TWI563125B - Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface - Google Patents

Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface

Info

Publication number
TWI563125B
TWI563125B TW104111104A TW104111104A TWI563125B TW I563125 B TWI563125 B TW I563125B TW 104111104 A TW104111104 A TW 104111104A TW 104111104 A TW104111104 A TW 104111104A TW I563125 B TWI563125 B TW I563125B
Authority
TW
Taiwan
Prior art keywords
metal surface
protecting metal
composition
aqueous dispersion
protecting
Prior art date
Application number
TW104111104A
Other languages
Chinese (zh)
Other versions
TW201538798A (en
Inventor
chun lian Liu
Original Assignee
Suzhou Asanuo Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Asanuo Electronic Technology Co Ltd filed Critical Suzhou Asanuo Electronic Technology Co Ltd
Publication of TW201538798A publication Critical patent/TW201538798A/en
Application granted granted Critical
Publication of TWI563125B publication Critical patent/TWI563125B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW104111104A 2014-04-09 2015-04-07 Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface TWI563125B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410139435.4A CN103993301B (en) 2014-04-09 2014-04-09 A kind of surface-mounted integrated circuit metal surface protectant

Publications (2)

Publication Number Publication Date
TW201538798A TW201538798A (en) 2015-10-16
TWI563125B true TWI563125B (en) 2016-12-21

Family

ID=51307623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111104A TWI563125B (en) 2014-04-09 2015-04-07 Composition and aqueous dispersion for protecting metal surface and method of protecting metal surface

Country Status (2)

Country Link
CN (1) CN103993301B (en)
TW (1) TWI563125B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104294296A (en) * 2014-09-17 2015-01-21 明光市锐创电气有限公司 Cleaning agent used in production of preformed armor rods and production method of cleaning agent
CN104651861B (en) * 2015-01-27 2017-05-31 南京航空航天大学 The expanding rear inner wall washing agent of straight-line joint submerged arc welding tube
CN104862680A (en) * 2015-04-08 2015-08-26 安徽豪鼎金属制品有限公司 Anti-oxidation metal surface treatment agent
CN108611628A (en) * 2016-12-09 2018-10-02 段钰 A kind of metal anti-corrosion protection agent
CN107022762B (en) * 2017-05-08 2019-07-30 广东光华科技股份有限公司 The application of three amido fortified phenols or three amido substituted benzene thiophenols and tiny-etching treatment fluid
CN107365989B (en) * 2017-07-11 2019-08-09 东莞市富默克化工有限公司 A kind of metal surface treating method and its metal protective film obtained
CN108315789A (en) * 2018-03-01 2018-07-24 深圳市盛元半导体有限公司 A kind of copper-based tin plating high temperature resistant protective agent
CN110079142A (en) * 2019-05-23 2019-08-02 深圳市力达纳米科技有限公司 A kind of surface protection water solubility protective agent and method, 5G communications electronics product
CN110257072A (en) * 2019-06-13 2019-09-20 常州时创能源科技有限公司 Silicon wafer one texture-etching side and etching edge additive and its application
CN110373055A (en) * 2019-07-29 2019-10-25 深圳市力达纳米科技有限公司 A kind of water-soluble protective agent and preparation method, integrated circuit of surface protection

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200944367A (en) * 2007-04-18 2009-11-01 Enthone Metallic surface enhancement
TW201247047A (en) * 2011-05-04 2012-11-16 Subtron Technology Co Ltd Circuit structure and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
FR2851258B1 (en) * 2003-02-17 2007-03-30 Commissariat Energie Atomique METHOD OF COATING A SURFACE, FABRICATION OF MICROELECTRONIC INTERCONNECTION USING THE SAME, AND INTEGRATED CIRCUITS
FR2868085B1 (en) * 2004-03-24 2006-07-14 Alchimer Sa METHOD FOR SELECTIVE COATING OF COMPOSITE SURFACE, FABRICATION OF MICROELECTRONIC INTERCONNECTIONS USING THE SAME, AND INTEGRATED CIRCUITS
CN101575704B (en) * 2009-06-12 2011-01-26 林原标 Copper and copper alloy surface conditioning agent
CN103602990B (en) * 2013-11-18 2016-03-30 北京化工大学 The supramolecule inhibiter of a kind of copper and alloy thereof and high-speed stirring preparation method thereof
CN103602992B (en) * 2013-11-19 2015-11-18 北京化工大学 The supramolecule inhibiter of a kind of copper and alloy thereof and extra-fine grinding preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200944367A (en) * 2007-04-18 2009-11-01 Enthone Metallic surface enhancement
TW201247047A (en) * 2011-05-04 2012-11-16 Subtron Technology Co Ltd Circuit structure and manufacturing method thereof

Also Published As

Publication number Publication date
CN103993301A (en) 2014-08-20
TW201538798A (en) 2015-10-16
CN103993301B (en) 2016-09-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees