TWI596953B - Sound recording module - Google Patents

Sound recording module Download PDF

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Publication number
TWI596953B
TWI596953B TW105103346A TW105103346A TWI596953B TW I596953 B TWI596953 B TW I596953B TW 105103346 A TW105103346 A TW 105103346A TW 105103346 A TW105103346 A TW 105103346A TW I596953 B TWI596953 B TW I596953B
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Taiwan
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sound
collecting
sound wave
wave
area
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TW105103346A
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Chinese (zh)
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TW201729605A (en
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小迪 王
洪銘佑
王文弘
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美律實業股份有限公司
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Priority to TW105103346A priority Critical patent/TWI596953B/en
Priority to US15/139,347 priority patent/US9860631B2/en
Publication of TW201729605A publication Critical patent/TW201729605A/en
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Publication of TWI596953B publication Critical patent/TWI596953B/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/342Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Multimedia (AREA)
  • Stereophonic Arrangements (AREA)

Description

錄音模組Recording module

本發明是有關於一種錄音模組,且特別是有關於一種具有良好的集音效果的錄音模組。The invention relates to a recording module, and in particular to a recording module with good sound collecting effect.

目前市售的喇叭多無法表現出自然的音場,其原因在於,自喇叭所放送出的聲波是先通過空氣傳播再到達人耳,接著依序通過耳廓與外耳而傳遞至耳鼓膜,最後被大腦神經所感知。在前述聲波傳遞的過程中,前述聲波會因人的耳廓、外耳道、頭蓋骨或肩部等干涉而產生折射、繞射或衍射等現象,使得音訊品質受到影響。At present, most of the commercially available speakers cannot express the natural sound field. The reason is that the sound waves emitted from the speakers are first transmitted through the air and then reach the human ear, and then passed through the auricle and the outer ear to the eardrum. Perceived by the brain's nerves. In the process of the aforementioned sound wave transmission, the sound wave may be refracted, diffracted or diffracted due to interference of the human auricle, the external auditory canal, the skull or the shoulder, and the audio quality is affected.

現有的作法是採用「仿真人頭(Dummy Head)」的雙聲道錄音方式來改善前述缺陷,此種錄音方式是將兩個微型全方向性麥克風放在仿真人頭的外耳道內,例如接近人耳鼓膜的位置。待收錄的聲波是在通過仿真的耳廓與外耳後傳遞至微型全方向性麥克風,且待收錄的聲波亦會受到仿真人頭的耳廓、外耳道、頭蓋骨或肩部等干涉,即真實地模擬人耳在聽到聲音時所受到的頭部相關傳輸函數(Head-related Transfer Function, HRTF)的影響。如此收錄所得的音訊於播放時,便能重現立體音效。然而,使用者必須隨身攜帶仿真人頭,方能即時收錄音訊以重現近乎人耳所聽到的聲音時,故操作上極為不便。The existing method is to use the "Dummy Head" two-channel recording method to improve the aforementioned defects. The recording method is to place two miniature omnidirectional microphones in the external auditory canal of the artificial head, for example, close to a person. The location of the eardrum. The sound waves to be recorded are transmitted to the micro omnidirectional microphone after passing through the simulated auricle and the outer ear, and the sound waves to be recorded are also interfered by the auricle, external auditory canal, skull or shoulder of the simulated human head, that is, the real simulation The influence of the head-related transfer function (HRTF) that the human ear receives when hearing the sound. The audio content thus recorded can reproduce the stereo sound when played. However, the user must carry the artificial head with him to receive the recording immediately to reproduce the sound heard by the human ear, so the operation is extremely inconvenient.

本發明提供一種錄音模組,其具有良好的集音效果。The invention provides a recording module which has a good sound collecting effect.

本發明提出一種錄音模組,其包括集聲空間、聲波進入口以及收音元件。集聲空間至少具有反射區塊。反射區塊分別與第一聲波聚集區及第二聲波聚集區相鄰。第一聲波聚集區呈虎口態樣,令其最深處界定有收音元件固定部。聲波進入口對應形成於第二聲波聚集區至少局部周側。收音元件設置於第一聲波聚集區之收音元件固定部。收音元件用以收錄進入集聲空間的音訊。The invention provides a recording module, which comprises a sound collecting space, an acoustic wave inlet port and a sound collecting component. The sound collecting space has at least a reflective block. The reflective blocks are adjacent to the first sound wave gathering region and the second sound wave gathering region, respectively. The first sound wave gathering area is in the shape of a tiger's mouth, so that the sound-receiving element fixing portion is defined at the deepest point. The sound wave inlet port is formed corresponding to at least a partial circumference side of the second sound wave gathering region. The sound pickup element is disposed at the sound pickup element fixing portion of the first sound wave gathering area. The radio component is used to record the audio entering the sound collection space.

在本發明的一實施例中,上述的錄音模組更包括集聲結構。集聲結構具有通孔,其中通孔貫穿第一聲波聚集區之收音元件固定部,且聲波進入口與通孔分別位於集聲空間的相對兩側。In an embodiment of the invention, the recording module further includes a sound collecting structure. The sound collecting structure has a through hole, wherein the through hole penetrates the fixing part of the sound receiving element of the first sound wave collecting area, and the sound wave inlet port and the through hole are respectively located on opposite sides of the sound collecting space.

在本發明的一實施例中,上述的錄音模組更包括殼體。集聲結構設置於殼體內,且集聲結構與殼體定義出集聲空間及聲波進入口。In an embodiment of the invention, the recording module further includes a housing. The sound collecting structure is disposed in the casing, and the sound collecting structure and the casing define a sound collecting space and an acoustic wave inlet port.

在本發明的一實施例中,上述的集聲結構與殼體進一步定義出聲波進入區。聲波進入區與第二聲波聚集區相鄰,且反射區塊位於聲波進入區與第二聲波聚集區之間。In an embodiment of the invention, the sound collecting structure and the housing further define an acoustic wave entry zone. The sound wave entering zone is adjacent to the second sound wave gathering zone, and the reflective block is located between the sound wave entering zone and the second sound wave gathering zone.

在本發明的一實施例中,上述的第一聲波聚集區與收音元件分別位於集聲結構的相對兩側,且通孔暴露出至少部分收音元件。In an embodiment of the invention, the first sound wave collecting area and the sound collecting element are respectively located on opposite sides of the sound collecting structure, and the through hole exposes at least part of the sound collecting element.

