TWI574071B - Optical fiber connector and manufacturing method thereof, optical fiber connector and optical fiber connecting method, and optical fiber connector and optical fiber assembly - Google Patents

Description

Optical fiber connector and manufacturing method thereof, optical fiber connector and optical fiber connecting method, and optical fiber connector and optical fiber assembly

The invention relates to a fiber optic connector and a manufacturing method thereof, a fiber optic connector and an optical fiber connecting method, an optical fiber connector and an optical fiber assembly, and particularly relates to a position alignment of an optical fiber and an optical waveguide core independent of a substrate. An optical fiber connector that is easy to offset and whose position of the optical fiber is not easily offset, a method of manufacturing the same, a method of connecting an optical fiber connector and an optical fiber, an optical fiber connector, and an optical fiber assembly.

In general, cable (also known as fiber optic cable) can perform high-speed communication of a large amount of information, and thus is widely used in information communication for home and industrial use. Moreover, for example, in a car, various power components (for example, a car navigation system, etc.) are equipped, and the above-mentioned optical cable is also used in optical communication of the power components. The optical cable connector disclosed in Patent Document 1 is an optical cable connector in which the terminals of the optical fibers included in the optical cable are connected to each other.

Moreover, with the increase in information capacity, the development of optical interconnection technology using optical signals has been promoted not only in the communication field such as trunk lines or access systems but also in information processing in routers or servers. Specifically, in order to use light in short-distance signal transmission between boards or boards in a router or a server device, as a light transmission path, wiring is used with higher degree of freedom and high density compared with an optical fiber. Optical waveguide.

In addition, as a method of joining the optical waveguide and the optical fiber, for example, an optical fiber connector described in Patent Document 2 can be cited.

However, in such an optical fiber connector, it is necessary to cut the optical fiber mounting groove by cutting, so that work efficiency is poor, and the optical waveguide core is light-driven in another step different from the cutting step of the groove. Fabrication by lithography and etching, which results in a positional shift of the fiber. Further, in the above method, if a hard substrate having a dimensional stability such as a tantalum wafer is not formed, a larger positional shift of the optical fiber occurs.

Further, there is a method of connecting an optical fiber to an optical waveguide, that is, a waveguide substrate on which an optical waveguide is formed as described in Patent Document 3 and an optical connector carrying the optical fiber are mounted on different holders. The end faces of the respective holders are fixed to each other, but the number of steps up to the connection is large and complicated.

Further, in the optical fiber connector described in Patent Document 4 in which the optical fiber mounting groove and the optical waveguide are provided, the optical fiber fixing adhesive and the optical fiber are introduced into the optical fiber mounting groove, and the optical fiber mounting side is provided by the optical fiber mounting side. The optical waveguide and the optical fiber are aligned by fixing the jig, but if the fixing jig is not horizontal when the optical fiber is fixed, the optical fiber and the optical waveguide are axially offset, which causes a problem of light loss.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open 2010-48925

[Patent Document 2] Japanese Patent Laid-Open 2001-201646

[Patent Document 3] Japanese Patent Laid-Open No. 7-13040

[Patent Document 4] Patent No. 4577376

An object of the present invention is to provide an optical fiber connector with easy alignment of an optical fiber and an optical waveguide core, and easy mounting of the optical fiber, and a position of the optical fiber is not easily offset, a method of manufacturing the optical fiber connector and the optical fiber, and an optical fiber connector And the assembly of the fiber.

The inventors of the present invention have found that the above problem can be solved by the optical fiber connector including a fiber guiding member formed with a groove for fixing an optical fiber by the following optical fiber connector a fiber guiding pattern and a cover material covering the fiber guiding pattern, and the fiber guiding member and the optical waveguide are disposed in parallel. The present invention has been completed based on this finding.

That is, the present invention provides the following (1) to (4).

(1) An optical fiber connector comprising: a fiber guiding member and an optical waveguide, wherein the optical fiber guiding member includes: an optical fiber guide side substrate portion constituting a part of the substrate, and the optical fiber guiding side substrate portion An optical fiber guide pattern and a cover material covering the optical fiber guiding pattern; the optical waveguide comprising: an optical waveguide side substrate portion adjacent to the optical fiber guiding side substrate portion of the substrate, the optical waveguide a first lower clad layer on the optical waveguide side of the side substrate portion, an optical signal transmission core pattern on the optical waveguide side first lower cladding layer, and the optical signal transmission core pattern An optical waveguide side upper cladding layer; the optical fiber guiding pattern includes a plurality of guiding members juxtaposed at intervals, two adjacent guiding members, an optical fiber guiding side substrate portion, and an optical fiber guiding side cover portion The space between the fibers becomes a fiber guiding groove, and the fiber guiding groove is present on an extension line of the optical path direction of the optical signal transmission core pattern.

(2) A method of manufacturing an optical fiber connector, comprising the method of manufacturing the optical fiber connector, comprising: a first step of laminating a first lower cladding layer on a substrate, and then guiding the optical fiber to be formed by etching The first lower cladding layer of the trench portion is removed to form the first lower cladding layer on the optical waveguide side, and the second step is for forming the laminated core on the substrate on which the first lower cladding layer on the optical waveguide side is formed. After the resin layer, the optical fiber guiding core pattern and the optical signal transmitting core pattern are formed by etching once; and in the third step, the upper layer is laminated on the substrate on which the optical fiber guiding core pattern and the optical signal transmitting core pattern are formed After the resin layer for forming a cladding layer is removed, the resin layer for forming an upper cladding layer which is present in the portion where the fiber guiding groove is to be formed is removed by etching, thereby forming an upper cladding layer on the optical fiber guiding side and an optical waveguide side. An upper cladding layer and a fiber guiding groove; and a fourth step of forming a cover material covering the fiber guiding groove.

(3) A method of connecting an optical fiber connector and an optical fiber, wherein an optical adhesive groove of the optical fiber connector is filled with an adhesive agent and inserted into the optical fiber.

(4) An optical fiber connector and an optical fiber assembly comprising: the optical fiber connector; and an optical fiber disposed in the optical fiber guiding groove of the optical fiber connector; and an adhesive.

The optical fiber connector of the present invention has an easy alignment with the optical waveguide core and easy mounting of the optical fiber, and the position of the optical fiber is not easily shifted.

The optical fiber connector of the present invention comprises a fiber guiding member and an optical waveguide, The optical fiber guiding member includes: a fiber guiding side substrate portion constituting a part of the substrate; a fiber guiding pattern on the fiber guiding side substrate portion; and a cover member covering the fiber guiding pattern; the optical waveguide comprising: An optical waveguide side substrate portion adjacent to the optical fiber guiding side substrate portion in the substrate, an optical waveguide side first lower cladding layer on the optical waveguide side substrate portion, and an optical signal on the optical waveguide side first lower cladding layer Transmitting a core pattern and an optical waveguide side upper cladding layer on the optical signal transmission core pattern; the optical fiber guiding pattern includes a plurality of guiding members juxtaposed at intervals, and two adjacent guiding members, The space between the optical fiber guiding side substrate portion and the optical fiber guiding side cover material portion serves as a fiber guiding groove, and the optical fiber guiding groove is present on an extension line of the optical path direction of the optical signal transmission core pattern.

Moreover, the method of manufacturing the optical fiber connector of the present invention is the method for manufacturing the optical fiber connector, and includes the first step of: after laminating the first lower cladding layer on the substrate, the etching is performed on the optical fiber to be guided. The first lower cladding layer of the trench portion is removed to form the first lower cladding layer on the optical waveguide side, and the second step is for forming the laminated core on the substrate on which the first lower cladding layer on the optical waveguide side is formed. After the resin layer, the optical fiber guiding core pattern and the optical signal transmitting core pattern are formed by etching once; and in the third step, the upper layer is laminated on the substrate on which the optical fiber guiding core pattern and the optical signal transmitting core pattern are formed After the resin layer for forming a cladding layer is removed, the resin layer for forming an upper cladding layer which is present in the portion where the fiber guiding groove is to be formed is removed by etching, thereby forming an upper cladding layer and an optical waveguide of the optical fiber guiding member side. a side upper cladding layer and a fiber guiding groove; and a fourth step of forming a cover material covering the fiber guiding groove.

The method of connecting the optical fiber connector and the optical fiber of the present invention comprises the steps of filling the optical fiber guiding groove of the above-mentioned optical fiber connector with an adhesive and inserting the optical fiber.

The optical fiber connector and the optical fiber assembly of the present invention include the above-described optical fiber connector, and an optical fiber and an adhesive disposed in the optical fiber guiding groove of the optical fiber connector.

When the optical fiber connector is used, since the optical fiber guiding member and the optical waveguide are disposed, the optical fiber and the optical waveguide core can be easily aligned by fixing the optical fiber to the optical fiber guiding member. Moreover, since the optical fiber is guided by the optical fiber guiding pattern and the cover material, the position of the optical fiber is not easily shifted. Further, by inserting the optical fiber into the fiber guiding groove, the optical fiber and the optical waveguide can be easily fixed.

[First Embodiment]

(Structure of fiber optic connector)

Hereinafter, the optical fiber connector 1 of the first embodiment will be described with reference to the drawings. Fig. 1 is a plan view showing the optical connector 1 of the first embodiment, Fig. 2 is a perspective view showing the optical connector of the first embodiment, and Fig. 3 is an end view taken along line AA of Fig. 1, 4 is an end view taken along line BB of FIG. 1, FIG. 5 is an end view taken along line CC of FIG. 1, and FIG. 6 is an end view taken along line DD of FIG. 1.

The optical fiber connector 1 of the first embodiment is provided with the optical fiber guiding member 2 and the optical waveguide 3.

The optical fiber guiding member 2 includes a fiber guiding side substrate portion 10a constituting a part (the left side in FIG. 3) of the substrate 10, and a fiber guiding side substrate. The fiber guiding pattern 26 (Fig. 3) on the portion 10a and the cover member 40 covering the fiber guiding pattern 26.

Further, the optical waveguide 3 includes an optical waveguide side substrate portion 10b adjacent to the above-described optical fiber guiding side substrate portion 10a in the substrate 10, and an optical waveguide side first lower cladding layer 22b on the optical waveguide side substrate portion 10b, and an optical waveguide side The optical signal transmission core pattern 23b on the first lower cladding layer 22b and the optical waveguide side upper cladding layer 24b on the optical signal transmission core pattern 23b.

Next, the optical fiber guiding member 2 and the optical waveguide 3 will be described in more detail.

The substrate 10 includes a substrate body 11 having a rectangular shape in plan view, a metal wiring 12 disposed on the back surface of the substrate body 11 , and an adhesive layer 13 present on substantially the entire surface of the substrate body 11 . The adhesive layer 13 preferably functions as a second lower cladding layer. However, the adhesive layer 13 can also be omitted.

A part of the substrate 10 (the left side in FIG. 3) is the fiber guiding side substrate portion 10a, and the remaining portion (the right side in FIG. 3) is the optical waveguide side substrate portion 10b.

Further, the lid member 40 includes a lid member body 41 and an adhesive layer 42 present on the back surface of the lid member body 41. The adhesive layer 42 can also be omitted.

In the present embodiment, the cover member 40 extends from the optical fiber guiding member 2 across the optical waveguide 3. Therefore, the cover member 40 includes the optical fiber guiding side cover portion 40a covering the optical fiber guiding member 2, and the optical waveguide side cover portion 40b covering the optical waveguide 3. The cover member 40 may not extend to the optical waveguide 3 .

A fiber guiding pattern 26 is present on the fiber guiding side substrate portion 10a. The optical fiber guiding pattern 26 includes a plurality of (five in the present embodiment) guiding members 126 (first and second figures) which are present in parallel with each other at intervals. The plurality of guiding members 126 extend in parallel with the long sides of the substrate 10. The space between the adjacent two guiding members 126 becomes the fiber guiding groove 32.

The fiber guiding pattern 26 includes a fiber guiding side first lower cladding layer 22a existing on the fiber guiding side substrate portion 10a, and a fiber guiding guide existing on the fiber guiding side first lower cladding layer 22a. The core pattern 23a and the fiber guiding side upper cladding layer 24a present on the fiber guiding core pattern 23a.

As shown in FIG. 2, the first optical fiber guiding side first lower cladding layer 22a includes a plurality of (five in the present embodiment) optical fiber guiding side first lower wrapping sheets 122 which are present in parallel with each other at intervals. . Similarly, the above-described optical fiber guiding core pattern 23a includes a plurality of (five in the present embodiment) optical fiber guiding chips 123 which are present in parallel with each other at intervals. Similarly, the optical fiber guiding side upper cladding layer 24a includes a plurality of (five in the present embodiment) optical fiber guiding side upper wrapping sheets 124 which are present in parallel with each other at intervals.

