TWI553071B - Hotline Masking Adhesive Composition and Hot Wire Masking Adhesive Sheet - Google Patents

Hotline Masking Adhesive Composition and Hot Wire Masking Adhesive Sheet Download PDF

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TWI553071B
TWI553071B TW101140400A TW101140400A TWI553071B TW I553071 B TWI553071 B TW I553071B TW 101140400 A TW101140400 A TW 101140400A TW 101140400 A TW101140400 A TW 101140400A TW I553071 B TWI553071 B TW I553071B
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shielding adhesive
adhesive composition
heat
metal
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TW201323549A (en
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Takahiro Higeta
Takaaki Kurata
Chihiro Takahashi
Michiharu Arifuku
Yukihiro Hara
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Nippon Kayaku Kk
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09BORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B67/00Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
    • C09B67/0071Process features in the making of dyestuff preparations; Dehydrating agents; Dispersing agents; Dustfree compositions
    • C09B67/0084Dispersions of dyes
    • C09B67/0085Non common dispersing agents
    • C09B67/009Non common dispersing agents polymeric dispersing agent
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    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2231Oxides; Hydroxides of metals of tin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041Optical brightening agents, organic pigments
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • C08K5/3417Five-membered rings condensed with carbocyclic rings
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

熱線遮蔽性黏著劑組合物及熱線遮蔽性黏著片 Heat shielding adhesive composition and heat shielding adhesive sheet

本發明係關於一種貼合於窗玻璃等上而使用之可有效率地遮蔽熱線的熱線遮蔽性黏著劑組合物及使用其之熱線遮蔽性黏著片。 The present invention relates to a heat ray-shielding adhesive composition which can be used for adhering to a window glass or the like to efficiently shield a heat ray, and a heat ray-shielding adhesive sheet using the same.

近年來,就節能或地球環境問題之觀點而言,要求減輕空調機器之負荷。例如,要求於住宅或汽車之領域中對窗玻璃賦予可遮蔽來自陽光之熱線之熱線遮蔽性材料,從而抑制室內或車內之溫度上升。具有熱線遮蔽性之材料存在有多種,於專利文獻1中揭示了賦予熱線遮蔽性之黏著劑及其黏著片。該黏著片係將賦予熱線遮蔽性之黏著劑加工為片狀者,具有可事前加工為任意之形狀,具有可再拉伸之二次加工性之特徵。然而,該賦予熱線遮蔽性之黏著片之熱遮斷性並不充分,期望進一步之改善。 In recent years, it has been demanded to reduce the load on air conditioners in terms of energy saving or global environmental problems. For example, it is required to provide a heat shield material that shields a hot wire from sunlight in a window of a house or a car, thereby suppressing an increase in temperature in a room or a car. There are various materials having heat shielding properties, and Patent Document 1 discloses an adhesive which imparts heat shielding properties and an adhesive sheet thereof. This adhesive sheet is characterized in that the heat-shielding adhesive is processed into a sheet shape, and has a feature that it can be processed into an arbitrary shape in advance and has reworkability secondary workability. However, the heat-shielding property of the heat-shielding adhesive sheet is not sufficient, and further improvement is desired.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特願平10-8010號 [Patent Document 1] Japanese Patent Special Patent No. 10-8010

本發明之課題在於提供一種與先前之熱線遮蔽性黏著片相比而言,熱線遮蔽性得到大幅改善之熱線遮蔽性黏著劑組合物及熱線遮蔽性黏著片。 An object of the present invention is to provide a heat ray-shielding adhesive composition and a heat ray-shielding adhesive sheet which are improved in heat ray shielding properties as compared with the conventional heat ray-shielding adhesive sheet.

本發明者等人為了獲得熱線遮蔽性得到大幅改善之熱線遮蔽性黏著片而進行了銳意研究,結果發現:可藉由含有以摻雜錫之氧化銦為首之金屬微粒子、近紅外吸收色素、分散劑及黏著劑,而獲得可有效率地遮蔽熱線之熱線遮蔽性黏著劑組合物及將其加工為片狀之熱線遮蔽性黏著片,從而完成本發明。 The inventors of the present invention conducted intensive studies to obtain a heat-shielding adhesive sheet in which heat ray shielding properties are greatly improved, and as a result, it has been found that metal fine particles including near-indium-doped indium oxide, near-infrared absorbing pigment, and dispersion can be obtained. The present invention is accomplished by obtaining a heat-shielding adhesive composition which can effectively shield the heat rays and a heat-shielding adhesive sheet which is processed into a sheet shape.

即,本發明係關於如下者:「(1)一種熱線遮蔽性黏著劑組合物,其含有(A)金屬微粒子、(B)丙烯酸系黏著劑、(C)分散劑及(D)近紅外吸收色素;(2)如(1)之熱線遮蔽性黏著劑組合物,其中(A)金屬微粒子係選自氧化錫、氧化銦、氧化鋅之群之一種金屬微粒子;(3)如(1)或(2)中任一項之熱線遮蔽性黏著劑組合物,其中(B)丙烯酸系黏著劑係羧基或者含有酸酐之單體之結構單元之比率為聚合物中之所有單體結構單元之1~5%之聚合物;(4)如(1)至(3)中任一項之熱線遮蔽性黏著劑組合物,其中(B)丙烯酸系黏著劑之重量平均分子量為10萬~120萬;(5)如(1)至(4)中任一項之熱線遮蔽性黏著劑組合物,其中(D)近紅外吸收色素係酞菁系化合物、萘酞菁系化合物及/或二亞銨系化合物;(6)如(5)之熱線遮蔽性黏著劑組合物,其中(D)近紅外吸收色素係式(1)所表示之萘酞菁系化合物:[化1] [式(1)中,M表示金屬原子、金屬氧化物、金屬氫氧化物或者金屬鹵化物、或氫原子,X表示低級烷基、低級烷氧基、經取代之胺基、硝基、鹵基、羥基、羧基、磺酸基、磺醯胺基;A表示二價之交聯基,Y表示磺酸基、羧基、除去1~2級胺基之氮原子上之至少一個氫之殘基,或除去含氮雜環之氮原子上之至少一個氫之殘基;m及n均為平均值,m、n分別為0以上12以下,且m與n之和為0以上12以下];(7)如(6)之熱線遮蔽性黏著劑組合物,其中式(1)中之M為VO,A為碳數1~3之伸烷基,Y為亦可具有取代基之鄰苯二甲醯亞胺基;(8)如(6)之熱線遮蔽性黏著劑組合物,其中式(1)中之M為Cu,A為碳數1~3之伸烷基,Y為亦可具有取代基之鄰苯二甲醯亞胺基;(9)一種熱線遮蔽性黏著片,其係塗佈如(1)至(8)中任一項之熱線遮蔽性黏著劑組合物而成」。 That is, the present invention relates to the following: "(1) A heat ray-shielding adhesive composition containing (A) metal fine particles, (B) an acrylic adhesive, (C) a dispersant, and (D) near-infrared absorption. (2) The heat shielding adhesive composition according to (1), wherein (A) the metal microparticles are selected from the group consisting of tin oxide, indium oxide, and zinc oxide; and (3) as (1) or (2) The heat shielding adhesive composition according to any one of the preceding claims, wherein (B) the ratio of the acrylic resin-based carboxyl group or the structural unit containing the acid anhydride-containing monomer is 1 to 1 of all monomer structural units in the polymer. (4) The heat ray-shielding adhesive composition according to any one of (1) to (3), wherein (B) the acrylic-based adhesive has a weight average molecular weight of from 100,000 to 1,200,000; The heat shielding adhesive composition according to any one of (1) to (4), wherein (D) a near-infrared absorbing pigment-based phthalocyanine-based compound, a naphthalocyanine-based compound, and/or a diimmonium-based compound (6) The heat ray-shielding adhesive composition according to (5), wherein (D) the near-infrared absorbing pigment system is a naphthalocyanine-based compound represented by the formula (1): [Chemical Formula 1] [In the formula (1), M represents a metal atom, a metal oxide, a metal hydroxide or a metal halide, or a hydrogen atom, and X represents a lower alkyl group, a lower alkoxy group, a substituted amino group, a nitro group, a halogen group. a group, a hydroxyl group, a carboxyl group, a sulfonic acid group, a sulfonylamino group; A represents a divalent crosslinking group, and Y represents a sulfonic acid group, a carboxyl group, and a residue of at least one hydrogen on the nitrogen atom of the amine group 1 to 2 Or removing at least one hydrogen residue on the nitrogen atom of the nitrogen-containing heterocyclic ring; m and n are average values, m and n are each 0 or more and 12 or less, and the sum of m and n is 0 or more and 12 or less]; (7) The heat shielding adhesive composition according to (6), wherein M in the formula (1) is VO, A is an alkylene group having 1 to 3 carbon atoms, and Y is an ortho-phenylene group which may have a substituent. (8) The heat ray-shielding adhesive composition of (6), wherein M in the formula (1) is Cu, A is an alkylene group having 1 to 3 carbon atoms, and Y may have (9) A heat ray-shielding adhesive sheet obtained by applying the heat ray-shielding adhesive composition according to any one of (1) to (8).

