TWI576695B - Method for monitoring hardware - Google Patents
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本發明涉及一種監控方法,特別涉及一種伺服器的硬體監控方法。The invention relates to a monitoring method, in particular to a hardware monitoring method of a server.
在電腦系統中,硬體監控模組(如:硬體監視器;HW Monitor)是對電腦系統硬體的溫度,電壓及風扇速度進行監控。伺服器作為電腦的一個應用分支,其主機板之硬體監控功能通常由基板管理控制器(Baseboard Management Controller;BMC)晶片來實現。In computer systems, hardware monitoring modules (such as hardware monitors; HW Monitor) monitor the temperature, voltage, and fan speed of the computer system hardware. The server acts as an application branch of the computer, and the hardware monitoring function of the motherboard is usually implemented by a Baseboard Management Controller (BMC) chip.
但是,在伺服器生產開發過程中,生產商為了滿足用戶的不同需求,往往將伺服器開發成高,低端等多個版本,而這些配置的區別主要是在硬體監控功能和硬體監控成本等方面存在較大的差別。However, in the server production development process, in order to meet the different needs of users, manufacturers often develop servers into high-end, low-end and other versions, and the differences between these configurations are mainly in hardware monitoring functions and hardware monitoring. There are big differences in costs and so on.
目前,在低端伺服器中,其硬體監控一般存在著如下幾種方案:(1)採用專用的基板管理控制器晶片,使用成本高。(2)採用的微控制單元(Micro Control Unit;MCU),如硬體監控器(Hardware Monitor;HW Monitor),可監控記憶體,中央處理器(Central Process Unit;CPU),平台路徑控制器(Platform Controller Hub;PCH)以及熱感測器的溫度;此方案,往往需要相容系統管理匯流排連接埠(System Management Bus;SMBUS),積體電路匯流排連接埠(Inter-Integrated Circuit;I²C)以及平台環境控制介面(Platform Environmental Control Interface;PECI)等多種協定,開發週期長 。At present, in the low-end server, there are generally the following schemes for hardware monitoring: (1) The dedicated substrate management controller chip is used, and the use cost is high. (2) Micro Control Unit (MCU), such as Hardware Monitor (HW Monitor), can monitor memory, Central Process Unit (CPU), platform path controller ( Platform Controller Hub; PCH) and the temperature of the thermal sensor; this solution often requires a compatible system management bus (System Management Bus; SMBUS), integrated circuit bus (Inter-Integrated Circuit; I2C) And a variety of agreements such as the Platform Environmental Control Interface (PECI), the development cycle is long.
(3)採用專用的嵌入式控制器(Embed Controller;EC),雖然能夠實現的系統管理匯流排,積體電路匯流排以及平台環境控制介面等多種協議的整合,但一些功能冗餘,成本仍然較高。(3) Using a dedicated embedded controller (EC), although the system management bus, the integrated circuit bus and the platform environment control interface can be integrated, but some functions are redundant and the cost is still Higher.
(4)採用低成本的硬體監控,溫度感測器的監測點數量往往不能滿足伺服器的要求;此外,低成本的硬體監控不能針對每個溫度感測器設置獨立的溫度補償值,這使得不同區域的溫度因差距過大,而不能在風扇控制時體現其合理的權重。例如:記憶體區域的溫度一般在60至75℃,其風扇加速窗口設置在大於65℃,而IO區域(輸入/輸出區域)一般在50至65℃,其風扇加速窗口設置在大於55℃,如果不能對IO區域增加10℃溫度補償,那麼在同一路脈波寬度調變連接埠(Pulse Width Modulation;PWM)控制時,就會始終由溫度較高的區域主導,而忽略了低溫度警戒窗口的感測器資料。(4) With low-cost hardware monitoring, the number of monitoring points of the temperature sensor often cannot meet the requirements of the server; in addition, low-cost hardware monitoring cannot set independent temperature compensation values for each temperature sensor. This makes the temperature difference in different areas too large, and can not reflect its reasonable weight when the fan is controlled. For example, the temperature of the memory area is generally 60 to 75 ° C, the fan acceleration window is set to be greater than 65 ° C, and the IO area (input / output area) is generally 50 to 65 ° C, and the fan acceleration window is set to be greater than 55 ° C. If 10°C temperature compensation cannot be added to the IO area, then in the same Pulse Width Modulation (PWM) control, it will always dominate the higher temperature area, ignoring the low temperature warning window. Sensor data.
因此,針對低端伺服器,有必要開發一種新型的硬體監控系統,解決風扇控制的權重不匹配問題。Therefore, for low-end servers, it is necessary to develop a new type of hardware monitoring system to solve the problem of weight mismatch of fan control.
本發明的目的在於提供一種硬體監控方法,該伺服器主要是低端伺服器,且在沒有BMC晶片的情況下,可實現硬體的散熱監控,並能夠對不同溫度區域的溫度進行補償,以解決風扇控制的權重不匹配問題,提升低端伺服器的散熱效果。The object of the present invention is to provide a hardware monitoring method, which is mainly a low-end server, and can realize hardware heat-dissipation monitoring without the BMC chip, and can compensate temperature in different temperature regions. In order to solve the problem of weight mismatch of the fan control, the heat dissipation effect of the low-end server is improved.
本發明為解決先前技術之問題,所採用之必要技術手段為提供了一硬體監控方法,適用於對一電腦系統進行監控,包括:透過一第一溫度感測器感測一第一溫度區域的一第一溫度值,並透過一第二溫度感測器感測一第二溫度區域的一第二溫度值;透過一複雜可程式邏輯裝置讀取第二溫度值,然後複雜可程式邏輯裝置對第二溫度值進行溫度補償;之後,透過一硬體監控器讀取第一溫度值以及溫度補償後的第二溫度值,且硬體監控器根據第一溫度值和溫度補償後的第二溫度值控制電腦系統散熱。The present invention solves the problems of the prior art, and the necessary technical means is to provide a hardware monitoring method, which is suitable for monitoring a computer system, comprising: sensing a first temperature region through a first temperature sensor. a first temperature value, and sensing a second temperature value of a second temperature region through a second temperature sensor; reading the second temperature value through a complex programmable logic device, and then complex programmable logic device Temperature compensation is performed on the second temperature value; then, the first temperature value and the second temperature value after the temperature compensation are read by a hardware monitor, and the hardware monitor is second according to the first temperature value and the temperature compensation The temperature value controls the heat dissipation of the computer system.
由上述必要技術手段所衍生之一附屬技術手段為硬體監控方法還包括:將複雜可程式邏輯裝置電性連接一可擴展元件,可擴展元件連接擴展有一第三溫度感測器,透過第三溫度感測器感測一第三溫度區域的一第三溫度值;複雜可程式邏輯裝置自可擴展元件中讀取第三溫度值並對第三溫度值進行溫度補償;複雜可程式邏輯裝置比較溫度補償後的第三溫度值以及第二溫度值的大小,並將其中一個溫度最大值反饋給硬體監控器;硬體監控器根據一個溫度最大值以及第一溫度值控制電腦系統散熱。An auxiliary technical means derived from the above-mentioned necessary technical means for the hardware monitoring method further comprises: electrically connecting the complex programmable logic device to an expandable component, and the expandable component connection is extended with a third temperature sensor, through the third The temperature sensor senses a third temperature value of a third temperature region; the complex programmable logic device reads the third temperature value from the expandable component and performs temperature compensation on the third temperature value; comparing the complex programmable logic device The third temperature value after temperature compensation and the magnitude of the second temperature value, and one of the temperature maximum values is fed back to the hardware monitor; the hardware monitor controls the heat dissipation of the computer system according to a maximum temperature value and a first temperature value.
由上述必要技術手段所衍生之一附屬技術手段為硬體監控方法還包括:將可擴展元件連接擴展該些第三溫度感測器,透過該些第三溫度感測器感測第三溫度區域的該些第三溫度值,此時,複雜可程式邏輯裝置讀取該些第三溫度值並對各第三溫度值進行溫度補償;之後,複雜可程式邏輯裝置比較溫度補償後的第二溫度值以及溫度補償後的該些第三溫度值的大小,並獲取其中一個溫度最大值供硬體監控器讀取。An auxiliary technical means derived from the above-mentioned necessary technical means is that the hardware monitoring method further comprises: expanding the expandable component to extend the third temperature sensors, and sensing the third temperature region through the third temperature sensors The third temperature value, at this time, the complex programmable logic device reads the third temperature values and performs temperature compensation for each third temperature value; after that, the complex programmable logic device compares the second temperature after the temperature compensation The value and the magnitude of the third temperature values after temperature compensation, and one of the temperature maxima is obtained for reading by the hardware monitor.
由上述必要技術手段所衍生之一附屬技術手段為讀取第二溫度值以及第三溫度值之後,還包括:複雜可程式邏輯裝置將第二溫度值以及第三溫度值存儲於一存儲單元中;複雜可程式邏輯裝置自存儲單元中查找與第二溫度值對應的一第一偏移量,並依據該第一偏移量溫度補償第二溫度值,以產生一第四溫度值;複雜可程式邏輯裝置自存儲單元中查找與第三溫度值對應的一第二偏移量,並依據第二偏移量溫度補償第三溫度值,以產生一第五溫度值;複雜可程式邏輯裝置比較第四溫度值以及第五溫度值的大小,以獲取其中一個溫度最大值供硬體監控器讀取。An auxiliary technical means derived from the above-mentioned necessary technical means, after reading the second temperature value and the third temperature value, further comprising: the complex programmable logic device storing the second temperature value and the third temperature value in a storage unit The complex programmable logic device searches for a first offset corresponding to the second temperature value from the storage unit, and compensates the second temperature value according to the first offset temperature to generate a fourth temperature value; The program logic device searches a storage unit for a second offset corresponding to the third temperature value, and compensates the third temperature value according to the second offset temperature to generate a fifth temperature value; comparing the complex programmable logic devices The fourth temperature value and the fifth temperature value are obtained to obtain one of the temperature maximum values for reading by the hardware monitor.
由上述必要技術手段所衍生之一附屬技術手段為將至少一個第三溫度感測器設置在一IO區域,以感測IO區域的至少一個第三溫度值;並且,將另一個第三溫度感測器設置在可擴展元件所在的區域,以感測可擴展元件的一個第三溫度值;此時,第三溫度值的溫度補償步驟包括:複雜可程式邏輯裝置自存儲單元中查找一第三偏移量,並依據一個第三偏移量溫度補償可擴展元件的一個第三溫度值;複雜可程式邏輯裝置自存儲單元中查找至少一第四偏移量,並依據至少一個第四偏移量溫度補償IO區域的至少一個第三溫度值;其中,第二偏移量包括第三偏移量和第四偏移量。An auxiliary technical means derived from the above-mentioned necessary technical means is to set at least one third temperature sensor in an IO area to sense at least one third temperature value of the IO area; and, to add another third temperature sense The detector is disposed in an area where the expandable component is located to sense a third temperature value of the expandable component; at this time, the temperature compensation step of the third temperature value includes: the complex programmable logic device searches for a third from the storage unit An offset, and a third temperature value of the scalable component is compensated according to a third offset temperature; the complex programmable logic device searches the memory unit for at least a fourth offset and according to the at least one fourth offset The quantity temperature compensates for at least one third temperature value of the IO region; wherein the second offset includes a third offset and a fourth offset.
由上述必要技術手段所衍生之一附屬技術手段為將一個第二溫度感測器設置在一平台路徑控制器所在的區域,以感測平台路徑控制器的一個第二溫度值;此時,複雜可程式邏輯裝置自存儲單元中查找平台路徑控制器對應的第一偏移量,並依據第一偏移量溫度補償第二溫度值。An auxiliary technical means derived from the above-mentioned necessary technical means is to set a second temperature sensor in an area where the platform path controller is located to sense a second temperature value of the platform path controller; The programmable logic device searches the storage unit for a first offset corresponding to the platform path controller, and compensates the second temperature value according to the first offset temperature.
由上述必要技術手段所衍生之一附屬技術手段為將平台路徑控制器電性連接複雜可程式邏輯裝置,以透過平台路徑控制器設定存儲單元中的至少一個偏移量。An auxiliary technical means derived from the above-mentioned necessary technical means is to electrically connect the platform path controller to the complex programmable logic device to set at least one offset in the storage unit through the platform path controller.
由上述必要技術手段所衍生之一附屬技術手段為電腦系統包括一風扇模組,硬體監控器透過訪問一風扇轉速表,並依據一個溫度最大值以及第一溫度值控制風扇模組之風扇的轉速進行散熱。An auxiliary technical means derived from the above-mentioned necessary technical means is that the computer system comprises a fan module, and the hardware monitor accesses a fan tachometer and controls the fan of the fan module according to a maximum temperature value and a first temperature value. Speed is used for heat dissipation.
由上述必要技術手段所衍生之一附屬技術手段為透過一平台路徑控制器初始化硬體監控器以及複雜可程式邏輯裝置。An auxiliary technical means derived from the above-mentioned necessary technical means is to initialize a hardware monitor and a complex programmable logic device through a platform path controller.
由上述必要技術手段所衍生之一附屬技術手段為電腦系統為一伺服器。One of the subsidiary technical means derived from the above-mentioned necessary technical means is that the computer system is a server.
由上述必要技術手段所衍生之一附屬技術手段為當伺服器之工作參數超過一預設值時,硬體監控器發送一預警信號給複雜可程式邏輯裝置,複雜可程式邏輯裝置根據預警信號中止資料讀取。An auxiliary technical means derived from the above-mentioned necessary technical means is that when the operating parameter of the server exceeds a preset value, the hardware monitor sends an early warning signal to the complex programmable logic device, and the complex programmable logic device terminates according to the warning signal. Data reading.
本發明為解決先前技術之問題,所採用之必要技術手段為提供了一種硬體監控系統,適用於一電腦系統,包括:一硬體監控器,具有一第一溫度感測器,第一溫度感測器用以感測一第一溫度區域的一第一溫度值。一複雜可程式邏輯裝置,電性連接硬體監控器,且複雜可程式邏輯裝置具有一第二溫度感測器,第二溫度感測器用以感測一第二溫度區域的一第二溫度值。其中,複雜可程式邏輯裝置用以讀取第二溫度值,並對第二溫度值進行溫度補償;硬體監控器用以讀取第一溫度值以及溫度補償後的第二溫度值,並根據第一溫度值以及溫度補償後的第二溫度值控制電腦系統散熱。The present invention solves the problems of the prior art, and the necessary technical means for providing a hardware monitoring system for a computer system includes: a hardware monitor having a first temperature sensor, the first temperature The sensor is configured to sense a first temperature value of a first temperature region. A complex programmable logic device electrically connected to the hardware monitor, wherein the complex programmable logic device has a second temperature sensor, and the second temperature sensor is configured to sense a second temperature value of the second temperature region . Wherein, the complex programmable logic device is configured to read the second temperature value and perform temperature compensation on the second temperature value; the hardware monitor is configured to read the first temperature value and the second temperature value after the temperature compensation, and according to the A temperature value and a second temperature value after temperature compensation control the heat dissipation of the computer system.
由上述必要技術手段所衍生之一附屬技術手段為複雜可程式邏輯裝置電性連接一可擴展元件,可擴展元件連接擴展有一第三溫度感測器,第三溫度感測器用以感測一第三溫度區域的一第三溫度值。An auxiliary technical means derived from the above-mentioned necessary technical means is a flexible programmable logic device electrically connected to an expandable component, the expandable component connection is extended with a third temperature sensor, and the third temperature sensor is used for sensing a first A third temperature value of the three temperature zones.
其中,複雜可程式邏輯裝置自可擴展元件中讀取第三溫度值並對第三溫度值進行溫度補償;複雜可程式邏輯裝置比較溫度補償後的第三溫度值以及第二溫度值的大小,並將其中一個溫度最大值反饋給硬體監控器;硬體監控器根據一個溫度最大值以及第一溫度值控制電腦系統散熱。Wherein, the complex programmable logic device reads the third temperature value from the expandable component and performs temperature compensation on the third temperature value; the complex programmable logic device compares the temperature compensated third temperature value and the second temperature value, And one of the maximum temperature values is fed back to the hardware monitor; the hardware monitor controls the heat dissipation of the computer system according to a maximum temperature value and a first temperature value.
