TWI576695B - Method for monitoring hardware - Google Patents

Description

Hardware monitoring method

The invention relates to a monitoring method, in particular to a hardware monitoring method of a server.

In computer systems, hardware monitoring modules (such as hardware monitors; HW Monitor) monitor the temperature, voltage, and fan speed of the computer system hardware. The server acts as an application branch of the computer, and the hardware monitoring function of the motherboard is usually implemented by a Baseboard Management Controller (BMC) chip.

However, in the server production development process, in order to meet the different needs of users, manufacturers often develop servers into high-end, low-end and other versions, and the differences between these configurations are mainly in hardware monitoring functions and hardware monitoring. There are big differences in costs and so on.

At present, in the low-end server, there are generally the following schemes for hardware monitoring: (1) The dedicated substrate management controller chip is used, and the use cost is high. (2) Micro Control Unit (MCU), such as Hardware Monitor (HW Monitor), can monitor memory, Central Process Unit (CPU), platform path controller ( Platform Controller Hub; PCH) and the temperature of the thermal sensor; this solution often requires a compatible system management bus (System Management Bus; SMBUS), integrated circuit bus (Inter-Integrated Circuit; I2C) And a variety of agreements such as the Platform Environmental Control Interface (PECI), the development cycle is long.

(3) Using a dedicated embedded controller (EC), although the system management bus, the integrated circuit bus and the platform environment control interface can be integrated, but some functions are redundant and the cost is still Higher.

(4) With low-cost hardware monitoring, the number of monitoring points of the temperature sensor often cannot meet the requirements of the server; in addition, low-cost hardware monitoring cannot set independent temperature compensation values for each temperature sensor. This makes the temperature difference in different areas too large, and can not reflect its reasonable weight when the fan is controlled. For example, the temperature of the memory area is generally 60 to 75 ° C, the fan acceleration window is set to be greater than 65 ° C, and the IO area (input / output area) is generally 50 to 65 ° C, and the fan acceleration window is set to be greater than 55 ° C. If 10°C temperature compensation cannot be added to the IO area, then in the same Pulse Width Modulation (PWM) control, it will always dominate the higher temperature area, ignoring the low temperature warning window. Sensor data.

Therefore, for low-end servers, it is necessary to develop a new type of hardware monitoring system to solve the problem of weight mismatch of fan control.

The object of the present invention is to provide a hardware monitoring method, which is mainly a low-end server, and can realize hardware heat-dissipation monitoring without the BMC chip, and can compensate temperature in different temperature regions. In order to solve the problem of weight mismatch of the fan control, the heat dissipation effect of the low-end server is improved.

The present invention solves the problems of the prior art, and the necessary technical means is to provide a hardware monitoring method, which is suitable for monitoring a computer system, comprising: sensing a first temperature region through a first temperature sensor. a first temperature value, and sensing a second temperature value of a second temperature region through a second temperature sensor; reading the second temperature value through a complex programmable logic device, and then complex programmable logic device Temperature compensation is performed on the second temperature value; then, the first temperature value and the second temperature value after the temperature compensation are read by a hardware monitor, and the hardware monitor is second according to the first temperature value and the temperature compensation The temperature value controls the heat dissipation of the computer system.

An auxiliary technical means derived from the above-mentioned necessary technical means for the hardware monitoring method further comprises: electrically connecting the complex programmable logic device to an expandable component, and the expandable component connection is extended with a third temperature sensor, through the third The temperature sensor senses a third temperature value of a third temperature region; the complex programmable logic device reads the third temperature value from the expandable component and performs temperature compensation on the third temperature value; comparing the complex programmable logic device The third temperature value after temperature compensation and the magnitude of the second temperature value, and one of the temperature maximum values is fed back to the hardware monitor; the hardware monitor controls the heat dissipation of the computer system according to a maximum temperature value and a first temperature value.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the hardware monitoring method further comprises: expanding the expandable component to extend the third temperature sensors, and sensing the third temperature region through the third temperature sensors The third temperature value, at this time, the complex programmable logic device reads the third temperature values and performs temperature compensation for each third temperature value; after that, the complex programmable logic device compares the second temperature after the temperature compensation The value and the magnitude of the third temperature values after temperature compensation, and one of the temperature maxima is obtained for reading by the hardware monitor.