本發明提出另一種錄音模組,其包括第一集聲空間、第二集聲空間、第一聲波進入口、第二聲波進入口、第一收音元件以及第二收音元件。第一集聲空間至少具有第一反射區塊。第一反射區塊分別與第一聲波聚集區及第二聲波聚集區相鄰。第一聲波聚集區呈虎口態樣,令其最深處界定有第一收音元件固定部。第二集聲空間與第一集聲空間並列。第二集聲空間至少具有第二反射區塊。第二反射區塊分別與第三聲波聚集區及第四聲波聚集區相鄰。第三聲波聚集區呈虎口態樣,令其最深處界定有第二收音元件固定部,且第一收音元件固定部與第二收音元件固定部彼此相對。第一聲波進入口對應形成於第二聲波聚集區至少局部周側。第二聲波進入口對應形成於第四聲波聚集區至少局部周側,且第一聲波進入口與第二聲波進入口彼此相對。第一收音元件設置於第一聲波聚集區之第一收音元件固定部,第一收音元件用以收錄進入第一集聲空間的音訊。第二收音元件設置於第三聲波聚集區之第二收音元件固定部,第二收音元件用以收錄進入第二集聲空間的音訊。The invention provides another recording module, which comprises a first sound collecting space, a second sound collecting space, a first sound wave inlet port, a second sound wave inlet port, a first sound collecting element and a second sound collecting element. The first set of acoustic spaces has at least a first reflective block. The first reflective block is adjacent to the first sound wave gathering region and the second sound wave gathering region, respectively. The first sound wave gathering area is in the form of a tiger's mouth, so that the first sound receiving element fixing portion is defined at the deepest point. The second set of sound spaces is juxtaposed with the first set of sound spaces. The second set of acoustic spaces has at least a second reflective block. The second reflective block is adjacent to the third sound wave collecting area and the fourth sound wave collecting area, respectively. The third sound wave gathering region has a tiger mouth shape such that the second sound pickup element fixing portion is defined at the deepest point, and the first sound pickup element fixing portion and the second sound pickup element fixing portion are opposed to each other. The first acoustic wave inlet port is formed corresponding to at least a partial circumferential side of the second sound wave gathering region. The second acoustic wave inlet port is formed corresponding to at least a partial circumference side of the fourth sound wave gathering region, and the first sound wave inlet port and the second sound wave inlet port are opposed to each other. The first sound pickup component is disposed in the first sound pickup component fixing portion of the first sound wave gathering area, and the first sound pickup component is configured to receive the audio entering the first sound collection space. The second sound pickup component is disposed in the second sound pickup component fixing portion of the third sound wave gathering area, and the second sound pickup component is configured to receive the audio entering the second sound collecting space.

在本發明的一實施例中,上述的錄音模組更包括集聲結構。集聲結構具有第一通孔與相對於第一通孔的第二通孔。第一通孔貫穿第一聲波聚集區之第一收音元件固定部,且第一聲波進入口與第一通孔分別位於第一集聲空間的相對兩側。第二通孔貫穿第三聲波聚集區之第二收音元件固定部,且第二聲波進入口與第二通孔分別位於第二集聲空間的相對兩側。In an embodiment of the invention, the recording module further includes a sound collecting structure. The sound collecting structure has a first through hole and a second through hole opposite to the first through hole. The first through hole penetrates the first sound receiving element fixing portion of the first sound wave collecting area, and the first sound wave inlet port and the first through hole are respectively located on opposite sides of the first sound collecting space. The second through hole penetrates the second sound receiving element fixing portion of the third sound wave collecting area, and the second sound wave inlet port and the second through hole are respectively located on opposite sides of the second sound collecting space.

在本發明的一實施例中,上述的錄音模組更包括殼體。集聲結構設置於殼體內,且集聲結構與殼體定義出第一集聲空間、第一聲波進入口、第二集聲空間及第二聲波進入口。In an embodiment of the invention, the recording module further includes a housing. The sound collecting structure is disposed in the housing, and the sound collecting structure and the housing define a first sound collecting space, a first sound wave inlet port, a second sound collecting space, and a second sound wave inlet port.

在本發明的一實施例中,上述的集聲結構與殼體進一步定義出第一聲波進入區及第二聲波進入區。第一聲波進入區與第二聲波聚集區相鄰,且第一反射區塊位於第一聲波進入區與第二聲波聚集區之間。第二聲波進入區與第四聲波聚集區相鄰,且第二反射區塊位於第二聲波進入區與第四聲波聚集區之間。In an embodiment of the invention, the sound collecting structure and the housing further define a first sound wave entry zone and a second sound wave entry zone. The first acoustic wave entry zone is adjacent to the second acoustic wave accumulation zone, and the first reflective block is located between the first acoustic wave entry zone and the second acoustic wave accumulation zone. The second acoustic wave entry zone is adjacent to the fourth acoustic wave accumulation zone, and the second reflective block is located between the second acoustic wave entry zone and the fourth acoustic wave accumulation zone.

在本發明的一實施例中,上述的第一聲波聚集區與第一收音元件分別位於集聲結構的相對兩側,且第一通孔暴露出至少部分第一收音元件。第三聲波聚集區與第二收音元件分別位於集聲結構的相對兩側,且第二通孔暴露出至少部分第二收音元件。In an embodiment of the invention, the first sound wave collecting area and the first sound collecting element are respectively located on opposite sides of the sound collecting structure, and the first through hole exposes at least a part of the first sound collecting element. The third sound wave collecting area and the second sound collecting element are respectively located on opposite sides of the sound collecting structure, and the second through hole exposes at least part of the second sound collecting element.

