TWI577965B - Detecting method of detecting status of mold - Google Patents

Detecting method of detecting status of mold Download PDF

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TWI577965B
TWI577965B TW105102478A TW105102478A TWI577965B TW I577965 B TWI577965 B TW I577965B TW 105102478 A TW105102478 A TW 105102478A TW 105102478 A TW105102478 A TW 105102478A TW I577965 B TWI577965 B TW I577965B
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image
detection
area
sample
mold
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TW105102478A
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TW201727192A (en
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陳俞
徐自謙
紀廷運
黃俊彥
楊志強
辛孟錩
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高瞻資訊股份有限公司
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模具狀態檢測方法 Mold state detection method

本發明係與檢測方法有關,特別有關於模具狀態檢測方法。 The present invention relates to a detection method, and more particularly to a mold state detecting method.

現有的採用射出成形技術的模型製造裝置係使用包括公模及母模的模具。具體而言,當欲製造模型時,製造裝置先使公模朝接近母模方向移動以進行鎖模(即將公模及母模緊密結合)。接著,製造裝置將液態的原料射出至母模,並等待其冷卻成型。於冷卻完成後,製造裝置再使公模朝遠離母模方向移動,並使用頂針將已成型的模型頂出公模以完成退模。 A conventional mold manufacturing apparatus using an injection molding technique uses a mold including a male mold and a female mold. Specifically, when the model is to be manufactured, the manufacturing apparatus first moves the male mold toward the mother mold to perform mold clamping (ie, the male mold and the female mold are tightly coupled). Next, the manufacturing apparatus ejects the liquid raw material to the master mold and waits for it to be cooled and molded. After the cooling is completed, the manufacturing device moves the male mold away from the master mold, and uses the thimble to push the formed mold out of the male mold to complete the mold release.

然而,於現有技術中,操作人員於製造裝置退模後需手動檢測模具狀態是否異常(如頂針未完全收回、公模內有殘留物或模具受損),若無異常才可進行下次製造。前述檢測方式需耗費人力且增加製造成本。 However, in the prior art, the operator needs to manually check whether the state of the mold is abnormal after the mold is removed from the manufacturing device (for example, the thimble is not completely retracted, there is residue in the male mold or the mold is damaged), and the next manufacturing can be performed if there is no abnormality. . The aforementioned detection method requires labor and increases manufacturing costs.

為解決上述問題,目前已有一種模具狀態檢測裝置被提出。現有的模具狀態檢測裝置係預存一組樣本影像(即模具狀態正常時以特定視角所拍攝的影像),並可於模具退模時以相同視角拍攝模具當前的影像(即檢測影像)。接著,模具狀態檢測裝置直接將樣本影像與檢測影像進行比對,以判斷模具狀態是否異常。 In order to solve the above problems, a mold state detecting device has been proposed. The existing mold state detecting device pre-stores a set of sample images (that is, images taken at a specific viewing angle when the mold state is normal), and can capture the current image of the mold (ie, detect images) at the same viewing angle when the mold is demolded. Next, the mold state detecting device directly compares the sample image with the detected image to determine whether the mold state is abnormal.

然而,由於機械運作存在誤差(如每次模具退模後的位置並不完全相同或模具可能因震動而產生晃動),現有的模具狀態檢測裝置於未考慮上述誤差且未對所擷取影像進行校正的情況下,其檢測結果將失準,而使準確率低落。 However, due to errors in the mechanical operation (such as the position of each mold after the mold is not completely the same or the mold may be shaken due to vibration), the existing mold state detecting device does not consider the above error and does not perform the captured image. In the case of correction, the detection result will be out of alignment, and the accuracy will be low.

是以,現有模具狀態檢測裝置存在上述問題,而亟待更有效的方案被提出。 Therefore, the existing mold state detecting device has the above problems, and a solution to be more effective is proposed.

本發明之主要目的,係在於提供一種模具狀態檢測方法,可對檢測影像進行校正,並使用校正後的檢測影像來進行檢測。 The main object of the present invention is to provide a mold state detecting method which can correct a detected image and perform detection using the corrected detected image.

為達上述目的,本發明係提供一種模具狀態檢測方法,包括下列步驟:a)擷取一模具的一檢測影像,並於該檢測影像中設定一檢測區域;b)取得該模具的一樣本影像,並於該樣本影像中的相同位置設定一樣本區域,其中該樣本區域與該檢測區域具有相同區域大小;c)依據該檢測區域中的影像及該樣本區域中的影像計算一區域位移值;d)依據該區域位移值校正該檢測影像;及e)依據該樣本影像及校正後的該檢測影像來決定一檢測結果。 In order to achieve the above object, the present invention provides a mold state detecting method comprising the steps of: a) capturing a detection image of a mold, and setting a detection area in the detection image; b) obtaining the same image of the mold. And setting the same area in the same position in the sample image, wherein the sample area has the same area size as the detection area; c) calculating an area displacement value according to the image in the detection area and the image in the sample area; d) correcting the detection image according to the displacement value of the region; and e) determining a detection result according to the sample image and the corrected detection image.

本發明經由對檢測影像進行校正,可有效提升模具狀態檢測的準確率。 The invention can effectively improve the accuracy of the mold state detection by correcting the detected image.