An auxiliary technical means derived from the above-mentioned necessary technical means, after reading the second temperature value and the third temperature value, further comprising: the complex programmable logic device storing the second temperature value and the third temperature value in a storage unit The complex programmable logic device searches for a first offset corresponding to the second temperature value from the storage unit, and compensates the second temperature value according to the first offset temperature to generate a fourth temperature value; The program logic device searches a storage unit for a second offset corresponding to the third temperature value, and compensates the third temperature value according to the second offset temperature to generate a fifth temperature value; comparing the complex programmable logic devices The fourth temperature value and the fifth temperature value are obtained to obtain one of the temperature maximum values for reading by the hardware monitor.

An auxiliary technical means derived from the above-mentioned necessary technical means is to set at least one third temperature sensor in an IO area to sense at least one third temperature value of the IO area; and, to add another third temperature sense The detector is disposed in an area where the expandable component is located to sense a third temperature value of the expandable component; at this time, the temperature compensation step of the third temperature value includes: the complex programmable logic device searches for a third from the storage unit An offset, and a third temperature value of the scalable component is compensated according to a third offset temperature; the complex programmable logic device searches the memory unit for at least a fourth offset and according to the at least one fourth offset The quantity temperature compensates for at least one third temperature value of the IO region; wherein the second offset includes a third offset and a fourth offset.

An auxiliary technical means derived from the above-mentioned necessary technical means is to set a second temperature sensor in an area where the platform path controller is located to sense a second temperature value of the platform path controller; The programmable logic device searches the storage unit for a first offset corresponding to the platform path controller, and compensates the second temperature value according to the first offset temperature.

An auxiliary technical means derived from the above-mentioned necessary technical means is to electrically connect the platform path controller to the complex programmable logic device to set at least one offset in the storage unit through the platform path controller.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the computer system comprises a fan module, and the hardware monitor accesses a fan tachometer and controls the fan of the fan module according to a maximum temperature value and a first temperature value. Speed is used for heat dissipation.

An auxiliary technical means derived from the above-mentioned necessary technical means is to initialize a hardware monitor and a complex programmable logic device through a platform path controller.

One of the subsidiary technical means derived from the above-mentioned necessary technical means is that the computer system is a server.

An auxiliary technical means derived from the above-mentioned necessary technical means is that when the operating parameter of the server exceeds a preset value, the hardware monitor sends an early warning signal to the complex programmable logic device, and the complex programmable logic device terminates according to the warning signal. Data reading.

The present invention solves the problems of the prior art, and the necessary technical means for providing a hardware monitoring system for a computer system includes: a hardware monitor having a first temperature sensor, the first temperature The sensor is configured to sense a first temperature value of a first temperature region. A complex programmable logic device electrically connected to the hardware monitor, wherein the complex programmable logic device has a second temperature sensor, and the second temperature sensor is configured to sense a second temperature value of the second temperature region . Wherein, the complex programmable logic device is configured to read the second temperature value and perform temperature compensation on the second temperature value; the hardware monitor is configured to read the first temperature value and the second temperature value after the temperature compensation, and according to the A temperature value and a second temperature value after temperature compensation control the heat dissipation of the computer system.

An auxiliary technical means derived from the above-mentioned necessary technical means is a flexible programmable logic device electrically connected to an expandable component, the expandable component connection is extended with a third temperature sensor, and the third temperature sensor is used for sensing a first A third temperature value of the three temperature zones.

Wherein, the complex programmable logic device reads the third temperature value from the expandable component and performs temperature compensation on the third temperature value; the complex programmable logic device compares the temperature compensated third temperature value and the second temperature value, And one of the maximum temperature values is fed back to the hardware monitor; the hardware monitor controls the heat dissipation of the computer system according to a maximum temperature value and a first temperature value.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the complex programmable logic device further has: a first integrated circuit bus bar connection port electrically connected to the expandable component for connecting through the first integrated circuit bus bar connection埠 reading a third temperature value; a second integrated circuit bus bar connection port, electrically connected to the second temperature sensor for reading the second temperature value through the second integrated circuit bus bar connection; A system management bus, electrically connected to the hardware monitor, is used to provide a maximum temperature to the hardware monitor through the first system management bus.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the complex programmable logic device further has a storage unit for storing the read second temperature value and the third temperature value through the storage unit; and the storage unit stores a first The offset and a second offset, the complex programmable logic device compensates the second temperature value according to the first offset temperature, and compensates the third temperature value according to the second offset temperature.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the complex programmable logic device further has: a second system management bus bar connection, electrically connected to a platform path controller for managing the bus bar connection through the second system埠 Set at least one offset in the memory unit.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the third temperature region comprises: an IO region and an area where the expandable component is located; the second temperature region includes: a region where the platform path controller is located; the first temperature region includes At least one of the following areas: a region where the CPU is located, a memory region, a region where a hardware monitor is located, and an area where the thermal diode is located.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the computer system includes a fan module, the hardware monitor further has a storage module, and the storage module stores a fan tachometer; the hardware monitor accesses the fan speed through The table heats the fan of the fan module according to a maximum temperature value and a first temperature value.

