TWI596644B - Fluid distribution member assembly for plasma processing apparatus - Google Patents

Description

Fluid distribution component assembly and plasma processing equipment

The present invention is generally directed to fluid distribution component assemblies for use in plasma processing equipment, and more particularly to mitigate the effects of thermal stress on fluid distribution component assemblies during plasma processing.

Currently, the development of integrated circuits (ICs) requires the drive of a plasma ashing process to take advantage of increased aggressive chemical processes and phenomena and thermal environments. It is important that the ashing process occurs at a uniform rate across the surface of the wafer to be processed. For this purpose, process conditions are precisely controlled and carefully designed components are used in the process chamber to ensure uniform ashing. One such component is a so-called baffle, or fluid distribution plate and/or assembly that is designed to uniformly direct and distribute the excited plasma onto a wafer surface. An exemplary fluid distribution plate design is shown and described in U.S. Patent Application Publication No. 2005/0241767.

The plasma temperature in the dry asher system is generally in the range of 1000 degrees Celsius. The type of molecule is excited within the microwave source of the system and carries energy downstream. The energy is transferred in the form of heat to the parts that are wetted by the plasma. Due to the effects of uneven heat transfer, thermal non-uniformity develops over these parts and creates internal stresses that in turn compromise the integrity of the structure. Recombination of the surface upon collision with various components of the processing system, including the various components of the fluid distribution component, results in a very high thermal load requiring the design of a plasma processing system including the fluid distribution component The novel heat flow management.

Due to their resistance to high temperatures and their chemical purity, glass, ceramic, and fused ceria are typically employed in the design of the parts used in the most important areas of the plasma processing system including the fluid distribution element. Stress cracking typically occurs in these materials due to uneven thermal loading or uneven expansion between different materials. In many cases, uneven heating and cooling can create stresses that exceed the material's fall or final tensile stress limit, resulting in devastating damage. Although not affected by high temperatures in the general range of plasma processing, these materials are sensitive to relatively large temperature gradients and thermal shocks.

The fluid distribution elements and/or components used in the plasma system may be alumina ceramic (AL ₂ O ₃ ), fused cerium oxide (SiO ₂ ), or other glass, ceramic, metal, or any suitable material. And / or a combination thereof. A downstream microwave plasma source similar to a plasma torch outputs a radial gas and creates an extreme temperature gradient across the impacted part. Further temperature differences between the center and the edge of the first panel to be contacted by the plasma are within a few hundred degrees Celsius. This gradient can create significant thermal stresses that can cause damage to the panel. Separating the fluid distribution plates into concentric nested structures has proven to be a fairly effective form of interrupting one of the gradients, and thus reducing such internal stresses, while maintaining process consistency, according to conventional processes. However, this significantly increases the cost of the part and can result in particulates due to sliding between the separated panels. Furthermore, with increased power requirements, there is a need for further board optimization for the optimal geometry of nested panels.

Accordingly, there is a need in the art for improved fluid dispensing elements and/or assemblies that maintain plasma or gas uniformity and withstand various conditions utilized during high temperature plasma or gas processing (eg, endurance). Living a broad thermal gradient and associated stress, and/or being economically viable, and/or compatible with complex chemical properties, and/or the like).

The fluid reservoir component assemblies described and disclosed herein are configured to mitigate thermal stresses and reduce the likelihood of catastrophic failure of the baffles.

In accordance with an exemplary embodiment of the present invention, a fluid dispensing component assembly for use in a substrate processing system includes a fluid dispensing component having a central portion and a peripheral portion. The fluid distribution element defines at least one groove formed through the fluid distribution element, and the at least one groove extends along a non-radial path configured to allow the central portion to expand and relative to The peripheral portion is rotated.

According to an additional exemplary embodiment of the present invention, a substrate processing apparatus includes a process chamber in which a workpiece can be treated with plasma, hot gas, or hot liquid; and at least one fluid distribution element is disposed Within the process chamber, it is constructed to distribute the plasma, gas, or liquid to the workpiece. The at least one fluid distribution member includes a central portion and a peripheral portion, the at least one fluid distribution member defining at least one groove formed through the at least one fluid distribution member, and the at least one groove is along a non-radial The path extending, the non-radial path being constructed to allow the central portion to expand and relative Rotate in the peripheral part.

In accordance with still another exemplary embodiment of the present invention, a method for plasma treating a substrate includes generating a plasma-reducing plasma in a plasma generator, and directing the ion density-reducing plasma through a fluid distribution An element, and a plasma that exposes a workpiece to the reduced ion density. The fluid distribution member includes a central portion and a peripheral portion, the fluid distribution member defining at least one groove formed through the fluid distribution member, and the at least one groove extending along a non-radial path, the non-diameter The path is constructed to allow the center portion to expand and rotate relative to the peripheral portion.

The above description and other features are exemplified by the following drawings and detailed description.

Exemplary embodiments of the present invention are generally directed to a fluid dispensing element and/or assembly for use in a plasma treatment. The fluid distribution element assembly can generally include at least one fluid distribution element and have one or more continuous grooves formed through the at least one fluid distribution element. At least one groove travels along a non-radial path that allows the central portion of the fluid distribution member to expand and rotate relative to/with respect to a peripheral portion. For example, the appropriate shape/planning of the groove can be a substantially spiral or spiral-like pattern of at least one groove. According to some exemplary embodiments, the first end of the at least one groove begins in an area that is within 2/3 of the radius from the center of the fluid distribution element and is non-radial or spiral Extending outward in the direction, the extension may be curved, curved or linear, and Having a total length of at least 1/3 of the radius of the fluid distribution element. The groove may be in the form of a helix, a set of concentric polygons or any other suitable geometry, wherein the groove or grooves have almost free or substantial freedom to allow the material comprising the fluid distribution element The role of expansion. During operation, the gas or high energy components of the plasma flow through the grooves. The presence of the groove or grooves allows the central region of the fluid dispensing member to expand almost freely as the element heats, causing a slight rotation of the central region relative to the outer, cooler regions of the fluid dispensing member.

The function of these grooves is intended to be two turns. From a process perspective, the grooves redistribute gas or fluid flow to achieve nearly optimal dry ashing profile consistency. From the standpoint of structural integrity of the part, the grooves allow for quasi-unconstrained thermal expansion to minimize internal stresses within the part. The geometry of the structure defined by any two adjacent grooves is self-joining or does not have the support of the material in the intermediate region of the fluid distribution element. The semi-tangential orientation of the support member comprising this structure allows the material in the central region to expand and essentially allows for radial strain while simultaneously relieving internal stress via movement of the opposite polar coordinates of the inner region.

It should be noted that although the term "spiral" can be interpreted as a very specific mathematical term, it is easiest to use polar coordinates to describe, where the radius is a continuous monotonic function of the angle, or a point along the center point A path-spreading curve having a progressively increasing dimension from the center point, which will be understood as the term "spiral" as used herein to mean more generally interpreted as curved, linear, Curve or a straight line pattern, This point is wound by increasing or decreasing the distance. Thus, the term "spiral" is intended to encompass any generally discovered structure that ranges from a grooved groove on a record curve to a rectangular helical sawtooth; and any organization that resembles those in The various embodiments described herein are described.

In the following, the invention will be described more fully with reference to the drawings, and exemplary embodiments of the invention are shown in the drawings.

1 illustrates an exemplary photoresist material ashing unit 10, generally including a gas box 12; a microwave plasma generator assembly 14; a process chamber 16 defining an internal bore in which the semiconductor substrate is processed Materials, such as wafer 18; and a radiant heater assembly 20 for heating wafers 18 located at the bottom of the process chamber. A temperature probe 24, such as a thermocouple, is typically used to monitor the temperature of the wafer 18 during operation. Vacuum pump 26 is used to evacuate process chamber 16 for processes requiring vacuum conditions.

A selective monochromatic illuminator 28 is used to monitor the optical emission characteristics of the gas within the chamber to aid in process endpoint determination. The wafer 18 is introduced into and removed from the process chamber 16 via an inlet/outlet passage 30 via a suitable load lock mechanism (not shown). Alternately, if the tool is not equipped with a load lock, the wafer 18 can be directly introduced into the process chamber 16 through the inlet/outlet passage 30. Although the present disclosure is shown and characterized as being implemented within a photoresist material asher, it can also be used in another semiconductor fabrication facility, such as a plasma etcher or plasma deposition system. For example, downstream axial flow plasma devices that are particularly suitable for use in the modifications of the present disclosure are, for example, plasma ashers, such as those in the trade name Microwave plasma ashers from Axcelis technologies are available under the RadiantStrip320. The various portions of the microwave plasma ashers are described in U.S. Patent Nos. 5,498,308 and 4,341, 592, the entire disclosure of which is incorporated herein by reference. As will be discussed below, in this or in the following specific examples, the disclosure is not intended to be limited to any particular plasma asher. For example, the processing plasma can be formed from a parallel plate using a DC magnet system, a capacitively coupled plasma source, an inductively coupled plasma source, and any combination thereof. Alternately, the treated plasma can be formed using electron cyclotron resonance. In yet another embodiment, the processing plasma is formed by the emission of a spiral wave. In yet another embodiment, the processing plasma is formed by a propagated surface wave. In addition, the disclosure encompasses any semi-conducting, institutional process equipment requiring gas or plasma distribution, where the gas or plasma distribution component is in the glass, fused ceria, ceramic and/or metal of the distribution system. The component includes a sufficient thermal load such that the material will suffer stress cracking or distortion.

Positioned within the plasma chamber 16 is a fluid dispensing element or assembly, generally designated by the reference numeral 50. Although shown as a single layer fluid dispensing element assembly, it is intended that the fluid dispensing element assembly can take the form of one or more fluid dispensing elements. Likewise, the single-layer fluid dispensing element assembly can include a percussive disc thereon, such as generally disclosed in U.S. Patent Publication No. 2004/0238123, which is hereby incorporated by reference in its entirety. In this article. In any of the specific embodiments described above, the fluid distribution elements and/or components evenly distribute the reactive gas or electricity The slurry passes over the surface 18 of the wafer to be processed. As will be discussed in greater detail herein, at least one of the fluid dispensing elements comprises the helical groove structure, as discussed in more detail below, which has been found to minimize thermal stress during operation. .

Turning to Figure 2, a conventional, one-piece fluid dispensing element assembly 200 is illustrated. The fluid distribution component assembly 200 generally includes an array of holes through which the gas or plasma flows. The hole pattern, hole size, and hole density are selected to dispense the gas or plasma over the work surface.

Turning to Figure 3, a single fluid dispensing element assembly 300 is illustrated. As shown, the fluid dispensing element assembly 300 includes a recess 310 (first recess) that is cut/formed through the fluid dispensing element assembly 300, wherein the recess 310 is in the 2/3 region of the radius 340 The beginning begins as measured by the center 320 of the dispensing element and continues toward the outer edge. According to this exemplary embodiment, the cutting path length 330 is greater than or equal to 1/3 of the plate radius (340).

Turning now to Figure 4, a single fluid dispensing element assembly 400 is illustrated. As shown, the fluid distribution element assembly 400 includes a helical groove 410 (first groove) that is cut/formed through the fluid distribution element assembly 400. The groove 410 begins at a region of the fluid distribution member centered within 2/3 of the radius of the fluid distribution member and extends to a region further outward from the center of the fluid distribution member, wherein the groove path length is greater than or equal to The fluid distribution element has a radius of 1/3. The helical groove 410 can be considered to be constant or variable width formed or cut through the fluid distribution element 400. Any of the degrees. As shown, the spiral groove 410 includes a first end 430 and a second end 420. The second end portion is further outwardly displaced from the center of the dispensing member than the first end portion, and the groove includes a total path length greater than or equal to 1/3 of the radius of the dispensing member. If desired, the width of the groove 410 can be varied from the first end 430 to the second end 420 to control the flow of gas or plasma as needed to the workpiece located downstream of the fluid distribution element 400. Get a fairly even flow on it.

As noted, the helical groove 410 incorporates a pitch 440. From the first end 430 to the second end 420 of the helical groove 410, as specifically noted, the pitch may be constant or may vary differently depending on any desired loss. As additionally noted, the helical groove 410 extends outwardly from the center of the fluid dispensing element assembly as measured by the radius of the helical groove 410. However, the helical groove 410 can likewise be described as advancing inward.

Although illustrated and described above in terms of a single helical groove, it will be appreciated that one or more grooves may be formed through a fluid distribution component assembly in accordance with any desired loss. For example, turning now to FIG. 5, a fluid distribution component assembly 500 including two helical grooves 410 and 510 (second grooves) has start ends 430 and 530 and terminals 420 and 520. As illustrated, at least one of the spirals has a path length greater than or equal to one-third of the radius of the fluid distribution element 500.

Turning now to Figure 6, a fluid dispensing element assembly 600 including a plurality of grooves 610 (first grooves) is illustrated. As shown, the plurality of grooves 610 are cut or formed into the fluid dispensing element 600, wherein at least one of the grooves The center begins at 2/3 of the radius of the fluid distribution element and extends for a total path length greater than or equal to 1/3 of the radius of the fluid distribution element.

As shown, the grooves 610 travel along a non-radial path allowing the central portion of the dispensing member 600 to expand and rotate relative to the peripheral portion. Moreover, as portions 640 between the grooves 610 expand (e.g., "legs"), the portions 640 are tangentially urged on the central portion causing them to rotate. In this way, thermal and mechanical stresses are relaxed.

It should be noted that although the grooves 610 are shown as being curved, the grooves 610 may also be linear, extending substantially non-radially from the central portion of the dispensing member 600, thereby being configured to cause Mechanical rotation as described above. For example, Figure 7 depicts a fluid dispensing element assembly having linear grooves that extend non-radially from a central portion of the fluid dispensing element assembly. In contrast, a conventional radially extending groove or groove (as disclosed in U.S. Patent No. 6,444,040), when exposed to heat, will be radially urged in the central portion of the dispensing member. On, causing compression. As such, the center portion will expand outwardly, causing additional stress.

Turning now to Figure 7, a fluid dispensing element assembly 700 including a plurality of grooves 710 (first grooves) is illustrated. As shown, the plurality of grooves 710 are cut or formed into the fluid dispensing element 700, wherein at least one of the grooves begins at the center within 2/3 of the radius of the fluid dispensing element and extends greater than or equal to The total path length of 1/3 of the radius of the fluid distribution element.

As shown, the grooves 710 travel along a non-radial path, allowing the central portion of the dispensing element 700 to expand and rotate relative to the peripheral portion. Furthermore, due to the expansion of the portion 740 between the grooves 710 (for example, "legs" The portion 740 is tangentially urged on the central portion to cause it to rotate. In this manner, thermal and mechanical stresses are relaxed.

Thus, as described above, exemplary embodiments of the present invention comprise a fluid dispensing element assembly that includes one or more grooves or grooves formed through the fluid dispensing element assembly. The grooves may be circular or spiral-like in shape and orientation, extending non-radially from a central portion of the fluid distribution member. However, as mentioned above, according to additional exemplary embodiments, the one or more grooves may be segmented or formed from different segments, as shown in Figures 8-9.

Turning to Figure 8, the groove 810 (first groove) has a start end 830 within 2/3 of the radius of the fluid distribution element 800, as measured by the center, and passed through a series of connected The line segments continue outwardly toward one end 820, wherein the total path length of the series of lines is greater than or equal to 1/3 of the radius of the distribution element. These lines may be right angles, as shown in Figure 8, or may be a series of connected non-orthogonal line segments 910, as shown in Figure 9. Each segment 910 of fluid distribution element 900 begins at point 930 and extends outwardly to an end point 920, wherein the total path length is greater than or equal to one-third the radius of the fluid distribution element.

Additionally, exemplary embodiments may include any combination of slotted and/or through hole features described above. For example, as shown in FIG. 10, the fluid distribution component assembly 1000 can include at least one recess 410 formed through the fluid distribution component assembly 1000 and begin within the center of the panel within 2/3 of the radius of the panel. Extending outwardly, having a total path length greater than or equal to 1/3 of the radius of the fluid distribution element, and one or more holes 210 and grooves 1010 (third groove) combined.

It will be appreciated that while described and illustrated as a general fluid dispensing component assembly that can generally be considered a planar type, the fluid dispensing component assembly can be varied in accordance with any desired cues. For example, Figures 11A-11E depict side and cross-sectional views of a fluid dispensing element in accordance with an exemplary embodiment.

As illustrated in FIG. 11A, the fluid distribution member can include a composite first surface 1111 and an immediately adjacent sidewall 1110 that is configured to be generally convex or concave. It should be understood that any of the screw configurations mentioned above may be formed on the first surface 1101. The side walls 1110 can be substantially flat and can surround the entire fluid distribution element 1101. Alternatively, the side walls 1110 can be composite and can include a locking mechanism or protrusion to facilitate deployment of the fluid dispensing element in a processing apparatus, as illustrated in FIG.

As illustrated in FIG. 11B, a fluid dispensing element 1102 can include a generally planar first surface 1122 that abuts the sidewall 1120. The side walls 1120 can be substantially flat and can surround the entire fluid dispensing element 1101. The fluid dispensing element 1102 can further include a protruding portion 1121 that is immediately adjacent to the side walls 1120, such as being configured to facilitate placement of the fluid dispensing element in a processing apparatus, as illustrated in FIG.

As illustrated in Figure 11C, a fluid dispensing element 1103 can be generally planar.

As illustrated in Figure 11D, the fluid dispensing element 1104 can be substantially planar and varying in thickness. The fluid distribution element 1104 can include a substantially planar first surface 1141 and an opposite, substantially concave second surface 1140.

As illustrated in Figure 11E, a fluid dispensing element 1105 can include two opposing and substantially concave surfaces 1150 and 1151.

As illustrated in Figures 12 and 16, the exemplary multi-piece fluid dispensing element assembly 50 can optionally include a hexagonal opening 56 formed in the fluid dispensing member 52, and a structure configured to fit within the opening 56. The inner hexagonal insertion portion 54. It should be apparent that the shape of the opening 56 and the insertion portion 54 can be any desired or suitable shape. Again, the fluid distribution element 52 can include more than one insertion portion. In the exemplary embodiment shown, the hexagonal shape is configured to adjust some or all of the thermal stress associated with the downstream plasma asher, wherein the plasma initially impacts the fluid distribution element to a large extent. Central area. However, this configuration can be equally applied to any other plasma process. As previously described, the annular ring portion forming the fluid distribution element assembly 50 and the number of elements can define any opening shape. Furthermore, although the Applicant refers to an annular ring portion, it is intended that the various elements do not include an annular ring portion. Instead, the majority of the components are constructed and fabricated to form a single layer of the fluid distribution component 52. Further, a locking mechanism can be included to maintain the fluid dispensing member 52 in a generally planar configuration, and is well within the skill of those skilled in the art.

The impact disk/insert portion 54 can be formed from a similar or different material including the annular ring/fluid distribution element 52. The impact disk 54 can include an aperture 68 that is generally disposed through the impact disk 54 or a slot that cuts through the impact disk 54 or that cuts through the impact disk 54 Any combination of ports or grooves, or may be non-porous or may include a central non-perforated area with external apertures or grooves disposed around it.

Although described and illustrated as orifices, it should be understood that limiting the orifices to the illustrated constant diameter, geometry, decreasing inner diameter, or special configuration is not appropriate. For example, the ashing rate and uniformity provided by the fluid distribution component assembly can be adjusted to various solutions through the manipulation of the configuration, geometry, dimensions, and other features of the orifices 68. Alternately, the impact disk may also include a helical groove (not shown), such as a ring portion 52 that is generally defined for the ring.

Figure 13 depicts an exemplary temperature profile of the fluid distribution element in a microwave downstream asher in operation. The magnitude of this thermal gradient exceeds 400 degrees Celsius / cm. In the exemplary fluid distribution element shown in Figure 2, a baffle hole that concentrates the thermal stress is included, and this temperature profile can cause thermal stress to well exceed 300 megapascals (MPa).

Figures 14 and 15 depict a temperature profile along path 1420 for a single helical groove 1410 (first groove) and for the fluid distribution element 1400 used in the microwave downstream plasma asher. As can be seen in Figure 15, the temperature is nearly linear over the path length and the magnitude of the thermal gradient is several orders of magnitude lower than the exemplary fluid distribution element shown in Figure 2. The calculated maximum stress due to thermal expansion is reduced by at least about 3 megapascals (MPa). As illustrated, the fluid distribution element temperature profile is modeled as a model based on a helical cutting fluid dispensing element having a constant pitch.

The fluid distribution element according to any of the specific embodiments disclosed herein is preferably formed of a ceramic material, fused ceria, metal or glass. Suitable ceramic materials include, but are not intended to be limited to, alumina (various oxides), zirconium dioxide, various carbides such as tantalum carbide, boron carbide, various nitrogens such as tantalum nitride, aluminum nitride, boron nitride. Compounds, quartz, cerium oxide, various nitrogen oxides such as cerium oxynitride, and the like, and stable ceramics having elements such as magnesium, cerium, lanthanum oxide, cerium, and the like. Suitable metals include, but are not intended to be limited to, aluminum, aluminum alloys, stainless steel, titanium, titanium alloys, tantalum, and the like. Alternatively, the underlying one-piece fluid dispensing element can be the same or different materials, typically fused cerium oxide or anodized aluminum. Furthermore, the fluid distribution element and/or the impact disk can be coated with a second material such as Al ₂ O ₃ , CeO, SiO ₂ , TiO ₂ , Si, and/or Ta ₃ O ₄ .

The fluid distribution element may additionally be non-planar, but may be curved or thinned, for example, thinned at the center to enhance mechanical stability. Furthermore, it will be appreciated that the majority of the fluid distribution elements can be used in a single plasma processing chamber, such as a stack of one or more helical fluid distribution elements, wherein the spirals are at different locations, To reduce the line of sight. Additionally, the grooves can be cut at an angle, such as 45 degrees from the surface normal.

As disclosed and described in detail above, exemplary embodiments of the present invention may include fluids such as uniform cooling over ceramic baffles and/or fluid distribution component assemblies and thereby reducing the risk of cracking, and fluids used in plasma processing systems. The advantages of a simplified structure for allocating component components. These fluid distribution component assemblies can be used in any applicable method for plasma processing of substrates.

For example, Figure 17 depicts a method for plasma processing of a workpiece, in accordance with an exemplary embodiment. In region 1701, the method 1700 can also be included in a plasma generator to produce a reduced ion density plasma.

In region 1702, the method 1700 can additionally include directing the reduced ion density plasma through a fluid distribution element. As described above, the fluid dispensing member can include a central portion and a peripheral portion with at least one groove formed through the fluid dispensing member. The at least one groove can extend along a non-radial path and is configured to allow the central portion to expand and rotate relative to the peripheral portion during the method 1700.

The method 1700 additionally includes exposing the workpiece to the reduced ion density of the plasma.

It will be appreciated that while the exemplary embodiments are described in terms of downstream plasma processing apparatus and methods for reducing ion density exposure, exemplary embodiments are not limited thereto. Exemplary embodiments of fluid distribution component assemblies are applicable to any suitable plasma processing system, whether or not high frequency electromagnetic plasma processing or any other suitable system, where the use of fluid dispensing elements is desired.

In addition, it should be understood that any of the above nouns and any new nouns used below shall be construed as representing the most logical definition of the terms, such as being designed, tested, formed, and manufactured by ordinary skill. It will be appreciated by those skilled in the art of the exemplary embodiments described herein.

The words used herein are for the purpose of describing particular embodiments only and are not intended to As used herein, the singular forms "a", "an" and "the" (the) is intended to include the plural form, unless the context clearly indicates otherwise. When used herein, it will be further understood that the terms "comprises" and "comprising" "," "includes" and/or "including" designates the stated features, integers, steps, operations, components, and/or components, but does not exclude one or more other features. The presence or addition of pitch factor, etching, coating, additional groove configuration, or any other suitable or desired feature.

Although the present invention has been described with reference to the exemplary embodiments thereof, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted by the elements used thereon without the scope of the present invention. Get rid of. In addition, many modifications may be made to adapt a particular state or material to the teachings of the invention without departing from the scope. Therefore, it is intended that the invention not be limited to the particular embodiments of the invention Specific embodiment. Exemplary embodiments of the present invention have been disclosed herein and in the description, and although specific nouns may have been employed, unless otherwise stated, they are only used in a generic and descriptive sense. It is not intended to be limiting, and the scope of the invention is therefore not so limited. Furthermore, the use of the first and second nouns does not indicate any order or importance, and the first and second terms are used to distinguish one element from another. Furthermore, the use of a noun such as (a), an (an), etc. does not indicate a limitation of quantity, and instead indicates the existence of at least one reference item of the referenced item.

10‧‧‧Photoresist material ashifier

12‧‧‧ gas box

14‧‧‧Microwave plasma generator assembly

16‧‧‧Processing Room

18‧‧‧ Wafer

20‧‧‧heater assembly

24‧‧‧ Temperature probe

26‧‧‧vacuum pump

28‧‧‧ Monochrome illuminator

30‧‧‧Entry/Exit Channel

50‧‧‧ Fluid distribution components

52‧‧‧ Fluid distribution components

54‧‧‧ hexagonal insert

56‧‧‧ hexagonal opening

68‧‧‧孔口

200‧‧‧Fluid distribution component assembly

210‧‧‧ holes

300‧‧‧Fluid distribution component assembly

310‧‧‧ Groove

320‧‧‧ Center

330‧‧‧ Cutting path length

340‧‧‧plate radius

400‧‧‧Fluid distribution component assembly

410‧‧‧Spiral groove

420‧‧‧ second end

430‧‧‧ first end

440‧‧‧pitch

500‧‧‧Fluid distribution component assembly

510‧‧‧Spiral groove

520‧‧‧ Terminal

530‧‧‧Starting end

600‧‧‧Fluid distribution component assembly

610‧‧‧ Groove

640‧‧‧Parts

700‧‧‧Fluid distribution components

710‧‧‧ Groove

740‧‧‧Parts

800‧‧‧Fluid distribution components

810‧‧‧ Groove

820‧‧‧End

830‧‧‧Starting end

900‧‧‧Fluid distribution components

910‧‧‧frag

920‧‧‧ End

930‧‧ points

1000‧‧‧Fluid distribution component assembly

1010‧‧‧ Groove

1101‧‧‧ first surface

1102‧‧‧ Fluid distribution components

1103‧‧‧ Fluid distribution components

1104‧‧‧ Fluid distribution components

1105‧‧‧ Fluid distribution components

1110‧‧‧ side wall

1111‧‧‧ first surface

1120‧‧‧ side wall

1121‧‧‧ highlight

1122‧‧‧ first surface

1140‧‧‧ second surface

1141‧‧‧ first surface

1150‧‧‧ surface

1151‧‧‧ surface

1400‧‧‧ Fluid distribution components

1410‧‧‧Single spiral groove

1420‧‧‧ Path

1700‧‧‧ method

The drawings are intended to describe exemplary embodiments of the invention and are not to be construed as limiting. The drawings are not considered to be drawn to scale, unless explicitly indicated. Reference is now made to the accompanying drawings, in which like reference numerals are used in the drawings of FIG. Figure 4 depicts a fluid dispensing element assembly in accordance with an embodiment; Figure 5 depicts a fluid dispensing element assembly in accordance with an embodiment; Figure 6 depicts a fluid dispensing element assembly in accordance with an embodiment; Fluid dispensing element assembly of an embodiment; FIG. 8 depicts a fluid dispensing element assembly in accordance with an embodiment; FIG. 9 depicts a fluid dispensing element assembly in accordance with an embodiment; FIG. 10 depicts a fluid dispensing element assembly in accordance with an embodiment; Figure 11A depicts a side view of a fluid dispensing member in accordance with an exemplary embodiment; Figure 11B depicts a cross-sectional view of a fluid dispensing member in accordance with an exemplary embodiment; Figure 11C depicts a cross-sectional view of a fluid dispensing member in accordance with an exemplary embodiment. Figure 11D depicts a cross-sectional view of a fluid dispensing element in accordance with an exemplary embodiment; Figure 11E Specific embodiments of said fluid according to an exemplary embodiment of the dispensing device FIG. 12 depicts a fluid distribution element assembly in accordance with an embodiment; FIG. 13 depicts a temperature distribution line diagram of the fluid distribution element assembly of FIG. 2; FIG. 14 depicts a fluid distribution element assembly in accordance with an embodiment; Figure 14 depicts a temperature distribution line diagram of a fluid dispensing element assembly; Figure 16 depicts a fluid dispensing element assembly in accordance with an embodiment; and Figure 17 depicts a method for plasma processing of a workpiece.

410‧‧‧Spiral groove

420‧‧‧ second end

430‧‧‧ first end

500‧‧‧Fluid distribution component assembly

510‧‧‧Spiral groove

520‧‧‧ Terminal

530‧‧‧Starting end

Claims (22)

A fluid dispensing component assembly for use in a substrate processing system, comprising: a fluid dispensing component having a central portion and a peripheral portion, wherein the fluid dispensing component is configured to be (i) disposed within the processing chamber The process chamber is separate from the plasma generator assembly, and (ii) receives plasma from the plasma generator assembly and is distributed into the process chamber via the fluid distribution member, wherein the fluid distribution member includes a first recess, The first groove is formed between the central portion and the peripheral portion and passes through the fluid distribution member, and wherein the first groove extends along a curved path, wherein the curved path is away from the fluid a manner in which the distance of a fixed point on the distribution element is continuously increasing or continuously decreasing, spiraling relative to the fixed point, wherein the first groove comprises: (i) a starting point, a radius at the fluid distribution element Within 2/3, the radius corresponds to a fixed center point from the fluid dispensing element to the periphery of the fluid dispensing element, and (ii) an end point, wherein the starting point and the end point define the curved path, and The length of the first groove from the starting point to the end point is such that the first groove completely surrounds the fixed point at least once, and wherein the curved path of the first groove allows thermal expansion of the fluid distribution element Having the central portion of the fluid dispensing member configured to: when the fluid dispensing member is heated, the central portion of the fluid dispensing member expands and rotates relative to the peripheral portion of the fluid dispensing member; and when When the fluid dispensing element cools, the central portion of the fluid dispensing element contracts and Rotate in the opposite direction. A fluid dispensing element assembly for use in a substrate processing system according to claim 1 wherein the fluid dispensing element further comprises at least one penetration aperture. A fluid dispensing component assembly for use in a substrate processing system, as claimed in claim 1, wherein the central portion includes a plurality of through holes or grooves. A fluid dispensing component assembly for use in a substrate processing system as claimed in claim 1 wherein the central portion is a non-porous component. A fluid dispensing element assembly for use in a substrate processing system as claimed in claim 1 wherein the curved path is helical in a variable pitch. A fluid dispensing element assembly for use in a substrate processing system according to claim 1 wherein the first groove has a variable width. A fluid dispensing element assembly for use in a substrate processing system, as claimed in claim 1, wherein the fluid dispensing element is substantially planar and substantially has a constant thickness. A fluid dispensing component assembly for use in a substrate processing system according to claim 1 wherein the thickness of the fluid dispensing component varies from the central portion to the peripheral portion. A fluid dispensing component assembly for use in a substrate processing system according to claim 1 wherein the peripheral portion includes at least one sidewall orthogonal to the central portion defining an opening, the opening being configured to direct electricity The pulp passes through the center portion. A fluid dispensing element assembly for use in a substrate processing system as claimed in claim 9 wherein the fluid dispensing element is a hemispherical member or a cup. A fluid dispensing element assembly for use in a substrate processing system as claimed in claim 1 wherein the fixed point is at a fixed center point of the fluid dispensing element. A fluid dispensing component assembly for use in a substrate processing system according to claim 1 wherein the fluid dispensing component comprises a second recess formed between the central portion and the peripheral portion And passing through the fluid distribution member, and the second groove defines a curved path having a shape similar to the curved path of the first groove. A fluid dispensing element assembly for use in a substrate processing system according to claim 12, wherein the second groove is rotationally offset relative to the first groove. A fluid dispensing component assembly for use in a substrate processing system according to claim 13 wherein at least a portion of the first recess passes between the first portion and the second portion of the second recess. A fluid dispensing component assembly for use in a substrate processing system according to claim 1 wherein the fluid dispensing component has a circular cross section and a fixed center point, and wherein the fixed point is co-located with the fixed center point. A fluid dispensing component assembly for a substrate processing system, comprising: a fluid dispensing component configured to be (i) disposed within a processing chamber, the processing chamber being separate from the plasma generator assembly, and (ii) from the Plasma generation The assembly receives plasma and is distributed into the process chamber via the fluid distribution member; and a first recess formed through the fluid distribution member and includes an end and an opposite end, wherein the first groove is along Extending a curved path that is helical relative to a fixed point on the fluid distribution member, wherein the end of the first groove is located closer to the fixed point than the opposite end, wherein the end is a point along the first groove between the opposite ends is located at an increasing radial distance from the fixed point, wherein the length of the first groove is such that the first groove completely surrounds the fixed point at least once And wherein the curved path of the first groove permits thermal expansion of the fluid dispensing element such that the central portion of the fluid dispensing element is configured to: when the fluid dispensing element is heated, the central portion of the fluid dispensing element The portion expands and rotates relative to the peripheral portion of the fluid dispensing member; and as the fluid dispensing member cools, the central portion of the fluid dispensing member contracts and rotates in a reverse direction. A fluid dispensing element assembly for a substrate processing system according to claim 16 wherein the fixed point is at a fixed center point of the fluid dispensing element. The fluid dispensing component assembly for a substrate processing system of claim 16 wherein: the fluid dispensing component comprises a second recess through which the second recess passes A fluid distribution member is formed, and the second groove defines a curved path having a shape similar to the curved path of the first groove. The fluid dispensing element assembly for a substrate processing system of claim 18, wherein the second groove is rotationally offset relative to the first groove. A fluid dispensing element assembly for a substrate processing system according to claim 19, wherein at least a portion of the first groove passes between the first portion and the second portion of the second groove. A fluid dispensing element assembly for a substrate processing system according to claim 16 wherein the fluid dispensing element has a circular cross section and a fixed center point, and wherein the fixed point is co-located with the fixed center point. A fluid dispensing element assembly for a substrate processing system according to claim 16 wherein the curved path is helical in a variable pitch.