的芳基可列舉上文中作為關於R1的一價取代基所已述的芳基。 The aryl group as described above for R 3 may be exemplified above as the monovalent substituent for R 1 .

關於R3的烷基、芳基可具有的進一步的取代基可列舉:上文中作為關於R1的芳基、雜環基可具有的進一步的取代基所已述的進一步的取代基。 Further substituents which the alkyl group and the aryl group of R 3 may have include the above-mentioned further substituents which are described as further examples of the aryl group of R 1 and the further substituent which the heterocyclic group may have.

以下示出可較佳地使用的肟化合物的具體例(PIox-1) ~具體例(PIox-13),但本發明不限定於該些具體例。 Specific examples of the ruthenium compound which can be preferably used are shown below (PIox-1) ~ Specific example (PIox-13), but the present invention is not limited to these specific examples.

[化10] [化10]

市售品中可較佳地使用伊魯卡(IRGACURE)-OXE01(巴斯夫(BASF)公司製造)、伊魯卡(IRGACURE)-OXE02(巴斯夫(BASF)公司製造),尤佳為伊魯卡(IRGACURE)-OXE01(巴斯夫(BASF)公司製造)。 Among the commercially available products, IRGACURE-OXE01 (manufactured by BASF), IRGACURE-OXE02 (manufactured by BASF), and especially Iruka (or IRGACURE)-OXE01 (manufactured by BASF).

肟化合物於350nm~500nm的波長範圍內具有最大吸收波長,較佳為於360nm~480nm的波長範圍內具有吸收波長,尤佳為365nm處及455nm處的吸光度高。 The ruthenium compound has a maximum absorption wavelength in a wavelength range of 350 nm to 500 nm, preferably has an absorption wavelength in a wavelength range of 360 nm to 480 nm, and particularly preferably has a high absorbance at 365 nm and 455 nm.

就感度的觀點而言,肟化合物於365nm或405nm下的莫耳吸光係數較佳為1,000~300,000,更佳為2,000~300,000,尤佳為5,000~200,000。 From the viewpoint of sensitivity, the molar absorption coefficient of the cerium compound at 365 nm or 405 nm is preferably from 1,000 to 300,000, more preferably from 2,000 to 300,000, particularly preferably from 5,000 to 200,000.

化合物的莫耳吸光係數的測定可使用公知的方法,具體而言,例如較佳為使用紫外可見分光光度計(瓦里安(Varian)公司製造的Carry-5 spectrophotometer),使用乙酸乙酯溶劑以0.01g/L的濃度進行測定。 The measurement of the molar absorption coefficient of the compound can be carried out by a known method. Specifically, for example, an ultraviolet-visible spectrophotometer (Carry-5 spectrophotometer manufactured by Varian Co., Ltd.) is preferably used, and an ethyl acetate solvent is used. The concentration was measured at a concentration of 0.01 g/L.

本發明中所用的聚合起始劑亦可視需要而組合使用兩 種以上。 The polymerization initiator used in the present invention may also be used in combination as needed. More than one species.

本發明的白色感光性樹脂組成物由於要求以銳利(sharp)的形狀來形成微細圖案,故重要的是硬化性並且對未曝光部進行顯影而不留殘渣。 Since the white photosensitive resin composition of the present invention is required to form a fine pattern in a sharp shape, it is important to be hardenability and develop the unexposed portion without leaving a residue.

就此種觀點而言,聚合起始劑尤佳為使用肟化合物。尤其於在固體攝影元件中形成微細圖案的情形時,於硬化用曝光時使用步進曝光機,但該曝光機有時因鹵素而受到損傷,而要求將聚合起始劑的添加量亦抑制得低,因此若考慮到該些方面,則於形成如固體攝影元件的微細圖案時,(C)聚合起始劑最佳為使用肟化合物。 From this point of view, it is especially preferred to use a hydrazine compound for the polymerization initiator. In particular, when a fine pattern is formed in a solid-state imaging device, a stepper is used for exposure for curing, but the exposure machine may be damaged by halogen, and it is required to suppress the addition amount of the polymerization initiator. It is low, and therefore, in consideration of these aspects, the (C) polymerization initiator is preferably a ruthenium compound when forming a fine pattern such as a solid photographic element.

相對於白色感光性樹脂組成物的總固體成分,本發明的 白色感光性樹脂組成物所含有的(C)聚合起始劑的含量(兩種以上的情形時為總含量)較佳為0.1質量%以上、40質量%以下,更佳為0.5質量%以上、20質量%以下,進而佳為1質量%以上、15 質量%以下,尤佳為3質量%以上、9質量%以下。藉由設定為該範圍,不會產生著色的問題,能以良好的感度獲得良好的硬化性與圖案形成性。再者,本發明的白色感光性樹脂組成物由於光不易透射,故較佳為添加較通常的感光性樹脂組成物更多的聚合起始劑。 The present invention is relative to the total solid content of the white photosensitive resin composition The content of the (C) polymerization initiator contained in the white photosensitive resin composition (the total content in the case of two or more kinds) is preferably 0.1% by mass or more and 40% by mass or less, more preferably 0.5% by mass or more. 20% by mass or less, and more preferably 1% by mass or more, 15 The mass% or less is particularly preferably 3% by mass or more and 9% by mass or less. By setting it as this range, the problem of coloring does not arise, and favorable hardenability and pattern formation are acquired with favorable sensitivity. Further, since the white photosensitive resin composition of the present invention is not easily transmitted by light, it is preferred to add a polymerization initiator which is more than a usual photosensitive resin composition.

[(D)平均粒徑為100nm以上的二氧化鈦粒子] [(D) Titanium dioxide particles having an average particle diameter of 100 nm or more]

本發明的二氧化鈦粒子可由化學式TiO2來表示,較佳為純度為70%以上,更佳為純度80%以上,進而佳為純度85%以上。通式TinO2n-1(n表示2~4的數)所表示的低級氧化鈦(lower titanium oxide)、氮氧化鈦等較佳為30質量%以下,更佳為20質量%以下,進而佳為15質量%以下。 The titanium dioxide particles of the present invention may be represented by the chemical formula TiO 2 , and preferably have a purity of 70% or more, more preferably 80% or more, and further preferably 85% or more. The lower titanium oxide or the titanium oxynitride represented by the general formula Ti n O 2n-1 (n is a number of 2 to 4) is preferably 30% by mass or less, more preferably 20% by mass or less, and further Good is 15% by mass or less.

本發明的二氧化鈦粒子只要平均粒徑為100nm以上,則並無特別限制,例如可自市售的二氧化鈦粒子中適當選擇使用。 The titanium dioxide particles of the present invention are not particularly limited as long as the average particle diameter is 100 nm or more, and can be appropriately selected from commercially available titanium oxide particles, for example.

上述二氧化鈦粒子的平均粒徑(數量平均粒徑)為100nm以上,較佳為180nm以上。於二氧化鈦粒子的平均粒徑小於100nm的情形時,有時反射率降低。 The average particle diameter (number average particle diameter) of the titanium dioxide particles is 100 nm or more, preferably 180 nm or more. When the average particle diameter of the titanium dioxide particles is less than 100 nm, the reflectance may be lowered.

上述二氧化鈦粒子的平均粒徑的上限並無特別限制,較佳為1000nm以下,更佳為500nm以下。 The upper limit of the average particle diameter of the titanium dioxide particles is not particularly limited, but is preferably 1000 nm or less, more preferably 500 nm or less.

本發明中的二氧化鈦粒子的平均粒徑是指藉由以下方法所得的值:利用丙二醇單甲醚乙酸酯將含有二氧化鈦粒子的混合液或分散液稀釋至80倍,對所得的稀釋液利用動態光散射法進行測定。 The average particle diameter of the titanium dioxide particles in the present invention means a value obtained by diluting a mixed liquid or dispersion containing titanium oxide particles to 80 times by using propylene glycol monomethyl ether acetate, and using the obtained diluent for dynamic use. The light scattering method was used for the measurement.

該測定中,將二氧化鈦粒子的平均粒徑設定為使用日機裝股 份有限公司製造的Microtrac UPA-EX150所得的數量平均粒徑。 In this measurement, the average particle diameter of the titanium dioxide particles is set to use the daily machine stock The number average particle size obtained from Microtrac UPA-EX150 manufactured by Ltd.

本發明中,二氧化鈦粒子的折射率並無特別限制,就獲得高折射率的觀點而言,較佳為1.75~2.70,更佳為1.90~2.70。 In the present invention, the refractive index of the titanium dioxide particles is not particularly limited, and from the viewpoint of obtaining a high refractive index, it is preferably 1.75 to 2.70, more preferably 1.90 to 2.70.

另外,二氧化鈦粒子的比表面積較佳為10m2/g~400m2/g,更佳為10m2/g~200m2/g,進而佳為10m2/g~150m2/g,最佳為10m2/g~40m2/g。 Further, the specific surface area of the titanium oxide particles is preferably from 10 m 2 /g to 400 m 2 /g, more preferably from 10 m 2 /g to 200 m 2 /g, further preferably from 10 m 2 /g to 150 m 2 /g, most preferably 10 m 2 /g~40m 2 /g.

另外,二氧化鈦粒子的形狀並無特別限制。例如可為米粒狀、球形狀、立方體狀、紡錘形狀或不定形狀。 Further, the shape of the titanium dioxide particles is not particularly limited. For example, it may be in the form of rice grains, spheres, cubes, spindles or indefinite shapes.

本發明的二氧化鈦粒子亦可為藉由有機化合物進行了表面處理者。表面處理中所用的有機化合物的例子中包括:多元醇、烷醇胺、硬脂酸、矽烷偶合劑及鈦酸酯偶合劑。其中,較佳為矽烷偶合劑。另外,本發明的二氧化鈦粒子較佳為利用Al(鋁)、Si(矽)及有機物進行了處理者。 The titanium dioxide particles of the present invention may also be surface treated by an organic compound. Examples of the organic compound used in the surface treatment include a polyol, an alkanolamine, a stearic acid, a decane coupling agent, and a titanate coupling agent. Among them, a decane coupling agent is preferred. Further, the titanium dioxide particles of the present invention are preferably treated with Al (aluminum), Si (antimony), and an organic substance.

表面處理可利用單獨一種表面處理劑來實施,亦可組合兩種以上的表面處理劑來實施。 The surface treatment can be carried out by using a single surface treatment agent, or can be carried out by combining two or more surface treatment agents.

另外,二氧化鈦粒子的表面較佳為藉由鋁、矽、鋯等的氧化物加以覆蓋。藉此,耐候性進一步提高。 Further, the surface of the titanium oxide particles is preferably covered with an oxide of aluminum, lanthanum, zirconium or the like. Thereby, the weather resistance is further improved.

本發明的二氧化鈦粒子可較佳地使用市售品。 A commercially available product can be preferably used for the titanium dioxide particles of the present invention.

二氧化鈦粒子的市售物例如可列舉:石原產業股份有限公司製造的商品名為泰帕克(Tipaque)R-550、泰帕克(Tipaque)R-580、泰帕克(Tipaque)R-630、泰帕克(Tipaque)R-670、泰帕克(Tipaque)R-680、泰帕克(Tipaque)R-780、泰帕克(Tipaque)R-780-2、 泰帕克(Tipaque)R-820、泰帕克(Tipaque)R-830、泰帕克(Tipaque)R-850、泰帕克(Tipaque)R-855、泰帕克(Tipaque)R-930、泰帕克(Tipaque)R-980、泰帕克(Tipaque)CR-50、泰帕克(Tipaque)CR-50-2、泰帕克(Tipaque)CR-57、泰帕克(Tipaque)CR-58、泰帕克(Tipaque)CR-58-2、泰帕克(Tipaque)CR-60、泰帕克(Tipaque)CR-60-2、泰帕克(Tipaque)CR-63、泰帕克(Tipaque)CR-67、泰帕克(Tipaque)CR-Super70、泰帕克(Tipaque)CR-80、泰帕克(Tipaque)CR-85、泰帕克(Tipaque)CR-90、泰帕克(Tipaque)CR-90-2、泰帕克(Tipaque)CR-93、泰帕克(Tipaque)CR-95、泰帕克(Tipaque)CR-953、泰帕克(Tipaque)CR-97、泰帕克(Tipaque)PF-736、泰帕克(Tipaque)PF-737、泰帕克(Tipaque)PF-742、泰帕克(Tipaque)PF-690、泰帕克(Tipaque)PF-691、泰帕克(Tipaque)PF-711、泰帕克(Tipaque)PF-739、泰帕克(Tipaque)PF-740、泰帕克(Tipaque)PC-3、泰帕克(Tipaque)S-305、泰帕克(Tipaque)CR-EL、泰帕克(Tipaque)PT-301、泰帕克(Tipaque)PT-501A、泰帕克(Tipaque)PT-501R者,堺化學工業股份有限公司製造的商品名為R-3L、R-5N、R-7E、R-11P、R-21、R-25、R-32、R-42、R-44、R-45M、R-62N、R-310、R-650、SR-1、D-918、GTR-100、FTR-700、TCR-52者,帝化(Tayca)股份有限公司製造的商品名為JR、JRNC、JR-301、JR-403、JR-405、JR-600A、JR-600E、JR-603、JR-605、JR-701、JR-800、JR-805、JR-806、JR-1000 者,鈦工業股份有限公司製造的商品名為KR-310、KR-380、KR-380N者,富士鈦工業股份有限公司製造的商品名為TR-600、TR-700、TR-750、TR-840、TR-900者等,較佳為泰帕克(Tipaque)CR-90-2。 Commercially available products of titanium dioxide particles include, for example, Tipaque R-550, Tipaque R-580, Tipaque R-630, and Taipak (trade name) manufactured by Ishihara Sangyo Co., Ltd. Tipaque) R-670, Tipaque R-680, Tipaque R-780, Tipaque R-780-2, Tipaque R-820, Tipaque R-830, Tipaque R-850, Tipaque R-855, Tipaque R-930, Tipaque R-980, Tipaque CR-50, Tipaque CR-50-2, Tipaque CR-57, Tipaque CR-58, Tipaque CR-58 - 2, Tipaque CR-60, Tipaque CR-60-2, Tipaque CR-63, Tipaque CR-67, Tipaque CR-Super70, Tipaque CR-80, Tipaque CR-85, Tipaque CR-90, Tipaque CR-90-2, Tipaque CR-93, Taipak (Tipaque) Tipaque) CR-95, Tipaque CR-953, Tipaque CR-97, Tipaque PF-736, Tipaque PF-737, Tipaque PF-742 , Tipaque PF-690, Tipaque PF-691, Tipaque PF-711, Tipaque PF-739, Tipaque PF-740, Tipaque ) PC-3, Tipaque S-305, Tipaque CR-EL, Tipaque PT-301, Tipaque PT-501A, Tipa Que) PT-501R, manufactured by 堺Chemical Industries Co., Ltd. under the trade names R-3L, R-5N, R-7E, R-11P, R-21, R-25, R-32, R-42, R-44, R-45M, R-62N, R-310, R-650, SR-1, D-918, GTR-100, FTR-700, TCR-52, manufactured by Tayca Co., Ltd. The trade names are JR, JRNC, JR-301, JR-403, JR-405, JR-600A, JR-600E, JR-603, JR-605, JR-701, JR-800, JR-805, JR- 806, JR-1000 Those who are manufactured by Titanium Industry Co., Ltd. under the trade names of KR-310, KR-380, and KR-380N are manufactured by Fuji Titanium Industrial Co., Ltd. under the trade names of TR-600, TR-700, TR-750, TR-. 840, TR-900, etc., preferably Tipaque CR-90-2.

本發明中,二氧化鈦粒子(D)可單獨使用一種,亦可組合使用兩種以上。 In the present invention, the titanium oxide particles (D) may be used alone or in combination of two or more.

相對於白色感光性樹脂組成物的總固體成分,本發明的白色感光性樹脂組成物中的二氧化鈦粒子的含量較佳為30質量%以上,更佳為35質量%以上。 The content of the titanium oxide particles in the white photosensitive resin composition of the present invention is preferably 30% by mass or more, and more preferably 35% by mass or more based on the total solid content of the white photosensitive resin composition.

含量的上限並無特別限制,相對於白色感光性樹脂組成物的總固體成分,較佳為95質量%以下,更佳為90質量%以下,進而佳為70質量%以下,最佳為60質量%以下。 The upper limit of the content is not particularly limited, and is preferably 95% by mass or less, more preferably 90% by mass or less, still more preferably 70% by mass or less, and most preferably 60% by mass based on the total solid content of the white photosensitive resin composition. %the following.

[分散劑] [Dispersant]

就提高組成物中的二氧化鈦粒子(D)的分散性的觀點而言,本發明的白色感光性樹脂組成物較佳為含有分散劑,更佳為含有具有吸附部位的高分子分散劑。 The white photosensitive resin composition of the present invention preferably contains a dispersant, and more preferably contains a polymer dispersant having an adsorption site, from the viewpoint of improving the dispersibility of the titanium oxide particles (D) in the composition.

於本發明中,將具有對二氧化鈦粒子(D)的吸附能力的部位適當統稱為「吸附部位」。 In the present invention, the sites having the adsorption ability to the titanium oxide particles (D) are collectively referred to as "adsorption sites" as appropriate.

本發明的吸附部位可列舉具有至少一種選自由以下基團所組 成的組群中的基團的一價取代基等:酸基、脲基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、雜環基、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、烷氧基矽烷基、環氧基、異氰酸酯基及羥基。 The adsorption site of the present invention may be exemplified by having at least one selected from the group consisting of the following groups a monovalent substituent of a group in the resulting group, etc.: an acid group, a urea group, a urethane group, a group having a coordinating oxygen atom, a group containing a basic nitrogen atom, a heterocyclic group An alkoxycarbonyl group, an alkylaminocarbonyl group, a carboxylate group, a sulfonylamino group, an alkoxyalkyl group, an epoxy group, an isocyanate group, and a hydroxyl group.

上述「酸基」例如可列舉羧酸基、磺酸基、單硫酸酯基、含磷原子的基團(磷酸基、單磷酸酯基、聚磷酸酯基等)、硼酸基作為較佳例,更佳為羧酸基、磺酸基、單硫酸酯基、含磷原子的基團(磷酸基、單磷酸酯基、聚磷酸酯基等),尤佳為羧酸基或含磷原子的基團。 Examples of the above-mentioned "acid group" include a carboxylic acid group, a sulfonic acid group, a monosulfate group, a phosphorus atom-containing group (phosphoric acid group, monophosphate group, polyphosphate group, etc.) and a boric acid group. More preferably, it is a carboxylic acid group, a sulfonic acid group, a monosulfate group, a phosphorus atom-containing group (phosphoric acid group, monophosphate group, polyphosphate group, etc.), and particularly preferably a carboxylic acid group or a phosphorus atom-containing group. group.

上述「脲基」例如可列舉-NR15CONR16R17(此處,R15、R16及R17分別獨立地表示氫原子、碳數1~20的烷基、碳數6以上的芳基或碳數7以上的芳烷基)作為較佳例,更佳為-NR15CONHR17(此處,R15及R17分別獨立地表示氫原子或碳數1~10的烷基、碳數6以上的芳基、碳數7以上的芳烷基),尤佳為-NHCONHR17(此處,R17表示氫原子或碳數1~10的烷基、碳數6以上的芳基、碳數7以上的芳烷基)。 Examples of the "ureido group" include -NR 15 CONR 16 R 17 (wherein, R 15 , R 16 and R 17 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 or more carbon atoms). Or an aralkyl group having a carbon number of 7 or more is more preferably -NR 15 CONHR 17 (wherein, R 15 and R 17 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, carbon number 6 or more aryl groups and aralkyl groups having 7 or more carbon atoms are particularly preferably -NHCONHR 17 (wherein R 17 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 or more carbon atoms, or carbon). Number 7 or more of aralkyl groups).

上述「胺基甲酸酯基」例如可列舉-NHCOOR18、-NR19COOR20、-OCONHR21、-OCONR22R23(此處,R18、R19、R20、R21、R22及R23分別獨立地表示碳數1~20的烷基、碳數6以上的芳基、碳數7以上的芳烷基)等作為較佳例,更佳為-NHCOOR18、-OCONHR21(此處,R18、R21分別獨立地表示碳數1~20的烷基、碳數6以上的芳基、碳數7以上的芳烷基)等,尤佳為-NHCOOR18、 -OCONHR21(此處,R18、R21分別獨立地表示碳數1~10的烷基、碳數6以上的芳基、碳數7以上的芳烷基)等。 Examples of the above-mentioned "urethane group" include -NHCOOR 18 , -NR 19 COOR 20 , -OCONHR 21 , and -OCONR 22 R 23 (here, R 18 , R 19 , R 20 , R 21 , R 22 and R 23 each independently represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, or an aralkyl group having 7 or more carbon atoms, and the like, and more preferably -NHCOOR 18 or -OCONHR 21 (this) In addition, R 18 and R 21 each independently represent an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, and an aralkyl group having 7 or more carbon atoms, and more preferably -NHCOOR 18 or -OCONHR 21 ( Here, R 18 and R 21 each independently represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 or more carbon atoms, and an aralkyl group having 7 or more carbon atoms.

上述「含配位性氧原子的基團」例如可列舉:乙醯丙酮基、冠醚等。 Examples of the "group containing a coordinating oxygen atom" include an acetoacetone group and a crown ether.

另外,上述「含鹼性氮原子的基團」例如可列舉胺基 (-NH2)、經取代的亞胺基(-NHR8、-NR9R10,此處,R8、R9及R10分別獨立地表示碳數1~20的烷基、碳數6以上的芳基、碳數7以上的芳烷基)、下述式(a1)所表示的胍基、下述式(a2)所表示的脒基(amidinyl)等作為較佳例。 Further, examples of the "basic group containing a basic nitrogen atom" include an amine group (-NH 2 ) and a substituted imine group (-NHR 8 , -NR 9 R 10 , here, R 8 and R 9 and R 10 each independently represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, and an aralkyl group having 7 or more carbon atoms, and an indenyl group represented by the following formula (a1), and the following formula (a2) The amidinyl or the like represented is a preferred example.

式(a1)中,R11及R12分別獨立地表示碳數1~20的烷 基、碳數6以上的芳基、碳數7以上的芳烷基。 In the formula (a1), R 11 and R 12 each independently represent an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, and an aralkyl group having 7 or more carbon atoms.

式(a2)中,R13及R14分別獨立地表示碳數1~20的烷基、碳數6以上的芳基、碳數7以上的芳烷基。 In the formula (a2), R 13 and R 14 each independently represent an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 or more carbon atoms, and an aralkyl group having 7 or more carbon atoms.

該些基團中,更佳為胺基(-NH2)、經取代的亞胺基(-NHR8、-NR9R10,此處,R8、R9及R10分別獨立地表示碳數1~10的烷基、苯基、苄基)、上述式(a1)所表示的胍基[式(a1)中,R11及R12分別獨立地表示碳數1~10的烷基、苯基、苄基]、上述式(a2)所表示的脒基[式(a2)中,R13及R14分別獨立地表 示碳數1~10的烷基、苯基、苄基]等。 More preferably, these groups are an amine group (-NH 2 ), a substituted imido group (-NHR 8 , -NR 9 R 10 , where R 8 , R 9 and R 10 each independently represent carbon The alkyl group represented by the above formula (a1), wherein R 11 and R 12 each independently represent an alkyl group having 1 to 10 carbon atoms, in the formula (a1), Phenyl group, benzyl group, and fluorenyl group represented by the above formula (a2). In the formula (a2), R 13 and R 14 each independently represent an alkyl group having 1 to 10 carbon atoms, a phenyl group or a benzyl group, and the like.

尤其可較佳地使用胺基(-NH2)、經取代的亞胺基(-NHR8、-NR9R10,此處,R8、R9及R10分別獨立地表示碳數1~5的烷基、苯基、苄基)、上述式(a1)所表示的胍基[式(a1)中,R11及R12分別獨立地表示碳數1~5的烷基、苯基、苄基]、上述式(a2)所表示的脒基[式(a2)中,R13及R14分別獨立地表示碳數1~5的烷基、苯基、苄基]等。 In particular, an amine group (-NH 2 ), a substituted imido group (-NHR 8 , -NR 9 R 10 , wherein R 8 , R 9 and R 10 independently represent a carbon number of 1 to 1 may be preferably used. In the formula (a1), R 11 and R 12 each independently represent an alkyl group having 1 to 5 carbon atoms, a phenyl group, and an alkyl group represented by the above formula (a1). Benzyl], a fluorenyl group represented by the above formula (a2). In the formula (a2), R 13 and R 14 each independently represent an alkyl group having 1 to 5 carbon atoms, a phenyl group or a benzyl group, and the like.

上述「烷氧基羰基」中的烷基部分較佳為碳數1~20的烷基,例如可列舉甲基、乙基等。 The alkyl group in the above "alkoxycarbonyl group" is preferably an alkyl group having 1 to 20 carbon atoms, and examples thereof include a methyl group and an ethyl group.

上述「烷基胺基羰基」中的烷基部分較佳為碳數1~20的烷基,例如可列舉甲基、乙基、丙基等。 The alkyl group in the above "alkylaminocarbonyl group" is preferably an alkyl group having 1 to 20 carbon atoms, and examples thereof include a methyl group, an ethyl group, and a propyl group.

上述「羧酸鹽基」可列舉包含羧酸的銨鹽的基團等。 The "carboxylate group" may, for example, be a group containing an ammonium salt of a carboxylic acid.

作為上述「磺醯胺基」,鍵結於氮原子的氫原子亦可經烷基(甲基等)、醯基(乙醯基、三氟乙醯基等)等所取代。 The "sulfonamide group" may be substituted with a hydrogen atom bonded to a nitrogen atom via an alkyl group (methyl group, etc.), a mercapto group (ethyl fluorenyl group, a trifluoroethenyl group or the like).

上述「雜環結構」例如可列舉以下結構作為較佳例:噻 吩、呋喃、二苯并哌喃、吡咯、吡咯啉、吡咯啶、二氧戊環、吡唑、吡唑啉、吡唑啶、咪唑、噁唑、噻唑、噁二唑、三唑、噻二唑、吡喃、吡啶、哌啶、二噁烷、嗎啉、噠嗪、嘧啶、哌嗪、三嗪、三噻烷(trithiane)、異吲哚啉、異吲哚啉酮、苯并咪唑酮、苯并噻唑,琥珀醯亞胺、鄰苯二甲醯亞胺、萘二甲醯亞胺等醯亞胺基,乙內醯脲(hydantoin)、吲哚、喹啉、咔唑、吖啶、吖啶酮、蒽醌。 The above "heterocyclic structure" may, for example, be exemplified by the following structure: a thiophene Phenanthrene, furan, dibenzopyran, pyrrole, pyrroline, pyrrolidine, dioxolane, pyrazole, pyrazoline, pyrazole, imidazole, oxazole, thiazole, oxadiazole, triazole, thiadipine Azole, pyran, pyridine, piperidine, dioxane, morpholine, pyridazine, pyrimidine, piperazine, triazine, trithiane, isoporphyrin, isoindolinone, benzimidazolone , benzothiazole, amber imine, phthalimide, naphthyl imine, etc., hydrazine, hydantoin, quinone, quinoline, carbazole, acridine, Acridone, hydrazine.

再者,上述「雜環結構」亦可更具有取代基,該取代基 例如可列舉:甲基、乙基等碳數1~20的烷基,苯基、萘基等碳數6~16的芳基,羥基,胺基,羧基,磺醯胺基,N-磺醯胺基,乙醯氧基等碳數1~6的醯氧基,甲氧基、乙氧基等碳數1~20的烷氧基,氯、溴等鹵素原子,甲氧基羰基、乙氧基羰基、環己氧基羰基等碳數2~7的烷氧基羰基,氰基,碳酸第三丁酯等碳酸酯基等。 Furthermore, the above "heterocyclic structure" may further have a substituent, and the substituent may be further substituted. For example, an alkyl group having 1 to 20 carbon atoms such as a methyl group or an ethyl group, an aryl group having 6 to 16 carbon atoms such as a phenyl group or a naphthyl group, a hydroxyl group, an amine group, a carboxyl group, a sulfonylamino group, and an N-sulfonium group are mentioned. Alkoxy groups such as an amine group and an ethoxy group having 1 to 6 carbon atoms; an alkoxy group having 1 to 20 carbon atoms such as a methoxy group or an ethoxy group; a halogen atom such as chlorine or bromine; a methoxycarbonyl group and an ethoxy group; Alkoxycarbonyl group having 2 to 7 carbon atoms such as a carbonyl group or a cyclohexyloxycarbonyl group, a carbonate group such as a cyano group or a third butyl carbonate.

上述「烷氧基矽烷基」可為單烷氧基矽烷基、二烷氧基 矽烷基、三烷氧基矽烷基的任一種,較佳為三烷氧基矽烷基,例如可列舉三甲氧基矽烷基、三乙氧基矽烷基等。 The above "alkoxyalkylene group" may be a monoalkoxyalkylene group or a dialkoxy group. Any one of a decyl group and a trialkoxyalkyl group is preferably a trialkoxyalkylene group, and examples thereof include a trimethoxydecyl group and a triethoxydecyl group.

上述「環氧基」可列舉經取代或未經取代的環氧乙烷基(氧化乙烯基)。 The above "epoxy group" may, for example, be a substituted or unsubstituted oxiranyl group (oxyethylene group).

上述吸附部位較佳為酸系吸附部位。酸系吸附部位可列舉酸基等。其中,較佳為酸系吸附部位為含磷原子的基團或羧酸基的至少一者。 The adsorption site is preferably an acid adsorption site. Examples of the acid-based adsorption site include an acid group and the like. Among them, it is preferred that the acid-based adsorption site is at least one of a phosphorus atom-containing group or a carboxylic acid group.

本發明中,具有上述吸附部位的高分子分散劑較佳為下述通式(1)所表示的高分子分散劑。 In the present invention, the polymer dispersant having the above-mentioned adsorption site is preferably a polymer dispersant represented by the following formula (1).

上述通式(1)中,R1表示(m+n)價的連結基,R2表示單鍵或二價連結基。 In the above formula (1), R 1 represents a (m+n)-valent linking group, and R 2 represents a single bond or a divalent linking group.