The guiding member 126 includes the first fiber guiding side first lower wrapping sheet 122, the fiber guiding chip 123, and the fiber guiding side upper wrapping sheet 124.

As shown in FIG. 2, the optical guiding chip 123 covers the upper surface and the side surface of the first lower wrapping sheet 122 on the optical fiber guiding side, and extends to the optical fiber guiding side substrate portion 10a at the three guiding members 126 at the center. The surface is up. In other words, the optical fiber guiding chip 123 is erected on the optical fiber guiding side substrate portion 10a, and the optical fiber guiding chip 123 has the optical fiber guiding side first. The configuration of the lower cover sheet 122. Further, in the two guiding members 126 at both ends, the optical fiber guiding chip 123 protrudes toward the optical fiber guiding groove 32 from the first lower cladding sheet 122 on the optical fiber guiding side, and covers the first lower cladding of the optical fiber guiding side. The side surface of the sheet 122 extends to the fiber guiding side substrate portion 10a.

Further, on the upper surfaces of the five fiber guiding chips 123, the fiber guiding side upper wrapping sheets 124 are present. The side faces of the fiber guiding grooves 32 are formed by the fiber guiding chips 123 and the fiber guiding side upper wrapping sheets 124. As shown in FIG. 6, the side faces of the optical fiber guiding chips 123 protrude toward the side of the optical fiber guiding groove 32 from the side of the upper optical fiber guiding side upper wrapping sheet 124. Thereby, the cross section in the direction orthogonal to the optical path of the optical fiber guiding groove 32 has a T-shape. That is, the fiber guiding groove 32 is a narrow portion formed by the fiber guiding chip 123 of the adjacent guiding member 126 and an adjacent fiber guiding side upper package of the adjacent guiding member 126 The shape of the cover sheet 124 is connected to the narrow portion. In this manner, since the fiber guiding groove 32 has a T-shape, the fiber guiding chip 123 protrudes toward the fiber guiding groove 32 side from the fiber guiding side upper wrapping sheet 124, so that the side portion of the fiber is substantially guided. The fiber guiding chip 123 of the lead member 126 is held. Thereby, since the side portion of the optical fiber can be fixed by the optical fiber guiding core pattern 23a, the optical signal transmission core pattern 23b can be accurately aligned with the optical fiber. Further, at the time of manufacture, even if the positions where the upper cladding layer and the lower cladding layer are formed are somewhat offset from the core pattern, the following excellent effects can be achieved: the upper cladding layer and the lower cladding layer can be prevented from being formed on the optical fiber. Guide the groove to prevent the insertion of the fiber. Further, as described above, the side portion of the optical fiber is held by the optical fiber guiding chip 123, so that it is used for optical signal transmission. The fiber guiding chip 123 is designed with the same mask as the core, whereby an excellent effect of positioning the optical fiber and the optical signal transmitting core with higher accuracy can be achieved.

Further, the fiber guiding side upper cladding layer 24a fills a space between the fiber guiding core pattern 23a and a fiber guiding side cover portion 40a which will be described later. Thereby, the fiber guiding side cover portion 40a can be supported by the fiber guiding pattern 26. Further, since the upper end of the optical fiber guiding pattern 26 is fixed to the optical fiber guiding side cover portion 40a, the optical fiber can be firmly fixed by the optical fiber guiding pattern 26.

Further, as shown in Fig. 2, in the outer two guiding members 126, the optical fiber guiding side upper wrapping sheet 124 exists from the upper surface of the optical fiber guiding chip 123 to the outer side surface.

The optical fiber guiding core pattern 23a is a guide for fixing the optical fiber, and does not function as a core for optical signal transmission.

On the fiber guiding pattern 26, there is a fiber guiding side cover portion 40a covering the fiber guiding pattern 26. By the fiber guiding side cover portion 40a, the upper end of the fiber guiding groove 32 is closed.

Further, on the optical waveguide side substrate portion 10b described above, the optical waveguide side first lower cladding layer 22b is present. The optical waveguide side first lower cladding layer 22b is present on substantially the entire surface of the surface of the optical waveguide side substrate portion 10b.

The optical signal transmission core pattern 23b is present on the optical waveguide side first lower cladding layer 22b. As shown in Fig. 1, the optical signal transmission core pattern 23b includes a plurality of (four in the present embodiment) core members 23c (first drawing) arranged at intervals. As shown in FIG. 1, the core member 23c as a whole extends in the longitudinal direction of the substrate 10. The core member 23c includes one end side portion, a center portion, And the other side of the side. The one end side portion is a portion on the side of the optical fiber guiding member 2, and extends in the longitudinal direction of the substrate 10, and the interval between the adjacent one end side portions is narrowed. The central portion is connected to the one end side portion, and extends at an angle to the outer side of the substrate 10 with respect to the longitudinal direction of the substrate 10. The other end side portion is connected to the central portion, and extends in the longitudinal direction of the substrate 10, and the interval between the adjacent other end side portions is wider than the interval between the one end side portions. As described above, in the present embodiment, the optical waveguide 3 has the pitch conversion function of the core pattern 23b. Thereby, the fiber pitch of the optical fiber ribbon of the optical fiber to be fixed by the optical fiber connector 1 can be made to match the pitch of the optical element array to be set above the optical path conversion mirror 31 of the optical fiber connector.

However, this pitch conversion function is not required. For example, the core pattern 23b may be a straight line, an S-shaped curve, or an inverse S-shaped curve.

The optical waveguide side upper cladding layer 24b is present on the optical signal transmission core pattern 23b. As shown in Fig. 5, the optical signal transmitting core pattern 23b is embedded in the optical waveguide side upper cladding layer 24b.

The V-shaped groove 30 is provided from the optical waveguide-side upper cladding layer 24b over the optical signal transmission core pattern 23b. The V-shaped groove 30 may extend over the entire length of the substrate 10 in the short-side direction and may exist on the optical path of at least one of the optical signal transmission core patterns 23b. Since the refractive index of the optical signal transmission core pattern 23b is different from the refractive index of the air, the surface of the V-shaped groove 30 on the side of the optical fiber guiding member 2 can be set as an optical path conversion mirror by using the refractive index difference. 31. Further, as shown in the figure, an optical path conversion mirror 31 including a vapor-deposited metal layer may be provided on at least the surface of the V-shaped groove 30 on the side of the optical fiber guiding member 2 side.

In the present embodiment, the optical path conversion mirror 31 is provided on the other end side portion of the optical signal transmission core pattern 23b (core member 23c), and may be provided at one end side portion or central portion. Among these, from the viewpoint of avoiding signal reception from the adjacent core member 23c, it is preferable to provide the other end side portion in which the interval between the core members 23c is widened.

The optical waveguide side cover member portion 40b is present on the surface of the optical waveguide side upper cladding layer 24b. The optical waveguide side cover portion 40b serves as a reinforcing portion of the V-shaped groove 30.

As shown in Fig. 3, a slit groove 25 is present at the boundary between the optical fiber guiding member 2 and the optical waveguide 3. The slit groove 25 exists from the lower surface of the lid member 40 in the middle of the thickness direction of the substrate 10 (adhesive layer 13). Further, the slit groove 25 may exist at least at the boundary between the optical signal transmission core pattern 23b and the optical fiber guiding member 2, and may extend over the entire length of the substrate 10 in the short-side direction. When the slit trench 25 is provided in a part of the short side direction of the substrate 10, it can be preferably formed by laser processing. In the case where the slit groove 25 is provided over the entire length of the substrate 10 in the short-side direction, it can be preferably formed by a laser processing or a Dicing Saw.

As shown in Fig. 1, the optical fiber guiding groove 32 is present on an extension line of the optical path direction of each of the core members 23c of the optical signal transmission core pattern 23b.

In the optical fiber connector 1 configured as described above, the optical fiber is inserted into the optical fiber guiding groove 32, and the end surface of the optical fiber is in contact with the end surface of the optical signal transmission core pattern 23b, and is fixed by an adhesive (refer to Fig. 48 which will be described later). . in this way The position alignment of the optical fiber and the optical waveguide 3 can be performed only by inserting the optical fiber.

At this time, the alignment of the width direction of the fiber guiding groove 32 (the horizontal direction of FIG. 6) can be performed by the fiber guiding pattern 26, and the height direction of the fiber guiding groove 32 (the upper and lower sides of FIG. 3) The alignment of the directions can be performed by the substrate 10 and the cover member 40. When the adhesive is introduced into the fiber guiding groove 32, the gap between the optical fiber and the substrate 10, the gap between the optical fiber and the cover member 40, and the gap between the optical fiber and the optical fiber guiding pattern 26 are filled with an adhesive, thereby reducing the optical waveguide. 3 and the axis offset of the fiber. By setting the gap in this way, the liquid circulation property of the adhesive is also improved.

(Manufacturing method of optical fiber connector)

Hereinafter, a method of manufacturing the optical fiber connector 1 of the first embodiment will be described with reference to the drawings.

Fig. 7 is an end view showing a portion corresponding to the AA line of Fig. 1 in the first manufacturing step of the substrate of the optical connector 1, and Fig. 8 is a view showing the equivalent of the first manufacturing step of the substrate of the optical connector 1. An end view of the portion of the CC line in Fig. 1.

FIG. 9 is an end view showing a portion corresponding to the line AA of FIG. 1 in the second manufacturing step of the substrate of the optical connector 1, and FIG. 10 is a view showing the equivalent of the second manufacturing step of the substrate of the optical connector 1. An end view of the portion of the CC line in Fig. 1.

11 is an end view showing a portion corresponding to the line AA of FIG. 1 in the third manufacturing step of the substrate of the optical connector 1, and FIG. 12 is a view showing the third manufacturing step of the substrate of the optical connector 1. An end view of the portion of the CC line in Fig. 1.

Fig. 13 is an end view showing a portion corresponding to the AA line of Fig. 1 in the first step of the optical connector 1, and Fig. 14 is a line BB corresponding to Fig. 1 showing the first step of the optical connector 1. FIG. 15 is an end view showing a portion corresponding to the CC line of FIG. 1 in the first step of the optical fiber connector 1, and FIG. 16 is a view showing the first step of the optical fiber connector 1. An end view of the portion of the DD line of Fig. 1.

17 is an end view showing a portion corresponding to the AA line of FIG. 1 in the second step of the optical fiber connector 1, and FIG. 18 is a BB line corresponding to the first figure showing the second step of the optical fiber connector 1. FIG. 19 is an end view showing a portion corresponding to the CC line of FIG. 1 in the second step of the optical fiber connector 1, and FIG. 20 is a view showing the second step of the optical fiber connector 1. An end view of the portion of the DD line of Fig. 1.

21 is an end view showing a portion corresponding to the AA line of FIG. 1 in the third step of the optical fiber connector 1, and FIG. 22 is a BB line corresponding to the first figure showing the third step of the optical fiber connector 1. Fig. 23 is an end view showing a portion corresponding to the CC line of Fig. 1 in the third step of the optical connector 1, and Fig. 24 is a view showing the third step of the optical connector 1 An end view of the portion of the DD line of Fig. 1.

Fig. 25 is a perspective view showing a fifth step and a sixth step of the optical connector 1, and Fig. 26 is a view showing a portion corresponding to a portion corresponding to the AA line of Fig. 1 in the fifth step and the sixth step of the optical connector 1. In the view, Fig. 27 is an end view showing a portion corresponding to the BB line of Fig. 1 in the fifth step and the sixth step of the optical fiber connector 1.

Figure 28 is a diagram showing the seventh step of the optical fiber connector 1 corresponding to the first In the end view of the portion of the A-A line in the drawing, FIG. 29 is an end view showing a portion corresponding to the line B-B of the first drawing in the seventh step of the optical fiber connector 1.

The method for manufacturing an optical fiber connector according to the first embodiment includes the following first step, second step, third step, and fourth step. Further, the first manufacturing step of the substrate, the second manufacturing step, the fifth step, the sixth step, and the seventh step of the substrate may be included.

<First Manufacturing Step of Substrate (Fig. 7, Fig. 8)>

In this step, the metal layer 12a is formed on the back surface of the substrate body 11. The metal layer 12a can also be formed by vapor deposition or the like.

<Second manufacturing step of the substrate (Fig. 9 and Fig. 10)>

In this step, unnecessary portions are removed from the metal layer 12a by etching or the like to form the metal wiring 12. Examples of the etching solution include a chlorinated cupric chloride aqueous solution, a chlorinated second ferric chloride aqueous solution, hydrogen peroxide water, a sulfuric acid aqueous solution, hydrochloric acid, and an aqueous nitric acid solution.