1‧‧‧模具狀態檢測裝置 1‧‧‧Mold condition detecting device

10‧‧‧影像擷取模組 10‧‧‧Image capture module

12‧‧‧記憶體 12‧‧‧ memory

14‧‧‧輸出模組 14‧‧‧Output module

16‧‧‧警示模組 16‧‧‧Warning module

18‧‧‧支架 18‧‧‧ bracket

20‧‧‧磁力座 20‧‧‧ Magnetic seat

200‧‧‧導磁殼體 200‧‧‧Magnetic shell

202‧‧‧隔磁元件 202‧‧‧magnetic components

204‧‧‧永久磁鐵 204‧‧‧ permanent magnet

206‧‧‧旋鈕 206‧‧‧ knob

22‧‧‧照明模組 22‧‧‧Lighting module

24‧‧‧機殼 24‧‧‧Chassis

3‧‧‧處理器 3‧‧‧ Processor

30‧‧‧區域設定模組 30‧‧‧Regional setting module

32‧‧‧位移計算模組 32‧‧‧Displacement calculation module

320‧‧‧區域調整模組 320‧‧‧Regional adjustment module

322‧‧‧搜尋模組 322‧‧‧Search Module

324‧‧‧計算模組 324‧‧‧Computation Module

326‧‧‧比對模組 326‧‧‧ Alignment module

328‧‧‧像素位移計算模組 328‧‧‧Pixel Displacement Calculation Module

34‧‧‧校正模組 34‧‧‧ Calibration Module

36‧‧‧檢測模組 36‧‧‧Test module

360‧‧‧差異影像生成模組 360‧‧‧Differential image generation module

362‧‧‧決策模組 362‧‧‧Decision Module

364‧‧‧統計模組 364‧‧‧Statistical Module

38‧‧‧偵測模組 38‧‧‧Detection module

40‧‧‧平移模組 40‧‧‧ translation module

50‧‧‧模具 50‧‧‧Mold

52‧‧‧母模 52‧‧‧Female model

54‧‧‧公模 54‧‧‧Male model

6、6’、6’’‧‧‧檢測影像 6, 6', 6'' ‧ ‧ test images

60‧‧‧檢測區域 60‧‧‧Detection area

62‧‧‧檢測子區域 62‧‧‧Detection subregion

7、7’‧‧‧樣本影像 7, 7'‧‧‧ sample image

70、72‧‧‧樣本區域 70, 72‧‧‧ sample area

S60-S68‧‧‧模具狀態檢測步驟 S60-S68‧‧‧Mold state detection steps

S640-S644‧‧‧區域位移計算步驟 S640-S644‧‧‧Regional displacement calculation steps

S680-S682‧‧‧檢測結果決定步驟 S680-S682‧‧‧ Test results decision steps

圖1為本發明第一實施例之模具狀態檢測裝置架構圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of a mold state detecting device according to a first embodiment of the present invention.

圖2為本發明第一實施例之位移計算模組架構圖。 2 is a structural diagram of a displacement calculation module according to a first embodiment of the present invention.

圖3為本發明第一實施例之檢測模組架構圖。 FIG. 3 is a structural diagram of a detection module according to a first embodiment of the present invention.

圖4為本發明第一實施例之模具狀態檢測裝置外觀示意圖。 Fig. 4 is a perspective view showing the appearance of a mold state detecting device according to a first embodiment of the present invention.

圖5A為本發明第一實施例之磁力座關閉示意圖。 Fig. 5A is a schematic view showing the closing of a magnetic seat according to a first embodiment of the present invention.

圖5B為本發明第一實施例之磁力座開啟示意圖。 FIG. 5B is a schematic view showing the opening of the magnetic seat according to the first embodiment of the present invention.

圖6為本發明第一實施例之模具狀態檢測方法流程圖。 Fig. 6 is a flow chart showing a method of detecting a mold state according to a first embodiment of the present invention.

圖7為本發明第二實施例之模具狀態檢測方法部分流程圖。 Fig. 7 is a partial flow chart showing a method of detecting a mold state according to a second embodiment of the present invention.

圖8為本發明第三實施例之模具狀態檢測方法部分流程圖。 Figure 8 is a partial flow chart showing a method of detecting a mold state according to a third embodiment of the present invention.

圖9為本發明第一實施例之檢測影像示意圖。 FIG. 9 is a schematic diagram of a detected image according to a first embodiment of the present invention.

圖10為本發明第一實施例之樣本影像示意圖。 FIG. 10 is a schematic diagram of a sample image according to a first embodiment of the present invention.

圖11為本發明第一實施例之檢測區域的影像示意圖。 FIG. 11 is a schematic diagram of an image of a detection area according to a first embodiment of the present invention.

圖12為本發明第一實施例之樣本區域的影像示意圖。 Figure 12 is a schematic view showing an image of a sample area according to a first embodiment of the present invention.

圖13為本發明第一實施例之校正後的檢測影像示意圖。 FIG. 13 is a schematic diagram of a corrected detection image according to the first embodiment of the present invention.

茲就本發明之一較佳實施例,配合圖式,詳細說明如後。 DETAILED DESCRIPTION OF THE INVENTION A preferred embodiment of the present invention will be described in detail with reference to the drawings.

首請參閱圖1至圖3,圖1為本發明第一實施例之模具狀態檢測裝置架構圖,圖2為本發明第一實施例之位移計算模組架構圖,圖3為本發明第一實施例之檢測模組架構圖。本發明的模具狀態檢測裝置1(下稱檢測裝置1)主要包括影像擷取模組10、記憶體12及電性連接上述元件的處理器3。 Referring to FIG. 1 to FIG. 3, FIG. 1 is a structural diagram of a mold state detecting device according to a first embodiment of the present invention, and FIG. 2 is a structural diagram of a displacement computing module according to a first embodiment of the present invention, and FIG. 3 is the first embodiment of the present invention. The detection module architecture diagram of the embodiment. The mold state detecting device 1 (hereinafter referred to as the detecting device 1) of the present invention mainly includes an image capturing module 10, a memory 12, and a processor 3 electrically connected to the above components.

影像擷取模組10可擷取模具(如圖4所示之模具50)的檢測影像(如圖9所示之檢測影像6)以供後續檢測。記憶體12儲存有樣本影像7。具體而言,樣本影像7係指在模具50的狀態正常時對公模54所擷取的影像。較佳地,影 像擷取模組10係紅外線相機,並且檢測影像6及樣本影像7係紅外線影像。藉此,所產生的影像不會受環境光的照度變化影響,而可提供亮度穩定的影像。 The image capturing module 10 can capture the detected image of the mold (the mold 50 shown in FIG. 4) (the detected image 6 shown in FIG. 9) for subsequent detection. The memory 12 stores a sample image 7. Specifically, the sample image 7 refers to an image captured by the male mold 54 when the state of the mold 50 is normal. Preferably, the shadow The capture module 10 is an infrared camera, and the detection image 6 and the sample image 7 are infrared images. Thereby, the generated image is not affected by the illuminance change of the ambient light, and the image with stable brightness can be provided.

