TWI556962B - Polyimide substrate and display substrate module including the same - Google Patents

Description

Polyimide substrate and display substrate module comprising the same

The present invention relates to a polyimide substrate and a display substrate module including the polyimide substrate, and more particularly to an excellent flexibility and impact resistance, which can be effectively used as a cover for flexible electronic equipment. A polyimide substrate of a substrate and a display substrate module including the polyimide substrate.

Recently, electronic devices that can be bent in a new generation of displays are favored, including flexible photovoltaic elements represented by flexible organic light-emitting diodes, lightweight displays, and flexible packages. Flexible electronic instruments such as materials, color EPD, plastic LCD, TSP and OPV. Such a bendable flexible type display device requires not only display, but also a novel flexible cover substrate that can replace the existing glass cover substrate in order to protect the bottom member. At the same time, in order to protect the components included in the display device, such a substrate needs to maintain low moisture permeability, chemical resistance, and light transmittance.

As a material for such a flexible display covering substrate, a variety of high-hardness plastic substrates have been studied as candidate materials, and a transparent polyimide film capable of achieving high hardness has been mainly used as a candidate material. However, the transparent plastic substrate has a low surface hardness as compared with glass, and therefore, it is limited in securing wear resistance. For this reason, a high hardness coating for improving the surface hardness of a polymer film, that is, a hard coat technique becomes an important problem.

In order to improve the surface hardness of plastic substrates, Korean Patent No. A film composition comprising a high-hardness coating of an ultraviolet curable urethane acrylate oligomer is disclosed in 2010-0041992. International Patent Publication No. WO2013-187699 discloses an alicyclic epoxy group high hardness decane resin composition, a process for producing the same, and an optical film comprising the cured product.

As described above, most of the conventionally employed production methods are to form an acrylic or epoxy-based organic cured film directly on the surface of a transparent film to increase its hardness. However, when an acrylic or epoxy-based organic cured film having a large difference in strength from a plastic substrate is directly formed on a plastic substrate, not only the flexibility of the plastic substrate but also the coating cannot be bent, therefore, When the bending property, the impact resistance, and the like are evaluated, there is a problem that the surface is cracked.

Accordingly, the present invention provides a substrate capable of forming a hard coat layer directly on a polyimide film while maintaining flexibility, surface hardness and chemical resistance, and also capable of improving optical properties and moisture barrier properties. Yttrium imide substrate.

In order to solve the above technical problems, a preferred first embodiment of the present invention provides a polyimide substrate. The polyimide substrate comprises a polyimide layer; and an optical primer layer comprising a ceria azide-oxane compound represented by the following Chemical Formula 1 on at least one side of the polyimide layer.

<Chemical Formula 1>-{R-(Si-NH)-R} _m -{R`-(Si-O)-R'} _n -

In the chemical formula 1, R is at least one selected from the group consisting of a hydroxyl group, a vinyl group, a hydroxy group (Acryl group), an epoxy group (Epoxy group), and an amino group (Amino group). Urethane, R` is a hydroxyl group (Hydroxyl), vinyl A cyanate of at least one of the group consisting of (Vinyl), Acryl, Epoxy, and Amino, and m and n are integers of 1 to 10.

The polyimide substrate according to the above first embodiment may further comprise a hard coat layer.

Further, a preferred second embodiment of the present invention is a display substrate module comprising a transparent adhesive layer, a black light shielding layer, and the polyimide substrate of the first embodiment.

The present invention can provide a transparent polyimide substrate having excellent flexibility and impact resistance as well as solvent resistance, optical properties, moisture barrier properties, and scratch resistance. The transparent polyimide substrate according to the present invention can be effectively used as a cover substrate for a flexible electronic device, and thus can provide a flexible display substrate module excellent in flexibility and impact resistance.

10‧‧‧ Polyimine layer

20‧‧‧Optical primer layer

30‧‧‧hard coating

40‧‧‧Transparent adhesive layer

50‧‧‧Black shading

FIG. 1 is a schematic structural view of a display substrate module including a polyimide substrate according to an embodiment of the present invention.

