TWI573998B - Optical inspection device - Google Patents
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- TWI573998B TWI573998B TW104143584A TW104143584A TWI573998B TW I573998 B TWI573998 B TW I573998B TW 104143584 A TW104143584 A TW 104143584A TW 104143584 A TW104143584 A TW 104143584A TW I573998 B TWI573998 B TW I573998B
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Description
本發明是有關於一種光學檢測裝置。 The present invention relates to an optical detecting device.
隨著科技的進步,越來越多的電子產品開始使用金屬材質作為殼體,以增加產品的美觀。金屬殼體可藉由機械加工(例如銑床或車床)而得到需求的形狀與特徵,這些形狀與特徵可利用光學儀器擷取其影像作檢測。然而加工過後,金屬表面可能會變得粗糙(例如加工所產生的刀紋),如此一來,光學儀器所擷取的影像可能會包含粗糙表面的資訊,使得量測不穩定,甚至無法量測出欲檢測的特徵。 With the advancement of technology, more and more electronic products are beginning to use metal materials as the shell to increase the aesthetics of the products. The metal casing can be machined (e.g., a milling machine or a lathe) to obtain the desired shape and features that can be imaged for inspection using optical instruments. However, after processing, the metal surface may become rough (for example, the stencil generated by the processing), so that the image captured by the optical instrument may contain information on the rough surface, making the measurement unstable or even impossible to measure. The characteristics to be detected.
本發明之一態樣提供一種光學檢測裝置,包含取像裝置、面光源與固定架。取像裝置具有取像位置。面光源置於取像裝置與取像位置之間。面光源包含導光板與發光元件。導光板具有第一出光面、第二出光面與入光面。第一出光面與該二出光面相對設置,且入光面連接第一出光面與第二出光面。取像裝置面對導光板之第二出光面設置。發光元件面對導光板之入光面設置。發光元件發出之光束自入光 面進入導光板,由導光板之第一出光面離開並進入取像位置,且自取像位置反射之光束穿透導光板之第一出光面與第二出光面而進入取像裝置。固定架連接該取像裝置與該面光源,且至少包圍該取像裝置與該面光源之間的空間。 One aspect of the present invention provides an optical detecting apparatus including an image taking device, a surface light source, and a holder. The image taking device has an image taking position. The surface light source is placed between the image capturing device and the image taking position. The surface light source includes a light guide plate and a light emitting element. The light guide plate has a first light emitting surface, a second light emitting surface and a light incident surface. The first light emitting surface is opposite to the two light emitting surfaces, and the light incident surface is connected to the first light emitting surface and the second light emitting surface. The image capturing device is disposed facing the second light emitting surface of the light guide plate. The light emitting element is disposed facing the light incident surface of the light guide plate. Light beam emitted by the light-emitting element The surface enters the light guide plate, and the first light exiting surface of the light guide plate exits and enters the image capturing position, and the light beam reflected from the image capturing position penetrates the first light emitting surface and the second light emitting surface of the light guiding plate to enter the image capturing device. The fixing frame connects the image capturing device and the surface light source, and at least surrounds a space between the image capturing device and the surface light source.
因在上述實施方式中,面光源置於取像裝置與取像位置之間,因此光束不會在待測物上形成取像裝置的陰影,此種設置即為無影式檢測裝置,且本實施方式之光學檢測裝置對於取像裝置的工作距離的選擇有較大的自由度。另外,上述實施方式之光學檢測裝置所擷取之待測物影像,其特徵能被加強,同時粗糙表面的影像被壓抑,使得待測物的特徵能夠被突顯,以取得清晰的待測物之特徵影像。固定架可隔絕環境光。 In the above embodiment, the surface light source is disposed between the image capturing device and the image capturing position, so that the light beam does not form a shadow of the image capturing device on the object to be tested, and the setting is a shadowless detecting device, and The optical detecting device of the embodiment has a large degree of freedom in selecting the working distance of the image capturing device. In addition, the image of the object to be tested captured by the optical detecting device of the above embodiment can be enhanced, and the image of the rough surface is suppressed, so that the feature of the object to be tested can be highlighted to obtain a clear object to be tested. Feature image. The holder isolates ambient light.