基於上述,由於聲波傳輸距離的不同會使聲壓和相位產生差異,因此透過集聲空間的口徑自聲波進入口朝其最深處界(或稱收音元件固定部)漸縮及反射區塊的設計,便能控制進入集聲空間內的聲波的干涉,以具有良好的水平指向性並且消除雜訊。如此一來,透過本發明的錄音模組收錄所得的音訊於播放時,不僅能重現立體音效,亦能具有良好的音訊品質。Based on the above, since the sound wave and the phase are different due to the difference in the sound wave transmission distance, the aperture of the sound collecting space is tapered from the sound wave inlet port toward the deepest boundary (or the fixed portion of the sound pickup member) and the design of the reflective block. It is possible to control the interference of sound waves entering the sound collecting space to have good horizontal directivity and eliminate noise. In this way, the audio recorded by the recording module of the present invention can not only reproduce the stereo sound effect but also have good audio quality during playback.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

圖1A是本發明第一實施例的錄音模組的示意圖。圖1B是圖1A的錄音模組的俯視示意圖。請參考圖1A與圖1B,在本實施例中,錄音模組100包括第一集聲空間110、第一聲波進入口120以及第一收音元件130。第一集聲空間110至少具有第一反射區塊111。第一反射區塊111分別與第一聲波聚集區112及第二聲波聚集區113相鄰。第一聲波聚集區112呈虎口態樣,令其最深處界定有第一收音元件固定部114。第一聲波進入口120對應形成於第二聲波聚集區113至少局部周側。第一收音元件130設置於第一聲波聚集區112之第一收音元件固定部114。第一收音元件130用以收錄進入第一集聲空間110的音訊。1A is a schematic diagram of a recording module according to a first embodiment of the present invention. FIG. 1B is a top plan view of the recording module of FIG. 1A. Referring to FIG. 1A and FIG. 1B , in the embodiment, the recording module 100 includes a first sound collecting space 110 , a first sound wave inlet port 120 , and a first sound pickup element 130 . The first set of acoustic spaces 110 has at least a first reflective block 111. The first reflective block 111 is adjacent to the first acoustic wave collecting area 112 and the second sound wave collecting area 113, respectively. The first sound wave gathering region 112 has a tiger mouth shape such that the first sound pickup element fixing portion 114 is defined at the deepest point. The first acoustic wave inlet port 120 is formed correspondingly to at least a partial circumference side of the second sound wave gathering region 113. The first sound pickup element 130 is disposed at the first sound pickup element fixing portion 114 of the first sound wave gathering area 112. The first sound pickup component 130 is configured to record the audio entering the first sound collection space 110.

詳細而言,錄音模組100更包括集聲結構140及殼體150,集聲結構140設置於殼體150內,且第一集聲空間110及第一聲波進入口120例如是由集聲結構140與殼體150所定義。舉例來說,殼體150的周側可具有開口,透過集聲結構140可用以界定出屬於前述開口的一部分的第一聲波進入口120。第一聲波進入口120與第二聲波聚集區113相連通,其中第二聲波聚集區113位於第一聲波進入口120與第一聲波聚集區112之間,且第二聲波聚集區113與第一聲波聚集區112相連通。此外,第二聲波聚集區113與第一聲波聚集區112分別位於第一反射區塊111的相對兩側,且第一聲波聚集區112與收音元件130分別位於集聲結構140的相對兩側。In detail, the recording module 100 further includes a sound collecting structure 140 and a housing 150. The sound collecting structure 140 is disposed in the housing 150, and the first sound collecting space 110 and the first sound wave inlet port 120 are, for example, a sound collecting structure. 140 is defined with the housing 150. For example, the circumferential side of the housing 150 can have an opening through which the sound collecting structure 140 can be used to define a first acoustic wave inlet port 120 that is part of the aforementioned opening. The first acoustic wave inlet port 120 is in communication with the second sound wave gathering region 113, wherein the second sound wave collecting region 113 is located between the first sound wave inlet port 120 and the first sound wave gathering region 112, and the second sound wave gathering region 113 is first and The sound wave gathering regions 112 are in communication. In addition, the second sound wave collecting area 113 and the first sound wave collecting area 112 are respectively located on opposite sides of the first reflecting block 111, and the first sound wave collecting area 112 and the sound collecting element 130 are respectively located on opposite sides of the sound collecting structure 140.

在本實例中,第二聲波聚集區113的口徑自第一聲波進入口120朝第一聲波聚集區112漸縮,且第一聲波聚集區112的口徑自第二聲波聚集區113朝其最深處界(或稱第一收音元件固定部114)漸縮。前述最深處界係指第一聲波聚集區112中最遠離第一聲波聚集區112與第二聲波聚集區113相連處之所在。如圖1B所示,第一聲波聚集區112中相對靠近第二聲波聚集區113的口徑較第一聲波聚集區112中相對靠近其最深處界(或稱第一收音元件固定部114)的口徑為大,因而呈虎口態樣。另一方面,集聲結構140具有第一通孔141,其中第一通孔141貫穿第一聲波聚集區112之第一收音元件固定部114,且第一聲波進入口120與第一通孔141分別位於第一集聲空間110的相對兩側。In the present example, the aperture of the second acoustic wave collecting region 113 tapers from the first acoustic wave inlet 120 toward the first acoustic wave collecting region 112, and the diameter of the first acoustic wave collecting region 112 is from the second acoustic wave collecting region 113 toward the deepest portion thereof. The boundary (or the first sound pickup element fixing portion 114) is tapered. The aforementioned deepest boundary means that the first sound wave gathering region 112 is located farthest from the first sound wave gathering region 112 and the second sound wave gathering region 113. As shown in FIG. 1B, the aperture of the first acoustic wave collecting region 112 relatively close to the second acoustic wave collecting region 113 is closer to the innermost portion of the first acoustic wave collecting region 112 than the deepest boundary (or the first sound collecting member fixing portion 114). It is big, so it looks like a tiger. On the other hand, the sound collecting structure 140 has a first through hole 141, wherein the first through hole 141 penetrates the first sound receiving element fixing portion 114 of the first sound wave collecting region 112, and the first sound wave inlet port 120 and the first through hole 141 They are respectively located on opposite sides of the first collection sound space 110.