According to a specific embodiment of the present invention, a polyimide substrate is provided. The polyimide substrate comprises a polyimide layer; and an optical primer layer comprising a ceria azide-oxirane compound on at least one side of the polyimide layer.

In the present invention, the polyimine layer is formed of a polyimide film, and can be obtained by polymerization of a diamine and a dianhydride acid to obtain a polyimide film which is generally used. The polyimine layer of the present invention is a colorless transparent polyimide film having no yellow color, and has a heat-resistant property inherent to the polyimide resin, and can be used without limitation. Average light transmission measured with a UV spectrophotometer at 350 to 700 nm based on a film thickness of 10 to 100 μm The rate is 85% or more, and the yellowness index is 5 or less; according to the thermal mechanical analysis method (TMA-Method), the polythenimine having a coefficient of thermal expansion (CTE) of 50.0 ppm/° C. or less measured at 50 to 205 ° C is obtained. The film is better.

If the thickness of the polyimide layer is 10 to 100 μm, the average light transmittance is less than 85%, or the yellowness index exceeds 5, there is a problem that the transparency may be lowered and it may not be used for display or optical elements. When the average coefficient of thermal expansion (CTE) exceeds 50.0 ppm/° C., the coefficient of thermal expansion with the flexible substrate also increases, and thus there is a fear that the element is overheated or short-circuited at a high temperature.

In the present invention, the indole azide-anthracene compound may be represented by the following Chemical Formula 1. The weight average molecular weight measured by gel permeation chromatography (GPC) is preferably from 500 to 500,000 g/mol.

<Chemical Formula 1>-{R-(Si-NH)-R} _m -{R`-(Si-O)-R'} _n -

In the chemical formula 1, R is a urethane group containing at least one selected from the group consisting of a hydroxyl group, a vinyl group, a propylene group, an epoxy group, and an amine group, and R' is a hydroxyl group, a vinyl group, or the like. A cyanate group of at least one of the group consisting of an acryl group, an epoxy group, and an amine group, and m and n are integers of 1 to 10.

If the weight average molecular weight of the decazane-hydroxane compound represented by Chemical Formula 1 is less than 500 g/mol, the solvent resistance, heat resistance, and moisture barrier property are less enhanced, if it exceeds 50,000 g/mol. When the hydrophobic property is improved, the adhesion to other compounds is insufficient. Since the decazane-nonane compound has a high density structure, the chemical resistance of the substrate can be improved, and a lower refractive index is exhibited as compared with the substrate, and due to the constructive interference with the substrate. The optical properties of the polyimide film can be further improved.

In the present invention, the indole azide-decane compound is dissolved in an organic solvent and then coated. At this time, an organic solvent suitable for use is isopropyl alcohol (IPA) or propylene glycol monomethyl ether (PGME). Propylene glycol methyl ether acetate (Propylene Glycol) Methyl Ether Acetate, PGMEA), N-butanol, pentanol, methyl ethyl ketone (MEK), acetone, methanol, ethanol, and the like. At this time, the amount of the organic solvent may be selected depending on the thickness to be applied, preferably from 0.5 to 90% by weight, more preferably from 1 to 50% by weight, most preferably from 1 to 20% by weight based on the total weight of the solution. %. When the amount of the organic solvent is less than 0.5% by weight, thickness unevenness may occur on the surface of the substrate due to uneven formation during coating, and if it exceeds 90% by weight, coating may be difficult due to high viscosity.

Further, in the present invention, in order to secure solvent resistance and optical properties and to improve moisture blocking characteristics, the thickness of the optical primer layer containing the ceria azide-decane compound is preferably 0.1 μm or more, and to prevent The polyimine coated substrate has a reduced optical property and a curl, and preferably has a thickness of 3 μm or less. The optical primer layer may be formed under or on the polyimide film, or may be formed on both sides. The polyimide substrate comprising the optical primer layer according to the present invention has a yellowness index of 2.5 or less as measured by the CM-3700D standard, and excellent optical transmittance of 85 to 93% at 350 to 700 nm. characteristic.

