TWI573652B - Laser processing of dust collection device - Google Patents

Laser processing of dust collection device Download PDF

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TWI573652B
TWI573652B TW105101776A TW105101776A TWI573652B TW I573652 B TWI573652 B TW I573652B TW 105101776 A TW105101776 A TW 105101776A TW 105101776 A TW105101776 A TW 105101776A TW I573652 B TWI573652 B TW I573652B
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dust collecting
casing
laser processing
collecting device
air inlet
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TW105101776A
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TW201726290A (en
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zhe-wei Xu
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Description

雷射加工之集塵裝置Laser processing dust collecting device

本創作係一種雷射加工之集塵裝置,尤指用於雷射切割作業的集塵裝置。This creation is a dust collecting device for laser processing, especially for dust collecting devices for laser cutting operations.

雷射切割作業過程中會產生飛散物,其中該飛散物包含碳渣、粉塵等碎屑,且該飛散物會影響雷射切割頭的切割作業,所以在進行雷射切割作業時,需要利用一集塵裝置來移除該飛散物。During the laser cutting operation, a scattering material is generated, wherein the flying object contains debris such as carbon residue and dust, and the flying object affects the cutting operation of the laser cutting head, so when performing laser cutting work, it is necessary to utilize one A dust collecting device is used to remove the scattered matter.

以可形成單一方向氣流的雷射加工之集塵裝置為例,該集塵裝置連接抽氣裝置,該集塵裝置包含一殼體,該殼體內形成一集塵室,以及該殼體上形成上下相對且連通該集塵室的一上開口及一下開口,以及該殼體外側面形成一抽氣口,該抽氣口連通該集塵室與抽氣裝置。For example, a dust collecting device capable of forming a laser flow in a single direction is connected to an air extracting device, and the dust collecting device includes a casing, a dust collecting chamber is formed in the casing, and a casing is formed on the casing. An upper opening and a lower opening that are opposite to each other and communicate with the dust collecting chamber, and an outer side of the casing form an air suction port that communicates with the dust collecting chamber and the air extracting device.

於雷射切割作業時,該雷射切割頭位於該集塵裝置的上開口的上方,待切割的物件位於該集塵裝置的下開口的下方,該雷射切割頭發出的雷射可通過該集塵裝置而打在該待切割的物件上,於切割的同時,該抽氣裝置可透過該抽氣口而抽取該集塵室內的氣體與飛散物,而單一方向氣流的抽氣方式,造成靠近該抽氣口處的集塵室的區域中的飛散物很容易被抽取出該抽氣口,而遠離該抽氣口處的集塵室的區域中的飛散物較不易被抽取出該抽氣口,導致抽取均勻度不佳,所以位於不易被抽取出的區域的飛散物容易飛出該上開口而沾染雷射切割頭。During a laser cutting operation, the laser cutting head is located above the upper opening of the dust collecting device, and the object to be cut is located below the lower opening of the dust collecting device, and the laser from the laser cutting hair can pass through the laser cutting head The dust collecting device is mounted on the object to be cut, and the air extracting device can extract the gas and the scattered matter in the dust collecting chamber through the air extracting port while cutting, and the air pumping manner in a single direction causes the approaching The scattered matter in the area of the dust collecting chamber at the air suction port is easily extracted from the air extracting port, and the scattered matter in the area away from the dust collecting chamber at the air extracting port is less likely to be extracted from the air extracting port, resulting in extraction The uniformity is not good, so the scattered matter located in the area that is not easily extracted is likely to fly out of the upper opening and contaminate the laser cutting head.

本創作之主要目的在於提供一種雷射加工之集塵裝置,藉此改善現有集塵裝置無法提供均勻抽取的氣流排除飛散物的問題,以及避免飛散物不移動出該集塵裝置,導致依舊產生飛散物影響雷射切割頭的問題。The main purpose of the present invention is to provide a dust collecting device for laser processing, thereby improving the problem that the existing dust collecting device cannot provide uniform extraction of the airflow to remove the scattered matter, and avoiding the scattering material from moving out of the dust collecting device, resulting in the still existing generation. Flying debris affects the problem of laser cutting heads.

為達成前揭目的,本創作雷射加工之集塵裝置包含:   一殼體,其內部形成一集塵室、一上進氣空間及複數連通孔,該集塵室於 該殼體的頂面形成一上開口,以及於該殼體的底面形成一下開口,該上進氣空間鄰近並環繞該上開口,該些連通孔係環狀地間隔排列,並位於該上進氣空間下方並連通該上進氣空間,該殼體外設置連通該集塵室的進氣口與抽氣口;   一第一下導引件,其係設於該殼體的上開口處,並包含一往下延伸至該集塵室的第一下導引牆;以及   一第二下導引件,其係設於該殼體並包含一往下延伸的第二下導引牆,該第二下導引牆位於該第一下導引牆與該殼體的側壁之間,且該第二下導引牆與第一下導引牆之間形成一第一流道,該第一流道連通該集塵室與該些連通孔,該第二下導引牆與該殼體的側壁之間形成一第二流道,該第二流道流通該進氣口與該抽氣口。In order to achieve the foregoing disclosure, the dust collecting device of the present invention includes: a casing having a dust collecting chamber, an upper air inlet space and a plurality of communication holes, the dust collecting chamber being on the top surface of the casing Forming an upper opening, and forming a lower opening on the bottom surface of the casing, the upper air inlet space is adjacent to and surrounding the upper opening, the communication holes are annularly spaced and located under the upper air intake space and communicate with the upper air inlet space The upper air inlet space is provided with an air inlet and a suction port connected to the dust collecting chamber; a first lower guiding member is disposed at an upper opening of the housing and includes a downward extending to the a first lower guiding wall of the dust collecting chamber; and a second lower guiding member disposed on the casing and including a second lower guiding wall extending downward, the second lower guiding wall is located at the a first flow path is formed between the first lower guide wall and the side wall of the casing, and a first flow path is formed between the second lower guide wall and the first lower guide wall, the first flow path is connected to the dust collection chamber and the a communication hole, a second flow path is formed between the second lower guide wall and the sidewall of the housing, Circulation of the liquid flow passage and the bleed air inlet port.

上述中,一雷射切割頭位於該殼體的上開口上方,待切割的物品位於該殼體的下開口下方,該集塵裝置可連接進氣裝置與抽氣裝置,進氣裝置可將氣體輸入該殼體的上進氣空間,並可透過連通孔而均勻地進入該第一流道,隨著第一流道的導引而形成往下吹的氣流,藉由往下吹的氣流可將進入集塵室的飛散物往下吹,讓飛散物不會往上移動出該上開口,避免雷射切割頭被碎屑沾染,另外,進氣裝置可藉由該殼體的進氣口將氣體吹入該殼體,且抽氣裝置可藉由該殼體的抽氣口將氣體抽出,因此在進氣口與抽氣口之間的第二流道形成渦旋的氣流,可將被第一流道的氣流往下帶動的飛散物進一步由下往上地經由第二流道帶出,且該第二導引牆可作為屏障有效分隔第一流道與第二流道,使得由下往上螺旋帶出的碎屑不會跑至第一流道,達到移除飛散物之效果、避免雷射切割頭被飛散物沾染的目的,進而可提高切割品質,以及第一流道與第二流道的配置,讓氣流可均勻地擴散並移除飛散物。In the above, a laser cutting head is located above the upper opening of the casing, and the item to be cut is located below the lower opening of the casing, and the dust collecting device can be connected to the air inlet device and the air suction device, and the air inlet device can be used for gas The upper air inlet space of the casing is input, and the first flow channel can be uniformly accessed through the communication hole, and the airflow that is blown downward is formed as the first flow channel is guided, and the airflow blown down can enter The flying object of the dust collecting chamber is blown downward, so that the flying object does not move upwards out of the upper opening, thereby preventing the laser cutting head from being contaminated by debris, and the air inlet device can pass the gas through the air inlet of the casing Blowing into the casing, and the air extracting device can extract the gas through the air suction port of the casing, so that the second flow path between the air inlet and the air suction port forms a vortex airflow, which can be the first flow channel The flying material that is driven downward is further taken up from the bottom to the second through the second flow path, and the second guiding wall can effectively separate the first flow path and the second flow path as a barrier, so that the spiral belt from the bottom to the top The debris will not run to the first flow path, the effect of removing the scattered objects Laser cutting head to avoid being contaminated scattering object was, in turn, can improve the cutting quality, and configuring the first flow path and second flow path, so that gas flow can be uniformly diffused and scattered was removed.

請參閱圖1至圖3,為本創作雷射加工之集塵裝置之一較佳實施例,其包含一殼體10、一第一下導引件20及一第二下導引件30。Referring to FIG. 1 to FIG. 3 , a preferred embodiment of the dust collecting device for laser processing includes a housing 10 , a first lower guiding member 20 and a second lower guiding member 30 .

該殼體10內部形成一集塵室11、一上進氣空間111及複數連通孔112,該集塵室11於該殼體10的頂面形成一上開口113,以及於該殼體10的底面形成一下開口114,該上進氣空間111鄰近並環繞該上開口113,該些連通孔112係環狀地間隔排列,並位於該上進氣空間111下方並連通該上進氣空間111,該殼體10外設置連通該集塵室11的進氣口115與抽氣口116,該進氣口115鄰近該下開口114,該抽氣口116鄰近該上開口113,且該殼體10於鄰近該下開口114的內側面形成一渦流導引部12。A dust collecting chamber 11 , an upper air inlet space 111 and a plurality of communication holes 112 are formed in the housing 10 , and the dust collecting chamber 11 forms an upper opening 113 on the top surface of the housing 10 , and the housing 10 The bottom surface defines a lower opening 114. The upper air inlet space 111 is adjacent to and surrounds the upper opening 113. The communication holes 112 are annularly spaced and located below the upper air intake space 111 and communicate with the upper air inlet space 111. An air inlet 115 and a suction port 116 are connected to the dust collecting chamber 11 , and the air inlet 115 is adjacent to the lower opening 114 . The air inlet 116 is adjacent to the upper opening 113 , and the housing 10 is adjacent to the housing 10 . The inner side surface of the lower opening 114 forms a vortex guiding portion 12.

