TWI573153B - Coil device - Google Patents

Description

Coil device

The present invention relates to a coil device having a coil.

In the past, the coil device is electrically connected and mounted on a circuit board. To achieve the above purpose, the coil device basically comprises a box base having a receiving space and a plurality of sockets mounted on the box base. a foot, and a plurality of coil modules mounted in the housing space of the cassette holder, each of the pins has a wiring portion, and a conductive portion electrically connectable to the circuit board, the coil module Generally, there are at least one bobbin, and a plurality of wires wound around the bobbins, each of which has two wire ends respectively fastened to the terminals of the pins.

In the assembly of the conventional coil device, the wires are manually wound on the bobbins, and the wire ends of the wires are respectively fastened to the connecting portions of the pins, and then manually A bobbin wound with the wires is loaded into the housing space of the cassette holder. When the coil device is mounted on the circuit board, the conductive portions of the pins are electrically connected to the circuit board.

For a long time, the conventional coil device has electrically connected the coils and the circuit board through the pins assembled on the box base. Although the coil device of this structure can achieve the purpose of electrical connection, in the assembly process. In the above, the wires must be manually wound on the winding frames, and then the wire ends of the wires are manually tied to the connecting portions of the pins, and then manually wound. The wire bobbin is assembled in the housing space of the box. The above assembly work is not only highly dependent on labor, but also slow in assembly and high in assembly cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a coil device which can improve assembly speed and reduce labor dependency and manufacturing cost.

The coil device of the present invention can be electrically connected to a circuit board and includes: a conductive carrier, at least one coil module mounted on the conductive carrier, and a alignment unit. The conductive carrier includes a carrier board and a conductive unit electrically connecting the carrier board to the circuit board, the carrier board has a plurality of contacts, and the coil module has a plurality of first line ends, The line unit includes a plurality of first alignment blocks that respectively position the first line ends on the carrier and respectively correspond to the contacts.

The beneficial effect of the present invention is that the first wire ends are disposed on the conductive carrier by the first alignment blocks and electrically connected to the contacts, respectively, and can be assembled by using an automatic processing tool. Achieve increased assembly speed, as well as reduced assembly costs and labor dependency.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figures 1, 2, and 3, a first embodiment of a coil device 90 of the present invention can be mounted on a plurality of circuit boards 91 and electrically connected to the circuit board 91. The coil device 90 includes a conductive carrier. 1. A plurality of coil modules 2, a aligning unit 3, and a plurality of soldering blocks 4 mounted on the conductive carrier 1. The conductive carrier 1 comprises a carrier plate 11 and a plurality of fixing blocks 12 arranged at intervals and composed of adhesive. The carrier 11 has substantially a non-conductive base layer 111, a main conductive layer 112 disposed on a top surface of the base layer 111, and an insulating protective layer covering the top surface of the main conductive layer 112. 113. The insulating protective layer 113 has a plurality of windows 114, and the main conductive layer 112 has a plurality of contacts 115 respectively corresponding to the windows 114.

The conductive carrier 1 further includes a conductive unit 13 electrically connected to the main conductive layer 112. The form of the conductive unit 13 is not particularly limited. In this embodiment, a design concept similar to an electronic circuit is disclosed. The conductive unit 13 has a connecting conductive layer 131 bonded to the bottom surface of the base layer 111, and a plurality of conductive pins 132 electrically connected to the connecting conductive layer 131 and the main conductive layer 112, that is, the connecting conductive layer 131. The main conductive layer 112 is located on the opposite side of the base layer 111, and the conductive pins 132 respectively correspond to the contacts 115 of the main conductive layer 112, and are electrically connected to the circuit board 91. In the design, the conductive unit 13 can also have a plurality of the conductive pins 132 directly connected to the contacts 115 of the main conductive layer 112. In the actual structure, since the main conductive layer 112, the insulating protective layer 113, and the connection conductive layer 131 are all thin, in the present embodiment, only the thickness is shown in FIG. 3, and the remaining patterns are omitted.

Referring to Figures 1, 3 and 4, each coil module 2 of the present embodiment includes two electrically connected coils 20, each of which has a bobbin 21, and is wound around the bobbin 21 A first wire 22 and a second wire 23 are disposed on the insulating cover 113 of the carrier 11 of the conductive carrier 1 by using the fixing blocks 12, respectively. The first wire 22 has two first wire ends 221 and the second wire 23 has two second wire ends 231.

In this embodiment, the alignment unit 3 includes four first alignment blocks 31 for respectively positioning the first line ends 221 of the first wires 22 on the carrier board 11, and two second wires 23 for the second wires 23 The second wire ends 231 are electrically connected to the second wire block 32 disposed on the carrier plate 11. The first alignment block 31 and the second alignment block 32 are preferably made of a conductive metal material. Each of the first alignment blocks 31 has a first abutment surface 311 facing one of the windows 114 of the carrier 11 and a first recessed upward by the first abutment surface 311 a first alignment slot 312 extending along a length of the first wire end 221 of the first wire 22, and the first wire end 221 of the first wire 22 may be respectively disposed at The first alignment block 31 is in the first alignment slot 312.

The second alignment block 32 has the same structure as the first alignment block 31, and thus has a second abutment surface 321 facing one of the windows 114 of the carrier 11, and a The second abutting surface 321 of the second abutting surface 321 is upwardly disposed, and the second wire end 231 of the second wire 23 of the coil 20 is electrically connected to the second fixing slot 322. Inside.

In the embodiment, the soldering blocks 4 are respectively used to cover the first alignment block 31 and the first line end 221 interposed therebetween, and the second alignment block 32 and the second line end interposed therebetween 231, and the first wire ends 221 and the second wire ends 231 are firmly mounted on the carrier 11 of the conductive carrier 1 and electrically connected to the contacts 115 of the carrier 11 respectively. connection.

In the manufacturing of the coil device 90, the first wire 22 and the second wires 23 are respectively wound around the winding frames 21 to form the coils 20, and then the automated operation is performed. Surface-mount technology (SMT), the coils 20 are placed above the carrier 11 of the conductive carrier 1, and the coil frame of each coil module 2 is automatically installed. 21 is adhered to the carrier 11 through the fixing blocks 12, and the first ends 221 of the first wires 22 are respectively disposed on the carrier 11 through the first alignment blocks 31.

That is, each of the first line ends 221 of the first wires 22 is sandwiched in the first alignment grooves 312 of the first alignment blocks 31, and each of the first alignment blocks 31 The bottom edge card is mounted in one of the windows 114 of the carrier board 11, so that the first alignment block 31 can be temporarily disposed on the conductive carrier 1. If the stability of the temporary placement is to be improved, The bottom surface of the first abutting surface 311 of the first alignment block 31 is coated with a conductive adhesive, that is, the conductive adhesive is used to increase the bonding force between the first alignment block 31 and the carrier 11.

Similarly, the second wire ends 231 of the second wires 23 of the coil modules 2 are also disposed on one of the windows 114 of the carrier 11 through the second alignment blocks 32. In order to improve the stability of the placement, the conductive paste may also be coated on the second abutting surface 321 of the second alignment block 32. Finally, welding processing is performed at each of the first alignment block 31 and each of the second alignment blocks 32, and the soldering blocks 4 can be formed. The soldering blocks 4 can be the first line ends 221 and the like. The second wire end 231 is firmly and electrically connected to the carrier plate 11. However, in the present invention, the first alignment block 31 and the second alignment block 32 can be directly bonded to the carrier 11 by using a conductive adhesive. Therefore, the present invention does not have These soldering blocks 4 are necessary.

Referring to Figures 1, 2 and 3, in the embodiment, when the coil device 90 is in use, the coil device 90 can be placed on the circuit board 91 by an automated processing tool, and the conductive connections of the conductive unit 13 can be utilized. The leg 132 and the circuit board 91 are electrically connected.

The coil module 2 disclosed in the first embodiment of the present invention has the functions of transforming and common mode inductance. Therefore, each coil module 2 includes two coils 20, and the second line ends 231 of the coils 20 are electrically For the connection, referring to the second embodiment of FIG. 5, when the coil module 2 has only a voltage function, each coil module 2 has only a single coil 20, and each coil 20 has one bobbin 21 and two The first wire 22, and each of the first wires 22 has two first wire ends 221, and the wire bonding unit 3 includes a plurality of first wire blocks 31 respectively sandwiching the first wire ends 221. That is, the present invention is not limited to the use of the coil device 2 having a variable voltage and a common mode inductance.

It can be seen from the above description that the structure of the coil device 90 of the present embodiment is not only novel, but also the assembly of the first alignment block 31 and the second alignment block 32 can be assembled by using an automatic processing tool, except that the assembly can be improved. In addition to assembly speed, assembly cost and labor dependency can be reduced. That is, when the coil device 90 of the present invention is assembled, the first wire 22 and the second wires 23 need to be manually wound, and the rest of the work can be installed by using an automatic processing tool. Therefore, the present invention It is indeed a coil device 90 with a novel structure and industrial value.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1‧‧‧Conductive Vehicle

11‧‧‧ Carrier Board

111‧‧‧ basement

112‧‧‧Main conductive layer

113‧‧‧Insulation protective layer

114‧‧‧ window

115‧‧‧Contacts

12‧‧‧Fixed blocks

13‧‧‧Conducting unit

131‧‧‧Connecting conductive layer

132‧‧‧Electrical pins

2‧‧‧ coil module

20‧‧‧ coil

21‧‧‧ Winding frame

22‧‧‧First wire

221‧‧‧ first line end

23‧‧‧Second wire

231‧‧‧second line

3‧‧‧Line unit

31‧‧‧First alignment block

311‧‧‧First contact surface

312‧‧‧First alignment slot

32‧‧‧Second alignment block

321‧‧‧Second affixed

322‧‧‧Second alignment slot

4‧‧‧welding block

90‧‧‧ coil device

91‧‧‧Circuit board

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a perspective exploded view of a first embodiment of the coil device of the present invention; Figure 1 is a cross-sectional view taken along line 3-3 of Figure 1; Figure 4 is an incomplete top view of the first embodiment. Figure 3 is a cross-sectional view taken along line 3-3 of Figure 1. A coil module of the coil device will be separately described; and Fig. 5 is an exploded perspective view of a second embodiment of the coil device of the present invention.

1‧‧‧Conductive Vehicle

11‧‧‧ Carrier Board

111‧‧‧ basement

113‧‧‧Insulation protective layer

114‧‧‧ window

115‧‧‧Contacts

12‧‧‧Fixed blocks

2‧‧‧ coil module

20‧‧‧ coil

21‧‧‧ Winding frame

221‧‧‧ first line end

23‧‧‧Second wire

231‧‧‧second line

3‧‧‧Line unit

31‧‧‧First alignment block

311‧‧‧First contact surface

312‧‧‧First alignment slot

32‧‧‧Second alignment block

321‧‧‧Second affixed

322‧‧‧Second alignment slot

22‧‧‧First wire

4‧‧‧welding block

Claims (6)

A coil device electrically connected to a circuit board and comprising: a conductive carrier, comprising a carrier board, and a conductive unit electrically connecting the carrier board to the circuit board, the carrier board having a base wall a layer, a main conductive layer bonded to the base layer and having the contacts, and an insulating protective layer bonded to the main conductive layer, the insulating protective layer having a plurality of windows, and the main conductive layer has a plurality of contacts respectively corresponding to the window; at least one coil module comprising two coils, each coil having a bobbin, a winding around the bobbin and having two first ends a wire, and a second wire wound around the wire frame and having two second wire ends, the first wire ends and the second wire ends respectively being electrically connected to the contacts of the carrier And a aligning unit comprising a plurality of first aligning blocks respectively locating the first line ends on the carrier board and respectively corresponding to the contacts, and at least two respectively locating the second lines The end is disposed on the carrier board and corresponds to the connection a second alignment block, the first alignment block and the second alignment block are respectively mounted at the windows of the carrier, each of the first alignment blocks having abutting a first abutment surface on the main conductive layer of the board, and a first alignment slot disposed on the first abutment surface for interposing one of the first line ends, and the second The alignment block has a second abutment surface abutting against the main conductive layer of the carrier, and a second abutment surface disposed on the second abutment surface for sandwiching one of the second line ends Second alignment slot. The coil device of claim 1, further comprising a plurality of soldering blocks respectively covering the first alignment block and the first line end sandwiched by the first alignment block, and covering The second alignment block and the second line end sandwiched by the second alignment block. The coil device of claim 1, wherein the conductive carrier further comprises a plurality of fixing blocks disposed on the insulating protective layer and the winding frames of the coil modules are disposed on the carrier. The coil device of claim 1, wherein the conductive unit has a connecting conductive layer bonded to the base layer, and a plurality of conductive pins electrically connected to the connecting conductive layer and the main conductive layer, The connecting conductive layer and the main conductive layer are respectively located on opposite sides of the base layer. A coil device electrically connected to a circuit board and comprising: a conductive carrier, comprising a carrier board, and a conductive unit electrically connecting the carrier board to the circuit board, the carrier board having a base wall a layer, a main conductive layer bonded to the base layer, and an insulating protective layer bonded to the main conductive layer, the insulating protective layer having a plurality of windows, and the main conductive layer respectively corresponding to a window a coil module having a plurality of first line ends respectively electrically connected to the contacts of the carrier board; and a routing unit including a plurality of the first line ends respectively disposed at The first alignment block corresponding to the contact point is respectively corresponding to the carrier, and the first alignment blocks are respectively mounted on the windows of the carrier, and each of the first alignment blocks has abutting a first abutment surface on the main conductive layer, and a a first alignment slot of one of the first line ends of the coil module. The coil device according to claim 5, further comprising a plurality of soldering blocks respectively covering the first alignment block and the first wire end sandwiched by the first alignment block.