In the present invention, the optical primer layer may be applied by a suitable method such as a spray coating method, a bar coating method, a spin coating method, or a dip coating method, and the coating method is generally used. The methods are all available and there are no special restrictions. For the optical primer layer, when heat treatment is performed at 200 to 300 ° C for curing, it is advantageous to form a network having a structure in the molecule, and to make the properties of the film stronger, thereby making chemical resistance. And heat resistance becomes excellent.

According to a preferred embodiment of the present invention, the polyimide substrate can ensure chemical resistance and impact resistance by further including a hard coat layer, and can exhibit a surface of 5H to 10H based on the JIS K56000 measurement standard. hardness. However, a hard coat layer should be formed on the surface of the substrate, and an optical primer layer and a hard coat layer are simultaneously formed on the polyimide layer as described above, which is combined with a polyimide substrate having only a hard coat layer formed thereon. In comparison with the optical characteristics such as the light transmittance and the yellowness index, the measured water vapor permeability can be reduced to 0.001 to 10 g/m ² *day under the ASTM E96BW measurement standard. Since the polyimide substrate of the present invention can exhibit a low water vapor permeability in the above range, it is more advantageous in protecting the TFT and the OLED element from damage from an external moisture environment.

In this case, the hard coat layer of the present invention may be formed of a rhodium oxide resin containing a mixture or a chemical reactant of an alkoxysilane represented by the following Chemical Formula 2 and an alkoxide metal represented by the following Chemical Formula 3.

In the chemical formulas 2 to 3, R1 is a linear, branched, alicyclic, and aromatic organic compound containing an epoxy group, an acryloyl group, and an isocyanate group, and R2 and R3 are oxygen or nitrogen. a linear, branched, alicyclic C1 to C8 alkyl group of a heterocompound, n is an integer of 1 to 3, and further, M is a metal element including a transition metal, and m is an integer of 1 to 10. .

In the present invention, the decyl alkane resin can be produced by carrying out a polymerization reaction using the alkoxy decane of the above Chemical Formula 2 alone. At the time of the polymerization reaction, a metal alkoxide represented by the above Chemical Formula 2 may be added to prepare a decane resin having a chemical bond of a metal element. The formation reaction of the decane resin can be carried out at normal temperature, but in order to promote the reaction, the reaction can be stirred at 50 ° C to 120 ° C for 1 hour to 120 hours.

Further, in the above reaction, as a catalyst for promoting hydrolysis and condensation reaction, an acid catalyst such as hydrochloric acid, acetic acid, hydrogen fluoride, phosphoric acid, sulfuric acid or iodic acid may be used, ammonia, potassium hydroxide, sodium hydroxide or barium hydroxide. And a base catalyst such as imidazole, and an amberite plasma exchange resin. These catalysts may be used singly or in combination. The amount of the catalyst is not particularly limited, but 0.0001 to about 10 parts by weight may be added in terms of 100 parts by weight of the decane resin.

When the hydrolysis and condensation reactions are carried out, by-products of the alcohol are produced, which can reduce the reverse reaction and allow the positive reaction to proceed more quickly, so that the reaction rate can be adjusted by this. In addition, After the reaction is completed, the by-products can be removed under reduced pressure and heating.

As described above, for the naphthenic resin synthesized by the condensation reaction, the viscosity and the curing speed can be adjusted by the monomer added at the time of the reaction. Thereby, an optimum resin composition suitable for the purpose can be provided. Further, the decane resin obtained by the above reaction can ensure a space between molecules at the time of crosslinking, and therefore, curling due to curing shrinkage can be prevented, and high surface hardness can be achieved by crosslinking a metal element.

Further, according to a preferred embodiment of the present invention, for the polymerization of the decane resin, the resin composition for a hard coat layer may further contain an initiator, and for example, a photopolymerization initiator such as an organic metal salt may be used. And a thermal polymerization initiator such as an amine or an imidazole. At this time, the amount of the initiator to be added is not particularly limited, but may be added in an amount of about 0.01 to 10 parts by weight based on 100 parts by weight of the decyl alkane resin.

