TWI581192B - Fingerprint identification unit and device - Google Patents

Description

Fingerprint identification component and fingerprint identification device

The invention relates to a fingerprint identification component and a fingerprint identification device.

The fingerprint identification device is widely used in various fields such as industry, national defense, fire protection, and electronics. A typical matter wave sensing element is an ultrasonic sensor composed of a substrate, a piezoelectric element formed on the substrate, and an electrode formed on the piezoelectric element. However, when the fingerprint recognition device is manufactured, the substrate, the piezoelectric element, and the electrode in the fingerprint recognition device are prone to generate defects such as particles or bubbles after bonding, but it is difficult to detect the particles or bubbles, so that the The production yield of the fingerprint identification device is not high.

In view of this, it is necessary to provide a fingerprint recognition component. The fingerprint identification component includes a first electrode layer, a signal receiving layer, a substrate, a second electrode layer, a signal transmitting layer, and a third electrode layer. The first electrode layer and the signal receiving layer are disposed on one side of the substrate. The second electrode layer, the signal transmitting layer and the third electrode layer are disposed on opposite sides of the substrate. The signal transmitting layer and the signal receiving layer are piezoelectric material layers. At least one of the first electrode layer, the second electrode layer, and the third electrode layer is a transparent conductive layer.

It is also necessary to provide a fingerprint recognition device that includes the fingerprint recognition component and a connection pad. The connection pad is electrically connected to the fingerprint identification component The fingerprint identification component is connected to an external circuit.

Compared with the prior art, the fingerprint identification component and the fingerprint identification device provided by the present invention can detect whether particles or bubbles are present in the fingerprint identification component and the fingerprint identification device by visual or image detection after assembly. A bad condition, thereby improving the yield of the fingerprint identification component and the fingerprint recognition device.

200, 300, 400, 500, 600‧‧‧ fingerprint identification device

210, 310, 410, 510, 610‧ ‧ fingerprint identification unit

220, 320, 420, 520, 620‧‧‧ connection pads

211, 311, 411, 511, 611‧‧‧ first electrode layer

212, 312, 412, 512, 612‧‧‧ signal receiving layer

213, 313, 413, 513, 613‧‧‧ first colloidal layer

214, 314, 414, 514, 614‧‧‧ substrates

215, 315, 415, 515, 615‧‧‧ second colloid layer

216, 316, 416, 516, 616‧‧‧ second electrode layer

217, 317, 417, 517, 617‧‧‧ signal transmission layer

218, 318, 418, 518, 618‧‧‧ third electrode layer

214a, 314a, 414a, 514a, 614a‧‧‧ Thin film transistor array

1 is a plan view of a fingerprint identification device according to a first embodiment of the present invention.

2 is an exploded perspective view of a fingerprint recognition component according to a first embodiment of the present invention.

Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 1.

4 is a plan view of a fingerprint recognition device according to a second embodiment of the present invention.

FIG. 5 is an exploded perspective view of a fingerprint identification component according to a second embodiment of the present invention.

Figure 6 is a schematic cross-sectional view taken along line VI-VI of Figure 4.

Fig. 7 is a plan view showing a fingerprint recognition device according to a third embodiment of the present invention.

FIG. 8 is an exploded perspective view of a fingerprint recognition component according to a third embodiment of the present invention.

Figure 9 is a schematic cross-sectional view taken along line IX-IX of Figure 7.

Fig. 10 is a plan view showing a fingerprint recognition device according to a fourth embodiment of the present invention.

11 is an exploded perspective view of a fingerprint recognition element according to a fourth embodiment of the present invention.

Figure 12 is a schematic cross-sectional view taken along line XII-XII of Figure 10.

Figure 13 is a plan view of a fingerprint recognition device according to a fifth embodiment of the present invention.

FIG. 14 is an exploded perspective view of a fingerprint recognition component according to a fifth embodiment of the present invention.

Figure 15 is a schematic cross-sectional view taken along line XV-XV of Figure 13.