第一收音元件130例如是微型全方向性麥克風,其設置於殼體150內,且位於集聲結構140的一側。詳細而言,第一收音元件130與第一聲波聚集區112分別位於第一通孔141的相對兩側。因此,固定於第一聲波聚集區112之第一收音元件固定部114上的第一收音元件130的至少部分可暴露於第一通孔141。在其他實施例中,第一收音元件130對應於第一通孔141設置,但與第一聲波聚集區112之第一收音元件固定部114保持間隙,或者是設置於第一聲波聚集區112之第一收音元件固定部114上,且位於第一聲波聚集區112內。通常而言,第一收音元件130電性連接於電路板(未繪示),並透過電路板(未繪示)電性連接於音訊處理單元(未繪示),其中音訊處理單元(未繪示)透過電路板(未繪示)電性連接於音訊儲存單元(未繪示)。藉此,第一收音元件130收錄所得的音訊便能透過電路板(未繪示)傳輸至音訊處理單元(未繪示),並於音訊處理完成後透過電路板(未繪示)傳輸至音訊儲存單元(未繪示)加以儲存。The first sound pickup element 130 is, for example, a micro omnidirectional microphone disposed in the housing 150 and located on one side of the sound collecting structure 140. In detail, the first sound collecting element 130 and the first sound wave collecting area 112 are respectively located on opposite sides of the first through hole 141. Therefore, at least a portion of the first sound pickup element 130 fixed to the first sound pickup element fixing portion 114 of the first sound wave accumulation region 112 may be exposed to the first through hole 141. In other embodiments, the first sound pickup element 130 is disposed corresponding to the first through hole 141, but is spaced apart from the first sound pickup element fixing portion 114 of the first sound wave gathering area 112, or is disposed in the first sound wave gathering area 112. The first sound pickup element fixing portion 114 is located in the first sound wave gathering region 112. Generally, the first sound receiving component 130 is electrically connected to a circuit board (not shown), and is electrically connected to an audio processing unit (not shown) through a circuit board (not shown), wherein the audio processing unit (not shown) The display is electrically connected to an audio storage unit (not shown) through a circuit board (not shown). In this way, the audio collected by the first sound pickup unit 130 can be transmitted to an audio processing unit (not shown) through a circuit board (not shown), and transmitted to the audio through the circuit board (not shown) after the audio processing is completed. A storage unit (not shown) is stored.

承接上述,來自外界的聲波可自第一聲波進入口120進入第一集聲空間110,且聲波於第一集聲空間110內的傳輸路徑可概分如下:(1) 依序通過第二聲波聚集區113及第一聲波聚集區112,在未與集聲結構140接觸的情況下,通過第一聲波聚集區112後的聲波穿過第一通孔141而被第一收音元件130收錄;(2) 通過第二聲波聚集區113時,聲波與集聲結構140接觸,並自第一反射區塊111反射後穿過第一通孔141而被第一收音元件130收錄;(3) 通過第一聲波聚集區112時,聲波與集聲結構140接觸,並自第一反射區塊111反射後穿過第一通孔141而被第一收音元件130收錄。由於聲波傳輸距離的不同會使聲壓和相位產生差異,因此透過第一集聲空間110的口徑自第一聲波進入口120朝其最深處界(或稱第一收音元件固定部114)漸縮及第一反射區塊111的設計,便能控制進入第一集聲空間110內的聲波的干涉,以具有良好的水平指向性並且消除雜訊。如此一來,透過本實施例的錄音模組100收錄所得的音訊於播放時,不僅能重現立體音效,亦能具有良好的音訊品質。In response to the above, sound waves from the outside can enter the first sound collecting space 110 from the first sound wave inlet port 120, and the sound wave in the first sound collecting space 110 can be roughly divided as follows: (1) sequentially pass the second sound wave The sound collecting area 113 and the first sound wave collecting area 112 are not received by the sound collecting structure 140, and the sound waves passing through the first sound wave collecting area 112 pass through the first through hole 141 to be recorded by the first sound collecting element 130; 2) When passing through the second sound wave gathering region 113, the sound wave is in contact with the sound collecting structure 140, and is reflected by the first reflecting block 111 and passes through the first through hole 141 to be recorded by the first sound collecting element 130; (3) When a sound collecting region 112 is present, the sound wave is in contact with the sound collecting structure 140, and is reflected by the first reflecting block 111 and passes through the first through hole 141 to be recorded by the first sound pickup element 130. Since the difference in sound wave transmission distance causes a difference in sound pressure and phase, the diameter of the first sound collecting space 110 is tapered from the first sound wave inlet port 120 toward its deepest boundary (or the first sound pickup element fixing portion 114). And the design of the first reflective block 111 can control the interference of the sound waves entering the first sound collecting space 110 to have good horizontal directivity and eliminate noise. In this way, the audio recorded by the recording module 100 of the embodiment can not only reproduce the stereo sound but also have good audio quality during playback.

圖1C為極座標圖,其顯示人耳與第一實施例的錄音模組的水平指向測試結果。如圖1C所示,測試的聲波頻率為4千赫(4kHz),測試結果顯示錄音模組100的水平指向性與人耳的水平指向性的表現相近。1C is a polar plot showing the horizontal pointing test results of the human ear and the recording module of the first embodiment. As shown in FIG. 1C, the sound frequency of the test is 4 kHz (4 kHz), and the test results show that the horizontal directivity of the recording module 100 is similar to the horizontal directivity of the human ear.

值得一提的是,錄音模組100的殼體150可作為行動電子裝置的機殼的部分,以與行動電子裝置整合為一體。又或者是,將錄音模組100透過外接的方式組裝至行動電子裝置。由於錄音模組100可與行動電子裝置電性連接,因此錄音模組100收錄所得的音訊能直接傳輸至行動電子裝置,以透過行動電子裝置的揚聲器進行播放的動作。如此一來,錄音模組100不僅便於使用者隨身攜帶,其操作上也極為簡易。It is worth mentioning that the housing 150 of the recording module 100 can be used as a part of the casing of the mobile electronic device to be integrated with the mobile electronic device. Alternatively, the recording module 100 is assembled to the mobile electronic device by external connection. Since the recording module 100 can be electrically connected to the mobile electronic device, the audio recorded by the recording module 100 can be directly transmitted to the mobile electronic device for playing through the speaker of the mobile electronic device. In this way, the recording module 100 is not only convenient for the user to carry around, but also extremely simple in operation.

以下將列舉其他實施例以作為說明。在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。Other embodiments are listed below for illustration. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