Further, in order to control the viscosity of the decane resin to facilitate processing, the resin composition for a hard coat layer of the present invention may further contain an organic solvent in order to adjust the thickness of the coating layer. The amount of the organic solvent to be added is not particularly limited, and ketones such as acetone, methyl ethyl ketone, methyl butyl ketone, and cyclohexanone, or cellosolve such as ethylene glycol methyl ether or ethylene glycol butyl ether can be used. An ether such as diethyl ether or dioxane, an alcohol such as isobutanol, isopropanol, butanol or methanol, or a halogenated hydrocarbon such as dichloromethane, chloroform or trichloroethylene, or n-hexane, benzene or toluene. More than one of the hydrocarbons.

In order to suppress the oxidation reaction caused by the polymerization reaction, the decane resin of the present invention may further include an antioxidant, and may further contain a leveling agent or a coating aid, but is not limited thereto.

The resin composition for a hard coat layer of the present invention can be prepared into a high-hardness coating cured product by photopolymerization and thermal polymerization after being subjected to coating, casting, molding, or the like. In the case of photopolymerization, heat treatment may be performed before light irradiation to obtain a uniform surface, and the heat treatment may be carried out at a temperature of 40 ° C or more and about 300 ° C or less, and the amount of light irradiated may be 50 mJ/cm ² or more and ²⁰⁰⁰⁰ mJ/cm. ² is implemented under the following conditions, but is not limited thereto. Further, in the case of thermal polymerization, it may be carried out at a temperature of from 40 ° C to not more than 300 ° C, but is not limited thereto.

In the present invention, the thickness of the hard coat layer formed by the above method is preferably 10 μm. Top to ensure excellent surface hardness, impact resistance and chemical resistance. Further, it is preferably 50 μm or less to prevent occurrence of buckling and excessive hardness.

Furthermore, the present invention can provide a display substrate module including a transparent adhesive layer, a black light-shielding layer, and a polyimide substrate having the above characteristics, but is not limited thereto. As an example of the display substrate module of the present invention, it can be prepared as shown in Fig. 1. That is, the optical primer layer 20, the polyimide layer 10, and the hard coat layer 30 are sequentially laminated to form a polyimide substrate, and the transparent adhesive layer 40 and the black light shielding layer 50 are formed under the optical primer layer.

Example

Hereinafter, the present invention will be described in more detail by way of examples. These examples are only intended to help the present invention more specifically, and the present invention is not limited to these examples.

<Preparation Example 1. Preparation of Polyimine Film>

1-1: Preparation of polyimine powder

A 1 L reactor equipped with a stirrer, a nitrogen injection device, a dropping funnel, a temperature regulator, and a cooler was used as a reactor, and while nitrogen gas was passed through the reactor, 832 g of N,N-dimethylacetonitrile was added. After the amine (DMAc), the temperature of the reactor was set to 25 ° C, and then 64.046 g (0.2 mol) of trifluoromethyldiaminobiphenyl (TFDB) was dissolved therein, and the solution was maintained at 25 °C. Thereto, 31.09 g (0.07 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 8.83 g (0.03 mol) of biphenyltetracarboxylic dianhydride were added and stirred. The dissolution and reaction are carried out for a certain period of time. At this time, the temperature of the solution was maintained at 25 °C. Then, 20.302 g (0.1 mol) of p-xylylene chloride (TPC) was added to finally obtain a polyglycine solution having a solid concentration of 13% by weight.

25.6 g of pyridine and 33.1 g of acetic anhydride were added to the above polyamic acid solution for 30 minutes, and then stirred again at 70 ° C for 1 hour, and then cooled at normal temperature, and precipitated with 20 L of methanol. The precipitated solid component was filtered and pulverized, and then vacuum-dried at 100 ° C for 6 hours to finally obtain 111 g of a solid component powder of polyimine.

