TWI573979B - Apparatus for positioning heat sink - Google Patents

Description

Radiator positioning device

The present invention relates to a heat sink positioning device, and more particularly to a heat sink positioning device that utilizes a cooperation between a positioning member and a heat sink to prevent the heat sink from being disposed on the circuit board in the wrong direction.

Generally speaking, since the mainframe of the computer will be hot when it is running, when the mainframe of the computer is overheated, the performance is often degraded, and even the situation of the crash occurs. Therefore, in the prior art, a radiator and a cooling fan are usually disposed in the host computer. In order to improve the heat dissipation efficiency of the motherboard, air ducts are usually arranged in the casing, so that the cooling fan can efficiently flow the airflow, and in particular, the heat dissipation portion is required. For example, a heat sink is installed at a position such as a CPU to dissipate heat through the heat sink and the air flow.

Referring to the first figure and the second figure, the first figure shows a schematic plan view of the fin extending direction of the heat sink in the prior art, which is consistent with the flow direction of the airflow of the circuit board; the second figure shows the heat dissipation in the prior art. Schematic diagram of the fin extension direction and the flow direction of the circuit board. As shown in the figure, when a heat sink PA1 is disposed on a circuit board PA2, and the extending direction of the heat sink PA1 is consistent with the flow direction PA21 of one of the circuit boards PA2, the heat can be effectively dissipated. The heat sheet of the device PA1 is taken away. However, when the extending direction of the heat sink PA1 does not coincide with the air flow direction PA21, the heat dissipation efficiency of the heat sink PA1 is greatly reduced.

In the conventional technology, when the extending direction of the heat sink is inconsistent with the airflow direction of the circuit board, the heat sink cannot effectively improve the heat dissipation efficiency.

Accordingly, the main object of the present invention is to provide a heat sink positioning device for cooperatively inserting a heat sink with a positioning member to determine that the extending direction of the heat sink is consistent with a predetermined heat dissipation direction.

In view of the above, the present invention provides a heat sink positioning device for mounting a heat sink on a circuit board having the necessary technical means for solving the problems of the prior art. The heat sink has a plurality of heat sink fins. The heat sink fins extend along an extending direction, the circuit board has a heat sink setting area and a predetermined heat dissipation direction, and the heat sink positioning device comprises a substrate, two support components and a mounting component. The substrate is placed on the circuit board and has an opening corresponding to the heat sink setting area. Two supporting components are respectively disposed on both sides of the opening, and are respectively exposed to the opening for supporting the heat sink placed in the opening. The mounting component is movably disposed on the substrate along the predetermined heat dissipation direction and includes a frame and a positioning member. The frame system abuts against the two support components in an interference manner. The positioning member is fixed to the frame and cooperates with the heat dissipation fins.

When the mounting component moves along the predetermined heat dissipation direction and the positioning component is correspondingly inserted between the heat dissipation fins, the two support components are respectively driven by the interference of the frame to exit the opening, thereby The heat sink is dropped from the opening to the heat sink setting area, and the extending direction is parallel to the predetermined heat dissipation direction.

Ancillary technical means derived from the above-mentioned necessary technical means The two support components each include: a support piece and a support column. The support piece is movably disposed on the substrate along a side perpendicular to the predetermined heat dissipation direction, and is exposed to the opening for supporting the heat sink placed on the opening. The support post is fixed to the support piece and movably penetrates the substrate along the side direction.

Preferably, the substrate is further provided with two limiting holes, and the two limiting holes are respectively located at two sides of the opening and extend along the side direction, and the two supporting columns are respectively movably disposed on the two Limit hole.

In another preferred embodiment, the frame further comprises a frame body and two side frames, wherein the two side frames respectively extend along the predetermined heat dissipation direction, and respectively have a guiding slot, wherein the guiding channels of the two side frames are respectively Interferingly abutting the support columns of the two support assemblies. The guiding slot has a driving bevel. When the mounting component moves along the predetermined heat dissipation direction and the positioning pin is correspondingly inserted between the heat dissipation fins, the two side frames are respectively The interference of the driving bevel causes the two supporting components to exit the opening.

In addition, the two support assemblies each include an elastic support member disposed on each side of the opening for abutting the support piece to move toward the opening.

An additional technical means derived from the above-mentioned technical means is that the mounting component further comprises a push rod, a limiting ring and a triggering member, the push rod is coupled to the frame, and the limiting ring is The push rod is positioned on the substrate, and the push rod is moved along the predetermined heat dissipation direction, and the pull member is coupled to the push rod to drive the push rod to move along the predetermined heat dissipation direction.