The auxiliary technical means derived from the above-mentioned necessary technical means is that the hardware monitor also has: a platform environment type control port, electrically connected to the first temperature sensor; and a third system management bus bar connection port, electrical Connecting a complex programmable logic device; a fourth system management bus bar connection, electrically connected to a platform path controller for managing the bus bar connection through the fourth system to initialize the hardware monitor.

Based on the above hardware monitoring system, the present invention provides a server including any of the above hardware monitoring systems.

Compared with the prior art, the server, the hardware monitoring system and the hardware monitoring method provided by the present invention have the following beneficial effects: First, the technical solution of the present invention combines a hardware monitor with a complex programmable logic device, and transmits more The temperature sensor senses the temperature values in different temperature zones and reads and corrects the corresponding temperature values through the complex programmable logic device, thus realizing the temperature compensation of different temperature sensors, and solving the problem that the existing computer system cannot be separated. The problem of temperature compensation for temperature values in different temperature zones.

Secondly, since the complex programmable logic device can independently compensate the temperature sensed by the corresponding temperature sensor, the temperature difference between different temperature regions is reduced, so that the weight of the temperature control can be balanced during the heat dissipation control, and better The cooling computer system improves the heat dissipation of the computer system.

Thirdly, the technical solution of the present invention electrically connects the complex programmable logic device to the expandable component, and the expandable component is expandably connected to one or more third temperature sensors, so that the temperature value of more temperature regions can be monitored, and the complexity is complicated. The programmable logic device can separately compensate the temperature value sensed by each of the third temperature sensors, thereby improving the range of temperature monitoring on the one hand and multi-channel temperature in the case of more monitoring ranges on the other hand. The temperature compensation of the value, the cooling effect of the computer system is better.

Please refer to the first figure, which is a block diagram showing the structure of a hardware monitoring system according to a preferred embodiment of the present invention. As shown, the hardware monitoring system 10 includes a hardware monitor 11 and a Complex Programmable Logic Device (CPLD) 12. The hardware monitoring system 10 mainly monitors the heat dissipation of the computer system, such as the temperature of the server board or other suitable electronic device. The invention is particularly suitable for monitoring the low-end server, and the heat-dissipation monitoring cost is low. The "low-end server" refers to a server with a low cost or function compared to a "high-end server". The hardware monitor 11 is electrically connected to the complex programmable logic device 12.

In one embodiment, the complex programmable logic device 12 is electrically coupled to the hardware monitor 11 via a first system management bus management system (SMBus) S1. However, including but not limited to System Management Bus Connections (SMBus), it can also be General Purpose I/O, Inter-Integrated Circuit (I2C). Or other suitable transmission connections are electrically connected to the hardware monitor 11. It can be understood that the hardware monitor 11 correspondingly has a third system management bus bar connection S3 electrically connected to the first system management bus bar port 埠S1 through the system management bus bar.

Next, the hardware monitor 11 has a first temperature sensor 111 to sense the first temperature value of the first temperature region through the first temperature sensor 111. The first temperature region includes at least one of the following regions in the embodiment: an area in which the central processing unit (CPU) is located, an area in which the memory 14 is located, and an area in which the hardware monitor 11 is located. And the area where the thermal diode 15 is located. It can be understood that when the first temperature region includes a plurality of the above regions, the number of the first temperature sensors 111 corresponds to a plurality, and each region is provided with at least one first temperature sensor 111 (ie, When a plurality of operating elements are operated in the first temperature region, the temperature of each of the operating elements is sensed by at least one first temperature sensor 111). Here, the first temperature zone is typically the area in which the electronic components or components of the computer system that are relatively high in heat relative to other components.

In this embodiment, when the first temperature sensor 111 is used to sense the temperature of the area where the central processing unit 13 is located, the hardware monitor 11 is electrically connected to the first temperature sensor 111 by the platform environment type control port 埠P. The first temperature value when the central processing unit 13 is operated is read through the platform environment control interface P; when the first temperature sensor 111 is used to sense the temperature of the area where the memory 14 is located, the hardware monitor 11 is configured by The third system management bus bar connection S3 is electrically connected to the first temperature sensor 111 to read the first temperature value when the memory device 14 is operated by the third system management bus bar port 埠S3, that is, the complex programmable logic device The third system management bus bar connection 埠S3 is shared by the first temperature sensor 111 that reads the temperature of the memory 14.