該第一下導引件20係設於該殼體10的上開口113處,並包含一往下延伸至該集塵室11的第一下導引牆21。The first lower guiding member 20 is disposed at the upper opening 113 of the casing 10 and includes a first lower guiding wall 21 extending downward to the dust collecting chamber 11.

該第二下導引件30係設於該殼體10並包含一往下延伸的第二下導引牆31,如圖4至圖6,該第二下導引牆31位於該第一下導引牆21與該殼體10的側壁之間,且該第二下導引牆31與第一下導引牆21之間形成一第一流道40,該第一流道40連通該集塵室11與該些連通孔112,該第二下導引牆31與該殼體10的側壁之間形成一第二流道50,該第二流道50流通該進氣口115與該抽氣口116。The second lower guiding member 30 is disposed on the housing 10 and includes a second lower guiding wall 31 extending downward. As shown in FIG. 4 to FIG. 6 , the second lower guiding wall 31 is located at the first lower portion. A first flow path 40 is formed between the guide wall 21 and the side wall of the casing 10, and the second lower guide wall 31 and the first lower guide wall 21 communicate with the dust collection chamber. A second flow path 50 is formed between the second lower guide wall 31 and the side wall of the housing 10, and the second flow path 50 flows through the air inlet 115 and the air suction port 116. .

如圖2、圖3所示,該殼體10包含一底座13、一罩子14、一頂座15及一均流組件16,該罩子14係設於該底座13上,該第二下導引件30係鎖設於該罩子14,該頂座15鎖設於該底座13且位於該第二下導引件30的上方,該均流組件16係鎖設於該頂座15並位於該頂座15與該第二下導引件30之間,其中,該上開口113係形成於該頂座15的頂面,且該第一下導引件20係鎖設於該頂座15,以及該集塵裝置於該頂座15上均勻地設置複數下進氣接頭70,該上進氣空間111係形成於該頂座15與該均流組件16之間,且如圖2、圖4所示,該些連通孔112係環狀間隔排列地設於該均流組件16,該均流組件16的底面形成一第一錐面161,該第二下導引件30的頂面形成一第二錐面32,該第二錐面32面向且間隔地對應該第一錐面161,以及該第一錐面161與該第二錐面32之間形成一下進氣空間60,該下進氣空間60係連通該第一流道40與該些連通孔112。As shown in FIG. 2 and FIG. 3 , the housing 10 includes a base 13 , a cover 14 , a top seat 15 , and a current sharing assembly 16 . The cover 14 is fastened to the base 13 . The top 30 is locked to the base 13 and is located above the second lower guiding member 30. The equalizing assembly 16 is locked to the top seat 15 and located at the top. Between the seat 15 and the second lower guide member 30, the upper opening 113 is formed on the top surface of the top seat 15, and the first lower guide member 20 is locked to the top seat 15, and The dust collecting device uniformly sets a plurality of lower air inlet joints 70 on the top seat 15, and the upper air inlet space 111 is formed between the top seat 15 and the current sharing assembly 16, and is as shown in FIG. 2 and FIG. The plurality of communication holes 112 are annularly spaced apart from each other. The bottom surface of the current distribution assembly 16 defines a first tapered surface 161, and the top surface of the second lower guide member 30 forms a first surface. a second tapered surface 32 facing the first tapered surface 161 facing and spaced apart, and a lower intake space 60 formed between the first tapered surface 161 and the second tapered surface 32, the lower intake air Space 60 is connected to the 40,112 flow channel and the plurality of communication holes.

如圖5、圖6所示,該下開口114係形成於該底座13的底面,該渦流導引部12位於該底座13,且該進氣口115係形成於該底座13,且該集塵裝置於該底座13的進氣口115處設置一渦流進氣接頭80,該罩子14的內周面為一錐狀的渦流導引面141,該渦流導引面141鄰接該第二流道50。As shown in FIG. 5 and FIG. 6 , the lower opening 114 is formed on the bottom surface of the base 13 , the vortex guiding portion 12 is located on the base 13 , and the air inlet 115 is formed on the base 13 , and the dust collection is provided. The device is provided with a vortex inlet joint 80 at the inlet 115 of the base 13. The inner peripheral surface of the cover 14 is a tapered vortex guiding surface 141, and the vortex guiding surface 141 is adjacent to the second flow passage 50. .

如圖5所示,該第一下導引牆21的底緣至該殼體10的底面的距離大於該第二下導引牆31的底緣至該殼體10的底面的距離;再參閱圖9所示,該第一下導引牆21的底緣至該殼體10的底面的距離等於該第二下導引牆31的底緣至該殼體10的底面的距離;再參閱圖10所示,該第一下導引牆21的底緣至該殼體10的底面的距離小於該第二下導引牆31的底緣至該殼體10的底面的距離,其中該第一下導引牆21的長度與該第二下導引牆31的長度可相互搭配來達到不同的效果,再參閱圖5、圖9、圖10所示,已揭示該第一下導引牆21的長度與該第二下導引牆31的長度分別係短、中、長三種相互搭配,最終以該第一下導引牆21的底緣至該殼體10的底面的距離大於該第二下導引牆31的底緣至該殼體10的底面的距離的配置,所得到的效果最佳。As shown in FIG. 5, the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the casing 10 is greater than the distance from the bottom edge of the second lower guiding wall 31 to the bottom surface of the casing 10; As shown in FIG. 9, the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the casing 10 is equal to the distance from the bottom edge of the second lower guiding wall 31 to the bottom surface of the casing 10; 10, the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the casing 10 is smaller than the distance from the bottom edge of the second lower guiding wall 31 to the bottom surface of the casing 10, wherein the first The length of the lower guiding wall 21 and the length of the second lower guiding wall 31 can be matched to each other to achieve different effects. Referring to FIG. 5, FIG. 9, and FIG. 10, the first lower guiding wall 21 is disclosed. The length of the second lower guiding wall 31 is short, medium and long respectively, and the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the housing 10 is greater than the second length. The arrangement of the distance from the bottom edge of the lower guide wall 31 to the bottom surface of the casing 10 is optimal.

此外,如圖5、圖11所示,該抽氣口116形成於該罩子14的外側壁並連通該第二流道50,其中,該抽氣口116的設置高度可依據需求而調整,如圖5所示,該抽氣口116鄰近該罩子14的上緣處,另如圖11所示,該抽氣口116鄰近該罩子的下緣處,其中,該抽氣口116的口徑與該罩子14的高度比值小於1/3,即該抽氣口116的口徑的比例為1時,該罩子14的高度的比例則大於3。In addition, as shown in FIG. 5 and FIG. 11 , the air suction port 116 is formed on the outer side wall of the cover 14 and communicates with the second flow path 50 . The height of the air suction port 116 can be adjusted according to requirements, as shown in FIG. 5 . As shown, the air suction port 116 is adjacent to the upper edge of the cover 14, and as shown in FIG. 11, the air suction port 116 is adjacent to the lower edge of the cover, wherein the ratio of the diameter of the air suction port 116 to the height of the cover 14 is shown. Less than 1/3, that is, when the ratio of the diameter of the suction port 116 is 1, the ratio of the height of the cover 14 is greater than 3.

上述中,於雷射切割作業中,一雷射切割頭位於該集塵裝置之殼體10的上開口113的上方,待切割的物品位於該集塵裝置之殼體10的下開口114的下方,該雷射切割頭發出的雷射可通過該集塵裝置的集塵室11而打在該待切割的物品,另外,該集塵裝置可連接二進氣裝置與一抽氣裝置,其中一進氣裝置連通該些下進氣接頭70,另一進氣裝置連通該渦流進氣接頭80,該抽氣裝置連通該殼體10的抽氣口116。In the above, in the laser cutting operation, a laser cutting head is located above the upper opening 113 of the casing 10 of the dust collecting device, and the article to be cut is located below the lower opening 114 of the casing 10 of the dust collecting device. The laser from the laser cutting hair can be hit on the object to be cut through the dust collecting chamber 11 of the dust collecting device, and the dust collecting device can be connected to the two air intake device and one air extracting device, one of which The intake device communicates with the lower intake joints 70, and the other intake device communicates with the vortex intake joints 80, and the suction devices communicate with the suction ports 116 of the housing 10.

如圖7所示,以該第一下導引牆21的底緣至該殼體10的底面的距離大於該第二下導引牆31的底緣至該殼體10的底面的距離的配置為例,進氣裝置可將氣體輸入該殼體10的上進氣空間111,且氣體進一步通過該均流組件16上間隔設置的連通孔112,其中該均流組件16在該殼體10內分隔出所述的上進氣空間111與下進氣空間60,氣體藉由該些下進氣接頭70首先進入上進氣空間111,填滿該上進氣空間111後在經過環狀的間隔排列之連通孔112進入下進氣空間60,使得氣體可均勻地吹入該第一流道40,隨著該第一流道40的導引而形成往下吹的氣流,藉由往下吹的氣流可將進入集塵室11的飛散物往下吹。As shown in FIG. 7, the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the casing 10 is greater than the distance from the bottom edge of the second lower guiding wall 31 to the bottom surface of the casing 10. For example, the air intake device can input gas into the upper air intake space 111 of the housing 10, and the gas further passes through the communication holes 112 spaced apart from the current sharing assembly 16, wherein the current sharing assembly 16 is inside the housing 10. The upper air intake space 111 and the lower air intake space 60 are separated, and the gas first enters the upper air intake space 111 by the lower air intake joints 70, fills the upper air intake space 111, and passes through the annular space. The aligned communication holes 112 enter the lower air intake space 60, so that the gas can be uniformly blown into the first flow path 40, and the airflow that is blown downward is formed along with the guidance of the first flow path 40, and the airflow is blown downward. The scattered matter entering the dust collecting chamber 11 can be blown downward.