An auxiliary technical means derived from the above-mentioned technical means is that the positioning component has at least one positioning pin extending along the predetermined heat dissipation direction; preferably, the positioning stitch is plural, and the positioning pin The positioning pins extend in parallel along the predetermined heat dissipation direction. In addition, the positioning pin has a front end Leading angle.

As described above, the heat sink positioning device of the present invention is cooperatively inserted into the heat sink by the positioning member to determine that the extending direction of the heat sink is consistent with the preset heat dissipation direction, thereby effectively preventing the user from accidentally placing the heat sink perpendicular to the heat sink. The extension direction of the preset heat dissipation direction is placed on the circuit board to avoid the heat dissipation efficiency caused by misplacement, or the rework caused by misplacement.

The specific embodiments of the present invention will be further described by the following examples and drawings.

PA1‧‧‧heatsink

PA2‧‧‧ circuit board

PA21‧‧‧ Airflow direction

100‧‧‧Radiator positioning device

1‧‧‧Substrate

11‧‧‧ openings

12, 13‧‧‧ Limit hole

14, 15 ‧ ‧ limit column

2, 3‧‧‧ support components

21, 31‧‧‧Support film

22, 32‧‧‧ support column

23, 33‧‧‧ elastic support elements

231, 331‧‧‧ elastic support blocks

232, 332‧‧‧ elastic components

4‧‧‧Installation components

41‧‧‧Frame

411‧‧‧Frame Ontology

412, 413‧‧‧ side frame

4121, 4131‧‧

41211, 41311‧‧‧ drive bevel

4122, 4132‧‧‧ Guide hole

42‧‧‧ Positioning parts

421‧‧‧ Positioning pins

4211‧‧‧ lead angle

43‧‧‧Put

44‧‧‧ Limit ring

45‧‧‧Removable parts

200‧‧‧ boards

201‧‧‧ Radiator setting area

300‧‧‧ radiator

301‧‧‧ Heat sink fins

SS1‧‧‧ side direction

SS2‧‧‧ side direction

HS‧‧‧Preset heat dissipation direction

The first figure shows a schematic plan view in which the fin extension direction of the heat sink is consistent with the flow direction of the airflow of the circuit board in the prior art; the second figure shows that in the prior art, the fin extension direction of the heat sink and the circuit board A schematic plan view of a heat sink positioning device according to a preferred embodiment of the present invention; and a fourth embodiment showing a heat sink positioning device provided by a preferred embodiment of the present invention. 5 is a schematic plan view of a heat sink positioning device provided on a circuit board according to a preferred embodiment of the present invention; and a sixth embodiment showing a heat sink positioning device provided by a preferred embodiment of the present invention. The schematic diagram of the heat sink is taken on the circuit board; the sixth diagram is an enlarged view of the sixth diagram of the sixth figure; the seventh diagram shows the positioning of the heat sink positioning device provided by the preferred embodiment of the present invention. A plan view of the heat sink falling onto the circuit board when the device is inserted into the heat sink; and the eighth figure shows the heat sink positioning device provided by the preferred embodiment of the present invention when the positioning member is inserted into the heat sink, the heat sink The extension direction is different from the preset heat dissipation direction and cannot be dropped to the plane diagram of the circuit board.

Please refer to the third to fifth figures. The third figure is a plan view of the heat sink positioning device provided by the preferred embodiment of the present invention. The fourth figure shows the heat sink positioning device provided by the preferred embodiment of the present invention. A schematic plan view showing a mounting assembly; a fifth drawing is a schematic plan view of a heat sink positioning device provided on a circuit board according to a preferred embodiment of the present invention. As shown, a heat sink positioning device 100 includes a substrate 1, two support assemblies 2 and 3, and a mounting assembly 4.

The substrate 1 defines an opening 11 , two limiting holes 12 (only one is shown), two limiting holes 13 (only one is shown), a limiting column 14 and a limiting column 15 , and two limiting holes 12 . And 13 are respectively located on both sides of the opening 11, and extend in the one side direction SS1 and the one side direction SS2, respectively, and the side direction SS1 and the side direction SS2 are opposite to each other. The two limiting columns 14 and 15 are respectively disposed on both sides of the opening 11.

The support assemblies 2 and 3 are respectively disposed on both sides of the opening 11, and the support assembly 2 includes a support piece 21, two support columns 22 (only one is shown), and two elastic support members 23 (only one is shown).

The support piece 21 is movably disposed on one side of the substrate 1 in the side direction SS1 and exposed to the opening 11. The support post 22 is fixed to the support piece 21 and movably disposed through the limiting hole 12 of the substrate 1 to be reciprocally restricted in the lateral direction SS1 by the limitation of the limiting hole 12. The elastic support member 23 comprises an elasticity The support block 231 and the two elastic members 232 (only one is shown), the elastic support block 231 is disposed on one side of the opening 1 and located outside the support piece 21, and the elastic member 232 is disposed on the elastic support block 231 and the support Between the sheets 21, the support piece 21 is elastically abutted, and the support piece 21 is driven to move toward the opening 11 in the opposite direction of the side direction SS1.

