TWI563593B - - Google Patents

Info

Publication number
TWI563593B
TWI563593B TW103140136A TW103140136A TWI563593B TW I563593 B TWI563593 B TW I563593B TW 103140136 A TW103140136 A TW 103140136A TW 103140136 A TW103140136 A TW 103140136A TW I563593 B TWI563593 B TW I563593B
Authority
TW
Taiwan
Application number
TW103140136A
Other versions
TW201526155A (zh
Inventor
Jie Liang
Ping Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201526155A publication Critical patent/TW201526155A/zh
Application granted granted Critical
Publication of TWI563593B publication Critical patent/TWI563593B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW103140136A 2013-11-29 2014-11-19 靜電卡盤加熱測溫電路及等離子體反應裝置 TW201526155A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310631392.7A CN104681462B (zh) 2013-11-29 2013-11-29 静电卡盘加热测温电路及等离子体反应装置

Publications (2)

Publication Number Publication Date
TW201526155A TW201526155A (zh) 2015-07-01
TWI563593B true TWI563593B (zh) 2016-12-21

Family

ID=53316347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103140136A TW201526155A (zh) 2013-11-29 2014-11-19 靜電卡盤加熱測溫電路及等離子體反應裝置

Country Status (2)

Country Link
CN (1) CN104681462B (zh)
TW (1) TW201526155A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI813710B (zh) * 2018-07-03 2023-09-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110502049B (zh) * 2019-08-30 2021-05-07 北京北方华创微电子装备有限公司 卡盘温度控制方法、卡盘温度控制系统及半导体设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200301934A (en) * 2001-12-13 2003-07-16 Tokyo Electron Ltd Plasma process apparatus
TW200527580A (en) * 2004-01-14 2005-08-16 Ngk Insulators Ltd Heating device
TW201249244A (en) * 2011-05-23 2012-12-01 Ching-Chuan Wang Safety control structure for heater wire
TW201304396A (zh) * 2011-07-08 2013-01-16 Nihon Dempa Kogyo Co 恒溫槽控制晶體振盪器的溫度控制電路
TWM448091U (zh) * 2011-05-18 2013-03-01 Nihon Dempa Kogyo Co 附恆溫槽的晶體振盪器及溫度控制電路
TW201344225A (zh) * 2012-04-24 2013-11-01 Hon Hai Prec Ind Co Ltd 電源測試系統

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070050111A (ko) * 2005-11-10 2007-05-15 주성엔지니어링(주) 균일한 온도제어를 위한 정전척 및 이를 포함하는 플라즈마발생장치
CN2909572Y (zh) * 2006-03-17 2007-06-06 富士康(昆山)电脑接插件有限公司 电连接器端子
TW201122746A (en) * 2009-12-25 2011-07-01 Hon Hai Prec Ind Co Ltd Electronic device and tempereture control circuit thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200301934A (en) * 2001-12-13 2003-07-16 Tokyo Electron Ltd Plasma process apparatus
TW200527580A (en) * 2004-01-14 2005-08-16 Ngk Insulators Ltd Heating device
TWM448091U (zh) * 2011-05-18 2013-03-01 Nihon Dempa Kogyo Co 附恆溫槽的晶體振盪器及溫度控制電路
TW201249244A (en) * 2011-05-23 2012-12-01 Ching-Chuan Wang Safety control structure for heater wire
TW201304396A (zh) * 2011-07-08 2013-01-16 Nihon Dempa Kogyo Co 恒溫槽控制晶體振盪器的溫度控制電路
TW201344225A (zh) * 2012-04-24 2013-11-01 Hon Hai Prec Ind Co Ltd 電源測試系統

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI813710B (zh) * 2018-07-03 2023-09-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
CN104681462A (zh) 2015-06-03
CN104681462B (zh) 2018-01-26
TW201526155A (zh) 2015-07-01

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