<The third manufacturing step of the substrate (Fig. 11 and Fig. 12)>

Next, an adhesive layer 13 is formed on the surface of the substrate body 11. The method of forming the adhesive layer 13 is not particularly limited, and can be preferably formed by the same method as the first lower cladding layer described later.

<Step 1 (Fig. 13 to Fig. 16)>

The first step is a step of removing the first lower cladding layer existing at a portion where the optical fiber guiding groove 32 is to be formed by etching, and then forming an optical waveguide by laminating the first lower cladding layer on the substrate 10. The first lower cladding layer 22b is on the side.

The method for forming the first lower cladding layer is not particularly limited, for example, borrowing The coating of the resin composition for forming a cladding layer or the resin film for forming a cladding layer may be formed by lamination.

In the case of coating, the method is not limited, and the resin composition for forming a coating layer may be applied by a usual method. In addition, the resin film for forming a cladding layer used for lamination can be easily produced, for example, by dissolving the resin composition for forming a cladding layer in a solvent, applying it to a carrier film, and removing the solvent. Further, the first lower cladding layer 22a on the optical fiber guiding side to be described later can be preferably formed by the same method as the first lower cladding layer.

In the first embodiment, as shown in FIG. 14 and FIG. 16, the first lower cladding layer is formed in the first lower cladding layer forming resin film by etching only the portion where the fiber guiding groove 32 is to be formed. The coating layer is formed by a resin film. Therefore, the first lower cladding layer 22a on the optical fiber guiding side is formed on the surface of the optical fiber guiding side substrate portion 10a. However, the first lower cladding layer 22a on the side of the optical fiber guiding member may not be formed, and the first resin film for forming the lower cladding layer on the side of the optical fiber guiding member may be removed.

<Step 2 (Fig. 17 to Fig. 20)>

The second step is a step of laminating the resin layer for forming a core on the substrate 10 on which the first lower cladding layer 22b on the optical waveguide side is formed, and then etching the optical fiber guiding core pattern 23a and the optical signal transmission core by etching. The pattern 23b is formed at one time. The core forming resin layer can also be preferably formed by the same method as the first lower cladding layer.

<Step 3 (Fig. 21 to Fig. 24)>

The third step is the step of forming the above-mentioned fiber guiding core pattern After the resin layer for forming the upper cladding layer is laminated on the substrate 10 of the optical signal transmission core pattern 23b, the upper cladding layer is formed by etching at the portion where the optical fiber guiding groove 32 is to be formed. The resin layer is removed, and the fiber guiding side upper cladding layer 24a, the optical waveguide side upper cladding layer 24b, and the optical fiber guiding groove 32 are formed. The resin layer for forming the upper cladding layer can also be preferably formed by the same method as the first lower cladding layer.

<Step 5 (Fig. 25 to Fig. 27)>

The fifth step is a step of forming a slit groove 25 on the surface of the substrate 10 along the boundary between the above-described optical fiber guiding groove 32 and the above-mentioned optical waveguide side lower cladding layer 22b. The slit groove 25 is preferably formed by a cutter.

The main reason for forming the slit groove 25 is as follows. In the same, the optical fiber joint end surface of the end portion on the side of the optical fiber guiding member 2 on the optical waveguide side first lower cladding layer 22b, the optical signal transmission core pattern 23b, and the optical waveguide side upper cladding layer 24b is provided. The substrate 10 is vertical. However, in actuality, when the fiber joint end face is formed by etching or the like, the fiber joint end face may not be perpendicular to the substrate 10 or may have irregularities on the fiber joint end face. Therefore, the slit groove 25 is formed such that the end face of the fiber joining is formed into a plane, whereby the end face of the fiber joining is a plane perpendicular to the substrate 10. Thereby, the fiber joint end face is in sufficient contact with the fiber end face, and light loss at the joint portion can be prevented or suppressed. Further, as shown in FIG. 27, the slit groove 25 reaches the adhesive layer 13 of the substrate 10. Therefore, the lower portion of the end face of the optical fiber is prevented from being pushed upward by the end portion of the end portion of the first lower cladding layer 22b on the optical waveguide side, and the bonding can be prevented or suppressed when the optical fiber bonding end face is bonded to the end face of the optical fiber. Light loss at the site.

In the fifth embodiment, the V-shaped groove 30 is formed from the optical waveguide-side upper cladding layer 24b to the optical signal transmission core pattern 23b. The V-shaped groove 30 is preferably formed by a cutter.

<Step 6 (Fig. 28 to Fig. 29)>

In the sixth step, an optical path conversion mirror 31 including a metal layer is formed on the surface of the V-shaped groove 30 on the side of the optical fiber guiding member 2. The optical path conversion mirror 31 can be preferably formed by metal deposition on the surface of the V-shaped groove 30 on the side of the optical fiber guiding member 2.

<Step 4 (Fig. 1 to Fig. 6)>

The fourth step is a step of forming a cover member 40 covering the above-described fiber guiding groove 32.

The cover member 40 can be preferably formed by preparing a laminate including the cover member 41 and the adhesive layer 42 on the back surface thereof, and bonding the adhesive layer 42 to the upper side cladding layer 24a and the optical waveguide side of the optical fiber guiding side. The surface of the upper cladding layer 24b.

The cover member 40 includes an optical fiber guiding side cover portion 40a that covers the optical fiber guiding groove 32, and an optical waveguide side cover portion 40b that covers the optical waveguide side upper cladding layer 24b. The optical waveguide side cover portion 40b functions as a reinforcing member that forms part of the optical path conversion mirror 31 of the optical waveguide 2.

The method of forming the lid member can be appropriately determined depending on the material of the lid member, but it is preferably formed by using a roll bonding machine, a vacuum laminator or the like.

(Description of each component of the optical fiber connector)

Hereinafter, each member constituting the optical fiber connector of the present invention will be described.

(lower cladding layer and upper cladding layer)

In the present specification, the optical fiber guiding side upper cladding layer 24a and the optical waveguide side upper cladding layer 24b are collectively referred to as an upper cladding layer, and the optical fiber guiding side first lower cladding layer 22a and the optical waveguide side are sometimes referred to. The first lower cladding layer 22b is referred to as a first lower cladding layer, and the first lower cladding layer and the adhesive layer 13 are combined to be referred to as a lower cladding layer.

As the lower cladding layer and the upper cladding layer, a resin for forming a cladding layer or a resin film for forming a cladding layer can be used.

The resin composition constituting the resin film for forming a cladding layer is not particularly limited as long as it is a refractive index lower than that of the optical signal transmission core pattern 23b, and is preferably cured by light or heat. A thermosetting resin composition or a photosensitive resin composition is used. The resin composition used for the resin film for forming a cladding layer may have the same or different components in the resin composition in the lower cladding layer and the upper cladding layer, and the resin composition may have the same refractive index. different. In addition, it is preferable that the second lower cladding layer has a function as an adhesive layer, and the refractive index or photocurability is not essential, and an adhesive or a resin film for forming a core to be described later may be used.

The thickness of the lower cladding layer and the upper cladding layer is not particularly limited, and the thickness after drying is preferably in the range of 5 μm to 500 μm. When the thickness is 5 μm or more, the coating thickness required for confinement of light can be ensured, and if it is 500 μm or less, the film thickness can be easily controlled uniformly. From the above viewpoints, the thickness of the lower cladding layer and the upper cladding layer is more preferably in the range of 10 μm to 100 μm. Further, the first lower cladding layer is further preferably a film having a thickness of { (optical fiber) for aligning the center of the optical fiber with the center of the optical signal transmission core pattern 23b. A film having a thickness of - (the thickness of the optical signal transmission core pattern 23b formed on the first lower cladding layer 3) / 2}.

As a specific example, the thickness of a preferable lower cladding layer in the case of using an optical fiber having a diameter of 80 μm and an optical fiber having a core diameter of 50 μm is used. First, when the core diameter of each core member 23c constituting the optical signal transmission core pattern 23b is transmitted from the optical fiber to the optical signal transmission core pattern 23b, the square circumscribing the core diameter of the optical fiber can be lost without light loss. Transfer. In this case, the core member 23c is 50 μm × 50 μm (core height; 50 μm). If the above formula is satisfied, the thickness of the optimum lower cladding layer is 15 μm. Further, when an optical signal is transmitted from the optical fiber to the optical signal transmission core pattern 23b using the same optical fiber as described above, the square inscribed in the core diameter of the optical fiber can be transmitted without loss of light. In this case, the core member 23c becomes 25 Mm×25 Mm (core height; 25 Mm). If the above formula is met, the optimum thickness of the lower cladding layer is (40-25). ) μm.

Further, in the optical waveguide 3, the thickness of the upper cladding layer for filling the optical signal transmission core pattern 23b is preferably equal to or greater than the thickness of the optical signal transmission core pattern 23b so as to be from the surface of the substrate 10 to the upper cladding layer. The height of the surface may be appropriately adjusted so as to be equal to or larger than the diameter of the optical fiber.

(Resin for forming a core layer and a resin film for forming a core layer)

In the present specification, the state in which the fiber guiding core pattern 23a and the optical signal transmitting core pattern 23b are combined and referred to as a core pattern, and the etching is performed to form a core pattern may be referred to as a core layer.

In the present invention, the method of forming the core pattern is not particularly limited. For example, the coating of the resin for forming a core layer or the lamination of the resin film for forming a core layer is used. The core layer is formed by etching to form a core pattern.

In the present invention, after the core layer is formed in the optical waveguide 3 and the optical fiber guiding member 2, the optical signal transmitting core pattern 23b and the optical fiber guiding core pattern 23a are simultaneously formed by etching, whereby the optical fiber connection can be efficiently manufactured. Device 1.

The core layer forming resin, particularly the core layer forming resin used in the optical signal transmitting core pattern 23b, is designed to have a higher refractive index than the cladding layer, and it is preferable to use a resin which can form a core pattern by active light rays. Composition. The method of forming the core layer before the patterning is not limited, and a method of applying the resin composition for forming a core layer by a usual method may be mentioned.

The thickness of the resin film for forming a core layer is not particularly limited, and the thickness of the core layer after drying is usually adjusted to 10 μm to 100 μm. When the thickness of the processed optical signal transmission core pattern 23b of the film is 10 μm or more, the positional alignment tolerance can be amplified in the combination of the light-receiving element or the optical fiber formed after the optical waveguide 3 is formed. When the thickness is 100 μm or less, there is an advantage that the bonding efficiency is improved in the combination of the light-receiving element or the optical fiber formed after the optical waveguide 3 is formed. From the above viewpoints, the thickness of the film is more preferably in the range of 30 μm to 90 μm, and the film thickness may be appropriately adjusted in order to obtain the thickness.

In the case where the thickness of the optical signal transmission core pattern 23b after curing is transmitted from the optical fiber to the optical signal transmission core pattern 23b, if the core diameter of the optical fiber is equal to or greater than the core diameter of the optical fiber, the loss of light is small, and the optical signal is transmitted. When the core pattern 23b transmits light to the optical fiber, the rectangle including the thickness and the width of the optical signal transmission core pattern 23b is adjusted to be the inner diameter of the optical fiber. Side, it is better.

(substrate)

The material of the substrate 10 is not particularly limited, and examples thereof include a glass epoxy resin substrate, a ceramic substrate, a glass substrate, a ruthenium substrate, a plastic substrate, a metal substrate, a substrate with a resin layer, a substrate with a metal layer, a plastic film, and A plastic film with a resin layer, a plastic film with a metal layer, and an electric wiring board.

Among these, as the substrate 10, a substrate having flexibility and toughness is used, for example, by using polyethylene terephthalate, polybutylene terephthalate, or polynaphthalene. Polyester such as polyethylene naphthalate, polyethylene, polypropylene, polyamide, polycarbonate, polyphenylene ether, polyether Polyether sulfide, polyarylate, liquid crystal polymer, polysulfone, poly ether sulfones, polyetheretherketone, polyetherimide, Polyimide imide or polyimide can also be used as a flexible optical fiber connector. The thickness of the substrate 10 can be appropriately changed depending on the warpage or dimensional stability of the sheet, and is preferably 10 μm to 10.0 mm. When the optical signal converted by the optical path by the optical path conversion mirror passes through the substrate 10, the substrate 10 which is transparent with respect to the wavelength of the optical signal can also be used. However, the optical path conversion mirror may be omitted as will be described later. In this case, a substrate other than the transparent substrate may be used.

Moreover, the electric wiring board is not particularly limited, and the metal wiring 12 may be In the electric wiring board formed on the FR-4, the metal wiring 12 may be a flexible wiring board formed on a polyimide or polyimide film. In addition, the metal wiring 12 may be formed of the metal layer 12a.

The type of the adhesive layer 13 is not particularly limited, and various adhesives used for the production of a double-faced tape, a UV or thermosetting adhesive, a prepreg, a build-up material, and an electric wiring board can be preferably used. In the case where the optical signal is transmitted through the substrate 10, it is sufficient that the wavelength of the optical signal is transparent. In this case, it is preferable to form a resin film for forming a cladding layer or a resin film for forming a core layer by using an adhesive layer having adhesion to the substrate 10. Adhesive layer 13.

(cover material)

The optical fiber connector 1 of the present invention has a cover member 40. In the case of such a cover member 40, it is important that either the height or the width of the fiber guiding groove 32 is equal to or larger than the diameter of the optical fiber fixed to the fiber guiding groove 32. That is, it is necessary to make the height of the fiber guiding groove 32 larger than the diameter of the fiber, and the width of the fiber guiding groove 32 is larger than the diameter of the fiber. By satisfying this condition, the optical fiber can be easily inserted into the space formed by the optical fiber guiding groove 32 and the cover member 40. Further, in a state in which the optical fiber is inserted in this manner, the optical fiber guiding member 2 and the optical waveguide 3 are provided so that the optical fiber and the optical signal transmitting core pattern 23b capable of transmitting the optical signal to the optical waveguide 3 are joined.

The material of the lid member 40 is not particularly limited, and when the upper cladding layer has adhesiveness, examples thereof include a glass epoxy resin substrate, a ceramic substrate, a glass substrate, a ruthenium substrate, a plastic substrate, a metal substrate, and a plastic film. A resin layer, a metal layer or the like may be provided in the substrates. Further, as the cover member 40, an electric wiring board can also be used.

In particular, as the cover material 40 having flexibility and toughness, for example, polyester such as polyethylene terephthalate, polybutylene terephthalate or polyethylene naphthalate may be preferably used. Polyethylene, polypropylene, polyamide, polycarbonate, polyphenylene ether, polyether thioether, polyarylate, liquid crystal polymer, polyfluorene, polyether oxime, polyetheretherketone, polyether oximeimide, poly Amidoxime, phthalimide, polyimine, and the like. Among these, from the viewpoint of heat resistance and dimensional stability, polyamine-imine and polyimine are particularly preferable.

Further, in the case where the upper cladding layer has no adhesiveness, it is preferable to provide the adhesive layer 42 in the above-mentioned lid member body 41, thereby forming the lid member 40 to which the adhesive layer is attached.

The thickness of the lid member 40 can be appropriately changed depending on the warpage or dimensional stability of the sheet, but is preferably 10 μm to 10.0 mm. Further, the thickness of the adhesive layer 42 formed on the lid member 40 is usually in the range of preferably 0.1 μm to 50 μm, and more preferably 0.1 μm to 20 μm. This is because if the thickness of the adhesive layer 42 is 20 μm or less, the flow of the adhesive toward the optical fiber guiding groove 32 is suppressed, and the distance from the surface of the substrate 10 to the bottom surface of the cover member 40 can be easily controlled.

Further, the optical waveguide 3 of the present invention preferably has the optical path conversion mirror 31. In the case of the optical waveguide 3, the cover member 40 preferably has a reinforcing portion that also includes the optical path conversion mirror 31.

(adhesive)

The adhesive for filling the optical fiber and the optical fiber guiding member 2 to be filled in the optical fiber guiding groove 32 is not particularly limited as long as it can adhere the optical fiber to the optical fiber guiding member 2, and examples thereof include an optical adhesive. Optical junction A photocurable adhesive, a thermosetting adhesive, or the like, which is used in combination with an adhesive, a sealing material for an optical component, a transparent adhesive, a refractive index-integrating material and an adhesive, a resin varnish for forming a coating layer, and a resin varnish for forming a core layer, A thermosetting type adhesive or a two-liquid type hardening type adhesive, and in the case where electromagnetic waves for curing the substrate 10 or the lid member 40 are not transmitted, a thermosetting type adhesive or 2 is preferable. Liquid mixed hardening type adhesive.

[Modification of the first embodiment]

The lower cladding layer and the upper cladding layer are respectively formed in a plurality of layers to form a desired thickness.

In the above-described optical fiber connector 1, the optical path conversion mirror 31 is an optical path conversion mirror in which a metal film is formed, but may be an optical path conversion mirror using a difference in refractive index between the air layer and the core layer.

Further, the V-shaped groove 30 and the optical path conversion mirror 31 may be omitted.

Further, particularly in the case where the substrate body 11 has adhesiveness, the adhesive layer 13 of the substrate 10 can be omitted. Further, the adhesive layer 13 may also form a part of the lower cladding layer as the second lower cladding layer.

In the above-described optical fiber connector 1, the optical fiber guiding side first lower cladding layer 22a is present on the substrate 10, and the optical fiber guiding core pattern 23a is present on the optical fiber guiding side first lower cladding layer 22a. The fiber guiding side upper cladding layer 24a is present on the guiding core pattern 23a, but the fiber guiding side first lower cladding layer 22a may be omitted.

[Second Embodiment]

(Structure of fiber optic connector)

The optical fiber connector of the second embodiment is the optical fiber connector of the first embodiment The adapter includes an adhesive introduction slit that communicates the outside of the optical fiber guiding member 2 with the optical fiber guiding groove 32 instead of or in combination with the slit groove 25.

In the optical fiber connector of the second embodiment, the optical fiber guiding groove 32 communicates with the outside through the optical fiber insertion opening of the optical fiber guiding groove 32, and is introduced into the slit via the adhesive to communicate with the outside. Therefore, when the adhesive is introduced from one of the insertion port of the optical fiber and the adhesive introduction slit, the air in the optical fiber guiding groove 32 flows out from the insertion opening of the optical fiber and the other of the adhesive introduction slit. Thereby, the adhesive can be easily introduced into the fiber guiding groove 32. Further, when an adhesive and an optical fiber are introduced into the optical fiber guiding groove 32 into which the adhesive is introduced to fix the optical fiber, an excessive amount of the adhesive is introduced into the slit through the adhesive and flows out to the outside of the optical fiber guiding groove 32. Thereby, the optical fiber can be easily introduced and fixed in the optical fiber guiding groove 32.

(First preferred example of the optical fiber connector and the method of manufacturing the same according to the second embodiment)

Hereinafter, a first preferred example of the optical connector of the second embodiment will be described with reference to the drawings. Fig. 30 is an end view of a portion of the optical fiber connector 1A corresponding to the AA line of Fig. 1, and Fig. 31 is an end view of a portion of the optical fiber connector 1A corresponding to the BB line of Fig. 1, and Fig. 32 is a view. An end view of a portion of the optical fiber connector 1A corresponding to the CC line of Fig. 1 and a third view of a portion of the optical fiber connector 1A corresponding to the DD line of Fig. 1 .

<Configuration of optical fiber connector>

The optical fiber connector 1A is the optical fiber connector 1 of the first embodiment. Instead of the slit groove 25, an adhesive introduction slit 25A that communicates the outside of the fiber guiding member 2 with the fiber guiding groove 32 is provided.

In the optical fiber connector 1A, the same reference numerals as those of the optical fiber connector 1 denote the same portions.

The adhesive introduction slit 25A exists at the boundary between the optical fiber guiding member 2 and the optical waveguide 3. The adhesive introduction slit 25A reaches the back surface of the substrate 10 from the middle in the thickness direction of the adhesive layer 42 of the lid member 40. Further, the adhesive introduction slit 25A extends over the entire length of the substrate 10 in the short-side direction, and may exist in a part of the short-side direction.

<Method of Manufacturing Optical Fiber Connector>

In the third step, the method of manufacturing the optical fiber connector of the second embodiment can preferably be carried out in the same manner as the method of manufacturing the optical fiber connector of the first embodiment. Therefore, the subsequent steps of the third step will be described.

"Step 5A (Figure 34 ~ Figure 37)"

Fig. 34 is an end view showing a portion corresponding to the line AA of Fig. 1 in the fifth step, and Fig. 35 is an end view showing a portion corresponding to the BB line of Fig. 1 in the fifth step, and Fig. 36 is a view An end view of a portion corresponding to the CC line of Fig. 1 in the step 5A, and an end view showing a portion corresponding to the DD line of Fig. 1 in the fifth step A is shown.

In the fifth step, the same steps as in the fifth step described above are carried out except that the formation of the slit groove 25 is not performed.

In other words, in the step 5A, the V-shaped groove 30 is formed from the optical waveguide-side upper cladding layer 24b to the optical signal transmission core pattern 23b. The V-shaped groove 30 is preferably formed by a cutter.

"Step 6 (Figure 38 ~ Figure 39)"

Fig. 38 is an end view showing a portion corresponding to the line A-A in Fig. 1 in the sixth step, and Fig. 39 is an end view showing a portion corresponding to the line B-B in Fig. 1 in the sixth step.

The sixth step is the same as the sixth step of the second embodiment.

That is, the optical path conversion mirror 31 including the metal layer is formed on the surface of the V-shaped groove 30 on the side of the optical fiber guiding member 2. The optical path conversion mirror 31 can be preferably formed by metal deposition on the surface of the V-shaped groove 30 on the side of the optical fiber guiding member 2.

"Step 4 (Figure 40 ~ Figure 43)"

Fig. 40 is an end view showing a portion corresponding to the AA line of Fig. 1 in the fourth step, and Fig. 41 is an end view showing a portion corresponding to the BB line of Fig. 1 in the fourth step, and Fig. 42 is a view showing the fourth step. An end view of a portion corresponding to the CC line of Fig. 1 in the fourth step, and Fig. 43 is an end view showing a portion corresponding to the DD line of Fig. 1 in the fourth step.

The fourth step is the same as the fourth step of the second embodiment.

That is, in the fourth step, the cover member 40 covering the above-described fiber guiding groove 32 is formed.

The cover member 40 is prepared by laminating the cover member 41 and the adhesive layer 42 on the back surface thereof, and the adhesive layer 42 is adhered to the surface of the optical fiber guiding side upper cladding layer 24a and the optical waveguide side upper cladding layer 24b. It is preferably formed.

The cover member 40 includes an optical fiber guiding side cover portion 40a that covers the optical fiber guiding groove 32, and an optical waveguide side cover portion 40b that covers the optical waveguide side upper cladding layer 24b. The optical waveguide side cover portion 40b serves as an optical path of the optical waveguide 2 The reinforcing member forming part of the mirror 31 functions as a reinforcing member.

"Step of Forming Adhesive Introducing Slit (Fig. 30 to Fig. 33)"

After the fourth step, the adhesive introduction slit 25A is formed. The adhesive introduction slit 25A reaches the fiber guiding groove 32 from the lower surface of the substrate 10. Further, the adhesive introduction slit 25A extends over the entire length of the substrate in the short-side direction. The adhesive introduction slit 25A is preferably formed by a cutter. Further, when the adhesive introduction slit 25A is formed by a cutter, the optical waveguide side first lower cladding layer 22b, the optical signal transmission core pattern 23b, and the optical waveguide side upper cladding layer 24b are preferably used. The end surface on the side of the guide member 2 is cut to form an adhesive introduction slit 25A.

(Second preferred embodiment of the optical fiber connector and the method of manufacturing the same according to the second embodiment)

Hereinafter, a second preferred example of the optical connector of the second embodiment will be described with reference to the drawings. Fig. 44 is an end view of a portion of the optical fiber connector 1B corresponding to the line A-A of Fig. 1, and Fig. 45 is an end view of a portion of the optical fiber connector 1B corresponding to the line B-B of Fig. 1 .

In the optical fiber connector 1B, in place of the adhesive introduction slit 25A, the optical fiber connector 1B is provided with an adhesive introduction slit 25B that communicates the outside of the optical fiber guiding member 2 with the optical fiber guiding groove 32.

In the optical fiber connector 1B, the same reference numerals as those of the optical fiber connector 1 denote the same portions.

The adhesive introduction slit 25B exists at the boundary between the optical fiber guiding member 2 and the optical waveguide 3. The adhesive introduction slit 25B reaches the surface of the cover member 40 from the middle in the thickness direction of the adhesive layer 13 of the substrate 10. And, that The adhesive introduction slit 25B extends over the entire length of the substrate 10 in the short-side direction, and may exist in a part of the short-side direction.

The adhesive introduction slit 25B can also be preferably formed by a cutter.

(Third preferred example of the optical fiber connector and the method of manufacturing the same according to the second embodiment)

Hereinafter, a third preferred example of the optical connector of the second embodiment will be described with reference to the drawings. Fig. 46 is an end view of a portion of the optical fiber connector 1C corresponding to the line A-A of Fig. 1, and Fig. 47 is an end view of a portion of the optical fiber connector 1C corresponding to the line B-B of Fig. 1 .

In the optical fiber connector 1C, an adhesive introduction slit 25C that communicates the outside of the optical fiber guiding member 2 with the optical fiber guiding groove 32 is further provided.

The adhesive introduction slit 25C is present on the side of the optical fiber guiding member 2 at a boundary between the optical fiber guiding member 2 and the optical waveguide 3. The adhesive introduction slit 25C reaches the surface of the cover member 40 from the middle in the thickness direction of the adhesive layer 13 of the substrate 10. Further, the adhesive introduction slit 25C extends over the entire length of the substrate 10 in the short-side direction, but may exist in a part of the short-side direction.

The adhesive introduction slit 25C can also be preferably formed by a cutter.

(Fourth preferred example of the optical fiber connector and the method of manufacturing the same according to the second embodiment)

Hereinafter, the third embodiment of the optical fiber connector of the second embodiment will be described with reference to the drawings. A preferred embodiment will be described. Fig. 54 is an end view of a portion of the optical fiber connector 1D corresponding to the line A-A of Fig. 1, and Fig. 55 is an end view of a portion of the optical fiber connector 1D corresponding to the line B-B of Fig. 1 .

In the optical fiber connector 1D, the optical fiber connector 1D is further provided with an adhesive introduction slit 25D that communicates the outside of the optical fiber guiding member with the optical fiber guiding groove 32.

The adhesive introduction slit 25D is present on the side of the optical fiber guiding member 2 at a boundary between the optical fiber guiding member 2 and the optical waveguide 3. The adhesive introduction slit 25D reaches the fiber guiding groove 32 from the substrate 10. Further, the adhesive introduction slit 25D extends over the entire length of the substrate 10 in the short-side direction, but may exist in a part of the short-side direction.

The adhesive introduction slit 25D can also be preferably formed by a cutter.

[Connection method and assembly of optical fiber connector and optical fiber of the present invention]

The method of connecting the optical fiber connector and the optical fiber of the present invention is a method of connecting the optical fiber guiding groove of the optical fiber connector of the present invention to the adhesive and inserting the optical fiber.

Further, the optical fiber connector and the optical fiber assembly of the present invention include the optical fiber connector of the present invention, and an optical fiber and an adhesive disposed in the optical fiber guiding groove of the optical fiber connector.

48 to 51 are cross-sectional views showing a method of connecting the optical fiber connector and the optical fiber assembly 70, 70A, 70B, and 70C of the present invention, and an optical fiber connector and an optical fiber.

The assembly bodies 70, 70A, 70B, and 70C respectively include: an optical fiber connector 1. 1A, 1B, 1C, and an optical fiber 50 and an adhesive 60 disposed in the optical fiber guiding grooves 32 of the respective optical fiber connectors 1, 1A, 1B, and 1C. The assembly 70, 70A, 70B, 70C can be manufactured by filling the adhesive 60 with the optical fiber guiding grooves 32 of the optical fiber connectors 1, 1A, 1B, 1C and inserting the optical fibers 50.

The adhesive is not particularly limited as long as it can adhere the optical fiber 50 to the optical fiber guiding member 2, and examples thereof include an optical adhesive, an optical path bonding adhesive, an optical component sealing material, a transparent adhesive, and a refractive index bonding material. a photocurable adhesive such as an adhesive varnish, a resin varnish for forming a cladding layer, a resin varnish for forming a core layer, a thermosetting adhesive, a photothermographic adhesive, or a two-liquid hybrid curing adhesive. In the case where electromagnetic waves for hardening the substrate 10 or the lid member 40 are not transmitted, a thermosetting adhesive or a two-liquid mixing-curing adhesive is preferred.

The viscosity at 25 ° C of the adhesive is preferably from 150 mPa ‧ to 400 mPa ‧ , more preferably from 200 mPa ‧ to 350 mPa s, and further preferably from 250 mPa ‧ to 300 mPa ‧ s. Within this range, the center line of the optical fiber 50 can be made to substantially coincide with the center line of the fiber guiding groove 32 in the fiber insertion direction. The viscosity at 25 ° C can be measured by the measurement method described in the examples below.

[Optical Connector and Fiber Size]

In the optical fiber connector of the present invention, the method of manufacturing the same, the method of connecting the optical fiber connector and the optical fiber, and the assembly of the optical fiber connector and the optical fiber, the preferred sizes of the optical fiber connector and the optical fiber are described using FIGS. 52 and 53. .

Figures 52 and 53 are partial enlargements of Figures 4 and 6 respectively. Figure. In addition, the size is described using the optical fiber connector 1, and the dimensions of the optical fiber connector 1A to the optical fiber connector 1D to be described later are also the same.

In the present invention, the optical fiber is not limited. The term "diameter of the optical fiber" means the outer diameter of the coated optical fiber. When the coating is covered by the protective layer and inserted into the optical fiber guiding groove, it is attached. The outer diameter of the fiber of the protective layer. Further, the term "radius of the optical fiber" means a length which is half of the "diameter of the optical fiber" defined above.

The diameter of the optical fiber is preferably 200 μm or less. From the viewpoint of easily controlling the film thickness of the resin film for forming a core, it is more preferable to use an optical fiber having a diameter of 125 μm or a diameter of 80 μm.

The width W of the optical fiber guiding groove 32 is equal to or larger than the diameter R of the optical fiber 50 fixed to the optical fiber guiding member 2, and the height D1 of the optical guiding groove 32 is preferably equal to or larger than the diameter R of the optical fiber. Thereby, the optical fiber 50 can be inserted into the optical fiber guiding groove 32 satisfactorily.

The value α1 obtained by subtracting the radius r of the optical fiber 50 fixed to the optical fiber guiding member 2 from the distance D2 between the substrate 10 and the center of the optical signal transmitting core pattern 23b in the height direction is preferably 0.5 μm to 15 μm. The value α2 obtained by subtracting the diameter R of the optical fiber 50 from the height D1 of the optical fiber guiding groove 32 is preferably 1.0 μm to 30 μm. Thereby, the interval between the optical fiber 50 and the substrate 10 and the interval between the optical fiber 50 and the cover member 40 are narrowed, and the optical fiber 50 is disposed in the height direction of the optical fiber guiding groove 32 by the surface tension of the adhesive or the fluidity of the adhesive. In the approximate center, the core of the optical fiber 50 and the light transmission core pattern 23b can be aligned with high precision.

From the above viewpoints, the value α1 is more preferably from 0.5 μm to 7.5 μm, still more preferably from 0.5 μm to 5 μm. Further, the value α2 is more preferably 1.0 μm to 15 μm, still more preferably 1.0 μm to 10 μm.

Similarly, the value α3 obtained by subtracting the radius r of the optical fiber 50 fixed to the optical fiber guiding member 2 from the distance D3 between the center of the optical signal transmitting core pattern 23b in the height direction and the cover member 40 is preferably 0.5. From μm to 15 μm, more preferably from 0.5 μm to 7.5 μm, still more preferably from 0.5 μm to 5 μm. Thereby, the interval between the optical fiber 50 and the substrate 10 and the interval between the optical fiber 50 and the cover member 40 are narrowed, and the optical fiber 50 is disposed in the height direction of the optical fiber guiding groove 32 by the surface tension of the adhesive or the fluidity of the adhesive. Since the center is substantially at the center, the core of the optical fiber 50 and the light transmission core pattern 23b can be aligned with high precision.

From the same viewpoint, the absolute value α4 of the difference between the value α3 and the value α1 is preferably 0 μm to 7.5 μm, more preferably 0 μm to 5 μm, still more preferably 0 μm to 3 μm.

The value α5 obtained by subtracting the diameter R of the optical fiber from the width W of the optical fiber guiding groove 32 is more preferably 1.0 μm to 30 μm, and further preferably 1.0 μm to 15 μm from the viewpoint of the mounting property and the tolerance of the optical fiber. More preferably, it is 1.0 μm to 10 μm.

Further, the center line of the optical fiber insertion direction of the optical fiber guiding groove 32 and the center line of the optical path direction of the optical signal transmission core pattern 23b are preferably coincident. When the optical signal transmission core pattern 23b and the optical fiber guiding core pattern 23a are formed by photolithography in the same step, the center line of the optical fiber guiding groove 32 and the optical signal transmission core are used. Pattern 23b (core member) The center line of 23c) is designed in such a manner that the shape of the mask is identical to each other. The optical fiber to be used may be a multimode optical fiber having a core diameter of several tens of μm or more.

The length L of the fiber guiding groove 32 is preferably from 100 μm to 30 mm, more preferably from 300 μm to 10 mm, and still more preferably from 1 mm to 5 mm. When the thickness is 100 μm or more, the inclination of the optical fiber with respect to the longitudinal direction L of the optical fiber guiding groove 32 can be sufficiently prevented, and if it is 30 mm or less, the optical fiber connector can be miniaturized.

[Example]

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples as long as they do not depart from the gist of the invention.

[Production of Resin Film for Coating Layer Formation]

<(A) base polymer; (meth)acrylic polymer ((meth)acrylic polymer) (A-1)

In a flask including a stirrer, a cooling tube, a gas introduction tube, a dropping funnel, and a thermometer, 46 parts by mass of propylene glycol monomethyl ether acetate and 23 parts by mass of methyl lactate were weighed. The mixture was stirred while introducing a nitrogen gas. The liquid temperature was raised to 65 ° C, 47 parts by mass of methyl methacrylate, 33 parts by mass of butyl acrylate, and 16 parts by mass of hydroxyethyl methacrylate. 14 parts by mass of acryl, 3 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile), 46 parts by mass of propylene glycol monomethyl ether acetate, and 23 parts by mass of methyl lactate are 3 After dropping for an hour, stir at 65 ° C. 3 After further, stirring was continued at 95 ° C for 1 hour to obtain a (meth)acrylic polymer (A-1) solution (solid content: 45 mass%).

<Measurement of Weight Average Molecular Weight>

The weight average molecular weight (in terms of standard polystyrene) of (A-1) was measured by GPC ("SD-8022", "DP-8020" and "RI-8020" manufactured by Tosoh), and the result was 3.9. ×10 ⁴ . In addition, "Gelpack GL-A150-S" and "Gelpack GL-A160-S" manufactured by Hitachi Chemical Co., Ltd. are used for the column.

<Measurement of acid value>

The acid value of (A-1) was measured and found to be 79 mgKOH/g. Further, the acid value was calculated from the amount of the 0.1 mol/L potassium hydroxide aqueous solution required for the neutralization (A-1) solution. At this time, the point at which the phenolphthalein added as the indicator was changed from colorless to pink was set as the neutralization point.

<Measurement of viscosity of adhesive>

For the adhesive, an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., trade name VISCODIC ELD) was used, the measurement temperature was set to 25 ° C, the sample was set to 0.4 mL, and the number of revolutions was set to 20 min ^-1 . .

<Adjustment of Resin Varnish A for Coating Layer Formation>

The mixture was mixed while stirring as follows: (A) 84 parts by mass of the above-mentioned A-1 solution (solid content: 45 mass%) as a base polymer (38 parts by mass of solid content), and (B) having a photohardening component 33 parts by mass of (meth)acrylic acid urethane ("U-200AX" manufactured by Shin-Nakamura Chemical Co., Ltd.) and (meth)acrylic acid urethane having a polypropylene glycol skeleton (new Nakamura Chemical Industry Co., Ltd. manufactures "UA-4200") 15 parts by mass, (C) a polyfunctional isocyanurate type terpolymer of hexamethylene diisocyanate as a thermosetting component, protected by methyl ethyl ketone oxime Blocked Isocyanate solution (75% by mass of solid content) ("Sumijuir BL3175" manufactured by Sumika Bayer Urethane) 20 parts by mass (15 parts by mass of solid content), (D) 1 as photopolymerization initiator -[4-(2-hydroxyethoxy)benzene]-2-hydroxy-2-methyl-1-propyl-1-one ("Irgacure 2959" manufactured by Ciba Japan Co., Ltd.) 1 part by mass, double ( 2,4,6-trimethylbenzhydryl)diphenylphosphine ("Irgacure 819" manufactured by Ciba Japan Co., Ltd.) 1 part by mass, and propylene glycol monomethyl ether acetate (propylene) as an organic solvent for dilution Glycol monomethyl ether acetate) 23 parts by mass. After pressure filtration using a Polyflon filter ("van020" manufactured by Advantec Toyo Co., Ltd.) having a pore size of 2 μm, defoaming under reduced pressure was carried out to obtain a resin varnish A for coating layer formation.