1-2: Preparation of polyimine film

In N,N-dimethylacetamide (DMAc), 0.03 g (0.03 wt%) of amorphous cerium oxide particles having surface-bound OH groups were added at a dispersion concentration of 0.1% for ultrasonication. After the solution was allowed to be transparent, 100 g of the solid component powder of the above obtained polyimine was taken and dissolved in 670 g of N,N-dimethylacetamide (DMAc) to finally obtain a 13 wt% solution. The thus obtained solution was coated on a stainless steel plate, cast at 340 μm, and dried by hot air at 130 ° C for 30 minutes, and then the film was peeled off from the stainless steel plate and fixed to the shelf with a pin.

The film-attached shelf was placed in a vacuum oven, slowly heated from 100 ° C to 300 ° C for 2 hours, and slowly cooled and separated from the shelf to obtain a polyimide film. Thereafter, heat treatment was again performed at 300 ° C for 30 minutes in the final heat treatment step. At this time, the obtained polyimide film has a thickness of 80 μm, an average light transmittance of 87%, a yellowness index of 4.5, and an average coefficient of thermal expansion (CTE) of 20 ppm measured at 50 to 250 ° C according to TMA-Method. /°C.

<Preparation Example 2. Preparation of Hard Coating Resin>

KBM-303 (Shinetsu), Titanium isopropoxide (Sigma-Aldrich), and water were mixed at a ratio of 227.96 mL: 1.94 mL: 21.61 mL, and charged into a 500 mL flask, and then, 0.2 g of sodium hydroxide was added as a catalyst, and stirred at 60 ° C for 24 hours. Thereafter, filtration was carried out using a 0.45 μm Teflon filter paper to finally obtain a decane resin having a number average molecular weight of 7,245, a weight average molecular weight of 20146, and a polydispersity index (PDI, M _w /M _n ) of 2.78 (the molecular weight It is measured by GPC). Here, the resin was added to 3 parts by weight of IRGACURE 250 (BASF Corporation) as a photoinitiator in 100 parts by weight, thereby finally obtaining a resin for a hard coat layer.

Example 1

A solution of a polydecazane-anthracene compound (DCT Corporation) in which 3 wt% of a polypothetical gold company (PGME) was dissolved and a weight average molecular weight of 2,000 g/mole was applied to the wire by the above method. On one side of the prepared colorless transparent polyimide film, it was then dried at 80 ° C to form a film of a polyaziroxane compound having a thickness of 0.1 μm. Thereafter, after leaving it at room temperature for about 5 minutes, it was thermally cured at a temperature of about 250 ° C to obtain a polyimide substrate having an optical primer layer having a thickness of 0.1 μm.

Example 2

A solution of Datong Chemical Co., Ltd. (PGME) in which 10 wt% of a polyazinane-hydroxane compound (DCT Corporation) having a weight average molecular weight of 2,000 g/mol is coated with a wire by the above method On one side of the prepared colorless transparent polyimide film, it was then dried at 80 ° C to form a film of a polyaziroxane compound having a thickness of 0.5 μm. Thereafter, after leaving it at room temperature for about 5 minutes, it was thermally cured at a temperature of about 250 ° C to obtain a polyimide film having an optical primer layer having a thickness of 0.5 μm.

Example 3

A solution of 20% by weight of polyphosphorus azide-oxane compound (DCT Corporation) in which Dagang Chemical Co., Ltd. (PGME) was dissolved and having a weight average molecular weight of 2,000 g/mol was applied to the wire by the above method. On one side of the prepared colorless transparent polyimide film, it was then dried at 80 ° C to form a film of a polyaziroxane compound having a thickness of 1.0 μm. Thereafter, after leaving it at room temperature for about 5 minutes, it was thermally cured at a temperature of about 250 ° C to obtain a polyimide film having an optical primer layer having a thickness of 1.0 μm.