續請一併參閱圖9至圖13,圖9為本發明第一實施例之檢測影像示意圖,圖10為本發明第一實施例之樣本影像示意圖,圖11為本發明第一實施例之檢測區域的影像示意圖,圖12為本發明第一實施例之樣本區域的影像示意圖,圖13為本發明第一實施例之校正後的檢測影像示意圖,用以示例性說明本發明如何對檢測影像6進行校正。於本例子中,檢測影像6及樣本影像7的影像尺寸皆為8像素×8像素,但檢測影像6及樣本影像7亦可為其他的影像尺寸,如7像素×7像素或10像素×10像素,不加以限定。 Continuing to refer to FIG. 9 to FIG. 13 , FIG. 9 is a schematic diagram of a detection image according to a first embodiment of the present invention, FIG. 10 is a schematic diagram of a sample image according to a first embodiment of the present invention, and FIG. 11 is a detection of the first embodiment of the present invention. FIG. 12 is a schematic diagram of an image of a sample area according to a first embodiment of the present invention, and FIG. 13 is a schematic diagram of a corrected image of the first embodiment of the present invention for illustrating how the present invention detects an image 6 Make corrections. In this example, the image size of the detection image 6 and the sample image 7 are both 8 pixels×8 pixels, but the detection image 6 and the sample image 7 may also be other image sizes, such as 7 pixels×7 pixels or 10 pixels×10. Pixels are not limited.

處理器3用以控制檢測裝置1,主要包括區域設定模組30、位移計算模組32、校正模組34及檢測模組36。 The processor 3 is configured to control the detecting device 1 and mainly includes a region setting module 30, a displacement calculating module 32, a calibration module 34, and a detecting module 36.

區域設定模組30用以於檢測影像6中設定檢測區域60(區域大小以8像素×8像素為例),並於樣本影像7中的相同位置設定相同區域大小的樣本區域70(例如同為6像素×6像素)。 The area setting module 30 is configured to set the detection area 60 in the detection image 6 (the area size is 8 pixels×8 pixels as an example), and set the sample area 70 of the same area size at the same position in the sample image 7 (for example, the same 6 pixels × 6 pixels).

於本發明之另一實施例中,處理器3可進一步包括偵測模組38,連接區域設定模組30。偵測模組38用於偵測模具50是否退模,並於偵測模具50退模後觸發影像擷取模組10擷取檢測影像6。 In another embodiment of the present invention, the processor 3 may further include a detection module 38 and a connection area setting module 30. The detecting module 38 is configured to detect whether the mold 50 is demolded, and trigger the image capturing module 10 to capture the detected image 6 after detecting the mold 50 being demolded.

位移計算模組32連接區域設定模組30,用以依據檢測區域60中的影像及樣本區域70中的影像來計算區域位移值。 The displacement calculation module 32 is connected to the area setting module 30 for calculating the area displacement value according to the image in the detection area 60 and the image in the sample area 70.

較佳地,位移計算模組32更包括區域調整模組320、搜尋模組322及計算模組324。區域調整模組320可縮小樣本區域70(如圖12所示樣本區域72),並於檢測區域60中定義複數檢測子區域62(為明確呈現檢測子區域62的區域大小,圖11僅標示一組檢測子區域62),其中各檢測子區域62係與縮小後的樣本區域72具有相同的區域大小(例如同為4像素×4像素)。 Preferably, the displacement calculation module 32 further includes an area adjustment module 320, a search module 322, and a calculation module 324. The area adjustment module 320 can reduce the sample area 70 (such as the sample area 72 shown in FIG. 12), and define the complex detection sub-area 62 in the detection area 60 (to clearly show the size of the area of the detection sub-area 62, FIG. 11 only indicates one The group detection sub-region 62), wherein each of the detection sub-regions 62 has the same region size as the reduced sample region 72 (for example, is also 4 pixels × 4 pixels).

舉例來說,區域調整模組320可將樣本區域70的四邊皆縮短1像素,而可獲得如圖12所示之縮小後的樣本區域72。並且,區域調整模組320可將檢測區域60定義為複數與縮小後的樣本區域72具有相同區域大小的檢測子區域62,檢測子區域62的數量以9個為例,即第一檢測子區域(包括像素P11-P14、P21-P24、P31-P34、P41-P44的區域)、第二檢測子區域(包括像素P12-P15、P22-P25、P32-P35、P42-P45的區域)、第三檢測子區域(包括像素P13-P16、P23-P26、P33-P36、P43-P46的區域)、第四檢測子區域(包括像素P21-P24、P31-P34、P41-P44、P51-P54的區域)、第五檢測子區域(包括像素P22-P25、P32-P35、P42-P45、P52-P55的區域)、第六檢測子區域(包括像素P23-P26、P33-P36、P43-P46、P53-P56的區域)、第七檢測子區域(包括像素P31-P35、P41-P45、P51-P55、P61-P65的區域)、第八檢測子區域(包括像素P32-P35、P42-P45、P52-P55、P62-P65的區域)、第九檢測子區域(包括像素P33-P36、P43-P46、P53-P56、P63-P66的區域)。 For example, the area adjustment module 320 can shorten the four sides of the sample area 70 by one pixel, and obtain the reduced sample area 72 as shown in FIG. The area adjustment module 320 can define the detection area 60 as a detection sub-area 62 having the same area size as the reduced sample area 72. The number of detection sub-areas 62 is exemplified by nine, that is, the first detection sub-area. (including a region of pixels P 11 -P 14 , P 21 -P 24 , P 31 -P 34 , P 41 -P 44 ), a second detection sub-region (including pixels P 12 -P 15 , P 22 -P 25 , a region of P 32 -P 35 , P 42 -P 45 ), a third detection sub-region (including a region of pixels P 13 -P 16 , P 23 -P 26 , P 33 -P 36 , P 43 -P 46 ), a fourth detection sub-region (a region including pixels P 21 -P 24 , P 31 -P 34 , P 41 -P 44 , P 51 -P 54 ), a fifth detection sub-region (including pixels P 22 -P 25 , P) 32 -P 35 , P 42 -P 45 , P 52 -P 55 area), sixth detection sub-area (including pixels P 23 -P 26 , P 33 -P 36 , P 43 -P 46 , P 53 -P a region of 56 ), a seventh detection sub-region (a region including pixels P 31 -P 35 , P 41 -P 45 , P 51 -P 55 , P 61 -P 65 ), and an eighth detection sub-region (including pixel P 32) -P 35 , P 42 -P 45 , P 52 -P 55 , P 62 -P 65 area), ninth detection sub-area ( A region including pixels P 33 - P 36 , P 43 - P 46 , P 53 - P 56 , P 63 - P 66 ).

