TWI600137B - Method of manufacturing for light emitting diode lamp - Google Patents

Description

Light-emitting diode lamp string set manufacturing method

The invention relates to a light emitting diode light string group technology, in particular to a light emitting diode light string group manufacturing method.

Press, when there is a set of the above-mentioned light-emitting diode string, the operator must carefully set the LEDs in the order of address encoding; for example, a light-emitting diode with address code 01 must be set In the first position of each of the light-emitting diodes, the light-emitting diode having the address code of 02 must be disposed at the second position of each of the light-emitting diodes, and so on. Therefore, when the user designs the lighting command (where the lighting command includes a plurality of respective lighting signals), each of the LEDs can be driven to emit light correctly according to the user's conceptual order. Therefore, it is very important to set each of the light-emitting diodes in the order of address encoding; the order of setting the light-emitting diodes with address codes cannot be erroneous.

In the manufacturing process of the existing manufacturing equipment, if the LED is assembled with the address coded LED, since there are about 20 LEDs on one LED string, the current feeding tray Up to 4~7 or so is the limit. The LEDs on each feeding tray have different address codes. If more than 20 LEDs must be used in conjunction with the LED array. , more feed trays are needed, which will inevitably make the equipment too large and affect the factory space.

On the other hand, since the address codes of the single light-emitting diodes on each of the light-emitting diode strings are different, and the factory production is continuous, therefore, if the light-emitting diodes are installed during fabrication, There is no way to determine the address code of the body one by one, which will result in a lot of operation time and cost burden when the latter product is verified.

In view of the above, the inventors of the present invention have made great efforts to solve the above problems in view of the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of improvement of the present inventors.

An object of the present invention is to provide a method for manufacturing a light-emitting diode lamp string group, which can reduce the situation in which each light-emitting diode is mis-planted, thereby improving production yield and production efficiency.

In order to achieve the above object, the present invention provides a method for manufacturing a light-emitting diode lamp string, the steps comprising: a) placing a plurality of light-emitting diodes in a vibration disk, each of which has a driving body; a wafer and an illuminating wafer; b) transferring each of the illuminating diodes to a lamp carousel, the lamp carousel positioning and rotating each of the illuminating diodes; c) using a certain code device for the lamp carousel Each of the light-emitting diodes transferred is subjected to a code process one by one, the drive chip has a bit address code, and the address code of each of the light-emitting diodes is different; d) one wire is passed through The wire device is guided to a wire turntable, which will clamp the wire and rotate; e) strip the wire with a stripping mechanism to expose the wire to a copper wire; And f) combining the copper wire with each of the light emitting diodes in accordance with the calibrating procedure of step c) to form a light emitting diode string.

The present invention also has the following effects. With the manufacturing method of the present invention, the feeding tray can be operated in only one set, and the confirmation can be completed at the initial stage of production, thereby reducing the working time in the latter stage and the verification cost.

10‧‧‧ machine base

30‧‧‧Light conveying equipment

31‧‧‧Vibration plate

32‧‧‧Transportation agencies

33‧‧‧ positive and negative test device

34‧‧‧Fixed device

35‧‧‧Flipping device

36‧‧‧Measurement device

37‧‧‧Light turntable

50‧‧‧Line conveyor equipment

51‧‧‧Incoming device

52‧‧‧ Pushing mechanism

53‧‧‧ Pulling mechanism

54‧‧‧Thread cutting mechanism

55‧‧‧Wire stripping mechanism

56‧‧‧Plastic tube installation

57‧‧‧Insert heat shrinkable tube device

58‧‧‧Clamping device

59‧‧‧Opening and closing device

60‧‧‧ wire carousel

61‧‧‧ Threading device

70‧‧‧ welding mechanism

90‧‧‧Hot air blower

100‧‧‧Lighting diode string

110‧‧‧Signal Controller

120‧‧‧Wire

130‧‧‧Lighting diode

131‧‧‧Drive chip

1311‧‧‧ lines

1312‧‧‧ Address Code

132‧‧‧Lighting chip

133‧‧‧ positive terminal

134‧‧‧Negative terminal

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a combined plan view of a string manufacturing system to which the method of the present invention is applied.

