TWI558855B - Electroplating anti - rocking components - Google Patents

Electroplating anti - rocking components Download PDF

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Publication number
TWI558855B
TWI558855B TW103144925A TW103144925A TWI558855B TW I558855 B TWI558855 B TW I558855B TW 103144925 A TW103144925 A TW 103144925A TW 103144925 A TW103144925 A TW 103144925A TW I558855 B TWI558855 B TW I558855B
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Prior art keywords
plated
electroplating
nozzle
sway
disposed
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TW103144925A
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Chinese (zh)
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TW201623701A (en
Inventor
wu-quan Xu
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Ampoc Equipment Co Ltd
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Priority to TW103144925A priority Critical patent/TWI558855B/en
Publication of TW201623701A publication Critical patent/TW201623701A/en
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Publication of TWI558855B publication Critical patent/TWI558855B/en

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Description

電鍍防晃構件Electroplating anti-sway component

本發明係關於一種防晃構件,更特別的是關於一種電鍍防晃構件,用於設置在一電鍍設備內的一噴嘴上,以限位一待鍍物。The present invention relates to a sway prevention member, and more particularly to an electroplating sway prevention member for arranging a nozzle in an electroplating apparatus to limit a to-be-plated object.

如圖1所示,於習知的電鍍設備1中,複數噴嘴2會不間斷地對一待鍍物3噴出電鍍液,以進行電鍍。為了防止氣泡阻塞於該待鍍物3的孔隙內,以使該待鍍物3的電鍍均勻,該等噴嘴2必須具有大的噴壓,但由於過大的噴出壓力容易導致該待鍍物3晃動,故必須藉由一橋撘結構4來防止該待鍍物3晃動。As shown in Fig. 1, in the conventional electroplating apparatus 1, the plurality of nozzles 2 uninterruptedly eject a plating solution to a to-be-plated material 3 for electroplating. In order to prevent air bubbles from clogging in the pores of the object to be plated 3, so that the plating of the object to be plated 3 is uniform, the nozzles 2 must have a large spray pressure, but the excessive discharge pressure easily causes the object to be plated 3 to sway. Therefore, the object to be plated 3 must be prevented from shaking by a bridge structure 4.

由於該電鍍設備1會對不同尺寸的待鍍物3進行電鍍,例如24吋或16吋。為了對應16吋的待鍍物3,該橋撘結構4的長度係對應16吋的待鍍物3之長度,但當同一個電鍍設備1要電鍍24吋的待鍍物3時,該橋撘結構4只會限位該待鍍物3的下半部,且該等噴嘴2會不間斷地產生大的噴壓至24吋的待鍍物3,故在該橋撘結構4未限位該待鍍物3的部分(圖1中上半部)時,24吋的待鍍物3之上半部容易撞到該等噴嘴2,進而使該電鍍設備1出錯,停止電鍍。對使用者而言,容易降低電鍍效率。Since the plating apparatus 1 electroplates different sizes of the object to be plated 3, for example, 24 吋 or 16 吋. In order to correspond to the 16 Å object to be plated 3, the length of the bridge structure 4 corresponds to the length of the 16 Å object to be plated 3, but when the same plating apparatus 1 is to be plated with 24 Å of the object to be plated 3, the bridge 撘The structure 4 will only limit the lower half of the object to be plated 3, and the nozzles 2 will continuously generate a large spray pressure to the object to be plated 3 of 24 Å, so that the bridge structure 4 is not limited. When the portion of the object to be plated 3 (the upper half in Fig. 1) is used, the upper half of the object to be plated 2 of 24 inches easily hits the nozzles 2, thereby causing the plating apparatus 1 to malfunction and stopping the plating. It is easy for the user to reduce the plating efficiency.

因此,如何發明出一種防晃結構,於電鍍大尺寸的待鍍物時,有效地防止晃動,將是本發明所欲積極揭露之處。Therefore, how to invent a sway prevention structure to effectively prevent sway when plating a large-sized object to be plated is a positive disclosure of the present invention.

為解決上述現有技術的問題,本發明之一目的在於提供一種電鍍防晃構件,於電鍍大尺寸的一待鍍物時,有效地防止晃動。In order to solve the above problems of the prior art, it is an object of the present invention to provide an electroplating anti-sway member which is effective in preventing sloshing when electroplating a large-sized object to be plated.