The above-mentioned resin varnish A for coating layer formation was used, and a coater (multi coater TM-MC, hirano) was used on a non-treated surface of a PET film (COSMOSHINE A4100, manufactured by Toyobo Co., Ltd., thickness: 50 μm). The coating was carried out at 100 ° C for 20 minutes, and a PET film ("Purex A31" manufactured by Teijindupontfilm (25 cm) having a thickness of 25 μm) was attached as a protective film to obtain a coating layer. A resin film is used. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coater, and the thicknesses of the first lower cladding layer and the second lower cladding layer (adhesive layer) used in the present example are It is described in the example. Further, the film thickness after curing of the first lower cladding layer and the second lower cladding layer is the same as the film thickness after coating. The film thickness of the resin film for forming an upper cladding layer used in the present example is also described in the examples. The film thickness of the resin film for forming an upper cladding layer described in the examples is the film thickness after coating.

[Production of Resin Film for Core Layer Formation]

(A) 26 parts by mass of a phenoxy resin (trade name: Phenotohto YP-70. manufactured by Tosho Kasei Co., Ltd.) as a base polymer, and (B) 9,9 as a photopolymerizable compound, except as follows: Bis[4-(2-propenyloxyethoxy)phenyl] (trade name: A-BPEF, manufactured by Shin-Nakamura Chemical Co., Ltd.) 36 parts by mass, and bisphenol A type epoxy acrylate (commercial product) Name: EA-1020. Manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) 36 parts by mass, (C) bis(2,4,6-trimethylbenzylidene) oxidized diphenylphosphine as a photopolymerization initiator (bis(2,4,6-trimethylbenzoyl)phenyl phosphine oxide)) (trade name: Irgacure 819, manufactured by Ciba Japan Co., Ltd.) 1 part by mass, and 1-[4-(2-hydroxyethoxy)benzene ]-2-hydroxy-2-methyl-1-propyl-1-one (trade name: Irgacure 2959, manufactured by Ciba Japan Co., Ltd.) 1 part by mass, 40 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent The resin layer varnish B for core layer formation is blended in the same manner and under the same conditions as the production example of the resin varnish A for coating layer formation. Then, pressure filtration is carried out in the same manner and under the same conditions as in the production example of the resin varnish A for coating layer formation described above, and defoaming under reduced pressure is further performed.

In the non-treated surface of PET film (trade name: COSMOSHINE A1517, manufactured by Toyobo Co., Ltd., thickness: 16 μm), use and use In the same manner as in the production example, the resin layer varnish B for core layer formation obtained above was applied and dried, and then a release PET film (trade name: Purex A31, manufactured by Teijindupontfilm Co., thickness: 25 μm) as a protective film was released. A resin film for forming a core layer is obtained by attaching the surface to the resin side. At this time, the thickness of the resin layer can be arbitrarily adjusted by adjusting the gap of the coater, and the thickness of the resin film for forming a core layer used in the present example is described in the following examples. The film thickness of the resin film for forming a core layer described in the examples is the film thickness after coating.

[Production of substrate]

(formed by the electrical wiring of the subtractive method)

Polyimide film with a single-sided copper foil as a metal layer ((polyimide); Upilex VT (manufactured by Ube Nitto Kasei Co., Ltd.), thickness; 25 μm), (copper foil; NA-DFF (Mitsui metal) Mining (manufacturing), thickness; 9 μm)) of the copper foil surface, using a roll laminator (Hitachi Chemical Techno-plant, HLM-1500), with a pressure of 0.4 MPa, a temperature of 110 ° C, laminating speed 0.4 m/min, a photosensitive dry film resist (trade name: Photek, manufactured by Hitachi Chemical Co., Ltd., thickness: 25 μm), and then fabricated by an ultraviolet exposure machine (Oak Co., Ltd., EXM) -1172) Irradiation of ultraviolet rays (wavelength 365 nm) at 120 mJ/cm ² through a negative-type mask having a width of 50 μm from the photosensitive dry film resist side, and using a thin solution of 0.1% by weight to 5% by weight of sodium carbonate at 35 ° C The photosensitive dry film resist of the unexposed portion was removed. Then, the copper foil which has been exposed to the exposed dry film resist using a ferric chloride solution is removed by etching, and the exposure is performed using a 1% by weight to 10% by weight aqueous sodium hydroxide solution at 35 ° C. A part of the photosensitive dry film resist was removed, and an electric wiring having L (line width) / S (gap width) = 60 μm / 65 μm was formed to obtain a flexible wiring board.

(Formation of Ni/Au plating)

Then, the flexible wiring board is subjected to degreasing, soft etching, and acid cleaning, and is carried out at 25 ° C for 5 minutes in a sensitizer for electroless Ni plating (trade name: SA-100. manufactured by Hitachi Chemical Co., Ltd.). After immersion, it was washed with water, and immersed in an electroless Ni plating solution (manufactured by Okuno Pharmaceutical Co., Ltd., ICP nikoron GM-SD solution, pH 4.6) at 83 ° C for 8 minutes to form a Ni film of 3 μm, and then, by pure water. Carry out cleaning.

Next, impregnation at 85 ° C in displacement gold plating solution (100 mL; HGS-500 and 1.5 g; bath in potassium cyanide/L) (trade name: HGS-500. manufactured by Hitachi Chemical Co., Ltd.) A gold film of 0.06 μm was formed on the Ni film for 8 minutes. Thereby, a flexible wiring board in which the electric wiring portion without the cover film is coated with Ni plating and Au plating is obtained.

The 10 μm-thick resin film for forming a cladding layer obtained as the adhesive layer 13 was cut into a size of 100 mm × 100 mm, and the release PET film (Purex A31) as a protective film was peeled off, and the flexible wiring formed as described above was peeled off. The polyimine surface of the plate is used as a vacuum pressurizing laminator (made by the famous machine manufacturer, MVLP-500) as a flat type laminating machine. After vacuuming at 500 Pa or less, the pressure is 0.4 MPa. The electric wiring board with the second lower cladding layer was formed by heating and pressure bonding under the conditions of a temperature of 100 ° C and a pressurization time of 30 seconds. Ultraviolet light (wavelength 365 nm) was irradiated from the carrier film side at 4 J/cm ² by an ultraviolet exposure machine (EXM-1172), and then the carrier film was peeled off, and heat treatment was performed at 170 ° C for 1 hour. A substrate 10 having a second lower cladding layer having a thickness of 10 μm was formed.

Example 1 [Production of Fiber Connector 1A]

(Step 1)

The resin film for forming a lower cladding layer having a thickness of 20 μm obtained as described above was cut into a size of 100 μm × 100 μm, and the protective film was peeled off. On the second lower cladding layer side, under the same conditions as above, a vacuum stack was used. Join the machine and build up. The negative-type photomask having 95 μm × 3.0 mm × 4 non-exposed portions was irradiated with ultraviolet rays (wavelength 365 nm) at 250 mJ/cm ² from the side of the carrier film by an ultraviolet exposure machine (manufactured by Oak Co., Ltd., EXM-1172). . Then, the carrier film was peeled off, and the first lower cladding layer was etched using a developing solution (1% potassium carbonate aqueous solution). Then, water washing was performed, and the film was dried by heating and hardening at 170 ° C for 1 hour to form an opening of 95 μm × 3.0 mm in the fiber guiding groove forming portion. Thereby, the optical waveguide side first lower cladding layer 22b is formed in the optical waveguide 3 forming portion, and the optical fiber guiding side first lower cladding layer 22a is formed on the optical fiber guiding member 2 side.

(Step 2)

Next, on the first lower cladding layer described above, a roll laminator (manufactured by Hitachi Chemical Techno-plant Co., Ltd., HLM-1500) was used under the conditions of a pressure of 0.4 MPa, a temperature of 50 ° C, and a laminating speed of 0.2 m/min. The resin film for forming a core layer having a thickness of 50 μm from which the protective film was peeled off was laminated, and then vacuum-pressurized laminator (MVLP-500, manufactured by Nippon Seisakusho Co., Ltd.) was used, and vacuum was applied at 500 Pa or less. The heating and pressure bonding was carried out under the conditions of a pressure of 0.4 MPa, a temperature of 70 ° C, and a pressurization time of 30 seconds. Then, the core pattern width is 50 μm via the optical signal transmission (pattern pitch of the fiber connecting portion; 125 μm, pattern pitch of the optical path conversion mirror forming portion (the point where the fiber connecting portion is separated by 5 mm); 250 μm, 4), the optical fiber guiding core A negative mask having a pattern width of 40 μm (fiber groove pitch; 125 μm, four, only two ends of the fiber guiding core pattern: 150 μm) is formed on the first lower cladding layer by the optical signal transmission core pattern 23b. The fiber guiding groove 32 formed by the guiding core pattern 23a is formed on the substrate, is aligned in this manner, and is irradiated with ultraviolet rays (wavelength 365 nm) at 700 mJ/cm ² by the above ultraviolet exposure machine, and then at 80 ° C, Heating was performed after exposure for 5 minutes. Then, the PET film as a carrier film was peeled off, and a core pattern was etched using a developing solution (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 8/2, mass ratio). Then, it was washed with a cleaning liquid (isopropyl alcohol), and dried by heating at 100 ° C for 10 minutes to form an optical signal transmission core pattern 23b and an optical fiber guiding core pattern 23a, and at the same time, an optical fiber guiding groove of 85 μm width was formed. 32. Further, the size of each pattern of the optical fiber guiding core pattern 23a is designed such that the optical fiber is bonded to a position at which the optical signal can be transmitted and received to the optical signal transmission core pattern 23b when the optical fiber is fixed to the optical fiber guiding groove 32.

(Step 3)

Then, the upper cladding resin film having a thickness of 70 μm from which the protective film was peeled off was used from the side of the core pattern forming surface, and the above-described vacuum pressure type laminator (produced by Miyoshi Seisakusho Co., Ltd., MVLP-500) was used. After vacuuming at 500 Pa or less, it was heat-compressed and laminated under the conditions of a pressure of 0.35 MPa, a temperature of 110 ° C, and a pressurization time of 30 seconds. Further, after the negative mask used in the formation of the first lower cladding layer was irradiated with ultraviolet rays (wavelength: 365 nm) at 150 mJ/cm ² , the carrier film was peeled off, and the developing solution (1% potassium carbonate aqueous solution) was used to etch the upper portion. A resin film for forming a cladding layer. Then, it was washed with water, and dried and hardened at 170 ° C for 1 hour.

As described above, an optical fiber connector body having a pitch of 125 μm, a fiber diameter of 80 μm, and four channels was produced.

In the obtained optical fiber connector body, the lateral width of the optical fiber guiding groove 32 is 85 μm, and the height of the optical fiber guiding core pattern 23a (the height from the surface of the second lower cladding layer) is 70 μm, from the substrate surface to the upper side. The height of the upper surface of the cladding layer was 90 μm, and the thickness of the optical signal transmission core pattern 23b was 50 μm.

(Steps 5A and 6)

<Formation of optical path conversion mirror>

A 45-degree V-shaped groove 30 was formed using a cutter (DAC552, manufactured by Disco Co., Ltd.) from the upper cladding side of the obtained fiber connector body. Next, a metal mask having a mirror-forming portion opening was placed in the fiber-optic connector body of the lens, and a vapor deposition apparatus (RE-0025, developed by First Technology) was used to vapor-deposit Au as a vapor-deposited metal layer to 0.5 μm. Optical path conversion mirror 31.

(Step 4)

<Formation of cover material>

The protective film of the resin film for forming a cladding layer having a thickness of 10 μm obtained as the above-mentioned adhesive layer 42 was peeled off on the polyimide film (Upilex RN (manufactured by Ube Nitto Kasei Co., Ltd.), thickness; 25 μm). Same as above Under the condition, the cover material 40 with the adhesive layer 42 is formed by laminating by a vacuum laminator. Then, the carrier film of the resin film for forming a cladding layer laminated on the lid member 40 is peeled off, and the surface of the upper cladding layer of the above-mentioned optical fiber connector is formed, and vacuum lamination is performed under the same conditions as described above. The machine is heated and crimped. Next, it was heat-hardened at 180 ° C for 1 hour to form the optical fiber connector 1A with the cover material 40.

The height from the surface of the substrate 10 (second lower cladding layer 13) of the fiber guiding groove 32 to the bottom surface of the lid member 40 (the bottom surface of the adhesive layer 42 of the lid member) was 90 μm.

In the obtained optical fiber connector 1A, the thickness of the lower cladding layer was 20 μm, the thickness of the optical signal transmission core pattern 23b was 50 μm, and the upper cladding from the upper surface of the optical signal transmission core pattern 23b to the bottom surface of the cover member 40 was coated. The thickness of the layer was 20 μm, and the width of the fiber groove 32 was 80 μm.

(Step of forming the adhesive introduction slit)

In order to smooth the optical fiber connection end face of the obtained optical waveguide 3, a cutter (DAC 552, manufactured by Disco Co., Ltd.) was used to form an adhesive introduction slit 25A which also serves as a slit groove having a width of 40 μm. Then, the substrate 10 (a point separated from the end face of the optical waveguide by 3 mm) is cut in parallel with respect to the optical fiber guiding core pattern 23a, and the outer shape processing is performed so that the optical fiber guiding groove 32 appears on the end surface of the substrate.

The adhesive introduction slit 25A of the optical fiber connector 1A obtained as described above is dropped, and the above-described resin layer varnish for core layer formation as an adhesive is dropped, and inserted into the space formed by the optical fiber guiding groove 32 and the lid member 40. 125μm pitch, 4-channel fiber 50 (core diameter; 50μm, cladding diameter; 80μm), After heat curing at 180 ° C for 1 hour, the light transmission surface of the optical signal transmission core pattern 23b of the optical waveguide 3 was bonded, and the optical signal was transmitted from the optical fiber 50, and the optical loss was 1.53 dB. The results are shown in Table 1.

Example 2~Example 19

In the example 1, the thickness of the lower cladding resin film, the thickness of the resin film for forming a core layer, the thickness of the upper cladding resin film, and the shape of the negative pattern mask for core pattern formation are appropriately adjusted to connect the optical fibers. The dimensions of the respective portions of the device 1A are shown in Table 1 except that the same operation as in Example 1 was carried out. Further, in the same manner as in Example 1, the value of the light loss was measured. The results are shown in Tables 1 and 2.

Example 20 [Production of Fiber Connector 1]

(Step 1)

The same operation as in the first step of Example 1 was carried out, except that a resin film for forming a lower cladding layer of a thickness of 20 μm was used, and a resin film for forming a lower cladding layer having a thickness of 15 μm was used.

(Step 2)

The same operation as in the second step of Example 1 was carried out.

(Step 3)

A resin film for forming an upper cladding layer of a thickness of 70 μm was used instead of the resin film for forming an upper cladding layer of a thickness of 70 μm, and a pressure at the time of press-bonding was 0.4 MPa instead of 0.35 MPa, and Example 1 was carried out. The third step of the same operation.

(Step 5 and Step 6)

<Formation of slit groove>

Smoothing the fiber connection end face of the obtained fiber connector body Using a cutter (DAC552, manufactured by Disco Co., Ltd.), a slit groove 25 having a width of 40 μm was formed. Then, the substrate (the point separated from the end face of the optical waveguide by 3 mm) is cut in parallel with respect to the optical fiber guiding side core pattern 23a, and the outer shape processing is performed so that the optical fiber guiding groove 32 appears on the end surface of the substrate.

<Formation of optical path conversion mirror>

A 45° V-shaped groove 30 was formed using a cutter (DAC552, manufactured by Disco Co., Ltd.) from the upper cladding side of the obtained optical connector body. Next, a metal mask having a mirror-formed portion is placed in the lens-attached optical fiber connector, and Au as a vapor-deposited metal layer 12a is vapor-deposited by 0.5 μm using a vapor deposition device (RE-0025, developed by First Technology) to form an optical path. Conversion mirror 31.

(Step 4)

The same operation as in the fourth step of Example 1 was carried out except that the height from the surface of the substrate 10 to the bottom surface of the lid member 40 (the bottom surface of the adhesive layer of the lid member 40) was 82 μm instead of 90 μm.

The above-described resin varnish for forming a core layer is dropped from the fiber guiding groove 32 of the optical fiber connector 1 obtained as described above, and a space of 125 μm and 4 channels are inserted in a space formed by the fiber guiding groove 32 and the lid member 40. The optical fiber 50 (core diameter; 50 μm, cladding diameter; 80 μm) is heat-hardened at 180 ° C for 1 hour, and then bonded to the light transmission surface of the optical signal transmission core pattern 23b of the optical waveguide 3, thereby being able to be transmitted from the optical fiber 50. The optical signal, and the optical fiber 50 is also not offset.

Example 21 [Production of Fiber Connector 1A]

(Step 1)

The same operation as in the first step of Example 1 was carried out, except that a resin film for forming a lower cladding layer of 20 μm thick was used instead of a resin film for forming a lower cladding layer having a thickness of 15 μm.

(Step 2)

The same operation as in the second step of Example 1 was carried out.

(Step 3)

The resin film for forming an upper cladding layer of 85 μm thick was used instead of the resin film for forming the upper cladding layer of 70 μm thick, and the pressure at the time of pressure bonding was 0.4 MPa instead of 0.35 MPa, and Example 1 was carried out. The third step of the same operation.

(Step 5A, Step 6)

The same operations as in the fifth step and the sixth step of the example 1 were carried out.

(Step 4)

The same operation as in the fourth step of Example 1 was carried out except that the height from the surface of the substrate 10 to the bottom surface of the lid member 40 (the bottom surface of the adhesive layer of the lid member 40) was 82 μm instead of 90 μm.

(Step of forming the adhesive introduction slit)

The same operation as the step of forming the adhesive introduction slit of Example 1 was carried out, thereby obtaining the optical fiber connector 1A.

The resin layer varnish for core layer formation described above was dropped from the adhesive introduction slit 25A of the optical fiber connector 1A obtained as described above, and a space of 125 μm was inserted into the space formed by the optical fiber guiding groove 32 and the lid member 40. aisle The optical fiber 50 (core diameter; 50 μm, cladding diameter; 80 μm) is heat-hardened at 180 ° C for 1 hour, and then bonded to the light transmission surface of the optical signal transmission core pattern 23b of the optical waveguide 3, thereby being able to be transmitted from the optical fiber 50. The optical signal, and the optical fiber 50 is also not offset.

Example 22 [Production of Optical Fiber Connector 1B]

The same operation as in Example 21 was carried out except that the steps of forming the adhesive into the slit were as follows.

(Step of forming the adhesive introduction slit)

In order to smooth the optical fiber connection end face of the obtained optical waveguide 3, an adhesive introduction slit 25B which also serves as a slit groove having a width of 40 μm is formed using a cutter (DAC552, manufactured by Disco Co., Ltd.). Then, the cover member 40 (a point separated from the end face of the optical waveguide by 3 mm) is cut in parallel with respect to the optical fiber-guide core pattern 23a, and the outer shape processing is performed so that the optical fiber guiding groove 32 appears on the end surface of the cover member.

The resin layer varnish for core layer formation described above was dropped from the adhesive introduction slit 25B of the optical fiber connector 1B obtained as described above, and a space of 125 μm was inserted into the space formed by the optical fiber guiding groove 32 and the lid member 40. The optical fiber 50 (core diameter; 50 μm, cladding diameter; 80 μm) of the channel is heat-hardened at 180 ° C for 1 hour, and then bonded to the light transmission surface of the optical signal transmission core pattern 23b of the optical waveguide 3, thereby being able to be obtained from the optical fiber 50. The optical signal is transmitted and the optical fiber 50 is not offset.

Example 23 [Production of optical fiber connector 1C]

After the fourth step, the same operation as in Example 20 was carried out except that the steps of forming the adhesive introduction slit described below were carried out.

(Step of forming the adhesive introduction slit)

An adhesive introduction slit 25C having a width of 40 μm was formed using a cutter (DAC552, manufactured by Disco Co., Ltd.). The adhesive introduction slit 25C is formed by cutting the cover member 40 (a position separated from the end face of the optical waveguide by 3 mm) in parallel with respect to the optical fiber guiding core pattern 23a to form a fiber guiding groove at the end surface of the cover member. The shape of 32 is processed in the shape.

The resin layer varnish for forming a core layer is dropped from the adhesive introduction slit 25C of the optical fiber connector 1C obtained as described above, and a space of 125 μm is inserted into a space formed by the optical fiber guiding groove 32 and the lid member 40. The optical fiber 50 (core diameter; 50 μm, cladding diameter; 80 μm) of the channel is heat-hardened at 180 ° C for 1 hour, and then bonded to the light transmission surface of the optical signal transmission core pattern 23b of the optical waveguide 3, thereby being able to be obtained from the optical fiber 50. The optical signal is transmitted and the optical fiber 50 is not offset.

Example 24 [Production of optical fiber connector 1D]

After the fourth step, the same operation as in Example 20 was carried out except that the steps of forming the adhesive introduction slit described below were carried out.

(Step of forming the adhesive introduction slit)

In order to smooth the optical fiber connection end face of the optical waveguide 3 obtained, a dicing machine (DAC 552, manufactured by Disco Co., Ltd.) was used to form an adhesive introduction slit 25D which also serves as a slit groove having a width of 40 μm. The adhesive introduction slit 25D is formed by: relative to the optical fiber-guide core pattern 23a cuts the substrate 10 in parallel (a position separated from the end face of the optical waveguide by 3 mm), and performs profile processing so that the fiber guiding groove 32 appears on the end surface of the lid member.

The resin layer varnish for forming a core layer is dropped from the adhesive introduction slit 25D of the optical fiber connector 1D obtained as described above, and a space of 125 μm is inserted into a space formed by the optical fiber guiding groove 32 and the lid member 40. The optical fiber 50 (core diameter; 50 μm, cladding diameter; 80 μm) of the channel is heat-hardened at 180 ° C for 1 hour, and then bonded to the light transmission surface of the optical signal transmission core pattern 23b of the optical waveguide 3, thereby being able to be obtained from the optical fiber 50. The optical signal is transmitted and the optical fiber 50 is not offset.

[Industrial availability]

As described in detail above, the optical fiber connector of the present invention can easily position the optical fiber and the optical waveguide core without depending on the substrate, and the position of the optical fiber is not easily shifted. Moreover, the optical fiber and the optical waveguide can be easily combined by inserting the optical fiber into the space formed by the groove and the cover material.

Therefore, it can be effectively used as a photoelectric conversion substrate for an optical fiber or the like.

1, 1A, 1B, 1C, 1D‧‧‧ fiber optic connectors

2‧‧‧Fiber guiding member

3‧‧‧ optical waveguide

10‧‧‧Substrate

10a‧‧‧Fibre guide side substrate

10b‧‧‧Optical waveguide side substrate

11‧‧‧Substrate body

12‧‧‧Metal wiring

12a‧‧‧metal layer

13‧‧‧Adhesive layer

22a‧‧‧1st lower cladding on the fiber guiding side

22b‧‧‧1st lower cladding on the optical waveguide side

23a‧‧‧Fiber guide core pattern

23b‧‧‧Light signal transmission core pattern

23c‧‧‧ core components

24a‧‧‧Film guiding side upper cladding

24b‧‧‧ optical waveguide side upper cladding

25‧‧‧Slit trench

25A, 25B, 25C, 25D‧‧‧Adhesive introduction slit

26‧‧‧Fiber guide pattern

30‧‧‧V-groove

31‧‧‧Light path conversion mirror

32‧‧‧Fiber guiding groove

40‧‧‧Cleaning

40a‧‧‧Fibre guide side cover

40b‧‧‧Light waveguide side cover part

41‧‧‧ cover body

42‧‧‧Adhesive layer

50‧‧‧ fiber

60‧‧‧Adhesive

70, 70A, 70B, 70C‧‧‧ assembly

122‧‧‧1st lower cover sheet on the fiber guiding side

123‧‧‧Fiber guide chip

124‧‧‧Film guiding side upper cover sheet

126‧‧‧Guide members

Lines A, B, C, D‧‧

D1‧‧‧ Height of fiber guiding groove

D2‧‧‧Distance between the substrate and the center of the height direction of the core pattern for optical signal transmission

D3‧‧‧ Distance between the center of the height direction of the core pattern of the optical signal transmission and the cover material

r‧‧‧The radius of the fiber

R‧‧‧diameter of fiber

W‧‧‧Width of fiber guiding groove

Fig. 1 is a plan view showing the optical connector 1 of the first embodiment.

Fig. 2 is a perspective view showing the optical connector 1 of the first embodiment.

Fig. 3 is an end view taken along line A-A of Fig. 1.

Fig. 4 is an end view taken along line B-B of Fig. 1.

Fig. 5 is an end view taken along line C-C of Fig. 1.