搜尋模組322連接區域調整模組320,用以於複數檢測子區域62中搜尋與縮小後的樣本區域72相符的檢測子區域62。較佳地,位移計算模組32更包括比對模組326,連接搜尋模組322,用以比對各檢測子區域62中的影像的複數檢測像素的像素值與縮小後的樣本區域72中的影像的複數樣本像素的像素值是否相符,再產生並發送比對結果至搜尋模組322。 The search module 322 is connected to the area adjustment module 320 for searching for the detection sub-area 62 corresponding to the reduced sample area 72 in the complex detection sub-area 62. Preferably, the displacement calculation module 32 further includes a comparison module 326 connected to the search module 322 for comparing the pixel values of the complex detection pixels of the images in the detection sub-regions 62 with the reduced sample region 72. Whether the pixel values of the plurality of sample pixels of the image match, and then generate and send the comparison result to the search module 322.

較佳地,位移計算模組32係經由比對模組326來分別比對縮小後的樣本區域72中的影像的複數樣本像素與各檢測子區域62中的影像的複數檢測像素,並將影像差異最小的一個檢測子區域62作為前述相符的檢測子區域62。 Preferably, the displacement calculation module 32 compares the complex sample pixels of the image in the reduced sample region 72 with the complex detection pixels of the images in each detection sub-region 62 via the comparison module 326, and images the images. One of the detection sub-regions 62 having the smallest difference serves as the aforementioned detection sub-region 62.

計算模組324連接搜尋模組322,用以計算縮小後的樣本區域72及相符的檢測子區域62(以第九檢測子區域為例)間的區域位移值,其中區域位移值包括水平位移值及垂直位移值。舉例來說,縮小後的樣本區域72與第九檢測子區域間的區域位移值可為(+1,+1),即水平位移值為+1且垂直位移值為+1。 The calculation module 324 is connected to the search module 322 for calculating the regional displacement value between the reduced sample region 72 and the matching detection sub-region 62 (taking the ninth detection sub-region as an example), wherein the regional displacement value includes the horizontal displacement value. And vertical displacement values. For example, the region displacement value between the reduced sample region 72 and the ninth detection sub-region may be (+1, +1), that is, the horizontal displacement value is +1 and the vertical displacement value is +1.

較佳地,位移計算模組32更包括像素位移計算模組328,連接計算模組324,用以計算縮小後的樣本區域72中的影像的複數樣本像素與符合的檢測子區域72中的影像的複數檢測像素間的複數像素位移值,並傳送至計算模組324以使計算模組324依據複數像素位移值計算區域位移值。舉例來說,位移計算模組32可依據像素P33及S22算出第一像素位移值(+1,+1),依據像素P34及S23算出第二像素位移值(+1,+1),依據像素P35及S24算出第三像素位移值(+1,+1)、依據像素P36及S25算出第四像素位移值(+1,+1)...以此類推,並傳送所算出的16組像素位移值至計算模組324。接著,計算模組324將所收到的16組像素位移值進行平均運算,以獲得區域位移值(+1,+1)。雖於本例子中係採用平均運算來計算區域位移值為例,但不以此限定。於本發明的另一實施例中,計算模組324係採用其他運算方法(如加權運算、先過濾極值後再進行平均運算或中間值運算)。 Preferably, the displacement calculation module 32 further includes a pixel displacement calculation module 328 coupled to the calculation module 324 for calculating the image of the complex sample pixels of the image in the reduced sample region 72 and the corresponding detection sub-region 72. The complex number detects the complex pixel displacement values between the pixels and passes to the calculation module 324 to cause the calculation module 324 to calculate the region displacement values based on the complex pixel displacement values. For example, the displacement calculation module 32 can calculate the first pixel displacement value (+1, +1) according to the pixels P 33 and S 22 , and calculate the second pixel displacement value ( +1, +1 according to the pixels P 34 and S 23 ). Calculating a third pixel displacement value (+1, +1) according to the pixels P 35 and S 24, calculating a fourth pixel displacement value (+1, +1) according to the pixels P 36 and S 25 , and so on, The calculated 16 sets of pixel displacement values are transmitted to the calculation module 324. Next, the calculation module 324 averages the received 16 sets of pixel displacement values to obtain a region displacement value (+1, +1). Although the average calculation is used in this example to calculate the regional displacement value, it is not limited thereto. In another embodiment of the present invention, the computing module 324 employs other computing methods (such as weighting operations, filtering the extreme values before performing the averaging operation or the intermediate value operation).

校正模組34連接位移計算模組32,用以依據所計算出的區域位移值來校正檢測影像6。較佳地,處理器3更包括連接校正模組34的平移模組40,用以依據區域位移值來平移檢測影像6。舉例來說,如圖13所示,若區域位移值為(+1,+1),則平移模組40可將檢測影像6的所有像素朝水平正向(以向右為例)移動1像素,並朝垂直正向(以向下為例)移動1像素,以獲得校正後的檢測影像6’(如圖13所示)。 The correction module 34 is connected to the displacement calculation module 32 for correcting the detection image 6 according to the calculated region displacement value. Preferably, the processor 3 further includes a translation module 40 connected to the correction module 34 for panning and detecting the image 6 according to the regional displacement value. For example, as shown in FIG. 13, if the area displacement value is (+1, +1), the panning module 40 can move all the pixels of the detected image 6 to the horizontal forward direction (for example, to the right) by 1 pixel. And move 1 pixel toward the vertical direction (for example, downward) to obtain the corrected detection image 6' (as shown in FIG. 13).

