TWI568327B - Method for manufacturing soft conductive substrate - Google Patents

Description

Method for manufacturing flexible conductive substrate

The invention relates to a method for manufacturing a flexible conductive plate, in particular to a process for producing a flexible conductive plate with non-precision lines.

In the modern era where the knowledge economy is the mainstream, the most important issue in the communication industry is how to generate, distribute, and rectify information in an electronic form. The telecommunication system provides an environment for electronic information circulation and communication. Therefore, telecommunication technology The development of the country is an important part of the improvement of a country's society.

Communication has always been closely related to human life. In the past, humans relied on wired telephones to communicate. Then with the advancement of wireless communication technology, a variety of wireless transmission electronic products developed by Xinge gradually replaced wired transmission communication equipment, which promoted the rapid development of Internet, electronic advertising media and instant messaging software, and greatly expanded people. With the speed of information flow between people, the world has truly become a "global village" that transcends national borders.

The field of communication technology covers a wide range. Since the 19th century, human beings have been devoted to the exploration and development of electromagnetic phenomena. On the one hand, in addition to using electromagnetic waves for various resource exploration and telemetry, on the other hand, it has also established radio, television and Communication technologies such as telephones for the transmission and circulation of information. In recent years, due to advances in the fields of satellite, fiber optics, semiconductors, computers, etc., the scope of resource exploration, the capacity of communication transmission, and the speed of information processing have all increased dramatically, enabling telecom technology to develop rapidly. It has affected industries such as aerospace, national defense and people's livelihood.

The integration of telecommunications, information, video networks, voice, data, video, music and other media and services, leading to a fully digital network. With the rapid development of the Internet, the demand for new services such as broadband network infrastructure, high-speed wireless or wire access, on-demand video and multimedia is on the rise, with the use of fiber and digital subscriber loop technology to increase user bandwidth. Integrate all forms of wired and wireless media, allocate appropriate bandwidth according to the needs of various telecom technology media and application transmissions, and transmit a large amount of information in any form to meet the needs of these new services. Research and development of technology.

Compared with wired electronic devices, electronic devices with wireless communication are less likely to be restricted by the use occasions and regions, and the overall wireless communication system can also change the size according to the design of different sizes of electronic products, and even The miniaturization of volume combined with the internal exploration of small electronic products provides a visually pleasing effect because it is not directly visible to the human eye.

In the wireless communication industry, in order to improve the precision of the antenna pattern and the wire diameter, the wireless communication industry uses high-precision equipment, for example, laser etching, etching process with a photomask, etc., however, The overall process is complex and takes a long time (at least 2 days), and the use of higher precision equipment will result in increased time and manufacturing costs.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a flexible conductive substrate which can be applied to various industries and has flexibility in a short period of time by using a low-precision and low-cost device in combination with a simplified process.

In order to achieve the above object, the method for manufacturing a flexible conductive substrate of the present invention, the overall process flow can be summarized as follows: providing a first substrate, connecting a hot melt adhesive layer to one surface of the first substrate to form a first plate body;

Forming a plurality of punches in the first punching of the first plate body, and forming a first conductive space inside the punching hole;

Providing a second board body, wherein the second board body comprises a second substrate and a metal conductive layer connected to each other, and the metal conductive layer of the second board body is connected with the hot melt adhesive layer of the first board body to form a soft body Conductive plate;

The flexible conductive plate is subjected to a second press cutting so that the flexible conductive plate forms at least one flexible conductive substrate having a conductive pattern.

In a first preferred embodiment of the present invention, the metal conductive layer may be made of a copper metal material during actual production, and the second board is formed by a bonding layer. The metal conductive layer is formed by a common connection of three layers, and the bonding layer may be selected from one of copper, nickel, a copper alloy or a nickel alloy, and in order to avoid the occurrence of oxidation of the metal conductive layer, the manufacturing method of the present invention is In a second preferred embodiment, an anti-oxidation layer is further connected to the surface of the metal conductive layer, and the second plate body is composed of four layers.

In order to enable the structure manufactured by the present invention to be widely applied to a variety of different industries, the flexible conductive substrate of the present invention can be provided with an adhesive layer that is coupled to other external articles on its surface.