由上述必要技術手段所衍生之一附屬技術手段為複雜可程式邏輯裝置還具有:一第一積體電路匯流排連接埠,電性連接可擴展元件,用以透過第一積體電路匯流排連接埠讀取第三溫度值;一第二積體電路匯流排連接埠,電性連接第二溫度感測器,用以透過第二積體電路匯流排連接埠讀取第二溫度值;一第一系統管理匯流排,電性連接硬體監控器,用以透過第一系統管理匯流排將一個溫度最大值提供給硬體監控器。An auxiliary technical means derived from the above-mentioned necessary technical means is that the complex programmable logic device further has: a first integrated circuit bus bar connection port electrically connected to the expandable component for connecting through the first integrated circuit bus bar connection埠 reading a third temperature value; a second integrated circuit bus bar connection port, electrically connected to the second temperature sensor for reading the second temperature value through the second integrated circuit bus bar connection; A system management bus, electrically connected to the hardware monitor, is used to provide a maximum temperature to the hardware monitor through the first system management bus.
由上述必要技術手段所衍生之一附屬技術手段為複雜可程式邏輯裝置還具有一存儲單元,以透過存儲單元存儲讀取的第二溫度值以及第三溫度值;並且存儲單元中存儲有一第一偏移量以及一第二偏移量,複雜可程式邏輯裝置依據第一偏移量溫度補償第二溫度值,並依據第二偏移量溫度補償第三溫度值。An auxiliary technical means derived from the above-mentioned necessary technical means is that the complex programmable logic device further has a storage unit for storing the read second temperature value and the third temperature value through the storage unit; and the storage unit stores a first The offset and a second offset, the complex programmable logic device compensates the second temperature value according to the first offset temperature, and compensates the third temperature value according to the second offset temperature.
由上述必要技術手段所衍生之一附屬技術手段為複雜可程式邏輯裝置還具有:一第二系統管理匯流排連接埠,電性連接一平台路徑控制器,用以透過第二系統管理匯流排連接埠設定存儲單元中的至少一偏移量。An auxiliary technical means derived from the above-mentioned necessary technical means is that the complex programmable logic device further has: a second system management bus bar connection, electrically connected to a platform path controller for managing the bus bar connection through the second system埠 Set at least one offset in the memory unit.
由上述必要技術手段所衍生之一附屬技術手段為第三溫度區域包括:一IO區域以及可擴展元件所在的區域;第二溫度區域包括:一平台路徑控制器所在的區域;第一溫度區域包括以下區域中的至少一種:一CPU所在的區域、一記憶體區域、一硬體監控器所在的區域以及一熱敏二極體所在的區域。An auxiliary technical means derived from the above-mentioned necessary technical means is that the third temperature region comprises: an IO region and an area where the expandable component is located; the second temperature region includes: a region where the platform path controller is located; the first temperature region includes At least one of the following areas: a region where the CPU is located, a memory region, a region where a hardware monitor is located, and an area where the thermal diode is located.
由上述必要技術手段所衍生之一附屬技術手段為電腦系統包括一風扇模組,硬體監控器還具有一存儲模組,存儲模組中存儲有一風扇轉速表;硬體監控器透過訪問風扇轉速表並依據一個溫度最大值以及第一溫度值控制風扇模組之風扇的轉速進行散熱。An auxiliary technical means derived from the above-mentioned necessary technical means is that the computer system includes a fan module, the hardware monitor further has a storage module, and the storage module stores a fan tachometer; the hardware monitor accesses the fan speed through The table heats the fan of the fan module according to a maximum temperature value and a first temperature value.
由上述必要技術手段所衍生之一附屬技術手段為硬體監控器還具有:一平台環境式控制連接埠,電性連接第一溫度感測器;一第三系統管理匯流排連接埠,電性連接複雜可程式邏輯裝置; 一第四系統管理匯流排連接埠,電性連接一平台路徑控制器,用以透過該第四系統管理匯流排連接埠初始化硬體監控器。The auxiliary technical means derived from the above-mentioned necessary technical means is that the hardware monitor also has: a platform environment type control port, electrically connected to the first temperature sensor; and a third system management bus bar connection port, electrical Connecting a complex programmable logic device; a fourth system management bus bar connection, electrically connected to a platform path controller for managing the bus bar connection through the fourth system to initialize the hardware monitor.
基於上述硬體監控系統,本發明提供了一種包括如上任意一項硬體監控系統的伺服器。Based on the above hardware monitoring system, the present invention provides a server including any of the above hardware monitoring systems.
與現有技術相比,本發明提供的伺服器,硬體監控系統以及硬體監控方法具有以下有益效果:首先,本發明的技術方案將硬體監控器與複雜可程式邏輯裝置相結合,透過多個溫度感測器感測不同溫度區域的溫度值,並透過複雜可程式邏輯裝置讀取並修正對應的溫度值,這樣實現了不同溫度感測器的溫度補償,解決了現有電腦系統中無法單獨對不同溫度區域的溫度值進行溫度補償的問題。Compared with the prior art, the server, the hardware monitoring system and the hardware monitoring method provided by the present invention have the following beneficial effects: First, the technical solution of the present invention combines a hardware monitor with a complex programmable logic device, and transmits more The temperature sensor senses the temperature values in different temperature zones and reads and corrects the corresponding temperature values through the complex programmable logic device, thus realizing the temperature compensation of different temperature sensors, and solving the problem that the existing computer system cannot be separated. The problem of temperature compensation for temperature values in different temperature zones.
其次,由於複雜可程式邏輯裝置可對對應溫度感測器感測的溫度進行獨立的溫度補償,這使得不同溫度區域的溫度差距縮小,因而在散熱控制時可以平衡溫度控制的權重,更好地散熱電腦系統,提升了電腦系統的散熱效果。Secondly, since the complex programmable logic device can independently compensate the temperature sensed by the corresponding temperature sensor, the temperature difference between different temperature regions is reduced, so that the weight of the temperature control can be balanced during the heat dissipation control, and better The cooling computer system improves the heat dissipation of the computer system.
再次,本發明的技術方案將複雜可程式邏輯裝置電性連接可擴展元件,可擴展元件可擴展連接一個或多個第三溫度感測器,從而可以監測更多溫度區域的溫度值,並且複雜可程式邏輯裝置可對每一個第三溫度感測器感測的溫度值單獨進行溫度補償,一方面提升了溫度監測的範圍,另一方面在更多監測範圍的情況下,實現了多路溫度值的溫度補償,電腦系統的散熱效果更好。Thirdly, the technical solution of the present invention electrically connects the complex programmable logic device to the expandable component, and the expandable component is expandably connected to one or more third temperature sensors, so that the temperature value of more temperature regions can be monitored, and the complexity is complicated. The programmable logic device can separately compensate the temperature value sensed by each of the third temperature sensors, thereby improving the range of temperature monitoring on the one hand and multi-channel temperature in the case of more monitoring ranges on the other hand. The temperature compensation of the value, the cooling effect of the computer system is better.
請參閱第一圖,第一圖係顯示本發明較佳實施例的硬體監控系統的結構方塊示意圖。如圖所示,硬體監控系統10包括硬體監控器11(Hardware Monitor)和複雜可程式邏輯裝置(Complex Programmable Logic Device;CPLD)12。硬體監控系統10主要是對電腦系統的散熱進行監控,例如伺服器主板或其他合適的電子裝置的溫度,本發明尤其適合於監控低端伺服器,散熱監控成本低。所謂「低端伺服器」是指成本或功能等相對於「高端伺服器」低的伺服器。硬體監控器11電性連接複雜可程式邏輯裝置12。Please refer to the first figure, which is a block diagram showing the structure of a hardware monitoring system according to a preferred embodiment of the present invention. As shown, the hardware monitoring system 10 includes a hardware monitor 11 and a Complex Programmable Logic Device (CPLD) 12. The hardware monitoring system 10 mainly monitors the heat dissipation of the computer system, such as the temperature of the server board or other suitable electronic device. The invention is particularly suitable for monitoring the low-end server, and the heat-dissipation monitoring cost is low. The "low-end server" refers to a server with a low cost or function compared to a "high-end server". The hardware monitor 11 is electrically connected to the complex programmable logic device 12.
在一個實施例中,複雜可程式邏輯裝置12透過第一系統管理匯流排連接埠(System Management Bus;SMBus)S1電性連接硬體監控器11。然而,包括但不限於系統管理匯流排連接埠(SMBus),也可以是通用型輸入輸出匯流排連接埠(General Purpose I/O)、積體電路匯流排連接埠(Inter-Integrated Circuit,I²C)或其他合適的傳輸連接埠電性連接硬體監控器11。可以理解地,硬體監控器11對應地具有透過系統管理匯流排與第一系統管理匯流排連接埠S1電性連接的第三系統管理匯流排連接埠S3。In one embodiment, the complex programmable logic device 12 is electrically coupled to the hardware monitor 11 via a first system management bus management system (SMBus) S1. However, including but not limited to System Management Bus Connections (SMBus), it can also be General Purpose I/O, Inter-Integrated Circuit (I2C). Or other suitable transmission connections are electrically connected to the hardware monitor 11. It can be understood that the hardware monitor 11 correspondingly has a third system management bus bar connection S3 electrically connected to the first system management bus bar port 埠S1 through the system management bus bar.
接著,硬體監控器11具有第一溫度感測器111,以透過第一溫度感測器111感測第一溫度區域的第一溫度值。第一溫度區域在本實施例中包括以下區域中的至少一種:中央處理器13(Central Process Unit;CPU)所在的區域、記憶體14(Memory)所在的區域、硬體監控器11所在的區域以及熱敏二極體15所在的區域。可以理解的是,當第一溫度區域包括上述區域中的多種時,第一溫度感測器111的數量對應有多個,而且每個區域中設置有至少一個第一溫度感測器111(即當第一溫度區域中運作有多個運行元件時,每個運行元件的溫度藉由至少一個第一溫度感測器111感測)。在此,第一溫度區域通常是電腦系統中發熱量相對其它部分高的電子元件或組件所在的區域。Next, the hardware monitor 11 has a first temperature sensor 111 to sense the first temperature value of the first temperature region through the first temperature sensor 111. The first temperature region includes at least one of the following regions in the embodiment: an area in which the central processing unit (CPU) is located, an area in which the memory 14 is located, and an area in which the hardware monitor 11 is located. And the area where the thermal diode 15 is located. It can be understood that when the first temperature region includes a plurality of the above regions, the number of the first temperature sensors 111 corresponds to a plurality, and each region is provided with at least one first temperature sensor 111 (ie, When a plurality of operating elements are operated in the first temperature region, the temperature of each of the operating elements is sensed by at least one first temperature sensor 111). Here, the first temperature zone is typically the area in which the electronic components or components of the computer system that are relatively high in heat relative to other components.
本實施例中,當第一溫度感測器111用以感測中央處理器13所在區域的溫度時,硬體監控器11由平台環境式控制連接埠P電性連接第一溫度感測器111,以透過平台環境式控制介面P讀取中央處理器13運作時的第一溫度值;當第一溫度感測器111用以感測記憶體14所在區域的溫度時,硬體監控器11由第三系統管理匯流排連接埠S3電性連接第一溫度感測器111,以由第三系統管理匯流排連接埠S3讀取記憶體14運作時的第一溫度值,即複雜可程式邏輯裝置12與讀取記憶體14溫度的第一溫度感測器111共享第三系統管理匯流排連接埠S3。In this embodiment, when the first temperature sensor 111 is used to sense the temperature of the area where the central processing unit 13 is located, the hardware monitor 11 is electrically connected to the first temperature sensor 111 by the platform environment type control port 埠P. The first temperature value when the central processing unit 13 is operated is read through the platform environment control interface P; when the first temperature sensor 111 is used to sense the temperature of the area where the memory 14 is located, the hardware monitor 11 is configured by The third system management bus bar connection S3 is electrically connected to the first temperature sensor 111 to read the first temperature value when the memory device 14 is operated by the third system management bus bar port 埠S3, that is, the complex programmable logic device The third system management bus bar connection 埠S3 is shared by the first temperature sensor 111 that reads the temperature of the memory 14.
根據第一圖所示之硬體監控系統10,硬體監控器11具有八個第一溫度感測器111,其中兩個第一溫度感測器111用以感測兩個熱敏二極體15(分別是第一熱敏二極體151和第二熱敏二極體152)運作時的第一溫度值,四個第一溫度感測器111用以感測四個記憶體14(分別是第一記憶體141、第二記憶體142、第三記憶體143和第四記憶體144)運作時的第一溫度值,另有一個第一溫度感測器111用以感測硬體監控器11運作時的第一溫度值,再有一個第一溫度感測器111用以感測中央處理器13運作時的第一溫度值。According to the hardware monitoring system 10 shown in the first figure, the hardware monitor 11 has eight first temperature sensors 111, wherein the two first temperature sensors 111 are used to sense two thermal diodes. 15 (the first temperature sensitive diode 151 and the second temperature sensitive diode 152, respectively) operate at a first temperature value, and the four first temperature sensors 111 are used to sense four memories 14 (respectively The first temperature value of the first memory 141, the second memory 142, the third memory 143, and the fourth memory 144), and a first temperature sensor 111 for sensing hardware monitoring The first temperature sensor 111 is used to sense the first temperature value when the central processing unit 13 operates.
進一步,硬體監控器11還具有五個模擬量輸入連接埠V1、V2、V3、V4、V5,分別用以監控12V、5V、2.5V、VTT以及Vccp通道的電壓值。更進一步,硬體監控器11選用的型號是NCT7491,採用24接腳,四方平面無引腳封裝(Quad Flat No leads;QFN)或四分之一尺寸小輪廓封裝(Quad Small Outline Package;QSOP),工作電壓在3.0V至3.6V之間。Further, the hardware monitor 11 also has five analog input ports 埠V1, V2, V3, V4, and V5 for monitoring the voltage values of the 12V, 5V, 2.5V, VTT, and Vccp channels, respectively. Furthermore, the hardware monitor 11 is modeled after the NCT7491, which uses a 24-pin, Quad Flat No leads (QFN) or a Quad Small Outline Package (QSOP). The working voltage is between 3.0V and 3.6V.
更進一步,複雜可程式邏輯裝置12具有第二溫度感測器121,以透過第二溫度感測器121感測第二溫度區域的第二溫度值。第二溫度區域在本實施例中包括以下區域:平台路徑控制器16(Platform Controller Hub;PCH)所在的區域。換而言之,第二溫度值是平台路徑控制器16運作時的溫度。Further, the complex programmable logic device 12 has a second temperature sensor 121 for sensing a second temperature value of the second temperature region through the second temperature sensor 121. The second temperature region includes the following region in this embodiment: the region where the Platform Controller Hub (PCH) is located. In other words, the second temperature value is the temperature at which the platform path controller 16 operates.
本實施例中,複雜可程式邏輯裝置12還具有存儲單元122。複雜可程式邏輯裝置12讀取第二溫度感測器121感測的第二溫度值,並將第二溫度值儲存於存儲單元122中。存儲單元122可以是內部暫存器,也可以是內建記憶體。複雜可程式邏輯裝置12自存儲單元122中查找一個第一偏移量,並依據第一偏移量修正第二溫度值。In this embodiment, the complex programmable logic device 12 also has a storage unit 122. The complex programmable logic device 12 reads the second temperature value sensed by the second temperature sensor 121 and stores the second temperature value in the storage unit 122. The storage unit 122 can be an internal register or a built-in memory. The complex programmable logic device 12 looks up a first offset from the storage unit 122 and corrects the second temperature value based on the first offset.
在一個實施例中,當複雜可程式邏輯裝置12讀取第二溫度感測器121感測的第二溫度值後,其依據存儲單元122中存儲的溫度對應表,查找平台路徑控制器16所對應的第一偏移量,且以查找的第一偏移量修正第二溫度值,修正後的第二溫度值提供給硬體監控器11讀取。硬體監控器11讀取第一溫度值以及修正後的第二溫度值後,依據第一溫度值以及修正後的第二溫度值控制電腦系統散熱。In one embodiment, after the complex programmable logic device 12 reads the second temperature value sensed by the second temperature sensor 121, it searches the platform path controller 16 according to the temperature correspondence table stored in the storage unit 122. Corresponding to the first offset, and correcting the second temperature value by the first offset of the search, the corrected second temperature value is provided to the hardware monitor 11 for reading. After the hardware monitor 11 reads the first temperature value and the corrected second temperature value, the hardware system controls the heat dissipation of the computer system according to the first temperature value and the corrected second temperature value.
