TWI557097B - Shape memeory alloy ceramic composite material for three dimensional printing and application method thereof - Google Patents
Shape memeory alloy ceramic composite material for three dimensional printing and application method thereof Download PDFInfo
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本發明是有關於一種用於三維列印的材料及其應用方法,且特別是有關於一種用於三維列印的記憶合金陶瓷複合材料及其應用方法。 The invention relates to a material for three-dimensional printing and a method for applying the same, and in particular to a memory alloy ceramic composite material for three-dimensional printing and a method for applying the same.
隨著科技的日新月異,傳統的平面複印技術已無法滿足使用上的需求。有鑑於此,眾多廠商無不積極投入三維列印(或稱立體列印)技術的開發與研究。常見的三維列印技術包括積層製造技術(Additive Manufacturing,AM),而目前的積層製造技術主要以雷射燒結積層製造技術(Laser Sintering)為主。在雷射燒結積層製造技術中,如何提升所列印出之立體物件的緻密度與強度,為本領域技術人員亟欲發展的目標。 With the rapid development of technology, traditional flat copying technology can no longer meet the needs of use. In view of this, many manufacturers are actively involved in the development and research of three-dimensional printing (or three-dimensional printing) technology. Common three-dimensional printing technologies include Additive Manufacturing (AM), and current laminated manufacturing technologies are mainly based on Laser Sintering. In the laser sinter lamination manufacturing technology, how to increase the density and strength of the listed three-dimensional objects is an object of development for those skilled in the art.
本發明提供一種用於三維列印的記憶合金陶瓷複合材料及其應用方法,可降低熱能與溫度的急速變化對於陶瓷粉體所造成的熱應力影響,並減少裂紋發生,因此,可進一步提升所列印出之立體物件的緻密度與強度。 The invention provides a memory alloy ceramic composite material for three-dimensional printing and an application method thereof, which can reduce the influence of the rapid change of thermal energy and temperature on the thermal stress caused by the ceramic powder, and reduce the occurrence of cracks, thereby further improving the The density and strength of the printed three-dimensional object.
本發明提出一種用於三維列印的記憶合金陶瓷複合材料,包括陶瓷粉體與記憶合金粉體。陶瓷粉體的材料包括氧化鋯、氧化鋁、氮化矽、碳化矽或氧化矽等。記憶合金粉體的材料包括金-鎘合金、銀-鎘合金、銅-鋅合金、銅-鋅-鋁合金、銅-鋅-錫合金、銅-鋅-矽合金、銅-錫合金、銅-鋅-鎵合金、銦-鈦合金、金-銅-鋅合金、鎳-鋁合金、鐵-鉑合金、鈦-鎳合金、鈦-鎳-鈀合金、鈦-鈮合金、鈾-鈮合金或鐵-錳-硫合金。所述記憶合金陶瓷複合材料經雷射光照射後,其中記憶合金粉體會融化並填入陶瓷粉體之間的縫隙中。 The invention provides a memory alloy ceramic composite material for three-dimensional printing, comprising ceramic powder and memory alloy powder. The material of the ceramic powder includes zirconia, alumina, tantalum nitride, tantalum carbide or ruthenium oxide. Memory alloy powder materials include gold-cadmium alloy, silver-cadmium alloy, copper-zinc alloy, copper-zinc-aluminum alloy, copper-zinc-tin alloy, copper-zinc-bismuth alloy, copper-tin alloy, copper- Zinc-gallium alloy, indium-titanium alloy, gold-copper-zinc alloy, nickel-aluminum alloy, iron-platinum alloy, titanium-nickel alloy, titanium-nickel-palladium alloy, titanium-niobium alloy, uranium-niobium alloy or iron - Manganese-sulfur alloy. After the memory alloy ceramic composite material is irradiated by laser light, the memory alloy powder is melted and filled into the gap between the ceramic powder bodies.
本發明提出一種三維列印方法,包括以下步驟。首先,提供前述記憶合金陶瓷複合材料於基材上。接著,以雷射光照射所述用於三維列印的記憶合金陶瓷複合材料,以使記憶合金粉體融化並填入陶瓷粉體之間的縫隙中而形成三維列印材料。 The present invention proposes a three-dimensional printing method comprising the following steps. First, the aforementioned memory alloy ceramic composite material is provided on a substrate. Next, the memory alloy ceramic composite material for three-dimensional printing is irradiated with laser light to melt the memory alloy powder and fill the gap between the ceramic powder bodies to form a three-dimensional printing material.
基於上述,本發明之用於三維列印的記憶合金陶瓷複合材料經雷射光照射後,其中記憶合金粉體會融化並填入陶瓷粉體之間的縫隙中。亦即,經雷射光照射後,記憶合金粉體可作為陶瓷粉體接合的黏接劑,以形成三維列印材料。如此一來,可降低熱能與溫度的急速變化對於陶瓷粉體所造成的熱應力影響,並減 少裂紋發生。因此,利用本發明提出的記憶合金陶瓷複合材料所進行之三維列印方法,可進一步提升所列印出之立體物件的緻密度與強度。 Based on the above, the memory alloy ceramic composite material for three-dimensional printing of the present invention is irradiated with laser light, wherein the memory alloy powder is melted and filled into the gap between the ceramic powder bodies. That is, after being irradiated by laser light, the memory alloy powder can be used as a bonding agent for ceramic powder bonding to form a three-dimensional printing material. In this way, the thermal stress caused by the ceramic powder can be reduced and reduced by the rapid change of thermal energy and temperature. Less cracking occurs. Therefore, the three-dimensional printing method performed by the memory alloy ceramic composite material proposed by the present invention can further enhance the density and strength of the printed three-dimensional object.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
10‧‧‧基材 10‧‧‧Substrate
100‧‧‧雷射光 100‧‧‧Laser light
200‧‧‧記憶合金陶瓷複合材料 200‧‧‧Memory Alloy Ceramic Composites
202‧‧‧記憶合金粉體 202‧‧‧Memory alloy powder
202a‧‧‧融化的記憶合金粉體 202a‧‧‧melted memory alloy powder
204‧‧‧陶瓷粉體 204‧‧‧Ceramic powder
205‧‧‧三維列印材料 205‧‧‧3D printing materials
圖1至圖2是依據本發明一實施例之三維列印方法的流程示意圖。 1 to 2 are schematic flow charts of a three-dimensional printing method according to an embodiment of the present invention.
本發明一實施例之用於三維列印的記憶合金陶瓷複合材料可包括陶瓷粉體與記憶合金粉體。陶瓷粉體的材料可包括氧化鋯(zirconium oxide)、氧化鋁(aluminum oxide)、氮化矽(silicon nitride)、碳化矽(silicon carbide)或氧化矽(silicon oxide)等。記憶合金粉體的材料可包括金-鎘合金(Au-Cd)、銀-鎘合金(Ag-Cd)、銅-鋅合金(Cu-Zn)、銅-鋅-鋁合金(Cu-Zn-Al)、銅-鋅-錫合金(Cu-Zn-Sn)、銅-鋅-矽合金(Cu-Zn-Si)、銅-錫合金(Cu-Sn)、銅-鋅-鎵合金(Cu-Zn-Ga)、銦-鈦合金(In-Ti)、金-銅-鋅合金(Au-Cu-Zn)、鎳-鋁合金(Ni-Al)、鐵-鉑合金(Fe-Pt)、鈦-鎳合金(Ti-Ni)、鈦-鎳-鈀合金(Ti-Ni-Pd)、鈦-鈮合金(Ti-Nb)、 鈾-鈮合金(U-Nb)或鐵-錳-硫合金(Fe-Mn-S)。在本實施例中,陶瓷粉體的含量例如是60wt%至95wt%,該記憶合金粉體的含量例如是5wt%至40wt%。陶瓷粉體的粒徑例如是1μm至50μm,記憶合金粉的粒徑例如是100nm至10μm。 The memory alloy ceramic composite material for three-dimensional printing according to an embodiment of the present invention may include ceramic powder and memory alloy powder. The material of the ceramic powder may include zirconium oxide, aluminum oxide, silicon nitride, silicon carbide or silicon oxide. The material of the memory alloy powder may include gold-cadmium alloy (Au-Cd), silver-cadmium alloy (Ag-Cd), copper-zinc alloy (Cu-Zn), copper-zinc-aluminum alloy (Cu-Zn-Al). ), Cu-Zn-Sn alloy, Cu-Zn-Si, Cu-Sn, Cu-Sn, Cu-Zn -Ga), Indium-Titanium Alloy (In-Ti), Gold-Copper-Zinc Alloy (Au-Cu-Zn), Nickel-Aluminum Alloy (Ni-Al), Iron-Platinum Alloy (Fe-Pt), Titanium- Nickel alloy (Ti-Ni), titanium-nickel-palladium alloy (Ti-Ni-Pd), titanium-bismuth alloy (Ti-Nb), Uranium-niobium alloy (U-Nb) or iron-manganese-sulfur alloy (Fe-Mn-S). In the present embodiment, the content of the ceramic powder is, for example, 60% by weight to 95% by weight, and the content of the memory alloy powder is, for example, 5% by weight to 40% by weight. The particle diameter of the ceramic powder is, for example, 1 μm to 50 μm, and the particle diameter of the memory alloy powder is, for example, 100 nm to 10 μm.