According to the hardware monitoring system 10 shown in the first figure, the hardware monitor 11 has eight first temperature sensors 111, wherein the two first temperature sensors 111 are used to sense two thermal diodes. 15 (the first temperature sensitive diode 151 and the second temperature sensitive diode 152, respectively) operate at a first temperature value, and the four first temperature sensors 111 are used to sense four memories 14 (respectively The first temperature value of the first memory 141, the second memory 142, the third memory 143, and the fourth memory 144), and a first temperature sensor 111 for sensing hardware monitoring The first temperature sensor 111 is used to sense the first temperature value when the central processing unit 13 operates.

Further, the hardware monitor 11 also has five analog input ports 埠V1, V2, V3, V4, and V5 for monitoring the voltage values of the 12V, 5V, 2.5V, VTT, and Vccp channels, respectively. Furthermore, the hardware monitor 11 is modeled after the NCT7491, which uses a 24-pin, Quad Flat No leads (QFN) or a Quad Small Outline Package (QSOP). The working voltage is between 3.0V and 3.6V.

Further, the complex programmable logic device 12 has a second temperature sensor 121 for sensing a second temperature value of the second temperature region through the second temperature sensor 121. The second temperature region includes the following region in this embodiment: the region where the Platform Controller Hub (PCH) is located. In other words, the second temperature value is the temperature at which the platform path controller 16 operates.

In this embodiment, the complex programmable logic device 12 also has a storage unit 122. The complex programmable logic device 12 reads the second temperature value sensed by the second temperature sensor 121 and stores the second temperature value in the storage unit 122. The storage unit 122 can be an internal register or a built-in memory. The complex programmable logic device 12 looks up a first offset from the storage unit 122 and corrects the second temperature value based on the first offset.

In one embodiment, after the complex programmable logic device 12 reads the second temperature value sensed by the second temperature sensor 121, it searches the platform path controller 16 according to the temperature correspondence table stored in the storage unit 122. Corresponding to the first offset, and correcting the second temperature value by the first offset of the search, the corrected second temperature value is provided to the hardware monitor 11 for reading. After the hardware monitor 11 reads the first temperature value and the corrected second temperature value, the hardware system controls the heat dissipation of the computer system according to the first temperature value and the corrected second temperature value.

Specifically, the hardware monitoring principle disclosed in the foregoing embodiment can be referred to the second figure. The second figure is a flowchart showing a monitoring method of the hardware monitoring system according to the preferred embodiment of the present invention. As shown in the figure, the hardware monitoring method 200 of the present embodiment includes the following steps: First, step 211 is divided into step 211-1 and step 211-2, and step 211-1 senses the first temperature for the first temperature sensor 111. The first temperature value of the region, step 211-2, senses the second temperature value of the second temperature region for the second temperature sensor 121. Step 212 reads the second temperature value for the complex programmable logic device 12 and temperature compensates for the second temperature value (temperature compensation is also referred to herein as a correction). Step 213 is that the hardware monitor 11 reads the first temperature value and the temperature compensated second temperature value. Step 214 is that the hardware monitor 11 controls the heat dissipation of the computer system according to the first temperature value and the second temperature value after the temperature compensation.

In one embodiment, the computer system includes a fan module 17 that includes one or more fans. Specifically, the fan module 17 includes a system fan 171, a CPU fan 172, and a redundant fan 173. Preferably, the hardware monitor 11 controls the operating speed of the fans through a Pulse Width Modulation (PWM) bus bar connection 埠 PWM. More specifically, the hardware monitor 11 searches for the fan speed corresponding to the first temperature value and the corrected second temperature value according to the fan tachometer, and controls the fan operation by using the fan speed. Alternatively, the fan tachometer is stored in the storage module 112 of the hardware monitor 11.

In this embodiment, the platform path controller 16 in the computer system is electrically coupled to the complex programmable logic device 12 to initialize the complex programmable logic device 12. The initialized content includes setting a first offset corresponding to the platform path controller 16 in the storage unit 122 and a second offset described below. Alternatively, platform path controller 16 may also read the second temperature value stored in complex programmable logic device 12 for use in thermal analysis. However, the role of the platform path controller 16 is not limited thereto, and the present invention is not particularly limited. In one embodiment of the invention, the complex programmable logic device 12 is electrically coupled to the platform path controller 16 via a second system conduit bus bar connection S2.