為達上述目的及其他目的,本發明提出一種電鍍防晃構件,用於設置在一電鍍設備內的一噴嘴上,以限位一待鍍物,該電鍍防晃構件包含:一本體;一卡固部,設置於該本體,以將該本體固定於該噴嘴;一彈性臂,設置於該本體,並朝遠離該卡固部的方向延伸;及一抵頂部,設置於該彈性臂的自由端,以限位該待鍍物。To achieve the above and other objects, the present invention provides an electroplating anti-sway member for disposing a nozzle in a plating apparatus to limit a to-be-plated object, the electroplating anti-sway member comprising: a body; a card a solid portion disposed on the body to fix the body to the nozzle; a resilient arm disposed on the body and extending away from the securing portion; and a top portion disposed at the free end of the resilient arm To limit the object to be plated.

於本發明之電鍍防晃構件中,該抵頂部接觸該待鍍物的部分為圓弧狀。In the electroplating anti-sway member of the present invention, the portion of the abutting top that contacts the object to be plated has an arc shape.

於本發明之電鍍防晃構件中,該卡固部具有一套設固定件及一卡合固定件,該套設固定件套設於該噴嘴的一頭部,該卡合固定件卡固於該噴嘴的一管部。In the electroplating anti-swaying member of the present invention, the securing portion has a set of fixing members and a locking fixing member, and the sleeve fixing member is sleeved on a head of the nozzle, and the engaging fixing member is fastened a tube portion of the nozzle.

於本發明之電鍍防晃構件中,該本體、該卡固件、該彈性臂及該抵頂部係為一體成型。In the electroplating anti-sway member of the present invention, the body, the fastener, the elastic arm and the abutting top are integrally formed.

藉此,本發明電鍍防晃構件藉由上述的結構,設置於該電鍍設備後,於電鍍大尺寸的待鍍物時,限位該待鍍物,以防止該待鍍物過度搖晃。Therefore, the electroplating anti-swaying member of the present invention is disposed on the electroplating apparatus by the above-mentioned structure, and when plating a large-sized object to be plated, the object to be plated is limited to prevent the object to be plated from being excessively shaken.

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.

請參照圖2至圖4,其係為本發明電鍍防晃構件100及該電鍍防晃構件100設置於習知的電鍍設備1的一噴嘴2上之示意圖。該電鍍防晃構件100用於限位一待鍍物3,該電鍍防晃構件100包含一本體10、一卡固部20、一彈性臂30及一抵頂部40。Please refer to FIG. 2 to FIG. 4 , which are schematic diagrams of the electroplating anti-sway member 100 and the electroplating anti-sway member 100 of the present invention disposed on a nozzle 2 of a conventional electroplating apparatus 1 . The electroplating anti-swaying member 100 is used for limiting a to-be-plated object 3. The electroplating anti-swaying member 100 includes a body 10, a fastening portion 20, a resilient arm 30 and an abutting top 40.

該卡固部20設置於該本體10,以將該本體10固定於該噴嘴2,更具體而言,如圖4所示,該卡固部20具有一套設固定件21及一卡合固定件22,該套設固定件21套設於該噴嘴2的一頭部2a,該卡合固定件22卡固於該噴嘴2的一管部2b。藉此,使該電鍍防晃構件100穩固地固定於該噴嘴2。The fixing portion 20 is disposed on the body 10 to fix the body 10 to the nozzle 2, and more specifically, as shown in FIG. 4, the fastening portion 20 has a set of fixing members 21 and a clamping and fixing portion. The sleeve 22 is sleeved on a head portion 2a of the nozzle 2, and the snap fixing member 22 is fastened to a tube portion 2b of the nozzle 2. Thereby, the plating anti-sway member 100 is firmly fixed to the nozzle 2.

該彈性臂30設置於該本體10,並朝遠離該卡固部20的方向延伸。並且,該抵頂部40設置於該彈性臂30的自由端,以限位該待鍍物3;其中,該抵頂部40接觸該待鍍物3的部分為圓弧狀,以防止該抵頂部40刮到該待鍍物3的表面。The elastic arm 30 is disposed on the body 10 and extends away from the fastening portion 20 . Moreover, the abutting top 40 is disposed at the free end of the elastic arm 30 to limit the object to be plated 3; wherein the portion of the abutting top 40 that contacts the object to be plated 3 has an arc shape to prevent the top portion 40 from being offset. The surface of the object to be plated 3 is scraped.

接著,請參照圖3,當該電鍍設備1要對該待鍍物3進行電鍍時,由於該橋撘結構4無法限位該待鍍物3的上半部,藉由該電鍍防晃構件100來限位該待鍍物3的上半部,以防止該待鍍物3因該等噴嘴2的噴壓而過度晃動。Next, referring to FIG. 3, when the plating apparatus 1 is to electroplate the object to be plated 3, since the bridge structure 4 cannot limit the upper half of the object to be plated 3, the plated anti-sway member 100 The upper half of the object to be plated 3 is limited to prevent the object to be plated 3 from excessively shaking due to the spray pressure of the nozzles 2.