具體的,上述實施例公開的硬體監控原理可參閱第二圖,第二圖係顯示本發明較佳實施例的硬體監控系統的監控方法的流程圖。如圖所示,本實施例的硬體監控方法200包括下列步驟:首先步驟211分為步驟211-1和步驟211-2,步驟211-1為第一溫度感測器111感測第一溫度區域的第一溫度值,步驟211-2為第二溫度感測器121感測第二溫度區域的第二溫度值。步驟212為複雜可程式邏輯裝置12讀取第二溫度值,並對第二溫度值進行溫度補償(溫度補償在本文中還稱之為修正)。步驟213為硬體監控器11讀取第一溫度值以及溫度補償後的第二溫度值。步驟214為硬體監控器11依據第一溫度值以及溫度補償後的第二溫度值,控制電腦系統散熱。Specifically, the hardware monitoring principle disclosed in the foregoing embodiment can be referred to the second figure. The second figure is a flowchart showing a monitoring method of the hardware monitoring system according to the preferred embodiment of the present invention. As shown in the figure, the hardware monitoring method 200 of the present embodiment includes the following steps: First, step 211 is divided into step 211-1 and step 211-2, and step 211-1 senses the first temperature for the first temperature sensor 111. The first temperature value of the region, step 211-2, senses the second temperature value of the second temperature region for the second temperature sensor 121. Step 212 reads the second temperature value for the complex programmable logic device 12 and temperature compensates for the second temperature value (temperature compensation is also referred to herein as a correction). Step 213 is that the hardware monitor 11 reads the first temperature value and the temperature compensated second temperature value. Step 214 is that the hardware monitor 11 controls the heat dissipation of the computer system according to the first temperature value and the second temperature value after the temperature compensation.
在一個實施例中,電腦系統包括一個風扇模組17,風扇模組17包括一個或多個風扇。具體地,風扇模組17包括系統風扇171、CPU風扇172以及冗餘風扇173。較佳者,硬體監控器11透過脈波寬度調變(Pulse Width Modulation;PWM)匯流排連接埠PWM控制這些風扇的運轉速度。更具體地說,硬體監控器11依據風扇轉速表,查找第一溫度值以及修正後的第二溫度值所對應的風扇轉速,並以此風扇轉速控制風扇的運行。可選擇地,風扇轉速表存儲在硬體監控器11的存儲模組112中。In one embodiment, the computer system includes a fan module 17 that includes one or more fans. Specifically, the fan module 17 includes a system fan 171, a CPU fan 172, and a redundant fan 173. Preferably, the hardware monitor 11 controls the operating speed of the fans through a Pulse Width Modulation (PWM) bus bar connection 埠 PWM. More specifically, the hardware monitor 11 searches for the fan speed corresponding to the first temperature value and the corrected second temperature value according to the fan tachometer, and controls the fan operation by using the fan speed. Alternatively, the fan tachometer is stored in the storage module 112 of the hardware monitor 11.
本實施例中,電腦系統中的平台路徑控制器16電性連接複雜可程式邏輯裝置12,以初始化複雜可程式邏輯裝置12。初始化的內容包括設定存儲單元122中平台路徑控制器16所對應的第一偏移量以及下述的第二偏移量。或者,平台路徑控制器16還可讀取複雜可程式邏輯裝置12中存儲的第二溫度值,以便散熱分析使用。然而,平台路徑控制器16的作用並不限於此,具體本發明並不作特別的限定。在本發明的一個實施例中,複雜可程式邏輯裝置12經由第二系統管路匯流排連接埠S2電性連接平台路徑控制器16。In this embodiment, the platform path controller 16 in the computer system is electrically coupled to the complex programmable logic device 12 to initialize the complex programmable logic device 12. The initialized content includes setting a first offset corresponding to the platform path controller 16 in the storage unit 122 and a second offset described below. Alternatively, platform path controller 16 may also read the second temperature value stored in complex programmable logic device 12 for use in thermal analysis. However, the role of the platform path controller 16 is not limited thereto, and the present invention is not particularly limited. In one embodiment of the invention, the complex programmable logic device 12 is electrically coupled to the platform path controller 16 via a second system conduit bus bar connection S2.
類似地,平台路徑控制器16還電性連接硬體監控器11,以初始化硬體監控器11。此初始化的內容包括設定硬體監控器11中的風扇轉速表。平台路徑控制器16在本實施例中,自BIOS唯讀記憶體18(BIOS-Rom,Basic Input/Output System-Rom)中獲取風扇轉速表並存儲在硬體監控器11中。Similarly, the platform path controller 16 is also electrically connected to the hardware monitor 11 to initialize the hardware monitor 11. The content of this initialization includes setting a fan tachometer in the hardware monitor 11. In the present embodiment, the platform path controller 16 obtains a fan tachometer from the BIOS-Rom (Basic Input/Output System-Rom) and stores it in the hardware monitor 11.
在本發明的一個實施例中,硬體監控器12經由第四系統管理匯流排連接埠S4電性連接平台路徑控制器16,而且,複雜可程式邏輯裝置12和硬體監控器11電性連接至平台路徑控制器16時,共享平台路徑控制器16的一個系統管理匯流排連接埠。In one embodiment of the present invention, the hardware monitor 12 is electrically connected to the platform path controller 16 via the fourth system management bus port ,S4, and the complex programmable logic device 12 and the hardware monitor 11 are electrically connected. To the platform path controller 16, a system of the shared platform path controller 16 manages the bus ports.
承以上所述,以系統管理匯流排連接埠作為硬體監控器11電性連接複雜可程式邏輯裝置12和平台路徑控制器16的傳輸連接埠來說,當硬體監控器11讀取複雜可程式邏輯裝置12修正後的第二溫度值時,硬體監控器11作為系統管理匯流排連接埠上的主控制器,而平台路徑控制器16和其他系統管理匯流排連接埠上的組件作為系統管理匯流排連接埠上的從控制器,這樣,可使硬體監控器11透過系統管理匯流排連接埠讀取複雜可程式邏輯裝置12或其他組件中的溫度值。當硬體監控器11要求讀取溫度時,硬體監控器11會切換為系統管理匯流排連接埠上的主控制器,而平台路徑控制器16切換為系統管理匯流排連接埠上的從控制器,硬體監控器11經由系統管理匯流排連接埠讀取複雜可程式邏輯裝置12之存儲單元122中存儲的修正後的第二溫度值。As described above, the system management bus bar is used as the hardware monitor 11 to electrically connect the complex programmable logic device 12 and the platform path controller 16 for the transmission port. When the hardware monitor 11 is complicated to read, When the program logic device 12 corrects the second temperature value, the hardware monitor 11 functions as a main controller on the system management bus bar, and the platform path controller 16 and other system management components on the bus bar are used as the system. The slave controller on the bus bar is managed so that the hardware monitor 11 can read the temperature values in the complex programmable logic device 12 or other components through the system management bus bar connection. When the hardware monitor 11 requests reading temperature, the hardware monitor 11 switches to the main controller on the system management bus bar connection, and the platform path controller 16 switches to the slave control on the system management bus bar port. The hardware monitor 11 reads the corrected second temperature value stored in the storage unit 122 of the complex programmable logic device 12 via the system management bus bar connection.
在較佳實施例中,硬體監控系統10還包括可擴展元件19,分別電性連接複雜可程式邏輯裝置12以及第三溫度感測器20,第三溫度感測器20用以感測第三溫度區域的第三溫度值。複雜可程式邏輯裝置12自可擴展元件19中讀取第三溫度值並對第三溫度值進行修正。具體而言,複雜可程式邏輯裝置12自存儲單元122中查找一個第二偏移量,並依據第二偏移量修正第三溫度值。可擴展元件19的型號可為EMC1464,其具有多個可擴展連接埠,用以電性連接多個第三溫度感測器20。In a preferred embodiment, the hardware monitoring system 10 further includes an expandable component 19 electrically connected to the complex programmable logic device 12 and the third temperature sensor 20, and the third temperature sensor 20 is configured to sense the first The third temperature value of the three temperature zones. The complex programmable logic device 12 reads the third temperature value from the expandable element 19 and corrects the third temperature value. Specifically, the complex programmable logic device 12 looks up a second offset from the storage unit 122 and corrects the third temperature value based on the second offset. The expandable component 19 can be of the EMC 1464 with a plurality of expandable ports for electrically connecting the plurality of third temperature sensors 20.
進一步,複雜可程式邏輯裝置12比較修正後的第三溫度值以及修正後的第二溫度值的大小,並將其中一個溫度最大值反饋給硬體監控器11。硬體監控器11根據溫度最大值以及讀取的第一溫度值控制電腦系統散熱。Further, the complex programmable logic device 12 compares the corrected third temperature value with the corrected second temperature value and feeds one of the temperature maximum values to the hardware monitor 11. The hardware monitor 11 controls the heat dissipation of the computer system based on the maximum temperature and the read first temperature value.
結合第三圖來說,第三圖係顯示本發明較佳實施例的硬體監控系統的監控方法的流程圖。如圖所示,硬體監控方法200-1在步驟211中,還包括步驟211-3,為第三溫度感測器20感測第三溫度區域的第三溫度值。與第二圖不同的是,步驟212包括步驟212-1和步驟212-2,步驟212-1為複雜可程式邏輯裝置12除讀取第二溫度值外,還讀取第三溫度值,且讀取第二溫度值和第三溫度值後,複雜可程式邏輯裝置12分別對第二溫度值和第三溫度值進行溫度補償,步驟212-2為複雜可程式邏輯裝置12比較溫度補償後的第二溫度值和第三溫度值的相對大小,並得到其中一個溫度最大值。之後,步驟213a中,硬體監控器11讀取第一溫度值以及比較後的一個溫度最大值。隨後,步驟214中,硬體監控器11根據第一溫度值以及比較後的一個溫度最大值,控制電腦系統散熱。In conjunction with the third figure, a third diagram is a flow chart showing a method of monitoring a hardware monitoring system in accordance with a preferred embodiment of the present invention. As shown in the figure, the hardware monitoring method 200-1 further includes a step 211-3 to sense a third temperature value of the third temperature region for the third temperature sensor 20 in step 211. Different from the second figure, step 212 includes step 212-1 and step 212-2, and step 212-1 reads the third temperature value for the complex programmable logic device 12 in addition to reading the second temperature value, and After reading the second temperature value and the third temperature value, the complex programmable logic device 12 respectively performs temperature compensation on the second temperature value and the third temperature value, and the step 212-2 is to compare the temperature compensated by the complex programmable logic device 12 The relative magnitude of the second temperature value and the third temperature value, and one of the temperature maximum values is obtained. Thereafter, in step 213a, the hardware monitor 11 reads the first temperature value and the compared one of the temperature maximum values. Subsequently, in step 214, the hardware monitor 11 controls the heat dissipation of the computer system based on the first temperature value and the compared one of the temperature maximum values.
更進一步,可擴展元件19連接擴展有多個第三溫度感測器20、20a、20b,多個第三溫度感測器20、20a、20b用以感測第三溫度區域中多個運行元件的第三溫度值。其中,須配置一個第三溫度感測器20用以感測可擴展元件19運作時的第三溫度值。可選擇地,另有至少一個第三溫度感測器20、20a、20b用以感測IO(輸入/輸出)區域運作時的第三溫度值。為簡明起見,下文中,將修正後的第二溫度值定義為第四溫度值,並將修正後的第三溫度值定義為第五溫度值。Further, the expandable component 19 is connected to extend a plurality of third temperature sensors 20, 20a, 20b, and the plurality of third temperature sensors 20, 20a, 20b are configured to sense a plurality of operating elements in the third temperature region. The third temperature value. A third temperature sensor 20 is required to sense the third temperature value when the expandable element 19 is in operation. Optionally, at least one third temperature sensor 20, 20a, 20b is used to sense a third temperature value when the IO (input/output) region operates. For the sake of brevity, hereinafter, the corrected second temperature value is defined as a fourth temperature value, and the corrected third temperature value is defined as a fifth temperature value.
接著,在多個第三溫度感測器20、20a、20b的情況下,複雜可程式邏輯裝置12自可擴展元件19處讀取多個第三溫度值並對每個第三溫度值進行修正,得到多個第五溫度值,之後,比較第四溫度值以及多個第五溫度值的大小並獲取其中一個溫度最大值,以便硬體監控器11後續散熱控制時讀取。Next, in the case of a plurality of third temperature sensors 20, 20a, 20b, the complex programmable logic device 12 reads a plurality of third temperature values from the expandable element 19 and corrects each of the third temperature values And obtaining a plurality of fifth temperature values, and then comparing the fourth temperature value and the plurality of fifth temperature values and acquiring one of the temperature maximum values for reading by the hardware monitor 11 during subsequent heat dissipation control.
更為具體地說,讀取第二溫度值後,複雜可程式邏輯裝置12將第二溫度值存儲在存儲單元122中。然後,自存儲單元122中查找與第二溫度值對應的第一偏移量,並依據第一偏移量修正第二溫度值,產生第四溫度值;同時,讀取一個或多個第三溫度值後,複雜可程式邏輯裝置12將第三溫度值存儲於存儲單元122中。然後,自存儲單元122中查找與第三溫度值對應的第二偏移量,並依據第二偏移量修正第三溫度值,產生第五溫度值。需要說明的是,第三溫度值為多個時,複雜可程式邏輯裝置12查找與每個第三溫度值對應的一個第二偏移量,並各自進行修正。More specifically, after reading the second temperature value, the complex programmable logic device 12 stores the second temperature value in the storage unit 122. Then, searching for a first offset corresponding to the second temperature value from the storage unit 122, and correcting the second temperature value according to the first offset to generate a fourth temperature value; and simultaneously reading one or more third After the temperature value, the complex programmable logic device 12 stores the third temperature value in the storage unit 122. Then, a second offset corresponding to the third temperature value is searched from the storage unit 122, and the third temperature value is corrected according to the second offset to generate a fifth temperature value. It should be noted that when the third temperature value is plural, the complex programmable logic device 12 searches for a second offset corresponding to each third temperature value, and performs correction separately.
舉例來說,將一個第三溫度感測器20設置在IO區域,並將另一個第三溫度感測器20a設置在可擴展元件19所在的區域。此時,複雜可程式邏輯裝置12自存儲單元122中查找第三偏移量,並依據一個第三偏移量修正可擴展元件19運作時的第三溫度值。與此同時,複雜可程式邏輯裝置12自存儲單元122中查找一個第四偏移量,並依據第四偏移量修正IO區域對應的第三溫度值。換而言之,一個第三溫度感測器20感測可擴展元件19運行時的溫度,另一個第三溫度感測器20感測IO區域運行時的溫度。可以理解的,第二偏移量包括第三偏移量和第四偏移量。For example, one third temperature sensor 20 is placed in the IO area and the other third temperature sensor 20a is placed in the area where the expandable element 19 is located. At this time, the complex programmable logic device 12 searches for the third offset from the storage unit 122 and corrects the third temperature value when the expandable element 19 operates according to a third offset. At the same time, the complex programmable logic device 12 searches for a fourth offset from the storage unit 122 and corrects the third temperature value corresponding to the IO region according to the fourth offset. In other words, one third temperature sensor 20 senses the temperature at which the expandable element 19 operates, and the other third temperature sensor 20 senses the temperature at which the IO area operates. It can be understood that the second offset includes a third offset and a fourth offset.
在一個實施例中,第一偏移量是依據平台路徑控制器16的實際溫度和第二溫度感測器121感測到的溫度差來制定。具體來說,當平台路徑控制器16的實際溫度到達60度,第二溫度感測器121感測到第二溫度值僅有54度,此時,硬體監控器11仍依據第二溫度值54度控制風扇模組17,使得風扇尚未啟動或是轉速不足,對平台路徑控制器16的降溫效率不夠,從而令平台路徑控制器16處於溫度過高的風險中。因此,偏移量可以修正溫度感測器感測到的溫度值和實際溫度值的差距。In one embodiment, the first offset is determined based on the actual temperature of the platform path controller 16 and the temperature difference sensed by the second temperature sensor 121. Specifically, when the actual temperature of the platform path controller 16 reaches 60 degrees, the second temperature sensor 121 senses that the second temperature value is only 54 degrees. At this time, the hardware monitor 11 still depends on the second temperature value. The fan module 17 is controlled at 54 degrees so that the fan has not been started or the speed is insufficient, and the cooling efficiency of the platform path controller 16 is insufficient, so that the platform path controller 16 is at risk of excessive temperature. Therefore, the offset can correct the difference between the temperature value sensed by the temperature sensor and the actual temperature value.
