TWI572416B - Automatic processing module and method for spraying process - Google Patents

Description

Automated processing module and method for spraying process

The present invention relates to an automation module, and more particularly to an automated processing module for a spray coating process.

In order to cause the light-emitting diode wafer to emit a specific light, after the manufacturer manufactures the light-emitting diode wafer, the surface of the light-emitting diode wafer is sprayed with phosphor powder to utilize the effect of light mixing to cause the light-emitting diode wafer to be emitted. Need light. For example, when a light-emitting diode chip is to emit white light, the manufacturer usually fabricates a blue light-emitting diode wafer, and then sprays a yellow phosphor powder on the blue light-emitting diode wafer to make the blue light-emitting diode chip. Can emit white light.

In general, it is often necessary to perform multiple repeated spraying, baking, and cooling processes before the light-emitting diode wafer reaches the target region of color temperature. Between different processes, it is necessary to manually carry the light-emitting diode chip to the machine of the next process, which not only causes the burden of time cost and labor cost, but also easily causes the light-emitting diode chip to be contaminated or even damaged.

In view of the above, it is an object of the present invention to provide a spray for The automated processing module and automated processing method of the coating process saves the process of manually transferring the LED chip, thereby reducing the time cost and labor cost, and reducing the probability of contamination or damage of the LED chip.

In order to achieve the above object, in accordance with an embodiment of the present invention, an automated processing module for a spray coating process includes a loading device, a take-up device, and a baking device. The loading device is adapted to extend into a spray booth to feed an uncoated substrate into the spray booth. The take-up device is used to move a sprayed substrate out of the spray booth. The baking device is used to bake the coated substrate.

According to another embodiment of the present invention, an automated processing method for a spray coating process comprises the following steps. An uncoated substrate is fed into the spray booth using a loading device that extends into a spray booth. A sprayed substrate is removed from the spray booth from the spray booth using a take-up device. Bake the sprayed substrate.

In the above embodiment, since the uncoated substrate can be fed into the spraying chamber by using the loading device, and the taken-out device can be removed from the spraying chamber by the taking-out device for subsequent baking operation, the manual handling base can be omitted. The process of materials, thereby reducing time and labor costs and reducing the chance of contamination or damage to the substrate.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10‧‧‧Automatic processing module

20‧‧‧ spray module

21‧‧‧ spraying room

22‧‧‧Conveyor

100‧‧‧Loading device

110‧‧‧lower track

120‧‧‧Middle track

130‧‧‧Upper track

200‧‧‧ removal device

210‧‧‧lower track

220‧‧‧ middle track

230‧‧‧Upper track

300‧‧‧ baking device

310‧‧‧heating port

400‧‧‧ lifting device

500‧‧‧Resistance cover

600‧‧‧Mobile devices

610‧‧‧ carrying arm

620‧‧‧ Track

700‧‧‧Cooling device

800‧‧‧Pressure device

A, A1, A2, A3, A4‧‧‧ uncoated substrate

B, B1, B2, B3‧‧‧ sprayed substrate

C‧‧‧Processing room

D1, D2, D3, D4, D5‧‧‧ arrows

L‧‧‧Light Emitter Wafer

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. 1 is an external perspective view of an automated processing module and a spray module according to an embodiment of the present invention; and FIG. 2 is an internal perspective view of the automated processing module shown in FIG. 1 from a perspective view; The figure shows an internal perspective view of the automated processing module shown in FIG. 1 from another perspective; and FIGS. 4A to 4R illustrate the decomposition steps of the automated processing method according to an embodiment of the present invention.

The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood by those skilled in the art that the details of the invention are not essential to the details of the invention. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings. In addition, the dimensions of the various elements in the drawings are not shown in actual scale for the convenience of the reader.

FIG. 1 is a perspective view showing the appearance of an automated processing module 10 and a spray module 20 according to an embodiment of the present invention. As shown in FIG. 1 , the automated processing module 10 can be disposed adjacent to the spray module 20 to feed the substrate into the spray module 20 , and when the spray module 20 completes the spraying operation on the substrate, the automated processing module 10 The coated substrate can be removed and subjected to subsequent processes (such as baking or cooling processes) without the need to manually transport the substrate.

Further, please refer to Figures 2 and 3, wherein Figure 2 shows The automated processing module 10 shown in FIG. 1 is an internal perspective view from a perspective view, and FIG. 3 is an internal perspective view of the automated processing module 10 shown in FIG. 1 viewed from another perspective. As shown in FIGS. 2 and 3, the automated processing module 10 includes a loading device 100, a take-out device 200, and a baking device 300. The loading device 100 can carry the uncoated substrate A and can be inserted into the spray booth (not shown) of the spray module 20 to feed the uncoated substrate A into the spray booth. The take-up device 200 can move the sprayed substrate B out of the spray booth. The baking device 300 is used to bake the coated substrate B.