The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

Please refer to FIG. 1 , which is a top view of a fingerprint identification device 200 according to a first embodiment of the present invention. The fingerprint recognition device 200 includes a fingerprint recognition component 210 and a connection pad 220. The connection pad 220 is electrically connected to the fingerprint recognition component 210. The fingerprint recognition component 210 is for recognizing a fingerprint placed on the fingerprint recognition component 210. The connection pad 220 is used to connect the fingerprint recognition component 210 to an external circuit.

2 is an exploded perspective view of the fingerprint identification component 210, and FIG. 3 is a cross-sectional view taken along line III-III of FIG. Referring to FIG. 2 and FIG. 3 together, the fingerprint identification component 210 includes a first electrode layer 211, a signal receiving layer 212, a first colloid layer 213, a substrate 214, a second colloid layer 215, and a second electrode layer. 216. The signal transmitting layer 217 and the third electrode layer 218. The signal receiving layer 212 is pasted on one side of the substrate 214 by the first colloid layer 213. The second electrode layer 216 is pasted on the opposite side of the substrate 214 by the second colloid layer 215. The substrate 214 includes a thin film transistor array 214a.

The second electrode layer 216 and the third electrode layer 218 are disposed on upper and lower sides of the signal transmitting layer 217. The signal transmitting layer 217 is a piezoelectric material layer. In this embodiment, the signal transmission layer 217 is made of polydifluoroethylene (Polyvinylidene Fluoride, PVDF). The second electrode layer 216 and the third electrode layer 218 are used to apply a voltage to the signal transmitting layer 217. The signal transmitting layer 217 generates vibration when a voltage is applied by the second electrode layer 216 and the third electrode layer 218 to emit a sound wave. In the present embodiment, the emitted sound wave is an ultrasonic wave.

The first electrode layer 211 is formed on the signal receiving layer 212. The signal receiving layer 212 is a layer of piezoelectric material. In this embodiment, the material of the signal receiving layer 212 is Polyvinylidene Fluoride (PVDF). The signal receiving layer 212 is configured to receive a sound wave reflected by a finger placed on the fingerprint recognition component 210 and convert the sound wave into an electrical signal. The first electrode layer 211 is configured to transfer the electrical signal to the thin film transistor array 214a.

The thin film transistor array 214a is configured to receive the electrical signal transmitted by the first electrode layer 211 and convert the electrical signal into a grayscale image of the fingerprint.

When the fingerprint identifying component 210 is in operation, the second electrode layer 216 and the third electrode layer 218 apply a voltage to the signal transmitting layer 217, and the signal transmitting layer 217 generates vibration by a voltage to emit Ultrasonic. When a finger is placed on the fingerprint recognition component 210, the ultrasonic wave is reflected by the finger to the signal receiving layer 212, and is affected by the shape of the finger fingerprint and the shape of the ridge, and the reflected ultrasonic wave changes correspondingly. The signal receiving layer 212 converts the received ultrasonic wave into an electrical signal and transmits the electrical signal to the thin film transistor array 214a, and the electrical signal is converted into the optical signal by the thin film transistor array 214a. A grayscale image of the fingerprint to obtain a fingerprint.

In the embodiment, the first electrode layer 211 is a transparent conductive layer. Specifically, the material of the first electrode layer 211 is a single layer transparent conductive material or a multilayer composite transparent Conductive material. The single-layer transparent conductive material includes, but is not limited to, Indium Tin Oxide (ITO), zinc oxide (ZnO), polyethylene dioxythiophene (PEDOT), carbon nanotubes (CNT), and silver nanowires (AgNW). ) and graphene. The multilayer composite transparent conductive material includes, but is not limited to, a three-layer composite structure conductive material composed of indium tin oxide, silver, indium tin oxide which are sequentially laminated. The first electrode layer 211 is coated on the signal receiving layer 212. The material of the second electrode layer 216 and the third electrode layer 218 is an opaque conductive material such as silver. The second electrode layer 216 and the third electrode layer 218 are respectively coated on both sides of the signal transmitting layer 217.