A1表示一價取代基,上述一價取代基具有至少一種選自由以下基團所組成的組群中的基團:酸基、脲基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、雜環基、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、烷氧基矽烷基、環氧基、異氰酸酯基及羥基。n個A1及R2分別可相同亦可不同。 A 1 represents a monovalent substituent, and the above monovalent substituent has at least one group selected from the group consisting of an acid group, a urea group, a urethane group, and a coordinating oxygen atom. Group, a group containing a basic nitrogen atom, a heterocyclic group, an alkoxycarbonyl group, an alkylaminocarbonyl group, a carboxylate group, a sulfonylamino group, an alkoxyalkyl group, an epoxy group, an isocyanate group And hydroxyl. The n A 1 and R 2 may be the same or different.

m表示8以下的正數,n表示1~9,m+n滿足3~10。 m represents a positive number of 8 or less, n represents 1 to 9, and m+n satisfies 3 to 10.

P1表示聚合物鏈。m個P1可相同亦可不同。 P 1 represents a polymer chain. m P 1 may be the same or different.

上述通式(1)所表示的高分子化合物可參考日本專利特開2007-277514號公報的段落0039(對應的美國專利申請公開第2010/0233595號說明書的[0053])以後的記載,將該些內容併入至本申請說明書中。 The polymer compound represented by the above formula (1) can be referred to the description of paragraph 0039 of the Japanese Patent Application Laid-Open No. 2007-277514 (the corresponding US Patent Application Publication No. 2010/0233595 [0053]). These are incorporated into the specification of the present application.

上述通式(1)所表示的高分子分散劑所具有的取代基A1可與二氧化鈦粒子(D)相互作用,故上述通式(1)所表示的分散劑藉由具有n個(1~9個)取代基A1,可與二氧化鈦粒子(D)強烈地相互作用。另外,上述通式(1)所表示的高分子分散劑所具有的m個聚合物鏈P1可作為立體排斥基而發揮功能,藉由具有m個,可發揮良好的立體排斥力而使二氧化鈦粒子(D)均勻地分散。進而可推測,上述通式(1)所表示的高分子分散劑於分子結構上不會產生先前的接枝無規結構的分散劑中可能產生的由粒子間交聯所致的粒子的凝聚等弊病。 Since the substituent A 1 of the polymer dispersant represented by the above formula (1) can interact with the titania particles (D), the dispersant represented by the above formula (1) has n (1~) The 9 substituents A 1 can strongly interact with the titanium dioxide particles (D). In addition, the m polymer chains P 1 of the polymer dispersant represented by the above formula (1) can function as a steric repulsion group, and by having m, it can exhibit good steric repulsive force and make titanium dioxide. The particles (D) are uniformly dispersed. Further, it is presumed that the polymer dispersant represented by the above formula (1) does not cause agglomeration of particles due to cross-linking between particles which may occur in a dispersant having a previously grafted random structure in a molecular structure. Disadvantages.

以下,對上述通式(1)中的各基團加以詳細說明。再 者,關於通式(1)所表示的高分子分散劑,於日本專利特開2007-277514(日本專利特願2006-269707)中亦揭示有同樣的高分子分散劑,其記載中所說明的內容及較佳結構亦可應用於下述說明中,適當省略重複的記載。 Hereinafter, each group in the above formula (1) will be described in detail. again The polymer dispersant represented by the formula (1) is also disclosed in Japanese Patent Laid-Open No. Hei. No. 2007-277514 (Japanese Patent Application No. 2006-269707). The contents and preferred configurations can also be applied to the following description, and overlapping descriptions are omitted as appropriate.

上述A1表示具有至少一種具有對二氧化鈦粒子(D)的吸附能力的官能基、如雜環結構般的具有對二氧化鈦粒子(D)的吸附能力的結構的一價取代基。 The above A 1 represents a monovalent substituent having a structure having at least one functional group having an adsorption ability for the titanium oxide particles (D), and a structure having an adsorption ability to the titanium oxide particles (D), such as a heterocyclic structure.

再者,該具有對二氧化鈦粒子(D)的吸附能力的部位(上述官能基及結構)相當於上述「吸附部位」。 Further, the portion (the functional group and the structure) having the adsorption ability to the titanium oxide particles (D) corresponds to the above-mentioned "adsorption site".

上述吸附部位只要於一個A1中含有至少一種即可,亦 可含有兩種以上。 The adsorption site may contain at least one of A 1 and may contain two or more types.

對於關於A1的具有至少一種選自由酸基、脲基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、雜環基、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、烷氧基矽烷基、環氧基、異氰酸酯基及羥基所組成的組群中的基團的一價取代基的詳細情況,如作為吸附部位而已於上文中作為具有至少一種選自由酸基、脲基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、雜環基、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、烷氧基矽烷基、環氧基、異氰酸酯基及羥基所組成的組群中的基團的一價取代基所述。 With respect to A 1 having at least one selected from the group consisting of an acid group, a urea group, a urethane group, a group having a coordinating oxygen atom, a group containing a basic nitrogen atom, a heterocyclic group, an alkoxycarbonyl group Details of the monovalent substituent of the group in the group consisting of an alkylaminocarbonyl group, a carboxylate group, a sulfonylamino group, an alkoxyalkyl group, an epoxy group, an isocyanate group, and a hydroxyl group, such as As the adsorption site, as having at least one selected from the group consisting of an acid group, a ureido group, a urethane group, a group having a coordinating oxygen atom, a group containing a basic nitrogen atom, a heterocyclic group, or an alkane a monovalent substituent of a group in the group consisting of an oxycarbonyl group, an alkylaminocarbonyl group, a carboxylate group, a sulfonylamino group, an alkoxyalkyl group, an epoxy group, an isocyanate group, and a hydroxyl group. .

另外,本發明中,「具有至少一種吸附部位的一價取代基」為 上述吸附部位與由1個~200個碳原子、0個~20個氮原子、0個~100個氧原子、1個~400個氫原子及0個~40個硫原子所形成的連結基鍵結而成的一價取代基。再者,於吸附部位自身可構成一價取代基的情形時,吸附部位本身亦可為A1所表示的一價取代基。 Further, in the present invention, the "monovalent substituent having at least one adsorption site" is the adsorption site and one to 200 carbon atoms, 0 to 20 nitrogen atoms, 0 to 100 oxygen atoms, and 1 a monovalent substituent in which a linking group formed by ~400 hydrogen atoms and 0 to 40 sulfur atoms is bonded. Further, in the case where the adsorption site itself can constitute a monovalent substituent, the adsorption site itself can also be a monovalent substituent represented by A 1 .

與上述吸附部位鍵結的連結基較佳為單鍵或由1個~ 100個碳原子、0個~10個氮原子、0個~50個氧原子、1個~200個氫原子及0個~20個硫原子所形成的連結基,該有機連結基可未經取代亦可更具有取代基。 The linking group bonded to the adsorption site is preferably a single bond or one by one. a linking group formed by 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms, the organic linking group may be unsubstituted It may also have a substituent.

上述中,上述A1較佳為具有至少一種選自由酸基、脲 基、胺基甲酸酯基、磺醯胺基、醯亞胺基及含配位性氧原子的基團所組成的組群中的基團的一價取代基。 In the above, the above A 1 preferably has at least one group selected from the group consisting of an acid group, a urea group, a urethane group, a sulfonylamino group, a quinone imine group, and a group having a coordinating oxygen atom. A monovalent substituent of a group in a group.

尤其就使其與二氧化鈦粒子(D)的相互作用良好、提高折射率、且降低組成物的黏度的觀點而言,A1更佳為具有至少一種pKa為5~14的官能基的一價取代基。 In particular, A 1 is more preferably a monovalent substitution having at least one functional group having a pKa of 5 to 14 from the viewpoint of improving the interaction with the titanium oxide particles (D), increasing the refractive index, and lowering the viscosity of the composition. base.

此處所謂「pKa」,是指具有化學便覽(II)(修訂4版,1993年,日本化學會編,丸善股份有限公司)中記載的定義者。 The term "pKa" as used herein refers to the definitions described in Chemical Handbook (II) (Revised 4th Edition, 1993, edited by the Chemical Society of Japan, Maruzen Co., Ltd.).

上述pKa為5~14的官能基可列舉:脲基、胺基甲酸酯基、磺醯胺基、醯亞胺基或含配位性氧原子的基團。 The functional group having a pKa of 5 to 14 may, for example, be a ureido group, a urethane group, a sulfonylamino group, a quinone imine group or a group containing a coordinating oxygen atom.

具體而言,例如可列舉:脲基(pKa為12~14左右)、胺基甲酸酯基(pKa為11~13左右)、作為配位性氧原子的-COCH2CO-(pKa為8~10左右)、磺醯胺基(pKa為9~11左右)等。 Specific examples thereof include a urea group (pKa of about 12 to 14), a urethane group (pKa of about 11 to 13), and a COCO 2 CO- (a pKa of 8 as a coordinating oxygen atom). ~10 or so), sulfonamide group (pKa is about 9 to 11) and the like.

上述A1較佳為作為下述通式(4)所表示的一價取代基 而表示。 The above A 1 is preferably represented by a monovalent substituent represented by the following formula (4).

上述通式(4)中,B1表示上述吸附部位(即酸基、脲 基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、雜環基、烷氧基矽烷基、環氧基、異氰酸酯基或羥基),R24表示單鍵或(a+1)價的連結基。a表示1~10的整數,於通式(4)中存在a個的B1可相同亦可不同。 In the above formula (4), B 1 represents the above-mentioned adsorption site (i.e., acid group, urea group, urethane group, group containing a coordinating oxygen atom, a group containing a basic nitrogen atom, alkoxy group) Alkylcarbonyl, alkylaminocarbonyl, carboxylate, sulfonylamino, heterocyclyl, alkoxyalkyl, epoxy, isocyanate or hydroxy), R 24 represents a single bond or (a+1) The link of the price. a represents an integer of 1 to 10, there are a number of B (4) in the general formula 1 may be the same or different.

上述B1所表示的吸附部位可列舉與構成上述通式(1) 的A1的吸附部位相同者,較佳例亦相同。 The adsorption site represented by the above B 1 is the same as the adsorption site of A 1 constituting the above formula (1), and preferred examples are also the same.

其中,較佳為酸基、脲基、胺基甲酸酯基、磺醯胺基、醯亞胺基或含配位性氧原子的基團,更佳為pKa為5~14的官能基,就此觀點而言,更佳為脲基、胺基甲酸酯基、磺醯胺基、醯亞胺基或含配位性氧原子的基團。 Among them, an acid group, a urea group, a urethane group, a sulfonylamino group, a quinone imine group or a group having a coordinating oxygen atom is preferred, and a functional group having a pKa of 5 to 14 is more preferred. From this point of view, a ureido group, a urethane group, a sulfonylamino group, a quinone imine group or a group containing a coordinating oxygen atom is more preferable.

R24表示單鍵或(a+1)價的連結基,a表示1~10。較 佳為a為1~7,更佳為a為1~5,尤佳為a為1~3。 R 24 represents a single bond or a (a+1)-valent linking group, and a represents 1 to 10. Preferably, a is 1 to 7, more preferably a is 1 to 5, and particularly preferably a is 1 to 3.

(a+1)價的連結基包含由1個~100個碳原子、0個~10個氮原子、0個~50個氧原子、1個~200個氫原子及0個~20個硫原子所形成的基團,可未經取代亦可更具有取代基。 The (a+1)-valent linking group includes from 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms. The group formed may be unsubstituted or more substituted.

R24較佳為單鍵或由1個~50個碳原子、0個~8個氮原 子、0個~25個氧原子、1個~100個氫原子及0個~10個硫原子所形成的(a+1)價的連結基,更佳為單鍵或由1個~30個碳原子、0個~6個氮原子、0個~15個氧原子、1個~50個氫原子及0個~7個硫原子所形成的(a+1)價連結基,尤佳為單鍵或由1個~10個碳原子、0個~5個氮原子、0個~10個氧原子、1個~30個氫原子及0個~5個硫原子所形成的(a+1)價的連結基。 R 24 is preferably a single bond or is formed by 1 to 50 carbon atoms, 0 to 8 nitrogen atoms, 0 to 25 oxygen atoms, 1 to 100 hydrogen atoms, and 0 to 10 sulfur atoms. a (a+1)-valent linking group, more preferably a single bond or from 1 to 30 carbon atoms, 0 to 6 nitrogen atoms, 0 to 15 oxygen atoms, 1 to 50 hydrogen atoms, and (a+1) valent linking group formed by 0 to 7 sulfur atoms, particularly preferably a single bond or 1 to 10 carbon atoms, 0 to 5 nitrogen atoms, 0 to 10 oxygen atoms, A (a+1)-valent linking group formed by one to 30 hydrogen atoms and 0 to 5 sulfur atoms.

上述中,於(a+1)價的連結基具有取代基的情形時, 該取代基例如可列舉:甲基、乙基等碳數1~20的烷基,苯基、萘基等碳數6~16的芳基,羥基,胺基,羧基,磺醯胺基,N-磺醯胺基,乙醯氧基等碳數1~6的醯氧基,甲氧基、乙氧基等碳數1~6的烷氧基,氯、溴等鹵素原子,甲氧基羰基、乙氧基羰基、環己氧基羰基等碳數2~7的烷氧基羰基,氰基,碳酸第三丁酯等碳酸酯基等。 In the above, when the (a+1)-valent linking group has a substituent, Examples of the substituent include an alkyl group having 1 to 20 carbon atoms such as a methyl group or an ethyl group, an aryl group having 6 to 16 carbon atoms such as a phenyl group or a naphthyl group, a hydroxyl group, an amine group, a carboxyl group, and a sulfonylamino group. a sulfonylamino group, an ethoxy group having a carbon number of 1 to 6 such as a decyloxy group, a methoxy group such as a methoxy group and an alkoxy group having 1 to 6 carbon atoms, a halogen atom such as chlorine or bromine, and a methoxycarbonyl group. And an alkoxycarbonyl group having 2 to 7 carbon atoms such as an ethoxycarbonyl group or a cyclohexyloxycarbonyl group, a carbonate group such as a cyano group or a third butyl carbonate.

上述通式(1)中,R2表示單鍵或二價連結基。n個R2 可相同亦可不同。 In the above formula (1), R 2 represents a single bond or a divalent linking group. The n R 2 's may be the same or different.

二價連結基包含由1個~100個碳原子、0個~10個氮原子、0個~50個氧原子、1個~200個氫原子及0個~20個硫原子所形成的基團,可未經取代亦可更具有取代基。 The divalent linking group includes a group formed by 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms. It may be unsubstituted or substituted.

R2較佳為單鍵或由1個~50個碳原子、0個~8個氮原 子、0個~25個氧原子、1個~100個氫原子及0個~10個硫原子所形成的二價連結基,更佳為單鍵或由1個~30個碳原子、0個 ~6個氮原子、0個~15個氧原子、1個~50個氫原子及0個~7個硫原子所形成的二價連結基,尤佳為單鍵或由1個~10個碳原子、0個~5個氮原子、0個~10個氧原子、1個~30個氫原子及0個~5個硫原子所形成的二價連結基。 R 2 is preferably a single bond or is formed by 1 to 50 carbon atoms, 0 to 8 nitrogen atoms, 0 to 25 oxygen atoms, 1 to 100 hydrogen atoms, and 0 to 10 sulfur atoms. The divalent linking group is more preferably a single bond or from 1 to 30 carbon atoms, 0 to 6 nitrogen atoms, 0 to 15 oxygen atoms, 1 to 50 hydrogen atoms, and 0 to 7 The divalent linking group formed by the sulfur atom is particularly preferably a single bond or from 1 to 10 carbon atoms, 0 to 5 nitrogen atoms, 0 to 10 oxygen atoms, 1 to 30 hydrogen atoms, and 0. A divalent linking group formed by ~5 sulfur atoms.

上述中,於二價連結基具有取代基的情形時,該取代基 例如可列舉:甲基、乙基等碳數1~20的烷基,苯基、萘基等碳數6~16的芳基,羥基,胺基,羧基,磺醯胺基,N-磺醯胺基,乙醯氧基等碳數1~6的醯氧基,甲氧基、乙氧基等碳數1~6的烷氧基,氯、溴等鹵素原子,甲氧基羰基、乙氧基羰基、環己氧基羰基等碳數2~7的烷氧基羰基,氰基,碳酸第三丁酯等碳酸酯基等。 In the above, in the case where the divalent linking group has a substituent, the substituent For example, an alkyl group having 1 to 20 carbon atoms such as a methyl group or an ethyl group, an aryl group having 6 to 16 carbon atoms such as a phenyl group or a naphthyl group, a hydroxyl group, an amine group, a carboxyl group, a sulfonylamino group, and an N-sulfonium group are mentioned. Alkoxy groups such as an amine group and an ethoxy group having 1 to 6 carbon atoms; an alkoxy group having 1 to 6 carbon atoms such as a methoxy group or an ethoxy group; a halogen atom such as chlorine or bromine; a methoxycarbonyl group and an ethoxy group; Alkoxycarbonyl group having 2 to 7 carbon atoms such as a carbonyl group or a cyclohexyloxycarbonyl group, a carbonate group such as a cyano group or a third butyl carbonate.

上述通式(1)中,R1表示(m+n)價的連結基。m+n 滿足3~10。 In the above formula (1), R 1 represents a (m+n)-valent linking group. m+n satisfies 3~10.

上述R1所表示的(m+n)價的連結基包含由1個~100個碳原子、0個~10個氮原子、0個~50個氧原子、1個~200個氫原子及0個~20個硫原子所形成的基團,可未經取代亦可更具有取代基。 The (m+n)-valent linking group represented by the above R 1 includes 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0. The group formed by ~20 sulfur atoms may be unsubstituted or more substituted.

上述R1所表示的(m+n)價的連結基的具體例可列舉日 本專利特開2007-277514號公報的段落0082及段落0083中揭示的具體例(1)~具體例(17)。 Specific examples of the (m+n)-valent linking group represented by the above R 1 include specific examples (1) to (17) disclosed in paragraphs 0082 and 0083 of JP-A-2007-277514.

上述通式(1)中,m表示8以下的正數。m較佳為0.5~5,更佳為1~4,尤佳為1~3。 In the above formula (1), m represents a positive number of 8 or less. m is preferably from 0.5 to 5, more preferably from 1 to 4, and particularly preferably from 1 to 3.

另外,上述通式(1)中,n表示1~9。n較佳為2~8,更佳為2~7,尤佳為3~6。 Further, in the above formula (1), n represents 1 to 9. n is preferably 2 to 8, more preferably 2 to 7, and particularly preferably 3 to 6.

上述通式(1)中,P1表示聚合物鏈,可自公知的聚合物等中根據目的等而選擇。m個P1可相同亦可不同。 In the above formula (1), P 1 represents a polymer chain, and can be selected from known polymers or the like according to the purpose and the like. m P 1 may be the same or different.

聚合物中,構成聚合物鏈時,較佳為選自由乙烯系單體的聚合物或共聚物、酯系聚合物、醚系聚合物、胺基甲酸酯系聚合物、醯胺系聚合物、環氧系聚合物、矽酮系聚合物及該等的改質物或共聚物[例如包含聚醚/聚胺基甲酸酯共聚物、聚醚/乙烯系單體的聚合物的共聚物等(可為無規共聚物、嵌段共聚物、接枝共聚物的任一種)]所組成的組群中的至少一種,更佳為選自由乙烯系單體的聚合物或共聚物、酯系聚合物、醚系聚合物、胺基甲酸酯系聚合物及該等的改質物或共聚物所組成的組群中的至少一種,尤佳為乙烯系單體的聚合物或共聚物。 In the polymer, when the polymer chain is formed, it is preferably a polymer or copolymer selected from a vinyl monomer, an ester polymer, an ether polymer, a urethane polymer, or a guanamine polymer. An epoxy-based polymer, an anthrone-based polymer, and a modified or copolymer thereof (for example, a copolymer of a polymer comprising a polyether/polyurethane copolymer or a polyether/vinyl monomer) At least one selected from the group consisting of: a random copolymer, a block copolymer, and a graft copolymer, more preferably a polymer or copolymer selected from a vinyl monomer, or an ester system At least one of a group consisting of a polymer, an ether polymer, a urethane polymer, and the like, or a modified or copolymer thereof is preferably a polymer or copolymer of a vinyl monomer.

聚合物鏈P1較佳為含有至少一種重複單元。 The polymer chain P 1 preferably contains at least one repeating unit.

就發揮立體排斥力而提高分散性的觀點而言,聚合物鏈P1中的上述至少一種重複單元的重複數k較佳為3以上,更佳為5以上。 The number k of repetitions of the at least one repeating unit in the polymer chain P 1 is preferably 3 or more, and more preferably 5 or more, from the viewpoint of exerting a steric repulsive force and improving dispersibility.

另外,就抑制上述通式(1)所表示的高分子分散劑的大體積、使二氧化鈦粒子(D)密集地存在於白色硬化膜中的觀點而言,上述至少一種重複單元的重複單元數k較佳為50以下,更佳為40以下,進而佳為30以下。 In addition, from the viewpoint of suppressing the large volume of the polymer dispersant represented by the above formula (1) and causing the titanium dioxide particles (D) to be densely present in the white cured film, the number of repeating units of the at least one repeating unit is k It is preferably 50 or less, more preferably 40 or less, and still more preferably 30 or less.

再者,上述聚合物鏈較佳為可溶於有機溶劑中。若與有 機溶劑的親和性低,則與分散介質的親和性變弱,有時無法確保分散穩定化充分的吸附層。 Further, the above polymer chain is preferably soluble in an organic solvent. If and When the affinity of the organic solvent is low, the affinity with the dispersion medium is weak, and the adsorption layer having sufficient dispersion stabilization cannot be ensured.

上述通式(1)所表示的高分子分散劑中,較佳為下述通式(2)所表示的高分子分散劑。 Among the polymer dispersants represented by the above formula (1), a polymer dispersant represented by the following formula (2) is preferred.

上述通式(2)中,A2表示一價取代基,上述一價取代 基具有至少一種選自由以下基團所組成的組群中的基團:酸基、脲基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、雜環基、烷氧基矽烷基、環氧基、異氰酸酯基及羥基。n個A2可相同亦可不同。 In the above formula (2), A 2 represents a monovalent substituent, and the above monovalent substituent has at least one group selected from the group consisting of an acid group, a urea group, a urethane group. a group, a group containing a coordinating oxygen atom, a group containing a basic nitrogen atom, an alkoxycarbonyl group, an alkylaminocarbonyl group, a carboxylate group, a sulfonylamino group, a heterocyclic group, an alkoxydecane Base, epoxy group, isocyanate group and hydroxyl group. The n A 2 's may be the same or different.

再者,A2與上述通式(1)中的上述A1為相同涵義,較佳形態亦相同。 Further, A 2 has the same meaning as the above A 1 in the above formula (1), and the preferred embodiment is also the same.

上述通式(2)中,R4、R5分別獨立地表示單鍵或二價 連結基。n個R4可相同亦可不同。另外,m個R5可相同亦可不同。 In the above formula (2), R 4 and R 5 each independently represent a single bond or a divalent linking group. The n R 4 's may be the same or different. In addition, m R 5 's may be the same or different.

R4、R5所表示的二價連結基可使用與作為上述通式(1)的R2所表示的二價連結基而列舉的基團相同的基團,較佳形態亦相同。 The divalent linking group represented by R 4 and R 5 may be the same as those exemplified as the divalent linking group represented by R 2 in the above formula (1), and the preferred embodiment is also the same.

上述通式(2)中,R3表示(m+n)價的連結基。m+n 滿足3~10。 In the above formula (2), R 3 represents a (m+n)-valent linking group. m+n satisfies 3~10.

上述R3所表示的(m+n)價的連結基包含由1個~60個碳原子、0個~10個氮原子、0個~50個氧原子、1個~100個氫原子及0個~20個硫原子所形成的基團,可未經取代亦可更具有取代基。 The (m+n)-valent linking group represented by R 3 above includes 1 to 60 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 100 hydrogen atoms, and 0. The group formed by ~20 sulfur atoms may be unsubstituted or more substituted.

上述R3所表示的(m+n)價的連結基具體可使用與作為上述通式(1)的R1所表示的(m+n)價的連結基而列舉的基團相同的基團,較佳形態亦相同。 The (m+n)-valent linking group represented by the above R 3 may be the same as those exemplified as the (m+n)-valent linking group represented by R 1 of the above formula (1). The preferred form is also the same.

上述通式(2)中,m表示8以下的正數。m較佳為0.5 ~5,更佳為1~4,尤佳為1~3。 In the above formula (2), m represents a positive number of 8 or less. m is preferably 0.5 ~5, more preferably 1~4, especially preferably 1~3.

另外,上述通式(2)中,n表示1~9。n較佳為2~8,更佳為2~7,尤佳為3~6。 Further, in the above formula (2), n represents 1 to 9. n is preferably 2 to 8, more preferably 2 to 7, and particularly preferably 3 to 6.

另外,通式(2)中的P2表示聚合物鏈,可自公知的聚 合物等中根據目的等而選擇。m個P2可相同亦可不同。聚合物的較佳形態與上述通式(1)中的P1相同。 Further, P 2 in the formula (2) represents a polymer chain, and can be selected from known polymers or the like according to the purpose and the like. m P 2 may be the same or different. The preferred form of the polymer is the same as P 1 in the above formula (1).

上述通式(2)所表示的高分子分散劑中,最佳為全部 滿足以下所示的R3、R4、R5、P2、m及n者。 In the polymer dispersant represented by the above formula (2), it is preferable that all of R 3 , R 4 , R 5 , P 2 , m and n satisfying the following are satisfied.

R3:上述具體例(1)、具體例(2)、具體例(10)、具體例(11)、具體例(16)或具體例(17) R 3 : the above specific example (1), specific example (2), specific example (10), specific example (11), specific example (16) or specific example (17)

R4:單鍵、或下述結構單元或將該結構單元組合而構成的由「1個~10個碳原子、0個~5個氮原子、0個~10個氧原子、1個~30個氫原子及0個~5個硫原子」所形成的二價連結基(亦 可具有取代基,該取代基例如可列舉:甲基、乙基等碳數1~20的烷基,苯基、萘基等碳數6~16的芳基,羥基,胺基,羧基,磺醯胺基,N-磺醯胺基,乙醯氧基等碳數1~6的醯氧基,甲氧基、乙氧基等碳數1~6的烷氧基,氯、溴等鹵素原子,甲氧基羰基、乙氧基羰基、環己氧基羰基等碳數2~7的烷氧基羰基,氰基,碳酸第三丁酯等碳酸酯基等) R 4 : a single bond, or the following structural unit or a combination of the structural units: "1 to 10 carbon atoms, 0 to 5 nitrogen atoms, 0 to 10 oxygen atoms, 1 to 30" A divalent linking group formed by a hydrogen atom and 0 to 5 sulfur atoms (may also have a substituent, and examples of the substituent include an alkyl group having 1 to 20 carbon atoms such as a methyl group or an ethyl group, and a phenyl group; a naphthyl group having 6 to 16 carbon atoms such as a aryl group, a hydroxyl group, an amine group, a carboxyl group, a sulfonylamino group, an N-sulfonylamino group, an ethoxycarbonyl group and the like, a methoxy group having 1 to 6 carbon atoms, and a methoxy group. An alkoxy group having 1 to 6 carbon atoms such as an ethoxy group, a halogen atom such as chlorine or bromine, an alkoxycarbonyl group having 2 to 7 carbon atoms such as a methoxycarbonyl group, an ethoxycarbonyl group or a cyclohexyloxycarbonyl group; Base, carbonate ester such as tributyl carbonate, etc.)

R5:單鍵、伸乙基、伸丙基、下述基(a)或下述基(b) R 5 : single bond, ethyl group, propyl group, the following group (a) or the following group (b)

再者,下述基中,R12表示氫原子或甲基,l表示1或2。 Further, in the following group, R 12 represents a hydrogen atom or a methyl group, and l represents 1 or 2.

P2:乙烯系單體的聚合物或共聚物、酯系聚合物、醚系聚合物、胺基甲酸酯系聚合物及該等的改質物 P 2 : a polymer or copolymer of a vinyl monomer, an ester polymer, an ether polymer, a urethane polymer, and the like

m:1~3 m:1~3

n:3~6 n: 3~6

上述通式(1)或通式(2)所表示的高分子分散劑的酸值並無特別限制,就分散性的觀點而言,酸值較佳為400mgKOH/g以下,更佳為300mgKOH/g以下,尤佳為250mgKOH/g以下。 The acid value of the polymer dispersant represented by the above formula (1) or (2) is not particularly limited, and from the viewpoint of dispersibility, the acid value is preferably 400 mgKOH/g or less, more preferably 300 mgKOH/ Below g, it is particularly preferably 250 mgKOH/g or less.

再者,酸值的下限值並無特別限制,就二氧化鈦粒子的分散穩定性的觀點而言,較佳為5mgKOH/g以上,更佳為10mgKOH/g以上。 In addition, the lower limit of the acid value is not particularly limited, and is preferably 5 mgKOH/g or more, and more preferably 10 mgKOH/g or more from the viewpoint of dispersion stability of the titanium oxide particles.

此處,上述通式(1)或通式(2)所表示的高分子分散劑的酸值為固體成分酸值。 Here, the acid value of the polymer dispersant represented by the above formula (1) or formula (2) is a solid component acid value.

於本發明中,上述通式(1)或通式(2)所表示的高分子分散劑的酸值例如可根據上述通式(1)或通式(2)所表示的分散劑中的酸基的平均含量來算出。 In the present invention, the acid value of the polymer dispersant represented by the above formula (1) or (2) may be, for example, an acid in the dispersant represented by the above formula (1) or formula (2). The average content of the base is calculated.

上述通式(1)或通式(2)所表示的高分子分散劑的分子量以重量平均分子量計而較佳為1000~50000,更佳為3000~30000,尤佳為3000~20000。若重量平均分子量為上述範圍內,則充分發揮導入至聚合物的末端的多個上述吸附部位的效果,可發揮對二氧化鈦粒子表面的吸附性優異的性能。 The molecular weight of the polymer dispersant represented by the above formula (1) or (2) is preferably from 1,000 to 50,000, more preferably from 3,000 to 30,000, still more preferably from 3,000 to 20,000, in terms of weight average molecular weight. When the weight average molecular weight is within the above range, the effect of introducing a plurality of the adsorption sites introduced into the terminal of the polymer is sufficiently exhibited, and the adsorption property to the surface of the titanium oxide particles is excellent.

上述通式(1)所表示的高分子化合物的具體例可參考日本專利特開2007-277514公報的段落0266(對應的美國專利申請公開第2010/0233595號說明書的[0389])以後所記載的實施例中合成的化合物C-1~化合物C-57,將該些內容併入至本申請說明書中。 Specific examples of the polymer compound represented by the above formula (1) can be referred to the following paragraphs of JP-A-2007-277514, paragraph 0266 (corresponding to U.S. Patent Application Publication No. 2010/0233595 [0389]). The compound C-1 to the compound C-57 synthesized in the examples are incorporated in the specification of the present application.