Similarly, the platform path controller 16 is also electrically connected to the hardware monitor 11 to initialize the hardware monitor 11. The content of this initialization includes setting a fan tachometer in the hardware monitor 11. In the present embodiment, the platform path controller 16 obtains a fan tachometer from the BIOS-Rom (Basic Input/Output System-Rom) and stores it in the hardware monitor 11.

In one embodiment of the present invention, the hardware monitor 12 is electrically connected to the platform path controller 16 via the fourth system management bus port ,S4, and the complex programmable logic device 12 and the hardware monitor 11 are electrically connected. To the platform path controller 16, a system of the shared platform path controller 16 manages the bus ports.

As described above, the system management bus bar is used as the hardware monitor 11 to electrically connect the complex programmable logic device 12 and the platform path controller 16 for the transmission port. When the hardware monitor 11 is complicated to read, When the program logic device 12 corrects the second temperature value, the hardware monitor 11 functions as a main controller on the system management bus bar, and the platform path controller 16 and other system management components on the bus bar are used as the system. The slave controller on the bus bar is managed so that the hardware monitor 11 can read the temperature values in the complex programmable logic device 12 or other components through the system management bus bar connection. When the hardware monitor 11 requests reading temperature, the hardware monitor 11 switches to the main controller on the system management bus bar connection, and the platform path controller 16 switches to the slave control on the system management bus bar port. The hardware monitor 11 reads the corrected second temperature value stored in the storage unit 122 of the complex programmable logic device 12 via the system management bus bar connection.

In a preferred embodiment, the hardware monitoring system 10 further includes an expandable component 19 electrically connected to the complex programmable logic device 12 and the third temperature sensor 20, and the third temperature sensor 20 is configured to sense the first The third temperature value of the three temperature zones. The complex programmable logic device 12 reads the third temperature value from the expandable element 19 and corrects the third temperature value. Specifically, the complex programmable logic device 12 looks up a second offset from the storage unit 122 and corrects the third temperature value based on the second offset. The expandable component 19 can be of the EMC 1464 with a plurality of expandable ports for electrically connecting the plurality of third temperature sensors 20.

Further, the complex programmable logic device 12 compares the corrected third temperature value with the corrected second temperature value and feeds one of the temperature maximum values to the hardware monitor 11. The hardware monitor 11 controls the heat dissipation of the computer system based on the maximum temperature and the read first temperature value.

In conjunction with the third figure, a third diagram is a flow chart showing a method of monitoring a hardware monitoring system in accordance with a preferred embodiment of the present invention. As shown in the figure, the hardware monitoring method 200-1 further includes a step 211-3 to sense a third temperature value of the third temperature region for the third temperature sensor 20 in step 211. Different from the second figure, step 212 includes step 212-1 and step 212-2, and step 212-1 reads the third temperature value for the complex programmable logic device 12 in addition to reading the second temperature value, and After reading the second temperature value and the third temperature value, the complex programmable logic device 12 respectively performs temperature compensation on the second temperature value and the third temperature value, and the step 212-2 is to compare the temperature compensated by the complex programmable logic device 12 The relative magnitude of the second temperature value and the third temperature value, and one of the temperature maximum values is obtained. Thereafter, in step 213a, the hardware monitor 11 reads the first temperature value and the compared one of the temperature maximum values. Subsequently, in step 214, the hardware monitor 11 controls the heat dissipation of the computer system based on the first temperature value and the compared one of the temperature maximum values.

Further, the expandable component 19 is connected to extend a plurality of third temperature sensors 20, 20a, 20b, and the plurality of third temperature sensors 20, 20a, 20b are configured to sense a plurality of operating elements in the third temperature region. The third temperature value. A third temperature sensor 20 is required to sense the third temperature value when the expandable element 19 is in operation. Optionally, at least one third temperature sensor 20, 20a, 20b is used to sense a third temperature value when the IO (input/output) region operates. For the sake of brevity, hereinafter, the corrected second temperature value is defined as a fourth temperature value, and the corrected third temperature value is defined as a fifth temperature value.

Next, in the case of a plurality of third temperature sensors 20, 20a, 20b, the complex programmable logic device 12 reads a plurality of third temperature values from the expandable element 19 and corrects each of the third temperature values And obtaining a plurality of fifth temperature values, and then comparing the fourth temperature value and the plurality of fifth temperature values and acquiring one of the temperature maximum values for reading by the hardware monitor 11 during subsequent heat dissipation control.