Fig. 6 is an end view taken along line D-D of Fig. 1.

7 is a view showing a phase of a first manufacturing step of a substrate of the optical fiber connector 1. An end view of the portion of the line A-A in Fig. 1.

8 is an end view showing a portion corresponding to a line C-C of FIG. 1 in a first manufacturing step of the substrate of the optical fiber connector 1.

FIG. 9 is an end view showing a portion corresponding to the line A-A of FIG. 1 in the second manufacturing step of the substrate of the optical fiber connector 1.

FIG. 10 is an end view showing a portion corresponding to the line C-C of FIG. 1 in the second manufacturing step of the substrate of the optical fiber connector 1.

FIG. 11 is an end view showing a portion corresponding to the line A-A of FIG. 1 in the third manufacturing step of the substrate of the optical fiber connector 1.

FIG. 12 is an end view showing a portion corresponding to a line C-C of FIG. 1 in a third manufacturing step of the substrate of the optical fiber connector 1.

FIG. 13 is an end view showing a portion corresponding to the line A-A of FIG. 1 in the first step of the optical fiber connector 1.

FIG. 14 is an end view showing a portion corresponding to the line B-B of FIG. 1 in the first step of the optical fiber connector 1.

FIG. 15 is an end view showing a portion corresponding to the line C-C of FIG. 1 in the first step of the optical fiber connector 1.

FIG. 16 is an end view showing a portion corresponding to the line D-D of FIG. 1 in the first step of the optical fiber connector 1.

Fig. 17 is an end elevational view showing a portion corresponding to the line A-A of Fig. 1 in the second step of the optical fiber connector 1.

FIG. 18 is an end view showing a portion corresponding to the line B-B of FIG. 1 in the second step of the optical fiber connector 1.

19 is a view corresponding to the first step of the second step of the optical fiber connector 1. An end view of the portion of the C-C line of the figure.

FIG. 20 is an end view showing a portion corresponding to the D-D line of FIG. 1 in the second step of the optical fiber connector 1.

FIG. 21 is an end view showing a portion corresponding to the line A-A of FIG. 1 in the third step of the optical fiber connector 1.

FIG. 22 is an end view showing a portion corresponding to the line B-B of FIG. 1 in the third step of the optical fiber connector 1.

FIG. 23 is an end view showing a portion corresponding to the line C-C of FIG. 1 in the third step of the optical fiber connector 1.

FIG. 24 is an end view showing a portion corresponding to the D-D line of FIG. 1 in the third step of the optical fiber connector 1.

FIG. 25 is a perspective view showing a fifth step and a sixth step of the optical fiber connector 1.

FIG. 26 is an end view showing a portion corresponding to the line A-A of FIG. 1 in the fifth step and the sixth step of the optical fiber connector 1.

FIG. 27 is an end view showing a portion corresponding to the line B-B of FIG. 1 in the fifth step and the sixth step of the optical fiber connector 1.

FIG. 28 is an end view showing a portion corresponding to the line A-A of FIG. 1 in the sixth step of the optical fiber connector 1.

FIG. 29 is an end view showing a portion corresponding to the line B-B of FIG. 1 in the sixth step of the optical fiber connector 1.

Fig. 30 is an end view of a portion of the optical fiber connector 1A corresponding to the line A-A of Fig. 1;

Fig. 31 is a portion of the optical fiber connector 1A corresponding to the line B-B of Fig. 1; The end view of the bit.

Fig. 32 is an end elevational view of a portion of the optical fiber connector 1A corresponding to the line C-C of Fig. 1;

Fig. 33 is an end elevational view of a portion of the optical fiber connector 1A corresponding to the line D-D of Fig. 1;

Fig. 34 is an end elevational view showing a portion corresponding to the line A-A of Fig. 1 in the fifth step of the optical fiber connector 1A.

35 is an end view showing a portion corresponding to the line B-B of the first drawing in the fifth step of the optical fiber connector 1A.

Fig. 36 is an end elevational view showing a portion corresponding to the line C-C of Fig. 1 in the fifth step of the optical fiber connector 1A.

Fig. 37 is an end elevational view showing a portion corresponding to the line D-D of Fig. 1 in the fifth step of the optical fiber connector 1A.

38 is an end view showing a portion corresponding to the line A-A of Fig. 1 in the sixth step of the optical fiber connector 1A.

Fig. 39 is an end elevational view showing a portion corresponding to the line B-B of Fig. 1 in the sixth step of the optical fiber connector 1A.

Fig. 40 is an end elevational view showing a portion corresponding to the line A-A of Fig. 1 in the fourth step of the optical fiber connector 1A.

Fig. 41 is an end elevational view showing a portion corresponding to the line B-B of Fig. 1 in the fourth step of the optical fiber connector 1A.

Fig. 42 is an end elevational view showing a portion corresponding to the line C-C of Fig. 1 in the fourth step of the optical fiber connector 1A.

Figure 43 is a view showing the first step of the fourth step of the optical fiber connector 1A. An end view of the portion of the D-D line of the figure.

Fig. 44 is an end view of a portion of the optical fiber connector 1B corresponding to the line A-A of Fig. 1;

Fig. 45 is an end view of a portion of the optical fiber connector 1B corresponding to the line B-B of Fig. 1;

Fig. 46 is an end elevational view of a portion of the optical fiber connector 1C corresponding to the line A-A of Fig. 1;

Fig. 47 is an end view of a portion of the optical fiber connector 1C corresponding to the line B-B of Fig. 1;

Fig. 48 is a cross-sectional view showing a method of connecting the optical fiber connector 1 and the optical fiber assembly 70, and the optical fiber connector and the optical fiber.

Fig. 49 is a cross-sectional view showing a method of connecting the optical fiber connector 1A and the optical fiber assembly 70A, and the optical fiber connector and the optical fiber.

Fig. 50 is a cross-sectional view showing a method of connecting the optical fiber connector 1B and the optical fiber assembly 70B and the optical fiber connector and the optical fiber.

Fig. 51 is a cross-sectional view showing a method of connecting the optical fiber connector 1C and the optical fiber assembly 70C and the optical fiber connector and the optical fiber.

Figure 52 is a partial enlarged view of Figure 4;

Figure 53 is a partial enlarged view of Figure 6.

Fig. 54 is an end elevational view of a portion of the optical fiber connector 1D corresponding to the line A-A of Fig. 1;

Fig. 55 is an end elevational view of a portion of the optical fiber connector 1D corresponding to the line B-B of Fig. 1;

1‧‧‧Fiber optic connector

2‧‧‧Fiber guiding member

3‧‧‧ optical waveguide

23c‧‧‧ core components

30‧‧‧V-groove

31‧‧‧Light path conversion mirror

32‧‧‧Fiber guiding groove

126‧‧‧Guide members

Claims (17)

An optical fiber connector comprising: a fiber guiding member and an optical waveguide, the fiber guiding member comprising: a fiber guiding side substrate portion constituting a part of the substrate; a fiber guiding pattern on the fiber guiding side substrate portion; and covering a cover member for the optical fiber guiding pattern; the optical waveguide includes: an optical waveguide side substrate portion adjacent to the optical fiber guiding side substrate portion of the substrate; and an optical waveguide side first lower cladding layer on the optical waveguide side substrate portion And an optical signal transmission core pattern on the first lower cladding layer on the optical waveguide side; and an optical waveguide side upper cladding layer on the optical signal transmission core pattern, wherein the optical fiber guiding pattern is juxtaposed at intervals a plurality of guiding members, a space between the adjacent two guiding members, the optical fiber guiding side substrate portion, and the optical fiber guiding side cover member is a fiber guiding groove, and the optical signal transmitting core pattern is The optical fiber guiding groove is present on an extension line of the optical path direction, and the V-shaped groove is provided from the optical waveguide-side upper cladding layer over the optical signal transmission core pattern, and the V-shaped groove Optical fiber guide groove to the surface of the side member to the optical path conversion mirror, The optical waveguide includes an optical path conversion mirror on an optical path of the optical signal transmission core pattern, and the cover member includes an optical fiber guiding side cover member covering the optical fiber guiding pattern side; and an optical waveguide side covering the optical path conversion mirror In the lid member, the optical waveguide side cover member serves as the optical path conversion mirror reinforcing portion. The optical fiber connector according to claim 1, wherein the optical fiber guiding pattern comprises: a first lower cladding layer on a fiber guiding side of the optical fiber guiding side substrate portion; and the optical fiber guiding side substrate portion a fiber guiding core pattern; and a fiber guiding side upper cladding layer on the fiber guiding core pattern. The optical fiber connector according to claim 1 or 2, wherein the optical fiber guiding member includes an adhesive introduction slit that communicates an outer portion of the optical fiber guiding member with the optical fiber guiding groove. The optical fiber connector according to the first or second aspect of the invention, wherein the optical waveguide side first lower cladding layer and the optical fiber guiding side first lower cladding layer are present on the substrate The surface layer is an adhesive layer. The optical fiber connector of claim 4, wherein the adhesive layer is a second lower cladding layer. The optical fiber connector of claim 1, wherein the substrate is an electrical wiring board. The optical fiber connector of claim 1, wherein the width of the optical fiber guiding groove is an optical fiber fixed to the optical fiber guiding member Above the diameter, the height of the above-mentioned fiber guiding groove is equal to or larger than the diameter of the above fiber. The optical fiber connector according to claim 1, wherein a distance between the substrate and a center of a height direction of the optical signal transmission core pattern is subtracted from a radius of an optical fiber fixed to the optical fiber guiding member. The value α1 is 0.5 μm to 15 μm, and the value α2 obtained by subtracting the diameter of the above-mentioned optical fiber from the height of the above-mentioned optical fiber guiding groove is 1.0 μm to 30 μm. The optical fiber connector according to claim 8, wherein a distance from a center of a height direction of the optical signal transmission core pattern to the cover material is subtracted from a radius of an optical fiber fixed to the optical fiber guiding member. The value α3 is 0.5 μm to 15 μm. The optical fiber connector according to claim 9, wherein the distance between the center of the height direction of the optical signal transmission core pattern and the cover material is subtracted from the radius of the optical fiber fixed to the optical fiber guiding member. The absolute value α4 of the difference between the value α3 and the value α1 is 0 μm to 7.5 μm. The optical fiber connector according to claim 1, wherein a value α5 obtained by subtracting a diameter of the optical fiber from the width of the optical fiber guiding groove is 1.0 μm to 30 μm. A method of manufacturing an optical fiber connector according to any one of claims 1 to 11, further comprising: a first step of laminating a first lower cladding on the substrate After the layer, the first lower cladding layer existing in the portion where the fiber guiding trench is to be formed is removed by etching to form the first lower cladding layer on the optical waveguide side; In the second step, after the resin layer for forming a core is laminated on the substrate on which the first lower cladding layer on the optical waveguide side is formed, the optical fiber guiding core pattern and the optical signal transmission core pattern are formed by etching once; In the step of forming the resin layer for forming the upper cladding layer on the substrate on which the optical fiber guiding core pattern and the optical signal transmitting core pattern are formed, the etching is performed on the portion where the optical fiber guiding groove should be formed. The upper cladding layer is formed by removing the resin layer to form a fiber guiding side upper cladding layer, an optical waveguide side upper cladding layer, and a fiber guiding trench; a step of forming a V-shaped trench, the V-shaped trench The optical waveguide side upper cladding layer reaches the optical signal transmission core pattern; and the optical path conversion mirror includes a metal layer formed on the surface of the V-shaped groove on the side of the optical fiber guiding member And a fourth step of forming a cover material covering the fiber guiding groove and the fiber guiding groove. The method of manufacturing the optical fiber connector according to claim 12, wherein after the third step, the fifth step is included, the fifth step along the optical fiber guiding groove and the optical waveguide side lower cladding layer The boundary forms a slit groove on the surface of the substrate. The method of manufacturing the optical fiber connector according to Item 12 or 13, wherein after the third step or after the fourth step, the adhesion is formed through the thickness direction of the substrate and communicates with the fiber guiding groove. The agent is introduced into the slit. The method for manufacturing a fiber optic connector according to claim 12, wherein after the fourth step, the thickness of the through-cover member is formed. The adhesive introduction slit is connected to the fiber guiding groove in the direction of the direction. A method of connecting a fiber optic connector and an optical fiber, comprising: filling an optical fiber guiding groove of the optical fiber connector according to any one of claims 1 to 11 and inserting the configuration optical fiber. An optical fiber connector and an optical fiber assembly, comprising: the optical fiber connector according to any one of claims 1 to 11, and an optical fiber disposed in the optical fiber guiding groove of the optical fiber connector; Adhesive.