(上述通式(1)或通式(2)所表示的高分子分散劑的 合成方法) (Polymer dispersant represented by the above formula (1) or formula (2) resolve resolution)

上述通式(1)或通式(2)所表示的高分子分散劑並無特別限制,可依照日本專利特開2007-277514號公報的段落0114~段落0140及段落0266~段落0348中記載的合成方法來合成。 The polymer dispersant represented by the above formula (1) or (2) is not particularly limited, and can be as described in paragraphs 0114 to 0140 and paragraphs 0266 to 0348 of JP-A-2007-277514. Synthetic methods to synthesize.

分散劑亦可使用以下將說明的樹脂(以下適當稱為「分 散樹脂2」)。分散樹脂2的特徵在於:含有具有基團X(該基團X具有pKa為14以下的官能基)的重複單元、與位於側鏈上的原子數為40~10,000的低聚物鏈或聚合物鏈Y,且含有鹼性氮原子。 The dispersant may also use a resin which will be described below (hereinafter referred to as "minutes" Scattered resin 2"). The dispersion resin 2 is characterized by comprising a repeating unit having a group X (the group X has a pKa of 14 or less) and an oligomer chain or polymer having 40 to 10,000 atoms on the side chain. Chain Y and contains a basic nitrogen atom.

如後文將詳述般,分散樹脂2中的氮原子與基團X所具 有的pKa為14以下的官能基兩者與二氧化鈦粒子(D)相互作用,進而,分散樹脂2具有原子數為40~10,000的低聚物鏈或聚合物鏈Y,因此例如上述低聚物鏈或聚合物鏈Y作為立體排斥基而發揮功能,藉此可發揮良好的分散性,使二氧化鈦粒子(D)均勻地分散。另外,即便於將組成物於室溫等下長期保存的情形時,上述低聚物鏈或聚合物鏈Y與溶劑亦進行相互作用,藉此可長期抑制二氧化鈦粒子(D)的沈降。進而,上述低聚物鏈或聚合物鏈Y作為立體排斥基而發揮功能,由此防止二氧化鈦粒子(D)的凝聚,故即便提高二氧化鈦粒子(D)的含量,亦如上述般不易損及分散性及分散穩定性。 As will be described in detail later, the nitrogen atom and the group X in the dispersion resin 2 have Some of the functional groups having a pKa of 14 or less interact with the titanium oxide particles (D), and further, the dispersion resin 2 has an oligomer chain or a polymer chain Y having an atomic number of 40 to 10,000, and thus, for example, the above oligomer chain Or the polymer chain Y functions as a steric repulsion group, whereby the dispersibility can be exhibited, and the titanium oxide particles (D) can be uniformly dispersed. In addition, even when the composition is stored for a long period of time at room temperature or the like, the oligomer chain or the polymer chain Y interacts with the solvent, whereby the sedimentation of the titanium oxide particles (D) can be suppressed for a long period of time. Further, since the oligomer chain or the polymer chain Y functions as a steric repellency group, thereby preventing aggregation of the titanium oxide particles (D), even if the content of the titanium oxide particles (D) is increased, the dispersion is not easily impaired as described above. Sex and dispersion stability.

此處,所謂鹼性氮原子,只要為呈鹼性的氮原子,則並 無特別限制,較佳為分散樹脂2含有具有pKb為14以下的氮原子的結構,更佳為含有具有pKb為10以下的氮原子的結構。 Here, the basic nitrogen atom is a basic nitrogen atom, and The dispersion resin 2 preferably has a structure having a nitrogen atom having a pKb of 14 or less, and more preferably a structure having a nitrogen atom having a pKb of 10 or less.

本發明中,所謂鹼強度pKb,是指水溫25℃下的pKb,是用以定量地表示鹼的強度的指標之一,與鹼性度常數為相同涵義。鹼強度pKb與酸強度pKa有pKb=14-pKa的關係。 In the present invention, the alkali strength pKb refers to pKb at a water temperature of 25 ° C, and is one of the indexes for quantitatively indicating the strength of the alkali, and has the same meaning as the basicity constant. The alkali strength pKb has a relationship with the acid strength pKa of pKb = 1 - pKa.

關於具有pKa為14以下的官能基的基團X,與下文中關於分散樹脂2-1所述的基團X為相同涵義。 The group X having a functional group having a pKa of 14 or less has the same meaning as the group X described below with respect to the dispersion resin 2-1.

關於分散樹脂2於側鏈上具有的原子數40~10,000的低聚物鏈或聚合物鏈Y,亦與下文中關於分散樹脂2-1所述的原子數為40~10,000的低聚物鏈或聚合物鏈Y為相同涵義。 The oligomer chain or polymer chain Y having a number of atoms of 40 to 10,000 in the side chain of the dispersion resin 2, and the oligomer chain having 40 to 10,000 atoms as described below with respect to the dispersion resin 2-1 Or the polymer chain Y has the same meaning.

分散樹脂2可列舉含有以下重複單元的樹脂等:下述式所表示的含有具有pKa為14以下的官能基的基團X的重複單元、下述式所表示的具有鹼性氮原子的重複單元、及下述式所表示的具有原子數為40~10,000的低聚物鏈或聚合物鏈Y的重複單元(自下述重複單元的結構的左側起依序對應)。 The resin which contains the following repeating unit is a repeating unit containing the group X which has a functional group of pKa of 14 or less, and the repeating unit which has a basic nitrogen atom represented by the following formula. And a repeating unit having an oligomer chain or a polymer chain Y having an atomic number of 40 to 10,000 represented by the following formula (corresponding to the left side of the structure of the repeating unit described below).

上述式中,x、y及z分別表示重複單元的聚合莫耳比, 較佳為x為5~50、y為5~60、z為10~90。l表示聚酯鏈的連結數,為可形成原子數為40~10,000的低聚物鏈或聚合物鏈的整數,較佳為70~2000。 In the above formula, x, y and z represent the polymerization molar ratio of the repeating unit, respectively. Preferably, x is 5 to 50, y is 5 to 60, and z is 10 to 90. l represents the number of bonds of the polyester chain, and is an integer of an oligomer chain or a polymer chain which can form an atomic number of 40 to 10,000, preferably 70 to 2,000.

上述分散樹脂2較佳為含有以下結構的樹脂:含有氮原子(該 氮原子為上述具有pKa為14以下的官能基的基團X鍵結的氮原子)的重複單元、及位於側鏈上的原子數為40~10,000的低聚物鏈或聚合物鏈Y。 The above dispersion resin 2 is preferably a resin having a structure containing a nitrogen atom (this The repeating unit in which the nitrogen atom is a group X-bonded nitrogen atom having a functional group having a pKa of 14 or less, and the oligomer chain or polymer chain Y having 40 to 10,000 atoms in the side chain.

上述分散樹脂2尤佳為含有以下結構的樹脂2-1(以下適當稱為「分散樹脂2-1」):(i)選自聚(低級伸烷基亞胺)系重複單元、聚烯丙基胺系重複單元、聚二烯丙基胺系重複單元、間二甲苯二胺-表氯醇聚縮合物系重複單元及聚乙烯基胺系重複單元中的至少一種含有氮原子的重複單元,且該重複單元具有鍵結於上述氮原子且含有pKa為14以下的官能基的基團X;以及位於側鏈上的(ii)原子數為40~10,000的低聚物鏈或聚合物鏈Y。 The dispersion resin 2 is preferably a resin 2-1 having the following structure (hereinafter referred to as "dispersion resin 2-1" as appropriate): (i) a poly(lower alkylene imine)-based repeating unit, polyallyl a repeating unit containing at least one of a hydroxyl group-based repeating unit, a polydiallylamine-based repeating unit, a meta-xylenediamine-epichlorohydrin polycondensate-based repeating unit, and a polyvinylamine-based repeating unit; And the repeating unit has a group X bonded to the above nitrogen atom and having a functional group having a pKa of 14 or less; and (ii) an oligomer chain or a polymer chain Y of 40 to 10,000 in the side chain .

((i)選自聚(低級伸烷基亞胺)系重複單元、聚烯丙基 胺系重複單元、聚二烯丙基胺系重複單元、間二甲苯二胺-表氯醇聚縮合物系重複單元及聚乙烯基胺系重複單元中的至少一種的含有氮原子的重複單元) ((i) selected from poly(lower alkylene imine) repeating units, polyallyl a nitrogen atom-containing repeating unit of at least one of an amine-based repeating unit, a polydiallylamine-based repeating unit, a meta-xylenediamine-epichlorohydrin polycondensate-based repeating unit, and a polyvinylamine-based repeating unit)

本發明的分散樹脂2-1具有選自聚(低級伸烷基亞胺)系重複單元、聚烯丙基胺系重複單元、聚二烯丙基胺系重複單元、間二甲苯二胺-表氯醇聚縮合物系重複單元及聚乙烯基胺系重複單元中的至少一種含有氮原子的重複單元(i)。藉此,對二氧化鈦粒子(D)表面的吸附力提高,且可降低上述二氧化鈦粒子(D)間的相互作用。 The dispersion resin 2-1 of the present invention has a repeating unit selected from a poly(lower alkyleneimine) type, a polyallylamine-based repeating unit, a polydiallylamine-based repeating unit, and a meta-xylenediamine-table The repeating unit (i) containing at least one of a chlorohydrin polycondensate-based repeating unit and a polyvinylamine-based repeating unit containing a nitrogen atom. Thereby, the adsorption force on the surface of the titanium oxide particle (D) is improved, and the interaction between the above-mentioned titanium oxide particles (D) can be reduced.

聚(低級伸烷基亞胺)可為鏈狀亦可為網狀。 The poly(lower alkylene imide) may be in the form of a chain or a network.

將選自聚(低級伸烷基亞胺)系重複單元、聚烯丙基胺系重複單 元、聚二烯丙基胺系重複單元、間二甲苯二胺-表氯醇聚縮合物系重複單元及聚乙烯基胺系重複單元中的至少一種含有氮原子的重複單元(i)聚合所得的主鏈的數量平均分子量,即自分散樹脂2-1中去掉側鏈的上述低聚物鏈或聚合物鏈Y部分所得的部分的數量平均分子量較佳為100~10,000,更佳為200~5,000,最佳為300~2,000。主鏈部的數量平均分子量可根據核磁共振光譜法中測定的末端基與主鏈部的氫原子積分值的比率而求出,或藉由作為原料的含有胺基的低聚物或聚合物的分子量的測定來求出。 Will be selected from poly(lower alkylene imine) repeating units, polyallylamine repeats Polymer, polydiallylamine repeating unit, meta-xylenediamine-epichlorohydrin polycondensate repeating unit and polyvinylamine repeating unit, at least one repeating unit containing nitrogen atom (i) The number average molecular weight of the main chain, that is, the portion obtained by removing the above-mentioned oligomer chain or the polymer chain Y portion of the side chain from the dispersion resin 2-1 preferably has a number average molecular weight of 100 to 10,000, more preferably 200. 5,000, the best is 300~2,000. The number average molecular weight of the main chain portion can be determined from the ratio of the terminal group and the hydrogen atom integrated value of the main chain portion measured in the nuclear magnetic resonance spectroscopy, or the amine group-containing oligomer or polymer as a raw material. The molecular weight was measured and determined.

含有氮原子的重複單元(i)尤佳為聚(低級伸烷基亞胺) 系重複單元或聚烯丙基胺系重複單元。再者,本發明中,所謂聚(低級伸烷基亞胺)中的低級,表示碳數為1~5,所謂低級伸烷基亞胺,表示碳數1~5的伸烷基亞胺。若明示該結構,則本發明的分散樹脂2-1較佳為含有以下結構:具有通式(I-1)所表示的重複單元及通式(I-2)所表示的重複單元的結構、或具有通式(II-1)所表示的重複單元及通式(II-2)所表示的重複單元的結構。 The repeating unit (i) containing a nitrogen atom is particularly preferably a poly(lower alkylene imine) A repeating unit or a polyallylamine-based repeating unit. In the present invention, the lower order of poly(lower alkylene imine) means a carbon number of 1 to 5, and the lower alkylene imide represents an alkylene imine having 1 to 5 carbon atoms. When the structure is clearly illustrated, the dispersion resin 2-1 of the present invention preferably has a structure having a repeating unit represented by the formula (I-1) and a repeating unit represented by the formula (I-2). Or a structure having a repeating unit represented by the formula (II-1) and a repeating unit represented by the formula (II-2).

(通式(I-1)所表示的重複單元及通式(I-2)所表示 的重複單元) (repeating unit represented by the formula (I-1) and represented by the formula (I-2) Repeat unit)

對作為本發明的分散樹脂2-1的較佳構成成分的通式(I-1)所表示的重複單元及通式(I-2)所表示的重複單元加以詳細說明。 The repeating unit represented by the formula (I-1) and the repeating unit represented by the formula (I-2) which are preferred constituent components of the dispersion resin 2-1 of the present invention will be described in detail.

通式(I-1) 通式(I-2) Formula (I-1) Formula (I-2)

上述通式(I-1)及通式(I-2)中,R1及R2分別獨立地表示氫原子、鹵素原子或烷基。a分別獨立地表示1~5的整數。*表示重複單元間的連結部。 In the above formula (I-1) and formula (I-2), R 1 and R 2 each independently represent a hydrogen atom, a halogen atom or an alkyl group. a independently represents an integer from 1 to 5, respectively. * indicates the connection between the repeating units.

X表示具有pKa為14以下的官能基的基團。 X represents a group having a functional group having a pKa of 14 or less.

Y表示原子數為40~10,000的低聚物鏈或聚合物鏈。 Y represents an oligomer chain or a polymer chain having an atomic number of 40 to 10,000.

本發明的分散樹脂2-1較佳為除了通式(I-1)或通式(I-2)所表示的重複單元,更含有通式(I-3)所表示的重複單元作為共聚合成分。藉由併用此種重複單元,二氧化鈦粒子(D)的分散性能進一步提高。 The dispersion resin 2-1 of the present invention preferably contains a repeating unit represented by the formula (I-1) or a repeating unit represented by the formula (I-3) as a copolymerization unit. ingredient. By using such a repeating unit in combination, the dispersion property of the titanium oxide particles (D) is further improved.

上述通式(I-3)中,*、R1、R2及a與通式(I-1)為相同涵義。 In the above formula (I-3), *, R 1 , R 2 and a have the same meanings as in the formula (I-1).

Y'表示具有陰離子基的原子數為40~10,000的低聚物鏈或聚合物鏈。 Y' represents an oligomer chain or a polymer chain having an anion group of 40 to 10,000 atoms.

上述通式(I-3)所表示的重複單元可藉由以下方式來形成:於主鏈部上具有一級胺基或二級胺基的樹脂中,添加具有與胺反 應而形成鹽的基團的低聚物或聚合物來進行反應。 The repeating unit represented by the above formula (I-3) can be formed by adding a compound having a primary amino group or a secondary amine group to the main chain portion, and having an anti-amine The reaction is carried out by forming an oligomer or polymer of a salt group.

通式(I-1)、通式(I-2)及通式(I-3)中,R1及R2尤佳為氫原子。就原料獲取的觀點而言,a較佳為2。 In the formula (I-1), the formula (I-2) and the formula (I-3), R 1 and R 2 are particularly preferably a hydrogen atom. From the viewpoint of raw material acquisition, a is preferably 2.

本發明的分散樹脂2-1除了通式(I-1)、通式(I-2)及通式(I-3)所表示的重複單元以外,亦可含有低級伸烷基亞胺作為重複單元。與上述同樣地,所謂低級伸烷基亞胺,表示碳數1~5的伸烷基亞胺。分散樹脂2-1可含有此種低級伸烷基亞胺重複單元,亦可不含此種低級伸烷基亞胺重複單元,於含有此種低級伸烷基亞胺重複單元的情形時,於分散樹脂2-1所含的所有重複單元中,低級伸烷基亞胺重複單元較佳為含有1莫耳%~70莫耳%。再者,此種低級伸烷基亞胺重複單元中的氮原子上,亦可進一步鍵結有上述X、Y或Y'所表示的基團。另外,於此種主鏈結構中含有鍵結有X所表示的基團的重複單元與鍵結有Y的重複單元兩者的樹脂亦包含在分散樹脂2-1中。 The dispersion resin 2-1 of the present invention may contain a lower alkyleneimine as a repeat in addition to the repeating unit represented by the formula (I-1), the formula (I-2) and the formula (I-3). unit. Similarly to the above, the lower alkyleneimine represents an alkyleneimine having 1 to 5 carbon atoms. The dispersion resin 2-1 may contain such a lower alkylene imine repeating unit, or may not contain such a lower alkylene imine repeating unit, and may be dispersed in the case of containing such a lower alkylene imine repeating unit. Among all the repeating units contained in the resin 2-1, the lower alkyleneimine repeating unit preferably contains from 1 mol% to 70 mol%. Further, the nitrogen atom in the repeating unit of the lower alkyleneimine may be further bonded to the group represented by the above X, Y or Y'. Further, a resin containing both a repeating unit to which a group represented by X is bonded and a repeating unit to which Y is bonded in such a main chain structure is also contained in the dispersion resin 2-1.

通式(I-1)所表示的重複單元為含有氮原子(該氮原子為具有pKa為14以下的官能基的基團X鍵結的氮原子)的重複單元,就保存穩定性、顯影性的觀點而言,於分散樹脂2-1所含的所有重複單元中,此種含有氮原子的重複單元較佳為含有1莫耳%~80莫耳%。 The repeating unit represented by the formula (I-1) is a repeating unit containing a nitrogen atom which is a nitrogen atom bonded to a group X having a functional group having a pKa of 14 or less, and stores stability and developability. From the viewpoint of the above, in all the repeating units contained in the dispersion resin 2-1, such a repeating unit containing a nitrogen atom preferably contains 1 mol% to 80 mol%.

通式(I-2)所表示的重複單元為具有原子數為40~10,000的低聚物鏈或聚合物鏈的重複單元,就保存穩定性的觀點而言,於分散樹脂2-1的所有重複單元中,此種重複單元較佳為含有10莫 耳%~90莫耳%。 The repeating unit represented by the formula (I-2) is a repeating unit having an oligomer chain or a polymer chain having an atomic number of 40 to 10,000, and is all of the dispersion resin 2-1 from the viewpoint of storage stability. In the repeating unit, such a repeating unit preferably contains 10 moles. Ear %~90% of the ear.

對兩者的含有比進行研究,就分散穩定性及親疏水性的平衡的觀點而言,重複單元(I-1):(I-2)較佳為以莫耳比計而為10:1~1:100的範圍。 From the viewpoint of the content ratio of the two, in terms of the balance of dispersion stability and hydrophilicity, the repeating unit (I-1): (I-2) is preferably 10:1 in terms of molar ratio. The range of 1:100.

再者,視需要而併用的通式(I-3)所表示的重複單元為含有原子數為40~10,000的低聚物鏈或聚合物鏈的部分結構以離子鍵的形式鍵結於主鏈的氮原子者,於分散樹脂2-1的所有重複單元中,就效果的觀點而言,較佳為含有0.5莫耳%~20莫耳%。 Further, the repeating unit represented by the formula (I-3) which is used in combination as needed is a partial structure containing an oligomer chain or a polymer chain having an atomic number of 40 to 10,000, and is bonded to the main chain in the form of an ionic bond. The nitrogen atom is preferably contained in an amount of from 0.5 mol% to 20 mol% in terms of the effect of all the repeating units of the dispersion resin 2-1.

(通式(II-1)所表示的重複單元及通式(II-2)所表示的重複單元) (repeating unit represented by the formula (II-1) and repeating unit represented by the formula (II-2))

對作為分散樹脂2-1的較佳構成成分的通式(II-1)所表示的重複單元及通式(II-2)所表示的重複單元加以詳細說明。 The repeating unit represented by the formula (II-1) and the repeating unit represented by the formula (II-2) which are preferred constituent components of the dispersion resin 2-1 will be described in detail.

通式(II-1)及通式(II-2)中,R3、R4、R5及R6分別獨立地表示氫原子、鹵素原子、烷基。*、X及Y與通式(I-1)及通式(I-2)中的*、X及Y為相同涵義。 In the general formula (II-1) and the general formula (II-2), R 3 , R 4 , R 5 and R 6 each independently represent a hydrogen atom, a halogen atom or an alkyl group. *, X and Y have the same meanings as *, X and Y in the formula (I-1) and the formula (I-2).

分散樹脂2-1較佳為除了通式(II-1)所表示的重複單 元、通式(II-2)所表示的重複單元以外,更含有通式(II-3)所表示的重複單元作為共聚合成分。藉由併用此種重複單元,二氧化鈦粒子(D)的分散性能進一步提高。 The dispersion resin 2-1 is preferably a repeating sheet other than the formula (II-1) In addition to the repeating unit represented by the formula (II-2), the repeating unit represented by the formula (II-3) is further contained as a copolymerization component. By using such a repeating unit in combination, the dispersion property of the titanium oxide particles (D) is further improved.

通式(II-3)中,*、R3、R4、R5及R6與通式(II-1)為相同涵義。Y'與通式(I-3)中的Y'為相同涵義。 In the formula (II-3), *, R 3 , R 4 , R 5 and R 6 have the same meanings as in the formula (II-1). Y' has the same meaning as Y' in the formula (I-3).

通式(II-1)、通式(II-2)及通式(II-3)中,就原料的獲取性的觀點而言,R3、R4、R5及R6較佳為氫原子。 In the general formula (II-1), the general formula (II-2) and the general formula (II-3), R 3 , R 4 , R 5 and R 6 are preferably hydrogen from the viewpoint of availability of raw materials. atom.

通式(II-1)為含有氮原子(該氮原子為具有pKa為14以下的官能基的基團X鍵結的氮原子)的重複單元,就保存穩定性、顯影性的觀點而言,於分散樹脂2-1所含的所有重複單元中,此種含有氮原子的重複單元較佳為含有1莫耳%~80莫耳%。 The general formula (II-1) is a repeating unit containing a nitrogen atom (a nitrogen atom in which the nitrogen atom is a group X having a functional group having a pKa of 14 or less), and from the viewpoint of storage stability and developability, In all the repeating units contained in the dispersion resin 2-1, such a repeating unit containing a nitrogen atom preferably contains 1 mol% to 80 mol%.

通式(II-2)為具有原子數為40~10,000的低聚物鏈或聚合物鏈Y的重複單元,就保存穩定性的觀點而言,於分散樹脂2-1的所有重複單元中,此種重複單元較佳為含有10莫耳%~90莫耳%。 The formula (II-2) is a repeating unit having an oligomer chain or a polymer chain Y having an atomic number of 40 to 10,000, and in terms of storage stability, in all the repeating units of the dispersion resin 2-1, Such a repeating unit preferably contains from 10 mol% to 90 mol%.

對兩者的含有比進行研究,就分散穩定性及親疏水性的 平衡的觀點而言,重複單元(II-1):(II-2)較佳為以莫耳比計而為10:1~1:100的範圍。 Studying the ratio of the two, the dispersion stability and hydrophilicity From the viewpoint of balance, the repeating unit (II-1): (II-2) is preferably in the range of 10:1 to 1:100 in terms of molar ratio.

於分散樹脂2-1的所有重複單元中,視需要而併用的通式(II-3)所表示的重複單元較佳為含有0.5莫耳%~20莫耳%。 In all the repeating units of the dispersion resin 2-1, the repeating unit represented by the formula (II-3) which is used in combination as needed preferably contains 0.5 mol% to 20 mol%.

分散樹脂2-1中,就分散性的觀點而言,尤其最佳為含有通式(I-1)所表示的重複單元與通式(I-2)所表示的重複單元兩者。 In the dispersion resin 2-1, it is particularly preferable to contain both the repeating unit represented by the formula (I-1) and the repeating unit represented by the formula (I-2) from the viewpoint of dispersibility.

<具有pKa為14以下的官能基的基團X> <Group X having a functional group having a pKa of 14 or less>

X具有於水溫25℃下的pKa為14以下的官能基。「pKa為14以下的官能基」只要物性滿足該條件,則其結構等並無特別限定,可列舉公知的官能基中pKa滿足上述範圍者,尤佳為pKa為12以下的官能基,最佳為pKa為11以下的官能基。具體而言,例如可列舉:羧酸(pKa為3~5左右)、磺酸(pKa為-3~-2左右)、-COCH2CO-(pKa為8~10左右)、-COCH2CN(pKa為8~11左右)、-CONHCO-、酚性羥基、-RFCH2OH或-(RF)2CHOH(RF表示全氟烷基。pKa為9~11左右)、磺醯胺基(pKa為9~11左右)等。 X has a functional group having a pKa of 14 or less at a water temperature of 25 °C. "The functional group having a pKa of 14 or less" is not particularly limited as long as the physical properties satisfy the above conditions, and the pKa of the known functional group satisfies the above range, and particularly preferably a functional group having a pKa of 12 or less. It is a functional group having a pKa of 11 or less. Specific examples thereof include carboxylic acid (pKa of about 3 to 5), sulfonic acid (pKa of about -3 to 2), -COCH 2 CO- (pKa of about 8 to 10), and -COCH 2 CN. (pKa is about 8 to 11), -CONHCO-, phenolic hydroxyl group, -R F CH 2 OH or -(R F ) 2 CHOH (R F represents a perfluoroalkyl group, pKa is about 9 to 11), and sulfonamide Amine group (pKa is about 9 to 11) and the like.

藉由上述基團X所具有的官能基的pKa為14以下,可達成其與上述二氧化鈦粒子(D)的相互作用。 The pKa of the functional group possessed by the above-mentioned group X is 14 or less, and the interaction with the above-mentioned titanium oxide particle (D) can be attained.

該具有pKa為14以下的官能基的基團X較佳為直接鍵結於上述含有氮原子的重複單元中的氮原子,上述含有氮原子的重複單元的氮原子與X不僅能以共價鍵的形態連結,而且能以進行離子鍵結而形成鹽的形態連結。 The group X having a functional group having a pKa of 14 or less is preferably a nitrogen atom directly bonded to the above-mentioned repeating unit containing a nitrogen atom, and the nitrogen atom of the repeating unit containing the nitrogen atom and X can be not only a covalent bond The form is connected, and it can be connected in a form in which a salt is formed by ion bonding.

本發明的具有pKa為14以下的官能基的基團X尤佳為具有通式(V-1)、通式(V-2)或通式(V-3)所表示的結構。 The group X having a functional group having a pKa of 14 or less of the present invention is preferably a structure represented by the formula (V-1), the formula (V-2) or the formula (V-3).

上述通式(V-1)、通式(V-2)中,U表示單鍵或二價連結基。 In the above formula (V-1) and formula (V-2), U represents a single bond or a divalent linking group.

d及e分別獨立地表示0或1。 d and e each independently represent 0 or 1.

上述通式(V-3)中,Q表示醯基或烷氧基羰基。 In the above formula (V-3), Q represents a mercapto group or an alkoxycarbonyl group.

U所表示的二價連結基例如可列舉:伸烷基(更具體而言,例如為-CH2-、-CH2CH2-、-CH2CHMe-、-(CH2)5-、-CH2CH(n-C10H21)-等)、含氧的伸烷基(更具體而言,例如為-CH2OCH2-、-CH2CH2OCH2CH2-等)、伸芳基(例如伸苯基、伸甲苯基、伸聯苯基、伸萘基、伸呋喃基、伸吡咯基(pyrrolylene)等)、伸烷氧基(例如伸乙氧基、伸丙氧基、伸苯氧基等)、伸烯基(例如伸乙烯基)等。另外,就生產性的觀點而言,d較佳為1,另外,e較佳為0。 The divalent linking group represented by U may, for example, be an alkylene group (more specifically, for example, -CH 2 -, -CH 2 CH 2 -, -CH 2 CHMe-, -(CH 2 ) 5 -, - CH 2 CH(nC 10 H 21 )-etc.), an oxygen-containing alkylene group (more specifically, for example, -CH 2 OCH 2 -, -CH 2 CH 2 OCH 2 CH 2 -, etc.), an aryl group (e.g., stretching phenyl, stretching tolyl, stretching biphenyl, stretching naphthyl, stretching furanyl, pyrrolylene, etc.), alkoxy (e.g., ethoxy, propenoxy, benzene) An oxy group, etc., an alkenyl group (for example, a vinyl group), and the like. Further, from the viewpoint of productivity, d is preferably 1, and e is preferably 0.

Q表示醯基或烷氧基羰基。Q尤佳為醯基,就容易製造、原料(X的前驅物X')的獲取性的觀點而言,較佳為乙醯基。 Q represents a mercapto or alkoxycarbonyl group. It is preferable that Q is a mercapto group, and from the viewpoint of availability of a raw material (precursor X of X), it is preferably an ethylene group.

本發明的基團X較佳為與含有氮原子的重複單元的上述氮原子鍵結。藉此,上述二氧化鈦粒子(D)的分散性、分散穩 定性飛躍性地提高。 The group X of the present invention is preferably bonded to the above nitrogen atom of a repeating unit containing a nitrogen atom. Thereby, the dispersibility and dispersion of the above titanium oxide particles (D) are stable Qualitatively and dramatically improved.

進而,基團X於其中含有pKa為14以下的官能基作為 部分結構,故亦作為鹼可溶性基而發揮功能。藉此,可認為未硬化區域對鹼性顯影液的顯影性提高,可實現分散性、分散穩定性、顯影性的並存。 Further, the group X contains a functional group having a pKa of 14 or less as a Part of the structure, so it also functions as an alkali-soluble group. Thereby, it is considered that the developability of the alkali-developing liquid in the uncured region is improved, and the dispersibility, the dispersion stability, and the developability can be achieved.

X中的pKa為14以下的官能基的含量並無特別限制, 相對於1g分散樹脂2,較佳為0.01mmol~5mmol。於該範圍內,上述二氧化鈦粒子(D)的分散性、分散穩定性提高,且未硬化部的顯影性變優異。另外,就酸值的觀點而言,含有使分散樹脂2的酸值成為5mgKOH/g~50mgKOH/g左右的量就顯影性的觀點而言較佳。 The content of the functional group having a pKa of 14 or less in X is not particularly limited. It is preferably 0.01 mmol to 5 mmol with respect to 1 g of the dispersion resin 2. Within this range, the dispersibility and dispersion stability of the titanium dioxide particles (D) are improved, and the developability of the uncured portion is excellent. In addition, it is preferable from the viewpoint of the acid value that the acid value of the dispersion resin 2 is about 5 mgKOH/g to 50 mgKOH/g.