另一方面,偏移量與運行元件的可耐溫程度有關。舉例來說,當平台路徑控制器16的實際溫度到達60度時,第二溫度感測器121感測到第二溫度值僅有54度。若未啟動風扇,平台路徑控制器16就有機會造成損壞。然而,當第三溫度區域中運行元件的實際溫度到達60度時,第三溫度感測器20感測到第三溫度值為56度。此時,因為第三溫度區域中運行元件的可耐溫程度較平台路徑控制器16高。因此,若未啟動風扇,運行元件損壞的機率較平台路徑控制器16低。因此,透過偏移量修正溫度值,可以避免溫度感測器測量到的溫度與實際溫度的差異,亦可以降低耐溫程度較低的組件損壞的機率。On the other hand, the offset is related to the temperature resistance of the operating element. For example, when the actual temperature of the platform path controller 16 reaches 60 degrees, the second temperature sensor 121 senses that the second temperature value is only 54 degrees. If the fan is not activated, the platform path controller 16 has an opportunity to cause damage. However, when the actual temperature of the operating element in the third temperature region reaches 60 degrees, the third temperature sensor 20 senses that the third temperature value is 56 degrees. At this time, since the operating temperature of the operating element in the third temperature region is higher than that of the platform path controller 16. Therefore, if the fan is not activated, the probability of damage to the running component is lower than that of the platform path controller 16. Therefore, by correcting the temperature value by the offset, the difference between the temperature measured by the temperature sensor and the actual temperature can be avoided, and the probability of damage of the component with a lower temperature resistance can also be reduced.
在一個實施例中,複雜可程式邏輯裝置12透過第一積體電路匯流排連接埠C1電性連接可擴展元件19,以讀取第三溫度感測器20感測的第三溫度值。複雜可程式邏輯裝置12還透過第二積體電路匯流排連接埠C2電性連接第二溫度感測器121,以讀取第二溫度感測器121感測的第二溫度值。In one embodiment, the complex programmable logic device 12 is electrically connected to the expandable element 19 through the first integrated circuit bus bar connection C1 to read the third temperature value sensed by the third temperature sensor 20. The complex programmable logic device 12 is also electrically connected to the second temperature sensor 121 through the second integrated circuit bus bar connection C2 to read the second temperature value sensed by the second temperature sensor 121.
在一個實施例中,當電腦系統的工作參數(例如電壓、電流、溫度與風扇轉速等)超過預設值時,硬體監控器11發送預警信號(數位信號)給複雜可程式邏輯裝置12,複雜可程式邏輯裝置12根據該預警信號中止資料讀取。硬體監控器11還具有報警連接埠A(alert),透過該報警連接埠A發送預警信號至複雜可程式邏輯裝置12。In one embodiment, when the operating parameters of the computer system (eg, voltage, current, temperature, fan speed, etc.) exceed a preset value, the hardware monitor 11 transmits an early warning signal (digital signal) to the complex programmable logic device 12, The complex programmable logic device 12 suspends data reading based on the early warning signal. The hardware monitor 11 also has an alarm connection 埠A (alert) through which the warning signal is sent to the complex programmable logic device 12.
本發明的較佳實施例如上所述,但並不局限於上述實施例所公開的範圍,例如硬體監控器、複雜可程式邏輯裝置、平台路徑控制器之間的傳輸連接埠;再者,複雜可程式邏輯裝置不局限於電性連接一個可擴展元件,還可電性連接多個可擴展元件,每個可擴展元件擴展連接有一個或多個第三溫度感測器;或者,硬體監控器不局限於電性連接一個複雜可程式邏輯裝置,還可電性連接多個複雜可程式邏輯裝置,每個複雜可程式邏輯裝置類似地透過上述實施例公開的方式進行操作。而且需要說明的是,上述實施例描述的硬體監控器具有第一溫度感測器。也就是指,本實施例的硬體監控系統具有第一溫度感測器,透過第一溫度感測器感測第一溫度區域的第一溫度值。同理,上述實施例描述的複雜可程式邏輯裝置具有第二溫度感測器,同樣指的是本實施例的硬體監控系統具有第二溫度感測器,透過第二溫度感測器感測第二溫度區域的第二溫度值。The preferred embodiment of the present invention is as described above, but is not limited to the scope disclosed in the above embodiments, such as a hardware monitor, a complex programmable logic device, and a transport connection between platform path controllers; The complex programmable logic device is not limited to electrically connecting one expandable component, and may also electrically connect a plurality of expandable components, each expandable component is extended and connected with one or more third temperature sensors; or, hardware The monitor is not limited to being electrically connected to a complex programmable logic device, and can also electrically connect a plurality of complex programmable logic devices, each complex programmable logic device operating similarly through the manner disclosed in the above embodiments. Moreover, it should be noted that the hardware monitor described in the above embodiment has a first temperature sensor. That is, the hardware monitoring system of this embodiment has a first temperature sensor that senses a first temperature value of the first temperature region through the first temperature sensor. Similarly, the complex programmable logic device described in the above embodiment has a second temperature sensor, which also refers to the hardware monitoring system of the embodiment having a second temperature sensor, which is sensed by the second temperature sensor. a second temperature value of the second temperature zone.
此外,基於上述實施例公開的硬體監控系統10,本實施例還提供了一種伺服器30。請參閱第四圖,第四圖係顯示本發明較佳實施例的伺服器的結構方塊示意圖。如圖所示,該伺服器30透過本實施例的硬體監控系統10對其硬體的散熱進行監控。由於伺服器30採用了上述實施例的硬體監控系統10,因此,由硬體監控系統10帶來的有益效果請相應參考上述實施例。In addition, based on the hardware monitoring system 10 disclosed in the above embodiment, the embodiment further provides a server 30. Please refer to the fourth figure, which is a block diagram showing the structure of a server according to a preferred embodiment of the present invention. As shown, the server 30 monitors the heat dissipation of the hardware through the hardware monitoring system 10 of the present embodiment. Since the server 30 employs the hardware monitoring system 10 of the above embodiment, the beneficial effects brought about by the hardware monitoring system 10 should be referred to the above embodiments accordingly.
綜上所述,本發明的硬體監控系統將硬體監控器與複雜可程式邏輯裝置相結合,透過多個溫度感測器感測不同溫度區域的溫度值,並透過複雜可程式邏輯裝置讀取並修正對應的溫度值,這樣,可解決不同溫度區域因溫度不同而導致的風扇控制的權重不匹配問題。In summary, the hardware monitoring system of the present invention combines a hardware monitor with a complex programmable logic device to sense temperature values in different temperature regions through multiple temperature sensors and read through complex programmable logic devices. The corresponding temperature value is taken and corrected, so that the weight mismatch problem of the fan control caused by different temperatures in different temperature regions can be solved.
其次,由於複雜可程式邏輯裝置可對對應溫度感測器感測的溫度進行獨立的溫度補償,這使得不同溫度區域的溫度差距縮小。因而在散熱控制時可以平衡溫度控制的權重,更好地散熱電腦系統,進而提升了電腦系統的散熱效果。Secondly, because the complex programmable logic device can independently compensate the temperature sensed by the corresponding temperature sensor, the temperature difference in different temperature regions is reduced. Therefore, in the heat dissipation control, the weight of the temperature control can be balanced to better dissipate the computer system, thereby improving the heat dissipation effect of the computer system.
再次,本發明的硬體監控系統將復雜可編程邏輯控制電性連接可擴展元件,可擴展元件可擴展連接一個或多個第三溫度感測器,從而可以監測更多溫度區域的溫度,並且複雜可程式邏輯裝置可對每一個第三溫度感測器感測的溫度值單獨進行溫度補償。一方面提升了溫度監測的範圍,另一方面在更多監測範圍的情況下,實現了多路溫度值的溫度補償,電腦系統的散熱效果更好。Again, the hardware monitoring system of the present invention electrically interconnects the expandable components with complex programmable logic, the expandable components being expandably connectable to one or more third temperature sensors to monitor the temperature of more temperature zones, and The complex programmable logic device can separately temperature compensate the temperature value sensed by each of the third temperature sensors. On the one hand, the scope of temperature monitoring is improved, and on the other hand, in the case of more monitoring ranges, temperature compensation of multiple temperature values is realized, and the heat dissipation effect of the computer system is better.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.