100‧‧‧取像裝置 100‧‧‧Image capture device
102‧‧‧收光面 102‧‧‧ Receiving surface
110‧‧‧取像位置 110‧‧‧Image location
200‧‧‧面光源 200‧‧‧ surface light source
210‧‧‧導光板 210‧‧‧Light guide plate
212‧‧‧第一出光面 212‧‧‧The first glazing
214‧‧‧第二出光面 214‧‧‧Second glazing
216‧‧‧入光面 216‧‧‧ into the glossy surface
220‧‧‧發光元件 220‧‧‧Lighting elements
222、224‧‧‧光束 222, 224 ‧ ‧ beam
230‧‧‧散射元件 230‧‧‧scattering elements
232‧‧‧黑色覆蓋層 232‧‧‧Black cover
234‧‧‧白色顆粒 234‧‧‧White particles
300‧‧‧固定架 300‧‧‧ fixed frame
900‧‧‧待測物 900‧‧‧Test object
D‧‧‧工作距離 D‧‧‧Working distance
第1圖為本發明一實施方式之光學檢測裝置的示意圖。 Fig. 1 is a schematic view showing an optical detecting device according to an embodiment of the present invention.
第2圖為第1圖之面光源的放大圖。 Fig. 2 is an enlarged view of the surface light source of Fig. 1.
第3圖為第1圖之導光板的上視圖。 Fig. 3 is a top view of the light guide plate of Fig. 1.
以下將以圖式揭露本發明的複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必 要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the present invention, these practical details are not necessarily need. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖為本發明一實施方式之光學檢測裝置的示意圖。光學檢測裝置包含取像裝置100與面光源200。取像裝置100具有取像位置110。取像位置110與取像裝置100實質相距取像裝置100之工作距離(Working Distance)D,因此取像裝置100主要係擷取置於取像位置110中的待測物900之影像。面光源200置於取像裝置100與取像位置110之間。面光源200包含導光板210與發光元件220。導光板210具有第一出光面212、第二出光面214與入光面216。第一出光面212與第二出光面214相對設置,且入光面216連接第一出光面212與第二出光面214。取像裝置100面對導光板210之第二出光面214設置。發光元件220面對導光板210之入光面216設置。發光元件220發出之光束222自入光面216進入導光板210,由導光板210之第一出光面212離開並進入取像位置110,且自取像位置110反射之光束224穿透導光板210之第一出光面212與第二出光面214而進入取像裝置100。 Fig. 1 is a schematic view showing an optical detecting device according to an embodiment of the present invention. The optical detecting device includes the image capturing device 100 and the surface light source 200. The image capturing device 100 has an image capturing position 110. The image capturing device 100 is substantially separated from the image capturing device 100 by a working distance D of the image capturing device 100. Therefore, the image capturing device 100 mainly captures an image of the object to be tested 900 placed in the image capturing position 110. The surface light source 200 is placed between the image capturing device 100 and the image capturing position 110. The surface light source 200 includes a light guide plate 210 and a light emitting element 220. The light guide plate 210 has a first light emitting surface 212, a second light emitting surface 214, and a light incident surface 216. The first light-emitting surface 212 is opposite to the second light-emitting surface 214 , and the light-incident surface 216 is connected to the first light-emitting surface 212 and the second light-emitting surface 214 . The image capturing device 100 is disposed facing the second light emitting surface 214 of the light guide plate 210. The light emitting element 220 is disposed facing the light incident surface 216 of the light guide plate 210. The light beam 222 emitted from the light-emitting element 220 enters the light guide plate 210 from the light-incident surface 216, exits from the first light-emitting surface 212 of the light guide plate 210, and enters the image capturing position 110, and the light beam 224 reflected from the image capturing position 110 penetrates the light guide plate 210. The first light-emitting surface 212 and the second light-emitting surface 214 enter the image capturing device 100.