Since the first electrode layer 211 is transparent, the fingerprint identification component 210 can be detected from one side of the first electrode layer 211 by visual or image detection after the fingerprint identification component 210 is assembled. Whether there are defects such as particles or bubbles in the middle, thereby improving the yield of the fingerprint recognition element 210 and the fingerprint recognition device 200.

In the embodiment, the impedance of the first electrode layer 211 is lower than 150 ohms, so that the first electrode layer 211 has better conductivity. At the same time, the visible light transmittance of the first electrode layer 211 is between 10% and 99%, so that it is convenient to observe whether there are defects such as particles or bubbles in the fingerprint recognition element 210 at the time of detection. Preferably, the first electrode layer has a visible light transmittance of more than 70%.

Please refer to FIG. 4 , which is a top view of a fingerprint identification device 300 according to a second embodiment of the present invention. The fingerprint identification device 300 includes a fingerprint recognition component 310 and a connection pad 320. The connection pad 320 is electrically connected to the fingerprint recognition component 310. The fingerprint recognition component 310 is for recognizing a fingerprint placed on the fingerprint recognition component 310. The connection pad 320 is used to connect the fingerprint recognition component 310 to an external circuit.

FIG. 5 is an exploded perspective view of the fingerprint identification component 310, and FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. Please refer to FIG. 5 and FIG. 6 together for fingerprint identification. The element 310 includes a first electrode layer 311, a signal receiving layer 312, a first colloid layer 313, a substrate 314, a second colloid layer 315, a second electrode layer 316, a signal transmitting layer 317, and a third electrode layer 318 which are sequentially stacked. The signal receiving layer 312 is pasted on one side of the substrate 314 by the first colloid layer 313. The second electrode layer 316 is pasted on the opposite side of the substrate 314 by the second colloid layer 315. The substrate 314 includes a thin film transistor array 314a.

The second electrode layer 316 and the third electrode layer 318 are disposed on upper and lower sides of the signal transmitting layer 317. The signal transmitting layer 317 is a piezoelectric material layer. In the embodiment, the signal transmission layer 317 is made of polyvinylidene fluoride (PVDF). The second electrode layer 316 and the third electrode layer 318 are used to apply a voltage to the signal transmitting layer 317. The signal transmitting layer 317 generates a vibration when a voltage is applied by the second electrode layer 316 and the third electrode layer 318 to emit a sound wave. In the present embodiment, the emitted sound wave is an ultrasonic wave.

The first electrode layer 311 is formed on the signal receiving layer 312. The signal receiving layer 312 is a layer of piezoelectric material. In the embodiment, the signal receiving layer 312 is made of polyvinylidene fluoride (PVDF). The signal receiving layer 312 is configured to receive the sound waves reflected by the fingers placed on the fingerprint recognition component 310 and convert the sound waves into electrical signals. The first electrode layer 311 is configured to transfer the electrical signal to the thin film transistor array 314a.

The thin film transistor array 314a is configured to receive the electrical signal transmitted by the first electrode layer 311 and convert the electrical signal into a grayscale image of the fingerprint.

When the fingerprint identification component 310 is in operation, the second electrode layer 316 and the third electrode layer 318 apply a voltage to the signal transmission layer 317, and the signal transmission layer 317 The vibration is generated by the voltage to emit ultrasonic waves. When a finger is placed on the fingerprint recognition component 310, the ultrasonic wave is reflected by the finger to the signal receiving layer 312, and is affected by the shape of the finger fingerprint and the shape of the ridge, and the reflected ultrasonic wave changes correspondingly. The signal receiving layer 312 converts the received ultrasonic wave into an electrical signal and transmits the electrical signal to the thin film transistor array 314a, and the electrical signal is converted into the electrical signal by the thin film transistor array 214a. A grayscale image of the fingerprint to obtain a fingerprint.