Figure 2 is a schematic illustration of a light-emitting diode used in the method of the present invention.

3 is a schematic view of a light-emitting diode lamp string set manufactured by the method of the present invention.

The detailed description and technical content of the present invention are set forth in the accompanying drawings.

Referring to FIG. 1 , the present invention provides a method for manufacturing a light-emitting diode string assembly, which is manufactured by a string manufacturing system, which mainly includes a base 10 and a lamp conveying device 30. A wire conveying device 50, a welding mechanism 70 and a hot air fan 90, wherein the lamp conveying device 30 is installed in the right half region of the machine frame 10, the wire conveying device 50 is installed in the right half region of the machine frame 10, and the welding mechanism 70 is installed. In the intersection between the lamp transport device 30 and the wire transport device 50, the hot air blower 90 is disposed adjacent to the wire transport device 50 for continuous automated production.

The lamp conveying device 30 mainly comprises a vibrating plate 31, a transfer mechanism 32, a leveling device 33, a fixed code device 34, a polarity testing and turning device 35, a measuring device 36 and a lamp turntable 37, wherein the vibrating plate 31, The transfer mechanism 32, the leveling device 33, the fixing device 34, the polarity test and inversion device 35, and the damage measuring device 36 are arranged in the counterclockwise direction along the circumference of the lamp turntable 37 in the counterclockwise direction around the lamp turntable 37.

The wire conveying device 50 mainly comprises a wire feeding device 51, a wire pushing mechanism 52, a wire pulling mechanism 53, a wire threading mechanism 54, a wire stripping mechanism 55, a plastic pipe fitting device 56, and a set of heat shrinkable tube device. 57. A clamping device 58, an opening and closing device 59, a wire turntable 60 and a wire winding device 61, wherein the wire feeding device 51, the wire pushing mechanism 52, the wire pulling mechanism 53, the thread cutting mechanism 54, the wire stripping mechanism 55, the plastic The tube attachment device 56, the sleeved heat shrinkable tube device 57, the clamp device 58, the opening and closing device 59, and the thread winding device 61 are arranged in a clockwise direction along the circumference of the wire turntable 60 in a clockwise direction.

The method for manufacturing a light-emitting diode lamp string set of the invention comprises the following steps:

a) The plurality of LEDs 130 are placed in a vibrating plate 31. Each of the LEDs 130 has a driving chip 131 and an emitting chip 132. Referring to FIG. 2, each of the steps is illuminated. The diode 130 has a driving chip 131, an illuminating chip 132, a positive terminal 133 and a negative terminal 134. The driving chip 131 has a line 1311 and an address code 1312. Each of the above-described light-emitting diodes 130 is poured into the vibration disk 31, and the respective light-emitting diodes 130 are arranged in a neat arrangement by the vibration action of the vibration disk 31.

The driving chip 131 is used to drive the light emission of the light emitting chip 132, and the light emitting mode of the light emitting chip 132, such as flicker or color change, can be controlled by a program built in the driving chip 131.

b) transferring each of the light-emitting diodes 130 to a light turntable 37, which will position and rotate each of the light-emitting diodes 130; as shown in FIG. 1, this step utilizes a transfer machine The light-emitting diode 130 is clamped, and the clipped light-emitting diode 130 is placed in the cavity of the lamp turntable 37 to be positioned, and rotated by the lamp turntable 37 in the counterclockwise direction to drive each The light-emitting diodes 130 are transported in a rotating manner, and at the same time, the light-emitting diodes 130 are leveled by means of the leveling device 33.

c) a certain code program is performed one by one for each of the light-emitting diodes 130 transferred from the lamp turntable 37 by the fixed code device 34. The drive chip 131 has a bit address code 1312, and the address code of each of the light-emitting diodes 130 1312 is different; please refer to FIG. 1 , in this step, each of the light-emitting diodes 130 transferred by the lamp turntable 37 is subjected to a certain code (coding) program by the fixing device 34. The fixing program can be The address code 1312 is formed on the driving chip 131 in a firing manner, or may be a method of reading the address code 1312 for the driving chip 131 having the address code 1312, and each of the light emitting diodes The address codes 1312 of 130 are different; if each of the LEDs 130 meets the code-fixing procedure, the lamp turntable 37 will drive the LEDs 130 that conform to the code-setting procedure to the next process, and if not, will not The light-emitting diode 130 conforming to the code-fixing process performs a blanking recovery operation.