Furthermore, in a third preferred embodiment of the present invention, before the first board and the second board are connected to each other to form the flexible conductive board, according to the shape and size of the conductive pattern, The second plate body performs a pre-stamping process to form a second molded plate body identical to the conductive pattern, wherein an anti-oxidation layer can be formed on the surface of the metal conductive layer in the first conductive space.

In addition, in a fourth preferred embodiment of the present invention, the second board is pre-punched according to the contour of the conductive pattern of the second board to form a reserved area corresponding to the conductive pattern. And a second molding plate formed by a plurality of connecting portions located at a periphery of the reserved area, a plurality of second conductive spaces between the reserved area and the area to be removed, and a plurality of connecting portions connecting the reserved area and the area to be removed.

Wherein, in the second stamping, the first plate body and the connecting portion of the flexible conductive plate are punched and cut in a range larger than the size of the conductive pattern in the second conductive space, so that the second The remaining region of the plate body, the remaining region of the plurality of connecting portions, and the remaining region of the first plate body collectively constitute the flexible conductive substrate.

In the foregoing four embodiments, it is applicable to a case where a single first plate body and a single second plate body have not been processed, wherein the plates of the two plates are substantially the same in size, and finally completed to be manufactured as a single flexible conductive machine. The three embodiments are also applicable to a plurality of first plates and a single second plate, wherein the size of the first plate is smaller than that of the second plate, and finally the manufacturing is completed. The number of flexible conductive plates is the same as the number of the first plates.

Finally, as apparent from the foregoing description, the present invention is characterized in that a method of manufacturing a structure having a flexible substrate is provided, and the technical features of the present invention enable the structure of the present invention to be applied to various industries, wherein In particular, the use of the processing requirements and the lower cost of the stamping and cutting, and the use of hot melt adhesive for the bonding between each single structure, and through the anti-oxidation layer to seal the metal part structure to the outside air, the manufacturing method of the present invention can be matched Low-precision and low-cost equipment can be used to reduce the overall production cost and production time, as well as the conventional etching process using a high-precision device for laser etching and etching with a mask. Suitable for the design and manufacture of non-precision, non-fine conductive circuits.

In order to further clarify and understand the structure, the use and the features of the present invention, the preferred embodiment is described in detail with reference to the following drawings:

The shape of the conductive pattern, the size of the conductive pattern, and the outline of the conductive pattern described in the present specification are respectively defined as: the shape of the conductive pattern is defined by the line, the bending angle, the ratio, and the size of the conductive pattern. The thickness of the structure is not limited; the size of the conductive pattern is defined as the size of the original conductive pattern is increased by several times or reduced by a factor of one or the same, and the thickness of the structure is not limited; the outline of the conductive pattern is defined as Most of the lines are the same as the original conductive pattern, however, the bending angle, the ratio and size, and the thickness of the structure are not limited.

Referring to FIG. 1 and FIG. 2, a first preferred embodiment of the method for manufacturing the flexible conductive substrate 1 of the present invention is as follows. First, a first substrate 2 having a first processed surface and a second processed surface is provided. And a hot melt adhesive layer (heat melt adhesive) which is subjected to warming and softening deformation is press-bonded to one of the processing faces of the first substrate 2 to form a first plate body 4.

Next, the first punching A operation is performed on the first plate body 4, and a plurality of punching holes 40 penetrating the entire first plate body 4 are formed inside the first plate body 4, and the inside of the punching hole 40 is set. A first conductive space 41.

Further, a second board body 5 is provided. The second board body 5 is formed by sequentially connecting a second substrate 50, a bonding layer 51, a metal conductive layer 52 and an anti-oxidation layer 53. The bonding layer 51 is selected from one of copper, nickel, a copper alloy or a nickel alloy, and one surface of the above-mentioned metal conductive layer 52 or other surface not connected to the bonding layer 51 is formed by the above-mentioned oxidation resistant layer 53. The connection sealing is performed so that the metal conductive layer 52 is completely isolated from the outside air, and the oxidation of the metal structure can be avoided. In order to reduce the manufacturing cost, the metal conductive layer 52 of the present invention can be selected when industrially produced. From copper metal materials. The second plate body 5 is connected to the hot-melt adhesive layer 3 of the first plate body 4 after being heated and softened by the metal conductive layer 52, and a soft conductive plate 8 is formed.

Finally, the flexible conductive plate 8 is subjected to a second punching B operation, and the first plate body 4 and the second plate body 5 are cut at the same time, and a flexible conductive substrate 1 having a conductive pattern 9 is formed.

In addition, in order to enable the flexible conductive plate 1 of the present invention to be widely used in various industries, it is also possible to add an adhesive layer (not shown) to the surface of the second plate 5 of the flexible conductive plate 1. In a preferred embodiment, the adhesive layer 90 is a double-sided adhesive made of PET (polyethylene terephthalate) material. The flexible conductive substrate 1 of the present invention can be further connected to other external parts through the adhesive layer 90. object.

The structure of the flexible conductive substrate 1 of the present invention mainly includes a first substrate 2, a hot melt adhesive layer 3, and an oxidation resistance, as described in the related description of the first preferred embodiment of the method for manufacturing the flexible conductive substrate 1 of the present invention. The layer 53, the metal conductive layer 52, the bonding layer 51, and the second substrate 50 are six parts in total, and the opposite surfaces of the metal conductive layer 52 are respectively connected by the bonding layer 51 and the oxidation resistant layer 53 to reduce the metal conductive layer. The total surface area of the 52 contact with the air is either connected to the entire surface of the metal conductive layer 52 to completely avoid the possibility of the metal conductive layer 52 being in contact with the air.

Referring to FIG. 3 and FIG. 4, a second preferred embodiment of the method for manufacturing the flexible conductive substrate 1 of the present invention is characterized in that the manufacturing method different from the first preferred embodiment described above is characterized in that the second is provided. The plate body 5 has a three-layer structure, and is sequentially connected by a second substrate 50, a bonding layer 51, and a metal conductive layer 52. Since the metal conductive layer 52 does not have the oxidation resistant layer in the first embodiment. 53 is protected, and the opposite surfaces of the second plate body 5 are directly connected to the hot melt adhesive layer 3 and the bonding layer 51, respectively, and the remaining surfaces are directly in contact with the air.

In the present embodiment, the second plate body 5 of the three-layer structure is connected to the first plate body 4 to form the flexible conductive plate 8. Further, in the above-described embodiment, after the soft conductive plate 8 is formed, an anti-oxidation layer 53 is formed on the surface of the metal conductive layer 52 in each of the first conductive spaces 41 of the flexible conductive plate 8, Alternatively, after the completion of the flexible conductive substrate 1 of the present invention, an anti-oxidation layer 53 is formed on the surface of the metal conductive layer 52 in each of the first conductive spaces 41 of the flexible conductive plate 8, and thus, The opposite surfaces of the metal conductive layer 52 are transmitted through the bonding layer 51, the hot melt adhesive layer 3, and the oxidation resistant layer 53 without coming into contact with air. The technical features of the other parts are the same as those of the first preferred embodiment described above, and will not be described again.

Referring to FIG. 5, FIG. 6A and FIG. 6B, a third preferred embodiment of the manufacturing method of the flexible conductive substrate 1 of the present invention is different from the manufacturing method of the second preferred embodiment. Before the formation of the flexible conductive plate 8, the second plate 5 provided is required to be advanced in advance, and in the present embodiment, the pre-pressing operation is based on the shape and size of the conductive pattern 9. The second plate body 5 is pre-punched so that the original second plate body 5 is cut to form a second molded plate body 6 which is identical to the conductive pattern 9 described above, and the second formed plate body 6 is further connected to The hot melt adhesive layer 3 of the first plate body 4 is connected to form a flexible conductive plate 8.

Referring to FIG. 7 , FIG. 8A and FIG. 8B , a fourth preferred embodiment of the method for manufacturing the flexible conductive substrate 1 of the present invention is characterized in that the manufacturing method different from the third preferred embodiment described above is characterized in that: In the present embodiment, the pre-pressing operation is performed by pre-pressing the second plate body 5 according to the contour of the conductive pattern 9 (in other words, substantially the same shape as the conductive pattern 9). Two forming plates 7.

