TWI580277B - Thin speaker - Google Patents

Description

Thin speaker

The present invention relates to a thin speaker.

The current trend of thin and light mobile devices has made it necessary to reduce the size of the components in the mobile device while maintaining the original performance. Therefore, the speakers that are indispensable in the mobile device also face the need to reduce the size, maintain the sound quality and reduce the work. Consumption requirements. However, when the size of the electromagnetic coil component of the speaker in the mobile device is to be reduced, it is obviously limited by the mechanical and physical characteristics of the electromagnetic coil itself, and the sound quality of the microspeaker having the electromagnetic coil is easily reduced by the size of the electromagnetic coil. decline. Furthermore, piezoelectric speakers can avoid this problem, but their high operating voltage characteristics are not easy to apply to mobile devices, and thin piezoelectric speakers are also easy to cause damage when the user holds them.

The present invention provides a thin speaker having at least one of the advantages of low operating voltage, good sound quality, avoidance of external force damage, and sound quality unaffected by the mounting position.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In order to achieve one or a part or all of the above or other objects, a thin speaker according to an embodiment of the invention comprises a circuit board, a piezoelectric speaker element, a first spacer and a second spacer. The circuit board is provided with a plurality of electronic components, the piezoelectric speaker elements are disposed on one side of the circuit board and the electronic components drive the piezoelectric speaker elements to generate sound vibration. The first gasket and the second gasket are disposed on two sides of the circuit board, the first gasket, the circuit board and the piezoelectric speaker Defining a first sound cavity, the second pad, the circuit board and the piezoelectric speaker element define a second sound cavity, and the circuit board is formed to transmit a medium of sound vibration together with the first pad and the second The gasket transmits sound vibration.

Another embodiment of the present invention provides a thin speaker comprising a circuit board, a piezoelectric speaker element, a first spacer, a second spacer, and at least one sponge tissue spacer. The circuit board is provided with a plurality of electronic components, the piezoelectric speaker elements are disposed on one side of the circuit board and the electronic components drive the piezoelectric speaker elements to generate sound vibration. The sponge tissue gasket is disposed on one side of the circuit board, and the thickness and total weight of the circuit board are set to a predetermined value so that the sponge tissue gasket and the circuit board are formed as a medium for transmitting the sound vibration, and the sponge tissue gasket absorbs the accompanying sound. Noise generated by vibration or reduced peak intensity of sound vibration. The first gasket and the second gasket are disposed on both sides of the sponge tissue gasket, and the first gasket, the second gasket, the circuit board, the sponge tissue gasket and the piezoelectric speaker element define at least two sound chambers.

Another embodiment of the present invention provides a thin speaker comprising a sound source component, a spacer set, and a circuit board. The spacer group includes a plurality of spacers, and the plurality of spacers are disposed beside the sound source component to protect the sound source component and transmit the sound vibration generated by the sound source component, and a buffer space for avoiding damage of the sound source component is formed between the plurality of spacers and the sound source component. The circuit board is provided with a plurality of electronic components that drive the sound source components to generate sound vibrations, and the circuit board transmits sound vibrations.

With the design of each of the above embodiments, the spacer is disposed beside the sound source element to protect the sound source element and transmit the sound vibration generated by the sound source element, and a buffer space for avoiding damage of the sound source element is formed between the spacer and the sound source element. Furthermore, the circuit board can be a spacer for transmitting the sound vibration of the sound source component, so that the total area of the thin speaker can be increased to increase the sound pressure level of the thin speaker, and the sponge tissue pad can absorb high frequency noise. . The opening formed in the spacer can be used to fine tune the sound performance parameters of the thin speaker such as the sound pressure level and the total harmonic distortion rate at different frequencies to adjust the thin speaker to the desired sound effect. Output characteristics. The electronic component may include a function of cutting out, weakening or enhancing a specific frequency interval of the sound vibration to compensate for the interval of insufficient sound, and when the system has a plurality of sound source components, the electronic component may also improve the sound generated between the individual sound source components. The problem of inconsistent performance characteristics.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein. The above and other objects, features, and advantages of the invention will be apparent from

10, 60‧‧‧ Thin speaker

12, 42‧‧‧ shims

14, 44, 54, 64‧‧ ‧ openings

22‧‧‧ Circuit board

24‧‧‧Fixed institutions

26‧‧‧Electronic components

28‧‧‧Connector

32‧‧‧Piezo speaker

52, 52a, 52b‧‧‧Sponge tissue gasket

62‧‧‧Substrate gasket

82‧‧‧ front shell

84‧‧‧Printed circuit board

86‧‧‧ Back shell

92‧‧‧ display panel

92a‧‧‧ front side

92b‧‧‧ Back side

100‧‧‧Sound Broadcasting System

122‧‧‧Power supply unit

124‧‧‧Pre-amplification unit

126‧‧‧Compensation filter unit

128‧‧‧ drive unit

140‧‧‧round opening

142‧‧‧ Crescent Shaped Hole

114, 116, 150, 152‧‧‧ Sound pressure level curve

A, B‧‧‧ curve section

D‧‧‧ drive signal

P, Q‧‧‧ sound cavity

S‧‧‧ signal

V‧‧‧ voltage

1 is a schematic view of a thin speaker according to an embodiment of the present invention.

2 is a block diagram of an electronic component in accordance with an embodiment of the present invention.

Fig. 3 is a graph showing the sound pressure level profile of the piezoelectric speaker element as a function of different frequency values and the sound pressure level profile of the thin speaker.

4 is a schematic view of a thin speaker according to another embodiment of the present invention.

FIG. 5 is a schematic diagram of a thin speaker according to another embodiment of the present invention.

6A and 6B are schematic views showing openings of different shapes formed on the spacer.

Fig. 7 is a graph showing sound pressure level profiles of piezoelectric speaker elements and thin speakers of different examples.

8-10 are schematic views showing the arrangement of a thin speaker according to an embodiment of the present invention in different devices.

Figure 11 is a schematic view of a thin speaker according to another embodiment of the present invention.

Figure 12 is a schematic illustration of a thin speaker in accordance with another embodiment of the present invention.

Figure 13 is a schematic view of a thin speaker according to another embodiment of the present invention.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

1 is a schematic view of a thin speaker 10 according to an embodiment of the present invention. As shown in FIG. 1, a thin speaker 10 includes two spacers 12, 42, a circuit board 22, a piezoelectric speaker element 32, and a sponge tissue spacer 52. The piezoelectric speaker element 32 can be mounted above or below the circuit board 22, or the piezoelectric speaker element 32 can be directly embedded in the circuit board 22. In one embodiment, the sponge tissue spacer 52 can be disposed above the circuit board 22, and the spacer 12 can be disposed on the sponge tissue spacer 52, and the spacer 12, the sponge tissue spacer 52, the circuit board 22, and the piezoelectric The space surrounded by the speaker element 32 constitutes a sound chamber P. Further, the spacer 42 can be disposed at the bottom of the circuit board 22, and the space surrounded by the spacer 42, the piezoelectric speaker element 32 and the circuit board 22 can be configured. Another sound chamber Q. The sound chamber P and the sound chamber Q can be used to increase the loudness of the piezoelectric speaker element 32, and can be used as a buffer space when external stress is applied to the piezoelectric speaker element 32, for example, a user may press a mobile device or the like to collide. In the case of the thin speaker 10, the sound chamber P and the sound chamber Q can serve as a buffer space for avoiding damage of the piezoelectric speaker element 32.