接著,藉由圖5至圖7及以下敘述,說明該電鍍防晃構件100與該橋撘結構4的關係。當該電鍍設備1要對小尺寸的待鍍物3進行電鍍時,該橋撘結構4逐漸上升,會使該電鍍防晃構件100的彈性臂30向上彎曲,直到該橋撘結構4完全上升來限位該待鍍物3,其中,該電鍍防晃構件100的彈性臂30與抵頂部40介於該橋撘結構4間。Next, the relationship between the plating anti-sway member 100 and the bridge structure 4 will be described with reference to FIGS. 5 to 7 and the following description. When the electroplating apparatus 1 is to electroplate a small-sized object to be plated 3, the bridge structure 4 is gradually raised, and the elastic arm 30 of the electroplating anti-sway member 100 is bent upward until the bridge structure 4 is completely raised. The object to be plated 3 is limited, wherein the elastic arm 30 and the abutting top 40 of the electroplating anti-sway member 100 are interposed between the bridge structures 4.

當該電鍍設備1要再次對大尺寸的待鍍物3進行電鍍時,由於該橋撘結構4會逐漸下降,會使該電鍍防晃構件100的彈性臂30向下彎曲,直到該橋撘結構4完全下降來對應大尺寸的待鍍物3,其中,該電鍍防晃構件100的彈性臂30與抵頂部40離開該橋撘結構4。When the electroplating apparatus 1 is to electroplate the large-sized object to be plated 3 again, since the bridge structure 4 is gradually lowered, the elastic arm 30 of the electroplating anti-sway member 100 is bent downward until the bridge structure 4 is completely lowered to correspond to the large-sized object to be plated 3, wherein the elastic arm 30 of the plated anti-sway member 100 and the abutting top 40 are separated from the bridge structure 4.

由上述可知,由於該電鍍防晃構件100具有彈性臂30,故當該橋撘結構4升降時,不會被該電鍍防晃構件100卡柱;換言之,該電鍍設備1藉由該等電鍍防晃構件100與該橋撘結構4的設置,不論是對大尺寸或小尺寸的待鍍物3,皆可有效防止其晃動。As can be seen from the above, since the plating anti-sway member 100 has the elastic arm 30, when the bridge structure 4 is raised and lowered, it is not stuck by the plating anti-sway member 100; in other words, the plating apparatus 1 is protected by the plating. The arrangement of the swaying member 100 and the bridge structure 4 can effectively prevent the swaying of the object to be plated 3 of a large size or a small size.

另外,應了解到,該本體10、該卡固件20、該彈性臂30及該抵頂部40係為一體成型。藉此,降低製造成本,並提高該電鍍防晃構件100的結構強度。In addition, it should be understood that the body 10, the fastener 20, the elastic arm 30 and the abutting top 40 are integrally formed. Thereby, the manufacturing cost is lowered, and the structural strength of the plating anti-sway member 100 is improved.

綜上所述,本發明電鍍防晃構件藉由上述的結構,設置於該電鍍設備後,於電鍍大尺寸的待鍍物時,限位該待鍍物,以防止該待鍍物因過度搖晃而撞到該等噴嘴中。In summary, the electroplating anti-swaying member of the present invention is disposed in the electroplating apparatus by the above-mentioned structure, and when plating a large-sized object to be plated, the object to be plated is limited to prevent the object to be plated from being excessively shaken. And hit the nozzles.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

1‧‧‧電鍍設備
2‧‧‧噴嘴
3‧‧‧待鍍物
4‧‧‧橋撘結構
10‧‧‧本體
20‧‧‧卡固部
21‧‧‧套設固定件
22‧‧‧卡合固定件
30‧‧‧彈性臂
40‧‧‧抵頂部
100‧‧‧電鍍防晃構件
1‧‧‧Electroplating equipment
2‧‧‧ nozzle
3‧‧‧Battery to be plated
4‧‧‧Bridge structure
10‧‧‧ Ontology
20‧‧‧Card Department
21‧‧‧Settings
22‧‧‧Clamping fixtures
30‧‧‧Flexible arm
40‧‧‧ arrive at the top
100‧‧‧Electroplating anti-sway component