根據本發明,可提供一種熱線遮蔽性黏著片,該熱線遮蔽性黏著片藉由將使用分散劑而將以摻雜錫之氧化銦為首 之金屬微粒子及近紅外吸收色素分散至丙烯酸系黏著劑中而成之熱線遮蔽性黏著劑組合物加工為片狀,從而與先前之熱線遮蔽性黏著片相比而言,可進一步抑制由熱線所引起之溫度上升。藉此可抑制住宅或汽車之空間之溫度上升,並可減輕空調機器之負荷,因此本發明可對節能或地球環境問題之解決作出貢獻。 According to the present invention, there can be provided a heat ray-shielding adhesive sheet which is led by doping tin-doped indium oxide by using a dispersing agent. The heat-shielding adhesive composition in which the metal fine particles and the near-infrared absorbing pigment are dispersed in the acrylic adhesive is processed into a sheet shape, thereby further suppressing the heat line by comparison with the previous heat shielding adhesive sheet The temperature caused rises. Thereby, the temperature rise of the space of the house or the automobile can be suppressed, and the load of the air conditioner can be reduced, so that the present invention can contribute to the solution of energy saving or global environmental problems.

對本發明詳細地進行說明。本發明之熱線遮蔽性黏著片形成用之黏著劑組合物之特徵在於:使用分散劑將以摻雜錫之氧化銦為首之金屬微粒子與近紅外吸收色素分散至丙烯酸系黏著劑中,該黏著劑組合物亦可加工為片狀。 The present invention will be described in detail. The adhesive composition for forming a heat ray-shielding adhesive sheet of the present invention is characterized in that a metal microparticle containing a tin-doped indium oxide and a near-infrared absorbing pigment are dispersed in an acrylic adhesive using a dispersing agent, the adhesive The composition can also be processed into a sheet.

於熱線遮蔽性黏著劑組合物中所使用之金屬微粒子適合可見光之吸收較小,對近紅外至遠紅外區域之光具有良好之吸收特性者。此種金屬微粒子可列舉於近紅外區域具有電漿波長之導電性金屬氧化物。具體而言可例示:氧化錫、氧化銦、氧化鋅、氧化鎢、氧化鉻、氧化鉬等。其中,尤其是於可見光區域光吸收性較小之氧化錫、氧化銦、氧化鋅較佳。 The metal microparticles used in the heat shielding adhesive composition are suitable for absorption of visible light and good absorption properties for light in the near-infrared to far-infrared region. Such metal fine particles can be exemplified by a conductive metal oxide having a plasma wavelength in the near-infrared region. Specifically, tin oxide, indium oxide, zinc oxide, tungsten oxide, chromium oxide, molybdenum oxide, or the like can be exemplified. Among them, tin oxide, indium oxide, and zinc oxide, which are particularly light-absorptive in the visible light region, are preferred.