In this embodiment, the material of the first electrode layer 311 is an opaque conductive material such as silver. The first electrode layer 311 is coated on the signal receiving layer 312. The second electrode layer 316 and the third electrode layer 318 are transparent conductive layers. Specifically, the material of the second electrode layer 316 and the third electrode layer 318 is a single layer transparent conductive material or a multilayer composite transparent conductive material. The single-layer transparent conductive material includes, but is not limited to, Indium Tin Oxide (ITO), zinc oxide (ZnO), polyethylene dioxythiophene (PEDOT), carbon nanotubes (CNT), and silver nanowires (AgNW). ) and graphene. The multilayer composite transparent conductive material includes, but is not limited to, a three-layer composite structure conductive material composed of indium tin oxide, silver, indium tin oxide which are sequentially laminated. The second electrode layer 316 and the third electrode layer 318 are respectively coated on both sides of the signal transmitting layer 317.

Since the second electrode layer 316 and the third electrode layer 318 are transparent, when the fingerprint identification component 310 is assembled, it can be detected from one side of the third electrode layer 318 by visual or image detection. Whether there is a defect such as particles or bubbles in the fingerprint recognition component 310 improves the yield of the fingerprint recognition component 310 and the fingerprint recognition device 300.

In this embodiment, the impedances of the second electrode layer 316 and the third electrode layer 318 are both lower than 150 ohms, so that the second electrode layer 316 and the third electrode layer 318 are better. Conductivity. . At the same time, the visible light transmittances of the second electrode layer 316 and the third electrode layer 318 are between 10% and 99%, so that the presence or absence of the fingerprint identification component 310 can be conveniently observed during the detection. Bad conditions such as particles or bubbles. Preferably, the second electrode layer 316 and the third electrode layer 318 have a visible light transmittance of more than 70%.

Please refer to FIG. 7 , which is a top view of a fingerprint identification device 400 according to a third embodiment of the present invention. The fingerprint recognition device 400 includes a fingerprint recognition component 410 and a connection pad 420. The connection pad 420 is electrically connected to the fingerprint recognition component 410. The fingerprint recognition component 410 is for recognizing a fingerprint placed over the fingerprint recognition component 410. The connection pad 420 is used to connect the fingerprint recognition component 410 to an external circuit.

FIG. 8 is an exploded perspective view of the fingerprint identification component 410, and FIG. 9 is a cross-sectional view taken along line IX-IX of FIG. Referring to FIG. 8 and FIG. 9 together, the fingerprint identification component 410 includes a first electrode layer 411, a signal receiving layer 412, a first colloid layer 413, a substrate 414, a second colloid layer 415, and a second electrode which are sequentially stacked. Layer 416, signal transmitting layer 417, and third electrode layer 418. The signal receiving layer 412 is pasted on one side of the substrate 414 by the first colloid layer 413. The second electrode layer 416 is adhered to the opposite side of the substrate 414 by the second colloid layer 415. The substrate 414 includes a thin film transistor array 414a.

The second electrode layer 416 and the third electrode layer 418 are disposed on upper and lower sides of the signal transmitting layer 417. The signal transmitting layer 417 is a piezoelectric material layer. In the embodiment, the signal transmission layer 417 is made of polyvinylidene fluoride (PVDF). The second electrode layer 416 and the third electrode layer 418 are used to apply a voltage to the signal transmitting layer 417. The signal transmitting layer 417 is when the second electrode layer 416 and the third electrode layer 418 are applied with a voltage Vibration is generated to emit sound waves. In the present embodiment, the emitted sound wave is an ultrasonic wave.

The first electrode layer 411 is formed on the signal receiving layer 412. The signal receiving layer 412 is a layer of piezoelectric material. In the embodiment, the signal receiving layer 412 is made of polyvinylidene fluoride (PVDF). The signal receiving layer 412 is configured to receive a sound wave reflected by a finger placed on the fingerprint recognition component 410 and convert the sound wave into an electrical signal. The first electrode layer 411 is used to transfer the electrical signal to the thin film transistor array 414a.

The thin film transistor array 414a is configured to receive the electrical signal transmitted by the first electrode layer 411 and convert the electrical signal into a grayscale image of the fingerprint.

When the fingerprint identification component 410 is in operation, the second electrode layer 416 and the third electrode layer 418 apply a voltage to the signal transmitting layer 417, and the signal transmitting layer 417 generates vibration by the voltage to emit Ultrasonic. When a finger is placed on the fingerprint recognition component 410, the ultrasonic wave is reflected by the finger to the signal receiving layer 412, and is affected by the shape of the finger fingerprint and the shape of the ridge, and the reflected ultrasonic wave changes correspondingly. The signal receiving layer 412 converts the received ultrasonic wave into an electrical signal and transmits the electrical signal to the thin film transistor array 414a, and the electrical signal is converted into the optical signal by the thin film transistor array 414a. A grayscale image of the fingerprint to obtain a fingerprint.

In the embodiment, the first electrode layer 411, the second electrode layer 416, and the third electrode layer 418 are transparent conductive layers. Specifically, the material of the first electrode layer 411, the second electrode layer 416, and the third electrode layer 418 is a single layer transparent conductive material or a multilayer composite transparent conductive material. The single-layer transparent conductive material includes, but is not limited to, Indium Tin Oxide (ITO), zinc oxide (ZnO), and polyethylene dioxythiophene. (PEDOT), carbon nanotubes (CNT), silver nanowires (AgNW), and graphene. The multilayer composite transparent conductive material includes, but is not limited to, a three-layer composite structure conductive material composed of indium tin oxide, silver, indium tin oxide which are sequentially laminated. The first electrode layer 411 is coated on the signal receiving layer 412. The second electrode layer 416 and the third electrode layer 418 are respectively coated on both sides of the signal transmitting layer 417.

Since the first electrode layer 411, the second electrode layer 416, and the third electrode layer 418 are transparent, when the fingerprint identification component 410 is assembled, it can be visually or image-detected from the first electrode. One side of the layer 411 and one side of the third electrode layer 418 detect whether there is a defect such as particles or bubbles in the fingerprint recognition element 410, thereby improving the yield of the fingerprint recognition element 410 and the fingerprint identification device 400.

In this embodiment, the impedances of the first electrode layer 411, the second electrode layer 416, and the third electrode layer 418 are all lower than 150 ohms, so that the first electrode layer 411, the second electrode layer 416, and the third Electrode layer 418 has a better conductivity. Meanwhile, the visible light transmittances of the first electrode layer 411, the second electrode layer 416, and the third electrode layer 418 are both between 10% and 99%, so that the fingerprint can be conveniently observed during detection. Whether or not there is a problem such as particles or bubbles in the identification member 410. Preferably, the visible light transmittance of the first electrode layer 411, the second electrode layer 416, and the third electrode layer 418 is greater than 70%.

Please refer to FIG. 10 , which is a top view of a fingerprint identification device 500 according to a fourth embodiment of the present invention. The fingerprint recognition device 500 includes a fingerprint recognition component 510 and a connection pad 520. The connection pad 520 is electrically connected to the fingerprint recognition component 510. The fingerprint recognition component 510 is for recognizing a fingerprint placed over the fingerprint recognition component 510. The connection pad 520 is used to connect the fingerprint recognition component 510 to an external circuit .

11 is an exploded perspective view of the fingerprint identification component 510, and FIG. 12 is a cross-sectional view taken along line XII-XII of FIG. Referring to FIG. 11 and FIG. 12 together, the fingerprint identification component 510 includes a first electrode layer 511, a signal receiving layer 512, a first colloid layer 513, a substrate 514, a second colloid layer 515, and a second electrode layer. 516, the signal transmitting layer 517 and the third electrode layer 518. The signal receiving layer 512 is pasted on one side of the substrate 514 by the first colloid layer 513. The second electrode layer 516 is pasted on the opposite side of the substrate 514 by the second colloid layer 515. The substrate 514 includes a thin film transistor array 514a.