Example 4

A solution of 20% by weight of polyphosphorus azide-oxane compound (DCT Corporation) in which Dagang Chemical Co., Ltd. (PGME) was dissolved and having a weight average molecular weight of 2,000 g/mol was applied to the wire by the above method. One side of the prepared colorless transparent polyimide film was dried at 80 ° C to form a polyazironadecane compound film having a thickness of 3.0 μm. Thereafter, after leaving it at room temperature for about 5 minutes, it was thermally cured at a temperature of about 250 ° C to obtain a polyimide film having an optical primer layer having a thickness of 3.0 μm.

Example 5

An optical primer layer was formed in the same manner as in the above Example 1, and an optical primer layer was formed on both sides of the polyimide substrate.

Example 6

The polyimide substrate having the optical primer layer formed thereon was prepared in the same manner as in the above Example 1, and 40 μm of the above preparation was applied on one side of the polyimide layer opposite to the surface on which the optical primer layer was formed. Example 2 for hard coating with resin, then, at 315 nm wavelength UV lamp The next exposure was for 30 seconds to further form a hard coat layer.

Example 7

In the above Example 5, a hard coat layer was further formed in the same manner as in Example 6 only on one of the optical primer layers formed on both sides.

Example 8

A polyimide substrate was prepared in the same manner as in the above Example 1 except that a polyazinane-hydroxane compound (DCT Corporation) having a weight average molecular weight of 1,000,000 g/mol was used.

Comparative example 1

The polyimide film prepared in Preparation Example 1 was directly prepared as Comparative Example 1.

Comparative example 2

On the polyimide film of the above Preparation Example 1, the optical primer layer was omitted, and only a hard coat layer was formed in the same manner as in Example 6 to prepare a polyimide substrate.

Comparative example 3

An acrylic resin was used instead of the resin for hard coat layer in the above Preparation Example 2, and a hard coat layer was formed in the same manner as in Example 6, but the shrinkage ratio was mismatched, thereby causing severe curling upon curing, and it was possible to use the naked eye. Confirm the surface crack.

Comparative example 4

A polyimide film was prepared in the same manner as in Example 1 except that the thickness of the optical primer layer was 3.5 μm, but cracks were generated at the time of curing, and it was confirmed that it was difficult to commercialize.

<Measurement Example>

Next, the physical properties of the above examples and comparative examples were measured by the following methods, except for Comparative Example 3 and Comparative Example 4, in which cracks were observed by the naked eye, and the results are shown in Tables 1 and 2. in.

(1) Average light transmittance (%): The light transmittance was measured at 350 to 700 nm by a spectrophotometer (CM-3700D, KONICA MINOLTA) according to the ASTM E313 standard.

(2) Yellowness index, the yellowness index was measured by a spectrophotometer (CM-3700D, KONICA MINOLTA) according to the ASTM E313 standard.

(3) Water vapor transmission rate (g/m ² *day): The water vapor permeability is measured by the water vapor permeability tester (MOCON/US/Aquatran-model-1) according to the ASTM E69BW standard ( WVTR).

(4) Pencil hardness: using a pencil (UNI) for evaluation by Mitsubishi according to the ASTM D3363 standard, and using an electric pencil hardness tester (in the direction in which the primer layer or the hard coat layer is formed) with a load of 1 kg and After the speed of 180 mm/min was 5 times 50 mm, the pencil hardness at which the surface was completely free of cracks was measured.

(5) Adhesion (Cross Cut, tearing off the tape after adhesion): Determined by tape peeling after the cross-cut according to ASTM D3359 standard.

(6) Bending property: placed in the center of a circular tool with a diameter of 2 mm, the substrate was wound up and unfolded 200,000 times, and the film was visually and microscopically judged whether the film was cracked or not, as long as there was a slight crack, it was expressed as "failure". If it does not split, it means "success".

(7) Chemical resistance measurement: 2.38% tetramethylammonium hydroxide (TMAH), dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (N-methyl-2) -pyrrolidone, NMP), 1% sodium hydroxide (NaOH), acetone (acetone), isopropyl alcohol (IPA), methylethylketone (MEK) and sodium sulfate (Na ₂ SO) ₄ ) After immersion (Dipping) for 1 hour, it was observed with the naked eye, and if it was observed to be cloudy or abnormal, it was expressed as "X", and when the weight change rate after drying was 0.01% or less, it was indicated as "○".

