TWI563052B - Adhesive composition, adhesive film, and processing method of substrate - Google Patents

Adhesive composition, adhesive film, and processing method of substrate

Info

Publication number
TWI563052B
TWI563052B TW102100699A TW102100699A TWI563052B TW I563052 B TWI563052 B TW I563052B TW 102100699 A TW102100699 A TW 102100699A TW 102100699 A TW102100699 A TW 102100699A TW I563052 B TWI563052 B TW I563052B
Authority
TW
Taiwan
Prior art keywords
substrate
processing method
adhesive
adhesive composition
adhesive film
Prior art date
Application number
TW102100699A
Other languages
Chinese (zh)
Other versions
TW201341493A (en
Inventor
Hirofumi Imai
Koki Tamura
Atsushi Kubo
Takahiro Yoshioka
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW201341493A publication Critical patent/TW201341493A/en
Application granted granted Critical
Publication of TWI563052B publication Critical patent/TWI563052B/en

Links

TW102100699A 2012-03-12 2013-01-09 Adhesive composition, adhesive film, and processing method of substrate TWI563052B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012054925 2012-03-12
JP2012283704A JP6063737B2 (en) 2012-03-12 2012-12-26 Adhesive composition, adhesive film and substrate processing method

Publications (2)

Publication Number Publication Date
TW201341493A TW201341493A (en) 2013-10-16
TWI563052B true TWI563052B (en) 2016-12-21

Family

ID=49589347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102100699A TWI563052B (en) 2012-03-12 2013-01-09 Adhesive composition, adhesive film, and processing method of substrate

Country Status (2)

Country Link
JP (1) JP6063737B2 (en)
TW (1) TWI563052B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040236024A1 (en) * 2003-01-28 2004-11-25 Cryovac, Inc. Cycloolefinic copolymer for high modulus film
CN101166784A (en) * 2005-03-29 2008-04-23 大科能树脂有限公司 Antistatic resin composition, antistatic/pressure-sensitive-adhesive resin composition, pressure-sensitive adhesive film, and method for producing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8333697D0 (en) * 1983-12-17 1984-01-25 Exxon Research Engineering Co Hydrocarbon resins
JP2720406B2 (en) * 1989-09-07 1998-03-04 三井化学株式会社 Adhesive for cyclic olefin resin
JP2001287307A (en) * 2000-04-07 2001-10-16 Nippon Zeon Co Ltd Composite molded object and method for manufacturing the same
US8268449B2 (en) * 2006-02-06 2012-09-18 Brewer Science Inc. Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
US20080200011A1 (en) * 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040236024A1 (en) * 2003-01-28 2004-11-25 Cryovac, Inc. Cycloolefinic copolymer for high modulus film
CN101166784A (en) * 2005-03-29 2008-04-23 大科能树脂有限公司 Antistatic resin composition, antistatic/pressure-sensitive-adhesive resin composition, pressure-sensitive adhesive film, and method for producing the same

Also Published As

Publication number Publication date
TW201341493A (en) 2013-10-16
JP6063737B2 (en) 2017-01-18
JP2013216857A (en) 2013-10-24

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