The second electrode layer 516 and the third electrode layer 518 are disposed on upper and lower sides of the signal transmitting layer 517. The signal transmitting layer 517 is a piezoelectric material layer. In the embodiment, the signal transmission layer 517 is made of polyvinylidene fluoride (PVDF). The second electrode layer 516 and the third electrode layer 518 are used to apply a voltage to the signal transmitting layer 517. The signal transmitting layer 517 generates a vibration when a voltage is applied by the second electrode layer 516 and the third electrode layer 518 to emit a sound wave. In the present embodiment, the emitted sound wave is an ultrasonic wave.

The first electrode layer 511 is formed on the signal receiving layer 512. The signal receiving layer 512 is a layer of piezoelectric material. In the embodiment, the signal receiving layer 512 is made of polyvinylidene fluoride (PVDF). The signal receiving layer 512 is configured to receive a sound wave reflected by a finger placed on the fingerprint recognition component 510 and convert the sound wave into an electrical signal. The first electrode layer 511 is configured to transfer the electrical signal to the thin film transistor array 514a.

The thin film transistor array 514a is configured to receive the conduction of the first electrode layer 511 The electrical signal and convert the electrical signal into a grayscale image of the fingerprint.

When the fingerprint identification component 510 is in operation, the second electrode layer 516 and the third electrode layer 518 apply a voltage to the signal transmitting layer 517, and the signal transmitting layer 517 generates vibration by the voltage to emit Ultrasonic. When a finger is placed on the fingerprint recognition component 510, the ultrasonic wave is reflected by the finger to the signal receiving layer 512, and is affected by the shape of the finger fingerprint and the shape of the ridge, and the reflected ultrasonic wave changes correspondingly. The signal receiving layer 512 converts the received ultrasonic wave into an electrical signal and transmits the electrical signal to the thin film transistor array 514a, and the electrical signal is converted into the electrical signal by the thin film transistor array 514a. A grayscale image of the fingerprint to obtain a fingerprint.

In this embodiment, the material of the first electrode layer 511 and the second electrode layer 516 is an opaque conductive material such as silver. The first electrode layer 511 is coated on the signal receiving layer 512. The third electrode layer 518 is a transparent conductive layer. Specifically, the material of the third electrode layer 518 is a single layer transparent conductive material or a multilayer composite transparent conductive material. The single-layer transparent conductive material includes, but is not limited to, Indium Tin Oxide (ITO), zinc oxide (ZnO), polyethylene dioxythiophene (PEDOT), carbon nanotubes (CNT), and silver nanowires (AgNW). ) and graphene. The multilayer composite transparent conductive material includes, but is not limited to, a three-layer composite structure conductive material composed of indium tin oxide, silver, indium tin oxide which are sequentially laminated. The second electrode layer 516 and the third electrode layer 518 are respectively coated on both sides of the signal transmitting layer 517. The second electrode layer 516 is disposed on a side of the signal transmitting layer 517 near the substrate 514, and the third electrode layer 518 is disposed on a side of the signal transmitting layer 518 away from the substrate 514.

Since the third electrode layer 518 is transparent, when the fingerprint identification component 510 is assembled, it can be visually or image-detected from the third electrode layer 518. One side detects whether there is a problem such as particles or bubbles between the third electrode layer 518 and the second electrode layer 516 in the fingerprint recognition element 510, thereby improving the yield of the fingerprint identification element 510 and the fingerprint identification device 500.

In the present embodiment, the impedance of the third electrode layer 518 is less than 150 ohms to make the third electrode layer 518 have better conductivity. At the same time, the visible light transmittance of the third electrode layer 518 is between 10% and 99%, so that it is convenient to observe whether there are defects such as particles or bubbles in the fingerprint recognition element 510 at the time of detection. Preferably, the third electrode layer 518 has a visible light transmittance greater than 70%.

Please refer to FIG. 13 , which is a top view of a fingerprint identification device 600 according to a fifth embodiment of the present invention. The fingerprint recognition device 600 includes a fingerprint recognition component 610 and a connection pad 620. The connection pad 620 is electrically connected to the fingerprint recognition component 610. The fingerprint recognition component 610 is for recognizing a fingerprint placed over the fingerprint recognition component 610. The connection pad 620 is used to connect the fingerprint recognition component 610 to an external circuit.