此外,該均流組件16可包含至少一均流板,且每一均流板皆設有所述連通孔112,以二個均流板為例,該二均流板可劃分為一第一均流板及一第二均流板,該第一均流板與該第二均流板係疊置地鎖設於該頂座15並位於該頂座15與該第二下導引件30之間,該第二均流板位於該第一均流板的下方,且該第一均流板與該第二均流板之間形成一均流氣室,且該均流氣室進一步呈環狀,且該均流氣室透過該第一均流板的連通孔112與該上進氣空間111連通,以及該均流氣室透過該第二均流板的連通孔112與下進氣空間60相連通,因此氣體填滿該上進氣空間111後會經過第一均流板的連通孔112而進入該均流氣室,氣體填滿該均流氣室並經過第二均流板的連通孔112而進入該下進氣空間60,其中,可依據需求設置適當數量的均流板,以形成適當數量的均流氣室,進而達到適當的均流效果,另外,所述均流板進一步為呈中空環狀的構件。In addition, the current sharing component 16 can include at least one current sharing plate, and each of the current sharing plates is provided with the communication hole 112. Taking two current sharing plates as an example, the two current sharing plates can be divided into a first a first flow equalization plate and a second current equalization plate are stacked on the top seat 15 and located at the top seat 15 and the second lower guide 30 The second flow equalization plate is located below the first flow equalization plate, and a current sharing air chamber is formed between the first current sharing plate and the second current sharing plate, and the current sharing air chamber is further annular. And the equalizing air chamber communicates with the upper air inlet space 111 through the communication hole 112 of the first current equalizing plate, and the current sharing air chamber communicates with the lower air inlet space 60 through the communication hole 112 of the second current sharing plate. Therefore, after filling the upper air inlet space 111, the gas enters the current sharing air chamber through the communication hole 112 of the first current equalizing plate, and the gas fills the current sharing air chamber and passes through the communication hole 112 of the second current sharing plate to enter the a lower intake space 60, wherein an appropriate number of flow equalization plates can be set according to requirements to form an appropriate number of flow equalization chambers, thereby achieving an appropriate average Effect, further, the average flow plate further is a hollow annular member.

再參閱圖8所示,另一進氣裝置可藉由該進氣口115將氣體輸入至該殼體10,且配合該抽氣裝置可藉由該抽氣口116將氣體抽出,以及配合該渦流導引部12,在該進氣口115與抽氣口116之間的第二流道50形成由下往上移動的渦旋的氣流,所以被第一流道40中下吹的氣流往下帶的飛散物,可接著被渦旋的氣流由下往上地經由第二流道50帶出,且該第一下導引牆21的底緣至該殼體10的底面的距離大於該第二下導引牆31的底緣至該殼體10的底面的距離,因此進入第二流道50的飛散物受到第二下導引牆31的阻擋,在往上移動的過程中不會移動出該殼體10的上開口113,所以飛散物不會沾染雷射切割頭。Referring to FIG. 8 again, another air intake device can input gas to the casing 10 through the air inlet 115, and the air extracting device can extract the gas through the air extracting port 116 and cooperate with the eddy current. The guiding portion 12, the second flow passage 50 between the intake port 115 and the suction port 116 forms a swirling airflow moving downward from the bottom, so that the airflow blown down by the first flow passage 40 is carried downward. The flying object can be taken up by the vortex flow from the bottom to the top through the second flow path 50, and the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the casing 10 is greater than the second lower portion. The distance from the bottom edge of the guide wall 31 to the bottom surface of the casing 10, so that the scattered matter entering the second flow passage 50 is blocked by the second lower guide wall 31, and does not move out during the upward movement. The upper opening 113 of the housing 10 is such that the flying objects do not contaminate the laser cutting head.

其中,該抽氣口116的口徑與該罩子14的高度比值小於1/3,因此產生的渦旋的氣流可以在第二流道50中流動2圈以上,以利於飛散物的排除,若該抽氣口116的口徑與該罩子14的高度比值越小,即該罩子14的高度越高或抽氣口的116的口徑越小,可提升渦旋的氣流排除飛散物的能力,另外,該抽氣口116的設置高度越靠近該罩子14的上緣,也可以提升渦旋的氣流排除飛散物的能力。Wherein, the ratio of the diameter of the suction port 116 to the height of the cover 14 is less than 1/3, so that the generated vortex flow can flow more than two times in the second flow path 50 to facilitate the elimination of the scattered matter, if the pumping The smaller the ratio of the diameter of the port 116 to the height of the cover 14, that is, the higher the height of the cover 14 or the smaller the diameter of the suction port 116, the ability of the vortex flow to remove the scattered matter can be increased, and the suction port 116 is further provided. The closer the setting height is to the upper edge of the cover 14, the higher the ability of the vortex to remove the scattered matter.

