TWI562672B - Heating plate - Google Patents
Heating plateInfo
- Publication number
- TWI562672B TWI562672B TW101148587A TW101148587A TWI562672B TW I562672 B TWI562672 B TW I562672B TW 101148587 A TW101148587 A TW 101148587A TW 101148587 A TW101148587 A TW 101148587A TW I562672 B TWI562672 B TW I562672B
- Authority
- TW
- Taiwan
- Prior art keywords
- heating plate
- heating
- plate
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101148587A TWI562672B (en) | 2012-12-20 | 2012-12-20 | Heating plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101148587A TWI562672B (en) | 2012-12-20 | 2012-12-20 | Heating plate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201427472A TW201427472A (en) | 2014-07-01 |
TWI562672B true TWI562672B (en) | 2016-12-11 |
Family
ID=51725827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101148587A TWI562672B (en) | 2012-12-20 | 2012-12-20 | Heating plate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI562672B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM289949U (en) * | 2005-10-25 | 2006-04-21 | Syntran Co Ltd | Electrical heater structure |
TWI370697B (en) * | 2006-02-20 | 2012-08-11 | Covalent Materials Corp | |
TWI374682B (en) * | 2006-07-20 | 2012-10-11 | Watlow Electric Mfg | Layered heater system having conductive overlays |
-
2012
- 2012-12-20 TW TW101148587A patent/TWI562672B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM289949U (en) * | 2005-10-25 | 2006-04-21 | Syntran Co Ltd | Electrical heater structure |
TWI370697B (en) * | 2006-02-20 | 2012-08-11 | Covalent Materials Corp | |
TWI374682B (en) * | 2006-07-20 | 2012-10-11 | Watlow Electric Mfg | Layered heater system having conductive overlays |
Also Published As
Publication number | Publication date |
---|---|
TW201427472A (en) | 2014-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |