TWI582705B - Fingerprint sensor packaging module and manufacation method thereof - Google Patents

Description

Fingerprint sensing package module and manufacturing method thereof

A fingerprint sensing package module and a manufacturing method thereof, in particular to a fingerprint sensing package module having a cover layer.

With the development of technology, electronic devices such as mobile phones, personal notebook computers or tablets have become a must-have tool in life, and the information stored in these electronic systems, such as contacts and photos, has become quite personal. specialty. In order to avoid the loss or misappropriation of important information, fingerprint sensing package modules have been widely used in electronic devices.

At present, the common fingerprint sensing package module electrically connects the fingerprint sensing chip to the circuit substrate through wire bonding, and then covers the package material. Generally, in the encapsulation process, the thickness of the encapsulating material must be higher than the arc height of the wire, so as to prevent the wire from being broken due to the force when the user touches the sensing. However, this will make the overall size of the package module large and thick, so it is difficult to further reduce the overall thickness of the electronic device.

An embodiment of the present invention provides a fingerprint sensing package module, including a cover layer, a conductive pattern layer, an adhesive layer, a circuit board, a fingerprint sensing wafer, a conductive pattern layer, and a package. The adhesive layer is on the cover layer. The circuit board has a first surface, and the circuit board includes a plurality of pads on the first surface. The first surface of the circuit board is disposed on the cover layer through the adhesive layer, and the circuit board has at least one slot. The fingerprint sensing chip has a sensing surface and includes a plurality of contacts on the sensing surface. The sensing surface of the fingerprint sensing chip is disposed on the cover layer through the adhesive layer and is received in the slot. The conductive pattern layer is located on the first surface and the sensing surface to electrically connect the pads and the contacts. The package is at least partially located within the slot to cover the fingerprint sensing wafer.

The present invention provides a method for fabricating a fingerprint sensing package module, comprising: disposing a circuit board on a carrier substrate, wherein the circuit board has a first surface, and the circuit board includes a plurality of pads on the first surface, the circuit board having at least a slot; providing at least one fingerprint sensing chip in the at least one slot, wherein the fingerprint sensing chip has a sensing surface and includes a plurality of contacts on the sensing surface, and the sensing surface of the fingerprint sensing chip is disposed on the bearing On the substrate; filling the package in the slot, and the package covers at least the fingerprint sensing wafer; removing the carrier substrate; and forming a conductive pattern layer to electrically connect the pads and the contacts.

In summary, the embodiment of the present invention provides a fingerprint sensing package module, including a cover layer, an adhesive layer, a circuit board, a fingerprint sensing wafer, a conductive pattern layer, and a package. The circuit board having the slot is disposed on the cover layer through the adhesive layer. The fingerprint sensing wafer is disposed on the cover layer through the adhesive layer and is received in the slot. The package is disposed within the slot to cover at least a portion of the fingerprint sensing wafer. The circuit board is used as a support for the overall module, which can improve the structural strength of the overall module, and the internal conductive ring can be electrically connected to the pad by circuit wiring. The conductive pattern layer is used to electrically connect the pads of the circuit board and the contacts of the fingerprint sensing chip. When a finger or other object is applied to the cover layer, the driving signal can be transmitted to the pad of the circuit board through the contact of the fingerprint sensing chip through the conductive pattern layer, and then transmitted to the inner conductive ring of the circuit board to make the fingerprint The sensing chip transmits the driving signal through the internal conductive ring to achieve the function of fingerprint recognition. In general, a conventional fingerprint sensing chip is disposed on a circuit substrate by wire bonding, and the package needs to be higher than the arc height of the wire. Therefore, the sensing surface of the fingerprint sensing chip of the conventional fingerprint sensing chip package module is farther from the cover layer touched by the finger. The sensing surface of the fingerprint sensing wafer by the embodiment of the present invention is closer to the cover layer than the prior art.

A method for manufacturing a fingerprint sensing package module according to an embodiment of the present invention is to adhere a circuit board and a fingerprint sensing wafer to a carrier substrate, wherein the fingerprint sensing chip is received in a slot of the circuit board. The package is filled in the slot to cover the fingerprint sensing wafer. Then, the carrier substrate is removed. A conductive pattern layer is formed to electrically connect the pads and the contacts. The conductive pattern layer is protected by the second protective layer. Next, the cover layer is overlaid on the second protective layer by an adhesive layer, and the circuit board is diced in the singulation process to form at least one fingerprint sensing package unit. In an embodiment, the fingerprint sensing package module (ie, the fingerprint sensing package module) is assembled with the electronic device having the fingerprint recognition function, and the fingerprint sensing package module is disposed on the electronic device. The cover is in the through hole so that the user's finger can touch the fingerprint to sense the cover layer of the package module.