圖2A是本發明第二實施例的錄音模組的示意圖。圖2B是圖2A的錄音模組的俯視示意圖。請參考圖2A與圖2B,本實施例的錄音模組100A與第一實施例的錄音模組100大致相似,兩者之間差異在於:集聲結構140a與殼體150進一步定義出第一聲波進入區115。第一聲波進入區115與第二聲波聚集區113相鄰,其中第一聲波進入區115及第二聲波聚集區113分別鄰接第一聲波進入口120a,且第一反射區塊111位於第一聲波進入區115與第二聲波聚集區113之間。詳細而言,第一集聲空間110及第一聲波進入口120a例如是由集聲結構140a與殼體150所定義,其中集聲結構140a與殼體150進一步定義出與第一反射區塊111相連接的第一延伸區塊116,且第一延伸區塊116與第一聲波進入區115相鄰。舉例來說,殼體150的周側可具有開口,透過集聲結構140a可用以界定出屬於前述開口的一部分的第一聲波進入口120a。相較於第一實施例的錄音模組100而言,本實施例的第一聲波進入口120a的開口面積較第一聲波進入口120的開口面積為大。2A is a schematic diagram of a recording module according to a second embodiment of the present invention. 2B is a top plan view of the recording module of FIG. 2A. Referring to FIG. 2A and FIG. 2B, the recording module 100A of the present embodiment is substantially similar to the recording module 100 of the first embodiment. The difference between the two is that the sound collecting structure 140a and the housing 150 further define the first sound wave. Enter zone 115. The first acoustic wave entering region 115 is adjacent to the second acoustic wave collecting region 113, wherein the first acoustic wave entering region 115 and the second acoustic wave collecting region 113 respectively abut the first acoustic wave inlet port 120a, and the first reflective segment 111 is located at the first acoustic wave The entry zone 115 is between the second acoustic wave accumulation zone 113. In detail, the first sound collecting space 110 and the first sound wave inlet port 120a are defined by the sound collecting structure 140a and the housing 150, for example, wherein the sound collecting structure 140a and the housing 150 are further defined with the first reflecting block 111. The first extension block 116 is connected, and the first extension block 116 is adjacent to the first acoustic wave entry region 115. For example, the circumferential side of the housing 150 can have an opening through which the sound collecting structure 140a can be used to define a first acoustic wave inlet port 120a that is part of the aforementioned opening. Compared with the recording module 100 of the first embodiment, the opening area of the first acoustic wave inlet 120a of the present embodiment is larger than the opening area of the first acoustic wave inlet 120.

圖3A是本發明第三實施例的錄音模組的示意圖。圖3B是圖3A的錄音模組的俯視示意圖。請參考圖3A與圖3B,本實施例的錄音模組100B與第一實施例的錄音模組100大致相似,兩者之間差異在於:錄音模組100B可透過集聲結構140b與殼體150定義出第一集聲空間110、第一聲波進入口120、第二集聲空間160及第二聲波進入口170,其中第一集聲空間110與第二集聲空間160由集聲結構140b分隔開來,而未相互連通。詳細而言,集聲結構140b可具有一中心軸線C,第一集聲空間110與第二集聲空間160對稱設置於中心軸線C的兩相對側,且第二聲波進入口170與第一聲波進入口120對稱設置於中心軸線C的兩相對側。第一聲波進入口120與第一集聲空間110相連通,且第二聲波進入口170與第二集聲空間160相連通。由於錄音模組100B包含有左右對稱的第一集聲空間110與第二集聲空間160,因此可收錄來自兩不同方向的音訊。特別注意的是,本發明並不限定錄音模組須包含有左右對稱的第一集聲空間與第二集聲空間,亦可僅包含第一集聲空間與第二集聲空間的其一。3A is a schematic diagram of a recording module in accordance with a third embodiment of the present invention. 3B is a top plan view of the recording module of FIG. 3A. Referring to FIG. 3A and FIG. 3B , the recording module 100B of the present embodiment is substantially similar to the recording module 100 of the first embodiment. The difference between the two is that the recording module 100B can pass through the sound collecting structure 140 b and the housing 150 . The first set of acoustic space 110, the first acoustic wave inlet 120, the second sound collection space 160, and the second acoustic wave inlet 170 are defined, wherein the first sound collection space 110 and the second sound collection space 160 are separated by the sound collection structure 140b. They are separated and not connected to each other. In detail, the sound collecting structure 140b may have a central axis C, the first sound collecting space 110 and the second sound collecting space 160 are symmetrically disposed on opposite sides of the central axis C, and the second sound wave inlet port 170 and the first sound wave The inlet port 120 is symmetrically disposed on opposite sides of the central axis C. The first acoustic wave inlet port 120 is in communication with the first sound collecting space 110, and the second sound wave inlet port 170 is in communication with the second sound collecting space 160. Since the recording module 100B includes the first sound collecting space 110 and the second sound collecting space 160 which are bilaterally symmetric, audio from two different directions can be recorded. It is to be noted that the present invention does not limit the recording module to include the first sound collection space and the second sound collection space, and may only include one of the first sound collection space and the second sound collection space.

在本實施例中,第二集聲空間160與第一集聲空間110並列。第二集聲空間160至少具有第二反射區塊161,其中第二反射區塊161分別與第三聲波聚集區162及第四聲波聚集區163相鄰。第三聲波聚集區163呈虎口態樣,令其最深處界定有第二收音元件固定部164,且第一收音元件固定部114與第二收音元件固定部164彼此相對。第二聲波進入口170對應形成於第四聲波聚集區163至少局部周側。另一方面,錄音模組100B可包括第二收音元件180,其中第二收音元件180設置於第三聲波聚集區162之第二收音元件固定部164,且第二收音元件180與第一收音元件130彼此相對。第二收音元件180用以收錄進入第二集聲空間160的音訊。In the embodiment, the second sound collecting space 160 is juxtaposed with the first sound collecting space 110. The second collection sound space 160 has at least a second reflection block 161, wherein the second reflection block 161 is adjacent to the third sound wave accumulation area 162 and the fourth sound wave accumulation area 163, respectively. The third sound wave collecting region 163 has a tiger mouth shape such that the second sound pickup element fixing portion 164 is defined at the deepest point, and the first sound pickup element fixing portion 114 and the second sound pickup element fixing portion 164 are opposed to each other. The second sound wave inlet port 170 is formed correspondingly to at least a partial circumference side of the fourth sound wave accumulation region 163. On the other hand, the recording module 100B may include a second sound pickup element 180, wherein the second sound pickup element 180 is disposed at the second sound pickup element fixing portion 164 of the third sound wave gathering area 162, and the second sound pickup element 180 and the first sound pickup element 130 are opposite each other. The second sound pickup component 180 is configured to record the audio entering the second sound collection space 160.

第四聲波聚集區163的口徑自第二聲波進入口170朝第三聲波聚集區162漸縮,且第三聲波聚集區162的口徑自第四聲波聚集區163朝其最深處界(或稱第二收音元件固定部164)漸縮。前述最深處界係指第三聲波聚集區162中最遠離第三聲波聚集區162與第四聲波聚集區163相連處之所在。如圖3B所示,第三聲波聚集區162中相對靠近第四聲波聚集區163的口徑較第三聲波聚集區162中相對靠近其最深處界(或稱第二收音元件固定部164)的口徑為大,因而呈虎口態樣。另一方面,集聲結構140b可具有第二通孔142,其中第二通孔142貫穿第三聲波聚集區162之第二收音元件固定部164,且第二聲波進入口170與第二通孔142分別位於第二集聲空間160的相對兩側。The caliber of the fourth acoustic wave collecting region 163 is tapered from the second acoustic wave inlet port 170 toward the third acoustic wave collecting region 162, and the diameter of the third acoustic wave collecting region 162 is from the fourth acoustic wave collecting region 163 toward the deepest boundary thereof (or The second sound pickup element fixing portion 164) is tapered. The aforementioned deepest boundary means that the third sound wave gathering region 162 is located farthest from the third sound wave gathering region 162 and the fourth sound wave gathering region 163. As shown in FIG. 3B, the aperture of the third acoustic wave collecting region 162 relatively close to the fourth acoustic wave collecting region 163 is relatively closer to the deepest boundary of the third acoustic wave collecting region 162 (or the second sound collecting member fixing portion 164). It is big, so it looks like a tiger. On the other hand, the sound collecting structure 140b may have a second through hole 142, wherein the second through hole 142 penetrates the second sound receiving element fixing portion 164 of the third sound wave collecting portion 162, and the second sound wave inlet port 170 and the second through hole 142 are located on opposite sides of the second collection sound space 160, respectively.

第二收音元件180例如是微型全方向性麥克風,其設置於殼體150內,且與第一收音元件130容納於集聲結構140b的一溝槽中。詳細而言,第二收音元件180與第三聲波聚集區162分別位於第二通孔142的相對兩側。因此,固定於第三聲波聚集區162之第二收音元件固定部164上的第二收音元件180的至少部分可暴露於第二通孔142。The second sound pickup element 180 is, for example, a micro omnidirectional microphone disposed in the housing 150 and housed in a groove of the sound collecting structure 140b with the first sound pickup element 130. In detail, the second sound collecting element 180 and the third sound wave collecting area 162 are respectively located on opposite sides of the second through hole 142. Therefore, at least a portion of the second sound pickup element 180 fixed to the second sound pickup element fixing portion 164 of the third sound wave accumulation region 162 may be exposed to the second through hole 142.

圖4A是本發明第四實施例的錄音模組的示意圖。圖4B是圖4A的錄音模組的俯視示意圖。請參考圖4A與圖4B,本實施例的錄音模組100C與第三實施例錄音模組100B大致相似,兩者之間差異在於:集聲結構140c與殼體150進一步定義出第一聲波進入區115及第二聲波進入區117。第一聲波進入區115與第二聲波聚集區113相鄰,其中第一聲波進入區115及第二聲波聚集區113分別鄰接第一聲波進入口120a,且第一反射區塊111位於第一聲波進入區115與第二聲波聚集區113之間。第二聲波進入區117與第四聲波聚集區163相鄰,其中第二聲波進入區117及第四聲波聚集區163分別鄰接第二聲波進入口170a,且第二反射區塊161位於第二聲波進入區117與第四聲波聚集區163之間。詳細而言,第一集聲空間110a、第一聲波進入口120a、第二集聲空間160a及第二聲波進入口170a例如是由集聲結構140c與殼體150所定義,其中集聲結構140c與殼體150進一步定義出與第一反射區塊111相連接的第一延伸區塊116以及與第二反射區塊161相連接的第二延伸區塊118,第一延伸區塊116與第一聲波進入區115相鄰,且第二延伸區塊118與第二聲波進入區117相鄰。特別注意的是,本發明並不限定錄音模組須包含有左右對稱的第一集聲空間與第二集聲空間,亦可僅包含第一集聲空間與第二集聲空間的其一。4A is a schematic diagram of a recording module according to a fourth embodiment of the present invention. 4B is a top plan view of the recording module of FIG. 4A. Referring to FIG. 4A and FIG. 4B, the recording module 100C of the present embodiment is substantially similar to the recording module 100B of the third embodiment. The difference between the two is that the sound collecting structure 140c and the housing 150 further define the first sound wave entering. Zone 115 and the second acoustic wave enter zone 117. The first acoustic wave entering region 115 is adjacent to the second acoustic wave collecting region 113, wherein the first acoustic wave entering region 115 and the second acoustic wave collecting region 113 respectively abut the first acoustic wave inlet port 120a, and the first reflective segment 111 is located at the first acoustic wave The entry zone 115 is between the second acoustic wave accumulation zone 113. The second acoustic wave entering region 117 is adjacent to the fourth acoustic wave collecting region 163, wherein the second acoustic wave entering region 117 and the fourth acoustic wave collecting region 163 are respectively adjacent to the second acoustic wave inlet port 170a, and the second reflective wave block 161 is located at the second acoustic wave inlet port 170a. The entry area 117 is between the fourth sound wave accumulation area 163. In detail, the first sound collecting space 110a, the first sound wave inlet port 120a, the second sound collecting space 160a, and the second sound wave inlet port 170a are defined, for example, by the sound collecting structure 140c and the housing 150, wherein the sound collecting structure 140c Further defining, with the housing 150, a first extension block 116 connected to the first reflection block 111 and a second extension block 118 connected to the second reflection block 161, the first extension block 116 and the first The acoustic wave entry zone 115 is adjacent and the second extension block 118 is adjacent to the second acoustic wave entry zone 117. It is to be noted that the present invention does not limit the recording module to include the first sound collection space and the second sound collection space, and may only include one of the first sound collection space and the second sound collection space.

綜上所述,由於聲波傳輸距離的不同會使聲壓和相位產生差異,因此透過集聲空間的口徑自聲波進入口朝其最深處界(或稱收音元件固定部)漸縮及反射區塊的設計,便能控制進入集聲空間內的聲波的干涉,以具有良好的水平指向性並且消除雜訊。如此一來,透過本發明的錄音模組收錄所得的音訊於播放時,不僅能重現立體音效,亦能具有良好的音訊品質。In summary, since the sound wave transmission distance is different, the sound pressure and the phase are different. Therefore, the aperture of the sound collecting space is tapered from the sound wave inlet port toward the deepest boundary (or the fixed portion of the sound pickup member) and the reflective block. The design can control the interference of sound waves entering the sound collecting space to have good horizontal directivity and eliminate noise. In this way, the audio recorded by the recording module of the present invention can not only reproduce the stereo sound effect but also have good audio quality during playback.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100、100A~100C:錄音模組 110、110a:第一集聲空間 111:第一反射區塊 112:第一聲波聚集區 113:第二聲波聚集區 114:第一收音元件固定部 115:第一聲波進入區 116:第一延伸區塊 117:第二聲波進入區 118:第二延伸區塊 120、120a:第一聲波進入口 130:第一收音元件 140、140a~140c:集聲結構 141:第一通孔 142:第二通孔 150:殼體 160、160a:第二集聲空間 161:第二反射區塊 162:第三聲波聚集區 163:第四聲波聚集區 164:第二收音元件固定部 170、170a:第二聲波進入口 180:第二收音元件 C:中心軸線100, 100A~100C: recording module 110, 110a: first set sound space 111: first reflective block 112: first sound wave gathering area 113: second sound wave collecting area 114: first sounding element fixing part 115: A sound wave entry zone 116: a first extension block 117: a second sound wave entry zone 118: a second extension block 120, 120a: a first sound wave entry port 130: a first sound pickup element 140, 140a~140c: a sound collection structure 141 : a first through hole 142: a second through hole 150: a housing 160, 160a: a second sound collecting space 161: a second reflecting block 162: a third sound wave collecting area 163: a fourth sound wave collecting area 164: a second sound collecting Element fixing portion 170, 170a: second sound wave inlet port 180: second sound pickup element C: central axis

圖1A是本發明第一實施例的錄音模組的示意圖。 圖1B是圖1A的錄音模組的俯視示意圖。 圖1C為極座標圖,其顯示人耳與第一實施例的錄音模組的水平指向測試結果。 圖2A是本發明第二實施例的錄音模組的示意圖。 圖2B是圖2A的錄音模組的俯視示意圖。 圖3A是本發明第三實施例的錄音模組的示意圖。 圖3B是圖3A的錄音模組的俯視示意圖。 圖4A是本發明第四實施例的錄音模組的示意圖。 圖4B是圖4A的錄音模組的俯視示意圖。1A is a schematic diagram of a recording module according to a first embodiment of the present invention. FIG. 1B is a top plan view of the recording module of FIG. 1A. 1C is a polar plot showing the horizontal pointing test results of the human ear and the recording module of the first embodiment. 2A is a schematic diagram of a recording module according to a second embodiment of the present invention. 2B is a top plan view of the recording module of FIG. 2A. 3A is a schematic diagram of a recording module in accordance with a third embodiment of the present invention. 3B is a top plan view of the recording module of FIG. 3A. 4A is a schematic diagram of a recording module according to a fourth embodiment of the present invention. 4B is a top plan view of the recording module of FIG. 4A.

100C:錄音模組 110a:第一集聲空間 111:第一反射區塊 114:第一收音元件固定部 116:第一延伸區塊 118:第二延伸區塊 120a:第一聲波進入口 130:第一收音元件 140c:集聲結構 141:第一通孔 142:第二通孔 150:殼體 160a:第二集聲空間 161:第二反射區塊 164:第二收音元件固定部 170a:第二聲波進入口 180:第二收音元件100C: recording module 110a: first sound collecting space 111: first reflecting block 114: first sounding element fixing portion 116: first extending block 118: second extending block 120a: first sound wave inlet port 130: The first sound collecting element 140c: the sound collecting structure 141: the first through hole 142: the second through hole 150: the housing 160a: the second sound collecting space 161: the second reflecting block 164: the second sound receiving element fixing portion 170a: Two sound wave inlet port 180: second sound pickup element

Claims (10)

一種錄音模組,包括:一集聲空間,至少具有一反射區塊,該反射區塊分別與一第一聲波聚集區及一第二聲波聚集區相鄰,該第一聲波聚集區呈一虎口態樣,令其最深處界定有一收音元件固定部;一聲波進入口,對應形成於該第二聲波聚集區至少局部周側;以及一收音元件,設置於該第一聲波聚集區之該收音元件固定部,該收音元件用以收錄進入該集聲空間的音訊,其中該第二聲波聚集區的口徑自該聲波進入口朝該第一聲波聚集區漸縮,且該第一聲波聚集區的口徑自該第二聲波聚集區朝該收音元件漸縮。 A recording module includes: a set of sound spaces having at least one reflective block, the reflective blocks being adjacent to a first sound wave gathering area and a second sound wave collecting area, wherein the first sound wave gathering area is a tiger mouth a state in which a sound receiving component is defined at a deepest portion; a sound wave inlet port corresponding to at least a partial circumference side of the second sound wave gathering region; and a sound pickup element disposed on the sound collecting component of the first sound wave gathering region a fixing portion, wherein the sound collecting component is configured to receive an audio entering the sound collecting space, wherein a diameter of the second sound wave collecting region tapers from the sound wave inlet port toward the first sound wave gathering region, and a diameter of the first sound wave gathering region The second sound wave gathering region is tapered toward the sound pickup element. 如申請專利範圍第1項所述的錄音模組,更包括:一集聲結構,該集聲結構具有一通孔,其中該通孔貫穿該第一聲波聚集區之該收音元件固定部,且該聲波進入口與該通孔分別位於該集聲空間的相對兩側。 The recording module of claim 1, further comprising: a sound collecting structure, the sound collecting structure having a through hole, wherein the through hole penetrates the sound receiving element fixing portion of the first sound wave collecting area, and the The sound wave inlet port and the through hole are respectively located on opposite sides of the sound collecting space. 如申請專利範圍第2項所述的錄音模組,更包括:一殼體,該集聲結構設置於該殼體內,且該集聲結構與該殼體定義出該集聲空間及該聲波進入口。 The recording module of claim 2, further comprising: a housing, the sound collecting structure is disposed in the housing, and the sound collecting structure and the housing define the sound collecting space and the sound wave enters mouth. 如申請專利範圍第3項所述的錄音模組,其中該集聲結構與該殼體進一步定義出一聲波進入區,該聲波進入區與該第二聲波聚集區相鄰,且該反射區塊位於該聲波進入區與該第二聲波聚集區之間。 The recording module of claim 3, wherein the sound collecting structure and the housing further define an acoustic wave entry zone, the sound wave entry zone is adjacent to the second sound wave gathering zone, and the reflective block Located between the sound wave entry zone and the second sound wave accumulation zone. 如申請專利範圍第2項所述的錄音模組,其中該第一聲波聚集區與該收音元件分別位於該集聲結構的相對兩側,且該通孔暴露出至少部分該收音元件。 The recording module of claim 2, wherein the first sound wave collecting area and the sound collecting element are respectively located on opposite sides of the sound collecting structure, and the through hole exposes at least a part of the sound collecting element. 一種錄音模組,包括:一第一集聲空間,至少具有一第一反射區塊,該第一反射區塊分別與一第一聲波聚集區及一第二聲波聚集區相鄰,該第一聲波聚集區呈一虎口態樣,令其最深處界定有一第一收音元件固定部;一第二集聲空間,與該第一集聲空間並列,該第二集聲空間至少具有一第二反射區塊,該第二反射區塊分別與一第三聲波聚集區及一第四聲波聚集區相鄰,該第三聲波聚集區呈一虎口態樣,令其最深處界定有一第二收音元件固定部,且該第一收音元件固定部與該第二收音元件固定部彼此相對;一第一聲波進入口,對應形成於該第二聲波聚集區至少局部周側;一第二聲波進入口,對應形成於該第四聲波聚集區至少局部周側,且該第一聲波進入口與該第二聲波進入口彼此相對;一第一收音元件,設置於該第一聲波聚集區之該第一收音元件固定部,該第一收音元件用以收錄進入該第一集聲空間的音訊,其中該第二聲波聚集區的口徑自該第一聲波進入口朝該第一聲波聚集區漸縮,且該第一聲波聚集區的口徑自該第二聲波聚集區朝該第一收音元件漸縮;以及 一第二收音元件,設置於該第三聲波聚集區之該第二收音元件固定部,該第二收音元件用以收錄進入該第二集聲空間的音訊,其中該第四聲波聚集區的口徑自該第二聲波進入口朝該第三聲波聚集區漸縮,且該第三聲波聚集區的口徑自該第四聲波聚集區朝該第二收音元件漸縮。 A recording module includes: a first sound collecting space having at least a first reflecting block, wherein the first reflecting block is adjacent to a first sound wave collecting area and a second sound wave collecting area, respectively. The sound wave gathering area is in a tiger mouth state, so that a deepest portion defines a first sound receiving element fixing portion; a second sound collecting space is juxtaposed with the first sound collecting space, and the second collected sound space has at least a second reflection a block, the second reflective block is adjacent to a third sound wave collecting area and a fourth sound wave collecting area, and the third sound wave collecting area is in a tiger mouth state, so that a second sound receiving element is fixed at the deepest point. And the first sound receiving element fixing portion and the second sound receiving element fixing portion are opposite to each other; a first sound wave inlet port corresponding to at least a partial circumference side of the second sound wave gathering region; and a second sound wave inlet port corresponding to Formed on the at least partial peripheral side of the fourth sound wave gathering region, and the first sound wave inlet port and the second sound wave inlet port are opposite to each other; a first sound pickup element, the first sound pickup element disposed in the first sound wave gathering region fixed The first sound collecting component is configured to receive the audio entering the first sound collecting space, wherein the diameter of the second sound wave collecting area is tapered from the first sound wave inlet port toward the first sound wave gathering area, and the first sound wave a caliber of the gathering zone tapers from the second acoustic gathering area toward the first sound collecting element; a second sound collecting component disposed in the second sound collecting component fixing portion of the third sound wave collecting area, wherein the second sound collecting component is configured to receive the sound entering the second sound collecting space, wherein the diameter of the fourth sound wave gathering area The second acoustic wave inlet port is tapered toward the third sound wave collecting region, and the diameter of the third sound wave collecting region is tapered toward the second sound collecting member from the fourth sound wave collecting region. 如申請專利範圍第6項所述的錄音模組,更包括:一集聲結構,該集聲結構具有一第一通孔與相對於該第一通孔的一第二通孔,該第一通孔貫穿該第一聲波聚集區之該第一收音元件固定部,且該第一聲波進入口與該第一通孔分別位於該第一集聲空間的相對兩側,該第二通孔貫穿該第三聲波聚集區之該第二收音元件固定部,且該第二聲波進入口與該第二通孔分別位於該第二集聲空間的相對兩側。 The recording module of claim 6, further comprising: a set of acoustic structures, the sound collecting structure having a first through hole and a second through hole opposite to the first through hole, the first The through hole runs through the first sound receiving element fixing portion of the first sound wave collecting area, and the first sound wave inlet port and the first through hole are respectively located on opposite sides of the first sound collecting space, and the second through hole runs through The second sound receiving element fixing portion of the third sound wave collecting area, and the second sound wave inlet port and the second through hole are respectively located on opposite sides of the second sound collecting space. 如申請專利範圍第7項所述的錄音模組,更包括:一殼體,該集聲結構設置於該殼體內,且該集聲結構與該殼體定義出該第一集聲空間、該第一聲波進入口、該第二集聲空間及該第二聲波進入口。 The recording module of claim 7, further comprising: a housing, the sound collecting structure is disposed in the housing, and the sound collecting structure and the housing define the first sound collecting space, a first sound wave inlet port, the second sound collecting space, and the second sound wave inlet port. 如申請專利範圍第8項所述的錄音模組,其中該集聲結構與該殼體進一步定義出一第一聲波進入區及一第二聲波進入區,該第一聲波進入區與該第二聲波聚集區相鄰,且該第一反射區塊位於該第一聲波進入區與該第二聲波聚集區之間,該第二聲波進入區與該第四聲波聚集區相鄰,且該第二反射區塊位於該第二聲波進入區與該第四聲波聚集區之間。 The recording module of claim 8, wherein the sound collecting structure and the housing further define a first sound wave entry zone and a second sound wave entry zone, the first sound wave entry zone and the second The sound wave collecting area is adjacent to each other, and the first reflecting block is located between the first sound wave entering area and the second sound wave collecting area, the second sound wave entering area is adjacent to the fourth sound wave collecting area, and the second The reflective block is located between the second acoustic wave entry zone and the fourth acoustic wave accumulation zone. 如申請專利範圍第7項所述的錄音模組,其中該第一聲波聚集區與該第一收音元件分別位於該集聲結構的相對兩側,且該第一通孔暴露出至少部分該第一收音元件,該第三聲波聚集區與該第二收音元件分別位於該集聲結構的相對兩側,且該第二通孔暴露出至少部分該第二收音元件。The recording module of claim 7, wherein the first sound wave collecting area and the first sound collecting element are respectively located on opposite sides of the sound collecting structure, and the first through hole exposes at least part of the a sound collecting component, the third sound collecting region and the second sound collecting component are respectively located on opposite sides of the sound collecting structure, and the second through hole exposes at least a portion of the second sound collecting component.
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