檢測模組36連接校正模組34,用以依據樣本影像7及校正後的檢測影像6’來決定檢測結果。具體而言,檢測模組36可先對樣本影像7及校正後的檢測影像6’分別進行檢測前處理(如高通濾波處理、裁切處理或亮度調整處理),再將處理後的影像進行比對以提高檢測準確度。 The detection module 36 is connected to the calibration module 34 for determining the detection result based on the sample image 7 and the corrected detection image 6'. Specifically, the detection module 36 may perform pre-detection processing (such as high-pass filtering processing, cropping processing, or brightness adjustment processing) on the sample image 7 and the corrected detection image 6′, respectively, and then compare the processed images. To improve the accuracy of detection.

以裁切處理為例,檢測模組36可依據區域位移值來計算裁切值(如水平位移值及垂直位移值中的最大值)或直接取得預設的裁切值(如1像 素),並依據裁切值裁切校正後的檢測影像6’及樣本影像7(如裁切掉外圍1像素的影像),以分別獲得處理後的檢測影像6’’及處理後的樣本影像7’,其中處理後的檢測影像6’’及處理後的樣本影像7’具有相同影像尺寸。 Taking the cutting process as an example, the detecting module 36 can calculate the cutting value (such as the maximum value of the horizontal displacement value and the vertical displacement value) according to the regional displacement value or directly obtain the preset cutting value (such as 1 image). And according to the cutting value, the corrected detection image 6' and the sample image 7 (for example, cutting out the outer 1 pixel image) are respectively cut to obtain the processed detection image 6'' and the processed sample image respectively. 7', wherein the processed detection image 6'' and the processed sample image 7' have the same image size.

值得一提的是,本發明對檢測影像6進行裁切處理主要是為了提供用以進行前述平移的平移空間。具體而言,若裁切處理係裁切掉外圍1像素的影像,則檢測影像6最多可朝上或下平移1像素,及/或朝左或右平移1像素,若裁切處理係裁切掉外圍2像素的影像,則檢測影像6最多可朝上或下平移2像素,及/或朝左或右平移2像素...以此類推。 It is worth mentioning that the cutting process of the detection image 6 of the present invention is mainly for providing a translation space for performing the aforementioned translation. Specifically, if the cropping process cuts out the image of the outer 1 pixel, the detected image 6 can be shifted by up to 1 pixel up or down, and/or 1 pixel to the left or right, if the cropping process is cropped. When the image of the outer 2 pixels is removed, the detected image 6 can be shifted up to 2 pixels up or down, and/or 2 pixels to the left or right, and so on.

於本發明之另一實施例中,檢測模組36包括差異影像生成模組360及決策模組362。差異影像生成模組360用以將處理後的樣本影像7’與處理後的檢測影像6’’進行相減以獲得差異影像。決策模組362連接差異影像生成模組360,用以依據差異影像決定檢測結果。 In another embodiment of the present invention, the detection module 36 includes a difference image generation module 360 and a decision module 362. The difference image generation module 360 is configured to subtract the processed sample image 7' from the processed detected image 6'' to obtain a difference image. The decision module 362 is connected to the difference image generation module 360 for determining the detection result according to the difference image.

較佳地,檢測模組36更包括連接決策模組362的統計模組364。統計模組364用以統計差異影像中像素值大於預設的臨界像素值的像素數量,並將統計出的像素數量傳送至決策模組362。接著,決策模組362判斷像素數量是否大於臨界數量,若是,則判定檢測結果為異常,否則判定檢測結果為正常。 Preferably, the detection module 36 further includes a statistics module 364 connected to the decision module 362. The statistics module 364 is configured to count the number of pixels in the difference image whose pixel value is greater than the preset threshold pixel value, and transmit the counted number of pixels to the decision module 362. Next, the decision module 362 determines whether the number of pixels is greater than a critical quantity, and if so, determines that the detection result is abnormal, otherwise the determination detection result is normal.

於本發明之另一實施例中,檢測裝置1更包括電性連接處理器3的輸出模組14(如顯示器、揚聲器或印表機),用以輸出檢測結果。 In another embodiment of the present invention, the detecting device 1 further includes an output module 14 (such as a display, a speaker or a printer) electrically connected to the processor 3 for outputting the detection result.

於本發明之另一實施例中,檢測裝置1更包括電性連接處理器3的警示模組16(如蜂鳴器、警報器或警示燈),用以發出警示。具體而言,處理器3於判定檢測結果為異常時,可控制警示模組16發出警示。 In another embodiment of the present invention, the detecting device 1 further includes an alert module 16 (such as a buzzer, an alarm or a warning light) electrically connected to the processor 3 for issuing an alert. Specifically, when the processor 3 determines that the detection result is abnormal, the processor 3 can control the warning module 16 to issue an alert.

續請一併參閱圖4,為本發明第一實施例之模具狀態檢測裝置外觀示意圖。於本實施例中,模具50包括可移動的公模54及固定式的母模52。並且,處理器3、記憶體12、輸出模組14及警示模組16係設置於機殼24中。影像擷 取模組10經由支架18固定於母模52上,以對公模54進行取像。檢測裝置1更包括用以照明公模54的照明模組22(如紅外線燈)。 Continuing to refer to FIG. 4, it is a schematic view of the appearance of a mold state detecting device according to a first embodiment of the present invention. In the present embodiment, the mold 50 includes a movable male mold 54 and a stationary female mold 52. Moreover, the processor 3, the memory 12, the output module 14, and the warning module 16 are disposed in the casing 24. Image撷 The module 10 is fixed to the master mold 52 via the bracket 18 to image the male mold 54. The detecting device 1 further includes a lighting module 22 (such as an infrared lamp) for illuminating the male mold 54.

較佳地,支架18更包括至少一磁力座20。磁力座20可經由磁力來吸附於模具50的導磁外殼(如鐵製殼體)上。 Preferably, the bracket 18 further includes at least one magnetic seat 20. The magnetic seat 20 can be attracted to the magnetically conductive outer casing (such as an iron casing) of the mold 50 via a magnetic force.

續請一併參閱圖5A及圖5B,圖5A為本發明第一實施例之磁力座關閉示意圖,圖5B為本發明第一實施例之磁力座開啟示意圖。 Continuing to refer to FIG. 5A and FIG. 5B, FIG. 5A is a schematic view showing the magnetic seat closing according to the first embodiment of the present invention, and FIG. 5B is a schematic view showing the opening of the magnetic seat according to the first embodiment of the present invention.

磁力座20包括一導磁殼體200(如鋼製殼體)、設置於導磁殼體200中的至少一隔磁元件202(如銅製元件)、可動地設置於導磁殼體200中的永久磁鐵204及連動永久磁鐵204的旋鈕206。 The magnetic base 20 includes a magnetic conductive housing 200 (such as a steel housing), at least one magnetic isolation component 202 (such as a copper component) disposed in the magnetic conductive housing 200, and is movably disposed in the magnetic conductive housing 200. The permanent magnet 204 and the knob 206 of the permanent magnet 204 are linked.

如圖5A所示,當旋鈕206被轉動至特定角度時,可使永久磁鐵204轉動至關閉位置,即永久磁鐵204的兩極皆位於臨近隔磁元件202的位置。由於磁力線具有從N極沿最短路徑至S極的特性,此時的永久磁鐵204的兩極會於導磁殼體200內部形成封閉的磁力線,而無法吸附於外部導磁物(即模具50的導磁外殼)。 As shown in FIG. 5A, when the knob 206 is rotated to a specific angle, the permanent magnet 204 can be rotated to the closed position, that is, both poles of the permanent magnet 204 are located adjacent to the magnetic isolation element 202. Since the magnetic lines of force have the characteristics of the shortest path from the N pole to the S pole, the two poles of the permanent magnet 204 at this time form a closed magnetic line of force inside the magnetic conductive housing 200, and cannot be adsorbed to the external magnetic conductor (ie, the guide of the mold 50). Magnetic enclosure).

如圖5B所示,當旋鈕206被轉動至另一角度時,可使永久磁鐵204轉動至開啟位置,即隔磁元件202臨近永久磁鐵204兩極交界的位置。此時的永久磁鐵204由於磁力線的最短路徑被隔磁元件202遮蔽,無法於導磁殼體200內部形成封閉的磁力線,將轉為經由導磁殼體200及外部導磁物形成開放磁力線。由於導磁殼體200及外部導磁物皆位於磁力線路徑上,因此,導磁殼體200可吸附於外部導磁物上。 As shown in FIG. 5B, when the knob 206 is rotated to another angle, the permanent magnet 204 can be rotated to the open position, that is, the magnetic isolation element 202 is adjacent to the position where the two ends of the permanent magnet 204 meet. At this time, the permanent magnet 204 is shielded by the magnetic isolation element 202 due to the shortest path of the magnetic lines of force, and a closed magnetic line of force cannot be formed inside the magnetic conductive case 200, and the open magnetic line of force is formed by the magnetic conductive case 200 and the external magnetic conductive material. Since the magnetic conductive housing 200 and the external magnetic conductor are located on the magnetic flux path, the magnetic conductive housing 200 can be adsorbed on the external magnetic conductor.

值得一提的是,前述區域設定模組30、位移計算模組32、校正模組34、檢測模組36、偵測模組38、平移模組40、區域調整模組320、搜尋模組322、計算模組324、比對模組326、像素位移計算模組328、差異影像生成模組360、決策模組362及統計模組364可經由硬體模組方式實現(如電子電路或已燒錄數 位電路的積體電路),亦可經由軟體模組方式實現(如程式(program)或應用程式介面(Application Programming Interface,API)),但不以此為限。當前述模組係經由軟體模組方式實現時,前述各模組間的連接係指程式間的鏈結(link)。 It is worth mentioning that the foregoing area setting module 30, the displacement calculating module 32, the correcting module 34, the detecting module 36, the detecting module 38, the panning module 40, the area adjusting module 320, and the searching module 322 The calculation module 324, the comparison module 326, the pixel displacement calculation module 328, the difference image generation module 360, the decision module 362, and the statistics module 364 can be implemented by using a hardware module (such as an electronic circuit or burned). Record The integrated circuit of the bit circuit can also be implemented by a software module (such as a program or an Application Programming Interface (API)), but not limited thereto. When the aforementioned modules are implemented via a software module, the connection between the above modules refers to a link between programs.

當前述模組係經由軟體模組方式實現時,記憶體12可進一步儲存電腦程式,電腦程式記錄有用於實現前述各模組的程式碼或機械碼(machine code)。處理器3執行電腦程式的程式碼或機械碼後,可實現各模組的功能。 When the module is implemented by a software module, the memory 12 can further store a computer program, and the computer program records a code or a machine code for implementing the foregoing modules. After the processor 3 executes the program code or mechanical code of the computer program, the functions of each module can be realized.

續請一併參閱圖6,為本發明第一實施例之模具狀態檢測方法流程圖。具體而言,檢測裝置1的處理器3執行前述電腦程式後,可執行本發明各實施例的模具狀態檢測方法(下稱檢測方法),並且檢測方法包括下列步驟。 Continuing to refer to FIG. 6, a flow chart of a mold state detecting method according to a first embodiment of the present invention is shown. Specifically, after the processor 3 of the detecting device 1 executes the aforementioned computer program, the mold state detecting method (hereinafter referred to as a detecting method) of each embodiment of the present invention can be performed, and the detecting method includes the following steps.

步驟S60:檢測裝置1經由影像擷取模組10擷取公模54的檢測影像6,並於檢測影像6中設定檢測區域60。較佳地,檢測裝置1係於偵測模具50退模完成後,才擷取檢測影像6。 Step S60: The detecting device 1 captures the detected image 6 of the male mold 54 via the image capturing module 10, and sets the detection area 60 in the detected image 6. Preferably, the detecting device 1 captures the detected image 6 after the detecting mold 50 is demolded.