綜上所述,該雷射加工之集塵裝置的第一下導引件20與第二下導引件30之間形成該第一流道40,可形成往下吹的氣流,將飛散物往下吹,再配合渦旋的氣流將飛散物吹入第二流道50,讓被渦旋的氣流往上帶的飛散物不會自該上開口113流出,所以飛散物不會沾染到雷射切割頭,因此該雷射加工之集塵裝置的結構配置可形成下吹的氣流與渦旋的氣流,達到移除飛散物之效果、避免雷射切割頭被飛散物沾染並提高切割品質的目的。In summary, the first flow path 40 is formed between the first lower guiding member 20 and the second lower guiding member 30 of the dust collecting device of the laser processing, and the airflow that is blown downward can be formed, and the scattered matter is moved toward Blowing down, and then vortexing the airflow to blow the scattering material into the second flow channel 50, so that the scattered matter of the vortex flow upward does not flow out from the upper opening 113, so the scattered matter will not be contaminated by the laser The cutting head, so the structure of the dust collecting device of the laser processing can form the airflow of the blown air and the vortex, to achieve the effect of removing the scattered matter, avoiding the laser cutting head being contaminated by the flying object and improving the cutting quality. .

其中,該均流組件16提供間隔設置的連通孔112,可提供均勻往下吹的氣流,配合第二流道中形成的渦旋的氣流,可將集塵室11內的飛散物均勻的排除,避免排除不均而飛散物飛出該上開口113,進而避免雷射切割頭被飛散物沾染。Wherein, the current sharing component 16 provides spaced-apart communication holes 112, which can provide a uniform downward blowing airflow, and can cooperate with the vortex airflow formed in the second flow channel to uniformly remove the scattered matter in the dust collecting chamber 11 Avoid the unevenness and the flying objects fly out of the upper opening 113, thereby preventing the laser cutting head from being contaminated by the flying objects.

此外,該雷射加工之集塵裝置進一步可採取「該第一下導引牆21的底緣至該殼體10的底面的距離大於該第二下導引牆31的底緣至該殼體10的底面的距離」的配置,使得該第二下導引牆31可有效分隔,讓被渦旋的氣流往上帶的飛散物不會自該上開口113流出,輔助避免雷射切割頭被飛散物沾染的功效。In addition, the dust collecting device of the laser processing may further adopt that “the distance from the bottom edge of the first lower guiding wall 21 to the bottom surface of the housing 10 is greater than the bottom edge of the second lower guiding wall 31 to the housing. The distance of the bottom surface of the 10 is configured such that the second lower guide wall 31 can be effectively separated, so that the scattered matter of the vortex flow upward does not flow out from the upper opening 113, thereby assisting in avoiding the laser cutting head being The effect of flying debris.

10‧‧‧殼體
11‧‧‧集塵室
111‧‧‧上進氣空間
112‧‧‧連通孔
113‧‧‧上開口
114‧‧‧下開口
115‧‧‧進氣口
116‧‧‧抽氣口
12‧‧‧渦流導引部
13‧‧‧底座
14‧‧‧罩子
141‧‧‧渦流導引面
15‧‧‧頂座
16‧‧‧均流組件
161‧‧‧第一錐面
20‧‧‧第一下導引件
21‧‧‧第一下導引牆
30‧‧‧第二下導引件
31‧‧‧第二下導引牆
32‧‧‧第二錐面
40‧‧‧第一流道
50‧‧‧第二流道
60‧‧‧下進氣空間
70‧‧‧下進氣接頭
80‧‧‧渦流進氣接頭
10‧‧‧shell
11‧‧‧dust room
111‧‧‧Upper air intake space
112‧‧‧Connected holes
113‧‧‧Opening
114‧‧‧ opening
115‧‧‧air inlet
116‧‧‧Exhaust port
12‧‧‧ eddy current guide
13‧‧‧Base
14‧‧‧ hood
141‧‧ eddy current guiding surface
15‧‧‧ top seat
16‧‧‧current sharing components
161‧‧‧First cone
20‧‧‧First lower guide
21‧‧‧First lower guide wall
30‧‧‧Second lower guide
31‧‧‧Second lower guide wall
32‧‧‧Second cone
40‧‧‧First runner
50‧‧‧Second runner
60‧‧‧ lower air intake space
70‧‧‧ lower intake joint
80‧‧‧Vortex inlet fittings