(原子數為40~10,000的低聚物鏈或聚合物鏈Y) (Opide chain or polymer chain Y with an atomic number of 40 to 10,000)

Y可列舉:可與分散樹脂2的主鏈部連結的聚酯、聚醯胺、聚醯亞胺、聚(甲基)丙烯酸酯等公知的聚合物鏈。Y與分散樹脂2的鍵結部位較佳為低聚物鏈或聚合物鏈Y的末端。 Y includes a known polymer chain such as polyester, polyamine, polyimine or poly(meth)acrylate which can be bonded to the main chain portion of the dispersion resin 2. The bonding site of Y and the dispersion resin 2 is preferably the terminal of the oligomer chain or the polymer chain Y.

Y較佳為與選自如下重複單元中的至少一種含有氮原子的重複單元的上述氮原子鍵結:聚(低級伸烷基亞胺)系重複單元、聚烯丙基胺系重複單元、聚二烯丙基胺系重複單元、間二甲苯二胺-表氯醇聚縮合物系重複單元及聚乙烯基胺系重複單元。選自聚(低級伸烷基亞胺)系重複單元、聚烯丙基胺系重複單元、聚二烯丙基胺系重複單元、間二甲苯二胺-表氯醇聚縮合物系重複單元及聚乙烯基胺系重複單元中的至少一種含有氮原子的重複單元等的主 鏈部與Y的鍵結方式為共價鍵、離子鍵或共價鍵及離子鍵的混合。Y與上述主鏈部的鍵結方式的比率為共價鍵:離子鍵=100:0~0:100,較佳為95:5~5:95。若為該範圍外,則分散性、分散穩定性劣化,且溶劑溶解性變低。 Y is preferably bonded to the above nitrogen atom with at least one repeating unit containing a nitrogen atom selected from the group consisting of poly(lower alkylene imine) repeating units, polyallylamine repeating units, and poly a diallylamine-based repeating unit, a meta-xylenediamine-epichlorohydrin polycondensate-based repeating unit, and a polyvinylamine-based repeating unit. a poly(lower alkylene imine) repeating unit, a polyallylamine repeating unit, a polydiallylamine repeating unit, a meta-xylenediamine-epichlorohydrin polycondensate repeating unit, and a main body of at least one of repeating units containing a nitrogen atom, such as a repeating unit of a nitrogen atom The bonding mode of the chain portion and Y is a covalent bond, an ionic bond, or a mixture of a covalent bond and an ionic bond. The ratio of the bonding mode of Y to the main chain portion is a covalent bond: ion bond = 100:0 to 0:100, preferably 95:5 to 5:95. When it is outside this range, dispersibility and dispersion stability will deteriorate, and solvent solubility will become low.

Y較佳為與上述含有氮原子的重複單元的上述氮原子以醯胺鍵或羧酸鹽的形式形成離子鍵。 Y preferably forms an ionic bond in the form of a guanamine bond or a carboxylate with the above nitrogen atom of the above repeating unit containing a nitrogen atom.

就分散性、分散穩定性、顯影性的觀點而言,上述低聚物鏈或聚合物鏈Y的原子數較佳為50~5,000,更佳為60~3,000。 The atomic number of the oligomer chain or polymer chain Y is preferably from 50 to 5,000, more preferably from 60 to 3,000, from the viewpoint of dispersibility, dispersion stability, and developability.

若每一條上述低聚物鏈或聚合物鏈Y的原子數小於40,則接枝鏈短,故有時立體排斥效應變小而分散性降低。另一方面,若每一條上述低聚物鏈或聚合物鏈Y的原子數超過10000,則上述低聚物鏈或聚合物鏈Y變得過長,有時對二氧化鈦粒子(D)的吸附力降低而分散性降低。 When the number of atoms of each of the above oligomer chain or polymer chain Y is less than 40, the graft chain is short, so that the steric repulsion effect is small and the dispersibility is lowered. On the other hand, if the number of atoms of each of the above oligomer chain or polymer chain Y exceeds 10,000, the oligomer chain or polymer chain Y becomes too long, and the adsorption force on the titanium oxide particles (D) may be excessive. Reduced and reduced dispersion.

另外,Y的數量平均分子量可利用由GPC法所得的聚苯乙烯換算值來測定。Y的數量平均分子量尤佳為1,000~50,000,就分散性、分散穩定性、顯影性的觀點而言,最佳為1,000~30,000。 Further, the number average molecular weight of Y can be measured by a polystyrene equivalent value obtained by a GPC method. The number average molecular weight of Y is particularly preferably from 1,000 to 50,000, and from the viewpoint of dispersibility, dispersion stability, and developability, it is preferably from 1,000 to 30,000.

Y所表示的側鏈結構較佳為相對於主鏈而於樹脂一分子中連結2個以上,最佳為連結5個以上。 The side chain structure represented by Y is preferably two or more in one molecule of the resin with respect to the main chain, and is preferably five or more.

尤佳為Y具有通式(III-1)所表示的結構。 More preferably, Y has a structure represented by the formula (III-1).

[化23] [化23]

通式(III-1)中,Z表示具有聚酯鏈作為部分結構的聚 合物或低聚物,表示自下述通式(IV)所表示的具有游離羧酸的聚酯中去掉羧基所得的殘基。 In the general formula (III-1), Z represents a polycondensation having a polyester chain as a partial structure The compound or oligomer represents a residue obtained by removing a carboxyl group from a polyester having a free carboxylic acid represented by the following formula (IV).

通式(IV)中,Z與通式(III-1)中的Z為相同涵義。 In the formula (IV), Z has the same meaning as Z in the formula (III-1).

於分散樹脂2-1含有通式(I-3)或通式(II-3)所表示的重複單元的情形時,Y'較佳為通式(III-2)。 In the case where the dispersion resin 2-1 contains a repeating unit represented by the formula (I-3) or the formula (II-3), Y' is preferably a formula (III-2).

通式(III-2)中,Z與通式(III-1)的Z為相同涵義。 In the formula (III-2), Z has the same meaning as Z of the formula (III-1).

於單末端具有羧基的聚酯(通式(IV)所表示的聚酯) 可藉由(IV-1)羧酸與內酯的聚縮合、(IV-2)含羥基的羧酸的聚縮合、(IV-3)二元醇與二元羧酸(或環狀酸酐)的聚縮合等而獲 得。 Polyester having a carboxyl group at a single terminal (polyester represented by the formula (IV)) By (IV-1) polycondensation of a carboxylic acid with a lactone, (IV-2) polycondensation of a hydroxyl group-containing carboxylic acid, (IV-3) a diol with a dicarboxylic acid (or a cyclic acid anhydride) Polycondensation Got it.

(IV-1)羧酸與內酯的聚縮合反應中所用的羧酸較佳為 脂肪族羧酸(碳數1~30的直鏈或分支的羧酸)。該些羧酸亦可混合使用。內酯可使用公知的內酯。 (IV-1) The carboxylic acid used in the polycondensation reaction of the carboxylic acid and the lactone is preferably An aliphatic carboxylic acid (a linear or branched carboxylic acid having 1 to 30 carbon atoms). These carboxylic acids may also be used in combination. As the lactone, a known lactone can be used.

該些內酯亦可混合使用多種。 These lactones may also be used in combination.

羧酸與內酯的反應時的添加莫耳比率視目標聚酯鏈的分子量而不同,故無法明確地決定,但較佳為羧酸:內酯=1:1~1:1,000,最佳為1:3~1:500。 The molar ratio of the addition of the carboxylic acid to the lactone varies depending on the molecular weight of the target polyester chain, and thus cannot be clearly determined. However, it is preferably a carboxylic acid: lactone = 1:1 to 1:1,000, preferably 1:3~1:500.

(IV-2)含羥基的羧酸的聚縮合中的含羥基的羧酸與上述(IV-1)中的含羥基的羧酸相同,較佳範圍亦相同。 (IV-2) The hydroxyl group-containing carboxylic acid in the polycondensation of the hydroxyl group-containing carboxylic acid is the same as the hydroxyl group-containing carboxylic acid in the above (IV-1), and the preferred range is also the same.

(IV-3)二元醇與二元羧酸(或環狀酸酐)的聚縮合反應中的二元醇較佳為直鏈或分支的脂肪族二醇(碳數2~30的二醇)。 (IV-3) The diol in the polycondensation reaction of the diol with the dicarboxylic acid (or cyclic acid anhydride) is preferably a linear or branched aliphatic diol (diol having 2 to 30 carbon atoms). .

二元羧酸較佳為直鏈或分支的二元脂肪族羧酸(碳數1~30的二元脂肪族羧酸)。 The dicarboxylic acid is preferably a linear or branched dibasic aliphatic carboxylic acid (a divalent aliphatic carboxylic acid having 1 to 30 carbon atoms).

二元羧酸與二元醇較佳為以莫耳比計以1:1添加。藉此可於末端導入羧酸。 The dicarboxylic acid and the diol are preferably added in a molar ratio of 1:1. Thereby, a carboxylic acid can be introduced at the end.

製造聚酯時的聚縮合較佳為添加觸媒來進行。觸媒較佳為作為路易斯酸而發揮功能的觸媒。 The polycondensation in the production of the polyester is preferably carried out by adding a catalyst. The catalyst is preferably a catalyst that functions as a Lewis acid.

聚酯的數量平均分子量可作為由GPC法所得的聚苯乙烯換算值來測定。聚酯的數量平均分子量為1,000~1,000,000,較佳為2,000~100,000,最佳為3,000~50,000。於分子量在該範圍內的情形時,可兼具分散性、顯影性。 The number average molecular weight of the polyester can be measured as a polystyrene-converted value obtained by a GPC method. The polyester has a number average molecular weight of 1,000 to 1,000,000, preferably 2,000 to 100,000, and most preferably 3,000 to 50,000. When the molecular weight is in this range, both dispersibility and developability can be achieved.

就製造容易性的觀點而言,Y中的形成聚合物鏈的聚酯 部分結構尤佳為藉由(IV-1)羧酸與內酯的聚縮合、及(IV-2)含羥基的羧酸的聚縮合而獲得的聚酯。 The polymer chain-forming polyester in Y from the viewpoint of ease of manufacture Part of the structure is particularly preferably a polyester obtained by polycondensation of (IV-1) a carboxylic acid with a lactone and polycondensation of a (IV-2) hydroxyl group-containing carboxylic acid.

藉由樹脂所具有的重複單元的具體結構及其組合將分 散樹脂2的具體形態[(A-1)~(A-61)]示於以下,但本發明不限定於此。下述式中,k、l、m及n分別表示重複單元的聚合莫耳比,k為1~80,l為10~90,m為0~80,n為0~70,且k+l+m+n=100。p及q表示聚酯鏈的連結數,分別獨立地表示5~100,000。R'表示氫原子或烷基羰基。 By the specific structure of the repeating unit of the resin and its combination The specific form of the bulk resin 2 [(A-1) to (A-61)] is shown below, but the present invention is not limited thereto. In the following formula, k, l, m and n respectively represent the polymerization molar ratio of the repeating unit, k is 1 to 80, l is 10 to 90, m is 0 to 80, n is 0 to 70, and k + l +m+n=100. p and q represent the number of linkages of the polyester chains, and each independently represents 5 to 100,000. R' represents a hydrogen atom or an alkylcarbonyl group.

[化26] [Chem. 26]

[化27] [化27]

[化28] [化28]

[化29] [化29]

[化30] [化30]

[化31] [化31]

[化32] [化32]

[化34] [化34]

[化35] [化35]

合成分散樹脂2的方法可利用日本專利特願2011-190180號的公開公報中記載的方法來合成。 The method of synthesizing the dispersion resin 2 can be synthesized by the method described in Japanese Laid-Open Patent Publication No. 2011-190180.

本發明的分散樹脂2較佳為藉由GPC法所測定的重量平均分子量為3,000~100,000,更佳為5,000~55,000。分子量在上述範圍內時,有可達成高顯影性、高保存穩定性的優點。另外,分散樹脂2中的含有氮原子的重複單元(i)中的氮原子的存在可藉由酸滴定等方法來確認,pKa為14以下的官能基的存在、及該官能基與上述重複單元的氮原子鍵結可藉由鹼滴定、核磁共振光 譜法、紅外光譜法等方法來確認。另外,關於側鏈上具有(ii)原子數為40~10,000的低聚物鏈或聚合物鏈Y的方面,可利用核磁共振光譜法、GPC法等方法來確認。 The dispersion resin 2 of the present invention preferably has a weight average molecular weight of 3,000 to 100,000, more preferably 5,000 to 55,000 as measured by a GPC method. When the molecular weight is in the above range, there is an advantage that high developability and high storage stability can be achieved. Further, the presence of a nitrogen atom in the repeating unit (i) containing a nitrogen atom in the dispersion resin 2 can be confirmed by a method such as acid titration, the presence of a functional group having a pKa of 14 or less, and the functional group and the above repeating unit Nitrate bonding, nuclear magnetic resonance light Spectral method, infrared spectroscopy and other methods to confirm. Further, the aspect in which the (ii) the oligomer chain or the polymer chain Y having 40 to 10,000 atoms in the side chain can be confirmed by a method such as nuclear magnetic resonance spectroscopy or GPC method.

以下,記載分散樹脂2的具體例且一併記載其分子量。R'表示烷基。 Hereinafter, a specific example of the dispersion resin 2 will be described, and the molecular weight thereof will be described together. R' represents an alkyl group.

[化39] [39]

[化42] [化42]

(上述通式(1)或通式(2)所表示的高分子分散劑、分散樹脂2以外的分散劑) (Polymer dispersant represented by the above formula (1) or (2), or a dispersant other than the dispersion resin 2)

本發明的白色感光性樹脂組成物亦可含有除上述通式(1)或通式(2)所表示的高分子分散劑、分散樹脂2以外的分散劑(以下有時稱為「其他分散劑」)。 The white photosensitive resin composition of the present invention may contain a dispersing agent other than the polymer dispersing agent represented by the above formula (1) or (2) and the dispersing resin 2 (hereinafter referred to as "other dispersing agent" ").

本發明中可使用的其他分散劑可列舉:高分子分散劑[例如具有含磷原子的基團或羧酸等酸基作為酸系吸附部位的高分子分散劑、聚醯胺-胺及其鹽、聚羧酸及其鹽、高分子量不飽和酸酯、改 質聚胺基甲酸酯、改質聚酯、改質聚(甲基)丙烯酸酯、(甲基)丙烯酸系共聚物、萘磺酸福爾馬林縮合物]、及聚氧伸乙基烷基磷酸酯、聚氧伸乙基烷基胺、烷醇胺、顏料衍生物等。其中,就良好地形成微細的孔圖案的觀點而言,較佳為具有含磷原子的基團或羧酸基的至少一者作為酸系吸附部位的高分子分散劑。含磷原子的基團可列舉磷酸酯基、聚磷酸酯基、磷酸基等。 The other dispersing agent which can be used in the present invention is a polymer dispersing agent [for example, a polymer dispersing agent having a phosphorus atom-containing group or an acid group such as a carboxylic acid as an acid-based adsorption site, a polyamine-amine and a salt thereof , polycarboxylic acids and their salts, high molecular weight unsaturated acid esters, change Polyurethane, modified polyester, modified poly(meth)acrylate, (meth)acrylic copolymer, formalin condensate naphthalenesulfonate], and polyoxyalkylene oxide Phosphate, polyoxyethylene ethylamine, alkanolamine, pigment derivative, and the like. In particular, a polymer dispersing agent having at least one of a phosphorus atom-containing group or a carboxylic acid group as an acid-based adsorption site is preferred from the viewpoint of forming a fine pore pattern. Examples of the phosphorus atom-containing group include a phosphate group, a polyphosphate group, a phosphoric acid group and the like.

其他分散劑可根據其結構而進一步分類為直鏈狀高分子、末端改質型高分子、接枝型高分子、嵌段型高分子。 Other dispersants may be further classified into a linear polymer, a terminal modified polymer, a graft polymer, and a block polymer depending on the structure thereof.

其他分散劑以吸附於二氧化鈦粒子的表面而防止再凝聚的方式發揮作用。因此,可列舉具有對二氧化鈦粒子表面的固定部位的末端改質型高分子、接枝型高分子、嵌段型高分子作為較佳結構。 The other dispersant functions to adsorb on the surface of the titanium dioxide particles to prevent re-agglomeration. Therefore, a terminal modified polymer having a fixed portion on the surface of the titanium oxide particles, a graft polymer, and a block polymer are preferable.

另一方面,其他分散劑具有以下效果:對二氧化鈦粒子表面進行改質,由此促進分散劑的吸附。 On the other hand, other dispersants have an effect of modifying the surface of the titanium oxide particles, thereby promoting adsorption of the dispersant.

其他分散劑的具體例可列舉:畢克化學(BYK Chemie)公司製造的「迪斯帕畢克(DISPERBYK)101(聚醯胺-胺磷酸鹽),迪斯帕畢克(DISPERBYK)107(羧酸酯),迪斯帕畢克(DISPERBYK)110、迪斯帕畢克(DISPERBYK)180(含酸基的共聚物),迪斯帕畢克(DISPERBYK)130(聚醯胺),迪斯帕畢克(DISPERBYK)161、迪斯帕畢克(DISPERBYK)162、迪斯帕畢克(DISPERBYK)163、迪斯帕畢克(DISPERBYK)164、迪斯帕畢克(DISPERBYK)165、迪斯帕畢克(DISPERBYK)166、 迪斯帕畢克(DISPERBYK)170(高分子共聚物)」、「畢克(BYK)-P104、畢克(BYK)-P105(高分子量不飽和聚羧酸)」;埃夫卡(EFKA)公司製造的「埃夫卡(EFKA)4047、埃夫卡(EFKA)4050、埃夫卡(EFKA)4010、埃夫卡(EFKA)4165(聚胺基甲酸酯系),埃夫卡(EFKA)4330、埃夫卡(EFKA)4340(嵌段共聚物),埃夫卡(EFKA)4400、埃夫卡(EFKA)4402(改質聚丙烯酸酯),埃夫卡(EFKA)5010(聚酯醯胺),埃夫卡(EFKA)5765(高分子量聚羧酸鹽),埃夫卡(EFKA)6220(脂肪酸聚酯),埃夫卡(EFKA)6745(酞菁衍生物),埃夫卡(EFKA)6750(偶氮顏料衍生物)」;味之素精細化學(Ajinomoto Fine-Techno)公司製造的「阿吉斯帕(Ajisper)PB821、阿吉斯帕(Ajisper)PB822」;共榮社化學公司製造的「弗洛蘭(Flowlen)TG-710(胺基甲酸酯低聚物)」、「波里弗洛(Polyflow)No.50E、波里弗洛(Polyflow)No.300(丙烯酸系共聚物)」;楠本化成公司製造的「蒂斯帕隆(Disparlon)KS-860、蒂斯帕隆(Disparlon)873SN、蒂斯帕隆(Disparlon)874、蒂斯帕隆(Disparlon)#2150(脂肪族多元羧酸),蒂斯帕隆(Disparlon)7004(聚醚酯),蒂斯帕隆(Disparlon)DA-703-50、蒂斯帕隆(Disparlon)DA-705、蒂斯帕隆(Disparlon)DA-725」;花王公司製造的「德莫耳(Demol)RN、德莫耳(Demol)N(萘磺酸福爾馬林聚縮合物)、德莫耳(Demol)MS、德莫耳(Demol)C、德莫耳(Demol)SN-B(芳香族磺酸福爾馬林聚縮合物)」、「火莫格諾(Homogenol)L-18(高分子聚羧酸)」、「愛木 根(Emulgen)920、愛木根(Emulgen)930、愛木根(Emulgen)935、愛木根(Emulgen)985(聚氧伸乙基壬基苯基醚)」、「阿塞他命(Acetamin)86(硬脂基胺乙酸酯)」;路博潤(Lubrizol)公司製造的「索努帕斯(SOLSPERSE)5000(酞菁衍生物),索努帕斯(SOLSPERSE)22000(偶氮顏料衍生物),索努帕斯(SOLSPERSE)13240(聚酯胺),索努帕斯(SOLSPERSE)3000、索努帕斯(SOLSPERSE)17000、索努帕斯(SOLSPERSE)27000(於末端部具有功能部的高分子),索努帕斯(SOLSPERSE)24000、索努帕斯(SOLSPERSE)26000、索努帕斯(SOLSPERSE)28000、索努帕斯(SOLSPERSE)32000、索努帕斯(SOLSPERSE)36000、索努帕斯(SOLSPERSE)38500(接枝型高分子),索努帕斯(SOLSPERSE)41000」;日光化學公司製造的「尼克爾(Nikkor)T106(聚氧伸乙基山梨糖醇酐單油酸酯)、MYS-IEX(聚氧伸乙基單硬脂酸酯)」等。 Specific examples of the other dispersing agent include: DISPERBYK 101 (polyamine-amine phosphate) manufactured by BYK Chemie, DISPERBYK 107 (carboxylate) Acid ester), DISPERBYK 110, DISPERBYK 180 (acid-containing copolymer), DISPERBYK 130 (polyamide), Dispa DISPERBYK 161, DISPERBYK 162, DISPERBYK 163, DISPERBYK 164, DISPERBYK 165, DISPA DISPERBYK 166, DISPERBYK 170 (polymer copolymer), "BYK-P104, BYK-P105 (high molecular weight unsaturated polycarboxylic acid)"; EFKA EFKA 4047, EFKA 4050, EFKA 4010, EFKA 4165 (polyurethane), EFKA ) 4330, Efka (EFKA) 4340 (block copolymer), Efka (EFKA) 4400, Efka (EFKA) 4402 (modified polyacrylate), Efka (EFKA) 5010 (polyester) Indoleamine, EFKA 5765 (high molecular weight polycarboxylate), Efka (EFKA) 6220 (fatty acid polyester), Efka (EFKA) 6745 (phthalocyanine derivative), Evka (EFKA) 6750 (Azo Pigment Derivative)"; Ajisper PB821 and Ajisper PB822 manufactured by Ajinomoto Fine-Techno Co., Ltd.; "Flowlen TG-710 (urethane oligomer)", "Polyflow No. 50E, Polyflow No. 300 (acrylic acid) manufactured by Chemical Company Copolymer)"; Disparlon KS-860, Disparlon, manufactured by Nanben Chemical Co., Ltd. ) 873SN, Disparlon 874, Disparlon #2150 (aliphatic polycarboxylic acid), Disparlon 7004 (polyether ester), Disparlon DA-703-50, Disparlon DA-705, Disparlon DA-725"; Demol RN, Demol N manufactured by Kao Corporation Formalin condensation condensate of naphthalene sulfonate, Demol MS, Demol C, Demol SN-B (aromatic condensate of aromatic sulfonic acid), "Fire Homogenol L-18 (polymer polycarboxylic acid), "Love Wood Emulgen 920, Emulgen 930, Emulgen 935, Emulgen 985 (polyoxyethyl phenyl ether), and Acetamin 86 ( Stearylamine acetate); "SOLSPERSE 5000 (phthalocyanine derivative) manufactured by Lubrizol, SONOSPERSE 22000 (azo pigment derivative) , SONOSPERSE 13240 (polyesteramine), SONOSPERSE 3000, SOLSPERSE 17000, SONOSPERSE 27000 (high at the end of the functional part) Molecular), SONOSPERSE 24000, SOSOLERS 26000, SOLSPERS 28000, SOLSPERS 32000, SOLSPERS 36000, Sonour SOLSPERSE 38500 (grafted polymer), SOLSPERSE 41000"; Nikkor T106 (polyoxyethylene sorbitan monooleate) manufactured by Nikko Chemical Co., Ltd. ), MYS-IEX (polyoxy-extension ethyl monostearate) and the like.

於本發明中,可較佳地使用索努帕斯(SOLSPERSE)26000、索努帕斯(SOLSPERSE)36000或索努帕斯(SOLSPERSE)41000來作為具有含磷原子的基團(例如磷酸基等)作為酸系吸附部位的高分子分散劑。 In the present invention, SOSOLERS 26000, SOLSPERS 36000 or SOLSPERSE 41000 can be preferably used as a group having a phosphorus atom (for example, a phosphate group or the like). ) A polymer dispersant as an acid-based adsorption site.

本發明的白色感光性樹脂組成物中,分散劑可單獨使用一種,或組合使用兩種以上。 In the white photosensitive resin composition of the present invention, the dispersing agent may be used alone or in combination of two or more.

就分散性的觀點而言,相對於本發明的白色感光性樹脂組成物的總固體成分的分散劑含量較佳為1質量%~40質量%的 範圍,更佳為1.3質量%~30質量%的範圍,進而佳為1.5質量%~20質量%的範圍,尤佳為2質量%~10質量%的範圍,最佳為2質量%~6質量%的範圍。 From the viewpoint of dispersibility, the dispersant content of the total solid content of the white photosensitive resin composition of the present invention is preferably from 1% by mass to 40% by mass. The range is more preferably in the range of 1.3% by mass to 30% by mass, further preferably in the range of 1.5% by mass to 20% by mass, particularly preferably in the range of 2% by mass to 10% by mass, and most preferably 2% by mass to 6% by mass. The range of %.

另外,於本發明的白色感光性樹脂組成物含有分散劑的情形時,若分散劑過多則亦可能引起剝離,故於組成物中,分散劑的質量較佳為少於二氧化鈦粒子(D)的質量,分散劑與二氧化鈦粒子(D)於組成物中的質量比更佳為分散劑/二氧化鈦粒子(D)=0.01~0.8,進而佳為分散劑/二氧化鈦粒子(D)=0.03~0.5,尤佳為分散劑/二氧化鈦粒子(D)=0.05~0.3。 Further, when the white photosensitive resin composition of the present invention contains a dispersing agent, if the dispersing agent is too large, peeling may occur, so that the mass of the dispersing agent in the composition is preferably less than that of the titanium oxide particles (D). The mass ratio of the mass, the dispersant and the titanium dioxide particles (D) in the composition is more preferably the dispersant/titanium dioxide particles (D) = 0.01 to 0.8, and further preferably the dispersant/titanium dioxide particles (D) = 0.03 to 0.5, especially Preferably, the dispersant/titanium dioxide particles (D) = 0.05 to 0.3.

進而,黏合劑聚合物(A)與分散劑的總含量(有時亦稱為聚合物含量)對解析度有大的幫助,於白色感光性樹脂組成物的總固體成分中,聚合物含量較佳為20質量%~50質量%的範圍,更佳為25質量%~50質量%的範圍,進而佳為24質量%~46質量%的範圍,尤佳為30質量%~46質量%的範圍。於該情形時,黏合劑聚合物較佳為具有酸基的黏合劑聚合物,分散劑較佳為具有酸性基及/或鹼性基的分散劑。 Further, the total content of the binder polymer (A) and the dispersant (sometimes referred to as the polymer content) greatly contributes to the resolution, and in the total solid content of the white photosensitive resin composition, the polymer content is higher. Preferably, the range is from 20% by mass to 50% by mass, more preferably from 25% by mass to 50% by mass, even more preferably from 24% by mass to 46% by mass, particularly preferably from 30% by mass to 46% by mass. . In this case, the binder polymer is preferably a binder polymer having an acid group, and the dispersant is preferably a dispersant having an acidic group and/or a basic group.

於使用本發明的白色感光性樹脂組成物來形成膜厚為2μm~6μm的白色硬化膜時,就形成具有孔徑為50μm以下的孔圖案等微細圖案的白色硬化膜的觀點(解析度的觀點)而言,於白色感光性樹脂組成物的固體成分中,聚合物含量較佳為24質量%~46質量%,更佳為24質量%~42質量%,進而佳為30質量%~39質量%。 When a white cured film having a thickness of 2 μm to 6 μm is formed by using the white photosensitive resin composition of the present invention, a white cured film having a fine pattern such as a pore pattern having a pore diameter of 50 μm or less is formed (viewing degree of viewpoint) In the solid content of the white photosensitive resin composition, the polymer content is preferably 24% by mass to 46% by mass, more preferably 24% by mass to 42% by mass, and still more preferably 30% by mass to 39% by mass. .

另外,於使用本發明的白色感光性樹脂組成物來形成膜厚為7μm~15μm的白色硬化膜時,就解析度的觀點而言,於白色感光性樹脂組成物的固體成分中,聚合物含量較佳為24質量%~50質量%,更佳為30質量%~46質量%,進而佳為35質量%~45質量%,尤佳為39質量%~45質量%。 Further, when a white cured film having a thickness of 7 μm to 15 μm is formed by using the white photosensitive resin composition of the present invention, the polymer content of the solid component of the white photosensitive resin composition is from the viewpoint of the resolution. It is preferably 24% by mass to 50% by mass, more preferably 30% by mass to 46% by mass, further preferably 35% by mass to 45% by mass, and particularly preferably 39% by mass to 45% by mass.

本發明亦是有關於一種白色感光性樹脂組成物,其含有(A)黏合劑聚合物、(B)聚合性單體、(C)聚合起始劑、(D)平均粒徑為100nm以上的二氧化鈦粒子及分散劑,並且於白色感光性樹脂組成物的固體成分中,黏合劑聚合物(A)與上述分散劑的總含量為24質量%~46質量%。 The present invention also relates to a white photosensitive resin composition comprising (A) a binder polymer, (B) a polymerizable monomer, (C) a polymerization initiator, and (D) an average particle diameter of 100 nm or more. In the solid content of the white photosensitive resin composition, the total content of the binder polymer (A) and the dispersant is 24% by mass to 46% by mass.

根據該實施方式,可形成於孔徑為50μm以下的孔圖案等微細圖案的形成方面特別優異的白色硬化膜。 According to this embodiment, it is possible to form a white cured film which is particularly excellent in formation of a fine pattern such as a hole pattern having a pore diameter of 50 μm or less.

於本發明的白色感光性樹脂組成物的該實施方式中,亦就解析度的觀點而言,黏合劑聚合物(A)與上述分散劑的總含量的較佳範圍與上述黏合劑聚合物(A)與上述分散劑的總含量相同。 In the embodiment of the white photosensitive resin composition of the present invention, the preferred range of the total content of the binder polymer (A) and the above dispersant is from the viewpoint of the resolution, and the above binder polymer ( A) is the same as the total content of the above dispersant.

[溶劑] [solvent]

本發明的白色感光性樹脂組成物較佳為含有溶劑。該溶劑可使用各種有機溶劑來構成。 The white photosensitive resin composition of the present invention preferably contains a solvent. The solvent can be constituted using various organic solvents.

