TWI561542B - Polymer particles and the manufacturing process and uses thereof - Google Patents
Polymer particles and the manufacturing process and uses thereofInfo
- Publication number
- TWI561542B TWI561542B TW102134490A TW102134490A TWI561542B TW I561542 B TWI561542 B TW I561542B TW 102134490 A TW102134490 A TW 102134490A TW 102134490 A TW102134490 A TW 102134490A TW I561542 B TWI561542 B TW I561542B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing process
- polymer particles
- particles
- polymer
- manufacturing
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102134490A TWI561542B (en) | 2013-09-25 | 2013-09-25 | Polymer particles and the manufacturing process and uses thereof |
CN201310642706.3A CN103613699B (en) | 2013-09-25 | 2013-12-03 | Polymer particles, method for producing same and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102134490A TWI561542B (en) | 2013-09-25 | 2013-09-25 | Polymer particles and the manufacturing process and uses thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201512232A TW201512232A (en) | 2015-04-01 |
TWI561542B true TWI561542B (en) | 2016-12-11 |
Family
ID=50164426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102134490A TWI561542B (en) | 2013-09-25 | 2013-09-25 | Polymer particles and the manufacturing process and uses thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103613699B (en) |
TW (1) | TWI561542B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109076706A (en) * | 2016-02-29 | 2018-12-21 | 薄膜电子有限公司 | Use the electronic device and its manufacturing method of anisotropy conductiving glue useful in surface mounting technique and this method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200907103A (en) * | 2007-08-01 | 2009-02-16 | Hanwha Chemical Corp | Electroless plating process of crosslinked monodisperse polymer particles with a diameter of micron and the plated particles therefrom |
TW201337957A (en) * | 2012-01-19 | 2013-09-16 | Sekisui Chemical Co Ltd | Conductive particles, conductive material and connection structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3561748B2 (en) * | 1994-10-14 | 2004-09-02 | 綜研化学株式会社 | Anisotropic conductive adhesive |
KR100667374B1 (en) * | 2004-12-16 | 2007-01-10 | 제일모직주식회사 | Polymer Particles for Anisotropic Conductive Packaging Materials, Conductive Particles and an Anisotropic Conductive Packaging Materials Containing the Same |
EP2492288B1 (en) * | 2009-10-22 | 2014-10-01 | Asahi Kasei Chemicals Corporation | Methacrylic resin, molded body thereof, and method for producing methacrylic resin |
CN102485755A (en) * | 2010-12-01 | 2012-06-06 | 河北科技师范学院 | Preparation method of polyacrylonitrile microballoon with special morphology |
-
2013
- 2013-09-25 TW TW102134490A patent/TWI561542B/en active
- 2013-12-03 CN CN201310642706.3A patent/CN103613699B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200907103A (en) * | 2007-08-01 | 2009-02-16 | Hanwha Chemical Corp | Electroless plating process of crosslinked monodisperse polymer particles with a diameter of micron and the plated particles therefrom |
TW201337957A (en) * | 2012-01-19 | 2013-09-16 | Sekisui Chemical Co Ltd | Conductive particles, conductive material and connection structure |
Also Published As
Publication number | Publication date |
---|---|
TW201512232A (en) | 2015-04-01 |
CN103613699A (en) | 2014-03-05 |
CN103613699B (en) | 2016-07-06 |
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