圖1:為本創作雷射加工之集塵裝置之一較佳實施例之立體外觀示意圖。 圖2:為本創作雷射加工之集塵裝置之一較佳實施例之立體外觀分解示意圖。 圖3:為本創作雷射加工之集塵裝置之一較佳實施例之另一立體外觀分解示意圖。 圖4:為本創作雷射加工之集塵裝置之一較佳實施例之俯視平面示意圖。 圖5:為圖4的A-A割面線的剖面示意圖。 圖6:為圖4的B-B割面線的剖面示意圖。 圖7:為本創作雷射加工之集塵裝置之一較佳實施例之第一流道形成下吹的氣流的示意圖。 圖8:為本創作雷射加工之集塵裝置之一較佳實施例之第二流道形成渦旋的氣流的示意圖。 圖9:為本創作雷射加工之集塵裝置之另一較佳實施例之剖面示意圖。 圖10:為本創作雷射加工之集塵裝置之又一較佳實施例之剖面示意圖。 圖11:為本創作雷射加工之集塵裝置之再一較佳實施例之剖面示意圖。Figure 1 is a perspective view of a preferred embodiment of a dust collecting device for laser processing. FIG. 2 is a perspective exploded view of a preferred embodiment of the dust collecting device for laser processing. FIG. 3 is another perspective exploded view of a preferred embodiment of the dust collecting device for laser processing. Fig. 4 is a top plan view showing a preferred embodiment of the dust collecting device for laser processing. Fig. 5 is a schematic cross-sectional view showing the A-A cut line of Fig. 4. Fig. 6 is a schematic cross-sectional view showing the B-B cut line of Fig. 4. Fig. 7 is a schematic view showing the flow of the lower blow formed by the first flow path of a preferred embodiment of the dust collecting device for laser processing. Fig. 8 is a schematic view showing the flow of the vortex formed by the second flow path of a preferred embodiment of the dust collecting device for laser processing. Figure 9 is a cross-sectional view showing another preferred embodiment of the dust collecting device for laser processing. Figure 10 is a cross-sectional view showing still another preferred embodiment of the dust collecting device for laser processing. Figure 11 is a cross-sectional view showing still another preferred embodiment of the dust collecting device for laser processing.

10‧‧‧殼體 10‧‧‧shell

116‧‧‧抽氣口 116‧‧‧Exhaust port

13‧‧‧底座 13‧‧‧Base

14‧‧‧罩子 14‧‧‧ hood

15‧‧‧頂座 15‧‧‧ top seat

20‧‧‧第一下導引件 20‧‧‧First lower guide

21‧‧‧第一下導引牆 21‧‧‧First lower guide wall

70‧‧‧下進氣接頭 70‧‧‧ lower intake joint

80‧‧‧渦流進氣接頭 80‧‧‧Vortex inlet fittings

Claims (8)

一種雷射加工之集塵裝置,其包含:一殼體,其內部形成一集塵室、一上進氣空間及複數連通孔,該集塵室於該殼體的頂面形成一上開口,以及於該殼體的底面形成一下開口,該上進氣空間鄰近並環繞該上開口,該些連通孔係環狀地間隔排列,並位於該上進氣空間下方並連通該上進氣空間,該殼體外設置連通該集塵室的進氣口與抽氣口,其中,該殼體包含一底座、一罩子、一頂座及一均流組件,該罩子係設於該底座上,該頂座鎖設於該罩子與該底座且位於該第二下導引件的上方,該均流組件係鎖設於該頂座並位於該頂座與該第二下導引件之間;一第一下導引件,其係設於該殼體的上開口處,並包含一往下延伸至該集塵室的第一下導引牆;以及一第二下導引件,其係鎖設於該殼體的罩子並包含一往下延伸的第二下導引牆,該第二下導引牆位於該第一下導引牆與該殼體的側壁之間,且該第二下導引牆與第一下導引牆之間形成一第一流道,該第一流道連通該集塵室與該些連通孔,該第二下導引牆與該殼體的側壁之間形成一第二流道,該第二流道流通該進氣口與該抽氣口。 A dust collecting device for laser processing, comprising: a casing, wherein a dust collecting chamber, an upper air inlet space and a plurality of communication holes are formed therein, the dust collecting chamber forming an upper opening on a top surface of the casing, And forming a lower opening on the bottom surface of the casing, the upper air inlet space is adjacent to and surrounding the upper opening, and the communication holes are annularly spaced and located below the upper air intake space and communicate with the upper air inlet space. An air inlet and a suction port connected to the dust collecting chamber are disposed outside the casing, wherein the casing comprises a base, a cover, a top seat and a current sharing component, and the cover is attached to the base, the top seat Locking is disposed on the cover and the base and above the second lower guiding member, the current sharing component is locked to the top seat and located between the top seat and the second lower guiding member; a lower guiding member disposed at an upper opening of the housing and including a first lower guiding wall extending downward to the dust collecting chamber; and a second lower guiding member locked to the second lower guiding member The cover of the housing further includes a second lower guiding wall extending downward, the second lower guiding wall is located at the first a first flow path is formed between the guide wall and the side wall of the casing, and the first lower guide wall and the first lower guide wall are connected to the dust collection chamber and the communication holes. A second flow path is formed between the second lower guiding wall and the side wall of the casing, and the second flow path flows through the air inlet and the air suction port. 如請求項1所述之雷射加工之集塵裝置,其中,該下開口係形成於該底座的底面,該渦流導引部位於該底座,且該進氣口係形成於該底座,且該雷射加工之集塵裝置於該底座的進氣口處設置一渦流進氣接頭,該排氣口係形成於該罩子的外側壁,該殼體於鄰近該下開口的內側面形成一渦流導引部,該上開口係形成於該頂座的頂面,且該第一下導引件係鎖設於該頂座,以及該雷射加工之集塵裝置於該頂座上設置複數下進氣接頭,該上進氣空間係形成於該頂座與該均流組件之間,且該些連通孔係環狀間隔排列地設於該均流組件。 The dust collecting device of the laser processing according to claim 1, wherein the lower opening is formed on a bottom surface of the base, the eddy current guiding portion is located at the base, and the air inlet is formed on the base, and the The dust collecting device of the laser processing is provided with a vortex inlet joint at the inlet of the base, the exhaust port is formed on the outer side wall of the cover, and the casing forms an eddy current guide on the inner side adjacent to the lower opening. a guiding portion, the upper opening is formed on a top surface of the top seat, and the first lower guiding member is locked on the top seat, and the laser processing dust collecting device is disposed on the top seat The air inlet is formed between the top seat and the current sharing component, and the communication holes are annularly spaced apart from the current sharing component. 如請求項2所述之雷射加工之集塵裝置,其中,該抽氣口的口徑與該罩子的高度比值小於1/3。 The dust collecting device for laser processing according to claim 2, wherein a ratio of a diameter of the air suction port to a height of the cover is less than 1/3. 如請求項1至3中任一項所述之雷射加工之集塵裝置,其中,該第一下導引牆的底緣至該殼體的底面的距離大於該第二下導引牆的底緣至該殼體的底面的距離。 The dust collecting device of the laser processing according to any one of claims 1 to 3, wherein a distance from a bottom edge of the first lower guiding wall to a bottom surface of the casing is greater than a width of the second lower guiding wall The distance from the bottom edge to the bottom surface of the housing. 如請求項1至3中任一項所述之雷射加工之集塵裝置,其中,該均流組件的底面形成一第一錐面,該第二下導引件的頂面形成一第二錐面,該第二錐面面向且間隔地對應該第一錐面,以及該第一錐面與該第二錐面之間形成一下進氣空間,該下進氣空間係連通該第一流道與該些連通孔。 The dust collecting device of the laser processing according to any one of claims 1 to 3, wherein a bottom surface of the current sharing assembly forms a first tapered surface, and a top surface of the second lower guiding member forms a second surface a tapered surface, the second tapered surface faces and spaced corresponding to the first tapered surface, and a lower intake space is formed between the first tapered surface and the second tapered surface, the lower air inlet space is connected to the first flow path Connect with these holes. 如請求項4所述之雷射加工之集塵裝置,其中,該均流組件的底面形成一第一錐面,該第二下導引件的頂面形成一第二錐面,該第二錐面面向且間隔地對應該第一錐面,以及該第一錐面與該第二錐面之間形成一下進氣空間,該下進氣空間係連通該第一流道與該些連通孔。 The dust collecting device of the laser processing according to claim 4, wherein a bottom surface of the current sharing component forms a first tapered surface, and a top surface of the second lower guiding component forms a second tapered surface, the second The tapered surface faces and spaced correspondingly to the first tapered surface, and a lower intake space is formed between the first tapered surface and the second tapered surface, the lower air inlet space is connected to the first flow channel and the communication holes. 如請求項1至3中任一項所述之雷射加工之集塵裝置,其中,該罩子的內周面為一錐狀的渦流導引面,該渦流導引面鄰接該第二流道。 The dust collecting device of the laser processing according to any one of claims 1 to 3, wherein the inner peripheral surface of the cover is a tapered vortex guiding surface, the eddy current guiding surface adjoins the second flow path . 如請求項6所述之雷射加工之集塵裝置,其中,該罩子的內周面為一錐狀的渦流導引面,該渦流導引面鄰接該第二流道。 The dust collecting device for laser processing according to claim 6, wherein the inner peripheral surface of the cover is a tapered vortex guiding surface, and the eddy guiding surface abuts the second flow path.
TW105101776A 2016-01-20 2016-01-20 Laser processing of dust collection device TWI573652B (en)

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CN203900736U (en) * 2014-04-23 2014-10-29 诚霸科技股份有限公司 Dust removing device for laser processing

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CN203900736U (en) * 2014-04-23 2014-10-29 诚霸科技股份有限公司 Dust removing device for laser processing

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