此處可使用的有機溶劑有丙酮、甲基乙基酮、環己烷、乙酸乙酯、二氯乙烯、四氫呋喃、甲苯、乙二醇單甲醚、乙二醇單乙醚、乙二醇二甲醚、丙二醇單甲醚、丙二醇單乙醚、乙醯丙酮、環己酮、二丙酮醇、乙二醇單甲醚乙酸酯、乙二醇乙醚乙酸酯、 乙二醇單異丙醚、乙二醇單丁醚乙酸酯、3-甲氧基丙醇、甲氧基甲氧基乙醇、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇二甲醚、二乙二醇二乙醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、3-甲氧基丙基乙酸酯、N,N-二甲基甲醯胺、二甲基亞碸、γ-丁內酯、乳酸甲酯、乳酸乙酯等。 The organic solvents usable here are acetone, methyl ethyl ketone, cyclohexane, ethyl acetate, dichloroethylene, tetrahydrofuran, toluene, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol Ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, acetamidine acetone, cyclohexanone, diacetone alcohol, ethylene glycol monomethyl ether acetate, ethylene glycol ethyl ether acetate, Ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether acetate, 3-methoxypropanol, methoxymethoxyethanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, two Ethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxypropyl acetate, N,N-dimethylformamide , dimethyl hydrazine, γ-butyrolactone, methyl lactate, ethyl lactate, and the like.

該些有機溶劑可單獨使用或混合使用。本發明的白色感光性樹脂組成物的固體成分的濃度較佳為2質量%~60質量%。 These organic solvents may be used singly or in combination. The concentration of the solid content of the white photosensitive resin composition of the present invention is preferably from 2% by mass to 60% by mass.

本發明的白色感光性樹脂組成物進而視需要亦可含有以下將詳述的任意成分。 The white photosensitive resin composition of the present invention may further contain any of the components described in detail below as needed.

[藍色顏料或紫色顏料] [Blue pigment or purple pigment]

就提高藉由本發明的白色感光性樹脂組成物所形成的白色硬化膜的耐著色性的觀點而言,本發明的白色感光性樹脂組成物可含有藍色顏料或紫色顏料。 The white photosensitive resin composition of the present invention may contain a blue pigment or a violet pigment from the viewpoint of improving the coloring resistance of the white cured film formed by the white photosensitive resin composition of the present invention.

上述藍色顏料或紫色顏料較佳為選自以下顏料中的一種以上:顏色索引(Color Index,C.I.)顏料紫(Pigment Violet)1、C.I.顏料紫19、C.I.顏料紫23、C.I.顏料紫27、C.I.顏料紫32、C.I.顏料紫37、C.I.顏料紫42及C.I.顏料藍(Pigment Blue)1、C.I.顏料藍2、C.I.顏料藍15、C.I.顏料藍15:1、C.I.顏料藍15:2、C.I.顏料藍15:3、C.I.顏料藍15:4、C.I.顏料藍15:6、C.I.顏料藍16、C.I.顏料藍22、C.I.顏料藍60、C.I.顏料藍64、C.I.顏料藍66、C.I.顏料藍79、C.I.顏料藍80。 The above blue pigment or violet pigment is preferably one or more selected from the group consisting of Color Index (CI) Pigment Violet 1, CI Pigment Violet 19, CI Pigment Violet 23, CI Pigment Violet 27, CI Pigment Violet 32, CI Pigment Violet 37, CI Pigment Violet 42 and CI Pigment Blue 1, Pigment Blue 2, CI Pigment Blue 15, CI Pigment Blue 15:1, CI Pigment Blue 15:2, CI Pigment Blue 15:3, CI Pigment Blue 15:4, CI Pigment Blue 15:6, CI Pigment Blue 16, CI Pigment Blue 22, CI Pigment Blue 60, CI Pigment Blue 64, CI Pigment Blue 66, CI Pigment Blue 79, CI Pigment Blue 80.

-顏料的調配-(配色) - Blending of pigments - (color matching)

該些有機顏料可單獨使用或為了提高色純度而組合使用。將上述組合的具體例示於以下。 These organic pigments may be used singly or in combination for the purpose of improving color purity. Specific examples of the above combinations are shown below.

藍色顏料可單獨使用一種酞菁系顏料,或將其與二噁嗪系紫色顏料混合使用。尤佳的例子可列舉C.I.顏料藍15:6與C.I.顏料紫23的混合。 The blue pigment may be used alone as a phthalocyanine-based pigment or may be mixed with a dioxazine-based violet pigment. A preferred example is a mixture of C.I. Pigment Blue 15:6 and C.I. Pigment Violet 23.

藍色顏料與紫色顏料的質量比較佳為100:0~100:100,更佳為100:70以下。 The quality of the blue pigment and the purple pigment is preferably from 100:0 to 100:100, more preferably less than 100:70.

較佳為於進行藍色顏料或紫色顏料的分散時含有分散 劑。分散劑的種類並無特別限制,較佳為使用高分子分散劑。高分子分散劑可列舉:迪斯帕畢克(DisperBYK)-101、迪斯帕畢克(DisperBYK)-102、迪斯帕畢克(DisperBYK)-103、迪斯帕畢克(DisperBYK)-106、迪斯帕畢克(DisperBYK)-111、迪斯帕畢克(DisperBYK)-161、迪斯帕畢克(DisperBYK)-162、迪斯帕畢克(DisperBYK)-163、迪斯帕畢克(DisperBYK)-164、迪斯帕畢克(DisperBYK)-166、迪斯帕畢克(DisperBYK)-167、迪斯帕畢克(DisperBYK)-168、迪斯帕畢克(DisperBYK)-170、迪斯帕畢克(DisperBYK)-171、迪斯帕畢克(DisperBYK)-174、迪斯帕畢克(DisperBYK)-182(以上為畢克化學(BYK Chemie)公司製造),埃夫卡(EFKA)4010、埃夫卡(EFKA)4046、埃夫卡(EFKA)4080、埃夫卡(EFKA)5010、埃夫卡(EFKA)5207、埃夫卡(EFKA)5244、埃夫卡(EFKA)6745、埃夫卡(EFKA)6750、埃夫卡(EFKA)7414、埃夫卡(EFKA)7462、埃夫卡(EFKA) 7500、埃夫卡(EFKA)7570、埃夫卡(EFKA)7575、埃夫卡(EFKA)7580(以上為埃夫卡助劑(EFKA Additives)公司製造),迪斯帕艾德(Disperse Aid)6、迪斯帕艾德(Disperse Aid)8、迪斯帕艾德(Disperse Aid)15、迪斯帕艾德(Disperse Aid)9100(聖諾普科(Sannopco)製造)等高分子分散劑;索努帕斯(SOLSPERSE)3000、索努帕斯(SOLSPERSE)5000、索努帕斯(SOLSPERSE)9000、索努帕斯(SOLSPERSE)12000、索努帕斯(SOLSPERSE)13240、索努帕斯(SOLSPERSE)13940、索努帕斯(SOLSPERSE)17000、索努帕斯(SOLSPERSE)24000、索努帕斯(SOLSPERSE)26000、索努帕斯(SOLSPERSE)28000、索努帕斯(SOLSPERSE)32000、索努帕斯(SOLSPERSE)36000、索努帕斯(SOLSPERSE)39000、索努帕斯(SOLSPERSE)41000、索努帕斯(SOLSPERSE)71000等各種索努帕斯(SOLSPERSE)分散劑(捷利康(Zeneca)公司製造);艾迪科普羅尼克(Adeka Pluronic)L31、艾迪科普羅尼克(Adeka Pluronic)F38、艾迪科普羅尼克(Adeka Pluronic)L42、艾迪科普羅尼克(Adeka Pluronic)L44、艾迪科普羅尼克(Adeka Pluronic)L61、艾迪科普羅尼克(Adeka Pluronic)L64、艾迪科普羅尼克(Adeka Pluronic)F68、艾迪科普羅尼克(Adeka Pluronic)L72、艾迪科普羅尼克(Adeka Pluronic)P95、艾迪科普羅尼克(Adeka Pluronic)F77、艾迪科普羅尼克(Adeka Pluronic)P84、艾迪科普羅尼克(Adeka Pluronic)F87、艾迪科普羅尼克(Adeka Pluronic)P94、艾迪科普羅尼克(Adeka Pluronic)L101、 艾迪科普羅尼克(Adeka Pluronic)P103、艾迪科普羅尼克(Adeka Pluronic)F108、艾迪科普羅尼克(Adeka Pluronic)L121、艾迪科普羅尼克(Adeka Pluronic)P-123(旭電化(股)製造)及伊索奈特(Isonet)S-20(三洋化成(股)製造)、楠本化成公司製造的「蒂斯帕隆(Disparlon)KS-860、蒂斯帕隆(Disparlon)873SN、蒂斯帕隆(Disparlon)874(高分子分散劑),蒂斯帕隆(Disparlon)#2150(脂肪族多元羧酸),蒂斯帕隆(Disparlon)#7004(聚醚酯型)」。 Preferably, it is dispersed when the blue pigment or the purple pigment is dispersed. Agent. The type of the dispersant is not particularly limited, and a polymer dispersant is preferably used. Examples of polymer dispersants include: DisperBYK-101, DisperBYK-102, DisperBYK-103, DisperBYK-106 , DisperBYK-111, DisperBYK-161, DisperBYK-162, DisperBYK-163, Despabike (DisperBYK)-164, DisperBYK-166, DisperBYK-167, DisperBYK-168, DisperBYK-170, DisperBYK-171, DisperBYK-174, DisperBYK-182 (above BYK Chemie), Evka ( EFKA) 4010, EFKA 4046, EFKA 4080, EFKA 5010, EFKA 5207, EFKA 5244, EFKA 6745, EFKA 6750, EFKA 7414, EFKA 7462, Efka (EFKA) 7500, EFKA 7570, EFKA 7575, EFKA 7580 (above EFKA Additives), Disperse Aid 6, Disperse Aid 8, Disperse Aid 15, Disperse Aid 9100 (manufactured by Sannopco) and other polymer dispersants; SOSOLSERSE 3000, SOLSPERSE 5000, SOLSPERSE 9000, SOLSPERSE 12000, SOSOLERSE 13240, Sonupas (Sonopas) SOLSPERSE) 13940, SONOSPERSE 17000, SOLSPERS 24000, SOLSPERS 26000, SOSOLERS 28000, SOSOLERS 32000, cable SOSOLERS 36000, SOLSPERSE 39000, SOLSPERSE 41000, SOLSPERSE 71000, etc. SOSOLERS Separators (Zeneca) )Manufactured by the company; Adeka Pluronic L31, Adeka Pluronic F38, Adeka Pluronic L42, Adi Copronik (A) Deka Pluronic) L44, Adeka Pluronic L61, Adeka Pluronic L64, Adeka Pluronic F68, Adeka Pluronic L72, Ai Adeka Pluronic P95, Adeka Pluronic F77, Adeka Pluronic P84, Adeka Pluronic F87, Adeka Pronik Pluronic) P94, Adeka Pluronic L101, Adeka Pluronic P103, Adeka Pluronic F108, Adeka Pluronic L121, Adeka Pluronic P-123 ))) Isonet S-20 (manufactured by Sanyo Chemical Co., Ltd.), "Disparlon" KS-860, Disparlon 873SN, and pedicle Disparlon 874 (polymer dispersant), Disparlon #2150 (aliphatic polycarboxylic acid), Disparlon #7004 (polyether ester type).

另外,亦可一併使用酞菁衍生物(商品名:埃夫卡(EFKA)-745(埃夫卡(EFKA)公司製造)),索努帕斯(SOLSPERSE)5000、索努帕斯(SOLSPERSE)12000、索努帕斯(SOLSPERSE)22000(捷利康(Zeneca)(股)製造)等顏料衍生物。 In addition, phthalocyanine derivatives (trade name: EFKA-745 (made by EFKA)), SOLSPERS 5000, SONOSPERSE can also be used together. 12000, Solinos (SOLSPERSE) 22000 (made by Zeneca (manufactured by Zeneca)) and other pigment derivatives.

[矽烷偶合劑] [decane coupling agent]

就進一步提高與基板的密接性的觀點而言,本發明的白色感光性樹脂組成物中可使用矽烷偶合劑。 A decane coupling agent can be used for the white photosensitive resin composition of the present invention from the viewpoint of further improving the adhesion to the substrate.

矽烷偶合劑較佳為具有烷氧基矽烷基作為可與無機材料形成化學鍵的水解性基。另外,較佳為具有與有機樹脂之間相互作用或形成鍵而顯示出親和性的基團,關於此種基團,較佳為具有(甲基)丙烯醯基、苯基、巰基、縮水甘油基、氧雜環丁基,其中,較佳為具有(甲基)丙烯醯基或縮水甘油基。 The decane coupling agent preferably has an alkoxyalkyl group as a hydrolyzable group capable of forming a chemical bond with an inorganic material. Further, it is preferred to have a group which exhibits an affinity with an organic resin or a bond, and it is preferred to have a (meth)acryl fluorenyl group, a phenyl group, a fluorenyl group, or a glycidol. The oxetanyl group is preferably a (meth) acrylonitrile group or a glycidyl group.

即,本發明中所用的矽烷偶合劑較佳為具有烷氧基矽烷基與(甲基)丙烯醯基或環氧基的化合物,具體可列舉:具有下述結構的 (甲基)丙烯醯基-三甲氧基矽烷化合物、縮水甘油基-三甲氧基矽烷化合物等。 That is, the decane coupling agent used in the present invention is preferably a compound having an alkoxyalkyl group, a (meth) acryl fluorenyl group or an epoxy group, and specifically, a structure having the following structure A (meth) acrylonitrile-trimethoxydecane compound, a glycidyl-trimethoxydecane compound, or the like.

另外,本發明的矽烷偶合劑較佳為一分子中具有至少2種反應性不同的官能基的矽烷化合物,尤佳為具有胺基與烷氧基作為官能基。此種矽烷偶合劑例如有N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷(N-β-胺基乙基-γ-胺基丙基-甲基二甲氧基矽烷)(信越化學工業公司製造的商品名:KBM-602)、N-β-胺基乙基-γ-胺基丙基-三甲氧基矽烷(信越化學工業公司製造的商品名:KBM-603,信越化學工業公司製造)、N-β-胺基乙基-γ-胺基丙基-三乙氧基矽烷(信越化學工業公司製造的商品名:KBE-602)、γ-胺基丙基-三甲氧基矽烷(信越化學工業公司製造,商品名:KBM-903)、γ-胺基丙基-三乙氧基矽烷(信越化學工業公司製造,商品名:KBE-903)等。 Further, the decane coupling agent of the present invention is preferably a decane compound having at least two functional groups having different reactivity in one molecule, and particularly preferably having an amine group and an alkoxy group as a functional group. Such a decane coupling agent is, for example, N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane (N-β-aminoethyl-γ-aminopropyl-methyl Dimethoxydecane) (trade name: KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.), N-β-aminoethyl-γ-aminopropyl-trimethoxydecane (trade name manufactured by Shin-Etsu Chemical Co., Ltd.) : KBM-603, manufactured by Shin-Etsu Chemical Co., Ltd.), N-β-aminoethyl-γ-aminopropyl-triethoxydecane (trade name: KBE-602, manufactured by Shin-Etsu Chemical Co., Ltd.), γ- Aminopropyl-trimethoxydecane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-903), γ-aminopropyl-triethoxydecane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBE-903) Wait.

關於使用矽烷偶合劑的情形的添加量,於白色感光性樹脂組成物的總固體成分中,較佳為0.01質量%~5.0質量%的範圍,更佳為0.05質量%~3.0質量%。 The amount of addition of the decane coupling agent is preferably from 0.01% by mass to 5.0% by mass, and more preferably from 0.05% by mass to 3.0% by mass, based on the total solid content of the white photosensitive resin composition.

[防著色劑(E)] [Anti-Colorant (E)]

本發明的白色感光性樹脂組成物含有防著色劑(E)。 The white photosensitive resin composition of the present invention contains a coloring preventive agent (E).

本發明的防著色劑較佳為酚化合物、及作為抗氧化劑而為人所知的亞磷酸酯化合物或硫醚化合物,更佳為分子量為500以上的酚化合物、及分子量為500以上的亞磷酸酯化合物或硫醚化合物。該些化合物亦可混合使用兩種以上。酚化合物可使用作為酚系抗氧化劑而為人所知的任意的酚化合物。較佳的酚化合物可列舉受阻酚化合物。尤佳為於鄰接於酚性羥基的部位(鄰位)上具有取代基,該情形的取代基較佳為碳數1~22的經取代或未經取代的烷基,更佳為甲基、乙基、丙醯基、異丙醯基、丁基、異丁基、第三丁基、戊基、異戊基、第三戊基、己基、辛基、異辛基、2-乙基己基。另外,亦可列舉於同一分子內具有酚基與亞磷酸酯基的穩定劑作為較佳的原材料。 The coloring inhibitor of the present invention is preferably a phenol compound and a phosphite compound or a sulfide compound known as an antioxidant, more preferably a phenol compound having a molecular weight of 500 or more, and a phosphorous acid having a molecular weight of 500 or more. An ester compound or a thioether compound. These compounds may be used in combination of two or more kinds. As the phenol compound, any phenol compound known as a phenolic antioxidant can be used. A preferred phenol compound is a hindered phenol compound. More preferably, it has a substituent at a site adjacent to the phenolic hydroxyl group (ortho), and the substituent in this case is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms, more preferably a methyl group. Ethyl, propyl sulfonyl, isopropenyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, tert-pentyl, hexyl, octyl, isooctyl, 2-ethylhexyl . Further, a stabilizer having a phenol group and a phosphite group in the same molecule may be mentioned as a preferred raw material.

該些化合物可作為市售品而容易地獲取,由下述廠商(maker)所銷售。可自旭電化工業股份有限公司作為艾迪科斯塔波(Adekastab)AO-50、艾迪科斯塔波(Adekastab)AO-60、艾迪科斯塔波(Adekastab)AO-20、艾迪科斯塔波(Adekastab)AO-70、艾迪科斯塔波(Adekastab)AO-80而獲取。 These compounds are easily available as commercially available products and are sold by the following manufacturers. Asahi Electric Industrial Co., Ltd. as Adekastab AO-50, Adekastab AO-60, Adekastab AO-20, Eddie Costap (Adekastab) AO-70, acquired by Adekastab AO-80.

白色感光性樹脂組成物中的防著色劑的含量以固體成分換算計,較佳為0.01質量%以上、20質量%以下,更佳為0.5質量%以上、15質量%以下。 The content of the coloring inhibitor in the white photosensitive resin composition is preferably 0.01% by mass or more and 20% by mass or less, and more preferably 0.5% by mass or more and 15% by mass or less, in terms of solid content.

[增感劑] [sensitizer]

為了提高(C)聚合起始劑的自由基產生效率,實現感光波長的長波長化,本發明的白色感光性樹脂組成物亦可含有增感劑。 In order to increase the radical generating efficiency of the (C) polymerization initiator and to achieve a long wavelength of the photosensitive wavelength, the white photosensitive resin composition of the present invention may contain a sensitizer.

本發明中可使用的增感劑較佳為利用電子移動機制或能量移動機制使上述(C)聚合起始劑增感。 The sensitizer which can be used in the present invention preferably sensitizes the above (C) polymerization initiator by an electron transfer mechanism or an energy shift mechanism.

增感劑可列舉:屬於以下所列舉的化合物類中、且於300nm~450nm的波長範圍內具有吸收波長者。 Examples of the sensitizer include those belonging to the following compounds and having an absorption wavelength in a wavelength range of 300 nm to 450 nm.

增感劑具體可參考日本專利特開2010-106268號公報的段落0231~段落0253(對應的美國專利申請公開第2011/0124824號說明書的[0256]~[0273])的說明,將該些內容併入至本申請說明書中。 The sensitizer is specifically described in the description of paragraphs 0231 to 0253 of the Japanese Patent Application Laid-Open No. 2010-106268 (the corresponding US Patent Application Publication No. 2011/0124824 [0256] to [0273]). Incorporated into the specification of the present application.

就對深部的光吸收效率及起始劑的分解效率的觀點而言,白色感光性樹脂組成物中的增感劑的含量以固體成分換算計,較佳為0.1質量%以上、20質量%以下,更佳為0.5質量%以上、15質量%以下。 The content of the sensitizer in the white photosensitive resin composition is preferably 0.1% by mass or more and 20% by mass or less in terms of solid content, from the viewpoint of the light absorption efficiency in the deep portion and the decomposition efficiency of the initiator. More preferably, it is 0.5 mass% or more and 15 mass% or less.

增感劑可單獨使用一種,亦可併用兩種以上。 The sensitizer may be used alone or in combination of two or more.

[共增感劑] [common sensitizer]

本發明的白色感光性樹脂組成物較佳為更含有共增感劑。 The white photosensitive resin composition of the present invention preferably further contains a co-sensitizer.

本發明的共增感劑具有以下作用:使(C)聚合起始劑或增感劑對活性放射線的感度進一步提高,或抑制氧對(B)聚合性單體的聚合的妨礙。 The co-sensitizer of the present invention has an effect of further improving the sensitivity of the (C) polymerization initiator or the sensitizer to actinic radiation or suppressing the inhibition of oxygen on the polymerization of the (B) polymerizable monomer.

共增感劑具體可參考日本專利特開2010-106268號公報的段落0254~段落0257(對應的美國專利申請公開第2011/0124824號說明書的[0277]~[0279])的說明,將該些內容併入至本申請說明書中。 For the specific sensitizer, the descriptions of paragraphs 0254 to 0257 of the Japanese Patent Application Laid-Open No. 2010-106268 (the corresponding US Patent Application Publication No. 2011/0124824 [0277] to [0279]), The content is incorporated into the specification of the present application.

就藉由聚合成長速度與鏈移動的平衡來提高硬化速度的觀點而言,相對於白色感光性樹脂組成物的所有固體成分的質量,該些共增感劑的含量較佳為0.1質量%以上、30質量%以下的範圍,更佳為1質量%以上、25質量%以下的範圍,進而佳為1.5質量%以上、20質量%以下的範圍。 The content of the co-sensitizer is preferably 0.1% by mass or more based on the mass of all the solid components of the white photosensitive resin composition, from the viewpoint of improving the curing rate by the balance between the polymerization growth rate and the chain movement. In the range of 30% by mass or less, more preferably 1% by mass or more and 25% by mass or less, and further preferably 1.5% by mass or more and 20% by mass or less.

[聚合抑制劑] [Polymerization inhibitor]

於本發明中,為了於白色感光性樹脂組成物的製造中或保存中阻止具有可聚合的乙烯性不飽和雙鍵的化合物的不需要的聚合,較佳為添加聚合抑制劑。 In the present invention, in order to prevent unnecessary polymerization of a compound having a polymerizable ethylenically unsaturated double bond during the production or storage of the white photosensitive resin composition, it is preferred to add a polymerization inhibitor.

本發明中可使用的聚合抑制劑可列舉:含酚系羥基的化合物、N-氧化物化合物類、哌啶1-氧自由基化合物類、吡咯啶1-氧自由基化合物類、N-亞硝基苯基羥基胺類、重氮鎓化合物類及陽離子染料類、含硫基的化合物類、含硝基的化合物類,FeCl3、CuCl2等過渡金屬化合物類。 Examples of the polymerization inhibitor which can be used in the present invention include a phenolic hydroxyl group-containing compound, an N-oxide compound, a piperidine 1-oxyl radical compound, a pyrrolidine 1-oxy radical compound, and an N-nitrous acid. Base phenylhydroxylamines, diazonium compounds and cationic dyes, sulfur group-containing compounds, nitro group-containing compounds, transition metal compounds such as FeCl 3 and CuCl 2 .

更佳的形態如下。 A better form is as follows.

含酚系羥基的化合物較佳為選自由對苯二酚、對甲氧基苯酚、二-第三丁基對甲酚、聯苯三酚(pyrogallol)、第三丁基鄰苯二酚、苯醌、4,4-硫代雙(3-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、2,6-二-第三丁基-4-甲基苯酚(BHT)、苯酚樹脂類及甲酚樹脂類所組成的組群中的化合物。 The phenolic hydroxyl group-containing compound is preferably selected from the group consisting of hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butyl catechol, and benzene.醌, 4,4-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2, A compound in a group consisting of 6-di-t-butyl-4-methylphenol (BHT), a phenol resin, and a cresol resin.

N-氧化物化合物類較佳為選自由5,5-二甲基-1-吡咯啉N-氧化物、4-甲基嗎啉N-氧化物、吡啶N-氧化物、4-硝基吡啶N-氧化物、 3-羥基吡啶N-氧化物、吡啶甲酸N-氧化物、煙鹼酸N-氧化物及異煙鹼酸N-氧化物所組成的組群中的化合物。 The N-oxide compound is preferably selected from the group consisting of 5,5-dimethyl-1-pyrroline N-oxide, 4-methylmorpholine N-oxide, pyridine N-oxide, 4-nitropyridine N-oxide, A compound of the group consisting of 3-hydroxypyridine N-oxide, picolinic acid N-oxide, nicotinic acid N-oxide, and isonicotinic acid N-oxide.

哌啶1-氧自由基化合物類為選自由哌啶1-氧自由基、2,2,6,6-四甲基哌啶1-氧自由基、4-氧代-2,2,6,6-四甲基哌啶1-氧自由基、4-羥基-2,2,6,6-四甲基哌啶1-氧自由基、4-乙醯胺-2,2,6,6-四甲基哌啶1-氧自由基、4-馬來醯亞胺-2,2,6,6-四甲基哌啶1-氧自由基及4-膦醯氧基-2,2,6,6-四甲基哌啶1-氧自由基所組成的組群中的化合物。 The piperidine 1-oxyl radical compound is selected from the group consisting of piperidine 1-oxyl radical, 2,2,6,6-tetramethylpiperidine 1-oxyl radical, 4-oxo-2,2,6, 6-Tetramethylpiperidine 1-oxyl radical, 4-hydroxy-2,2,6,6-tetramethylpiperidine 1-oxyl radical, 4-acetamide-2,2,6,6- Tetramethylpiperidine 1-oxyl radical, 4-maleimide-2,2,6,6-tetramethylpiperidine 1-oxyl radical and 4-phosphoniumoxy-2,2,6 a compound of the group consisting of 6-tetramethylpiperidine 1-oxyl radical.

吡咯啶1-氧自由基化合物類較佳為3-羧基丙氧基自由基(3-羧基-2,2,5,5-四甲基吡咯啶1-氧自由基)。 The pyrrolidine 1-oxyl radical compound is preferably a 3-carboxypropoxy radical (3-carboxy-2,2,5,5-tetramethylpyrrolidine 1-oxyl radical).

N-亞硝基苯基羥基胺類較佳為選自由N-亞硝基苯基羥基胺亞鈰鹽及N-亞硝基苯基羥基胺鋁鹽所組成的化合物組群中的化合物。 The N-nitrosophenylhydroxylamine is preferably a compound selected from the group consisting of N-nitrosophenylhydroxylamine sulfonium salts and N-nitrosophenylhydroxylamine aluminum salts.

重氮鎓化合物類較佳為選自由4-重氮苯基二甲基胺的硫酸氫鹽、4-重氮二苯基胺的四氟硼酸鹽及3-甲氧基-4-重氮二苯基胺的六氟磷酸鹽所組成的組群中的化合物。 The diazonium compound is preferably selected from the group consisting of hydrogen sulfate from 4-diazophenyldimethylamine, tetrafluoroborate from 4-diazodiphenylamine, and 3-methoxy-4-diazo two. A compound of the group consisting of phenylamine hexafluorophosphate.

以下例示本發明中可使用的較佳聚合抑制劑,但本發明不限制於該些化合物。再者,酚系聚合抑制劑可列舉下述例示化合物(P-1)~例示化合物(P-24)。 Preferred polymerization inhibitors which can be used in the present invention are exemplified below, but the present invention is not limited to these compounds. In addition, examples of the phenolic polymerization inhibitor include the following exemplified compounds (P-1) to exemplified compounds (P-24).

[化45] [化45]

[化47] [化47]

胺系聚合抑制劑可列舉下述例示化合物(N-1)~例示化合物(N-7)。 The amine-based polymerization inhibitors include the following exemplified compounds (N-1) to exemplified compounds (N-7).

[化49] [化49]

硫系聚合抑制劑可列舉下述例示化合物(S-1)~例示化合物(S-5)。 Examples of the sulfur-based polymerization inhibitor include the following exemplified compounds (S-1) to exemplified compounds (S-5).

[化50](S-1) (C18H37OCOCH2CH2)2S (S-2) (C12H25OCOCH2CH2)2S (S-3) (C13H27OCOCH2CH2)2S (S-4) (C14H29OCOCH2CH2)2S (S-5) (CH2OCOCH2CH2SC12H25)4C (S-1) (C 18 H 37 OCOCH 2 CH 2 ) 2 S (S-2) (C 12 H 25 OCOCH 2 CH 2 ) 2 S (S-3) (C 13 H 27 OCOCH 2 CH 2 ) 2 S (S-4) (C 14 H 29 OCOCH 2 CH 2 ) 2 S (S-5) (CH 2 OCOCH 2 CH 2 SC 12 H 25 ) 4 C

亞磷酸酯系聚合抑制劑可列舉下述例示化合物(R-1)~例示化合物(R-5)。 The phosphite-based polymerization inhibitors include the following exemplified compounds (R-1) to exemplified compounds (R-5).

[化51] [化51]

進而,以下所示的各化合物亦另外可用作較佳的聚合抑制劑。 Further, each of the compounds shown below can also be used as a preferred polymerization inhibitor.