As shown in FIG. 1, the spacer 12 and the spacer 42 can respectively cover the top and bottom of the thin speaker 10. The spacer 12 and the spacer 42 can also provide an external blocking stress to reduce the piezoelectric speaker element 32. The probability of damage when the user presses or assembles into a system. The piezoelectric speaker element 32 can be used as an embedded sound source of the thin speaker 10, and the piezoelectric or electrostatic effect can be used to reproduce the sound. The sponge tissue pad 52 can serve as a part of the medium for transmitting the sound vibration of the piezoelectric speaker element 32, that is, The sponge tissue spacer 52 can serve as an intermediary for the circuit board 22 to vibrate, when the sponge tissue spacer 52 is caused by the piezoelectric When the sound generated by the acoustic element 32 vibrates and vibrates, the circuit board 22 can be caused to vibrate to make the circuit board 22 an extension of the piezoelectric speaker element 32. The sponge tissue spacer 52 can also absorb, for example, harmonic noise caused by the shape of the piezoelectric speaker element 32. The circuit board 22 can serve as another part of the medium for transmitting the audio of the piezoelectric speaker element 32. The circuit board 22 can include a securing mechanism 24, a plurality of electronic components 26, and a plurality of connectors 28. The fixing mechanism 24 can be used to fix the thin speaker 10 in an external system (not shown) provided with the slim speaker 10. The connector 28 includes audio input, control, and connection terminals for supplying power to the thin speaker 10. The plurality of electronic components 26 can be located on either side of the circuit board 22 or embedded within the circuit board 22. The vibration signal from the piezoelectric speaker element 32 can be transmitted to the circuit board 22, and the thickness and total weight of the circuit board 22 can be set so that the circuit board 22 also serves as a spacer for transmitting the audio of the piezoelectric speaker element 32. Thus, the total area of the spacer of the thin speaker 10 can be increased to increase the sound pressure level of the thin speaker 10. That is, the circuit board 22 can serve as a medium in the sound vibration transmission path of the piezoelectric speaker element 32, the spacer 12, the spacer 42, the sponge tissue spacer 52, and the system in which the thin speaker 10 is embedded to generate a more High sound pressure level and loudness.

The sponge tissue spacer 52 may have openings 54 of different shapes or may have no openings 54. The spacers 12, 42 may have openings 14 and 44 of different shapes, respectively, or the spacers 12, 42 may not form the openings 14, 44. The openings 14, 44, 54 formed on the spacers 12, 42, 52, respectively, can be used to fine tune the sound performance parameters of the thin speaker 10 such as the sound pressure level and the total harmonic distortion rate at different frequencies to the thin speaker. 10 Adjust to the desired sound output characteristics.

The electronic component 26 can provide a function of compensating for the insufficient sound interval of the piezoelectric speaker element 32, thereby improving the sound effect of the piezoelectric speaker element 32 to a desired level, and when the system has a plurality of piezoelectric speaker elements 32, The electronic component 26 can also improve the problem of inconsistent sound performance characteristics generated between the individual piezoelectric speaker elements 32. Above sound The effect can be defined, for example, as including characteristic parameters such as an audio frequency response, a sound pressure level, and a total harmonic distortion. As shown in FIG. 2, the system in which the thin speaker 10 is embedded can input a digital or analog signal S to the preamplifier unit 124, and the preamplifier unit 124 amplifies the signal to a predetermined level, and the amplified signal S passes through the compensation filter unit. After 126 is transmitted to the drive unit 128. The compensation filtering unit 126 can reinforce and filter the amplified signal S according to the characteristics of the piezoelectric speaker element 32. The driving unit 128 can generate a driving signal D, and the driving unit 128 can integrate the automatic level control flow to ensure that the piezoelectric speaker element 32 is driven by the maximum value of the driving signal D. The voltage V of the system in which the thin speaker 10 is embedded may be delivered to the power supply unit 122, which converts the voltage V to supply power to all of the units of the electronic component 26. In addition, a feedback path is provided to ensure the reliability of the electronic component 26 using a feedback correction process. In the present embodiment, the operating voltage of the electronic component 26 can be lower than the operating voltage of the piezoelectric speaker component 32 to simplify the system design of the thin speaker 10. The system in which the thin speaker 10 is embedded may be, for example, a mobile device or the like without limitation, and the voltage V may be, for example, about 3.3 to 5 volts. The power supply unit 122 may integrate the low to high voltage converter to output a maximum driving signal D to drive the piezoelectric speaker element 32, and the maximum driving signal may have a peak voltage (Vpp) of about 15-30 volts.

An example of the operation of the thin speaker 10 will be described below. First, the electronic component 26 of the circuit board 22 receives the audio signal from the connector 28 and amplifies the audio signal and drives the piezoelectric speaker element 32. Therefore, the piezoelectric speaker element 32 generates a sound vibration that coincides with the sound signal, which can be transmitted to the circuit board 22 and can be transmitted to the system in which the thin speaker 10 is embedded via the sponge tissue pad 52. The sound generated by the piezoelectric speaker element 32 is propagated in the air by the spacer 12, the sound chamber P, the spacer 42 and the sound chamber Q.

When the piezoelectric speaker element 32 produces a sound vibration, high frequency noise and high The frequency and acoustic noise may be attenuated by the influence of the circuit board 22 as a spacer, while other audio vibrations may continue to be transmitted in the thin speaker 10. 3 is a characteristic diagram showing sound pressure levels of a piezoelectric speaker element and a thin speaker according to an embodiment of the present invention. 3 shows the sound pressure level profile 114 of the piezoelectric speaker element 32 as a function of different frequency values and the sound pressure level profile 116 of the thin speaker 10, and the curve section A of FIG. 3 shows the thin speaker for the low audio response area. 10 The effect of improving the sound effect of the piezoelectric speaker element, which is mainly caused by the vibration of the circuit board 22 and the low-audio vibration transmitted from the circuit board 22 to the system using the thin speaker 10. Moreover, the curved section B of FIG. 3 clearly shows that the sound pressure level of the piezoelectric speaker element 32 in the high-audio response region can be corrected, and the correction effect is mainly by the circuit design of the electronic component 26 on the circuit board 22. And the sponge tissue spacer 52 absorbs both the peak vibration generated by the piezoelectric speaker element 32. Since the human ear is sharp to high audio and high audio is prone to harmonic noise, the electronic component 26 may include an amplifier with a low pass filter to intercept or attenuate high frequency sounds above a certain frequency, as shown in FIG. Curve section B shows that the sound pressure level of the high audio response area can be reduced by this circuit design.

As shown in FIG. 4, in another embodiment, the sponge tissue spacer 52 can be disposed on the bottom of the circuit board 22, and the spacer 12 can be disposed on the sponge tissue spacer 52, and the circuit board 22, the spacer 12, and The space surrounded by the piezoelectric speaker element 32 constitutes a sound chamber P. Furthermore, the spacer 42 can be disposed at the bottom of the sponge tissue spacer 52, and the space surrounded by the spacer 42, the piezoelectric speaker element 32, the circuit board 22, and the sponge tissue spacer 52 can constitute another sound cavity Q.

As shown in FIG. 5, in another embodiment, two sponge tissue pads 52a, 52b may be respectively disposed above and at the bottom of the circuit board 22, and the spacer 12 may be disposed on the sponge tissue pad located above the circuit board 22. The film 52a, and the circuit board 22, the piezoelectric speaker element 32, the spacer 12, and the top sponge tissue spacer 52a surround the space A sound chamber P. Furthermore, the spacer 42 can be disposed at the bottom of the sponge tissue spacer 52b at the bottom of the circuit board 22, and the space surrounded by the spacer 42, the piezoelectric speaker element 32, the circuit board 22 and the bottom sponge tissue spacer 52b can be Forming another sound chamber Q.

In addition, the openings 14, 44 formed in the spacers 12, 42 can be used to fine tune the sound effect parameters of the thin speaker 10 such as sound pressure level and total harmonic distortion at different frequencies to change the sound output characteristics of the thin speaker 10. . 6A and 6B show schematic views of apertures of different shapes formed on the spacer 42, wherein FIG. 6A shows the circular aperture 140 and FIG. 6B shows the crescent aperture 142. Figure 7 is a graph showing the sound pressure level of each of the different thin speakers 10, for example, the sound pressure level curve 152 shows the characteristic performance of the thin speaker 10 having the circular opening 140, and the sound pressure level curve 150 is shown to have a new The thin speaker 10 of the moon-shaped opening 142 is characterized. As shown in FIG. 7, the sound pressure level curve 152 has a single peak at a sound pressure level at a frequency interval of about 600-1.5 kHz, and has other peaks at a frequency interval of about 5 k-20 kHz. The sound pressure level curve 150 has a double peak at a sound pressure level at a frequency interval of about 400-1.9 kHz and has other peaks at a frequency interval of 5k-20 kHz. Therefore, the characteristic performance curve of the thin speaker 10 can be changed by forming different numbers or shapes of openings on the spacer, thereby adjusting the sound pressure level of the thin speaker 10 to a desired level value. The shape of the opening of the thin speaker 10 is not limited. For example, it may have a rectangular strip shape, a square shape or a star shape, and the like, and different sound pressure level curves may be generated by the openings of different shapes.

In addition, the thin speaker 10 can have an outer cover to cover the inner component to prevent the piezoelectric speaker element 32 of the thin speaker 10 from being damaged when the user holds the hand or when the thin speaker 10 is embedded in a system. The outer shape of the outer cover of the thin speaker 10 is not limited, but may vary with the outer shape of the thin speaker 10 to facilitate installation into a dedicated space of the system.

As shown in FIG. 8, at least one thin speaker 10 can be mounted or embedded to The front housing 82, printed circuit board 84 or back housing 86 of any mobile device. Since the thickness of the thin speaker 10 is extremely small, it can be mounted or embedded in any space of the mobile device, so that it is easy to fine-tune the sound performance of the mobile device so that the output sound performance is not limited by the size of the speaker. Moreover, since the thickness of the thin speaker 10 is extremely small, the mobile device can be designed to be as thin as possible without being limited by the size of the speaker. In addition, the piezoelectric speaker element 32 has a good conversion efficiency between electric energy and sound, so that it can have a small power consumption under the condition of generating the same sound pressure level or volume. Furthermore, the electromagnetic interference generated when the electronic component 26 and the piezoelectric speaker component 32 operate is extremely low, and even if the component or module that generates electromagnetic interference is mounted beside the thin speaker 10, the operation of the thin speaker 10 is not affected.

As shown in FIG. 9, at least one thin speaker 10 can be mounted or embedded in the front side 92a or the back side 92b of a display panel 92, and a sound pressure level and volume can be generated by transmitting sound vibrations to the display panel 92. And the flexibility of the system design of the display panel 92 and the speaker can be provided. In addition, if the thin speaker 10 is used as an ear speaker, it is not necessary to consider the position matching problem between the display panel 92 and the ear speaker. As shown in FIG. 10, a plurality of thin speakers 10 can be mounted to a sound broadcasting system 100, and each speaker 10 can transmit different sound signals in different directions by different structural configurations of the respective speakers 10.

The material of the spacers 12, 42 may be, for example, polyetherimide (PEI), polyethylene terephthalate (PET), or polyethylene naphthalate (PEN), but is not limited. The circuit board 22 can be, for example, an FR4 printed circuit board or an FR5 printed circuit board, but is not limited. Electronic component 26 may comprise, for example, a semiconductor component, an inductor, a capacitor, a resistor, a linear transformer, or the like. The piezoelectric speaker element 32 can be, for example, a piezoelectric ceramic speaker element, an electrostatic speaker element, a piezoelectric speaker element made of a polyester fiber material, or the like. The sponge tissue spacer 52 can be, for example, a sponge piece of the model 5930 VHB manufactured by 3M Company. The spacer 12 and the spacer 42 are provided to isolate and protect the piezoelectricity during hand-held or manufacturing The function of the speaker element 32, which can operate at, for example, 5V, the thickness of the thin speaker 10 can be, for example, only 1.05 mm, so that it can be mounted in a very small space provided by the mobile device. The thin speaker 10 can be attached to, for example, the inside of the casing of the mobile device, the printed circuit board of the system, or the display panel embedded in the mobile device, and the like, and is not limited at all.

Figure 11 is a schematic view of a thin speaker according to another embodiment of the present invention. As shown in FIG. 11, the thin speaker 60 can further include a substrate spacer 62. The substrate spacer 62 can improve the stability of the overall structure of the thin speaker 60. The material of the substrate spacer 62 can be metal, plastic, wood, glass, etc. Etc. is not limited at all. The sponge tissue spacer 52 can be disposed on the circuit board 22, and the spacer 12 can be disposed on the sponge tissue spacer 52, and the spacer 12, the sponge tissue spacer 52, the circuit board 22, and the piezoelectric speaker element 32 are surrounded. The space constituting a sound chamber P. Further, the spacer 42 may be disposed at the bottom of the circuit board 22, and the space surrounded by the spacer 42, the piezoelectric speaker element 32, and the circuit board 22 may constitute another sound cavity Q. The installation position of the substrate spacer 62 is not limited, and may be provided, for example, at the bottom of the thin speaker 60 to support members of the thin speaker 60 such as the circuit board 22, the piezoelectric speaker element 32, and the respective spacers 12, 42, 52. The substrate pad 62 can also form at least one opening 64. If the substrate pad 62 forms a plurality of openings 64, the different openings 64 can have different shapes. The arrangement of the openings 64 can also be fine-tuned at different frequencies. The sound effect parameters of the thin speaker 60 such as the sound pressure level and the total harmonic distortion are used to change the sound output characteristics of the thin speaker 60. 12 and 13 show different configurations of the thin speaker provided with the substrate spacer 62. As shown in FIG. 12, the sponge tissue spacer 52 can be disposed at the bottom of the circuit board 22, and the spacer 12 can be disposed on the sponge tissue spacer 52, and the circuit board 22, the spacer 12, and the piezoelectric speaker element 32 surround. The space formed constitutes a sound chamber P, and the spacer 42 can be disposed at the bottom of the sponge tissue spacer 52, and the space surrounded by the spacer 42, the piezoelectric speaker element 32, the circuit board 22 and the sponge tissue spacer 52 can be formed. Another sound chamber Q. The substrate spacer 62 can be disposed, for example, at the bottom of the thin speaker to support other members of the thin speaker. As shown in Figure 13 In another embodiment, the two sponge tissue pads 52a, 52b can be respectively disposed above and at the bottom of the circuit board 22, and the spacer 12 can be disposed on the sponge tissue spacer 52a located above the circuit board 22. The space surrounded by the circuit board 22, the piezoelectric speaker element 32, the spacer 12, and the sponge tissue pad 52a at the top constitutes a sound chamber P. Furthermore, the spacer 42 can be disposed at the bottom of the sponge tissue spacer 52b at the bottom of the circuit board 22, and the space surrounded by the spacer 42, the piezoelectric speaker element 32, the circuit board 22 and the bottom sponge tissue spacer 52b can be Forming another sound chamber Q. The substrate spacer 62 can be disposed, for example, at the bottom of the thin speaker to support other members of the thin speaker.

In summary, the embodiments of the present invention have at least one of the following advantages. With the design of the above embodiments, the spacer is disposed beside the sound source element to protect the sound source element and transmit the sound vibration generated by the sound source element, and the spacer and the A buffer space is formed between the sound source elements to prevent damage of the sound source elements. Furthermore, the circuit board can be a spacer for transmitting the sound vibration of the sound source component, so that the total area of the thin speaker can be increased to increase the sound pressure level of the thin speaker, and the sponge tissue pad can absorb high frequency noise. . The opening formed in the spacer can be used to fine tune the sound performance parameters of the thin speaker such as the sound pressure level and the total harmonic distortion rate at different frequencies to adjust the thin speaker to the desired sound output characteristic. The electronic component may include a function of cutting out, weakening or enhancing a specific frequency interval of the sound vibration to compensate for the interval of insufficient sound, and when the system has a plurality of sound source components, the electronic component may also improve the sound generated between the individual sound source components. The problem of inconsistent performance characteristics.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. For example, the positional relationship of the various forms of the spacers with respect to each other and with respect to other components in the foregoing various embodiments may vary depending on the requirements and is not limited at all. In addition, any of the embodiments or patent applications of the present invention are not required to achieve all of the objects or advantages disclosed herein. Or characteristics. In addition, the terms "first" and "second" as used in the specification or the scope of the claims are only used to name the components or distinguish different embodiments or ranges, and are not intended to limit the upper or lower limits of the number of components. .

10‧‧‧Thin speaker

12, 42‧‧‧ shims

14, 44, 54‧‧‧ openings

22‧‧‧ Circuit board

24‧‧‧Fixed institutions

26‧‧‧Electronic components

28‧‧‧Connector

32‧‧‧Piezo speaker

52‧‧‧Sponge tissue gasket

P, Q‧‧‧ sound cavity

Claims (12)

A thin speaker comprising: a circuit board provided with a plurality of electronic components; a piezoelectric speaker element disposed on one side of the circuit board and the electronic components driving the piezoelectric speaker element to generate sound vibration; a gasket and a second gasket are disposed on two sides of the circuit board, wherein the first gasket, the circuit board and the piezoelectric speaker element define a first sound chamber, the second gasket, The circuit board and the piezoelectric speaker element define a second sound chamber, and the circuit board is formed to transmit a medium of the sound vibration to transmit the sound vibration together with the first gasket and the second gasket; a substrate spacer formed with at least one opening to finely adjust a sound pressure level output by the thin speaker at different frequencies. The thin speaker according to claim 1, further comprising: at least one sponge tissue spacer disposed on one side of the circuit board and formed as a medium for transmitting the sound vibration. The thin speaker of claim 1 or 2, wherein at least one of the first spacer, the second spacer, and the sponge tissue spacer is formed with at least one opening. A thin speaker according to claim 1, wherein the electronic components comprise a compensation filtering unit to cut off, weaken or enhance a specific frequency interval of the sound vibration. A thin speaker comprising: a circuit board provided with a plurality of electronic components; a piezoelectric speaker element disposed on one side of the circuit board and the electronic components driving the piezoelectric speaker element to generate sound vibration; at least one a sponge tissue spacer disposed on one side of the circuit board, wherein a thickness and a total weight of the circuit board are set to a predetermined value to form the sponge tissue spacer and the circuit board Transmitting the medium of the sound vibration, and the sponge tissue gasket absorbs noise generated by the sound vibration or reduces the peak intensity of the sound vibration; and a first gasket and a second gasket disposed on the sponge tissue gasket Two sides, wherein the first spacer, the second spacer, the circuit board, the sponge tissue spacer and the piezoelectric speaker element define at least two sound chambers, wherein the first spacer, the second At least one of the spacer and the sponge tissue spacer is formed with at least one opening to fine tune the sound pressure level output by the thin speaker at different frequencies. The thin speaker of claim 5, wherein the electronic components comprise a compensation filtering unit. The thin speaker according to claim 5, wherein the openings are plural, and the openings have different shapes from each other. The thin speaker of claim 5, wherein the operating voltage of the electronic components is lower than an operating voltage of the piezoelectric speaker. The thin speaker of claim 2 or 5, wherein the sponge tissue spacer is disposed between the circuit board and the first spacer, or the first spacer is disposed on the sponge tissue spacer and the circuit board between. A thin speaker comprising: a sound source component; a spacer set comprising a plurality of spacers disposed adjacent to the sound source component to protect the sound source component and transmit sound vibration generated by the sound source component, and the spacers Forming a buffer space between the sound source component to prevent damage of the sound source component; a substrate spacer formed with at least one opening to finely adjust a sound pressure level outputted by the thin speaker at different frequencies; and a circuit The board is provided with a plurality of electronic components that drive the sound source component to generate the sound vibration, and the circuit board transmits the sound vibration. The thin speaker of claim 10, wherein the spacers comprise at least one high frequency noise absorbing pad. The thin speaker of claim 10, wherein the substrate spacer is made of metal, plastic, wood or glass.