TWI580501B - Cutting wire - Google Patents
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- TWI580501B TWI580501B TW104143015A TW104143015A TWI580501B TW I580501 B TWI580501 B TW I580501B TW 104143015 A TW104143015 A TW 104143015A TW 104143015 A TW104143015 A TW 104143015A TW I580501 B TWI580501 B TW I580501B
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Description
本發明是有關於一種切割線，且特別是有關於一種使用高分子纖維材料的切割線。The present invention relates to a cutting line, and more particularly to a cutting line using a polymeric fibrous material.
由於科技的日新月異，現代人對於終端產品輕薄化的要求亦相對地提高。為了因應微型化的需求，線切割製程被廣泛地應用於各類之塊體材料切割，尤其是高單價之晶體材料及陶瓷材料加工。Due to the rapid development of technology, modern people's requirements for thinner and thinner terminal products have also increased. In order to meet the demand for miniaturization, wire cutting processes are widely used in the cutting of various types of block materials, especially high-priced crystal materials and ceramic materials.
一般來說，習知的切割線是利用樹脂線為裸線線材，再將鑽石顆粒黏著於樹脂線材上，以進行切割。然而，由於鑽石顆粒僅以樹脂黏著的方式附著而易於脫落，造成損耗。因此，使用鋼琴線或不鏽鋼線為裸線線材，再鍍上鑽石磨粒的切割線亦被提出。然而，由於鋼琴線以及不鏽鋼線具有較高密度，無法達到輕量化的目的。除此之外，鋼琴線以及不鏽鋼線亦具有較高的熱膨脹係數，故在切割時所產生的熱膨脹的影響下，會造成被切割材料不必要的浪費。因此，如何有效地提升材料切割率以及切割穩定度為目前亟待改善的問題。In general, the conventional cutting line uses a resin wire as a bare wire, and then the diamond particles are adhered to the resin wire for cutting. However, since the diamond particles adhere only by the adhesion of the resin, they are easily peeled off, resulting in loss. Therefore, a cutting line using a piano wire or a stainless steel wire as a bare wire and then plated with diamond abrasive grains is also proposed. However, due to the high density of the piano wire and the stainless steel wire, the purpose of weight reduction cannot be achieved. In addition, the piano wire and the stainless steel wire also have a high coefficient of thermal expansion, so that under the influence of the thermal expansion generated during cutting, unnecessary waste of the material to be cut is caused. Therefore, how to effectively improve the material cutting rate and the cutting stability is an urgent problem to be improved.
本發明提供一種切割線，能夠有效地提升材料切割率以及切割穩定度。The invention provides a cutting line which can effectively improve the material cutting rate and the cutting stability.
本發明提供一種切割線，其包括線材、導電材料層以及多個鑽石磨粒。導電材料層覆蓋線材，且鑽石磨粒位於導電材料層遠離線材的表面。The present invention provides a cutting line comprising a wire, a layer of electrically conductive material, and a plurality of diamond abrasive particles. A layer of electrically conductive material covers the wire and the diamond abrasive particles are located on the surface of the electrically conductive material layer away from the wire.
在本發明一實施例中，線材包括高分子纖維材料。In an embodiment of the invention, the wire comprises a polymeric fiber material.
在本發明一實施例中，高分子纖維材料具有由下列化學式(1)、化學式(2)或化學式(3)所示的化學結構： 化學式(1) 化學式(2) 化學式(3)； 其中，n為50至300的正整數，m為50至300的正整數，X為50至300的正整數，且Y為50至300的正整數。 In an embodiment of the invention, the polymer fiber material has a chemical structure represented by the following chemical formula (1), chemical formula (2) or chemical formula (3): Chemical formula (1) Chemical formula (2) Chemical formula (3); wherein n is a positive integer of 50 to 300, m is a positive integer of 50 to 300, X is a positive integer of 50 to 300, and Y is a positive integer of 50 to 300.
在本發明一實施例中，高分子纖維材料包括柴隆（Zylon®）高分子纖維、克維拉（Kevlar®）高分子纖維或維克聰（Vectran®）高分子纖維。In an embodiment of the invention, the polymer fiber material comprises Zylon® polymer fiber, Kevlar® polymer fiber or Vectran® polymer fiber.
在本發明一實施例中，線材包括玻璃纖維或是石墨烯纖維。In an embodiment of the invention, the wire comprises glass fibers or graphene fibers.
在本發明一實施例中，導電材料層包括一層或一層以上的金屬層或金屬氧化物層。In an embodiment of the invention, the layer of electrically conductive material comprises one or more layers of metal or metal oxide.
在本發明一實施例中，金屬層包括錫、鈀、鋁、銅、鎳、銀、金或其組合。In an embodiment of the invention, the metal layer comprises tin, palladium, aluminum, copper, nickel, silver, gold, or a combination thereof.
在本發明一實施例中，金屬氧化物層包括氧化鋅、氧化鋁鋅、氧化銦錫、氧化銦鋅、氧化鎵鋅、氧化銦鎵鋅或其組合。In an embodiment of the invention, the metal oxide layer comprises zinc oxide, aluminum zinc oxide, indium tin oxide, indium zinc oxide, gallium zinc oxide, indium gallium zinc oxide or a combination thereof.
在本發明一實施例中，鑽石磨粒的粒徑為1微米至10微米。In an embodiment of the invention, the diamond abrasive particles have a particle size of from 1 micron to 10 microns.
在本發明一實施例中，切割線的韌度（Tenacity）為19至37cN/dtex之間。In an embodiment of the invention, the toughness of the cutting line is between 19 and 37 cN/dtex.
基於上述，本發明藉由使用高分子纖維材料、玻璃纖維材料以及石墨烯纖維材料作為切割線的線材，可以有效地縮小切割線的線徑，藉以提升材料切割率，以避免被切割材料不必要的浪費。除此之外，由於本發明的切割線具有高張力強度，能夠避免切割過程中斷線狀況的產生，藉此提升切割穩定度。另一方面，由於本發明所使用的高分子纖維材料、玻璃纖維材料以及石墨烯纖維材料具有重量較輕等優點，故所形成的切割線亦能達到輕量化的目的。另外，本發明的高分子纖維材料以及玻璃纖維材料能夠被輕易地編織成為線索，可以大幅提升扭力水準。Based on the above, the present invention can effectively reduce the wire diameter of the cutting line by using the polymer fiber material, the glass fiber material, and the graphene fiber material as the wire of the cutting wire, thereby improving the cutting rate of the material to avoid unnecessary material to be cut. Waste. In addition, since the cutting line of the present invention has high tensile strength, it is possible to avoid the occurrence of interruption of the wire condition in the cutting process, thereby improving the cutting stability. On the other hand, since the polymer fiber material, the glass fiber material, and the graphene fiber material used in the present invention have advantages such as light weight, the formed cutting line can also achieve the purpose of weight reduction. Further, the polymer fiber material and the glass fiber material of the present invention can be easily woven into clues, and the torque level can be greatly improved.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1A是依照本發明一實施例的切割線的3D立體示意圖。圖1B是根據圖1A的切割線的剖線A-A’的剖面示意圖。請同時參照圖1A以及圖1B。切割線10包括線材11、導電材料層12以及鑽石磨粒13。1A is a 3D perspective view of a cutting line in accordance with an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along line A-A' of the cutting line of Fig. 1A. Please refer to FIG. 1A and FIG. 1B simultaneously. The cutting line 10 includes a wire 11, a layer of conductive material 12, and diamond abrasive particles 13.
在本實施例中，線材11的材料例如是高分子纖維材料、玻璃纖維或是石墨烯纖維。具體來說，當線材11的材料為高分子纖維材料時，其具有由下列化學式(1)、化學式(2)或化學式(3)所示的化學結構： 化學式(1) 化學式(2) 化學式(3)； 其中，n為50至300的正整數，m為50至300的正整數，X為50至300的正整數，且Y為50至300的正整數。 In the present embodiment, the material of the wire 11 is, for example, a polymer fiber material, a glass fiber or a graphene fiber. Specifically, when the material of the wire 11 is a polymer fiber material, it has a chemical structure represented by the following chemical formula (1), chemical formula (2) or chemical formula (3): Chemical formula (1) Chemical formula (2) Chemical formula (3); wherein n is a positive integer of 50 to 300, m is a positive integer of 50 to 300, X is a positive integer of 50 to 300, and Y is a positive integer of 50 to 300.
舉例來說，具有化學式(1)的高分子纖維材料包括柴隆（Zylon®）高分子纖維，具有化學式(2)的高分子纖維材料包括克維拉（Kevlar®）高分子纖維，具有化學式(3)的高分子纖維材料包括維克聰（Vectran®）高分子纖維。值得注意的是，高分子纖維材料較佳為柴隆（Zylon®）高分子纖維。然而，本發明不限於此。其他能夠符合化學式(1)至化學式(3)的產品亦可以作為本發明的線材11。For example, a polymer fiber material having the chemical formula (1) includes a Zylon® polymer fiber, and a polymer fiber material having a chemical formula (2) includes a Kevlar® polymer fiber having a chemical formula ( 3) Polymer fiber materials include Vectran® polymer fibers. It is worth noting that the polymer fiber material is preferably a Zylon® polymer fiber. However, the invention is not limited thereto. Other products capable of conforming to the chemical formula (1) to the chemical formula (3) can also be used as the wire 11 of the present invention.
另一方面，當線材11的材料為玻璃纖維時，線材11例如是S2玻璃纖維（S-2 Glass® Fibers），但本發明不限於此。其他適用的玻璃纖維亦可以作為本發明的線材11。On the other hand, when the material of the wire 11 is glass fiber, the wire 11 is, for example, S2 Glass® Fibers, but the invention is not limited thereto. Other suitable glass fibers can also be used as the wire 11 of the present invention.
請繼續參照圖1A，在本實施例中，導電材料層12包覆線材11的側表面，以完全覆蓋線材11。具體來說，形成導電材料層12的方式例如是無電電鍍法、化學鍍製程、熱蒸鍍法以及濺鍍法（sputtering），但本發明不限於此。其他合適的導電材料沉積法亦可以用以形成導電材料層12，只要導電材料層12確實能夠包覆線材11的側表面即可。With continued reference to FIG. 1A, in the present embodiment, the conductive material layer 12 covers the side surface of the wire 11 to completely cover the wire 11. Specifically, the method of forming the conductive material layer 12 is, for example, an electroless plating method, an electroless plating process, a thermal evaporation method, and a sputtering method, but the present invention is not limited thereto. Other suitable conductive material deposition methods can also be used to form the conductive material layer 12 as long as the conductive material layer 12 can indeed cover the side surface of the wire 11.
導電材料層12包括一層或一層以上的金屬層。另一方面，導電材料層12亦可以包括一層或一層以上的金屬氧化物層。詳細而言，金屬層的材料包括錫、鈀、鋁、銅、鎳、銀、金或其組合。另一方面，金屬氧化物層的材料包括氧化鋅、氧化鋁鋅、氧化銦錫、氧化銦鋅、氧化鎵鋅、氧化銦鎵鋅或其組合。換言之，當導電材料層12為多層結構時，可以是上述材料的堆疊結構。The layer of conductive material 12 includes one or more layers of metal. Alternatively, conductive material layer 12 may also include one or more layers of metal oxide. In detail, the material of the metal layer includes tin, palladium, aluminum, copper, nickel, silver, gold, or a combination thereof. On the other hand, the material of the metal oxide layer includes zinc oxide, aluminum zinc oxide, indium tin oxide, indium zinc oxide, gallium zinc oxide, indium gallium zinc oxide or a combination thereof. In other words, when the conductive material layer 12 is a multilayer structure, it may be a stacked structure of the above materials.
請參照圖1B，導電材料層12具有與線材11接觸的第一表面S1以及遠離線材11的第二表面S2。鑽石磨粒13形成於導電材料層12遠離線材11的第二表面S2，且鑽石磨粒13的粒徑為1微米至10微米。在本實施例中，由於鑽石磨粒13是藉由電鍍法形成於導電材料層12的第二表面S2，因此部份的鑽石磨粒13會鑲嵌於導電材料層12中。然而，本發明不限於此。在其他實施例中，鑽石磨粒13亦可以只位於導電材料層12的第二表面S2上。Referring to FIG. 1B, the conductive material layer 12 has a first surface S1 in contact with the wire 11 and a second surface S2 away from the wire 11. The diamond abrasive particles 13 are formed on the second surface S2 of the conductive material layer 12 away from the wire 11, and the diamond abrasive particles 13 have a particle diameter of 1 micrometer to 10 micrometers. In the present embodiment, since the diamond abrasive grains 13 are formed on the second surface S2 of the conductive material layer 12 by electroplating, a part of the diamond abrasive grains 13 are embedded in the conductive material layer 12. However, the invention is not limited thereto. In other embodiments, the diamond abrasive particles 13 may also be located only on the second surface S2 of the layer 12 of electrically conductive material.
承上述，由於本發明的切割線10採用高分子纖維材料、玻璃纖維或是石墨烯纖維作為線材11，故可以達到19至37cN/dtex之間的韌度（Tenacity）。換言之，本發明的切割線10的韌度可以達到鋼琴線或是不鏽鋼線作為裸線線材時的1.6至2倍。除此之外，由於高分子纖維材料、玻璃纖維以及石墨烯纖維的膨脹係數為鋼琴線或是不鏽鋼線的1/10以下，因此，在同等張力強度的要求下，本發明的切割線10的線徑可以縮小為鋼琴線或是不鏽鋼線的0.75至0.79倍，進而降低切片切損（kerf loss）比例，提升材料切割率。除此之外，本發明的切割線10的密度較低，可以將重量減輕至鋼琴線或是不鏽鋼線作為裸線線材時的1/3以下。In view of the above, since the cutting wire 10 of the present invention uses a polymer fiber material, a glass fiber or a graphene fiber as the wire 11, a tenacity of 19 to 37 cN/dtex can be achieved. In other words, the toughness of the cutting wire 10 of the present invention can be 1.6 to 2 times that of a piano wire or a stainless steel wire as a bare wire. In addition, since the expansion coefficient of the polymer fiber material, the glass fiber, and the graphene fiber is 1/10 or less of the piano wire or the stainless steel wire, the cutting wire 10 of the present invention is required under the same tensile strength. The wire diameter can be reduced to 0.75 to 0.79 times the piano wire or the stainless steel wire, thereby reducing the ratio of kerf loss and increasing the material cutting rate. In addition to this, the cutting wire 10 of the present invention has a low density, and can be reduced in weight to less than 1/3 of that of a bare wire or a stainless steel wire.
以下將列舉實例，以詳細說明本發明的線材11以及導電材料層12之間材料的搭配。值得注意的是，以下實例僅為例示，但本發明之範圍並不侷限於以下所提出的材料搭配。Examples will be exemplified below to explain in detail the combination of the materials of the wire 11 and the conductive material layer 12 of the present invention. It is to be noted that the following examples are merely illustrative, but the scope of the invention is not limited to the material combinations set forth below.
實例1Example 1
在實例1中，使用柴隆（Zylon®）高分子纖維作為線材11的材料，並使用富電子的金屬例如鎳、銅、銀或金作為導電材料層12。其中，柴隆（Zylon®）高分子纖維具有如化學式(1)所示的結構： 化學式(1)， 其中，n為50至300的正整數。 In Example 1, Zylon® polymer fiber was used as the material of the wire 11, and an electron-rich metal such as nickel, copper, silver or gold was used as the conductive material layer 12. Among them, Zylon® polymer fiber has a structure as shown in the chemical formula (1): Chemical formula (1), wherein n is a positive integer of 50 to 300.
由於化學式(1)為具有多元環之對位結構，其化學性質會因苯環電子共振穩定的機制而呈親電子特性，進而使得作為導電材料層12的富電子金屬能夠牢固地附著在線材11上。因此，鑽石磨粒13亦能穩定地附著在導電材料層12上，形成信賴性較高的切割線10。由於本發明的切割線10的韌度可以達到鋼琴線或是不鏽鋼線作為裸線線材時的1.6至2倍。因此，在同等張力強度的要求下，本發明的切割線10的線徑可以縮小為鋼琴線或是不鏽鋼線的0.75至0.79倍，以降低切片切損（kerf loss）比例，並提升材料切割率。Since the chemical formula (1) is a para-type structure having a polycyclic ring, its chemical properties are electrophilic due to the mechanism of electron resonance stabilization of the benzene ring, so that the electron-rich metal as the conductive material layer 12 can be firmly attached to the wire 11 on. Therefore, the diamond abrasive grains 13 can also stably adhere to the conductive material layer 12 to form the highly reliable cutting line 10. Since the toughness of the cutting wire 10 of the present invention can be 1.6 to 2 times that of a piano wire or a stainless steel wire as a bare wire. Therefore, under the requirement of the same tensile strength, the wire diameter of the cutting wire 10 of the present invention can be reduced to 0.75 to 0.79 times of the piano wire or the stainless steel wire to reduce the ratio of the kerf loss and increase the material cutting rate. .
實例2Example 2
在實例2中，使用克維拉（Kevlar®）高分子纖維作為線材11的材料，並使用富電子的金屬例如錫、鈀、鎳、銀或金作為導電材料層12。其中，克維拉（Kevlar®）高分子纖維具有如化學式(2)所示的結構： 化學式(2)， 其中，m為50至300的正整數。 In Example 2, Kevlar® polymer fibers were used as the material of the wire 11, and an electron-rich metal such as tin, palladium, nickel, silver or gold was used as the conductive material layer 12. Among them, Kevlar® polymer fiber has a structure as shown in the chemical formula (2): Chemical formula (2), wherein m is a positive integer of 50 to 300.
由於化學式(2)為具有苯環及醯胺鍵結之對位結構，且醯胺鍵的氧及氮具有較佳的親電子力，因此藉由苯環電子共振穩定的機制，化學式(2)所示的高分子纖維會呈現親電子特性，進而使得作為導電材料層12的富電子金屬能夠牢固地附著在線材11上。因此，鑽石磨粒13亦能穩定地附著在導電材料層12上，形成信賴性較高的切割線10。由於本發明的切割線10的韌度可以達到鋼琴線或是不鏽鋼線作為裸線線材時的1.6至2倍。因此，在同等張力強度的要求下，本發明的切割線10的線徑可以縮小為鋼琴線或是不鏽鋼線的0.75至0.79倍，以降低切片切損（kerf loss）比例，並提升材料切割率。Since the chemical formula (2) is a para-position having a benzene ring and a guanamine bond, and the oxygen and nitrogen of the guanamine bond have a good electrophilic force, the chemical formula (2) is stabilized by the electron resonance of the benzene ring. The polymer fiber shown exhibits electrophilic properties, and the electron-rich metal as the conductive material layer 12 can be firmly adhered to the wire 11. Therefore, the diamond abrasive grains 13 can also stably adhere to the conductive material layer 12 to form the highly reliable cutting line 10. Since the toughness of the cutting wire 10 of the present invention can be 1.6 to 2 times that of a piano wire or a stainless steel wire as a bare wire. Therefore, under the requirement of the same tensile strength, the wire diameter of the cutting wire 10 of the present invention can be reduced to 0.75 to 0.79 times of the piano wire or the stainless steel wire to reduce the ratio of the kerf loss and increase the material cutting rate. .
實例3Example 3
在實例3中，使用維克聰（Vectran®）高分子纖維作為線材11的材料，並使用富電子的金屬例如錫、鈀、鎳、銀或金作為導電材料層12。其中，維克聰（Vectran®）高分子纖維具有如化學式(3)所示的結構： 化學式(3)， 其中，X為50至300的正整數，且Y為50至300的正整數。 In Example 3, a Vectran® polymer fiber was used as the material of the wire 11, and an electron-rich metal such as tin, palladium, nickel, silver or gold was used as the conductive material layer 12. Among them, Vectran® polymer fiber has a structure as shown in chemical formula (3): Chemical formula (3), wherein X is a positive integer of 50 to 300, and Y is a positive integer of 50 to 300.
由於化學式(3)為具有苯環及聯苯環之結構，其化學性質會因苯環電子共振穩定的機制而呈親電子特性，進而使得作為導電材料層12的富電子金屬能夠牢固地附著在線材11上。因此，鑽石磨粒13亦能穩定地附著在導電材料層12上，形成信賴性較高的切割線10。由於本發明的切割線10的韌度可以達到鋼琴線或是不鏽鋼線作為裸線線材時的1.6至2倍。因此，在同等張力強度的要求下，本發明的切割線10的線徑可以縮小為鋼琴線或是不鏽鋼線的0.75至0.79倍，以降低切片切損（kerf loss）比例，並提升材料切割率。Since the chemical formula (3) is a structure having a benzene ring and a biphenyl ring, its chemical property is electrophilic due to the mechanism of electron resonance stabilization of the benzene ring, so that the electron-rich metal as the conductive material layer 12 can be firmly attached thereto. On the wire 11. Therefore, the diamond abrasive grains 13 can also stably adhere to the conductive material layer 12 to form the highly reliable cutting line 10. Since the toughness of the cutting wire 10 of the present invention can be 1.6 to 2 times that of a piano wire or a stainless steel wire as a bare wire. Therefore, under the requirement of the same tensile strength, the wire diameter of the cutting wire 10 of the present invention can be reduced to 0.75 to 0.79 times of the piano wire or the stainless steel wire to reduce the ratio of the kerf loss and increase the material cutting rate. .
實例4Example 4
在實例4中，使用S2玻璃纖維（S-2 Glass® Fibers），作為線材11的材料，並使用金屬氧化物作為導電材料層12。具體來說，金屬氧化物包括氧化鋅（ZnO）、氧化鋁鋅（ZnO:Al 2O 3；AZO）、氧化銦錫（In 2O 3:SnO 2；ITO）、氧化銦鋅（In 2O 3:ZnO；IZO）、氧化鎵鋅（Ga 2O 3:ZnO；GZO）、摻鉻氧化鋁鋅（AZO:Cr）、摻鉻氧化鋅（ZnO:Cr）或是摻鈷氧化鋅（ZnO:Co）。由於上述的金屬氧化物與S2玻璃纖維（S-2 Glass® Fibers）中的二氧化矽（SiO 2）具有良好的接合度，進而使得作為導電材料層12的金屬氧化物能夠牢固地附著在線材11上。因此，鑽石磨粒13亦能穩定地附著在導電材料層12上，形成信賴性較高的切割線10。由於本發明的切割線10的韌度可以達到鋼琴線或是不鏽鋼線作為裸線線材時的1.6至2倍。因此，在同等張力強度的要求下，本發明的切割線10的線徑可以縮小為鋼琴線或是不鏽鋼線的0.75至0.79倍，以降低切片切損（kerf loss）比例，並提升材料切割率。 In Example 4, S2 glass fiber (S-2 Glass® Fibers) was used as a material of the wire 11, and a metal oxide was used as the conductive material layer 12. Specifically, the metal oxide includes zinc oxide (ZnO), aluminum zinc oxide (ZnO: Al 2 O 3 ; AZO), indium tin oxide (In 2 O 3 :SnO 2 ; ITO), indium zinc oxide (In 2 O 3 : ZnO; IZO), gallium zinc oxide (Ga 2 O 3 : ZnO; GZO), chromium-doped aluminum oxide zinc (AZO: Cr), chromium-doped zinc oxide (ZnO: Cr) or cobalt-doped zinc oxide (ZnO: Co). Since the above metal oxide has good bonding with cerium oxide (SiO 2 ) in S2 glass fiber (S-2 Glass® Fibers), the metal oxide as the conductive material layer 12 can be firmly adhered to the wire. 11 on. Therefore, the diamond abrasive grains 13 can also stably adhere to the conductive material layer 12 to form the highly reliable cutting line 10. Since the toughness of the cutting wire 10 of the present invention can be 1.6 to 2 times that of a piano wire or a stainless steel wire as a bare wire. Therefore, under the requirement of the same tensile strength, the wire diameter of the cutting wire 10 of the present invention can be reduced to 0.75 to 0.79 times of the piano wire or the stainless steel wire to reduce the ratio of the kerf loss and increase the material cutting rate. .
綜上所述，本發明藉由使用高分子纖維材料、玻璃纖維材料以及石墨烯纖維材料作為切割線的線材，可以有效地縮小切割線的線徑，藉以提升材料切割率，以避免被切割材料不必要的浪費。除此之外，由於本發明的切割線具有高張力強度，能夠避免切割過程中斷線狀況的產生，藉此提升切割穩定度。另一方面，由於本發明所使用的高分子纖維材料、玻璃纖維材料以及石墨烯纖維材料具有重量較輕等優點，故所形成的切割線亦能達到輕量化的目的。另外，本發明的高分子纖維材料以及玻璃纖維材料能夠被輕易地編織成為線索，可以大幅提升扭力水準。In summary, the present invention can effectively reduce the wire diameter of the cutting line by using the polymer fiber material, the glass fiber material, and the graphene fiber material as the wire of the cutting wire, thereby improving the material cutting rate and avoiding the material to be cut. Unnecessary waste. In addition, since the cutting line of the present invention has high tensile strength, it is possible to avoid the occurrence of interruption of the wire condition in the cutting process, thereby improving the cutting stability. On the other hand, since the polymer fiber material, the glass fiber material, and the graphene fiber material used in the present invention have advantages such as light weight, the formed cutting line can also achieve the purpose of weight reduction. Further, the polymer fiber material and the glass fiber material of the present invention can be easily woven into clues, and the torque level can be greatly improved.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧切割線10‧‧‧ cutting line
11‧‧‧線材11‧‧‧Wire
12‧‧‧導電材料層12‧‧‧ Conductive material layer
13‧‧‧鑽石磨粒13‧‧‧Diamond Abrasives
S1‧‧‧第一表面S1‧‧‧ first surface
S2‧‧‧第二表面S2‧‧‧ second surface
圖1A是依照本發明一實施例的切割線的3D立體示意圖。 圖1B是根據圖1A的切割線的剖線A-A’的剖面示意圖。1A is a 3D perspective view of a cutting line in accordance with an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along line A-A' of the cutting line of Fig. 1A.
10‧‧‧切割線 10‧‧‧ cutting line
11‧‧‧線材 11‧‧‧Wire
12‧‧‧導電材料層 12‧‧‧ Conductive material layer
13‧‧‧鑽石磨粒 13‧‧‧Diamond Abrasives
Claims (7)
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| TW104143015A TWI580501B (en) | 2015-12-21 | 2015-12-21 | Cutting wire |
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| TW104143015A TWI580501B (en) | 2015-12-21 | 2015-12-21 | Cutting wire |
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| TW201722589A TW201722589A (en) | 2017-07-01 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201249602A (en) * | 2011-03-15 | 2012-12-16 | Sumitomo Electric Tochigi Co Ltd | Electrodeposition liquid for fixed-abrasive saw wire |
| CN202805445U (en) * | 2011-12-11 | 2013-03-20 | 赵钧永 | Improved ultrasonic-wave multi-line cutting special-purpose device |
| TW201323154A (en) * | 2011-12-15 | 2013-06-16 | Ying-Tung Chen | Product having abrasive particles and manufacturing method thereof |
| CN204844534U (en) * | 2015-07-31 | 2015-12-09 | 车国志 | Carbon fiber cutting wire |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201249602A (en) * | 2011-03-15 | 2012-12-16 | Sumitomo Electric Tochigi Co Ltd | Electrodeposition liquid for fixed-abrasive saw wire |
| CN202805445U (en) * | 2011-12-11 | 2013-03-20 | 赵钧永 | Improved ultrasonic-wave multi-line cutting special-purpose device |
| TW201323154A (en) * | 2011-12-15 | 2013-06-16 | Ying-Tung Chen | Product having abrasive particles and manufacturing method thereof |
| CN204844534U (en) * | 2015-07-31 | 2015-12-09 | 车国志 | Carbon fiber cutting wire |
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