10‧‧‧硬體監控系統
11‧‧‧硬體監控器
111‧‧‧第一溫度感測器
112‧‧‧存儲模組
12‧‧‧複雜可程式邏輯裝置
121‧‧‧第二溫度感測器
122‧‧‧存儲單元
13‧‧‧中央處理器
14‧‧‧記憶體
141‧‧‧第一記憶體
142‧‧‧第二記憶體
143‧‧‧第三記憶體
144‧‧‧第四記憶體
15‧‧‧熱敏二極體
151‧‧‧第一熱敏二極體
152‧‧‧第二熱敏二極體
16‧‧‧平台路徑控制器
17‧‧‧風扇模組
171‧‧‧系統風扇
172‧‧‧CPU風扇
173‧‧‧冗餘風扇
S1‧‧‧第一系統管理匯流排連接埠
S2‧‧‧第二系統管理匯流排連接埠
S3‧‧‧第三系統管理匯流排連接埠
S4‧‧‧第四系統管理匯流排連接埠
P‧‧‧平台環境式控制介面
V1、V2、V3、V4、V5‧‧‧模擬量輸入連接埠
PWM‧‧‧脈衝寬度調製連接埠
C1‧‧‧第一積體電路匯流排連接埠
C2‧‧‧第二積體電路匯流排連接埠
A‧‧‧報警連接埠
18‧‧‧BIOS唯讀記憶體
19‧‧‧可擴展元件
20、20a、20b‧‧‧第三溫度感測器
200、200-1‧‧‧硬體監控方法
30‧‧‧伺服器10‧‧‧ hardware monitoring system
11‧‧‧ hardware monitor
111‧‧‧First temperature sensor
112‧‧‧Memory Module
12‧‧‧Complex programmable logic device
121‧‧‧Second temperature sensor
122‧‧‧storage unit
13‧‧‧Central processor
14‧‧‧ memory
141‧‧‧First memory
142‧‧‧Second memory
143‧‧‧ third memory
144‧‧‧ fourth memory
15‧‧‧Thermal diode
151‧‧‧First Thermal Diode
152‧‧‧Second thermal diode
16‧‧‧Platform Path Controller
17‧‧‧Fan module
171‧‧‧System fan
172‧‧‧CPU fan
173‧‧‧Redundant fans
S1‧‧‧First System Management Bus Connection埠
S2‧‧‧Second system management bus connection埠
S3‧‧‧ Third System Management Bus Connections埠
S4‧‧‧4th system management bus connection埠
P‧‧‧ platform environment control interface
V1, V2, V3, V4, V5‧‧‧ analog input port埠
PWM‧‧‧ pulse width modulation connection埠
C1‧‧‧First integrated circuit bus bar connection埠
C2‧‧‧Second integrated circuit bus bar connection埠
A‧‧‧Alarm Connection埠
18‧‧‧BIOS read-only memory
19‧‧‧Extensible components
20, 20a, 20b‧‧‧ third temperature sensor
200, 200-1‧‧‧ hardware monitoring methods
30‧‧‧Server
第一圖係顯示本發明較佳實施例的硬體監控系統的結構方塊示意圖; 第二圖係顯示本發明較佳實施例的硬體監控系統的監控方法的流程圖; 第三圖係顯示本發明較佳實施例的硬體監控系統的監控方法的流程圖;以及 第四圖係顯示本發明較佳實施例的伺服器的結構方塊示意圖。1 is a block diagram showing the structure of a hardware monitoring system according to a preferred embodiment of the present invention; and FIG. 2 is a flow chart showing a monitoring method of the hardware monitoring system according to a preferred embodiment of the present invention; A flowchart of a method for monitoring a hardware monitoring system according to a preferred embodiment of the present invention; and a fourth block showing a block diagram of a server of a preferred embodiment of the present invention.
10‧‧‧硬體監控系統 10‧‧‧ hardware monitoring system
11‧‧‧硬體監控器 11‧‧‧ hardware monitor
111‧‧‧第一溫度感測器 111‧‧‧First temperature sensor
112‧‧‧存儲模組 112‧‧‧Memory Module
12‧‧‧複雜可程式邏輯裝置 12‧‧‧Complex programmable logic device
121‧‧‧第二溫度感測器 121‧‧‧Second temperature sensor
122‧‧‧存儲單元 122‧‧‧storage unit
13‧‧‧中央處理器 13‧‧‧Central processor
14‧‧‧記憶體 14‧‧‧ memory
141‧‧‧第一記憶體 141‧‧‧First memory
142‧‧‧第二記憶體 142‧‧‧Second memory
143‧‧‧第三記憶體 143‧‧‧ third memory
144‧‧‧第四記憶體 144‧‧‧ fourth memory
15‧‧‧熱敏二極體 15‧‧‧Thermal diode
151‧‧‧第一熱敏二極體 151‧‧‧First Thermal Diode
152‧‧‧第二熱敏二極體 152‧‧‧Second thermal diode
16‧‧‧平台路徑控制器 16‧‧‧Platform Path Controller
17‧‧‧風扇模組 17‧‧‧Fan module
171‧‧‧系統風扇 171‧‧‧System fan
172‧‧‧CPU風扇 172‧‧‧CPU fan
173‧‧‧冗餘風扇 173‧‧‧Redundant fans
S1‧‧‧第一系統管理匯流排連接埠 S1‧‧‧First System Management Bus Connection埠
S2‧‧‧第二系統管理匯流排連接埠 S2‧‧‧Second system management bus connection埠
S3‧‧‧第三系統管理匯流排連接埠 S3‧‧‧ Third System Management Bus Connections埠
S4‧‧‧第四系統管理匯流排連接埠 S4‧‧‧4th system management bus connection埠
P‧‧‧平台環境式控制介面 P‧‧‧ platform environment control interface
V1、V2、V3、V4、V5‧‧‧模擬量輸入連接埠 V1, V2, V3, V4, V5‧‧‧ analog input port埠
PWM‧‧‧脈衝寬度調製連接埠 PWM‧‧‧ pulse width modulation connection埠
C1‧‧‧第一積體電路匯流排連接埠 C1‧‧‧First integrated circuit bus bar connection埠
C2‧‧‧第二積體電路匯流排連接埠 C2‧‧‧Second integrated circuit bus bar connection埠
A‧‧‧報警連接埠 A‧‧‧Alarm Connection埠
18‧‧‧BIOS唯讀記憶體 18‧‧‧BIOS read-only memory
19‧‧‧可擴展元件 19‧‧‧Extensible components
20、20a、20b‧‧‧第三溫度感測器 20, 20a, 20b‧‧‧ third temperature sensor
Claims (10)
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TW105133847A TWI576695B (en) | 2016-10-20 | 2016-10-20 | Method for monitoring hardware |
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Cited By (1)
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CN109828882A (en) * | 2017-11-23 | 2019-05-31 | 研祥智能科技股份有限公司 | Cpu temperature and system ambient temperature monitoring device |
Citations (2)
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US20070242700A1 (en) * | 2006-04-18 | 2007-10-18 | Harris Corporation, Corporation Of The State Of Delaware | System and method for controlling content and delivery of internet protocol television (iptv) services |
TW201207604A (en) * | 2010-08-12 | 2012-02-16 | Hon Hai Prec Ind Co Ltd | System and method for monitoring server analog load |
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US20070242700A1 (en) * | 2006-04-18 | 2007-10-18 | Harris Corporation, Corporation Of The State Of Delaware | System and method for controlling content and delivery of internet protocol television (iptv) services |
TW201207604A (en) * | 2010-08-12 | 2012-02-16 | Hon Hai Prec Ind Co Ltd | System and method for monitoring server analog load |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109828882A (en) * | 2017-11-23 | 2019-05-31 | 研祥智能科技股份有限公司 | Cpu temperature and system ambient temperature monitoring device |
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