TWI560760B - - Google Patents

Info

Publication number
TWI560760B
TWI560760B TW103137134A TW103137134A TWI560760B TW I560760 B TWI560760 B TW I560760B TW 103137134 A TW103137134 A TW 103137134A TW 103137134 A TW103137134 A TW 103137134A TW I560760 B TWI560760 B TW I560760B
Authority
TW
Taiwan
Application number
TW103137134A
Other versions
TW201616559A (zh
Inventor
Yung-Chi Tsai
Original Assignee
Gta Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gta Electronics Co Ltd filed Critical Gta Electronics Co Ltd
Priority to TW103137134A priority Critical patent/TW201616559A/zh
Publication of TW201616559A publication Critical patent/TW201616559A/zh
Application granted granted Critical
Publication of TWI560760B publication Critical patent/TWI560760B/zh

Links

TW103137134A 2014-10-28 2014-10-28 雷射切割用保護膜組成物及應用 TW201616559A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103137134A TW201616559A (zh) 2014-10-28 2014-10-28 雷射切割用保護膜組成物及應用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103137134A TW201616559A (zh) 2014-10-28 2014-10-28 雷射切割用保護膜組成物及應用

Publications (2)

Publication Number Publication Date
TW201616559A TW201616559A (zh) 2016-05-01
TWI560760B true TWI560760B (zh) 2016-12-01

Family

ID=56508647

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103137134A TW201616559A (zh) 2014-10-28 2014-10-28 雷射切割用保護膜組成物及應用

Country Status (1)

Country Link
TW (1) TW201616559A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202120630A (zh) * 2019-11-13 2021-06-01 奇美實業股份有限公司 保護膜組成物、半導體裝置的製造方法及雷射切割方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239939B (en) * 1999-02-16 2005-09-21 Schott Glas Method of protecting surfaces of glass substrates
TW200631086A (en) * 2004-11-12 2006-09-01 Tokyo Ohka Kogyo Co Ltd Protective film agent for laser dicing and wafer processing method using the protective film agent
WO2009145526A2 (en) * 2008-05-29 2009-12-03 Dongwoo Fine-Chem. Co., Ltd. Protective film composition for wafer dicing
TWM496842U (zh) * 2014-10-28 2015-03-01 Gta Material Co Ltd 雷射切割用保護片

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239939B (en) * 1999-02-16 2005-09-21 Schott Glas Method of protecting surfaces of glass substrates
TW200631086A (en) * 2004-11-12 2006-09-01 Tokyo Ohka Kogyo Co Ltd Protective film agent for laser dicing and wafer processing method using the protective film agent
WO2009145526A2 (en) * 2008-05-29 2009-12-03 Dongwoo Fine-Chem. Co., Ltd. Protective film composition for wafer dicing
TWM496842U (zh) * 2014-10-28 2015-03-01 Gta Material Co Ltd 雷射切割用保護片

Also Published As

Publication number Publication date
TW201616559A (zh) 2016-05-01

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