TWI584025B - Screen control module for a mobile electronic device and its touch panel controller - Google Patents

Description

Screen control module of mobile electronic device and touch panel controller thereof

The invention relates to a screen control module of a mobile electronic device and a touch panel controller thereof, in particular to a screen control module capable of expanding a volume aspect ratio to meet the requirement of a mobile electronic device to reduce the width of a screen frame.

Due to the rise of Tablet Computer, the market share of various computers in the existing computer market has been reshuffled and a push effect has been formed. It is generally believed that the most affected by the tablet is the notebook. From the perspective of fashion and technology, the reasons why tablets can sweep the market are not difficult to imagine, but from a practical point of view, notebook computers still have the advantages and features that tablet PCs cannot exceed. For example, a tablet computer supports humanized intuitive operation with an excellent touch interface, but in the case where a large amount of input text is required, the disadvantage of handwriting input is obviously exposed, because the handwriting speed is far less than the input speed of using the keyboard to count the number of crosses per minute. . Although notebooks are not as good as tablets in terms of size, weight, and battery standby time, notebook computers still retain the status that tablets cannot completely replace based on different purposes and uses.

As can be seen from the above, the notebook computer can still maintain certain advantages in the market, and the industry continues to develop and improve the related technologies of the notebook computer. Among the various technologies developed and improved, the screen cover of the notebook computer is also one of the most concerned items. As shown in FIG. 8, the notebook computer is known to include a host 70 having a keyboard 71 and a pivoting device. A screen upper cover 72 of the display 73 is embedded on one side edge of the main unit 70. Referring to FIG. 9, the known upper cover 72 has a rectangular frame 720 on the inner side of the main body 70. The display 73 is disposed inside the frame 720, and the effective display area of the display 73 is defined by the frame 720. In this case, the width W of the bezel 720 directly affects the effective display area size of the display 73. However, the frame 720 of the upper cover 72 has the necessity of its existence, and its main function is the fixing and protection of the display 73, and more importantly, the display 73 and/or the touch panel (if the display 73 is used) A screen control module that is covered with a touch panel is also disposed within the bezel 720.

The so-called screen control module is mainly provided with one or more controllers 81 on a circuit board 80. The controller 81 is electrically connected through the lines on the circuit board 80 and the connector 82 and the display 73 and/or the touch panel. When the consumer market has a need to further enlarge the effective display area of the display 73, it is first necessary to consider reducing the width of the bezel 720 of the upper cover 72. However, the width of the reduced frame 720 must be considered together with the width of the screen control module, only on the screen. If the width of the control module may be reduced, the frame 720 may be reduced.

However, with the configuration of the existing screen control module, there is a real obstacle to narrowing the width. Referring to FIG. 10, the above-mentioned screen control module mainly has more than one controller 81 and more than one connection on the circuit board 80. The device 82 and the plurality of passive components 83, and reducing the width of the screen control module, firstly, the width of the circuit board 80 must be reduced, but whether the circuit board 80 can reduce its width, depending on the component size mounted thereon, The main component is the controller 81, but the package configuration of the controller 81 has a considerable width. In this case, the width of the circuit board 80 must be greater than the width of the controller 81 to meet the requirements of the mounting components.

It can be seen from the above that the notebook computer market has a further requirement for the effective display area of the display on the screen cover. To expand the effective display area, the width of the border of the screen cover must be reduced, and the width of the frame is limited by the width of the built-in screen control module. Because of the limitation, in order to reduce the width of the border of the screen cover, it is necessary to propose a specific solution for reducing the width of the screen control module.

The main purpose of the present invention is to provide a screen control module for a mobile electronic device, which mainly mounts a touch panel controller with a package on a circuit board, and the plurality of electrical contacts on the package body are respectively in the length direction and the width direction. Arranged, and the number of electrical contacts disposed along the length direction is greater than the number of electrical contacts disposed along the width direction, thereby being applicable to a carrier having an elongated electrical connection interface, allowing the circuit board to expand its length and width. The ratio can be used to reduce the width of the screen control module to eliminate the barrier of the existing notebook computer to reduce the width of the screen cover. At the same time, the number of fiberglass layers in the dielectric layer of the package is increased to further improve the flexural strength.

The main technical means for achieving the foregoing objective is that the screen control module of the mobile electronic device includes: a circuit board having a plurality of pads arranged along a first direction and a second direction respectively, and along the The number of pads disposed in the first direction is greater than the number of pads disposed along the second direction; and one or more touch panel controllers are formed by an integrated circuit having a package including a plurality of Electrical contacts respectively arranged along a length direction and a width direction, and the length direction corresponds to a first direction of the circuit board, the width direction corresponds to a second direction of the circuit board, and the plurality of electrical properties of the package body The contact corresponding to the plurality of pads electrically connected to the circuit board; wherein the package has a loading plate, the package carrier has a dielectric layer and two metal layers, and the dielectric layer is disposed on the two metal layers between.

In the screen control module of the mobile electronic device, the package of the touch panel controller can be applied to a carrier having a long and narrow electrical connection interface, such that the circuit board width of the screen control module can be transmitted through a narrow shop connection interface. The design of the carrier has been correspondingly reduced, making it possible to reduce the size of the border of the screen to expand the effective display area of the display.

Another object of the present invention is to provide a touch panel controller for a screen control module, which has a special size of a package body, and has a length to width ratio of between 2 and 4, which can satisfy an application having a long and narrow electrical connection interface.

The technical means for achieving the foregoing objective is that the touch panel controller of the foregoing screen control module is composed of an integrated circuit having a package body, and the package body of the touch panel controller is respectively disposed along a length direction. And a plurality of electrical contacts arranged in a width direction, wherein the number of electrical contacts disposed along the length direction is greater than the number of electrical contacts disposed along the width direction, wherein the package has a loading plate. The package carrier has a dielectric layer and two metal layers, and the dielectric layer is disposed between the two metal layers.

Since the length and width ratio of the package of the controller are between 2 and 4, the width of the package of the touch panel controller is reduced, and the width of the circuit board of the screen control module is correspondingly reduced. It is possible that the upper cover of the screen reduces its border to expand the effective display area of the display.

The mobile electronic device referred to in the present invention includes, but is not limited to, a notebook computer, an electronic dictionary, and other electronic devices having a clamshell structure and having the display on the screen cover. When the screen control module is applied to the notebook, it is installed in the screen cover of the notebook.

Referring to FIG. 1 , a screen control module is mainly provided with one or more controllers 20 and more than one connector 31 , 32 on a circuit board 10 . Or a plurality of passive components 33 are further provided. In this embodiment, the circuit board 10 is provided with two controllers 20, two connectors 31, 32 and a plurality of passive components 33, which must be stated: For the sake of example, it is not intended to limit the specific components of the screen control module. The screen control module is connected to the liquid crystal display panel and/or the touch panel in the upper cover of the screen through the connectors 31 and 32. When the liquid crystal display panel is connected, the at least one controller 20 is a liquid crystal panel controller. When the control panel is connected, at least one controller 20 functions as a touch panel controller.

In the embodiment, the circuit board 10 is mounted on the surface of the controller 20, the connectors 31, 32 and the passive component 33. The mounting of the connectors 31, 32 and the passive component 33 can be respectively soldered using a plug-in surface. Adhesive (SMT) and other methods, which are known technologies, will not be described again.