From the results of the above Tables 1 and 2, it is understood that in the case of Examples 1 to 5 in which an optical primer layer containing a ceria azide was formed on the surface of the polyimide film, no treatment was performed on the surface. In Comparative Example 1, not only the optical properties such as the light transmittance and the yellowness index were improved, but also the chemical resistance was improved. However, in the case of Example 8 having a weight average molecular weight higher than that of Examples 1 to 5, the surface hardness and adhesion were somewhat lowered, and slight bending property was exhibited.

Further, Examples 6 and 7 in which the optical primer layer and the hard coat layer were simultaneously formed were compared with Comparative Example 2 in which the optical primer layer was omitted and only the hard coat layer was formed, although chemical resistance or lead was observed. The physical properties such as pen hardness did not change much, but the yellowness index and light transmittance were improved, and the optical characteristics and water vapor permeability were significantly improved as compared with Comparative Example 2.

As a result of the above, the polyimide substrate of the present invention is excellent not only in optical properties but also excellent in surface hardness, chemical resistance, and flexibility, and is suitable as a display substrate module for flexible electronic equipment, particularly because of water. Low gas permeability is more advantageous for protecting TFTs and OLED components from external moisture.

10‧‧‧ Polyimine layer

20‧‧‧Optical primer layer

30‧‧‧hard coating

40‧‧‧Transparent adhesive layer

50‧‧‧Black shading

Claims (10)

A polyimine substrate, wherein the polyimide substrate comprises a polyimide layer; and a ceria azide-oxane compound represented by the following Chemical Formula 1 is contained on at least one side of the polyimide layer Optical primer layer; <Chemical Formula 1>-{R-(Si-NH)-R} _m -{R`-(Si-O)-R'} _n - In the chemical formula 1, R is selected from the group consisting of a urethane group of at least one of the group consisting of a hydroxyl group, a vinyl group, a propylene group, an epoxy group, and an amine group, and R' is composed of a hydroxyl group, a vinyl group, a propylene group, an epoxy group, and an amine group. The cyanate group of at least one of the groups, m and n are an integer of from 1 to 10. The polyimine substrate according to the above aspect of the invention, wherein the ceria azide-oxane compound has a weight average molecular weight of 500 to 500,000 g/mol. The polyimide substrate according to the above aspect of the invention, wherein the optical primer layer has a thickness of 0.1 to 3 μm. The polyimide substrate according to claim 1, wherein the polyimide substrate has a yellowness index of 2.5 or less and a light transmittance of 350 to 700 nm based on a KONICA MINOLTA CM-3700D measurement standard. The rate is 85 to 93%. The polyimide substrate according to claim 1, further comprising a hard coat layer. The polyimine substrate according to claim 5, wherein the hard coat layer is a mixture comprising an alkoxydecane represented by the following Chemical Formula 2 and an alkoxy metal represented by the following Chemical Formula 3; Or a chemical reactant of a rhodium oxide resin; In the chemical formulas 2 to 3, R1 is a linear, branched, alicyclic, and aromatic organic compound containing an epoxy group, an acryloyl group, and an isocyanate group, and R2 and R3 are impurities containing oxygen or nitrogen. A linear, branched, alicyclic C1 to C8 alkyl group of the compound, n is an integer of 1 to 3, M is a metal element including a transition metal, and m is an integer of 1 to 10. The polyimide substrate according to claim 5, wherein the hard coat layer has a thickness of 10 to 50 μm. The polyimide substrate according to claim 5, wherein the polyimide substrate has a surface hardness of 5H to 9H as measured by the direction in which the hard coat layer is formed based on the JIS K56000 measurement standard. The polyimine substrate according to claim 5, wherein the polyimide film has a water vapor permeability of 0.001 to 10 g/m ² *day based on the ASTM E96BW measurement standard. A display substrate module, wherein the display substrate module comprises a transparent adhesive layer, a black light-shielding layer, and the polyimide substrate according to any one of claims 1 to 9.