The second molding plate 7 is composed of a reserved area 70 corresponding to the conductive pattern 9, a region to be removed 71 located at the periphery of the reserved region 70, and a plurality of regions between the reserved region 70 and the region to be removed 71. The two conductive spaces 72 and the plurality of connecting portions 73 that connect the remaining region 70 and the region to be removed 71 are connected together, and the second conductive space 72 is between the reserved region 70 and the region to be removed 71 and penetrates through the second The gap of the plate 7 is formed, and the connecting portion 73 is designed to maintain a connection between the remaining region 70 and the region to be removed 71, so as to prevent the remaining region 70 from falling away from the second molding plate 7.

Referring to the arrow symbol in FIG. 8B and the broken line portion in the second conductive space 72, in the embodiment, the second punch B is in a plane of the second conductive space 72 on the surface of the second molding plate 7. And performing a second punching B cutting operation on the first plate body 4 and the connecting portion 73 of the flexible conductive plate 8 by a size larger than the size of the conductive pattern 9, so that the reserved area 70 and the plurality of the second plate body 5 The remaining area 731 of the connecting portion 73 and the remaining area 42 of the first plate 4 together constitute the flexible conductive substrate 1 of the present invention, and as shown in the drawing, after the second punch B is cut, in this embodiment The size of the second molding plate 7 is relatively smaller than the size of the first plate body 4 described above.

Through the plane range of the second conductive space 72 on the second molding plate 7, the cutting size of the second punch B in the embodiment is defined, that is, the first plate 4 is subjected to the second punching. The shape and size of the B-cut shape are determined according to the planar range of the second conductive space 72, and the shape and size of the first plate 4 need to satisfy the size of the conductive pattern 9 at the same time (the purpose is to retain the second plate). The reserved area 70 of 5, and the planar extent of the second conductive space 72 described above. The technical features of the other parts are the same as those of the second preferred embodiment described above, and will not be further described herein.

In addition, it should be summarized here that the oxidation resistant layer 53 of the present invention can be formed at four time points in the manufacturing method of the present invention, and one of them is formed on the metal conductive layer 52 when the second plate 5 is provided. a single surface or other surface not connected to the bonding layer 51; second, after the formation of the flexible conductive plate 8, forming an anti-oxidation layer 53 on the surface of the metal conductive layer 52 in the first conductive space 41; Thirdly, the second plate body 5 is subjected to a pre-pressing operation to form the second molding plate body 6 or the second molding plate 7, and is formed on the surface of the metal conductive layer 52 in the first conductive space 41, respectively. An anti-oxidation layer 53; Fourthly, after the flexible conductive substrate 1 of the present invention is fabricated, an anti-oxidation layer 53 is formed on the surface of the metal conductive layer 52 in the first conductive space 41, respectively.

In this way, the structure of the flexible conductive substrate 1 having the non-precision conductive circuit pattern can be manufactured by the embodiments of the four preferred manufacturing methods of the present invention, so that the flexible conductive substrate 1 of the present invention can be applied to a plurality of different structures. The structure of reprocessing applications in the industry is widely used. In addition, the manufacturing method of the present invention can be used in combination with low-order technology, low-precision, and low-cost equipment. Therefore, the manufacturing method of the flexible conductive substrate 1 of the present invention is suitable for manufacturing non-precision, non-fine conductive lines and lower-order technology designs. In the production and manufacturing, the production method such as laser etching using a high-precision device and an etching process using a photomask can greatly reduce the overall production cost and production time.

The above-mentioned embodiments are merely intended to be illustrative of the present invention and are not intended to limit the scope of the invention, and the various modifications and modifications made by those skilled in the art in accordance with the scope of the invention and the description of the invention are still It is included in the scope of the following patent application.