The circuit board 10 is elongated and has a length and a width ranging from 50 to 80 mm and a width of 9 mm or less. Further, the surface of the circuit board 10 is provided with one or more elongated electrical connection interfaces 11 for mounting the controller 20, and the electrical connection interface 11 is composed of a plurality of pads 110 formed on the surface of the circuit board 10, the pads 110 is respectively arranged along a first direction and a second direction. In the embodiment, the first direction refers to the length direction of the circuit board 10, and the second direction refers to the length direction of the circuit board 10 perpendicular to the length direction. In the width direction, that is, the pads 110 are arranged in a matrix, and the number of pads 110 in the length direction is larger than the number of pads 110 in the width direction, for example, the pads 110 in the length direction. There are 20, and the number of pads 110 in the width direction is eight.

Referring to FIG. 2, the controller 20 is composed of an integrated circuit and has a package body 200 having a length L and a width W, the length L being greater than the width W, and the length and the width. The ratio is not less than 2, and the ratio that can be achieved ranges from 2 to 4. The dimensions of the package 200 that can be achieved are: length not greater than 20 mm, preferably 10 to 13 mm, and width less than or equal to 6 mm. Therefore, the package body 200 is formed in a narrow shape, and the bottom surface of the package body 20 is provided with not less than 100 plurality of electrical contacts 210, respectively, along the length direction of the package body 200. Arranging in the width direction, and the length direction of the package body 200 corresponds to the first direction, and the width direction perpendicular to the length direction of the package body 200 corresponds to the second direction, that is, the electrical contacts 210 The number of the electrical contacts 210 in the length direction is greater than the number of the electrical contacts 210 in the width direction, and the arrangement and position are matched with the respective pads 110 on the circuit board 10, so Corresponding to electrical connection.

The following is a description of the possible length and width ratios of the plurality of packages 200 and the number of corresponding electrical contacts 210:

The form of the electrical contact 210 of the package 200 of the controller 20 is different depending on the packaging technology used. In the embodiment, the controller 20 is a ball grid array (BGA) component, and thus the package 200 The upper electrical contact 210 is composed of solder balls; in addition, when the controller 20 is a chip size package (CSP) component or a wafer level wafer size package (WLCSP) component, the electrical contact on the package 200 Point 210 is still composed of solder balls. If the controller 20 is a contactless array (LGA) component of a solderless ball, the electrical contact 210 on the package 200 is formed by a solder pad on the bottom surface thereof.

As can be seen from the above, the screen control module of the present invention is such that the plurality of pads 110 on the circuit board 10 are arranged in the first direction and the second direction, respectively, and the number of pads 110 disposed along the first direction is greater than The number of the pads 110 disposed in the two directions is configured to form a long and narrow electrical connection interface 11 for correspondingly connecting with the controller 20 having the plurality of electrical contacts 210 and arranged in the same form; in the foregoing matching relationship, the controller 20 The package 200 is enlarged in proportion to its length L and width W. In the case where the length L is elongated and the width W is reduced, the controller 20 can reduce the relative width ratio (width to width) to the board 10 (see FIG. 2). As shown, the width of the board 10 and the overall width of the screen control module are reduced, thereby eliminating the limitation of reducing the width of the border of the screen cover but limited by the screen control module. Therefore, as shown in FIG. 3 and FIG. 4, when the screen control module is mounted on the screen upper cover 61 of the notebook computer 60, the width W1 of the frame 610 of the screen upper cover 61 is reduced, thereby expanding the effective display area of the display.

As can be seen from the foregoing embodiments, the present invention lengthens the aspect ratio of the package 200 of the controller 20 to reduce the relative width ratio between the package and the board 10. In order to ensure that the controller 20 does not undergo a warp phenomenon during installation (for example, reflow), the present invention further proposes the following technical solutions to cope with possible flexing problems:

One of the technical solutions is to make the controller 20 use a wafer level chip size package (WLCSP) component. Referring to FIG. 5, a wafer level wafer size package component is disclosed, mainly on a surface of a substrate 40. A wafer 41 is disposed, a protective layer 42 is disposed around the wafer 41, and a plurality of pads 43 are disposed on the surface of the wafer 41. The upper layer of the wafer 41 and the protective layer 42 are further covered with a dielectric layer 44. The dielectric layer 44 has an inner layer line 440, and solder balls 45 are implanted on the surface, and the solder balls 45 are electrically connected to the bumps 43 on the wafer 41 through the inner layer wiring 440 of the dielectric layer 44.