Thereby, the unsprayed substrate A can be fed into the spray booth by the loading device 100 without manually carrying the unsprayed substrate A. Similarly, the sprayed substrate B can be removed from the spray booth by the take-up device 200. Without the manual handling of the sprayed substrate B, the time cost and labor cost can be reduced, and the probability of contamination or damage of the uncoated substrate A and the sprayed substrate B can be reduced.

In some embodiments, both the unsprayed substrate A and the sprayed substrate B can be a carrier carrying at least one light-emitting diode wafer L, wherein the uncoated substrate A represents a light-emitting diode wafer carried thereon. L has not been sprayed with phosphor powder, and the coated substrate B represents that the light-emitting diode wafer L carried by it has been sprayed with phosphor powder in the spray module 20.

In some embodiments, as shown in FIG. 2, the uncoated substrate A can be first loaded on the loading device 100, and the loading device 100 is telescopic, so that it can be extended into the spray module 20 ( Referring to the spray booth of Fig. 1), the uncoated substrate A is fed into the spray booth of the spray module 20 (see Fig. 1) and placed on the spray booth in the spray module 20. When the uncoated substrate A is placed on the spraying machine, the loading device 100 can be retracted to the outside of the spraying module 20 to facilitate the spraying chamber. The substrate A was not sprayed for the phosphor powder coating operation.

Specifically, as shown in FIG. 2, the loading device 100 may include a lower track 110, a middle track 120, and an upper track 130. The upper track 130 is superposed on the middle track 120, and the upper track 130 is slidable along the X axis with respect to the middle track 120. The middle track 120 is superposed on the lower track 110, and the middle track 120 is slidable along the X axis with respect to the lower track 110. Therefore, the upper track 130 can slide along the X axis toward the spray module 20 (see FIG. 1) on the middle track 120, and the middle track 120 can slide along the X axis toward the spray module 20 on the lower track 110. The loading device 100 is allowed to elongate along the X-axis to feed the uncoated substrate A into the spray booth of the spray module 20. When the uncoated substrate A is sent into the spraying chamber, the upper rail 130 can slide away from the spraying module 20 along the X axis on the middle rail 120, and the middle rail 120 can be separated from the spraying module along the X axis on the lower rail 110. 20 slides so that the loading device 100 can be retracted.

It should be understood that the embodiment of the present invention uses a three-layered retractable structure as an example of the loading device 100, but the invention is not limited thereto. The manufacturer can also use the four-layer, five-layer or multi-layer telescopic structure as the loading device 100 according to actual needs.

Similar to the loading device 100, the retrieval device 200 can also include a lower track 210, a middle track 220, and an upper track 230. The upper track 230 is superposed on the middle track 220, and the upper track 230 is slidable along the X axis with respect to the middle track 220. The middle track 220 is superposed on the lower track 210, and the middle track 220 is slidable along the X axis with respect to the lower track 210. Therefore, the upper track 230 can slide along the X axis toward the spray module 20 (see FIG. 1) on the middle track 220, and the middle track 220 can face the spray module along the X axis on the lower track 210. The sliding 20 causes the take-up device 200 to elongate along the X-axis to pick up the sprayed substrate B in the spray booth of the spray module 20. After the sprayed substrate B is taken up, the upper track 230 can slide away from the spray module 20 along the X axis on the middle track 220, and the middle track 220 can face away from the spray module 20 along the X axis on the lower track 210. Sliding causes the take-up device 200 to be retracted, and the sprayed substrate B is taken out of the spray module 20.

It should be understood that the embodiment of the present invention uses a three-layered retractable structure as an example of the take-out device 200, but the invention is not limited thereto. The manufacturer can also use the four-layer, five-layer or multi-layer telescopic structure as the take-out device 200 according to actual needs.

In some embodiments, as shown in FIG. 3, the highest position of the take-up device 200 (the top surface of the upper track 230) is lower than the lowest position of the bake unit 300. In this way, the take-up device 200 can be stretched under the baking device 300 without interfering with the baking operation of the baking device 300.