因在本實施方式中,面光源200置於取像裝置100與取像位置110之間,因此光束222不會在待測物900上形成取像裝置100的陰影,此種設置即為無影式檢測裝置。再者,面光源200之高度相較於長度與寬度皆較小,因此即使取像裝置100具有較小的工作距離D,面光源200仍然可置於取像裝置100與取像位置110之間。換言之,本實 施方式之光學檢測裝置對於取像裝置100的工作距離D的選擇有較大的自由度。對於大口徑的取像裝置100而言,工作距離D亦不需因此增加(相對於使用45度分光鏡之光源系統,其光源尺寸會隨取像裝置的口徑增加而增加),因此不會有光源尺寸過大而遮蔽視角(如側向收光)的問題。另外,在一些實施方式中,待測物900可為一金屬殼體,例如為經過機械加工、表面具有刀紋的金屬殼體。對於一個表面粗糙之待測物900而言,本實施方式之光學檢測裝置所擷取之待測物900影像,其特徵能被加強,同時粗糙表面的影像被壓抑,使得待測物900的特徵能夠被突顯,以取得清晰的待測物900之特徵影像。換言之,面光源200能夠過濾待測物900之粗糙表面所造成的影像雜訊,進而留下待測物900之特徵。如此一來,待測物900可不需經過表面處理(例如噴砂處理)即可作檢測,可大幅簡化製程。 In the present embodiment, the surface light source 200 is placed between the image capturing device 100 and the image capturing position 110, so that the light beam 222 does not form a shadow on the image capturing device 100 on the object to be tested 900. Type detection device. Moreover, the height of the surface light source 200 is smaller than the length and the width, so even if the image capturing apparatus 100 has a small working distance D, the surface light source 200 can be placed between the image capturing device 100 and the image capturing position 110. . In other words, this is The optical detecting device of the embodiment has a large degree of freedom in selecting the working distance D of the image capturing device 100. For the large-diameter image capturing device 100, the working distance D does not need to be increased accordingly (relative to the light source system using the 45-degree beam splitter, the size of the light source increases as the aperture of the image capturing device increases), so there is no The problem that the size of the light source is too large to obscure the viewing angle (such as lateral light collection). In addition, in some embodiments, the object to be tested 900 may be a metal casing, such as a metal casing that is machined and has a knife surface. For a rough surface of the object to be tested 900, the image of the object to be tested 900 captured by the optical detecting device of the present embodiment can be enhanced, and the image of the rough surface is suppressed, so that the characteristics of the object to be tested 900 are Can be highlighted to obtain a clear feature image of the object to be tested 900. In other words, the surface light source 200 is capable of filtering image noise caused by the rough surface of the object to be tested 900, thereby leaving the features of the object to be tested 900. In this way, the object to be tested 900 can be tested without surface treatment (for example, sand blasting), which greatly simplifies the process.
在本實施方式中,發光元件220可為燈條,例如發光二極體燈條,然而本發明不以此為限。發光元件220所發出之光束222的波長可依實際情況作調整,以配合取像裝置100之收光波段。舉例而言,發光元件220之波長可位於可見光之波長範圍中。 In the present embodiment, the light-emitting element 220 can be a light bar, such as a light-emitting diode light bar, but the invention is not limited thereto. The wavelength of the light beam 222 emitted by the light-emitting element 220 can be adjusted according to the actual situation to match the light-receiving band of the image capturing device 100. For example, the wavelength of the light-emitting element 220 can be in the wavelength range of visible light.