The wafer-level chip-scale package component as described above is completed in the wafer process, and the wafer 41 and the germanium substrate 40 are both twinned materials, so the heat wave coefficient of the joint surface is small, which can effectively reduce the reflow time. The deflection effect of the heat on the component.

Another technical method adopted by the present invention uses a CCL substrate as a package carrier, and utilizes the flexural resistance of the CCL substrate in response to the deflection effect on the package carrier during reflow. Referring to FIG. 6A, a typical chip size (CSP) component is mainly provided on the surface of a loading board 50 with a wafer 51 having an inner layer line and a plurality of bumps 54 formed on the surface. A plurality of solder balls 52 are implanted on the bottom surface thereof, and the bumps 54 and the solder balls 52 are connected to each other through the inner layer line; the surface of the wafer 51 is provided with a solder pad, and the bumps 54 on the surface of the package carrier 50 are electrically connected. The connection is followed by forming a glue layer 53 on the package carrier 50 and the wafer 51 to complete the package.

As shown in FIG. 6B, a wafer size (CSP) device using flip chip (FC) technology is mainly provided on a surface of a loading board 50 to form a wafer 51 on a flip chip (FC). The plate 50 has an inner layer line, and a plurality of bumps 54 are formed on the surface, and a plurality of solder balls 52 are implanted on the bottom surface thereof. The bumps 54 and the solder balls 52 are connected to each other through the inner layer line; the wafer 51 is coated with solder balls on the surface thereof. 55, electrically connected to the bump 54 on the surface of the package carrier 50 by flip chip bonding, and then a glue layer 53 is formed on the package carrier 50 and the wafer 51 to complete the package.

When the package carrier 50 is composed of a CCL substrate, the structure is as shown in FIG. 7 , and the multi-layer dielectric layer 501 and the plurality of copper circuit layers 502 are overlapped to form a multi-layer substrate, wherein each dielectric layer 501, 501 A fiberglass cloth 503 is provided in each of A. In order to improve the flexural strength of the multilayer substrate, the present invention can reduce the thickness of the fiberglass cloth 503 in at least one dielectric layer 501A, but increase the number of fiberglass layers in the dielectric layer 501A, that is, in the dielectric. Two or more layers of the fiberglass cloth 503 are disposed in the layer 501A. For example, when the dielectric layer 501A has a thickness of 0.15 mm, the original fiberglass cloth 503 having a thickness of 0.14 mm (item number 1056) can reduce the fiberglass cloth 503. The thickness is up to 0.05 mm (item 1086) and the number of layers is increased. When the thickness of the dielectric layer 501A is 0.25 mm, the original thickness of the fiberglass cloth 503 having a thickness of 0.09 mm (item 2116) can reduce the thickness of the fiberglass cloth 503 to 0.08 mm (item number 3313). Increase the number of layers.

Generally, the CCL substrate is provided with a fiberglass cloth 503 in the dielectric layer 501, 501A, which has a considerable resistance to deflection. The invention increases the number of layers of the fiberglass cloth 503 in the dielectric layer 501A of the original thickness, thereby further enhancing the resistance. Flexural strength.

As can be seen from the above, the screen control module of the present invention is provided with a plurality of pads arranged on the circuit board in the first direction and the second direction, respectively, and the number of pads disposed along the first direction is greater than that along the second The number of pads disposed in the direction to form a long and narrow electrical connection interface; and a controller is provided with a plurality of electrical contacts in the same arrangement on the elongated package for corresponding connection; under the foregoing design, The controller package can expand its length to width ratio. Under the condition that the length is elongated and the width is reduced, the controller can reduce the relative width ratio of the board, so the width of the board can be reduced, so that the screen control module The overall width can also be reduced to meet the need to reduce the width of the border of the screen cover.

10‧‧‧ boards
11‧‧‧Electrical connection interface
110‧‧‧ solder pads
20‧‧‧ Controller
200‧‧‧ package
210‧‧‧Electrical contacts
31,32‧‧‧Connector
33‧‧‧ Passive components
40‧‧‧矽 substrate
41‧‧‧ wafer
42‧‧‧Protective layer
43‧‧‧Bumps
44‧‧‧ dielectric layer
440‧‧‧ Inner line
45‧‧‧ solder balls
50‧‧‧Package carrier
51‧‧‧ wafer
52,55‧‧‧ solder balls
53‧‧‧ Sealing layer
54‧‧‧Bumps
501,501A‧‧‧ dielectric layer
502‧‧‧ copper circuit layer
503‧‧‧glass cloth
60‧‧‧Note Computer
61‧‧‧Screen cover
610‧‧‧Border
70‧‧‧Host
71‧‧‧ keyboard
72‧‧‧Screen cover
720‧‧‧Border
73‧‧‧ display
80‧‧‧ boards
81‧‧‧ Controller
82‧‧‧Connector
83‧‧‧ Passive components

1 is an external view of a screen control module of the present invention. 2 is a plan view of a screen control module of the present invention. Figure 3 is an external view of the screen control module of the present invention installed on a notebook computer. Figure 4 is a plan view of the screen control module of the present invention in the upper cover of the screen. Figure 5 is a plan view of a wafer level wafer size package component employed by the controller of the present invention. Figures 6A, 6B are plan views of two wafer-sized package components employed by the controller of the present invention. 7 is a plan view of a package carrier used in the touch panel controller of the present invention. Figure 8 shows the appearance of an existing notebook. Figure 9 is a plan view showing the screen control module of the existing notebook computer in the screen cover. Figure 10 is a plan view of an existing screen control module.

10‧‧‧ boards

20‧‧‧ Controller

200‧‧‧ package

31,32‧‧‧Connector

33‧‧‧ Passive components

Claims (6)

A screen control module for a mobile electronic device includes: a circuit board having a plurality of pads arranged along a first direction and a second direction, and the number of pads disposed along the first direction is greater than The number of pads disposed in the second direction; and one or more touch panel controllers are formed by an integrated circuit having a package body including a plurality of lengths and a width direction respectively Arranging the electrical contacts, and the length direction corresponds to the first direction of the circuit board, the width direction corresponding to the second direction of the circuit board, and the plurality of electrical contacts of the package body are electrically connected to the circuit board a plurality of solder pads, wherein the length of the package of the touch panel controller is no more than 20 mm and the width is less than or equal to 6 mm, and the ratio of the length to the width of the package of the touch panel controller is between 2 and 4; wherein the package is The body has a loading plate having a dielectric layer and two metal layers, the dielectric layer being disposed between the two metal layers. The screen control module of the mobile electronic device of claim 1, wherein the dielectric layer comprises two or more layers of fibers. The screen control module of the mobile electronic device of claim 2, wherein the fiber layer is a fiberglass cloth. A touch panel controller of a screen control module is composed of an integrated circuit having a package body, and the package body of the touch panel controller is provided with a plurality of electric wires arranged along a length direction and a width direction respectively. The number of electrical contacts disposed along the length direction is greater than the number of electrical contacts disposed along the width direction. The length of the package of the touch panel controller is not more than 20 mm, and the width is less than or equal to 6 mm. The ratio of the length to the width of the package of the touch panel controller is between 2 and 4. The package has a loading board having a dielectric layer and two metal layers. A layer is disposed between the two metal layers. The touch panel controller of claim 4, wherein the dielectric layer comprises two or more layers of fibers. The touch panel controller according to claim 5, wherein the fiber layer is a fiberglass cloth.