1‧‧‧Soft conductive substrate
2‧‧‧First substrate
3‧‧‧hot melt adhesive layer
4‧‧‧ first board
40‧‧‧punching
41‧‧‧First conduction space
42‧‧‧Residual area
5‧‧‧Second plate
50‧‧‧second substrate
51‧‧‧ joint layer
52‧‧‧Metal conductive layer
53‧‧‧Antioxidant layer
6‧‧‧Second forming plate
7‧‧‧Second forming plate
70‧‧‧ Reserved area
71‧‧‧ want to remove the area
72‧‧‧Second conduction space
73‧‧‧Connecting Department
731‧‧‧Remaining area
8‧‧‧Soft conductive plate
9‧‧‧ conductive pattern
A‧‧‧First stamping ‧‧‧Pre-stamping
B‧‧‧Second stamping

1 to 2 are flow charts of a manufacturing method according to a first preferred embodiment of the present invention; FIG. 3 to FIG. 4 are flowcharts showing a manufacturing method of a second preferred embodiment of the present invention; FIG. 5 to FIG. A flow chart of a manufacturing method of a preferred embodiment; and FIG. 7 to FIG. 8B are flowcharts of a manufacturing method of a fourth preferred embodiment of the present invention.

1‧‧‧Soft conductive substrate

2‧‧‧First substrate

3‧‧‧hot melt adhesive layer

4‧‧‧ first board

40‧‧‧punching

41‧‧‧First conduction space

5‧‧‧Second plate

50‧‧‧second substrate

51‧‧‧ joint layer

52‧‧‧Metal conductive layer

53‧‧‧Antioxidant layer

8‧‧‧Soft conductive plate

9‧‧‧ conductive pattern

A‧‧‧First stamping

B‧‧‧Second stamping

Claims (11)

A method for manufacturing a flexible conductive substrate, comprising: providing a first substrate, connecting a hot melt adhesive layer to one surface of the first substrate to form a first plate; performing the first plate for the first time Pressing to form a plurality of punching holes, the inside of the punching holes forming a first conductive space; providing a second plate body, wherein the second plate body comprises a second substrate and a metal conductive layer connected to each other, the second plate body The metal conductive layer is connected with the hot melt adhesive layer of the first plate body to form a flexible conductive plate; and the second flexible punching plate is subjected to a second punching and cutting, so that the soft conductive plate forms at least one softness having a conductive pattern. Conductive substrate. The method of manufacturing a flexible conductive substrate according to claim 1, wherein the second plate body is connected to the second substrate and the metal conductive layer by a bonding layer, and an anti-oxidation layer is connected to a surface of the metal conductive layer. Together constitute. The method for producing a flexible conductive substrate according to claim 1, wherein an anti-oxidation layer is formed on a surface of the metal conductive layer in the first conductive space of the flexible conductive plate. The method for producing a flexible conductive substrate according to claim 1, wherein the manufacturing method further comprises forming an oxidation resistant layer on a surface of the metal conductive layer in the first conductive space of the flexible conductive substrate. The method for producing a flexible conductive substrate according to claim 1, wherein the manufacturing method further comprises a step of performing a pre-pressing on the second plate. The method for manufacturing a flexible conductive substrate according to claim 5, wherein after the second plate is pre-punched, an anti-oxidation layer is formed on the surface of the metal conductive layer in the first conductive space. . The method for manufacturing a flexible conductive substrate according to claim 5, wherein the second plate is pre-punched according to the shape and size of the conductive pattern to form a second molded plate identical to the conductive pattern. body. The method for manufacturing a flexible conductive substrate according to claim 5, wherein the second plate body is pre-punched according to a contour of the conductive pattern to form a reserved area corresponding to the conductive pattern, and a A second molding plate is formed by a plurality of connecting portions on the periphery of the reserved area, a plurality of second conductive spaces between the reserved area and the area to be removed, and a plurality of connecting portions connecting the reserved area and the area to be removed. The method of manufacturing a flexible conductive substrate according to claim 8, wherein the second stamping is performed on the flexible conductive sheet in a range of the second conductive space by a size larger than the conductive pattern. The first plate body and the connecting portion are press-cut so that the remaining region of the second plate body, the remaining region of the plurality of connecting portions, and the remaining region of the first plate body together constitute the soft conductive substrate. The method for producing a flexible conductive substrate according to claim 1, wherein the metal conductive layer is selected from a copper metal material, and the bonding layer is selected from one of copper, nickel, a copper alloy, or a nickel alloy. The method of manufacturing a flexible conductive substrate according to claim 1, wherein the manufacturing method further comprises: providing an adhesive layer that is coupled to the other external object on the surface of the flexible conductive substrate.