記憶合金粉體是由形狀記憶合金(Shape Memory Alloy,SMA)所構成,故具有形狀記憶效應(Shape Memory Effect,SME)。記憶合金粉體所具有的形狀記憶效應,可使其在經過加工賦型後,加熱到一定的溫度,受外力作用後變形,在變形狀態下冷卻並凍結應力。之後,當再次加熱到一定溫度時釋放應力,能自動回復到原來的賦型狀態。由於記憶合金粉體具有形狀記憶效應,因此,可使利用本發明提出的記憶合金陶瓷複合材料所列印出之立體物件在成形後不易變形。 The memory alloy powder is composed of Shape Memory Alloy (SMA) and therefore has a Shape Memory Effect (SME). The shape memory effect of the memory alloy powder can be heated to a certain temperature after being processed and shaped, deformed by an external force, and cooled and frozen in a deformed state. After that, when the temperature is again heated to a certain temperature, the stress is released, and the original shaping state can be automatically restored. Since the memory alloy powder has a shape memory effect, the three-dimensional object printed by the memory alloy ceramic composite material proposed by the present invention can be easily deformed after forming.
另一方面,記憶合金粉體更具有擬彈性(Pseudoelasticity)。亦即,當記憶合金粉體在高於相變態溫度下,施以應力使其受到有限度的塑性變形(非線性彈性變形)後,可利用直接釋放應力的方式,使其恢復到變形前的原始形狀。由於記憶合金粉體具有擬彈性,因此,當本發明之用於三維列印的記憶合金陶瓷複合材料經雷射光照射後,熱應力會造成記憶合金粉體相變而體積膨脹,故具有阻擋裂縫以防止裂縫產生之效果。 On the other hand, the memory alloy powder is more Pseudoelasticity. That is, when the memory alloy powder is subjected to a limited plastic deformation (non-linear elastic deformation) at a temperature higher than the phase transformation temperature, the direct release stress can be used to restore the deformation before the deformation. Original shape. Since the memory alloy powder has pseudo-elasticity, when the memory alloy ceramic composite material for three-dimensional printing of the present invention is irradiated by laser light, thermal stress causes the memory alloy powder to undergo phase transformation and volume expansion, so that it has a barrier crack. To prevent the effect of cracks.
值得說明的是,在本發明一實施例中,記憶合金粉體的材料例如是鈦-鎳合金。此時,由於鈦-鎳合金對於氧化鋯的濕潤性(Wettability)良好,因此,記憶合金粉體可較佳地附著於陶瓷粉 體的表面上。另一方面,鈦-鎳合金與氧化鋯可能會形成氧化鈦(TiOx),因此,可強化記憶合金粉體與陶瓷粉體之間結合性。 It is to be noted that, in an embodiment of the invention, the material of the memory alloy powder is, for example, a titanium-nickel alloy. At this time, since the titanium-nickel alloy has good wettability to zirconia, the memory alloy powder can be preferably attached to the ceramic powder. On the surface of the body. On the other hand, titanium-nickel alloy and zirconia may form titanium oxide (TiOx), and therefore, the bond between the memory alloy powder and the ceramic powder can be strengthened.
圖1至圖2是依據本發明一實施例之三維列印方法的流程示意圖。所述三維列印方法包括利用上述實施例的記憶合金陶瓷複合材料以選擇性雷射燒結(Selective Laser Sintering;SLS)技術進行三維列印。基本上,先於一基材上逐層鋪覆記憶合金陶瓷複合材料、利用雷射光進行掃描燒結,使粉體材料融合結合一起,逐層堆疊成形而得到三維列印物件。以下將配合圖式詳細說明本發明一實施例之三維列印方法的流程。 1 to 2 are schematic flow charts of a three-dimensional printing method according to an embodiment of the present invention. The three-dimensional printing method includes three-dimensional printing using a selective alloying (SLS) technique using the memory alloy ceramic composite of the above embodiment. Basically, the memory alloy ceramic composite material is layered on a substrate first, and the scanning and sintering are performed by using laser light, and the powder materials are fused and combined together, and stacked three-dimensionally to obtain a three-dimensional printed object. Hereinafter, the flow of the three-dimensional printing method according to an embodiment of the present invention will be described in detail with reference to the drawings.