The fixing device 34 has a check table having a count value and a preset address code of the corresponding count value; the fixing program is the fixing device 34, and the number of the LED strings 100 is one. The limit value is used to count each of the light-emitting diodes 130 that perform the sizing process, and then use the count value to compare the preset address code in the checklist with the address code 1312 of the illuminating diode 130 that performs the sizing process. Check, if the preset address code matches the address code 1312, it is considered to be in accordance with the fixed code procedure; otherwise, if the preset address code does not match the address code 1312, it is considered to be inconsistent with the fixed code program. .

Further, the fixing device 34 has a memory unit, and the fixing program is the fixing device 34. The number of the LED strings 100 is an upper limit value, and the LEDs 130 for each of the fixing programs are performed. Counting and storing the address code 1312 of each of the light-emitting diodes 130 that conforms to the code-fixing process In the memory unit, when the address code 1312 of the LED 130 that performs the fixing process does not match the address code stored in the memory unit, it is regarded as conforming to the code fixing program, when the code is fixed. When the address 1312 of the light-emitting diode 130 of the program matches the address code stored in the memory unit, it is considered to be inconsistent with the fixed code program.

Further, the fixing device 34 has a burning function, and the fixing program is a fixing device 34 that uses the LED array 100 as an upper limit value, and counts each of the LEDs 130 that perform the fixing procedure. And each of the light-emitting diodes 130 is programmed to address 1312, and the address code 1312 of each of the light-emitting diodes is different.

Further, the sizing device 34 further has a counting unit.

After the fixing process of the address code 1312 is completed, the lamp turntable 37 is continuously rotated counterclockwise, thereby driving each of the light emitting diodes 130 to follow the workstations such as the polarity testing and turning device 35 and the damage detecting device 36. operation.

d) guiding a wire 120 to a wire turntable 60 via a wire feeding device 51, which will clamp the wire 120 and rotate it; see FIG. Guided into the wire turntable 60, and then rotated by the wire turntable 60 to drive the wire 120 through the push-wire mechanism 52, the wire pulling mechanism 53 and the tangential mechanism 54 to perform subsequent operations on the wire 120, wherein the wire turntable 60 is clockwise The rotary conveyance is rotated in the opposite direction to the rotation direction of the aforementioned lamp turntable 37.

e) stripping the electric wire 120 with a stripping mechanism 55 to expose the electric wire 120 to a copper wire; as shown in FIG. 1, in this step, the electric wire 120 is stripped by the stripping mechanism 55 to expose the electric wire 120. A copper wire is produced.

f) Combining the copper wire with each of the light-emitting diodes 130 conforming to the fixing procedure of step c) to form a light-emitting diode string set 100.

Further, the bonding process in this step may be completed by a bonding mechanism 70, or other bonding steps such as a soft-heading process may be used to achieve the same bonding step, wherein the soft-heading is referred to at one end of the wire 120 and The light-emitting diode unit 130 is inserted into the soft head by a device and is bonded to the copper wire. In this embodiment, the bonding is completed by using a soldering method, but the invention is not limited thereto.

Referring to FIG. 1 , in this step, each of the light-emitting diodes 130 is continuously conveyed by the lamp turntable 37, and the wire 120 is continuously conveyed by the wire turntable 60, and is conveyed on the light-emitting diode 130 and the wire 120 with the bare copper wire. When the position is to the position of the welding mechanism 70, the positive electrode terminal 133 and the negative electrode terminal 134 of the light-emitting diode 130 passing through the fixing process and the copper wires are welded and bonded by the welding mechanism 70, thereby producing a light-emitting diode lamp string. Group 100.

As shown in FIG. 3, the LED array 100 includes a signal controller 110, a wire 120, and a plurality of LED units 130. The signal controller 110 includes control of the power signal and the illumination signal.

After the completion of the welding operation, the LED tube assembly 100 is followed by a workstation such as a plastic tube mounting device 56, a heat shrink tube device 57, a clamping device 58, an opening and closing device 59, and a winding device 61. operation.