接著請一併參照第1圖與第2圖,其中第2圖為第1圖之面光源200的放大圖。在本實施方式中,面光源200更包含複數個散射元件230,設置於導光板210之第二出光面214。當光束222射至散射元件230時,散射元件230可改變光束222的行進方向,不但能使得光束222在導光板210 中充分混合,以增加面光源200的光均勻度,亦可將自入光面216入射的光束222導引至第一出光面212,以讓光束222自第一出光面212離開導光板210並照射至位於取像裝置100之取像位置110的待測物900上。 Next, please refer to FIG. 1 and FIG. 2 together, and FIG. 2 is an enlarged view of the surface light source 200 of FIG. In the present embodiment, the surface light source 200 further includes a plurality of scattering elements 230 disposed on the second light-emitting surface 214 of the light guide plate 210. When the beam 222 is incident on the scattering element 230, the scattering element 230 can change the direction of travel of the beam 222, such that the beam 222 can be caused to be on the light guide plate 210. The light beam 222 incident from the light incident surface 216 is guided to the first light exit surface 212 to allow the light beam 222 to exit the light guide plate 210 from the first light exit surface 212. The object to be tested 900 located at the image capturing position 110 of the image capturing apparatus 100 is irradiated.
在第2圖中,散射元件230之尺寸較為誇張化,以表現出其內部特徵,然而在實際應用下,散射元件230之尺寸可小於取像裝置100(如第1圖所繪示)的解析度,更進一步的,散射元件230可位於取像裝置100之景深外,如此可減少散射元件230於取像裝置100成像的機會。 In FIG. 2, the size of the scattering element 230 is exaggerated to exhibit its internal features. However, in practical applications, the size of the scattering element 230 can be smaller than that of the image capturing apparatus 100 (as shown in FIG. 1). Further, the scattering element 230 can be located outside the depth of field of the image capturing device 100, which can reduce the chance of the scattering element 230 being imaged by the image capturing device 100.
請回到第1圖。取像裝置100具有工作距離D,而面光源200可置於取像裝置100至取像裝置100之一半工作距離D之間。舉例而言,取像裝置100之工作距離D為約300毫米,則面光源200可置於相距取像裝置100約0毫米至約150毫米處。如此一來,面光源200可遠離取像裝置100的景深範圍,因此第2圖之散射元件230便不會成像於取像裝置100上。既然不會成像,則能避免散射元件230與取像裝置100之影像感測元件(如電荷耦合元件(CCD))之間產生莫爾(Moire)效應,因此面光源200與取像裝置100可不需特別調整或相對旋轉以消除莫爾效應。 Please return to Figure 1. The image capturing device 100 has a working distance D, and the surface light source 200 can be placed between the image capturing device 100 and one of the half working distances D of the image capturing device 100. For example, if the working distance D of the image capturing device 100 is about 300 mm, the surface light source 200 can be placed at a distance of about 0 mm to about 150 mm from the image capturing device 100. In this way, the surface light source 200 can be away from the depth of field range of the image capturing apparatus 100, so that the scattering element 230 of FIG. 2 is not imaged on the image capturing apparatus 100. Since the imaging is not performed, the Moire effect between the scattering element 230 and the image sensing element (such as the charge coupled device (CCD) of the image capturing device 100 can be avoided. Therefore, the surface light source 200 and the image capturing device 100 can be omitted. Special adjustments or relative rotations are required to eliminate the Moire effect.
請參照第2圖。至少一之散射元件230包含黑色覆蓋層232與白色顆粒234。白色顆粒234置於黑色覆蓋層232與導光板210之第二出光面214之間。白色顆粒234可讓光束222產生散射,而黑色覆蓋層232則能夠吸收或阻擋光束222。具體而言,當光束222射至散射元件230時,白色 顆粒234能夠讓光束222產生散射,亦即光束222可以白色顆粒234為中心以輻射狀散出(第2圖僅繪示部分光束222的行徑路徑)。因黑色覆蓋層232覆蓋白色顆粒234,因此往上方(即往第1圖之取像裝置100之方向)散出的部分光束222便會被黑色覆蓋層232擋住或吸收,使得光束222無法往上方離開導光板210。另一方面,往下方(即往第1圖之取像位置110之方向)散出的另一部分光束222則因沒有黑色覆蓋層232的阻擋或吸收,因此此部分的光束222可由第一出光面212離開導光板210,進而照射至待測物900(如第1圖所示)。如此一來,導光板210便能將發光元件220發出之光束222導引至待測物900。 Please refer to Figure 2. At least one of the scattering elements 230 includes a black cover layer 232 and white particles 234. The white particles 234 are disposed between the black cover layer 232 and the second light exit surface 214 of the light guide plate 210. The white particles 234 can cause the beam 222 to scatter, while the black cover layer 232 can absorb or block the beam 222. Specifically, when the light beam 222 hits the scattering element 230, white The particles 234 are capable of causing the beam 222 to scatter, that is, the beam 222 can be radiated as a center of the white particles 234 (Fig. 2 only shows the path of the partial beam 222). Since the black cover layer 232 covers the white particles 234, the partial light beam 222 that is scattered upward (ie, toward the image taking device 100 of FIG. 1) is blocked or absorbed by the black cover layer 232, so that the light beam 222 cannot be lifted upward. Leaving the light guide plate 210. On the other hand, another portion of the light beam 222 that is scattered downward (i.e., in the direction of the image capturing position 110 of FIG. 1) is blocked or absorbed by the black covering layer 232, so that the portion of the light beam 222 can be made of the first light emitting surface. 212 leaves the light guide plate 210 and is then irradiated to the object to be tested 900 (as shown in FIG. 1). In this way, the light guide plate 210 can guide the light beam 222 emitted by the light emitting element 220 to the object to be tested 900.
在一些實施方式中,黑色覆蓋層232可完全覆蓋白色顆粒234,例如白色顆粒234被導光板210與黑色覆蓋層232共同包覆。如此一來,可大幅降低光束222往上方離開導光板210的機率。因此,取像裝置100便不會收到此部分的光,也就不會干擾待測物900之影像。 In some embodiments, the black cover layer 232 can completely cover the white particles 234, for example, the white particles 234 are co-coated with the black cover layer 232 by the light guide plate 210. In this way, the probability that the light beam 222 leaves the light guide plate 210 upward can be greatly reduced. Therefore, the image capturing device 100 does not receive the light of the portion, and does not interfere with the image of the object to be tested 900.
接著請一併參照第1圖與第2圖。導光板210將光束222導引至取像裝置100之取像位置110後,光束222即照射至待測物900。自待測物900反射之光束224接著回到面光源200,依序穿透導光板210之第一出光面212與第二出光面214後被取像裝置100所接收,如此一來取像裝置100即可得到待測物900之影像(第1、2圖僅繪示部分光束224的行徑路徑)。 Please refer to Figure 1 and Figure 2 together. After the light guide plate 210 guides the light beam 222 to the image capturing position 110 of the image capturing device 100, the light beam 222 is irradiated to the object to be tested 900. The light beam 224 reflected from the object to be tested 900 then returns to the surface light source 200, and sequentially passes through the first light-emitting surface 212 and the second light-emitting surface 214 of the light guide plate 210, and is received by the image capturing device 100, so that the image capturing device is obtained. 100 can obtain the image of the object to be tested 900 (the first and second figures only show the path of the partial beam 224).
請一併參照第1圖與第3圖,其中第3圖為第1圖之導光板210的上視圖。在一些實施方式中,為了讓光束222能夠穿透第二出光面214,散射元件230可覆蓋第二出光面214之約20%至約25%之面積。被散射元件230覆蓋的地方,光束224無法通過,光束224由散射元件230未覆蓋之部分第二出光面214通過。如此一來,散射元件230能夠同時達成將光束222導引至取像裝置100之取像位置110與不阻擋光束224通過的目的。 Please refer to FIG. 1 and FIG. 3 together, wherein FIG. 3 is a top view of the light guide plate 210 of FIG. 1. In some embodiments, in order to enable the beam 222 to penetrate the second illuminating surface 214, the scattering element 230 can cover an area of about 20% to about 25% of the second illuminating surface 214. Where the scattering element 230 is covered, the beam 224 fails to pass, and the beam 224 passes through a portion of the second exit surface 214 that is not covered by the scattering element 230. In this way, the scattering element 230 can simultaneously achieve the purpose of guiding the light beam 222 to the image capturing position 110 of the image capturing device 100 and not blocking the light beam 224 from passing.
接著請回到第1圖。在一些實施方式中,光學檢測裝置更包含固定架300,連接取像裝置100與面光源200,且至少包圍取像裝置100與面光源200之間的空間。具體而言,經過面光源200之光束224強度可能會因面光源200的厚度影響而減弱,因此斜向入射取像裝置100的環境光可能會加劇對影像的干擾。然而在本實施方式中,固定架300可為不透光的材質,因此可隔絕環境光,以減少取像裝置100收到環境光的機率。固定架300亦可固定面光源200以及取像裝置100與面光源200之間的距離,例如將面光源200之散射元件230(如第2圖所示)置於取像裝置100之景深外。 Then please return to Figure 1. In some embodiments, the optical detecting device further includes a fixing frame 300 that connects the image capturing device 100 and the surface light source 200 and at least surrounds a space between the image capturing device 100 and the surface light source 200. Specifically, the intensity of the light beam 224 passing through the surface light source 200 may be weakened by the thickness of the surface light source 200, and thus the ambient light obliquely incident on the image capturing apparatus 100 may exacerbate interference with the image. However, in the present embodiment, the fixing frame 300 can be a material that is opaque, so that ambient light can be isolated to reduce the probability that the image capturing device 100 receives ambient light. The holder 300 can also fix the distance between the surface light source 200 and the image capturing device 100 and the surface light source 200. For example, the scattering element 230 of the surface light source 200 (shown in FIG. 2) is placed outside the depth of field of the image capturing device 100.
在本實施方式中,取像裝置100例如為相機,其更具有收光面102,光束224自收光面102進入取像裝置100。取像裝置100之收光面102與面光源200之第二出光面214實質平行,且面光源200完全覆蓋取像裝置100之收光面102,亦即進入收光面102之光束224會先經過面光源 200。在一些實施方式中,隨著面光源200的厚度不同,取像裝置100的後焦距離也會因此改變。在此情況下,可將面光源200的厚度考慮進取像裝置100的透鏡設計中,或者在取像裝置100中加入調焦裝置或延伸環的方式以調整其焦距,即可得到合適的焦距。 In the present embodiment, the image capturing device 100 is, for example, a camera, and further has a light receiving surface 102, and the light beam 224 enters the image capturing device 100 from the light receiving surface 102. The light-receiving surface 102 of the image capturing device 100 is substantially parallel to the second light-emitting surface 214 of the surface light source 200, and the surface light source 200 completely covers the light-receiving surface 102 of the image capturing device 100, that is, the light beam 224 entering the light-receiving surface 102 is first Surface light source 200. In some embodiments, as the thickness of the surface light source 200 is different, the back focus distance of the image capturing device 100 may also change. In this case, the thickness of the surface light source 200 can be taken into consideration in the lens design of the image capturing device 100, or the focusing device or the extension ring can be added to the image capturing device 100 to adjust the focal length thereof to obtain a suitable focal length.
接著請參照第2圖。在一些實施方式中,導光板210之入光面216與第一出光面212實質垂直,且亦與導光板210之第二出光面214實質垂直。換言之,若第一出光面212與第二出光面214為導光板210之主表面,則入光面216可為導光板210之側面,因此發光元件220所發光的光束222即為側向入光。 Please refer to Figure 2 below. In some embodiments, the light incident surface 216 of the light guide plate 210 is substantially perpendicular to the first light exit surface 212 and is also substantially perpendicular to the second light exit surface 214 of the light guide plate 210. In other words, if the first light-emitting surface 212 and the second light-emitting surface 214 are the main surfaces of the light guide plate 210, the light-incident surface 216 can be the side surface of the light guide plate 210. Therefore, the light beam 222 emitted by the light-emitting element 220 is laterally incident. .
接著請一併參照第1圖與第2圖。承接上述,發光元件220所發光的光束222為橫向出光,導光板210將光束222轉為縱向後從第一出光面212離開導光板210而照射待測物900。自待測物900反射之光束224以縱向穿透導光板210後入射取像裝置100。換言之,取像裝置100為縱向收光,因此其收光方向不同於發光元件220的出光方向,例如,取像裝置100之收光方向可實質垂直於發光元件220的出光方向。 Please refer to Figure 1 and Figure 2 together. In response to the above, the light beam 222 emitted by the light-emitting element 220 emits light laterally, and the light guide plate 210 rotates the light beam 222 into the longitudinal direction, and then exits the light guide plate 210 from the first light-emitting surface 212 to illuminate the object to be tested 900. The light beam 224 reflected from the object to be tested 900 is incident on the image capturing device 100 after passing through the light guide plate 210 in the longitudinal direction. In other words, the image capturing device 100 is longitudinally received, so that the light collecting direction is different from the light emitting direction of the light emitting element 220. For example, the light receiving direction of the image capturing device 100 may be substantially perpendicular to the light emitting direction of the light emitting element 220.
綜合上述,因在上述實施方式中,面光源置於取像裝置與取像位置之間,因此光束不會在待測物上形成取像裝置的陰影。再者,即使取像裝置具有較小的工作距離,面光源仍然可置於取像裝置與取像位置之間。另外,對於一個表面粗糙之待測物而言,上述實施方式之光學檢測裝置所 擷取之待測物影像,其特徵能被加強,同時粗糙表面的影像被壓抑,使得待測物的特徵能夠被突顯,以取得清晰的待測物之特徵影像,因此待測物可不需經過表面處理即可作檢測,可大幅簡化製程。 In summary, in the above embodiment, the surface light source is placed between the image capturing device and the image taking position, so that the light beam does not form a shadow of the image capturing device on the object to be tested. Moreover, even if the image capturing device has a small working distance, the surface light source can be placed between the image capturing device and the image capturing position. In addition, for a rough surface test object, the optical detecting device of the above embodiment The image of the object to be tested can be enhanced, and the image of the rough surface is suppressed, so that the feature of the object to be tested can be highlighted to obtain a clear image of the object to be tested, so that the object to be tested can be passed without Surface treatment can be used for inspection, which greatly simplifies the process.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧取像裝置 100‧‧‧Image capture device
102‧‧‧收光面 102‧‧‧ Receiving surface
110‧‧‧取像位置 110‧‧‧Image location
200‧‧‧面光源 200‧‧‧ surface light source
210‧‧‧導光板 210‧‧‧Light guide plate
212‧‧‧第一出光面 212‧‧‧The first glazing
214‧‧‧第二出光面 214‧‧‧Second glazing
216‧‧‧入光面 216‧‧‧ into the glossy surface
220‧‧‧發光元件 220‧‧‧Lighting elements
222、224‧‧‧光束 222, 224 ‧ ‧ beam
300‧‧‧固定架 300‧‧‧ fixed frame
900‧‧‧待測物 900‧‧‧Test object
D‧‧‧工作距離 D‧‧‧Working distance
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TWI454689B (en) * | 2011-12-29 | 2014-10-01 | Chroma Ate Inc | Optical inspecting system |
TWI500963B (en) * | 2010-06-29 | 2015-09-21 | Chroma Ate Inc | An image capturing device and method |
TWM514002U (en) * | 2015-07-07 | 2015-12-11 | Hank Technology Global Co Ltd | Optical inspection device |
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TWI500963B (en) * | 2010-06-29 | 2015-09-21 | Chroma Ate Inc | An image capturing device and method |
TWI454689B (en) * | 2011-12-29 | 2014-10-01 | Chroma Ate Inc | Optical inspecting system |
TWM514002U (en) * | 2015-07-07 | 2015-12-11 | Hank Technology Global Co Ltd | Optical inspection device |
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