請參照圖1,提供上述實施例的記憶合金陶瓷複合材料200而鋪設於一基材10上,其包括記憶合金粉體202與陶瓷粉體204。之後,以雷射光100照射記憶合金粉體202與陶瓷粉體204。在本實施例中,所述雷射光100的能量範圍為10W至100W,照射於記憶合金陶瓷複合材料200之溫度範圍為1000℃至1700℃,雷射光100例如是由1064nm的光纖雷射光源所提供。然而,本發明並不以此為限。 Referring to FIG. 1, a memory alloy ceramic composite material 200 of the above embodiment is provided and laid on a substrate 10, which includes a memory alloy powder 202 and a ceramic powder body 204. Thereafter, the memory alloy powder 202 and the ceramic powder 204 are irradiated with the laser light 100. In this embodiment, the energy of the laser light 100 ranges from 10W to 100W, and the temperature of the memory alloy ceramic composite 200 is 1000° C. to 1700° C., and the laser light 100 is, for example, a 1064 nm fiber laser source. provide. However, the invention is not limited thereto.
接著,請同時參照圖1與圖2,記憶合金粉體202與陶瓷粉體204經雷射光100照射後,其中記憶合金粉體202會融化形成融化的記憶合金粉體202a,填入陶瓷粉體204之間的縫隙中,而使兩者相互融合結合,形成三維列印材料205,而使得記憶合金陶瓷複合材料200成形。更具體而言,經雷射光100照射後,所形成之融化的記憶合金粉體202a等同作為陶瓷粉體204接合的黏 接劑,因此,使兩者相互融合結合形成三維列印材料205,而幫助記憶合金陶瓷複合材料成形並提升所列印出之立體物件的緻密度。 Next, referring to FIG. 1 and FIG. 2 simultaneously, after the memory alloy powder 202 and the ceramic powder body 204 are irradiated by the laser light 100, the memory alloy powder 202 is melted to form the melted memory alloy powder 202a, and the ceramic powder body is filled. In the gap between the 204s, the two are fused together to form a three-dimensional printing material 205, and the memory alloy ceramic composite material 200 is formed. More specifically, after being irradiated by the laser light 100, the formed melted memory alloy powder 202a is equivalent to the bonding of the ceramic powder 204. The bonding agent, therefore, combines the two to form a three-dimensional printing material 205, and helps the memory alloy ceramic composite to shape and enhance the density of the printed three-dimensional object.
綜上所述,本發明所提出的用於三維列印的記憶合金陶瓷複合材料,其包括陶瓷粉體與記憶合金粉體。記憶合金粉體具有良好的熱傳導係數,導熱速度較快,因此,可降低熱能與溫度的急速變化對於陶瓷粉體所造成的熱應力影響。再者,由於記憶合金粉體韌性較佳,因此,利用本發明提出的記憶合金陶瓷複合材料所進行之三維列印方法,可改善所列印出之立體物件的機械性質如斷裂韌性,並降低裂紋形成的可能性。此外,記憶合金粉體更具有形狀記憶性與擬彈性。形狀記憶性可使所列印出之立體物件成形後不易變形,擬彈性則具有阻擋裂縫以防止裂縫產生之效果。值得說明的是,本發明所提出之用於三維列印的記憶合金陶瓷複合材料,經雷射光照射後,複合材料中的記憶合金粉體會融化並填入陶瓷粉體之間的縫隙中,兩者相互融合結合,得到成形的三維列印材料;而採用此種複合材料作為三維列印的材料來進行三維列印,可提升三維列印時所列印出之立體物件的緻密度。 In summary, the memory alloy ceramic composite material for three-dimensional printing proposed by the present invention comprises ceramic powder and memory alloy powder. The memory alloy powder has a good heat transfer coefficient and a fast heat transfer rate, so that the thermal stress caused by the ceramic powder can be reduced by the rapid change of heat energy and temperature. Furthermore, since the memory alloy powder has good toughness, the three-dimensional printing method performed by the memory alloy ceramic composite material proposed by the present invention can improve the mechanical properties such as fracture toughness of the printed three-dimensional object and reduce The possibility of crack formation. In addition, the memory alloy powder has more shape memory and pseudo-elasticity. The shape memory property can make the printed three-dimensional object less deformable after being formed, and the pseudo-elasticity has the effect of blocking cracks to prevent cracks from being generated. It should be noted that the memory alloy ceramic composite material for three-dimensional printing proposed by the present invention is irradiated by laser light, and the memory alloy powder in the composite material is melted and filled into the gap between the ceramic powder bodies, The three-dimensional printing materials are obtained by combining and integrating each other; and the three-dimensional printing is performed by using the composite material as a three-dimensional printing material, thereby increasing the density of the three-dimensional objects printed in the three-dimensional printing.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧基材 10‧‧‧Substrate
202a‧‧‧融化的記憶合金粉體 202a‧‧‧melted memory alloy powder
204‧‧‧陶瓷粉體 204‧‧‧Ceramic powder
205‧‧‧三維列印材料 205‧‧‧3D printing materials
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