The method for manufacturing a light-emitting diode lamp string assembly of the present invention further comprises a step g), after the step f), performing the luminescence test on the light-emitting diode string unit 100 If at least one of the light-emitting diodes 130 is not lit, the replacement operation is performed by using the light-emitting diode 130 having no address code 1312, and a flash programming procedure is performed on the replaced light-emitting diode 130. will be The address code 1312 of the replaced light-emitting diode 130 is burned into the drive wafer 131 of the replaced light-emitting diode 130.

In summary, the manufacturing method of the LED array of the present invention can achieve the intended purpose of use, and solve the lack of the conventional, and because of the novelty and progress, fully meet the requirements of the invention patent application, To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the inventor.

100‧‧‧Lighting diode string

110‧‧‧Signal Controller

120‧‧‧Wire

130‧‧‧Lighting diode

Claims (8)

A method for manufacturing a light-emitting diode string assembly, comprising the steps of: a) placing a plurality of light-emitting diodes in a vibration disk, each of the light-emitting diodes having a driving chip and a light-emitting chip; b) each a light emitting diode is forwarded to a light turntable, the light turntable will position and rotate each of the light emitting diodes; c) each of the light emitting diodes transferred by the light turntable by a certain code device Performing a code process one by one, the driver chip has a bit address code, and the address code of each of the light emitting diodes is different, and if the code sequence is met, the lamp turntable drives the code that conforms to the code program The light-emitting diode enters the next process; if not, the light-emitting diode that does not meet the fixing procedure is subjected to a blanking recovery operation; d) a wire is guided to the first-line turntable via a wire feeding device, The wire carousel will hold the wire and rotate; e) strip the wire with a stripping mechanism to expose the wire to a copper wire; and f) match the copper wire with the code that meets step c) Each of the light emitting diodes of the program is knotted To prepare a light emitting diode strings. The method for manufacturing a light-emitting diode string set according to claim 1, wherein in step c), the fixing device has a checklist having a count value and a preset address corresponding to the count value. Encoding; the fixing program is that the fixing device uses the number of the LED strings as an upper limit value, and counts each of the LEDs that perform the fixing process, and then uses the counting value to compare The preset address code in the checklist is checked against the address code of the LED for performing the coder, and if the preset address code matches the address code value, it is deemed to be consistent. The fixing program; if the preset If the address code does not match the address coded value, it is considered not to conform to the code sequence. The method for manufacturing a light-emitting diode string set according to claim 1, wherein in step c), the fixing device has a memory unit, and the fixing program is the fixing device with the light-emitting diode string The number of groups is an upper limit value, and each of the light emitting diodes that perform the fixing process is counted, and the address of each of the light emitting diodes that meets the coded program is stored in the memory unit. Where the address code of the light-emitting diode that performs the codec process does not match the address code stored in the memory unit, and is deemed to conform to the code-fixing program when the code is performed. When the address code of the LED of the program matches the address code stored in the memory unit, it is deemed to be inconsistent with the code sequence. The method for manufacturing a light-emitting diode string set according to claim 1, wherein in the step c), the fixing device has a burning function, and the fixing program is the fixing device with the light-emitting diode string group For an upper limit value, the LEDs for each of the calibrating procedures are counted, and the address code is programmed for each of the illuminating diodes. The method for manufacturing a light-emitting diode string set according to claim 2, 3 or 4, wherein in step c), the fixing device further has a counting unit. The method for manufacturing a light-emitting diode string set according to claim 1, further comprising a step g), wherein the step g) performing a luminescence test on the LED string, if at least one of the When the light-emitting diode is not bright, the replacement operation is performed by using the light-emitting diode without the address code, and the replaced light-emitting diode is subjected to a burning process, and the light-emitting diode to be replaced is replaced. The address of the polar body is encoded into the drive wafer of the replaced light-emitting diode. The method for manufacturing a light-emitting diode string set according to claim 1, wherein in the step d), the rotation direction of the wire turntable is opposite to the rotation direction of the lamp turntable. The method for manufacturing a light-emitting diode string assembly according to claim 1, wherein in the step f), the bonding method is to solder the copper wire and each of the light-emitting diodes by a soldering mechanism.