In order to facilitate the baking of the coated substrate B by the baking device 300, in some embodiments, as shown in FIG. 3, the automated processing module 10 may further include a lifting device 400. The lifting device 400 is used to lift the sprayed substrate B from the take-up device 200 to the baking device 300 for baking by the baking device 300. Specifically, when the take-up device 200 takes out the sprayed substrate B, the take-up device 200 can be first retracted such that the sprayed substrate B is not under the lift device 400. Next, the lifting device 400 can first be lowered to a position lower than the level of the substrate B that has been sprayed. Next, the take-up device 200 can be extended to deliver the sprayed substrate B above the lift device 400. Then, the lifting device 400 can be raised, and the sprayed substrate B is raised to the baking device. 300.

In some embodiments, as shown in FIG. 3, the toasting device 300 can have a heating port 310. The lifting device 400 can lift the sprayed substrate B and cause the sprayed substrate B to close the heating port 310. In this way, not only the baking effect of the sprayed substrate B but also the heat energy of the baking device 300 can be prevented. Specifically, the baking device 300 may be a basin-like structure having a heat source, and the heating port 310 is an opening of a basin-like structure. When the sprayed substrate B closes the heating port 310, the heat energy provided by the heat source can be received in a large amount to enhance the baking effect.

In some embodiments, when there is no substrate B sprayed under the heating port 310, in order to prevent the thermal energy of the baking device 300 from spreading, affecting other devices in the automated processing module 10, the automated processing module 10 The heat blocking cover 500 may be further included. The heat blocking cover 500 can close the heating port 310 when the lifting device 400 has not lifted the sprayed substrate B to prevent the heat energy of the baking device 300 from being dissipated. For example, when the lifting device 400 has not lifted the sprayed substrate B, the heat blocking cover 500 may be located below the heating port 310 to close the heating port 310. When the lifting device 400 is about to lift the sprayed substrate B, the heat blocking cover 500 The heating port 310 can be separated from the Y-axis direction to facilitate the lifting device 400 to lift the sprayed substrate B to the heating port 310 and close the heating port 310.

In some embodiments, as shown in FIG. 3, the automated processing module 10 can further include a mobile device 600 and a cooling device 700. The mobile device 600 can move the baked coated substrate B to the cooling device 700, and the cooling device 700 can cool the baked coated substrate B. In particular, the mobile device 600 can include a carrier arm 610 and a track 620. The carrier arm 610 is disposed on the rail 620 and is movable along the rail 620. The length direction of the track 620 is parallel to The arrangement direction of the baking device 300 and the cooling device 700. In this way, the carrying arm 610 can be moved along the length direction of the rail 620 to the baking device 300 to take off the sprayed substrate B, and then the sprayed substrate B is moved to the cooling device 700. For example, in the figure, the length direction of the track 620 is parallel to the Y axis, and the bake unit 300 and the cooling device 700 are arranged along the Y axis.

In use, the carrying arm 610 can first move along the rail 620 to below the baking device 300. When the sprayed substrate B is baked, the lifting device 400 can be lowered, and the sprayed substrate B can be lowered onto the carrying arm 610. . Next, the carrying arm 610 can carry the sprayed substrate B and move along the rail 620 to the cooling device 700, and then the sprayed substrate B is moved to the cooling device 700, so that the cooling device 700 is cooled and sprayed. Substrate B.

In some embodiments, as shown in FIG. 3, the cooling device 700 can be a cooling plate. When the high temperature sprayed substrate B after baking is moved to the low temperature cooling plate, the thermal energy of the sprayed substrate B can be transferred to the cooling plate, and the effect of cooling the sprayed substrate B can be achieved.

In some embodiments, as shown in FIG. 3, the automated processing module 10 can further include a processing chamber C and a pressurizing device 800. The processing chamber C can accommodate the loading device 100, the take-out device 200 and the baking device 300, the lifting device 400, the heat-resistant cover 500, the moving device 600, and the cooling device 700. In other words, the transfer, baking and cooling operations of the sprayed substrate B are carried out in the process chamber C. The pressurizing device 800 is used to raise the air pressure in the process chamber C. In this way, even if the phosphor powder on the sprayed substrate B is not completely attached to the LED wafer L, since the air pressure in the processing chamber C can be improved, the spray coating process can be prevented from being dissipated into the spray module. Fluorescent dust in the spray booth of 20 is dispersed in the process chamber C. Yubu In some embodiments, the pressing device 800 can be a fan, but the invention is not limited thereto.

4A to 4R are schematic diagrams showing the decomposition steps of the automated processing method according to an embodiment of the present invention. As shown in FIG. 4A, first, the uncoated substrate A1 can be placed on the loading device 100 first. Next, in FIG. 4B, the loading device 100 is inserted into the spray booth 21 of the spray module 20, and the uncoated substrate A1 is fed into the spray booth 21. Next, the loading device 100 can be retracted out of the spray booth 21, and the user can place another uncoated substrate A2 on the loading device 100.