The support piece 31 is movably disposed on the other side of the substrate 1 in the side direction SS2 and exposed to the opening 11. The support post 32 is fixed to the support piece 31 and movably disposed through the limiting hole 13 of the substrate 1 to be reciprocally restricted in the lateral direction SS2 by the limitation of the limiting hole 13 . The elastic supporting member 33 includes an elastic supporting block 331 and two elastic members 332 (only one is shown). The elastic supporting block 331 is disposed on one side of the opening 1 and located outside the supporting piece 31, and the elastic member 332 is disposed. Between the elastic support block 331 and the support piece 31, the support piece 31 is elastically abutted, and the support piece 31 is driven to move toward the opening 11 in the opposite direction of the side direction SS2. Among them, the support sheets 21 and 31 are exposed symmetrically to the opening 11.

The mounting assembly 4 is reciprocally disposed on the substrate 1 along a predetermined heat dissipation direction HS perpendicular to the side direction SS1 and the side direction SS2, and includes a frame 41, a positioning member 42, a push rod 43, and a limit The bit ring 44 and a trigger member 45. The frame 41 includes a frame body 411 and two side frames 412 and 413. The two side frames 412 and 413 respectively extend along a predetermined heat dissipation direction HS, and are respectively provided with two guiding grooves 4121 and 4131 (only one is shown). And a guiding hole 4122 and 4132, and the guiding groove 4121 has a driving oblique side 41211, and the guiding groove 4131 also has a driving oblique side 41311, and the driving oblique sides 41211 and 41311 respectively interfere with the supporting columns 22 and 32, respectively. The guiding holes 4122 and 4132 respectively extend along the preset heat dissipation direction HS and are respectively inserted into the limiting posts 14 and 15 to move the two side frames 412 and 413 in a predetermined heat dissipation direction HS.

The positioning member 42 is fixed to the frame body 411 and includes a plurality of The positioning pins 421 extending in parallel along the preset heat dissipation direction HS, and each of the positioning pins 421 is provided with a lead angle 4211. The push rod 43 is fixed to the frame body 411, and the limiting ring 44 positions the push rod 43 on the substrate 1. The limit push rod 43 moves along the preset heat dissipation direction HS, and the trigger member 45 is linked to the push. The rod 43 is for driving the push rod 43 to move along the preset heat dissipation direction HS.

Please refer to FIG. 6 to FIG. 7 . FIG. 6 is a schematic plan view showing a heat sink positioning device provided on a circuit board and receiving a heat sink according to a preferred embodiment of the present invention; FIG. 6 is a schematic plan view showing a heat sink positioning device provided by a preferred embodiment of the present invention, wherein the heat sink is dropped onto the circuit board when the positioning member is inserted into the heat sink.

As shown in the figure, in the practical application, the heat sink positioning device 100 of the present invention is first placed on a circuit board 200, and the circuit board 200 has a heat sink setting area 201 and a predetermined heat dissipation direction HS; When the heat sink positioning device 100 is placed on the circuit board 200, since the support sheets 21 and 31 are respectively exposed by the elastic supporting members 23 and 33 and exposed to the opening 11, the user wants to pass a heat sink 300 via the user. When the opening 11 is placed in the heat sink setting area 201, the heat sink 300 is first placed on the support sheets 21 and 31; wherein the heat sink 300 has a plurality of extending directions along a direction (not shown, parallel to the seventh figure) The heat dissipation fins 301 extending from the predetermined heat dissipation direction HS). Then, when the user moves the trigger member 45 to move the push rod 43 along the predetermined heat dissipation direction HS, the plurality of positioning pins of the positioning member 42 are correspondingly inserted between the heat dissipation fins of the heat sink 300. At this time, since the two side frames 412 and 413 move along the preset heat dissipation direction HS, the guide grooves 4121 and 4131 move along the preset heat dissipation direction HS, and then push the support columns 22 and 32 through the driving oblique sides 41211 and 41311. Since the support columns 22 and 32 are respectively restricted by the restriction holes 12 and 13, the support columns 22 and 32 will be along the side direction SS1 and the side, respectively. The side direction SS2 moves, and then the support sheets 21 and 31 are respectively moved along the side direction SS1 and the side direction SS2 to exit the opening 11. At this time, the heat sink 300 directly slides down the opening 11 to the heat sink setting area 201 for supply. The user applies the heat sink lock to the circuit board 200, and causes the heat sink 300 to extend in a direction parallel to the predetermined heat dissipation direction HS. In addition, since the leading ends of the positioning pins 42 of the embodiment are provided with the lead angles 4211, the positioning pins 42 can be smoothly inserted between the plurality of heat radiating fins 301.

Please refer to the eighth figure. The eighth figure shows the heat sink positioning device provided by the preferred embodiment of the present invention. When the positioning component is inserted into the heat sink, the extending direction of the heat sink is different from the preset heat dissipation direction and cannot be dropped to A schematic diagram of the board. As shown in the figure, if the user places the heat sink 300 on the support sheets 21 and 31 and the extension direction of the heat sink 300 is perpendicular to the predetermined heat dissipation direction HS, the positioning pins of the positioning member 42 cannot be used by the user. When the triggering member 45 is pulled, the correspondingly inserted between the heat radiating fins of the heat sink 300 causes the guiding slots 4121 and 4131 to drive the supporting columns 22 and 32 to move to the side directions SS1 and SS2 respectively, and the distance is insufficient. 300 can't fall.

In summary, since the heat sink positioning device of the present invention is configured to be inserted into the heat sink by the positioning member to determine that the extending direction of the heat sink is consistent with the preset heat dissipation direction, the user can effectively prevent the heat sink from being mistaken. It is placed on the circuit board perpendicular to the direction in which the preset heat dissipation direction extends, to avoid the decrease in heat dissipation efficiency caused by misplacement, or the rework caused by misplacement.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

100‧‧‧Radiator positioning device

1‧‧‧Substrate

2‧‧‧Support components

3‧‧‧Support components

4‧‧‧Installation components

41‧‧‧Frame

HS‧‧‧Preset heat dissipation direction

Claims (10)

A heat sink positioning device for mounting a heat sink on a circuit board, the heat sink having a plurality of heat dissipation fins extending along an extending direction, the circuit board having a heat sink setting And a predetermined heat dissipation direction, the heat sink positioning device comprises: a substrate for placing on the circuit board, and an opening is formed, the opening corresponding to the heat sink setting area; And being disposed on the two sides of the opening and respectively exposed to the opening for supporting the heat sink disposed on the opening; a mounting assembly movably disposed on the substrate along the predetermined heat dissipation direction, and comprising: a frame that is interferingly abutted against the two supporting components, and a positioning member fixed to the frame and cooperating with the heat dissipating fins; wherein, when the mounting component moves along the predetermined heat dissipation direction When the positioning member is correspondingly inserted between the heat dissipation fins, the two supporting components are respectively driven by the interference of the frame to exit the opening, so that the heat sink falls from the opening. The heat sink region is provided, and extending in the direction parallel to the predetermined radiating direction. The heat sink positioning device of claim 1, wherein the two support assemblies respectively comprise: a support piece movably disposed on the substrate along a side perpendicular to the predetermined heat dissipation direction; Exposed to the opening to support a heat sink placed in the opening; A support column is fixed to the support piece and movably disposed on the substrate along the side direction. The heat sink positioning device of claim 2, wherein the substrate is further provided with two limiting holes, wherein the two limiting holes are respectively located at two sides of the opening and extend along the side direction, the two The support columns are respectively movably disposed through the two limiting holes. The heat sink positioning device of claim 2, wherein the frame further comprises: a frame body; and two side frames respectively extending along the predetermined heat dissipation direction and respectively provided with a guiding slot, The guiding grooves of the two side frames respectively form a sliding fit with the two supporting columns. The heat sink positioning device of claim 4, wherein the guide groove has a driving bevel, and the positioning component is correspondingly inserted into the heat dissipation when the mounting component moves along the predetermined heat dissipation direction. When the fins are between, the two side frames respectively drive the two supporting components to exit the opening by the interference of the driving bevel. The heat sink positioning device of claim 2, wherein the two support assemblies each comprise an elastic support member and are respectively disposed on two sides of the opening for abutting the support piece to move toward the opening. The heat sink positioning device of claim 1, wherein the mounting assembly further comprises a push rod, a limit ring and a trigger member, the push rod is coupled to the frame, and the limit ring system is The push rod is positioned on the substrate, and the push rod is moved along the predetermined heat dissipation direction, and the pull member is coupled to the push rod to drive the push rod to move along the predetermined heat dissipation direction. The heat sink positioning device of claim 1, wherein the positioning member has at least one positioning pin extending along the predetermined heat dissipation direction. The heat sink positioning device of claim 8, wherein the positioning pins are plural, and the positioning pins extend in parallel along the predetermined heat dissipation direction. The heat sink positioning device of claim 8, wherein the front end of the positioning pin is provided with a lead angle.