TWI575636B - - Google Patents
Info
- Publication number
- TWI575636B TWI575636B TW103142797A TW103142797A TWI575636B TW I575636 B TWI575636 B TW I575636B TW 103142797 A TW103142797 A TW 103142797A TW 103142797 A TW103142797 A TW 103142797A TW I575636 B TWI575636 B TW I575636B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32807—Construction (includes replacing parts of the apparatus)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310745011.8A CN104752136B (zh) | 2013-12-30 | 2013-12-30 | 一种等离子体处理装置及其静电卡盘 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201541536A TW201541536A (zh) | 2015-11-01 |
TWI575636B true TWI575636B (zh) | 2017-03-21 |
Family
ID=53591661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103142797A TW201541536A (zh) | 2013-12-30 | 2014-12-09 | 一種等離子體處理裝置及其靜電卡盤 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104752136B (zh) |
TW (1) | TW201541536A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106898574A (zh) * | 2015-12-17 | 2017-06-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 静电卡盘机构以及半导体加工设备 |
CN108054087B (zh) * | 2017-12-07 | 2020-05-29 | 德淮半导体有限公司 | 晶圆键合中的退火装置及退火方法 |
CN109285923A (zh) * | 2018-10-22 | 2019-01-29 | 天马微电子股份有限公司 | 微型器件转印模具和微型器件转印方法 |
CN111383882B (zh) * | 2018-12-27 | 2023-03-10 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置及用于该处理装置的基片支座 |
CN111383885B (zh) * | 2018-12-27 | 2023-03-31 | 中微半导体设备(上海)股份有限公司 | 一种能提高控温精度的基片安装台及等离子体处理设备 |
CN114496692B (zh) * | 2020-11-11 | 2024-03-12 | 中微半导体设备(上海)股份有限公司 | 加热组件、基片承载组件及其等离子体处理装置 |
CN113110644B (zh) * | 2021-04-26 | 2022-09-16 | 北京北方华创微电子装备有限公司 | 静电卡盘的温度控制方法和温度控制系统 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101278368A (zh) * | 2005-09-30 | 2008-10-01 | 朗姆研究公司 | 具有变化厚度、轮廓和/或形状的介电材料和/或空腔的静电卡盘组件、其使用方法及结合有其的装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316298A (ja) * | 1995-05-11 | 1996-11-29 | Souzou Kagaku:Kk | 静電チャック |
KR20090071060A (ko) * | 2007-12-27 | 2009-07-01 | 주성엔지니어링(주) | 정전척 및 그를 포함하는 기판처리장치 |
KR20100046909A (ko) * | 2008-10-28 | 2010-05-07 | 주성엔지니어링(주) | 정전 흡착 장치와 그의 제조방법 |
KR101074458B1 (ko) * | 2009-06-11 | 2011-10-18 | 세메스 주식회사 | 기판 가열 유닛 및 이를 포함하는 기판 처리 장치 |
CN202332816U (zh) * | 2011-11-23 | 2012-07-11 | 中微半导体设备(上海)有限公司 | 一种以不同材料形成分区的静电吸盘 |
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2013
- 2013-12-30 CN CN201310745011.8A patent/CN104752136B/zh active Active
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2014
- 2014-12-09 TW TW103142797A patent/TW201541536A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101278368A (zh) * | 2005-09-30 | 2008-10-01 | 朗姆研究公司 | 具有变化厚度、轮廓和/或形状的介电材料和/或空腔的静电卡盘组件、其使用方法及结合有其的装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201541536A (zh) | 2015-11-01 |
CN104752136A (zh) | 2015-07-01 |
CN104752136B (zh) | 2017-06-27 |