FIG. 14 is an exploded perspective view of the fingerprint identification component 610, and FIG. 15 is a cross-sectional view taken along line XV-XV of FIG. Referring to FIG. 14 and FIG. 15 together, the fingerprint identification component 610 includes a first electrode layer 611, a signal receiving layer 612, a first colloid layer 613, a substrate 614, a second colloid layer 615, and a second electrode layer. 616, the signal transmitting layer 617 and the third electrode layer 618. The signal receiving layer 612 is pasted on one side of the substrate 614 by the first colloid layer 613. The second electrode layer 616 is pasted on the opposite side of the substrate 614 by the second colloid layer 615. The substrate 614 includes a thin film transistor array 614a.

The second electrode layer 616 and the third electrode layer 618 are disposed on upper and lower sides of the signal transmitting layer 617. The signal transmitting layer 617 is a piezoelectric material layer. In this embodiment In the formula, the signal transmitting layer 617 is made of polyvinylidene fluoride (PVDF). The second electrode layer 616 and the third electrode layer 618 are used to apply a voltage to the signal transmitting layer 617. The signal transmitting layer 617 generates vibration when a voltage is applied by the second electrode layer 616 and the third electrode layer 618 to emit a sound wave. In the present embodiment, the emitted sound wave is an ultrasonic wave.

The first electrode layer 611 is formed on the signal receiving layer 612. The signal receiving layer 612 is a layer of piezoelectric material. In the embodiment, the signal receiving layer 612 is made of polyvinylidene fluoride (PVDF). The signal receiving layer 612 is configured to receive a sound wave reflected by a finger placed on the fingerprint recognition component 610 and convert the sound wave into an electrical signal. The first electrode layer 611 is configured to transfer the electrical signal to the thin film transistor array 614a.

The thin film transistor array 614a is configured to receive the electrical signal transmitted by the first electrode layer 611 and convert the electrical signal into a grayscale image of the fingerprint.

When the fingerprint identifying component 610 is in operation, the second electrode layer 616 and the third electrode layer 618 apply a voltage to the signal transmitting layer 617, and the signal transmitting layer 617 generates vibration by the voltage to emit Ultrasonic. When a finger is placed on the fingerprint recognition component 610, the ultrasonic wave is reflected by the finger to the signal receiving layer 612, and is affected by the shape of the finger fingerprint and the shape of the ridge, and the reflected ultrasonic wave changes correspondingly. The signal receiving layer 612 converts the received ultrasonic wave into an electrical signal and transmits the electrical signal to the thin film transistor array 614a, and the electrical signal is converted into the optical signal by the thin film transistor array 614a. A grayscale image of the fingerprint to obtain a fingerprint.

In this embodiment, the first electrode layer 611 and the third electrode layer 618 are transparent guides. Electrical layer. Specifically, the material of the first electrode layer 611 and the third electrode layer 618 is a single layer transparent conductive material or a multilayer composite transparent conductive material. The single-layer transparent conductive material includes, but is not limited to, Indium Tin Oxide (ITO), zinc oxide (ZnO), polyethylene dioxythiophene (PEDOT), carbon nanotubes (CNT), and silver nanowires (AgNW). ) and graphene. The multilayer composite transparent conductive material includes, but is not limited to, a three-layer composite structure conductive material composed of indium tin oxide, silver, indium tin oxide which are sequentially laminated. The first electrode layer 611 is coated on the signal receiving layer 612. The material of the second electrode layer 616 is an opaque conductive material such as silver. The second electrode layer 616 and the third electrode layer 618 are respectively applied to both sides of the signal transmitting layer 617. The second electrode layer 616 is disposed on a side of the signal transmitting layer 617 near the substrate 614, and the third electrode layer 618 is disposed on a side of the signal transmitting layer 618 away from the substrate 614.

Since the first electrode layer 611 and the third electrode layer 618 are transparent, when the fingerprint identification component 610 is assembled, it can be visually or image-detected from one side of the first electrode layer 611 and One side of the third electrode layer 618 detects whether there is a defect such as particles or bubbles in the fingerprint recognition component 610, thereby improving the yield of the fingerprint identification component 610 and the fingerprint identification device 600.