In addition, in the manufacturing method of the fingerprint sensing package module according to another embodiment of the present invention, after the step of forming the second protective layer on the conductive pattern layer, the circuit board is cut to form at least one fingerprint sensing package unit. In one embodiment, the fingerprint sensing package unit is directly disposed on the touch cover of the electronic device through the adhesive layer, and is electrically connected to the touch cover through the circuit board. That is to say, the touch cover does not need to be provided with a through hole to accommodate the fingerprint sensing package unit. Accordingly, the fingerprint sensing package unit is convenient to be directly mounted on a touch device that needs to have a fingerprint recognition function, such as a smart phone.

FIG. 1A is a schematic structural diagram of a fingerprint sensing package module according to a first embodiment of the present invention. FIG. 1B is a partial top plan view of a fingerprint sensing package module according to a first embodiment of the present invention. Referring to FIGS. 1A and 1B , the fingerprint sensing package module 100 includes a cover layer 110 , an adhesive layer 120 , a circuit board 130 , a fingerprint sensing wafer 140 , a conductive pattern layer 150 , and a package 160 . The adhesive layer 120 is on the cover layer 110. The circuit board 130 is attached to the cover layer 110 through the adhesive layer 120 and has a slot H1. The fingerprint sensing wafer 140 is received in the slot H1. The conductive pattern layer 150 is electrically connected to the fingerprint sensing chip 140 and the circuit board 130. The package body 160 is disposed in the slot H1 and covers the fingerprint sensing chip 140.

The cover layer 110 is used as a protective cover for the whole module, which can be touched by a user's finger. In practice, the cover layer 110 can be a light transmissive substrate, such as a glass substrate, a plastic substrate, or a sapphire substrate. Alternatively, the cover layer 110 can also be a touch cover applied to a touch device.

The adhesive layer 120 is on the cover layer 110. Specifically, the adhesive layer 120 is an adhesive material that is viscous. The circuit board 130 and the fingerprint sensing chip 140 can be disposed on the cover layer 110 through the adhesive layer 120.

The circuit board 130 has a first surface S1 and a second surface S2 opposite to the first surface S1, and the first surface S1 of the circuit board 130 is adhered to the cover layer 110 through the adhesive layer 120. In practice, the circuit board 130 is used to implement an electrical connection design and a support body as an integral module. The circuit board 130 includes at least one dielectric layer, circuit wiring (not shown), and a plurality of pads 132. The circuit wiring may be distributed on the first surface S1, the second surface S2 or the dielectric layer to serve as a line for electrically connecting the components. The pad 132 is located on the first surface S1 for electrically connecting to the fingerprint sensing chip 140. In practice, the pads 132 can be electrically connected to at least a portion of the circuit wirings according to the overall electrical connection requirements, and the invention is not limited thereto. The circuit board 130 has a slot H1 that penetrates from the first surface S1 of the circuit board 130 to the second surface S2. In this embodiment, the height of the slot H1 may be greater than the thickness of the fingerprint sensing wafer 140. However, in other embodiments, the height of the slot H1 may be approximately equal to the thickness of the fingerprint sensing wafer 140. In addition, in the embodiment, the circuit board 130 further includes an inner conductive ring 134 on the first surface S1. The inner conductive ring 134 is an annular circuit wiring pattern and surrounds the fingerprint sensing wafer 140. The inner conductive ring 134 can be electrically connected to the pad 132 by circuit wiring (for example, the wiring 136 shown in FIG. 1B). However, the present invention does not limit the manner in which the inner conductive ring 134 is electrically connected to the fingerprint sensing wafer 140.

The fingerprint sensing chip 140 is received in the slot H1 of the circuit board 130. The fingerprint sensing wafer 140 has a sensing surface SA, and the sensing surface SA of the fingerprint sensing wafer 140 is attached to the cover layer 110 through the adhesive layer 120. The fingerprint sensing wafer 140 includes a plurality of contacts 142 on the sensing surface SA that can output the signals of the fingerprint sensing wafer 140.

The conductive pattern layer 150 is located on the first surface S1 of the circuit board 130 and the sensing surface SA of the fingerprint sensing wafer 140. The conductive pattern layer 150 is electrically connected to the pads 132 of the circuit board 130 and the contacts 142 of the fingerprint sensing chip 140, so that the driving signals are transmitted through the conductive pattern layer 150 and transmitted to the circuit by the contacts 142 of the fingerprint sensing chip 140. The pads 132 of the board 130 are transferred to the inner conductive ring 134 to pass the fingerprint sensing chip 140 through the inner conductive ring 134 to output a driving signal for fingerprint recognition. In practice, the circuit pattern of the conductive pattern layer 150 can be designed according to circuit connection requirements. For example, the conductive pattern layer 150 can be a redistribution layer (RDL).

In practice, the conductive pattern layer 150 is formed by a yellow light process, and thus the fingerprint sensing package module 100 may further include a first protective layer P1 and a second protective layer P2 to form a conductive pattern through a patterning process. Layer 150. The first protective layer P1 covers the first surface S1 of the circuit board 130' and the pads 132 thereon and the sensing surface SA covering the fingerprint sensing chip 140 and the contacts 142 located thereon, so that the first The surface S1 and the sensing surface SA are flattened. The first protective layer P1 has a plurality of openings T1, and the positions of the openings T1 correspond to the positions of the pads 132 of the circuit board 130' and the contacts 142 of the fingerprint sensing wafer 140. The conductive pattern layer 150 is located on the first protective layer P1 and in the opening T1. The second protective layer P2 covers the conductive pattern layer 150 and a portion of the first protective layer P1, and mainly planarizes the conductive pattern layer 150 located on the first surface S1. Generally, the material of the first protective layer P1 and the second protective layer P2 may be polyimide or photoresist.

The package body 160 is at least partially located within the slot H1 to cover the fingerprint sensing wafer 140. In particular, the package 160 is used to encapsulate the fingerprint sensing wafer 140 and reduce moisture intrusion. The material of the package body 160 may be an underfill, filled in the slot H1 through the dispensing process, and a gap between the fingerprint sensing wafer 140 and the contact 142, and covering the fingerprint sensing wafer 140. Alternatively, the material of the package 160 may be an Epoxy Molding Compound (EMC) commonly used in general packaging, and is fabricated by a compression molding process.

2A to 2J are schematic views respectively showing the steps of manufacturing a fingerprint sensing package module according to an embodiment of the present invention. Please refer to FIG. 2A to 2J in order.

First, referring to Fig. 2A, the circuit board 130' is disposed on the carrier substrate C1. In practice, the adhesive material G1 is applied to the surface of the carrier substrate C1 so that the first surface S1 of the circuit board 130' can be attached to the carrier substrate C1. The adhesive material G1 may be a thermal adhesive tape, a double-sided adhesive, a viscous ink or a viscous paint, and can be removed in a subsequent treatment process. The carrier substrate C1 may be a supporting substrate having a supporting function such as a glass substrate, a sapphire substrate, or a plastic substrate. It should be noted that the circuit board 130 ′ may be a circuit board panel or a circuit substrate strip. The circuit board 130 of the fingerprint sensing package module 100 is subjected to subsequent singulation. Circuit board 130'. The circuit board 130' has at least one slot H1 and circuit wiring (not shown) on the first surface S1, the pad 132 and the inner conductive ring 134, and the inner conductive ring 134 surrounds the slot H1, and the inner conductive ring 134 It can be electrically connected to the pad 132 by circuit wiring.

Referring to FIG. 2B, at least one fingerprint sensing wafer 140 is disposed in at least one of the slots H1. In practice, the fingerprint sensing wafer 140 is disposed on the surface of the carrier substrate C1 through the adhesive material G1, and the sensing surface SA and the contact 142 located on the sensing surface SA are in contact with the adhesive material G1.

Referring to FIG. 2C, the package 160 is filled in the slot H1. The package 160 covers at least the fingerprint sensing wafer 140 to encapsulate the fingerprint sensing wafer 140 and reduce moisture intrusion. Specifically, the package body 160 may be formed by filling a filling glue in the slot H1 and a gap between the fingerprint sensing wafer 140 and the contact 142 by a dispensing process, and covering the fingerprint sensing wafer 140. Alternatively, the package body 160 can be completed by filling the epoxy molding material into the slot H1 through a press molding process.

Referring to FIG. 2D, the carrier substrate C1 is removed. Specifically, the adhesive material G1 is removed to separate the carrier substrate C1 from the circuit board 130', the fingerprint sensing wafer 140, and the package body 160, and is at least exposed and located on the first surface S1 of the circuit board 130'. The pads 132 and the contacts 142 on the sensing surface SA of the fingerprint sensing wafer 140 are exposed. In general, if the adhesive material G1 is a thermal adhesive tape, the thermal release adhesive tape can be lost in viscosity by heating to facilitate peeling off the carrier substrate C1. In addition, if the viscous material G1 is a double-sided tape, a viscous ink or a viscous paint, etc., it may be removed by a mechanical method, for example, scraping with a doctor blade, sanding with a sandpaper, or the like. Alternatively, the viscous material G1 may be etched by a solvent. The invention is not limited thereto.

Referring to FIG. 2E, the method for fabricating the fingerprint sensing package module may further include forming a first protective layer P1 overlying the circuit board 130' and the fingerprint sensing wafer 140. In detail, before the step of forming the conductive pattern layer 150, the first protective layer P1 is formed to cover the first surface S1 of the circuit board 130' and the pads 132 thereon and the sensing of the fingerprint sensing wafer 140 The surface SA and the contact 142 located thereon planarize the first surface S1 and the sensing surface SA. Specifically, the material of the first protective layer P1 may be polyimide (PI) or photoresist. In the present embodiment, the thickness of the first protective layer P1 may be slightly higher than the height of the pads 132 and the contacts 142, and the present invention does not limit the thickness of the first protective layer P1.

Referring to FIG. 2F, a plurality of openings T1 are formed in the first protective layer P1. In detail, the positions of the openings T1 correspond to the positions of the pads 132 of the circuit board 130' and the contacts 142 of the fingerprint sensing chip 140 to expose the pads 132 and the contacts 142.

Referring to FIG. 2G, a conductive material is formed on the first protective layer P1 and in the opening T1. In practice, spray plating or injection filling the conductive material on the first protective layer P1 and filling the opening T1 to form the conductive layer CL.

Next, referring to FIG. 2H, the conductive layer CL on the first protective layer P1 is patterned by a yellow light process to form the conductive pattern layer 150. The conductive pattern layer 150 is formed on the first protective layer P1 and in the opening T1 for electrically connecting the pad 132 and the contact 142. It should be noted that, in this embodiment, the conductive pattern layer 150 is a rewiring layer, so that the lines of the fingerprint sensing wafer 140 are rewired on the periphery of the sensing surface SA of the fingerprint sensing wafer 140.

Referring to FIG. 2I, the second protective layer P2 is formed to cover the conductive pattern layer 150 and a portion of the first protective layer P1, and the conductive pattern layer 150 located on the first surface S1 is mainly planarized. Generally, the material of the second protective layer P2 may be polyimide or photoresist.

Referring to FIG. 2J, an adhesive layer 120 is formed on the second protective layer P2. Specifically, the adhesive layer 120 is an adhesive material that is viscous. Next, the cover layer 110' is overlaid on the second protective layer P2. In this embodiment, the cover layer 110 ′ may be a large-sized permeable substrate, such as a glass substrate, a plastic substrate or a sapphire substrate. The cover layer 110 of the fingerprint sensing package module 100 is The cover layer 110' is subjected to subsequent singulation. Next, in the present embodiment, the circuit board 130' is cut to form a plurality of fingerprint sensing package units U1. The fingerprint sensing package unit M1 is substantially equivalent to the fingerprint sensing package module 100 as illustrated in FIG. 1A. It should be noted that, in this embodiment, when the singularized fingerprint sensing package module 100 is assembled with the electronic device having the fingerprint recognition function, a through hole is formed on the surface of the cover of the electronic device, and the fingerprint is The sensing package module 100 is disposed in the through hole of the cover of the electronic device, so that the finger of the user can touch the cover layer 110 of the fingerprint sensing package module 100. The sensing surface SA of the fingerprint sensing wafer 140 can be closer to its cover layer than conventional techniques.

3A to 3B are schematic diagrams showing the steps of manufacturing a fingerprint sensing package module according to a second embodiment of the present invention. Please refer to FIG. 3A to 3B in order.

The step of FIG. 3A is to follow the steps of FIG. 2I of the first embodiment of the present invention. Referring to FIG. 3A, after the step of forming the second protective layer P2 over the conductive pattern layer 150, the circuit board 130' is cut to form a plurality of The fingerprint sensing package unit U1.

Referring to FIG. 3B, an adhesive layer 120 is formed on the second protective layer P2. Next, the cover layer 110 is overlaid on the second protective layer P2. In this embodiment, the cover layer 110 is a touch cover applied to the touch device. Herein, the fingerprint sensing package module 100 illustrated in FIG. 1A is substantially completed. It is to be noted that the fingerprint sensing package unit U1 of the present embodiment can be directly disposed on the touch cover through the adhesive layer 120 and can be electrically connected to the touch cover through the circuit board 130. That is to say, the touch cover does not need to be provided with a through hole to accommodate the fingerprint sensing package unit U1. According to the method for manufacturing the fingerprint sensing package module of the second embodiment of the present invention, the fingerprint sensing package unit U1 is conveniently installed directly on a touch device having a fingerprint recognition function, such as a smart phone. Compared to the prior art, the sensing surface SA of the fingerprint sensing wafer 140 can be closer to the touch cover (ie, the cover layer 110).

In summary, the embodiment of the present invention provides a fingerprint sensing package module, including a cover layer, an adhesive layer, a circuit board, a fingerprint sensing wafer, a conductive pattern layer, and a package. The circuit board having the slot is disposed on the cover layer through the adhesive layer. The fingerprint sensing wafer is disposed on the cover layer through the adhesive layer and is received in the slot. The package is disposed within the slot to cover at least a portion of the fingerprint sensing wafer. The circuit board is used as a support for the overall module, which can improve the structural strength of the overall module, and the internal conductive ring can be electrically connected to the pad by circuit wiring. The conductive pattern layer is used to electrically connect the pads of the circuit board and the contacts of the fingerprint sensing chip. When a finger or other object is applied to the cover layer, the driving signal can be transmitted to the pad of the circuit board through the contact of the fingerprint sensing chip through the conductive pattern layer, and then transmitted to the inner conductive ring of the circuit board to make the fingerprint The sensing chip transmits the driving signal through the internal conductive ring to achieve the function of fingerprint recognition. In general, a conventional fingerprint sensing chip is disposed on a circuit substrate by wire bonding, and the package needs to be higher than the arc height of the wire. Therefore, the sensing surface of the fingerprint sensing chip of the conventional fingerprint sensing chip package module is farther from the cover layer touched by the finger. The sensing surface of the fingerprint sensing wafer by the embodiment of the present invention is closer to the cover layer than the prior art.

The method for manufacturing the fingerprint sensing package module of the first embodiment of the present invention is to adhere the circuit board and the fingerprint sensing wafer to the carrier substrate, wherein the fingerprint sensing chip is received in the slot of the circuit board. The package is filled in the slot to cover the fingerprint sensing wafer. Then, the carrier substrate is removed. A conductive pattern layer is formed to electrically connect the pads and the contacts. The conductive pattern layer is protected by the second protective layer. Next, the cover layer is overlaid on the second protective layer by an adhesive layer, and the circuit board is diced in the singulation process to form at least one fingerprint sensing package unit. In the first embodiment, when the singularized fingerprint sensing package unit (ie, the fingerprint sensing package module) is assembled with the electronic device having the fingerprint recognition function, the fingerprint sensing package module is disposed on the electronic device. The through hole of the cover of the device is such that the finger of the user can touch the fingerprint to sense the cover layer of the package module.

In addition, in the manufacturing method of the fingerprint sensing package module according to the second embodiment of the present invention, after the step of forming the second protective layer on the conductive pattern layer, the circuit board is cut to form at least one fingerprint sensing package unit. In the second embodiment, the fingerprint sensing package unit is directly disposed on the touch cover of the electronic device through the adhesive layer, and is electrically connected to the touch cover through the circuit board. That is to say, the touch cover does not need to be provided with a through hole to accommodate the fingerprint sensing package unit. Accordingly, the fingerprint sensing package unit is convenient to be directly mounted on a touch device that needs to have a fingerprint recognition function, such as a smart phone.

Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

100‧‧‧Fingerprint sensing package module

110, 110’ ‧ ‧ cover

120‧‧‧Adhesive layer

130, 130’‧‧‧ boards

132‧‧‧ pads

134‧‧‧Internal conductive ring

136‧‧‧Wiring

140‧‧‧Fingerprinting Wafer

142‧‧‧Contacts

150‧‧‧conductive pattern layer

160‧‧‧Package

C1‧‧‧bearing substrate

CL‧‧‧ Conductive layer

G1‧‧‧Adhesive material

H1‧‧‧ slot

M1‧‧‧Fingerprint sensing package

P1‧‧‧ first protective layer

P2‧‧‧Second protective layer

S1‧‧‧ first surface

S2‧‧‧ second surface

SA‧‧‧ sensing surface

U1‧‧‧Fingerprinting package unit

T1‧‧‧ opening

FIG. 1A is a schematic structural diagram of a fingerprint sensing package module according to a first embodiment of the present invention. FIG. 1B is a partial top plan view of a fingerprint sensing package module according to a first embodiment of the present invention. 2A to 2J are schematic views respectively showing the steps of manufacturing a fingerprint sensing package module according to an embodiment of the present invention. 3A to 3B are schematic views respectively showing the steps of manufacturing a fingerprint sensing package module according to a second embodiment of the present invention.

100‧‧‧Fingerprint sensing package module

110‧‧‧ Coverage

120‧‧‧Adhesive layer

130‧‧‧ boards

132‧‧‧ pads

134‧‧‧Internal conductive ring

140‧‧‧Fingerprinting Wafer

142‧‧‧Contacts

150‧‧‧conductive pattern layer

160‧‧‧Package

H1‧‧‧ slot

P1‧‧‧ first protective layer

P2‧‧‧Second protective layer

S1‧‧‧ first surface

S2‧‧‧ second surface

SA‧‧‧ sensing surface

Claims (9)

A fingerprint sensing package module includes: a cover layer; an adhesive layer on the cover layer; a circuit board having a first surface, the circuit board including a plurality of pads on the first surface, the circuit board The first surface of the circuit board is disposed on the cover layer through the adhesive layer, the circuit board has at least one slot; a fingerprint sensing chip has a sensing surface and includes a plurality of contacts on the sensing surface The sensing surface of the fingerprint sensing chip is disposed on the cover layer through the adhesive layer and received in the slot; a first protective layer covering the first surface and the sensing surface, the first a protective layer has a plurality of openings, the positions of the openings corresponding to the pads and the locations of the contacts to expose the pads and the contacts; a conductive pattern layer located in the first protection The pads and the contacts are electrically connected to the layer and the opening; and a package is at least partially located in the slot to cover the fingerprint sensing chip. The fingerprint sensing package module of claim 1, wherein the circuit board further comprises an inner conductive ring, the inner conductive ring is located on the first surface and surrounds the fingerprint sensing chip, and the fingerprint sensing chip Electrical connection. The fingerprint sensing package module of claim 1, wherein the conductive pattern layer is a rewiring layer. A method for manufacturing a fingerprint sensing package module includes: disposing a circuit board on a carrier substrate, wherein the circuit board has a first surface, the circuit board includes a plurality of pads on the first surface, the circuit The board has at least one slot; at least one fingerprint sensing chip is disposed in at least one of the slots, wherein the fingerprint sensing chip has a sensing surface and includes a plurality of contacts on the sensing surface, the fingerprint sensing The sensing surface of the chip is disposed on the carrier substrate; a package is filled in the slot, and the package covers at least the fingerprint sensing wafer; the carrier substrate is removed; and a first protective layer is formed to cover The first surface and the sensing surface; forming a plurality of openings in the first protective layer, the positions of the openings corresponding to the pads and the positions of the contacts to expose the pads and the a conductive material is formed on the first protective layer and in the opening to form a conductive layer; and the conductive layer is patterned on the first protective layer to form a conductive pattern layer, wherein the conductive pattern a layer formed on the first protective layer Within the opening to electrically connect the pad and the contacts. The method of manufacturing the fingerprint sensing package module of claim 4, further comprising: forming a second protective layer overlying the conductive pattern layer. The method of manufacturing the fingerprint sensing package module of claim 5, further comprising: forming an adhesive layer on the second protective layer; Covering a cover layer on the adhesive layer. The method of manufacturing the fingerprint sensing package module of claim 6, further comprising: cutting the circuit board to form at least one fingerprint sensing package unit. The method of manufacturing the fingerprint sensing package module of claim 5, further comprising: after forming the second protective layer covering the conductive pattern layer, cutting the circuit board to form at least one fingerprint sensing package unit . The method of manufacturing the fingerprint sensing package module of claim 8, further comprising: forming an adhesive layer on the second protective layer; and covering a cover layer on the adhesive layer.