More specifically, after reading the second temperature value, the complex programmable logic device 12 stores the second temperature value in the storage unit 122. Then, searching for a first offset corresponding to the second temperature value from the storage unit 122, and correcting the second temperature value according to the first offset to generate a fourth temperature value; and simultaneously reading one or more third After the temperature value, the complex programmable logic device 12 stores the third temperature value in the storage unit 122. Then, a second offset corresponding to the third temperature value is searched from the storage unit 122, and the third temperature value is corrected according to the second offset to generate a fifth temperature value. It should be noted that when the third temperature value is plural, the complex programmable logic device 12 searches for a second offset corresponding to each third temperature value, and performs correction separately.

For example, one third temperature sensor 20 is placed in the IO area and the other third temperature sensor 20a is placed in the area where the expandable element 19 is located. At this time, the complex programmable logic device 12 searches for the third offset from the storage unit 122 and corrects the third temperature value when the expandable element 19 operates according to a third offset. At the same time, the complex programmable logic device 12 searches for a fourth offset from the storage unit 122 and corrects the third temperature value corresponding to the IO region according to the fourth offset. In other words, one third temperature sensor 20 senses the temperature at which the expandable element 19 operates, and the other third temperature sensor 20 senses the temperature at which the IO area operates. It can be understood that the second offset includes a third offset and a fourth offset.

In one embodiment, the first offset is determined based on the actual temperature of the platform path controller 16 and the temperature difference sensed by the second temperature sensor 121. Specifically, when the actual temperature of the platform path controller 16 reaches 60 degrees, the second temperature sensor 121 senses that the second temperature value is only 54 degrees. At this time, the hardware monitor 11 still depends on the second temperature value. The fan module 17 is controlled at 54 degrees so that the fan has not been started or the speed is insufficient, and the cooling efficiency of the platform path controller 16 is insufficient, so that the platform path controller 16 is at risk of excessive temperature. Therefore, the offset can correct the difference between the temperature value sensed by the temperature sensor and the actual temperature value.

On the other hand, the offset is related to the temperature resistance of the operating element. For example, when the actual temperature of the platform path controller 16 reaches 60 degrees, the second temperature sensor 121 senses that the second temperature value is only 54 degrees. If the fan is not activated, the platform path controller 16 has an opportunity to cause damage. However, when the actual temperature of the operating element in the third temperature region reaches 60 degrees, the third temperature sensor 20 senses that the third temperature value is 56 degrees. At this time, since the operating temperature of the operating element in the third temperature region is higher than that of the platform path controller 16. Therefore, if the fan is not activated, the probability of damage to the running component is lower than that of the platform path controller 16. Therefore, by correcting the temperature value by the offset, the difference between the temperature measured by the temperature sensor and the actual temperature can be avoided, and the probability of damage of the component with a lower temperature resistance can also be reduced.

In one embodiment, the complex programmable logic device 12 is electrically connected to the expandable element 19 through the first integrated circuit bus bar connection C1 to read the third temperature value sensed by the third temperature sensor 20. The complex programmable logic device 12 is also electrically connected to the second temperature sensor 121 through the second integrated circuit bus bar connection C2 to read the second temperature value sensed by the second temperature sensor 121.

In one embodiment, when the operating parameters of the computer system (eg, voltage, current, temperature, fan speed, etc.) exceed a preset value, the hardware monitor 11 transmits an early warning signal (digital signal) to the complex programmable logic device 12, The complex programmable logic device 12 suspends data reading based on the early warning signal. The hardware monitor 11 also has an alarm connection 埠A (alert) through which the warning signal is sent to the complex programmable logic device 12.

The preferred embodiment of the present invention is as described above, but is not limited to the scope disclosed in the above embodiments, such as a hardware monitor, a complex programmable logic device, and a transport connection between platform path controllers; The complex programmable logic device is not limited to electrically connecting one expandable component, and may also electrically connect a plurality of expandable components, each expandable component is extended and connected with one or more third temperature sensors; or, hardware The monitor is not limited to being electrically connected to a complex programmable logic device, and can also electrically connect a plurality of complex programmable logic devices, each complex programmable logic device operating similarly through the manner disclosed in the above embodiments. Moreover, it should be noted that the hardware monitor described in the above embodiment has a first temperature sensor. That is, the hardware monitoring system of this embodiment has a first temperature sensor that senses a first temperature value of the first temperature region through the first temperature sensor. Similarly, the complex programmable logic device described in the above embodiment has a second temperature sensor, which also refers to the hardware monitoring system of the embodiment having a second temperature sensor, which is sensed by the second temperature sensor. a second temperature value of the second temperature zone.