上述例示化合物中,較佳為對苯二酚、對甲氧基苯酚、 二-第三丁基對甲酚、聯苯三酚、第三丁基鄰苯二酚、苯醌、4,4-硫代雙(3-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)般的含酚系羥基的化合物,哌啶1-氧自由基化合物類或2,2,6,6-四甲基哌啶1-氧自由基、4-氧代-2,2,6,6-四甲基哌啶1-氧自由基、4-羥基-2,2,6,6-四甲基哌啶1-氧自由基、4-乙醯胺-2,2,6,6-四甲基哌啶1-氧自由基、4-馬來醯亞胺-2,2,6,6-四甲基哌啶1-氧自由基及4-膦醯氧基-2,2,6,6-四甲基哌啶1-氧自由基般的哌啶1-氧 自由基化合物,或N-亞硝基苯基羥基胺亞鈰鹽及N-亞硝基苯基羥基胺鋁鹽的N-亞硝基苯基羥基胺化合物,更佳為2,2,6,6-四甲基哌啶1-氧自由基、4-氧代-2,2,6,6-四甲基哌啶1-氧自由基、4-羥基-2,2,6,6-四甲基哌啶1-氧自由基、4-乙醯胺-2,2,6,6-四甲基哌啶1-氧自由基、4-馬來醯亞胺-2,2,6,6-四甲基哌啶1-氧自由基及4-膦醯氧基-2,2,6,6-四甲基哌啶1-氧自由基般的哌啶1-氧自由基化合物,或N-亞硝基苯基羥基胺亞鈰鹽及N-亞硝基苯基羥基胺鋁鹽般的N-亞硝基苯基羥基胺化合物,進而佳為N-亞硝基苯基羥基胺亞鈰鹽及N-亞硝基苯基羥基胺鋁鹽般的N-亞硝基苯基羥基胺化合物。 Among the above exemplified compounds, hydroquinone or p-methoxyphenol is preferred. Di-t-butyl-p-cresol, biphenyltriol, tert-butyl catechol, benzoquinone, 4,4-thiobis(3-methyl-6-tert-butylphenol), 2 , 2'-methylenebis(4-methyl-6-tert-butylphenol)-like phenolic hydroxyl-containing compound, piperidine 1-oxyl radical compound or 2,2,6,6-tetra Methylpiperidine 1-oxyl radical, 4-oxo-2,2,6,6-tetramethylpiperidine 1-oxyl radical, 4-hydroxy-2,2,6,6-tetramethylper Pyridine 1-oxyl radical, 4-acetamide-2,2,6,6-tetramethylpiperidine 1-oxyl radical, 4-maleimide-2,2,6,6-tetramethyl 5-piperidine 1-oxyl radical and 4-phosphoniumoxy-2,2,6,6-tetramethylpiperidine 1-oxyl free radical piperidine 1-oxygen a radical compound, or an N-nitrosophenylhydroxylamine compound of an N-nitrosophenylhydroxylamine sulfonium salt and an N-nitrosophenylhydroxylamine aluminum salt, more preferably 2, 2, 6, 6-tetramethylpiperidine 1-oxyl radical, 4-oxo-2,2,6,6-tetramethylpiperidine 1-oxyl radical, 4-hydroxy-2,2,6,6-tetra Methylpiperidine 1-oxyl radical, 4-acetamide-2,2,6,6-tetramethylpiperidine 1-oxyl radical, 4-maleimide-2,2,6,6 - tetramethylpiperidine 1-oxyl radical and 4-phosphoniumoxy-2,2,6,6-tetramethylpiperidine 1-oxyl free radical piperidine 1-oxyl radical compound, or N N-nitrosophenylhydroxylamine compound like nitrosophenylhydroxylamine sulfonium salt and N-nitrosophenylhydroxylamine aluminum salt, and further preferably N-nitrosophenylhydroxylamine Salt and N-nitrosophenylhydroxylamine compound like N-nitrosophenylhydroxylamine aluminum salt.

相對於(C)聚合起始劑100質量份,聚合抑制劑的較 佳添加量較佳為0.01質量份以上、10質量份以下,進而佳為0.01質量份以上、8質量份以下,最佳為0.01質量份以上、5質量份以下的範圍。 Compared with 100 parts by mass of the (C) polymerization initiator, the polymerization inhibitor is more The amount of addition is preferably 0.01 parts by mass or more and 10 parts by mass or less, more preferably 0.01 parts by mass or more and 8 parts by mass or less, and most preferably 0.01 parts by mass or more and 5 parts by mass or less.

藉由設定為上述範圍,可充分抑制非圖像部的硬化反應且促進圖像部的硬化反應,圖像形成性及感度變良好。 By setting it as the above range, the hardening reaction of the non-image portion can be sufficiently suppressed, and the curing reaction of the image portion can be promoted, and the image formability and sensitivity can be improved.

[界面活性劑] [Surfactant]

就進一步提高塗佈性的觀點而言,本發明的白色感光性樹脂組成物亦可添加各種界面活性劑。界面活性劑可使用氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑、矽酮系界面活性劑等各種界面活性劑。 From the viewpoint of further improving the coating property, various white surfactants may be added to the white photosensitive resin composition of the present invention. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and an anthrone-based surfactant can be used.

尤其藉由本發明的白色感光性樹脂組成物含有氟系界 面活性劑,製備成塗佈液時的溶液特性(特別是流動性)進一步提高,故可進一步改善塗佈厚度的均勻性或省液性。 In particular, the white photosensitive resin composition of the present invention contains a fluorine-based boundary The surface active agent has a further improved solution property (particularly fluidity) when it is prepared as a coating liquid, so that the uniformity of the coating thickness or the liquid-saving property can be further improved.

即,於使用應用了含有氟系界面活性劑的白色感光性樹脂組成物的塗佈液來進行膜形成的情形時,藉由降低被塗佈面與塗佈液的界面張力,對被塗佈面的濡濕性得到改善,對被塗佈面的塗佈性提高。因此,即便以少量的液量來形成幾微米(μm)左右的薄膜的情形時,亦可更佳地進行厚度不均一小的均勻厚度的膜形成,從而於該些方面而言有效。 In other words, when the film formation is carried out using a coating liquid to which a white photosensitive resin composition containing a fluorine-based surfactant is applied, the interfacial tension between the surface to be coated and the coating liquid is lowered to coat the coating layer. The wettability of the surface is improved, and the coatability to the coated surface is improved. Therefore, even when a film having a thickness of about several micrometers (μm) is formed with a small amount of liquid, a film having a uniform thickness having a small thickness unevenness can be more preferably formed, which is effective in these aspects.

氟系界面活性劑中的氟含有率較佳為3質量%~40質量%,更佳為5質量%~30質量%,尤佳為7質量%~25質量%。氟含有率在該範圍內的氟系界面活性劑於塗佈膜的厚度的均勻性或省液性的方面有效,於白色感光性樹脂組成物中的溶解性亦良好。 The fluorine content in the fluorine-based surfactant is preferably from 3% by mass to 40% by mass, more preferably from 5% by mass to 30% by mass, even more preferably from 7% by mass to 25% by mass. The fluorine-based surfactant having a fluorine content in this range is effective in the uniformity of the thickness of the coating film or the liquid-saving property, and the solubility in the white photosensitive resin composition is also good.

氟系界面活性劑例如可列舉:美佳法(Megafac)F171、美佳法(Megafac)F172、美佳法(Megafac)F173、美佳法(Megafac)F176、美佳法(Megafac)F177、美佳法(Megafac)F141、美佳法(Megafac)F142、美佳法(Megafac)F143、美佳法(Megafac)F144、美佳法(Megafac)R30、美佳法(Megafac)F437、美佳法(Megafac)F475、美佳法(Megafac)F479、美佳法(Megafac)F482、美佳法(Megafac)F554、美佳法(Megafac)F780、美佳法(Megafac)F781(以上為迪愛生(DIC)(股)製造),弗拉德(Fluorad)FC430、弗拉德(Fluorad)FC431、弗拉德(Fluorad)FC171(以上為住友3M(股)製造),沙福隆(Surflon)S-382、 沙福隆(Surflon)SC-101、沙福隆(Surflon)SC-103、沙福隆(Surflon)SC-104、沙福隆(Surflon)SC-105、沙福隆(Surflon)SC1068、沙福隆(Surflon)SC-381、沙福隆(Surflon)SC-383、沙福隆(Surflon)S393、沙福隆(Surflon)KH-40(以上為旭硝子(股)製造),PF636、PF656、PF6320、PF6520、PF7002(歐諾法(OMNOVA)公司製造)等。 Examples of the fluorine-based surfactant include Megafac F171, Megafac F172, Megafac F173, Megafac F176, Megafac F177, and Megafac F141. , Megafac F142, Megafac F143, Megafac F144, Megafac R30, Megafac F437, Megafac F475, Megafac F479, Megafac F482, Megafac F554, Megafac F780, Megafac F781 (above produced by Di Aisheng (DIC)), Fluorad FC430, Fu Fluorad FC431, Fluorad FC171 (above Sumitomo 3M (share)), Shaflon (Surflon) S-382, Surflon SC-101, Surflon SC-103, Surflon SC-104, Surflon SC-105, Surflon SC1068, Shafu Surflon SC-381, Surflon SC-383, Surflon S393, Surflon KH-40 (above manufactured by Asahi Glass), PF636, PF656, PF6320 PF6520, PF7002 (manufactured by OMNOVA).

非離子系界面活性劑具體可列舉:甘油、三羥甲基丙烷、三羥甲基乙烷以及該等的乙氧基化物及丙氧基化物(例如甘油丙氧基化物、甘油乙氧基化物等)、聚氧伸乙基月桂基醚、聚氧伸乙基硬脂基醚、聚氧伸乙基油基醚、聚氧伸乙基辛基苯基醚、聚氧伸乙基壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、山梨糖醇酐脂肪酸酯(巴斯夫(BASF)公司製造的普羅尼克(Pluronic)L10、普羅尼克(Pluronic)L31、普羅尼克(Pluronic)L61、普羅尼克(Pluronic)L62、普羅尼克(Pluronic)10R5、普羅尼克(Pluronic)17R2、普羅尼克(Pluronic)25R2、特羅尼克(Tetronic)304、特羅尼克(Tetronic)701、特羅尼克(Tetronic)704、特羅尼克(Tetronic)901、特羅尼克(Tetronic)904、特羅尼克(Tetronic)150R1,派奧寧(Pionin)D-6512、派奧寧(Pionin)D-6414、派奧寧(Pionin)D-6112、派奧寧(Pionin)D-6115、派奧寧(Pionin)D-6120、派奧寧(Pionin)D-6131、派奧寧(Pionin)D-6108-W、派奧寧(Pionin)D-6112-W、派奧寧(Pionin)D-6115-W、派奧寧(Pionin)D-6115-X、派奧寧(Pionin)D-6120-X(竹本油 脂(股)製造),索努帕斯(SOLSPERSE)20000(日本路博潤(Lubrizol)(股)製造))等。 Specific examples of the nonionic surfactant include glycerin, trimethylolpropane, trimethylolethane, and the like ethoxylates and propoxylates (for example, glycerol propoxylate, glycerol ethoxylate). Etc.), polyoxyethylene ethyl lauryl ether, polyoxyethylene ethyl stearyl ether, polyoxyethylene ethyl oleyl ether, polyoxyethyl octyl phenyl ether, polyoxyethyl phenyl benzene Base ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester (Pluronic L10, manufactured by BASF), Pluronic L31 , Pluronic L61, Pluronic L62, Pluronic 10R5, Pluronic 17R2, Pluronic 25R2, Tetronic 304, Tetronic 701, Tetronic 704, Tetronic 901, Tetronic 904, Tetronic 150R1, Pionin D-6512, Pionin D-6414, Pionin D-6112, Pionin D-6115, Pionin D-6120, Pionin D-6131, pie Pionin D-6108-W, Pionin D-6112-W, Pionin D-6115-W, Pionin D-6115-X, Pionin ( Pionin) D-6120-X (bamboo oil) (manufacturing of fat (stock)), SONOSPERSE 20000 (made by Lubrizol Co., Ltd.) and so on.

陽離子系界面活性劑具體可列舉:酞菁衍生物(商品名:埃夫卡(EFKA)-745,森下產業(股)製造),有機矽氧烷聚合物KP341(信越化學工業(股)製造),(甲基)丙烯酸系(共)聚合物波里弗洛(Polyflow)No.75、波里弗洛(Polyflow)No.90、波里弗洛(Polyflow)No.95(共榮社化學(股)製造),W001(裕商(股)製造)等。 Specific examples of the cationic surfactant include a phthalocyanine derivative (trade name: Efka (EFKA)-745, manufactured by Morishita Industries Co., Ltd.), and an organic siloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.). , (meth)acrylic (co)polymer Polyflow No. 75, Polyflow No. 90, Polyflow No. 95 (Kyoeisha Chemicals ( () manufacturing), W001 (Yu Shang (share) manufacturing) and so on.

陰離子系界面活性劑具體可列舉:W004、W005、W017(裕商(股)公司製造)等。 Specific examples of the anionic surfactant include W004, W005, and W017 (manufactured by Yusei Co., Ltd.).

矽酮系界面活性劑例如可列舉:東麗.道康寧(Dow Corning Toray)(股)製造的「東麗矽酮(Toray Silicone)DC3PA」、「東麗矽酮(Toray Silicone)SH7PA」、「東麗矽酮(Toray Silicone)DC11PA」,「東麗矽酮(Toray Silicone)SH21PA」,「東麗矽酮(Toray Silicone)SH28PA」、「東麗矽酮(Toray Silicone)SH29PA」、「東麗矽酮(Toray Silicone)SH30PA」、「東麗矽酮(Toray Silicone)SH8400」,邁圖高新材料(Momentive Performance Materials)公司製造的「TSF-4440」、「TSF-4300」、「TSF-4445」、「TSF-4460」、「TSF-4452」,信越矽利光(Shinetsu silicone)股份有限公司製造的「KP341」、「KF6001」、「KF6002」,畢克化學(BYK Chemie)公司製造的「BYK307」、「BYK323」、「BYK330」等。 Examples of the anthrone-based surfactants include: Toray. "Toray Silicone DC3PA", "Toray Silicone SH7PA", "Toray Silicone DC11PA", "Dongli", manufactured by Dow Corning Toray Co., Ltd. Toray Silicone SH21PA", "Toray Silicone SH28PA", "Toray Silicone SH29PA", "Toray Silicone SH30PA", "Torayone" (Toray Silicone) SH8400", "TSF-4440", "TSF-4300", "TSF-4445", "TSF-4460", "TSF-4452" manufactured by Momentive Performance Materials, Shin-Etsu "KP341", "KF6001", "KF6002" manufactured by Shinetsu Silicon Co., Ltd., "BYK307", "BYK323", "BYK330" manufactured by BYK Chemie.

界面活性劑可僅使用一種,亦可組合使用兩種以上。 The surfactant may be used alone or in combination of two or more.

白色感光性樹脂組成物可含有界面活性劑亦可不含界 面活性劑,於含有界面活性劑的情形時,相對於白色感光性樹脂組成物的總質量,界面活性劑的添加量較佳為0.001質量%~2.0質量%,更佳為0.005質量%~1.0質量%。 The white photosensitive resin composition may contain a surfactant or a boundary In the case of the surfactant, when the surfactant is contained, the amount of the surfactant added is preferably from 0.001% by mass to 2.0% by mass, more preferably from 0.005% by mass to 1.0%, based on the total mass of the white photosensitive resin composition. quality%.

[其他添加劑] [Other additives]

進而,亦可對白色感光性樹脂組成物添加塑化劑或感脂劑等公知的添加劑以改良硬化皮膜的物性。 Further, a known additive such as a plasticizer or a fat sensitive agent may be added to the white photosensitive resin composition to improve the physical properties of the cured film.

塑化劑例如有鄰苯二甲酸二辛酯、鄰苯二甲酸二-十二烷基酯、三乙二醇二辛酸酯、二甲基二醇鄰苯二甲酸酯、磷酸三甲苯酯、己二酸二辛酯、癸二酸二丁酯、三乙醯基甘油等,於使用黏合劑聚合物的情形時,可相對於聚合性化合物與黏合劑聚合物的合計質量而添加10質量%以下。 Plasticizers are, for example, dioctyl phthalate, di-dodecyl phthalate, triethylene glycol dicaprylate, dimethyl glycol phthalate, tricresyl phosphate , dioctyl adipate, dibutyl sebacate, triethylene glyceryl, etc., in the case of using a binder polymer, 10 mass can be added with respect to the total mass of the polymerizable compound and the binder polymer %the following.

[紫外線吸收劑] [UV absorber]

本發明的白色感光性樹脂組成物亦可含有紫外線吸收劑。紫外線吸收劑尤佳為作為共軛二烯系化合物的下述通式(I)所表示的化合物。 The white photosensitive resin composition of the present invention may also contain an ultraviolet absorber. The ultraviolet absorber is particularly preferably a compound represented by the following formula (I) which is a conjugated diene compound.

上述通式(I)中,R1及R2分別獨立地表示氫原子、碳 原子數1~20的烷基或碳原子數6~20的芳基,R1與R2可彼此相同亦可不同,但不同時表示氫原子。 In the above formula (I), R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms, and R 1 and R 2 may be the same as each other. Different, but not simultaneously, a hydrogen atom.

另外,R1及R2亦可與R1及R2所鍵結的氮原子一起形成環狀胺基。環狀胺基例如可列舉:哌啶基、嗎啉基、吡咯啶基、六氫氮呯基(hexahydroazepino)、哌嗪基等。 Further, R 1 and R 2 may form a cyclic amino group together with a nitrogen atom to which R 1 and R 2 are bonded. Examples of the cyclic amino group include a piperidinyl group, a morpholinyl group, a pyrrolidinyl group, a hexahydroazepino group, a piperazinyl group, and the like.

上述R3及R4表示拉電子基。此處,拉電子基為哈米特(Hammett)的取代基常數σp值(以下亦簡稱為「σp值」)為0.20以上、1.0以下的拉電子性基。較佳為σp值為0.30以上、0.8以下的拉電子性基。R3及R4亦可相互鍵結而形成環。 The above R 3 and R 4 represent an electron withdrawing group. Here, the electron withdrawing group is an electron withdrawing group having a substituent constant σ p value (hereinafter also simply referred to as "σ p value") of Hammett of 0.20 or more and 1.0 or less. The electron withdrawing group having a σ p value of 0.30 or more and 0.8 or less is preferable. R 3 and R 4 may also be bonded to each other to form a ring.

另外,上述R1、R2、R3及R4的至少一個亦可成為由經由連結基而與乙烯基鍵結的單體所衍生的聚合物的形態。亦可為與其他單體的共聚物。 Further, at least one of R 1 , R 2 , R 3 and R 4 may be in the form of a polymer derived from a monomer bonded to a vinyl group via a linking group. It may also be a copolymer with other monomers.

上述式(I)所表示的紫外線吸收劑的取代基的說明可參照WO2009/123109號公報的段落0024~段落0033(對應的美國專利申請公開第2011/0039195號說明書的[0040]~[0059])的記載,將該些內容併入至本申請說明書中。上述式(I)所表示的化合物的較佳具體例可參照WO2009/123109號公報的段落0034~段落0037(對應的美國專利申請公開第2011/0039195號說明書的[0060])的例示化合物(1)~例示化合物(14)的記載,將該些內容併入至本申請說明書中。 The description of the substituent of the ultraviolet absorber represented by the above formula (I) can be referred to in paragraphs 0024 to 0033 of WO2009/123109 (corresponding U.S. Patent Application Publication No. 2011/0039195 [0040] to [0059] The contents are incorporated into the specification of the present application. For a preferred embodiment of the compound represented by the above formula (I), reference is made to the exemplified compound (1) of paragraph 0034 to paragraph 0037 of the specification of WO2009/123109 (corresponding to the specification of [0060] of the corresponding US Patent Application Publication No. 2011/0039195). The description of the exemplified compound (14) is incorporated into the specification of the present application.

本發明的白色感光性樹脂組成物可含有紫外線吸收劑亦可不含紫外線吸收劑,於含有紫外線吸收劑的情形時,相對於 白色感光性樹脂組成物的總固體成分,紫外線吸收劑的含量較佳為0.1質量%~10質量%,更佳為0.1質量%~5質量%,尤佳為0.1質量%~3質量%。 The white photosensitive resin composition of the present invention may contain an ultraviolet absorber or may not contain an ultraviolet absorber, and in the case of containing an ultraviolet absorber, The total solid content of the white photosensitive resin composition, the content of the ultraviolet absorber is preferably from 0.1% by mass to 10% by mass, more preferably from 0.1% by mass to 5% by mass, even more preferably from 0.1% by mass to 3% by mass.

另外,本發明中,上述各種紫外線吸收劑可單獨使用一種,亦可組合使用兩種以上。 Further, in the present invention, the above various ultraviolet absorbers may be used alone or in combination of two or more.

本發明的白色感光性樹脂組成物較佳為利用過濾器進行過濾以去除異物或減少缺陷等。只要為先前以來於過濾用途等中所用的過濾器,則可無特別限定地使用。例如可列舉:以聚四氟乙烯(Polytetrafluoroethylene,PTFE)等氟樹脂、尼龍-6、尼龍-6,6等聚醯胺系樹脂、聚乙烯、聚丙烯(Polypropylene,PP)等聚烯烴樹脂(包含高密度、超高分子量)等製成的過濾器。該些原材料中,較佳為聚丙烯(包含高密度聚丙烯)。 The white photosensitive resin composition of the present invention is preferably filtered by a filter to remove foreign matter or to reduce defects and the like. It is not particularly limited as long as it is a filter used in filtration applications and the like. For example, a fluororesin such as polytetrafluoroethylene (PTFE), a polyamide resin such as nylon-6 or nylon-6,6, or a polyolefin resin such as polyethylene or polypropylene (polypropylene) may be used. A filter made of high density, ultra high molecular weight, etc. Among these raw materials, polypropylene (including high density polypropylene) is preferred.

過濾器的孔徑適當的是0.2μm~10.0μm左右,較佳為0.3μm~7.0μm左右,進而佳為0.4μm~5.0μm左右。藉由設定為該範圍,能可靠地去除混入至溶解的顏料等中且於後續步驟中妨礙均勻及平滑的白色感光性樹脂組成物的製備的微細異物。 The pore diameter of the filter is suitably from about 0.2 μm to about 10.0 μm, preferably from about 0.3 μm to about 7.0 μm, and more preferably from about 0.4 μm to about 5.0 μm. By setting it as the range, it is possible to reliably remove the fine foreign matter which is mixed into the dissolved pigment or the like and which hinders the preparation of the uniform and smooth white photosensitive resin composition in the subsequent step.

使用過濾器時,亦可將不同的過濾器組合。此時,利用第一過濾器的過濾可僅進行1次,亦可進行2次以上。於將不同過濾器組合來進行2次以上的過濾的情形時,較佳為第2次過濾以後的孔徑大於第1次過濾的孔徑。另外,亦可於上述範圍內組合孔徑不同的第一過濾器。此處的孔徑可參照過濾器廠商的標稱值。市售的過濾器例如可自日本頗爾(Pall)股份有限公司、愛多邦得 科東洋(Advantec Toyo)股份有限公司、日本英特格(Entegris)股份有限公司(原日本麥克麗思(Microris)股份有限公司)或北澤微濾器(KITZ Micro Filter)股份有限公司等所提供的各種過濾器中選擇。 Different filters can also be combined when using filters. At this time, the filtration by the first filter may be performed only once or twice or more. In the case where two or more filters are combined by using different filters, it is preferred that the pore diameter after the second filtration is larger than the pore diameter of the first filtration. Further, it is also possible to combine the first filters having different pore diameters within the above range. The aperture here can be referred to the nominal value of the filter manufacturer. Commercially available filters are available, for example, from Pall Co., Ltd., Iddobond Advantec Toyo Co., Ltd., Japan's Entegris Co., Ltd. (formerly Japan Microris Co., Ltd.) or Kitazawa Micro Filter Co., Ltd. Select from the filter.

第二過濾器可使用由與上述第一過濾器相同的材料等所形成者。第二過濾器的孔徑適當的是0.5μm~7.0μm左右,較佳為2.5μm~7.0μm左右,更佳為4.5μm~6.0μm左右。藉由設定為該範圍,可去除於使混合液中所含有的成分粒子殘存的狀態下混入至混合液中、於後續步驟中妨礙均勻及平滑的白色感光性樹脂組成物的製備的異物。 The second filter may be formed using the same material or the like as the first filter described above. The pore diameter of the second filter is suitably from about 0.5 μm to about 7.0 μm, preferably from about 2.5 μm to about 7.0 μm, more preferably from about 4.5 μm to about 6.0 μm. By setting it as the range, it is possible to remove the foreign matter which is mixed in the mixed liquid in a state in which the component particles contained in the mixed liquid remain, and which hinders the preparation of the uniform and smooth white photosensitive resin composition in the subsequent step.

例如,利用第一過濾器的過濾亦可僅於分散液中進行,混合其他成分後,進行第二過濾。 For example, the filtration by the first filter may be carried out only in the dispersion, and after the other components are mixed, the second filtration is performed.

本發明的白色感光性樹脂組成物的製造方法並無特別限制,可應用通常所用的組成物的製造方法。例如可藉由以下方式來製造本發明的白色感光性樹脂組成物:將黏合劑聚合物(A)、聚合性單體(B)、聚合起始劑(C)、二氧化鈦粒子(D)、分散劑、防著色劑(E)及溶劑混合,使用循環型分散裝置(珠磨機)等進行分散處理。 The method for producing the white photosensitive resin composition of the present invention is not particularly limited, and a method for producing a composition generally used can be applied. For example, the white photosensitive resin composition of the present invention can be produced by dispersing the binder polymer (A), the polymerizable monomer (B), the polymerization initiator (C), the titanium oxide particles (D), and the like. The agent, the coloring preventive agent (E), and the solvent are mixed, and are subjected to dispersion treatment using a circulating type dispersing device (bead mill).

<白色硬化膜> <White cured film>

本發明的白色感光性樹脂組成物例如即便於265℃下加熱15分鐘亦不易著色,另外可形成孔徑為50μm以下的微細的圖案,故可較佳地用於形成白色硬化膜。 The white photosensitive resin composition of the present invention is not easily colored even when heated at 265 ° C for 15 minutes, and a fine pattern having a pore diameter of 50 μm or less can be formed. Therefore, it can be preferably used for forming a white cured film.

即,本發明的白色感光性樹脂組成物較佳為白色硬化膜形成用。 That is, the white photosensitive resin composition of the present invention is preferably used for the formation of a white cured film.

另外,本發明亦是有關於一種白色硬化膜,其是使用本發明的白色感光性樹脂組成物所形成。 Further, the present invention relates to a white cured film formed using the white photosensitive resin composition of the present invention.

[白色硬化膜的製造方法] [Method for Producing White Cured Film]

本發明的白色硬化膜的製造方法包括以下步驟:利用噴霧法、輥塗法、旋轉塗佈法(旋塗法)、棒塗法等將上述白色感光性樹脂組成物塗佈於基板上的步驟;隨後進行的第一加熱步驟;及進而隨後藉由更高溫度下的第二加熱及/或曝光來進行硬化的硬化步驟。 The method for producing a white cured film of the present invention comprises the steps of applying the white photosensitive resin composition onto a substrate by a spray method, a roll coating method, a spin coating method (spin coating method), a bar coating method, or the like. a subsequent first heating step; and then a hardening step of hardening by a second heating and/or exposure at a higher temperature.

第一加熱步驟的條件較佳為於70℃以上、110℃以下且2分鐘以上、4分鐘以下左右的條件下進行乾燥。 The conditions of the first heating step are preferably dried at 70 ° C or higher and 110 ° C or lower for 2 minutes or longer and 4 minutes or shorter.

白色硬化膜的膜厚並無特別限定,就更有效地獲得本發明的效果的觀點而言,乾燥後的膜厚較佳為0.2μm以上、50μm以下,更佳為0.5μm以上、30μm以下,進而佳為0.7μm以上、20μm以下,進而更佳為2μm以上、20μm以下,尤佳為3μm以上、20μm以下。 The film thickness of the white cured film is not particularly limited, and from the viewpoint of obtaining the effect of the present invention more effectively, the film thickness after drying is preferably 0.2 μm or more and 50 μm or less, more preferably 0.5 μm or more and 30 μm or less. Further, it is preferably 0.7 μm or more and 20 μm or less, more preferably 2 μm or more and 20 μm or less, and still more preferably 3 μm or more and 20 μm or less.

<白色圖案及其製造方法> <White pattern and its manufacturing method>

以下,對本發明的白色圖案藉由其製造方法加以詳述。 Hereinafter, the white pattern of the present invention will be described in detail by a method for producing the same.

本發明的白色圖案的製造方法包括以下步驟:於基板上塗佈本發明的白色感光性樹脂組成物而形成白色膜的步驟;隔著遮罩 對上述白色膜進行曝光的步驟(以下適當簡稱為「曝光步驟」);以及對曝光後的上述白色膜進行顯影而形成白色圖案的步驟(以下適當簡稱為「顯影步驟」)。 The method for producing a white pattern of the present invention comprises the steps of: coating a white photosensitive resin composition of the present invention on a substrate to form a white film; The step of exposing the white film (hereinafter referred to simply as "exposure step"); and the step of developing the white film after exposure to form a white pattern (hereinafter referred to simply as "development step").

於本發明的白色圖案的製造方法中,較佳為於進行上述形成白色膜的步驟、曝光步驟及顯影步驟之後,包括藉由加熱及/或曝光使所形成的白色圖案硬化的硬化步驟。 In the method for producing a white pattern of the present invention, it is preferred to include a hardening step of hardening the formed white pattern by heating and/or exposure after performing the step of forming a white film, the exposing step, and the developing step.

具體而言,可將本發明的白色感光性樹脂組成物直接或隔著其他層而塗佈於基板上,形成白色膜(白色膜形成步驟),隔著既定的遮罩圖案進行曝光,僅使經光照射的塗佈膜部分硬化(曝光步驟),利用顯影液進行顯影(顯影步驟),藉此形成白色圖案。 Specifically, the white photosensitive resin composition of the present invention can be applied onto a substrate directly or via another layer to form a white film (white film forming step), and exposure is performed via a predetermined mask pattern, and only The light-irradiated coating film is partially hardened (exposure step), and development is carried out using a developing solution (developing step), thereby forming a white pattern.

以下,對各步驟加以說明。 Hereinafter, each step will be described.

[白色膜形成步驟] [White film forming step]

於白色膜形成步驟中,於基板上塗佈本發明的白色感光性樹脂組成物而形成白色膜。 In the white film forming step, the white photosensitive resin composition of the present invention is applied onto a substrate to form a white film.

上述基板例如可列舉:液晶顯示裝置等中所用的無鹼玻璃、鈉玻璃(soda glass)、派熱司(Pyrex)(註冊商標)玻璃、石英玻璃及於該些玻璃上附著有透明導電膜者,固體攝影元件等中所用的光電轉換元件基板,例如矽基板等或互補型金屬氧化膜半導體(Complementary Metal Oxide Semiconductor,CMOS)等。 Examples of the substrate include an alkali-free glass, a soda glass, a Pyrex (registered trademark) glass, a quartz glass, and a transparent conductive film attached to the glass. A photoelectric conversion element substrate used in a solid-state imaging device or the like, for example, a germanium substrate or the like, or a complementary metal oxide semiconductor (CMOS).

另外,於該些基板上,視需要亦可設置底塗層以改良與上部的層的密接、防止物質的擴散或實現基板表面的平坦化。 Further, on the substrates, an undercoat layer may be provided as needed to improve adhesion to the upper layer, to prevent diffusion of substances, or to planarize the surface of the substrate.

於基板上塗佈本發明的白色感光性樹脂組成物的塗佈方法可 應用:狹縫塗佈、噴墨法、旋轉塗佈、流延塗佈、輥塗、噴霧塗佈、網版印刷法等各種塗佈方法。 Coating method for coating the white photosensitive resin composition of the present invention on a substrate Applications: Various coating methods such as slit coating, inkjet method, spin coating, cast coating, roll coating, spray coating, and screen printing.

白色膜的塗佈膜厚並無特別限定,就解析度及顯影性的觀點而言,較佳為0.2μm以上、50μm以下,更佳為0.5μm以上、30μm以下,進而佳為0.7μm以上、20μm以下。 The coating film thickness of the white film is not particularly limited, and is preferably 0.2 μm or more and 50 μm or less, more preferably 0.5 μm or more and 30 μm or less, and further preferably 0.7 μm or more from the viewpoint of resolution and developability. 20 μm or less.

塗佈於基板上的白色感光性樹脂組成物通常是於70℃以上、110℃以下且2分鐘以上、4分鐘以下左右的條件下乾燥,形成白色膜。 The white photosensitive resin composition applied to the substrate is usually dried at 70 ° C or higher and 110 ° C or lower for 2 minutes or longer and 4 minutes or shorter to form a white film.

[曝光步驟] [Exposure step]

於曝光步驟中,隔著遮罩對上述所形成的白色膜進行曝光,僅使經光照射的塗佈膜部分硬化。 In the exposure step, the white film formed as described above is exposed through a mask, and only the coating film irradiated with light is partially cured.

曝光較佳為藉由放射線的照射來進行,曝光時可使用的放射線尤其可較佳地使用g射線、h射線、i射線等紫外線,更佳為高壓水銀燈。照射強度較佳為5mJ/cm2以上、1500mJ/cm2以下,更佳為10mJ/cm2以上、1200mJ/cm2以下,最佳為10mJ/cm2以上、1000mJ/cm2以下。 The exposure is preferably performed by irradiation of radiation, and radiation which can be used for exposure can preferably use ultraviolet rays such as g-rays, h-rays, and i-rays, and more preferably a high-pressure mercury lamp. The irradiation intensity is preferably 5 mJ/cm 2 or more and 1500 mJ/cm 2 or less, more preferably 10 mJ/cm 2 or more and 1200 mJ/cm 2 or less, and most preferably 10 mJ/cm 2 or more and 1000 mJ/cm 2 or less.

[顯影步驟] [Development Step]

繼曝光步驟之後,進行顯影步驟(較佳為鹼顯影步驟),使曝光步驟中的光未照射部分溶出至鹼性水溶液中。藉此,僅經光硬化的部分殘留。 After the exposure step, a development step (preferably an alkali development step) is performed to dissolve the unexposed portion of the light in the exposure step into the alkaline aqueous solution. Thereby, only the photohardened portion remains.

顯影步驟中使用的顯影液並無特別限定,例如可使用鹼性顯影液或含有有機溶劑的顯影液。 The developing solution used in the developing step is not particularly limited, and for example, an alkaline developing solution or a developing solution containing an organic solvent can be used.

顯影液較佳為不對底層的電路等造成損傷的有機鹼性顯影液。顯影溫度通常為20℃以上、30℃以下,顯影時間為20秒鐘以上、90秒鐘以下。 The developer is preferably an organic alkaline developer which does not cause damage to the underlying circuit or the like. The development temperature is usually 20° C. or higher and 30° C. or lower, and the development time is 20 seconds or longer and 90 seconds or shorter.

鹼性顯影液例如可使用:氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、氨水等無機鹼類,乙胺、正丙胺等一級胺類;二乙胺、二正丁胺等二級胺類;三乙胺、甲基二乙基胺等三級胺類;二甲基乙醇胺、三乙醇胺等醇胺類;氫氧化四甲基銨、氫氧化四乙基銨、氫氧化四丙基銨、氫氧化四丁基銨、氫氧化四戊基銨、氫氧化四己基銨、氫氧化四辛基銨、氫氧化乙基三甲基銨、氫氧化丁基三甲基銨、氫氧化甲基三戊基銨、氫氧化二丁基二戊基銨等氫氧化四烷基銨;氫氧化三甲基苯基銨、氫氧化三甲基苄基銨、氫氧化三乙基苄基銨等四級銨鹽;吡咯、哌啶等環狀胺類等的鹼性水溶液。進而,亦可於上述鹼性水溶液中添加適當量的醇類、界面活性劑而使用。鹼性顯影液的鹼濃度通常為0.001質量%~20質量%,較佳為0.01質量%~10質量%,更佳為0.1質量%~1質量%。鹼性顯影液的pH值通常為10.0~15.0。鹼性顯影液的鹼濃度及pH值可適當製備而使用。鹼性顯影液例如可適量添加甲醇、乙醇等水溶性有機溶劑或界面活性劑等而使用。 As the alkaline developing solution, for example, inorganic bases such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, and aqueous ammonia, primary amines such as ethylamine and n-propylamine; diethylamine and di-n-butyl; Secondary amines such as butylamine; tertiary amines such as triethylamine and methyldiethylamine; alcoholamines such as dimethylethanolamine and triethanolamine; tetramethylammonium hydroxide and tetraethylammonium hydroxide; Tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetraammonium hydroxide, tetrahexylammonium hydroxide, tetraoctylammonium hydroxide, ethyltrimethylammonium hydroxide, butyltrimethyl hydroxide Tetraalkylammonium hydroxide such as ammonium, methyltriammonium hydroxide or dibutylammonium hydroxide; trimethylphenylammonium hydroxide, trimethylbenzylammonium hydroxide, triethyl hydroxide A quaternary ammonium salt such as a benzylammonium salt; an aqueous alkaline solution such as a cyclic amine such as pyrrole or piperidine. Further, an appropriate amount of an alcohol or a surfactant may be added to the aqueous alkaline solution and used. The alkali concentration of the alkaline developer is usually 0.001% by mass to 20% by mass, preferably 0.01% by mass to 10% by mass, more preferably 0.1% by mass to 1% by mass. The pH of the alkaline developer is usually from 10.0 to 15.0. The alkali concentration and pH of the alkaline developer can be suitably prepared and used. The alkaline developing solution can be used, for example, by adding a water-soluble organic solvent such as methanol or ethanol, a surfactant, or the like in an appropriate amount.

再者,於使用包含此種鹼性水溶液的顯影液的情形時,通常於顯影後以純水清洗(淋洗)。 Further, in the case of using a developer containing such an alkaline aqueous solution, it is usually washed (rinsed) with pure water after development.

[實施例] [Examples]

以下,藉由實施例對本發明加以具體說明,但本發明不 限定於該些實施例。再者,只要無特別說明,則「份」及「%」為質量基準。 Hereinafter, the present invention will be specifically described by way of examples, but the present invention does not Limited to these embodiments. In addition, "parts" and "%" are quality standards unless otherwise specified.

另外,實施例中,酸值是藉由電位差法(溶劑為四氫呋喃/水=54/6(體積比)、滴定液為0.1N氫氧化鈉水溶液(酸值))來確定。 Further, in the examples, the acid value was determined by a potential difference method (solvent was tetrahydrofuran/water = 54/6 (volume ratio), and the titration solution was 0.1 N aqueous sodium hydroxide solution (acid value)).

另外,後述的重量平均分子量的測定中,使用HPC-8220GPC(東曹製造)作為測定裝置,使用TSK guardcolumn SuperHZ-L作為保護管柱(guard column),且使用將TSKgel SuperHZM-M、TSKgel SuperHZ4000、TSKgel SuperHZ3000、TSKgel SuperHZ2000串聯而成的管柱作為管柱,將管柱溫度設定為40℃,注入試樣濃度為0.1質量%的四氫呋喃溶液10μl,使作為溶出溶劑的四氫呋喃以每分鐘0.35ml的流量流動,利用示差折射(Refractive Index,RI)檢測裝置來檢測試樣峰值,使用利用標準聚苯乙烯所製作的校準曲線來計算。 Further, in the measurement of the weight average molecular weight to be described later, HPC-8220GPC (manufactured by Tosoh Corporation) was used as a measuring device, TSK guardcolumn SuperHZ-L was used as a guard column, and TSKgel SuperHZM-M, TSKgel SuperHZ4000, and the like were used. A column in which TSKgel SuperHZ3000 and TSKgel SuperHZ2000 are connected in series is used as a column. The column temperature is set to 40 ° C, and 10 μl of a tetrahydrofuran solution having a sample concentration of 0.1% by mass is injected, and the flow rate of tetrahydrofuran as a dissolution solvent is 0.35 ml per minute. Flow, using a Refractive Index (RI) detection device to detect sample peaks, using a calibration curve made using standard polystyrene.

<實施例1> <Example 1>

[二氧化鈦分散液的製備1] [Preparation of Titanium Dioxide Dispersion 1]

對於下述組成的混合液,使用壽工業股份有限公司製造的超分散機(Ultra Apex Mill)作為循環型分散裝置(珠磨機),如以下般進行分散處理,獲得二氧化鈦分散液。 For the mixed liquid of the following composition, a super dispersing machine (Ultra Apex Mill) manufactured by Shou Industrial Co., Ltd. was used as a circulating type dispersing device (bead mill), and dispersion treatment was carried out as follows to obtain a titanium oxide dispersion liquid.

~組成~ ~Comment~

.二氧化鈦(石原產業(股)製造,CR-90-2)(純度為90%以上):540.00份 . Titanium dioxide (manufactured by Ishihara Industry Co., Ltd., CR-90-2) (purity of 90% or more): 540.00 parts

.分散劑(A-1)(30質量%的PGMEA溶液):129.00份 . Dispersant (A-1) (30% by mass of PGMEA solution): 129.00 parts

.丙二醇-1-單甲醚-2-乙酸酯(PGMEA):531.00份 . Propylene glycol-1-monomethyl ether-2-acetate (PGMEA): 531.00 parts

上述式中,n為14,分散劑(A-1)的聚苯乙烯換算的重量平均分子量為6400,酸值為80mgKOH/g。 In the above formula, n is 14, and the polystyrene-equivalent weight average molecular weight of the dispersing agent (A-1) is 6,400, and the acid value is 80 mgKOH/g.

另外,分散裝置是於以下條件下運轉。 Further, the dispersion device was operated under the following conditions.

.珠粒徑:φ0.2mm . Bead size: φ0.2mm

.珠粒填充率:75體積% . Bead filling rate: 75% by volume

.周速:10m/s . Weekly speed: 10m/s

.泵供給量:10kg/h . Pump supply: 10kg / h

.冷卻水:自來水 . Cooling water: tap water

.珠磨機環狀通路內容積:0.15L . Bead mill annular passage internal volume: 0.15L

.進行分散處理的混合液量:1.20kg . The amount of the mixture to be dispersed: 1.20 kg

分散開始後,以30分鐘為間隔(通過一次的時間)來進行平均粒徑的測定。 After the start of dispersion, the measurement of the average particle diameter was carried out at intervals of 30 minutes (time passed once).

平均粒徑隨著分散時間(通過次數)而減小,但其變化量逐漸變少。於粒度分佈的d50小於250nm、d90小於350nm的時刻結束分散。再者,該分散液中的二氧化鈦粒子的平均粒徑為253 nm。 The average particle diameter decreases with the dispersion time (the number of passes), but the amount of change gradually decreases. The dispersion was terminated at a time when the d50 of the particle size distribution was less than 250 nm and the d90 was less than 350 nm. Furthermore, the average particle diameter of the titanium dioxide particles in the dispersion is 253. Nm.

該測定中,將二氧化鈦粒子的平均粒徑設定為使用日機裝股份有限公司製造的Microtrac UPA-EX150所得的數量平均粒徑。 In this measurement, the average particle diameter of the titanium dioxide particles was set to the number average particle diameter obtained by using Microtrac UPA-EX150 manufactured by Nikkiso Co., Ltd.

[白色感光性樹脂組成物的製備1] [Preparation of White Photosensitive Resin Composition 1]

使用上述所得的二氧化鈦分散液,以成為以下組成的方式將各成分混合而獲得實施例1的白色感光性樹脂組成物。 The white photosensitive resin composition of Example 1 was obtained by mixing the respective components so as to have the following composition by using the titanium oxide dispersion liquid obtained above.

~白色感光性樹脂組成物的組成~ ~ Composition of white photosensitive resin composition~

.上述所製備的二氧化鈦分散液:36.67份 . The titanium dioxide dispersion prepared above: 36.67 parts

.下述黏合劑聚合物(B-1)40質量%PGMEA溶液:31.58份 . The following binder polymer (B-1) 40% by mass PGMEA solution: 31.58 parts

重量平均分子量(Mw)為11000,共聚合比(莫耳比)如下。 The weight average molecular weight (Mw) was 11,000, and the copolymerization ratio (mol ratio) was as follows.

.聚合性單體(季戊四醇四丙烯酸酯):8.92份 . Polymerizable monomer (pentaerythritol tetraacrylate): 8.92 parts

(新中村化學工業股份有限公司製造的A-TMMT;下述表中的M-1) (A-TMMT manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; M-1 in the following table)

.聚合起始劑(K-1):2.54份 . Polymerization initiator (K-1): 2.54 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.21份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.21 parts

.矽烷偶合劑(N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷):0.04份 . Decane coupling agent (N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane): 0.04 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造的美佳法(Megafac)F-781F)0.2質量%PGMEA溶液:4.17份 . Surfactant (Megafac F-781F manufactured by DiCai (DIC)) 0.2% by mass PGMEA solution: 4.17 parts

.PGMEA:3.10份 . PGMEA: 3.10 servings

.環己酮:12.76份 . Cyclohexanone: 12.76 parts

<實施例2~實施例4及實施例7> <Example 2 to Example 4 and Example 7>

除了變更分散劑、聚合起始劑、黏合劑聚合物的種類(下述分散劑(A-2)、下述聚合起始劑(K-2)、下述聚合起始劑(K-3)、下述黏合劑聚合物(B-2))以外,與實施例1同樣地製備實施例2~實施例4及實施例7的白色感光性樹脂組成物。 In addition to changing the type of the dispersant, the polymerization initiator, and the binder polymer (the following dispersant (A-2), the following polymerization initiator (K-2), the following polymerization initiator (K-3) The white photosensitive resin compositions of Examples 2 to 4 and Example 7 were prepared in the same manner as in Example 1 except for the following binder polymer (B-2).

關於A-2,重量平均分子量(Mw)為9000,共聚合比(莫耳比)如上所述。 Regarding A-2, the weight average molecular weight (Mw) was 9000, and the copolymerization ratio (mol ratio) was as described above.

上述式中,n為9,關於B-2,重量平均分子量(Mw)為10,000,共聚合比(莫耳比)如上所述。 In the above formula, n is 9, and with respect to B-2, the weight average molecular weight (Mw) is 10,000, and the copolymerization ratio (mole ratio) is as described above.

<實施例5> <Example 5>

[藍色顏料分散液的製備] [Preparation of Blue Pigment Dispersion]

對於下述組成的混合液,藉由依據上述二氧化鈦分散處理進行的操作來獲得藍色顏料分散液(C-1)。 The blue pigment dispersion liquid (C-1) was obtained by the operation according to the above-described titanium oxide dispersion treatment for the mixed liquid of the following composition.

~組成~ ~Comment~

.C.I.顏料藍(Pigment Blue)15:6:88.80份 . C.I. Pigment Blue 15:6:88.80 parts

.C.I.顏料紫(Pigment Violet)23:23.20份 . C.I. Pigment Violet 23: 23.20 parts

.分散劑(索努帕斯(SOLSPERSE)36000;路博潤(Lubrizol)公司製造)30質量%PGMEA溶液:152.00份 . Dispersant (SOLSPERSE 36000; manufactured by Lubrizol) 30% by mass PGMEA solution: 152.00 parts

.PGMEA:536.00份 . PGMEA: 536.00 servings

[白色感光性樹脂組成物的製備2] [Preparation of White Photosensitive Resin Composition 2]

使用利用上述方法所製備的藍色顏料分散液(C-1),以成為以下組成的方式將各成分混合而獲得實施例5的白色感光性樹脂組成物。 Using the blue pigment dispersion liquid (C-1) prepared by the above method, each component was mixed so as to have the following composition, and the white photosensitive resin composition of Example 5 was obtained.

~白色感光性樹脂組成物的組成~ ~ Composition of white photosensitive resin composition~

.利用上述方法所製備的藍色顏料分散液(C-1):0.03份 . Blue pigment dispersion (C-1) prepared by the above method: 0.03 parts

.與實施例1同樣地製備的二氧化鈦分散液:36.66份 . Titanium dioxide dispersion prepared in the same manner as in Example 1 : 36.66 parts

.上述黏合劑(B-1)40質量%PGMEA溶液:31.57份 . The above adhesive (B-1) 40% by mass PGMEA solution: 31.57 parts

.聚合性單體(季戊四醇四丙烯酸酯):8.92份 . Polymerizable monomer (pentaerythritol tetraacrylate): 8.92 parts

(新中村化學工業股份有限公司製造A-TMMT;下述表中的M-1) (New Nakamura Chemical Industry Co., Ltd. manufactures A-TMMT; M-1 in the following table)

.上述聚合起始劑(K-2):2.54份 . The above polymerization initiator (K-2): 2.54 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.21份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.21 parts

.矽烷偶合劑(N-2-(胺基甲基)-3-胺基丙基甲基二甲氧基矽烷):0.04份 . Decane coupling agent (N-2-(aminomethyl)-3-aminopropylmethyldimethoxydecane): 0.04 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)0.2質量%PGMEA溶液:4.17份 . Surfactant (manufactured by Dickson (DIC), Megafac F-781F) 0.2% by mass PGMEA solution: 4.17 parts

.PGMEA:3.10份 . PGMEA: 3.10 servings

.環己酮:12.75份 . Cyclohexanone: 12.75 parts

<實施例6> <Example 6>

除了將藍色顏料分散液的種類變更為下述藍色顏料分散液(C-2)以外,與實施例5同樣地製備實施例6的白色感光性樹脂組成物。 A white photosensitive resin composition of Example 6 was prepared in the same manner as in Example 5 except that the type of the blue pigment dispersion liquid was changed to the following blue pigment dispersion liquid (C-2).

於實施例6中,如下述般製備混合液,藉由依據上述二氧化鈦分散處理進行的操作來獲得藍色顏料分散液(C-2)。 In Example 6, a mixed liquid was prepared as follows, and a blue pigment dispersion liquid (C-2) was obtained by an operation according to the above-described titanium oxide dispersion treatment.

~組成~ ~Comment~

.C.I.顏料紫(Pigment Violet)23:80.00份 . C.I. Pigment Violet 23: 80.00 parts

.分散劑(索努帕斯(SOLSPERSE)36000;路博潤(Lubrizol)公司製造)30質量%PGMEA溶液:232.00份 . Dispersant (SOLSPERSE 36000; manufactured by Lubrizol) 30% by mass PGMEA solution: 232.00 parts

.PGMEA:488.00份 . PGMEA: 488.00 servings

<實施例8> <Example 8>

[二氧化鈦分散液的製備2] [Preparation of titanium dioxide dispersion 2]

除了如下述般變更組成及進行分散處理的混合液量以外,與實施例1同樣地製備分散液。 A dispersion liquid was prepared in the same manner as in Example 1 except that the composition and the amount of the mixed liquid to be subjected to the dispersion treatment were changed as described below.

~組成~ ~Comment~

.二氧化鈦(石原產業(股)製造,CR-90-2)(純度為90%以上):272.57份 . Titanium dioxide (manufactured by Ishihara Industry Co., Ltd., CR-90-2) (purity of 90% or more): 272.57 parts

.分散劑(索努帕斯(SOLSPERSE)36000)(30質量%PGMEA溶液):136.29份 . Dispersant (SOLSPERSE 36000) (30% by mass PGMEA solution): 136.29 parts

.丙二醇-1-單甲醚-2-乙酸酯(PGMEA):241.14份 . Propylene glycol-1-monomethyl ether-2-acetate (PGMEA): 241.44 parts

.進行分散處理的混合液量:0.65kg . The amount of the mixed solution for dispersion treatment: 0.65 kg

[白色感光性樹脂組成物的製備3] [Preparation of White Photosensitive Resin Composition 3]

使用利用上述方法所製備的二氧化鈦分散液,以成為以下組成的方式將各成分混合而獲得實施例8的白色感光性樹脂組成物。 The white photosensitive resin composition of Example 8 was obtained by mixing the respective components in such a manner that the titanium dioxide dispersion liquid prepared by the above method was used.

~白色感光性樹脂組成物的組成~ ~ Composition of white photosensitive resin composition~

.利用上述方法製備的二氧化鈦分散液:40.56份 . Titanium dioxide dispersion prepared by the above method: 40.56 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:28.35份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 28.35 parts

.聚合性單體(季戊四醇四丙烯酸酯):8.92份 . Polymerizable monomer (pentaerythritol tetraacrylate): 8.92 parts

(新中村化學工業股份有限公司製造A-TMMT;下述表中的M-1) (New Nakamura Chemical Industry Co., Ltd. manufactures A-TMMT; M-1 in the following table)

.上述聚合起始劑(K-2):2.54份 . The above polymerization initiator (K-2): 2.54 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.21份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.21 parts

.矽烷偶合劑(N-2-(胺基甲基)-3-胺基丙基甲基二甲氧基矽烷) 的1質量%環己酮溶液:4.20份 . Decane coupling agent (N-2-(aminomethyl)-3-aminopropylmethyldimethoxydecane) 1% by mass solution of cyclohexanone: 4.20 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)0.2質量%PGMEA溶液:4.17份 . Surfactant (manufactured by Dickson (DIC), Megafac F-781F) 0.2% by mass PGMEA solution: 4.17 parts

.PGMEA:11.04份 . PGMEA: 11.04 copies

<實施例9、實施例10> <Example 9, Example 10>

除了將分散劑的種類變更為索努帕斯(SOLSPERSE)26000、 索努帕斯(SOLSPERSE)41000以外,與實施例8同樣地製備白色感光性樹脂組成物。 In addition to changing the type of dispersant to SONOSPERSE 26000, A white photosensitive resin composition was prepared in the same manner as in Example 8 except for SONOSPERSE 41000.

<實施例11> <Example 11>

[白色感光性樹脂組成物的製備4] [Preparation of White Photosensitive Resin Composition 4]

以成為以下組成的方式將各成分混合而獲得實施例11的白色感光性樹脂組成物。 The white photosensitive resin composition of Example 11 was obtained by mixing the components in such a manner as to have the following composition.

~白色感光性樹脂組成物的組成~ ~ Composition of white photosensitive resin composition~

.二氧化鈦分散液的製備2中製備的分散液:45.63份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 45.63 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:42.07份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 42.07 parts

.聚合性單體(季戊四醇四丙烯酸酯):5.88份 . Polymerizable monomer (pentaerythritol tetraacrylate): 5.88 parts

(新中村化學工業股份有限公司製造,A-TMMT;下述表中的M-1) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT; M-1 in the following table)

.聚合起始劑(K-2):2.82份 . Polymerization initiator (K-2): 2.82 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.24份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.24 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.47份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.47 parts

.聚合抑制劑(對甲氧基苯酚):0.24份 . Polymerization inhibitor (p-methoxyphenol): 0.24 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)1質量%PGMEA溶液:0.90份 . Surfactant (manufactured by Dixon (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.90 parts

.PGMEA:1.99份 . PGMEA: 1.99 copies

使用如此般製備的白色感光性樹脂組成物來形成白色 硬化膜,對[耐熱性(色差△E*ab)]、[分光測定(透射率)]、[圖案形成性]進行評價。 A white cured film was formed using the white photosensitive resin composition thus prepared, and [heat resistance (color difference ΔE * ab)], [spectral measurement (transmittance)], and [pattern formability] were evaluated.

[白色硬化膜的形成(膜厚:4.0μm)] [Formation of White Cured Film (Thickness: 4.0 μm)]

利用旋塗法將實施例1~實施例11的白色感光性樹脂組成物分別塗佈於鈉玻璃(75mm×75mm平方,厚度為1.1mm)上,其後於熱板上以100℃加熱2分鐘而獲得膜厚為4.0μm的塗佈膜。藉由牛尾(Ushio)電機(股)製造的超高壓水銀燈「USH-500BY」以700mJ/cm2對該塗佈膜進行曝光。進而,以200℃於熱板上加熱5分鐘,獲得白色硬化膜(膜厚:4.0μm)。 The white photosensitive resin compositions of Examples 1 to 11 were applied to a soda glass (75 mm × 75 mm square, thickness: 1.1 mm) by spin coating, and then heated at 100 ° C for 2 minutes on a hot plate. A coating film having a film thickness of 4.0 μm was obtained. The coated film was exposed at 700 mJ/cm 2 by an ultrahigh pressure mercury lamp "USH-500BY" manufactured by Ushio Electric Co., Ltd. Further, the film was heated on a hot plate at 200 ° C for 5 minutes to obtain a white cured film (film thickness: 4.0 μm).

[耐熱性評價] [Heat resistance evaluation]

(分光測定(反射)) (Spectrophotometry (reflection))

利用Spectro EyeLT(阪田油墨(Sakata Inx)公司製造)來測定上述所形成的白色硬化膜的分光L*、a*、b*。再者,於測定時,將形成有白色硬化膜的玻璃放置於經黑色抗蝕劑被覆的台(黑色台)上來進行測定。黑色台的黑色抗蝕劑層的光密度(Optical Density,OD)於400nm下為3.5(透射率為0.03%)、於550nm下為3.2(透射率為0.06)、於700nm下為2.5(透射率為0.32%),反射率於400nm~700nm下為7%。該黑色台的OD是利用大塚電子(股)製造的「MCPD-3000」來測定,反射率是利用柯尼卡美能達(Konica Minolta)(股)製造的「分光光度計(SPECTROPHOTOMETER)CM-2600」來測定。 The spectroscopic light L * , a * , and b * of the white cured film formed as described above were measured by Spectro EyeLT (manufactured by Sakata Ink Co., Ltd.). Further, at the time of measurement, the glass on which the white cured film was formed was placed on a black resist-coated table (black table) and measured. The black resist layer of the black stage has an optical density (OD) of 3.5 (transmittance: 0.03%) at 400 nm, 3.2 (transmittance of 0.06) at 550 nm, and 2.5 at 700 nm (transmittance). The reflectance was 0.32%) and the reflectance was 7% at 400 nm to 700 nm. The OD of the black stage was measured by "MCPD-3000" manufactured by Otsuka Electronics Co., Ltd., and the reflectance was a spectrophotometer (SPECTROPHOTOMETER) CM-2600 manufactured by Konica Minolta Co., Ltd. To measure.

將上述白色硬化膜以265℃於熱板上加熱15分鐘,依照上述 方法來測定加熱後的白色硬化膜的色濃度,算出色差△E*ab。 The white cured film was heated on a hot plate at 265 ° C for 15 minutes, and the color density of the white cured film after heating was measured in accordance with the above method to calculate a color difference ΔE * ab.

[分光測定(透射率)] [Spectrophotometry (transmittance)]

利用大塚電子(股)製造的「MCPD-3000」來測定上述白色硬化膜的分光(透射率)。 The spectroscopic (transmittance) of the above-described white cured film was measured by "MCPD-3000" manufactured by Otsuka Electronics Co., Ltd.

[圖案形成(膜厚為4.0μm)] [Pattern formation (film thickness: 4.0 μm)]

利用旋塗法將上述白色感光性樹脂組成物塗佈於鈉玻璃(100mm×100mm平方,厚度為0.7mm)上,其後於熱板上以100℃加熱2分鐘,獲得膜厚為4.00μm的塗佈膜。藉由牛尾電機(股)製造的超高壓水銀燈「USH-500BY」,隔著具有多個直徑為50μm及20μm的圓形圖案的遮罩以700mJ/cm2對該塗佈膜進行曝光。 The white photosensitive resin composition was applied onto a soda glass (100 mm × 100 mm square, thickness: 0.7 mm) by a spin coating method, and then heated at 100 ° C for 2 minutes on a hot plate to obtain a film thickness of 4.00 μm. Coating film. The coating film was exposed at 700 mJ/cm 2 through a mask having a plurality of circular patterns having a diameter of 50 μm and 20 μm by an ultrahigh pressure mercury lamp "USH-500BY" manufactured by Oxtail Motor.

對其使用鹼性顯影液(CD-2060)(富士軟片電子材料(FUJIFILM Electronic Materials)(股)製造)於室溫下浸置顯影60秒鐘後,進而利用旋轉花灑(spin shower)以純水進行20秒鐘淋洗。其後,進一步以純水進行水洗,然後藉由高速旋轉使基板乾燥,形成孔圖案。 It was immersed and developed for 60 seconds at room temperature using an alkaline developer (CD-2060) (manufactured by FUJIFILM Electronic Materials Co., Ltd.), and then purified by a spin shower. The water was rinsed for 20 seconds. Thereafter, the substrate was further washed with pure water, and then the substrate was dried by high-speed rotation to form a hole pattern.

根據下述評價基準,對孔徑為50μm及20μm的孔圖案分別評價圖案形成性。 Pattern formation properties were evaluated for the hole patterns having pore diameters of 50 μm and 20 μm, respectively, according to the following evaluation criteria.

圖案形成性: Pattern formation:

1.未形成圖案。 1. No pattern is formed.

2.有大量殘渣,圖案形狀差。 2. There are a lot of residues and the shape of the pattern is poor.

3.有少許殘渣,但圖案形狀尚可。 3. There is a little residue, but the shape of the pattern is acceptable.

4.有少許殘渣,但清晰地形成圖案。 4. There is a little residue, but the pattern is clearly formed.

5.無殘渣且清晰地形成圖案。 5. No residue and clear patterning.

將結果示於下述表1中。 The results are shown in Table 1 below.

由表1明確得知,實施例1~實施例11中,耐熱試驗前 後的色差△E*ab為3以下而著色得到抑制,可良好地形成孔徑為50μm以下的孔圖案。 As is clear from Table 1, in Examples 1 to 11, the color difference ΔE * ab before and after the heat resistance test was 3 or less, and coloring was suppressed, and a hole pattern having a pore diameter of 50 μm or less was satisfactorily formed.

進而得知,藉由使用具有含磷原子的基團作為酸系吸附部位的高分子分散劑,可良好地形成20μm以下的孔圖案。 Further, it has been found that by using a polymer dispersant having a group containing a phosphorus atom as an acid-based adsorption site, a pore pattern of 20 μm or less can be favorably formed.

另外確認到,實施例11即便將膜厚增厚至10μm為止,耐熱試驗前後的著色亦少。另外,由後述表2亦明確得知,可良好地形成50μm以下的孔圖案。 Further, in Example 11, even when the film thickness was increased to 10 μm, the coloration before and after the heat resistance test was small. Further, as is clear from Table 2 to be described later, a hole pattern of 50 μm or less can be favorably formed.

繼而,對於上述實施例8及實施例11的白色感光性樹 脂組成物以及下述實施例12~實施例17的白色感光性樹脂組成物,形成膜厚為4.0μm及10.0μm的白色硬化膜,並對孔圖案評價圖案形成性。 Then, for the white photosensitive trees of the above-described Example 8 and Example 11, The fat composition and the white photosensitive resin compositions of the following Examples 12 to 17 were formed into white cured films having a thickness of 4.0 μm and 10.0 μm, and the pattern formation property was evaluated for the pore pattern.

除了如下述般變更白色感光性組成物的內容以外,與實 施例8同樣地製備實施例12~實施例17的白色感光性樹脂組成物。 In addition to changing the content of the white photosensitive composition as described below, Example 8 The white photosensitive resin compositions of Examples 12 to 17 were prepared in the same manner.

<實施例12> <Example 12>

.二氧化鈦分散液的製備2中製備的分散液:45.63份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 45.63 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:21.39份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 21.39 parts

.聚合性單體(季戊四醇四丙烯酸酯):14.15份 . Polymerizable monomer (pentaerythritol tetraacrylate): 14.15 parts

(新中村化學工業股份有限公司製造,A-TMMT) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT)

.聚合起始劑(K-2):2.82份 . Polymerization initiator (K-2): 2.82 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.23份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.23 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.47份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.47 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)1質量%PGMEA溶液:0.90份 . Surfactant (manufactured by Dixon (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.90 parts

.PGMEA:14.40份 . PGMEA: 14.40 copies

<實施例13> <Example 13>

.二氧化鈦分散液的製備2中製備的分散液:45.63份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 45.63 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:34.17份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 34.17 parts

.聚合性單體(季戊四醇四丙烯酸酯):9.04份 . Polymerizable monomer (pentaerythritol tetraacrylate): 9.04 parts

(新中村化學工業股份有限公司製造,A-TMMT) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT)

.聚合起始劑(K-2):2.82份 . Polymerization initiator (K-2): 2.82 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.23份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.23 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.47份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.47 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)1質量%PGMEA溶液:0.90份 . Surfactant (manufactured by Dixon (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.90 parts

.PGMEA:6.73份 . PGMEA: 6.73

<實施例14> <Example 14>

.二氧化鈦分散液的製備2中製備的分散液:45.63份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 45.63 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:36.70份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 36.70 parts

.聚合性單體(季戊四醇四丙烯酸酯):8.03份 . Polymerizable monomer (pentaerythritol tetraacrylate): 8.03 parts

(新中村化學工業股份有限公司製造,A-TMMT) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT)

.聚合起始劑(K-2):2.82份 . Polymerization initiator (K-2): 2.82 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.23份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.23 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.47份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.47 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)1質量%PGMEA溶液:0.90份 . Surfactant (manufactured by Dixon (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.90 parts

.PGMEA:5.21份 . PGMEA: 5.21 servings

<實施例15> <Example 15>

.二氧化鈦分散液的製備2中製備的分散液:45.63份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 45.63 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:40.29份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 40.29 parts

.聚合性單體(季戊四醇四丙烯酸酯):6.61份 . Polymerizable monomer (pentaerythritol tetraacrylate): 6.61 parts

(新中村化學工業股份有限公司製造,A-TMMT) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT)

.聚合起始劑(K-2):2.80份 . Polymerization initiator (K-2): 2.80 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.24份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.24 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.47份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.47 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)1質量%PGMEA溶液:0.90份 . Surfactant (manufactured by Dixon (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.90 parts

.PGMEA:3.05份 . PGMEA: 3.05 servings

<實施例16> <Example 16>

.二氧化鈦分散液的製備2中製備的分散液:44.66份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 44.66 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:46.05份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 46.05 parts

.聚合性單體(季戊四醇四丙烯酸酯):3.80份 . Polymerizable monomer (pentaerythritol tetraacrylate): 3.80 parts

(新中村化學工業股份有限公司製造,A-TMMT) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT)

.聚合起始劑(K-2):2.76份 . Polymerization initiator (K-2): 2.76 parts

.防著色劑(艾迪科(Adeka)(股)製造,艾迪科斯塔波(Adekastab)AO-80):0.23份 . Anti-coloring agent (made by Adeka), Adekastab AO-80): 0.23 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.46份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.46 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac) F-781F)1質量%PGMEA溶液:0.92份 . Surfactant (made by DiCai (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.92 parts

.PGMEA:1.11份 . PGMEA: 1.11 servings

<實施例17> <Example 17>

.二氧化鈦分散液的製備2中製備的分散液:45.63份 . Dispersion prepared in Preparation 2 of titanium dioxide dispersion: 45.63 parts

.上述黏合劑聚合物(B-1)40質量%PGMEA溶液:42.48份 . The above binder polymer (B-1) 40% by mass PGMEA solution: 42.48 parts

.聚合性單體(季戊四醇四丙烯酸酯):5.93份 . Polymerizable monomer (pentaerythritol tetraacrylate): 5.93 parts

(新中村化學工業股份有限公司製造,A-TMMT) (Manufactured by Shin-Nakamura Chemical Industry Co., Ltd., A-TMMT)

.聚合起始劑(K-2):2.84份 . Polymerization initiator (K-2): 2.84 parts

.矽烷偶合劑(N-2-(胺基甲基乙基)-3-胺基丙基甲基二甲氧基矽烷)(10%環己酮溶液):0.47份 . Decane coupling agent (N-2-(aminomethylethyl)-3-aminopropylmethyldimethoxydecane) (10% cyclohexanone solution): 0.47 parts

.聚合抑制劑(對甲氧基苯酚):0.01份 . Polymerization inhibitor (p-methoxyphenol): 0.01 parts

.界面活性劑(迪愛生(DIC)公司製造,美佳法(Megafac)F-781F)1質量%PGMEA溶液:0.90份 . Surfactant (manufactured by Dixon (DIC), Megafac F-781F) 1% by mass PGMEA solution: 0.90 parts

.PGMEA:1.74份 . PGMEA: 1.74

[白色硬化膜的形成(膜厚為10.0μm)] [Formation of white cured film (film thickness: 10.0 μm)]

關於膜厚為10.0μm的白色硬化膜的形成,除了獲得膜厚為10.0μm的塗佈膜後獲得膜厚為10.0μm的白色硬化膜以外,與[白色硬化膜的形成(膜厚為4.0μm)]同樣地獲得膜厚為10.0μm的白色硬化膜。 With respect to the formation of a white cured film having a film thickness of 10.0 μm, a white cured film having a film thickness of 10.0 μm was obtained in addition to a coating film having a film thickness of 10.0 μm, and [formation of a white cured film (film thickness: 4.0 μm) )] A white cured film having a film thickness of 10.0 μm was obtained in the same manner.

[圖案形成(膜厚為10.0μm)] [Pattern formation (film thickness: 10.0 μm)]

利用旋塗法將上述白色感光性樹脂組成物塗佈於鈉玻璃(100 mm×100mm平方,厚度為0.7mm)上,其後於熱板上以100℃加熱2分鐘而獲得膜厚為10.0μm的塗佈膜。隔著具有多個直徑為50μm的圓形圖案的遮罩,利用牛尾(Ushio)電機(股)製造的超高壓水銀燈「USH-500BY」,以1000mJ/cm2對上述塗佈膜進行曝光。 The white photosensitive resin composition was applied onto a soda glass (100 mm × 100 mm square, thickness: 0.7 mm) by a spin coating method, and then heated at 100 ° C for 2 minutes on a hot plate to obtain a film thickness of 10.0 μm. Coating film. The coating film was exposed at 1000 mJ/cm 2 using an ultrahigh pressure mercury lamp "USH-500BY" manufactured by Ushio motor (manufacturing) through a mask having a plurality of circular patterns having a diameter of 50 μm.

對其使用鹼性顯影液(CD-2060)(富士軟片電子材料(FUJI FILM Electronic Materials)(股)製造),於室溫下浸置顯影30秒鐘後,進而利用旋轉花灑以純水進行20秒鐘淋洗。其後,進一步以純水進行水洗,然後藉由高速旋轉使基板乾燥,形成孔圖案。 Using an alkaline developer (CD-2060) (manufactured by FUJI FILM Electronic Materials Co., Ltd.), it was immersed and developed at room temperature for 30 seconds, and then further rotated with pure water using a rotary shower. Rinse in 20 seconds. Thereafter, the substrate was further washed with pure water, and then the substrate was dried by high-speed rotation to form a hole pattern.

根據下述評價基準,對孔徑為50μm的孔圖案分別評價圖案形成性。 The pattern formation property was evaluated for each of the hole patterns having a pore diameter of 50 μm according to the following evaluation criteria.

圖案形成性: Pattern formation:

1.未形成圖案。 1. No pattern is formed.

2.有大量殘渣,圖案形狀差。 2. There are a lot of residues and the shape of the pattern is poor.

3.有少許殘渣,但圖案形狀尚可。 3. There is a little residue, but the shape of the pattern is acceptable.

4.有少許殘渣,但清晰地形成圖案。 4. There is a little residue, but the pattern is clearly formed.

5.無殘渣且清晰地形成圖案。 5. No residue and clear patterning.

將關於實施例8、實施例11~實施例17的白色感光性樹脂組成物的聚合物含量(固體成分中的黏合劑聚合物(A)及分散劑的總含量)與解析度的關係示於下述表2中。 The relationship between the polymer content (the total content of the binder polymer (A) and the dispersant in the solid component) and the resolution of the white photosensitive resin composition of Example 8 and Example 11 to Example 17 is shown in Table 2 below.

[表2] [Table 2]

由上述表2所示的實施例8、實施例11~實施例17的 白色感光性樹脂組成物的結果明確得知,均於聚合物含量在白色感光性樹脂組成物的總固體成分中為24質量%~46質量%時,顯示出良好的解析度。 From the eighth embodiment, the eleventh embodiment to the seventeenth embodiment shown in Table 2 above As a result of the white photosensitive resin composition, it was found that the polymer content was 24% by mass to 46% by mass based on the total solid content of the white photosensitive resin composition, and showed good resolution.

進而得知,於膜厚為4μm的情況下,於聚合物含量在白色感光性樹脂組成物的總固體成分中為24質量%~42質量%時,顯示出特別良好的解析度。另外得知,於膜厚為10μm的情況下,於聚合物含量在白色感光性樹脂組成物的總固體成分中為35質量%~45質量%時,顯示出特別良好的解析度。 Further, when the film thickness is 4 μm, the polymer content is particularly preferably 24% by mass to 42% by mass based on the total solid content of the white photosensitive resin composition. In addition, when the film thickness is 10 μm, the polymer content is from 35% by mass to 45% by mass based on the total solid content of the white photosensitive resin composition, and particularly excellent resolution is exhibited.

另外得知,不含防著色劑的實施例17的白色感光性樹脂組成物亦顯示出良好的解析度。 Further, it was found that the white photosensitive resin composition of Example 17 containing no anti-coloring agent exhibited good resolution.

再者,對於除了不含防著色劑以外,組成與實施例8、實施例12~實施例16的白色感光性樹脂組成物相同的白色感光性樹脂組成物,與實施例8、實施例12~實施例16同樣地形成白色硬化膜,並對圖案形成進行評價,結果可獲得於聚合物含量在白色感光性 樹脂組成物的總固體成分中為24質量%~46質量%時顯示出良好的解析度的結果,於膜厚為4μm的情況下,可獲得於聚合物含量在白色感光性樹脂組成物的總固體成分中為24質量%~42質量%時顯示出特別良好的解析度的結果,另外,於膜厚為10μm的情況下,可獲得於聚合物含量在白色感光性樹脂組成物的總固體成分中為35質量%~45質量%時顯示出特別良好的解析度的結果。 Further, the white photosensitive resin composition having the same composition as that of the white photosensitive resin compositions of Example 8 and Examples 12 to 16 except for the absence of the coloring preventive agent, and Example 8 and Example 12 were used. In Example 16, a white cured film was formed in the same manner, and pattern formation was evaluated, and as a result, the polymer content was obtained in white sensitivity. When the total solid content of the resin composition is from 24% by mass to 46% by mass, a good resolution is obtained. When the film thickness is 4 μm, the total amount of the polymer photosensitive resin composition in the white can be obtained. When the solid content is 24% by mass to 42% by mass, a particularly good resolution is obtained, and when the film thickness is 10 μm, the total solid content of the white photosensitive resin composition in the polymer content can be obtained. When it is 35 mass % -45 mass %, it shows the result of the especially favorable resolution.

Claims (26)

一種白色感光性樹脂組成物,含有(A)黏合劑聚合物、(B)聚合性單體、(C)聚合起始劑、(D)平均粒徑為100nm以上的二氧化鈦粒子及(E)防著色劑,其中上述聚合起始劑(C)為下述通式(A)所表示的肟酯系化合物, 上述通式(A)中,R1、R2及R3分別獨立地表示一價取代基。 A white photosensitive resin composition comprising (A) a binder polymer, (B) a polymerizable monomer, (C) a polymerization initiator, (D) titanium oxide particles having an average particle diameter of 100 nm or more, and (E) a coloring agent, wherein the polymerization initiator (C) is an oxime ester compound represented by the following formula (A), In the above formula (A), R 1 , R 2 and R 3 each independently represent a monovalent substituent. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中二氧化鈦(D)的平均粒徑為180nm以上。 The white photosensitive resin composition according to claim 1, wherein the titanium dioxide (D) has an average particle diameter of 180 nm or more. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中,於白色感光性樹脂組成物的固體成分中,二氧化鈦(D)的含量為35質量%以上。 The white photosensitive resin composition according to the first aspect of the invention, wherein the content of the titanium dioxide (D) in the solid content of the white photosensitive resin composition is 35 mass% or more. 如申請專利範圍第2項所述的白色感光性樹脂組成物,其中,於白色感光性樹脂組成物的固體成分中,二氧化鈦(D)的含量為35質量%以上。 The white photosensitive resin composition according to the second aspect of the invention, wherein the content of the titanium dioxide (D) in the solid content of the white photosensitive resin composition is 35 mass% or more. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中上述防著色劑(E)為酚化合物。 The white photosensitive resin composition according to claim 1, wherein the coloring preventive agent (E) is a phenol compound. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中上述防著色劑(E)為於酚性羥基的鄰位上具有取代基的酚化合物。 The white photosensitive resin composition according to claim 1, wherein the coloring preventive agent (E) is a phenol compound having a substituent in the ortho position of the phenolic hydroxyl group. 如申請專利範圍第1項所述的白色感光性樹脂組成物,更含 有分散劑,並且於上述白色感光性樹脂組成物的固體成分中,上述黏合劑聚合物(A)與上述分散劑的總含量為24質量%以上、46質量%以下。 The white photosensitive resin composition as described in claim 1 of the patent application, In the solid content of the white photosensitive resin composition, the total content of the binder polymer (A) and the dispersant is 24% by mass or more and 46% by mass or less. 如申請專利範圍第4項所述的白色感光性樹脂組成物,更含有分散劑,並且於上述白色感光性樹脂組成物的固體成分中,上述黏合劑聚合物(A)與上述分散劑的總含量為24質量%以上、46質量%以下。 The white photosensitive resin composition according to claim 4, further comprising a dispersing agent, and the total of the binder polymer (A) and the dispersing agent in the solid component of the white photosensitive resin composition The content is 24% by mass or more and 46% by mass or less. 如申請專利範圍第7項或第8項所述的白色感光性樹脂組成物,其中於上述白色感光性樹脂組成物的固體成分中,上述黏合劑聚合物(A)與上述分散劑的總含量為30質量%以上、46質量%以下。 The white photosensitive resin composition according to Item 7 or Item 8, wherein the total content of the binder polymer (A) and the dispersant is the solid content of the white photosensitive resin composition. It is 30% by mass or more and 46% by mass or less. 如申請專利範圍第7項或第8項所述的白色感光性樹脂組成物,其中上述分散劑為具有吸附部位的高分子分散劑。 The white photosensitive resin composition according to claim 7 or 8, wherein the dispersing agent is a polymer dispersing agent having an adsorption site. 如申請專利範圍第10項所述的白色感光性樹脂組成物,其中上述吸附部位為酸系吸附部位。 The white photosensitive resin composition according to claim 10, wherein the adsorption site is an acid adsorption site. 如申請專利範圍第11項所述的白色感光性樹脂組成物,其中上述酸系吸附部位為含磷原子的基團或羧酸基的至少一者。 The white photosensitive resin composition according to claim 11, wherein the acid-based adsorption site is at least one of a phosphorus atom-containing group or a carboxylic acid group. 如申請專利範圍第12項所述的白色感光性樹脂組成物,其中上述高分子分散劑為具有含磷原子的基團作為酸系吸附部位的高分子分散劑,且上述高分子分散劑為索努帕斯(SOLSPERSE)26000、索努帕斯36000或索努帕斯41000。 The white photosensitive resin composition according to claim 12, wherein the polymer dispersant is a polymer dispersant having a group containing a phosphorus atom as an acid-based adsorption site, and the polymer dispersant is a polymer dispersant. SOSOPERS 26000, Sonupas 36000 or Sonupas 41000. 如申請專利範圍第10項所述的白色感光性樹脂組成物, 其中上述高分子分散劑是由下述通式(1)所表示, 上述通式(1)中,R1表示(m+n)價的連結基,R2表示單鍵或二價連結基;A1表示一價取代基,上述一價取代基具有至少一種選自由以下基團所組成的組群中的基團:酸基、脲基、胺基甲酸酯基、含配位性氧原子的基團、含鹼性氮原子的基團、烷氧基羰基、烷基胺基羰基、羧酸鹽基、磺醯胺基、雜環基、烷氧基矽烷基、環氧基、異氰酸酯基及羥基;n個A1及R2分別可相同亦可不同;m表示8以下的正數,n表示1~9,m+n滿足3~10;P1表示聚合物鏈;m個P1可相同亦可不同。 The white photosensitive resin composition according to claim 10, wherein the polymer dispersant is represented by the following formula (1), In the above formula (1), R 1 represents a (m+n) valent linking group, R 2 represents a single bond or a divalent linking group; A 1 represents a monovalent substituent, and the above monovalent substituent has at least one selected from the group consisting of a group in the group consisting of an acid group, a urea group, a urethane group, a group having a coordinating oxygen atom, a group containing a basic nitrogen atom, an alkoxycarbonyl group, An alkylaminocarbonyl group, a carboxylate group, a sulfonylamino group, a heterocyclic group, an alkoxyalkyl group, an epoxy group, an isocyanate group, and a hydroxyl group; n of A 1 and R 2 may be the same or different; A positive number of 8 or less is represented, n represents 1 to 9, m+n satisfies 3 to 10, and P 1 represents a polymer chain; m of P 1 may be the same or different. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中上述黏合劑聚合物(A)含有具有羧基的單體。 The white photosensitive resin composition according to claim 1, wherein the binder polymer (A) contains a monomer having a carboxyl group. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中上述黏合劑聚合物(A)含有具有環氧基的單體。 The white photosensitive resin composition according to claim 1, wherein the binder polymer (A) contains a monomer having an epoxy group. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中上述黏合劑聚合物(A)含有具有自由基聚合性雙鍵的單體。 The white photosensitive resin composition according to claim 1, wherein the binder polymer (A) contains a monomer having a radical polymerizable double bond. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其中上述黏合劑聚合物(A)含有具有由下述通式(ED)所表示的化合物的單體成分, 上述通式(ED)中,R1及R2分別獨立地表示氫原子或可具有取代基的碳數1~25的烴基。 The white photosensitive resin composition according to claim 1, wherein the binder polymer (A) contains a monomer component having a compound represented by the following formula (ED). In the above formula (ED), R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. 如申請專利範圍第18項所述的白色感光性樹脂組成物,其中上述黏合劑聚合物(A)的酸值為50mgKOH/g~400mgKOH/g。 The white photosensitive resin composition according to claim 18, wherein the binder polymer (A) has an acid value of from 50 mgKOH/g to 400 mgKOH/g. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其可形成於265℃下加熱15分鐘前後的色差△E*ab為3以下的白色硬化膜。 The white photosensitive resin composition according to claim 1, which can be formed into a white cured film having a color difference ΔE*ab of 3 or less before and after heating at 265 ° C for 15 minutes. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其可形成於265℃下加熱15分鐘前後的色差△E*ab為2以下的白色硬化膜。 The white photosensitive resin composition according to the first aspect of the invention, which is capable of forming a white cured film having a color difference ΔE*ab of 2 or less before and after heating at 265 ° C for 15 minutes. 如申請專利範圍第1項所述的白色感光性樹脂組成物,其可形成具有孔徑為50μm以下的孔圖案的白色硬化膜。 The white photosensitive resin composition according to the first aspect of the invention, which is capable of forming a white cured film having a pore pattern having a pore diameter of 50 μm or less. 一種白色感光性樹脂組成物,含有(A)黏合劑聚合物、(B)聚合性單體、(C)聚合起始劑、(D)平均粒徑為100nm以上的二氧化鈦粒子及分散劑,並且於上述白色感光性樹脂組成物的固體成分中,上述黏合劑聚合物(A)與上述分散劑的總含量為24質量%~46質量%,且上述聚合起始劑(C)為下述通式(A)所表示的肟酯系化合物, 上述通式(A)中,R1、R2及R3分別獨立地表示一價取代基。 A white photosensitive resin composition comprising (A) a binder polymer, (B) a polymerizable monomer, (C) a polymerization initiator, (D) titanium oxide particles having an average particle diameter of 100 nm or more, and a dispersing agent, and In the solid content of the white photosensitive resin composition, the total content of the binder polymer (A) and the dispersant is 24% by mass to 46% by mass, and the polymerization initiator (C) is as follows. An oxime ester compound represented by the formula (A), In the above formula (A), R 1 , R 2 and R 3 each independently represent a monovalent substituent. 如申請專利範圍第23項所述的白色感光性樹脂組成物,其中於上述白色感光性樹脂組成物的固體成分中,上述黏合劑聚合物(A)與上述分散劑的總含量為30質量%~46質量%。 The white photosensitive resin composition according to claim 23, wherein the total content of the binder polymer (A) and the dispersant is 30% by mass in the solid content of the white photosensitive resin composition. ~46% by mass. 一種白色硬化膜,其是使用如申請專利範圍第1項所述的白色感光性樹脂組成物所形成的白色硬化膜。 A white cured film which is a white cured film formed using the white photosensitive resin composition as described in claim 1 of the patent application. 一種白色圖案的製造方法,包括以下步驟:於基板上塗佈如申請專利範圍第1項所述的白色感光性樹脂組成物而形成白色膜的步驟;隔著遮罩對上述白色膜進行曝光的步驟;以及對曝光後的上述白色膜進行顯影而形成白色圖案的步驟。 A method for producing a white pattern, comprising the steps of: coating a white photosensitive resin composition according to claim 1 on a substrate to form a white film; and exposing the white film through a mask And a step of developing the exposed white film to form a white pattern.
TW102141553A 2012-11-16 2013-11-15 White photosensitive resin composition, white hardened film, method for manufacturing white pattern TWI600693B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012252633 2012-11-16
JP2013146905 2013-07-12

Publications (2)

Publication Number Publication Date
TW201420659A TW201420659A (en) 2014-06-01
TWI600693B true TWI600693B (en) 2017-10-01

Family

ID=50731085

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102141553A TWI600693B (en) 2012-11-16 2013-11-15 White photosensitive resin composition, white hardened film, method for manufacturing white pattern

Country Status (3)

Country Link
JP (1) JP6126975B2 (en)
TW (1) TWI600693B (en)
WO (1) WO2014077171A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6448447B2 (en) * 2015-04-07 2019-01-09 日本化薬株式会社 White active energy ray-curable resin composition
JP6553439B2 (en) * 2015-07-28 2019-07-31 株式会社日本触媒 Curable resin composition
JP2017044976A (en) * 2015-08-28 2017-03-02 三洋化成工業株式会社 Photosensitive resin composition
WO2017056901A1 (en) * 2015-09-29 2017-04-06 富士フイルム株式会社 Composition, cured film, pattern, pattern manufacturing method, optical sensor, and imaging element
JP6717857B2 (en) 2016-02-02 2020-07-08 富士フイルム株式会社 Membrane manufacturing method
KR102134138B1 (en) 2016-03-14 2020-07-15 후지필름 가부시키가이샤 Composition, film, cured film, optical sensor and method for manufacturing film
TWI736646B (en) * 2016-07-15 2021-08-21 日商富士軟片股份有限公司 Laminated body, set, manufacturing method of laminated body and optical sensor
JP6630754B2 (en) * 2017-02-16 2020-01-15 住友化学株式会社 Curable resin composition, cured film and display device
JP6761896B2 (en) 2017-03-29 2020-09-30 富士フイルム株式会社 Structure and optical sensor
US11294284B2 (en) * 2018-07-17 2022-04-05 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition and pattern forming process
JPWO2020262270A1 (en) 2019-06-27 2020-12-30
CN114450098B (en) 2019-09-26 2023-05-02 富士胶片株式会社 Method for manufacturing heat conductive layer, method for manufacturing laminate, and method for manufacturing semiconductor device
WO2021199748A1 (en) 2020-03-30 2021-10-07 富士フイルム株式会社 Composition, film, and optical sensor
JP7211611B2 (en) * 2021-02-19 2023-01-24 互応化学工業株式会社 Photosensitive resin composition, dry film, solder resist and printed wiring board
JPWO2022196599A1 (en) 2021-03-19 2022-09-22
EP4410855A1 (en) 2021-09-29 2024-08-07 FUJIFILM Corporation Composition, resin, film and optical sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011213828A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Curable resin composition and dry film and printed wiring board using the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007314617A (en) * 2006-05-24 2007-12-06 Toyo Ink Mfg Co Ltd Vinyl copolymer and method for producing the same, and pigment composition using the same
JP2010197952A (en) * 2009-02-27 2010-09-09 Sekisui Chem Co Ltd Photosensitive composition and solder resist composition
JP5377021B2 (en) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 Curable resin composition, dry film and printed wiring board using the same
JP5434620B2 (en) * 2010-01-19 2014-03-05 富士ゼロックス株式会社 White toner for developing electrostatic image, electrostatic image developer, toner cartridge, process cartridge, and image forming apparatus
JP2011170050A (en) * 2010-02-17 2011-09-01 Taiyo Holdings Co Ltd Solder resist composition and printed circuit board
JP5645446B2 (en) * 2010-03-31 2014-12-24 太陽ホールディングス株式会社 Photocurable resin composition
WO2011161817A1 (en) * 2010-06-25 2011-12-29 リケンテクノス株式会社 Coating material and primer using the same, ink for ink-jet
JP2012174929A (en) * 2011-02-22 2012-09-10 Techno Polymer Co Ltd Backside protective film for solar battery, and solar battery module
JP5745886B2 (en) * 2011-02-16 2015-07-08 株式会社カネカ Novel white photosensitive resin composition and use thereof
JP5626009B2 (en) * 2011-02-25 2014-11-19 富士ゼロックス株式会社 Image forming method and image forming apparatus
JP5858740B2 (en) * 2011-11-15 2016-02-10 株式会社カネカ Novel photosensitive resin composition preparation kit and use thereof
JP2013205552A (en) * 2012-03-28 2013-10-07 Fujifilm Corp Photosensitive resin composition, photosensitive laminate, flexible circuit board and method for forming permanent pattern
JP5832973B2 (en) * 2012-08-28 2015-12-16 株式会社タムラ製作所 White active energy ray-curable resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011213828A (en) * 2010-03-31 2011-10-27 Taiyo Holdings Co Ltd Curable resin composition and dry film and printed wiring board using the same

Also Published As

Publication number Publication date
TW201420659A (en) 2014-06-01
JP2015034961A (en) 2015-02-19
JP6126975B2 (en) 2017-05-10
WO2014077171A1 (en) 2014-05-22

Similar Documents

Publication Publication Date Title
TWI600693B (en) White photosensitive resin composition, white hardened film, method for manufacturing white pattern
KR101965175B1 (en) Photosensitive composition, grey cured film using same, grey pixel, and solid state imaging element
TWI634144B (en) Infrared ray shielding composition, infrared ray shielding layer, infrared ray cut filter, camera module
TWI585134B (en) Dispersion composition and method of manufacturing the same, curable composition using the same, transparent film, micro lens, and solid-state image sensing device
JP5898887B2 (en) Composition, and transparent film, microlens, solid-state imaging device, method for manufacturing transparent film, method for manufacturing microlens, and method for manufacturing solid-state imaging device using the same
TW201431682A (en) Curable resin composition for forming infrared ray reflective film, infrared ray reflective film and method for manufacturing the same, and infrared ray cut filter and solid-state imaging device using the same
KR20160102276A (en) Coloring composition, and cured film, color filter, pattern-forming method, method for producing color filter, solid state imaging element, image display device and dye polymer using coloring composition
JP5894943B2 (en) Dispersion composition, curable composition using the same, transparent film, microlens, method for producing microlens, and solid-state imaging device
JP5934682B2 (en) Curable composition for forming microlenses or undercoat film for color filter, transparent film, microlens, solid-state imaging device, and method for producing curable composition
TWI534188B (en) Dispersion composition, curable composition, transparent film, microlens and solid-state image sensing device using the same, method for manufacturing transparent film, method for manufacturing microlens and method for manufacturing solid-state image sen
KR101678473B1 (en) Method for producing color filter
TW201809152A (en) Composition, cured film, color filter, light-blocking film, solid-state imaging device and image display device
JP5894944B2 (en) Compound and dispersion composition
KR20150126681A (en) Composition for forming far-infrared radiation shielding layer
TW201533535A (en) Radiation-sensitive composition, method for manufacturing radiation-sensitive composition, cured film, color filter, method for manufacturing color filter, method of forming patterns, solid-state imaging sensing device, and image display device
JP6598868B2 (en) Composition, cured film, pattern, pattern manufacturing method, optical sensor, and imaging device