In the embodiment, the impedance of the first electrode layer 611 and the third electrode layer 618 is lower than 150 ohms, so that the first electrode layer 611 and the third electrode layer 618 have better conductivity. At the same time, the visible light transmittance of the first electrode layer 611 and the third electrode layer 618 is between 10% and 99%, so that the presence or absence of particles in the fingerprint recognition element 210 can be conveniently observed during detection. Or a bad condition such as a bubble. Preferably, the visible light transmittance of the first electrode layer 611 and the third electrode layer 618 is greater than 70%.

In summary, the creation meets the requirements of the invention patent, and the patent application is filed according to law. but The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and any equivalent modification or change made by a person familiar with the skill of the present invention in accordance with the spirit of the present invention should be It is covered by the following patent application.

210‧‧‧Finger identification unit

211‧‧‧First electrode layer

212‧‧‧Signal receiving layer

213‧‧‧First colloid layer

214‧‧‧Substrate

215‧‧‧Second colloid layer

216‧‧‧Second electrode layer

217‧‧‧Signal transmission layer

218‧‧‧ third electrode layer

214a‧‧‧Thin Film Array

Claims (15)

a fingerprint identification component, the fingerprint identification component includes a first electrode layer, a signal receiving layer, a substrate, a second electrode layer, a signal transmitting layer, and a third electrode layer, wherein the first electrode layer and the signal receiving layer are disposed on the One side of the substrate, the second electrode layer, the signal transmitting layer and the third electrode layer are disposed on opposite sides of the substrate, and the signal transmitting layer and the signal receiving layer are piezoelectric material layers, the first At least one of the electrode layer, the second electrode layer and the third electrode layer is a transparent conductive layer, the signal transmitting layer is located between the second electrode and the third electrode, and the second electrode and the third electrode apply a voltage to the signal transmitting layer It generates vibrations to emit ultrasonic waves. The fingerprint identification component of claim 1, wherein the second electrode layer is disposed on a side of the signal transmitting layer adjacent to the substrate, and the third electrode layer is disposed on a side of the signal transmitting layer away from the substrate The third electrode layer is a transparent conductive layer. The fingerprint identification element of claim 2, wherein the second electrode layer is a transparent conductive layer. The fingerprint identification element of claim 2, wherein the first electrode layer is a transparent conductive layer. The fingerprint identification element of claim 4, wherein the second electrode layer is a transparent conductive layer. The fingerprint identification element of claim 1, wherein the first electrode layer is a transparent conductive layer. The fingerprint identification component of claim 1, wherein the transparent conductive layer is made of a single layer of transparent conductive material. The fingerprint identification element according to claim 7, wherein the single-layer transparent conductive material comprises indium tin oxide, zinc oxide, polyethylene dioxythiophene, carbon nanotubes, silver nanowires, and graphene. The fingerprint identification component of claim 1, wherein the transparent conductive layer is made of a multilayer composite transparent conductive material. The fingerprint recognition element according to claim 9, wherein the multilayer composite transparent conductive material comprises a three-layer composite structure conductive material composed of indium tin oxide, silver, and indium tin oxide which are sequentially laminated. The fingerprint identification component of claim 1, wherein the signal transmitting layer and the signal receiving layer are made of polydifluoroethylene. The fingerprint identification component of claim 1, wherein the substrate comprises a thin film transistor array, and the thin film transistor array is configured to convert the electrical signal into a grayscale image of the fingerprint. The fingerprint recognition element of claim 1, wherein the transparent conductive layer has an impedance of less than 150 ohms. The fingerprint recognition element according to claim 1, wherein the transparent conductive layer has a visible light transmittance of more than 70%. A fingerprint identification device, comprising the fingerprint identification component and the connection pad according to any one of claims 1 to 14, wherein the connection pad is electrically connected to the fingerprint identification component and the fingerprint is recognized The component is connected to an external circuit.