In addition, based on the hardware monitoring system 10 disclosed in the above embodiment, the embodiment further provides a server 30. Please refer to the fourth figure, which is a block diagram showing the structure of a server according to a preferred embodiment of the present invention. As shown, the server 30 monitors the heat dissipation of the hardware through the hardware monitoring system 10 of the present embodiment. Since the server 30 employs the hardware monitoring system 10 of the above embodiment, the beneficial effects brought about by the hardware monitoring system 10 should be referred to the above embodiments accordingly.

In summary, the hardware monitoring system of the present invention combines a hardware monitor with a complex programmable logic device to sense temperature values in different temperature regions through multiple temperature sensors and read through complex programmable logic devices. The corresponding temperature value is taken and corrected, so that the weight mismatch problem of the fan control caused by different temperatures in different temperature regions can be solved.

Secondly, because the complex programmable logic device can independently compensate the temperature sensed by the corresponding temperature sensor, the temperature difference in different temperature regions is reduced. Therefore, in the heat dissipation control, the weight of the temperature control can be balanced to better dissipate the computer system, thereby improving the heat dissipation effect of the computer system.

Again, the hardware monitoring system of the present invention electrically interconnects the expandable components with complex programmable logic, the expandable components being expandably connectable to one or more third temperature sensors to monitor the temperature of more temperature zones, and The complex programmable logic device can separately temperature compensate the temperature value sensed by each of the third temperature sensors. On the one hand, the scope of temperature monitoring is improved, and on the other hand, in the case of more monitoring ranges, temperature compensation of multiple temperature values is realized, and the heat dissipation effect of the computer system is better.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

10‧‧‧ hardware monitoring system
11‧‧‧ hardware monitor
111‧‧‧First temperature sensor
112‧‧‧Memory Module
12‧‧‧Complex programmable logic device
121‧‧‧Second temperature sensor
122‧‧‧storage unit
13‧‧‧Central processor
14‧‧‧ memory
141‧‧‧First memory
142‧‧‧Second memory
143‧‧‧ third memory
144‧‧‧ fourth memory
15‧‧‧Thermal diode
151‧‧‧First Thermal Diode
152‧‧‧Second thermal diode
16‧‧‧Platform Path Controller
17‧‧‧Fan module
171‧‧‧System fan
172‧‧‧CPU fan
173‧‧‧Redundant fans
S1‧‧‧First System Management Bus Connection埠
S2‧‧‧Second system management bus connection埠
S3‧‧‧ Third System Management Bus Connections埠
S4‧‧‧4th system management bus connection埠
P‧‧‧ platform environment control interface
V1, V2, V3, V4, V5‧‧‧ analog input port埠
PWM‧‧‧ pulse width modulation connection埠
C1‧‧‧First integrated circuit bus bar connection埠
C2‧‧‧Second integrated circuit bus bar connection埠
A‧‧‧Alarm Connection埠
18‧‧‧BIOS read-only memory
19‧‧‧Extensible components
20, 20a, 20b‧‧‧ third temperature sensor
200, 200-1‧‧‧ hardware monitoring methods
30‧‧‧Server

1 is a block diagram showing the structure of a hardware monitoring system according to a preferred embodiment of the present invention; and FIG. 2 is a flow chart showing a monitoring method of the hardware monitoring system according to a preferred embodiment of the present invention; A flowchart of a method for monitoring a hardware monitoring system according to a preferred embodiment of the present invention; and a fourth block showing a block diagram of a server of a preferred embodiment of the present invention.

10‧‧‧ hardware monitoring system

11‧‧‧ hardware monitor

111‧‧‧First temperature sensor

112‧‧‧Memory Module

12‧‧‧Complex programmable logic device

121‧‧‧Second temperature sensor

122‧‧‧storage unit

13‧‧‧Central processor

14‧‧‧ memory

141‧‧‧First memory

142‧‧‧Second memory

143‧‧‧ third memory

144‧‧‧ fourth memory

15‧‧‧Thermal diode

151‧‧‧First Thermal Diode

152‧‧‧Second thermal diode

16‧‧‧Platform Path Controller

17‧‧‧Fan module

171‧‧‧System fan

172‧‧‧CPU fan

173‧‧‧Redundant fans

S1‧‧‧First System Management Bus Connection埠

S2‧‧‧Second system management bus connection埠

S3‧‧‧ Third System Management Bus Connections埠

S4‧‧‧4th system management bus connection埠

P‧‧‧ platform environment control interface

V1, V2, V3, V4, V5‧‧‧ analog input port埠

PWM‧‧‧ pulse width modulation connection埠

C1‧‧‧First integrated circuit bus bar connection埠

C2‧‧‧Second integrated circuit bus bar connection埠

A‧‧‧Alarm Connection埠

18‧‧‧BIOS read-only memory

19‧‧‧Extensible components

20, 20a, 20b‧‧‧ third temperature sensor

Claims (10)