[圖1]係為習知的電鍍設備電鍍一待鍍物的示意圖。 [圖2]係為本發明電鍍防晃構件的示意圖。 [圖3]係為本發明電鍍防晃構件設置於該電鍍設備的示意圖。 [圖4]係為本發明電鍍防晃構件固定於一噴嘴的示意圖。 [圖5]係為該電鍍設備之橋撘上升的示意圖。 [圖6]係為本發明電鍍防晃構件與該電鍍設備之橋撘的示意圖。 [圖7]係為該電鍍設備之橋撘下降的示意圖。[Fig. 1] is a schematic view of plating a material to be plated by a conventional plating apparatus. Fig. 2 is a schematic view showing the electroplating anti-sway member of the present invention. Fig. 3 is a schematic view showing the plating anti-sway member of the present invention installed in the electroplating apparatus. Fig. 4 is a schematic view showing the plating anti-sway member of the present invention fixed to a nozzle. [Fig. 5] is a schematic view showing the rise of the bridge of the plating apparatus. Fig. 6 is a schematic view showing the bridge of the electroplating anti-sway member of the present invention and the electroplating apparatus. [Fig. 7] is a schematic view showing the bridge cascading of the plating apparatus.

10‧‧‧本體 10‧‧‧ Ontology

20‧‧‧卡固部 20‧‧‧Card Department

21‧‧‧套設固定件 21‧‧‧Settings

22‧‧‧卡合固定件 22‧‧‧Clamping fixtures

30‧‧‧彈性臂 30‧‧‧Flexible arm

40‧‧‧抵頂部 40‧‧‧ arrive at the top

100‧‧‧電鍍防晃構件 100‧‧‧Electroplating anti-sway component

Claims (5)

一種電鍍防晃構件,用於設置在一電鍍設備內的一噴嘴上,以限位一待鍍物,該電鍍防晃構件包含: 一本體; 一卡固部,設置於該本體,以將該本體固定於該噴嘴; 一彈性臂,設置於該本體,並朝遠離該卡固部的方向延伸;及 一抵頂部,設置於該彈性臂的自由端,以限位該待鍍物。An electroplating anti-swaying member is disposed on a nozzle in an electroplating apparatus to limit a to-be-plated object, the electroplating anti-swaying member comprises: a body; a fixing portion disposed on the body to The body is fixed to the nozzle; a resilient arm is disposed on the body and extends away from the fastening portion; and an abutting top is disposed at the free end of the elastic arm to limit the object to be plated. 如請求項1所述之電鍍防晃構件,其中,該抵頂部接觸該待鍍物的部分為圓弧狀。The electroplating anti-sway member according to claim 1, wherein the portion of the abutting top that contacts the object to be plated has an arc shape. 如請求項2所述之電鍍防晃構件,其中,該卡固部具有一套設固定件及一卡合固定件,該套設固定件套設於該噴嘴的一頭部,該卡合固定件卡固於該噴嘴的一管部。The electroplating anti-sway member according to claim 2, wherein the fastening portion has a set of fixing members and a locking fixing member, and the sleeve fixing member is sleeved on a head of the nozzle, and the engaging portion is fixed The piece is fastened to a tube portion of the nozzle. 如請求項1所述之電鍍防晃構件,其中,該卡固部具有一套設固定件及一卡合固定件,該套設固定件套設於該噴嘴的一頭部,該卡合固定件卡固於該噴嘴的一管部。The electroplating swaying member according to claim 1, wherein the fastening portion has a set of fixing members and a snap fixing member, and the sleeve fixing member is sleeved on a head of the nozzle, and the engaging portion is fixed The piece is fastened to a tube portion of the nozzle. 如請求項1至4中任一項所述之電鍍防晃構件,其中,該本體、該卡固件、該彈性臂及該抵頂部係為一體成型。The electroplating anti-sway member according to any one of claims 1 to 4, wherein the body, the fastener, the elastic arm and the abutting top are integrally formed.
TW103144925A 2014-12-23 2014-12-23 Electroplating anti - rocking components TWI558855B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681081B (en) * 2017-12-20 2020-01-01 亞碩企業股份有限公司 Activity protection mechanism for electroplating equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1428462A (en) * 2001-12-27 2003-07-09 丸仲工业株式会社 Product guide mechanism for electroplanting processing device
CN202830212U (en) * 2012-06-29 2013-03-27 健鼎(无锡)电子有限公司 Electroplating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1428462A (en) * 2001-12-27 2003-07-09 丸仲工业株式会社 Product guide mechanism for electroplanting processing device
CN202830212U (en) * 2012-06-29 2013-03-27 健鼎(无锡)电子有限公司 Electroplating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681081B (en) * 2017-12-20 2020-01-01 亞碩企業股份有限公司 Activity protection mechanism for electroplating equipment

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