步驟S62:檢測裝置1自記憶體12讀取樣本影像7,並於樣本影像7中的相同位置設定樣本區域70,其中樣本區域70與檢測區域60具有相同的區域大小。 Step S62: The detecting device 1 reads the sample image 7 from the memory 12, and sets the sample region 70 at the same position in the sample image 7, wherein the sample region 70 and the detecting region 60 have the same region size.

步驟S64:檢測裝置1依據檢測區域60中的影像及樣本區域70中的影像計算區域位移值。 Step S64: The detecting device 1 calculates the region displacement value according to the image in the detection region 60 and the image in the sample region 70.

步驟S66:檢測裝置1依據所計算出的區域位移值來校正檢測影像6,以獲得校正後的檢測影像6’。較佳地,檢測裝置係依據區域位移值來平移檢測影像6,以獲得校正後的檢測影像6’。 Step S66: The detecting means 1 corrects the detected image 6 based on the calculated area shift value to obtain the corrected detected image 6'. Preferably, the detecting means pans the detected image 6 in accordance with the area shift value to obtain the corrected detected image 6'.

步驟S68:檢測裝置1依據樣本影像7及校正後的檢測影像6’來決定檢測結果。較佳地,檢測裝置1係先對樣本影像7及校正後的檢測影像6’進行檢測前處理,以獲得處理後的樣本影像7’及處理後的檢測影像6’’,再依據 處理獲得的影像來決定檢測結果。較佳地,於決定檢測結果後,檢測裝置1可進一步經由輸出模組14輸出檢測結果。 Step S68: The detecting device 1 determines the detection result based on the sample image 7 and the corrected detected image 6'. Preferably, the detecting device 1 performs pre-detection processing on the sample image 7 and the corrected detected image 6' to obtain the processed sample image 7' and the processed detected image 6'', and then The obtained image is processed to determine the detection result. Preferably, after determining the detection result, the detecting device 1 can further output the detection result via the output module 14.

續請一併參閱圖7,為本發明第二實施例之模具狀態檢測方法部分流程圖。本實施例之檢測方法與第一實施例之檢測方法差異在於本實施例之檢測方法之步驟S64更包括下列步驟。 Continuing to refer to FIG. 7, a partial flow chart of a mold state detecting method according to a second embodiment of the present invention is shown. The detection method of the embodiment differs from the detection method of the first embodiment in that the step S64 of the detection method of the embodiment further includes the following steps.

步驟S640:檢測裝置1縮小樣本影像7中的樣本區域70,以獲得縮小後的樣本區域72。 Step S640: The detecting device 1 reduces the sample region 70 in the sample image 7 to obtain the reduced sample region 72.

步驟S642:檢測裝置1於檢測區域60中定義複數檢測子區域62,並於複數檢測子區域62中搜尋所包括影像與縮小後的樣本區域72的影像相符的檢測子區域62,其中各檢測子區域62係與縮小後的樣本區域72具有相同的區域大小。 Step S642: The detecting device 1 defines a complex detecting sub-region 62 in the detecting region 60, and searches the complex detecting sub-region 62 for the detecting sub-region 62 in which the included image matches the image of the reduced sample region 72, wherein each detector The region 62 has the same region size as the reduced sample region 72.

較佳地,檢測裝置1係於任一檢測子區域62中的影像的複數檢測像素的像素值與縮小後的樣本區域72中的影像的複數樣本像素的像素值相符時,才判定檢測子區域62與縮小後的樣本區域72相符。 Preferably, the detection device 1 determines the detection sub-region when the pixel value of the complex detection pixel of the image in any of the detection sub-regions 62 matches the pixel value of the complex sample pixel of the image in the reduced sample region 72. 62 coincides with the reduced sample area 72.

較佳地,檢測裝置1係分別比對縮小後的樣本區域72中的影像的複數樣本像素與各檢測子區域62中的影像的複數檢測像素,並將影像差異最小的一組檢測子區域62作為前述相符的檢測子區域62。 Preferably, the detecting device 1 compares the complex sample pixels of the image in the reduced sample region 72 with the complex detection pixels of the image in each of the detection sub-regions 62, and minimizes the image difference between the plurality of detection sub-regions 62. As the aforementioned matching sub-region 62.

步驟S644:檢測裝置1計算樣本區域72及相符的檢測子區域62間的區域位移值。 Step S644: The detecting device 1 calculates the region displacement value between the sample region 72 and the matching detection sub-region 62.

較佳地,檢測裝置1係分別計算樣本區域72中的影像的複數樣本像素與相符的檢測子區域62中的影像的複數檢測像素間的複數像素位移值,並依據複數像素位移值來計算一組區域位移值。 Preferably, the detecting device 1 calculates a complex pixel displacement value between the complex sample pixel of the image in the sample region 72 and the complex detection pixel of the image in the matching detection sub-region 62, and calculates a value according to the complex pixel displacement value. Group area displacement value.

圖8為本發明第三實施例之模具狀態檢測方法部分流程圖。本實施例之檢測方法與第一實施例之檢測方法差異在於本實施例之檢測方法之步驟S68更包括下列步驟。 Figure 8 is a partial flow chart showing a method of detecting a mold state according to a third embodiment of the present invention. The detection method of the embodiment differs from the detection method of the first embodiment in that the step S68 of the detection method of the embodiment further includes the following steps.

步驟S680:檢測裝置1將樣本影像7’及檢測影像6’’相減以獲得差異影像。 Step S680: The detecting device 1 subtracts the sample image 7' and the detected image 6'' to obtain a difference image.

較佳地,檢測裝置1係先對樣本影像7’及檢測影像6’分別進行檢測前處理(如高通濾波處理、裁切處理或亮度調整處理),以分別獲得處理後的樣本影像7’及處理後的檢測影像6’’,再將處理後的影像相減,或施以其他比較方法以獲得差異影像。 Preferably, the detecting device 1 performs pre-detection processing (such as high-pass filtering processing, cropping processing, or brightness adjustment processing) on the sample image 7' and the detected image 6', respectively, to obtain the processed sample image 7' and After processing the detected image 6'', the processed image is subtracted, or other comparison methods are applied to obtain the difference image.

步驟S682:檢測裝置1依據差異影像來決定檢測結果。較佳地,檢測裝置1係統計差異影像中像素值大於臨界像素值的像素數量。若檢測裝置1判斷像素數量大於臨界數量時,判定檢測結果為異常,並可進一步經由警示模組16發出警示,否則,判定檢測結果為正常。 Step S682: The detecting device 1 determines the detection result according to the difference image. Preferably, the detecting device 1 systematically counts the number of pixels in the difference image whose pixel value is greater than the critical pixel value. If the detecting device 1 determines that the number of pixels is greater than the critical number, it determines that the detection result is abnormal, and may further issue an alert via the warning module 16, otherwise, the determination result is normal.

本發明經由對檢測影像進行校正,可有效提升模具狀態檢測的準確率。 The invention can effectively improve the accuracy of the mold state detection by correcting the detected image.

以上所述僅為本發明之較佳具體實例,非因此即侷限本發明之專利範圍,故舉凡運用本發明內容所為之等效變化,均同理皆包含於本發明之範圍內,合予陳明。 The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent changes to the scope of the present invention are included in the scope of the present invention. Bright.

S60-S68‧‧‧模具狀態檢測步驟 S60-S68‧‧‧Mold state detection steps

Claims (9)

一種模具狀態檢測方法,包括下列步驟:a)擷取一模具的一檢測影像,並於該檢測影像中設定一檢測區域;b)取得該模具的一樣本影像,並於該樣本影像中的相同位置設定一樣本區域,其中該樣本區域與該檢測區域具有相同區域大小;c)依據該檢測區域中的影像及該樣本區域中的影像計算一區域位移值;d)依據該區域位移值平移該檢測影像;及e)依據該樣本影像及平移後的該檢測影像來決定一檢測結果。 A mold state detecting method comprises the steps of: a) capturing a detection image of a mold, and setting a detection area in the detection image; b) obtaining the same image of the mold, and the same in the sample image The position is set to be the same area, wherein the sample area has the same area size as the detection area; c) calculating an area displacement value according to the image in the detection area and the image in the sample area; d) shifting the displacement value according to the area displacement value Detecting an image; and e) determining a detection result based on the sample image and the translated image after translation. 如請求項1所述之模具狀態檢測方法,其中該步驟a係於該模具退模後擷取該檢測影像。 The mold state detecting method according to claim 1, wherein the step a is: taking the detection image after the mold is demolded. 如請求項1所述之模具狀態檢測方法,其中該步驟c包括下列步驟:c1)縮小該樣本區域;c2)搜尋所包括的影像與該樣本區域的影像相符的一檢測子區域,其中該檢測區域具有複數該檢測子區域,並且各該檢測子區域係與縮小後的該樣本區域具有相同區域大小;及c3)計算該樣本區域及相符的該檢測子區域間的該區域位移值。 The method of detecting a mold state according to claim 1, wherein the step c comprises the steps of: c1) reducing the sample area; c2) searching for a detection sub-area in which the image included includes an image of the sample area, wherein the detecting The area has a plurality of the detection sub-areas, and each of the detection sub-areas has the same area size as the reduced sample area; and c3) calculating the area displacement value between the sample area and the corresponding detection sub-area. 如請求項3所述之模具狀態檢測方法,其中該步驟c2係於任一該檢測子區域中的影像的複數檢測像素的像素值與該樣本區域中的影像的複數樣本像素的像素值相符時,判定該檢測子區域的影像與該樣本區域的影像相符。 The method of detecting a mold state according to claim 3, wherein the step c2 is when the pixel value of the complex detection pixel of the image in any of the detection sub-regions matches the pixel value of the plurality of sample pixels of the image in the sample region. And determining that the image of the detection sub-area matches the image of the sample area. 如請求項3所述之模具狀態檢測方法,其中該步驟c3係分別計算該樣本區域的影像的複數樣本像素與該檢測子區域中的影像的複數檢測像素間的複數像素位移值,並依據該些像素位移值計算該區域位移值。 The method of detecting a mold state according to claim 3, wherein the step c3 is respectively calculating a complex pixel displacement value between a complex sample pixel of the image of the sample region and a complex detection pixel of the image in the detection subregion, and according to the These pixel displacement values calculate the displacement value of the region. 如請求項1所述之模具狀態檢測方法,其中該步驟e包括下列步驟: e1)將該樣本影像及該檢測影像相減以獲得一差異影像;e2)依據該差異影像決定該檢測結果。 The mold state detecting method according to claim 1, wherein the step e comprises the following steps: E1) subtracting the sample image from the detected image to obtain a difference image; e2) determining the detection result according to the difference image. 如請求項6所述之模具狀態檢測方法,其中該步驟e2係統計該差異影像中像素值大於一臨界像素值的一像素數量,並於該像素數量大於一臨界數量時,判定該檢測結果為異常。 The method of detecting a mold state according to claim 6, wherein the step e2 calculates a number of pixels in the difference image whose pixel value is greater than a critical pixel value, and determines that the detection result is when the number of pixels is greater than a critical number. abnormal. 如請求項1所述之模具狀態檢測方法,其中該檢測影像及該樣本影像係紅外線影像。 The mold state detecting method according to claim 1, wherein the detection image and the sample image are infrared images. 如請求項1所述之模具狀態檢測方法,其中該區域位移值包括一水平位移值及一垂直位移值。 The mold state detecting method of claim 1, wherein the region displacement value comprises a horizontal displacement value and a vertical displacement value.
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TW200844426A (en) * 2007-05-04 2008-11-16 Univ Nat Formosa On-line mechanical visional inspection system of an object and method thereof
TW201539149A (en) * 2014-02-20 2015-10-16 克萊譚克公司 Signal response metrology for image based overlay measurements

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200844426A (en) * 2007-05-04 2008-11-16 Univ Nat Formosa On-line mechanical visional inspection system of an object and method thereof
TW201539149A (en) * 2014-02-20 2015-10-16 克萊譚克公司 Signal response metrology for image based overlay measurements

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