A hardware monitoring method for monitoring a computer system includes the steps of: sensing a first temperature value of a first temperature region through a first temperature sensor, and sensing through a second temperature Sensing a second temperature value of a second temperature region; reading the second temperature value through a complex programmable logic device, and temperature compensation the second temperature value; and thereafter, transmitting through a hardware monitor The first temperature value and the temperature compensated second temperature value are read, and the hardware monitor controls the computer system to dissipate heat according to the first temperature value and the temperature compensated second temperature value. The hardware monitoring method of claim 1, wherein the hardware monitoring method further comprises the steps of: electrically connecting the complex programmable logic device to an expandable component, the expandable component connection extension having a first a third temperature sensor, wherein the third temperature sensor senses a third temperature value of the third temperature region; the complex programmable logic device reads the third temperature value from the expandable component, and The third temperature value is temperature compensated; the complex programmable logic device compares the temperature compensated third temperature value and the second temperature value, and feeds one of the temperature maximum values to the hardware monitor; The hardware monitor controls heat dissipation of the computer system based on the one temperature maximum and the first temperature value. The hardware monitoring method of claim 2, wherein the hardware monitoring method further comprises the steps of: connecting the expandable component to the third temperature sensors, and transmitting the third temperature sense The detector senses the third temperature values of the third temperature region; the complex programmable logic device reads the third temperature values and performs temperature compensation for each third temperature value; and the complex programmable logic device Comparing the second temperature value after the temperature compensation and the magnitude of the third temperature values after the temperature compensation, and obtaining one of the temperature maximum values for reading by the hardware monitor. The hardware monitoring method of claim 3, wherein after reading the second temperature value and the third temperature value, the method further comprises: the complex programmable logic device to the second temperature value and the third temperature The value is stored in a storage unit; the complex programmable logic device searches the storage unit for a first offset corresponding to the second temperature value, and compensates the second temperature value according to the first offset temperature. And generating a fourth temperature value; the complex programmable logic device searches the memory unit for a second offset corresponding to the third temperature value, and compensates the third temperature according to the second offset temperature a value to generate a fifth temperature value; and the complex programmable logic device compares the fourth temperature value and the magnitude of the fifth temperature value to obtain one of the temperature maxima for reading by the hardware monitor. The hardware monitoring method of claim 4, wherein at least one of the third temperature sensors is disposed in an IO region to sense at least one of the third temperature values of the IO region; Another third temperature sensor is disposed in an area where the expandable component is located to sense the third temperature value of the expandable component, and the temperature compensation step of the third temperature value comprises the following steps: the complex programmable The logic device searches for a third offset from the storage unit, and compensates the third temperature value of the expandable component according to the third offset temperature; and the complex programmable logic device searches at least from the storage unit a fourth offset, and compensating for the at least one third temperature value of the IO region according to the at least one fourth offset temperature; wherein the second offset includes the third offset and the fourth Offset. The hardware monitoring method of claim 4, wherein the second temperature sensor is disposed in an area where the platform path controller is located to sense the second temperature value of the platform path controller. At this time, the complex programmable logic device searches the storage unit for the first offset corresponding to the platform path controller, and compensates the second temperature value according to the first offset temperature. The hardware monitoring method of claim 6, wherein the platform path controller is electrically connected to the complex programmable logic device to set at least one of the memory cells through the platform path controller. Transfer amount. The hardware monitoring method according to any one of the preceding claims, wherein the computer system includes a fan module, and the hardware monitor accesses a fan tachometer according to the one The maximum temperature and the first temperature value control the speed of the fan of the fan module to dissipate heat. The hardware monitoring method of any one of claims 2 to 7, wherein the hardware monitor and the complex programmable logic device are initialized by a platform path controller. The hardware monitoring method of claim 1, wherein the computer system is a server, and when the working parameter of the server exceeds a preset value, the hardware monitor sends an early warning signal to the server. A complex programmable logic device that suspends data reading based on the early warning signal. 【figure】