Next, in FIG. 4C, the spray module 20 can spray the phosphor powder on the unsprayed substrate A1 (see FIG. 4B) to produce the sprayed substrate B1. The transport device 22 in the spray booth 21 can transport the sprayed substrate B1 to a position corresponding to the take-up device 200. In addition, in Fig. 4C, the loading device 100 can be extended to feed the uncoated substrate A2 to the inlet of the spray booth 21 for spraying.

Next, in FIG. 4D, the take-up device 200 can be inserted into the spray booth 21, and the sprayed substrate B1 is taken out of the spray booth 21, and the retraction of the take-up device 200 can pass the sprayed substrate B1 through the baking device. Below 300, it waits at a position farther from the spraying chamber 21 than the baking device 300. At this time, the loading device 100 can be extended to feed the unsprayed substrate A2 into the spray booth 21 for spraying operation, and when the uncoated substrate A2 is fed into the spray booth 21, the loading device 100 can be retracted to the spray coating. Outside the chamber 21, the user places another unsprayed substrate A3.

Next, in FIG. 4E, the take-up device 200 can be extended to feed the sprayed substrate B1 under the baking device 300. For example, as shown in FIGS. 4F and 4G, the two figures show a schematic side view of "sending the coated substrate B1 under the baking device 300." In FIG. 4F, the take-up device 200 is in a contracted state. The sprayed substrate B1 is not placed below the baking device 300. In Fig. 4G, the take-up device 200 can be elongated in the direction of the arrow D1 to feed the sprayed substrate B1 under the baking device 300. Next, in FIG. 4H, the lifting device 400 can be raised in the direction of the arrow D2 to lift the sprayed substrate B1 to the baking device 300, so that the baking device 300 can perform the baking operation on the sprayed substrate B1. To dry the phosphor powder sprayed on the sprayed substrate B1.

Returning to FIG. 4E, when the baking apparatus 300 performs the baking operation on the sprayed substrate B1, the spray module 20 has completed spraying on the unsprayed substrate A2 (see FIG. 4D) to produce the sprayed base. The material B2 is conveyed by the conveying device 22 to the position corresponding to the take-out device 200.

Next, in FIG. 4I, when the baking apparatus 300 performs a baking operation on the sprayed substrate B1, the take-up apparatus 200 may pass under the sprayed substrate B1, and from the lower side of the lift apparatus 400 along the arrow D3. The direction is directed toward the spray booth 21 (see Figure 4E) to obtain the sprayed substrate B2. Since the take-up device 200 is stretched under the lifting device 400, it does not affect the baking operation of the sprayed substrate B1.

Next, in FIG. 4J, the take-out device 200 can be retracted in the direction of the arrow D4, and the sprayed substrate B2 is taken out to the spray booth 21 (see FIG. 4E), and the sprayed substrate B2 is moved. Wait until the position below the baking device 300. In other words, as shown in FIG. 4K, the sprayed substrate B2 can wait at a position farther from the spray booth 21 than the baking device 300.

Next, in the 4th L, the carrying arm 610 can be moved along the rail 620 below the baking device 300. Next, as shown in FIG. 4M, the lifting device 400 can be lowered in the direction of the arrow D5, and the baked substrate B1 after baking is lowered. The baked substrate B1 after baking is sent to the carrier arm 610.

Next, in FIG. 4N, the carrying arm 610 can move the sprayed substrate B1 along the rail 620 onto the cooling device 700, so that the cooling device 700 can perform a cooling operation on the baked substrate B1 after baking. In FIG. 4N, the loading device 100 can feed the unsprayed substrate A3 into the spray booth 21 and retract outside the spray booth 21, and the user can place another uncoated substrate A4 on the loading device 100. on.

Next, in FIG. 4O, the take-up device 200 can be extended to send the sprayed substrate B2 under the baking device 300, and the lifting device 400 can lift the sprayed substrate B2 by the steps as shown in Figures 4G to 4H. To the baking device 300, the baking device 300 performs a baking operation on the sprayed substrate B2. In FIG. 4O, the spray module 20 can spray the phosphor powder to the unsprayed substrate A3 (see FIG. 4N) to produce the sprayed substrate B3, and the transport device 22 can send the sprayed substrate B3 to the corresponding The position of the device 200 is taken out. In Fig. 4O, the loading device 100 can be extended to wait for the unsprayed substrate A4 to be sent to the inlet of the spray booth 21.

Next, in FIG. 4P, the take-out device 200 can be expanded and contracted under the baking device 300 and the sprayed substrate B2, and the sprayed substrate B3 is taken out from the spray booth 21, and the sprayed substrate B3 is moved to a specific baking. The grilling device 300 waits farther away from the spray booth 21.

Next, in the 4th drawing, the loading device 100 can be stretched to feed the uncoated substrate A4 into the coating chamber 21 to perform the spraying operation. Next, in FIG. 4R, the mobile device 600 can move the cooled sprayed substrate B1 onto the loading device 100 for the user to take out. Specifically, the carrying arm 610 can move along the track 620 toward the loading device 100 with the sprayed substrate B1 and will have been sprayed The coated substrate B1 is placed on the loading device 100.

It can be seen from the above process flow that the automatic processing method of the present embodiment can not only carry the substrate manually, but also can allow up to four substrates (the uncoated substrates A1, A2, A3 and A4) to be located in the automated processing module 10. And in the spray module 20, the processing efficiency is greatly improved.

In some embodiments, the user can also place a test substrate in the loading device 100, and when the loading device 100 feeds the test substrate into the spray booth 21, the loading device 100 directly The substrate for the test is taken out, and the user can observe whether the spray state of the phosphor powder is normal.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

10‧‧‧Automatic processing module

100‧‧‧Loading device

110‧‧‧lower track

120‧‧‧Middle track

130‧‧‧Upper track

200‧‧‧ removal device

210‧‧‧lower track

220‧‧‧ middle track

230‧‧‧Upper track

300‧‧‧ baking device

600‧‧‧Mobile devices

610‧‧‧ carrying arm

620‧‧‧ Track

800‧‧‧Pressure device

A‧‧‧Uncoated substrate

B‧‧‧Sprayed substrate

C‧‧‧Processing room

L‧‧‧Light Emitter Wafer

Claims (14)

An automated processing module for a spray coating process, comprising: a loading device for extending into a spray booth to feed an unsprayed substrate into the spray booth; and a take-up device for spraying a spray The substrate is removed from the spray booth; a baking device is used to bake the sprayed substrate; and a lifting device is used to lift the sprayed substrate from the take-up device to the baking device. The automatic processing module for a spraying process according to claim 1, wherein the baking device has a heating port for lifting the sprayed substrate and sealing the sprayed substrate to the heating port. . The automatic processing module for spraying process according to claim 2, further comprising a heat blocking cover for closing the heating port when the lifting device has not lifted the sprayed substrate. The automated processing module for the spraying process of claim 1, further comprising a cooling device for cooling the baked substrate after baking. The automatic processing module for the spraying process of claim 4, wherein the lifting device is configured to lower the sprayed substrate after the sprayed substrate is baked, and the automated processing module further comprises: a moving device for baking and lowering the sprayed substrate from the The lifting device moves to the cooling device. The automatic processing module for spraying a process according to claim 1, further comprising: a processing chamber for accommodating the loading device, the taking device and the baking device; and a pressing device for lifting the processing Air pressure in the room. The automated processing module for a spray coating process of claim 1, wherein the loading device and the removal device are both telescopic. An automated processing method for a spray coating process, comprising: using a loading device to extend into a spray booth, and feeding an unsprayed substrate into the spray booth; using a take-up device to apply a sprayed substrate from the spray chamber Spraying the chamber out of the spray booth; lifting the sprayed substrate from the take-up device to a baking device; and baking the sprayed substrate. An automated processing method for a spray coating process according to claim 8, wherein when the sprayed substrate is lifted to the baking device, the take-up device removes another sprayed substrate from the spray booth. Outside, and under the raised sprayed substrate. Automated office for spraying process as described in claim 8 The method wherein the sprayed substrate is lifted to close a heating port of the baking device. An automated processing method for a spray coating process according to claim 8, wherein lifting the sprayed substrate from the take-up device to the baking device comprises: utilizing a heat-resistant heat when the sprayed substrate has not been lifted The lid closes a heating port of the baking device; and after the heat blocking cover leaves the heating port, the sprayed substrate is lifted. The automated processing method for the spray coating process of claim 8, further comprising cooling the baked substrate after baking. The automated processing method for a spray coating process of claim 12, wherein the sprayed substrate after cooling and baking comprises: lowering the sprayed substrate; moving the sprayed substrate to a cooling device; and utilizing the A cooling device cools the sprayed substrate. The automated processing method for a spray coating process of claim 13 further comprising moving the cooled sprayed substrate from the cooling device to the loading device.