又,極佳為摻雜第三成分用以使該等氧化物之電氣導電性提高。作為用以實現此目的之摻雜劑,相對於氧化錫可選擇Sb、V、Nb、Ta等,相對於氧化銦可選擇Zn、Al、Sn、Sb、Ga、Ge等,相對於氧化鋅可選擇Al、Ga、In、Sn、Sb、Nb等。 Further, it is preferable to dope the third component for improving the electrical conductivity of the oxides. As a dopant for achieving the purpose, Sb, V, Nb, Ta, etc. may be selected with respect to tin oxide, and Zn, Al, Sn, Sb, Ga, Ge, etc. may be selected with respect to indium oxide, and may be relative to zinc oxide. Al, Ga, In, Sn, Sb, Nb, and the like are selected.

作為金屬微粒子之製法,只要是可獲得粒徑為100 nm以 下者,則並無特別限定,可使用氣相合成法、液層合成法等公知之方法。例如關於氧化銦微粒子,可利用日本專利特開平6-227815中所揭示之方法。亦即,是如下之方法:藉由鹼將含有特定金屬微粒子元素之鹽之水溶液中和,對所獲得之沈澱物進行過濾、清洗,並於高溫下進行加熱處理,藉此而獲得金屬微粒子。又,關於氧化錫微粒子、氧化鋅微粒子,可分別例示日本專利特開平2-105875、日本專利特開平6-234522。 As a method of preparing metal microparticles, as long as the particle diameter is 100 nm The following is not particularly limited, and a known method such as a gas phase synthesis method or a liquid layer synthesis method can be used. For example, regarding the indium oxide fine particles, the method disclosed in Japanese Patent Laid-Open No. Hei 6-227815 can be used. That is, it is a method of neutralizing an aqueous solution containing a salt of a specific metal fine particle element by a base, filtering, washing the obtained precipitate, and heat-treating at a high temperature, thereby obtaining metal fine particles. Further, the tin oxide fine particles and the zinc oxide fine particles can be exemplified by Japanese Patent Laid-Open No. Hei 2-105875 and Japanese Patent Laid-Open No. Hei 6-234522, respectively.

作為將金屬微粒子分散至有機溶劑中之方法,可使用先前之方法。亦即,可將金屬微粒子與有機溶劑以特定比率混合,根據需要於該混合物中添加分散劑、界面活性劑等,使用砂磨機、磨碎機、珠磨機、均質機、輥磨機等分散裝置而使混合物分散。 As a method of dispersing metal fine particles into an organic solvent, the prior method can be used. That is, the metal fine particles and the organic solvent may be mixed at a specific ratio, and a dispersant, a surfactant, or the like may be added to the mixture as needed, and a sand mill, an attritor, a bead mill, a homogenizer, a roll mill, or the like may be used. Disperse the device to disperse the mixture.

本發明之金屬微粒子之藉由XRD(X-ray Diffraction,X射線繞射)圖案所獲得之第一主峰之半高寬為0.01~0.8°,若半高寬為0.01°以下,則由於一次粒徑變大而難以確保透明性。又,若半高寬超過0.8°,則難以表現充分之遮熱性。又,上述金屬微粒子之半高寬之較佳之下限為0.1°,較佳之上限為0.8°,更佳之下限為0.2,更佳之上限為0.5°。 The half-height width of the first main peak obtained by the XRD (X-ray diffraction) pattern of the metal microparticles of the present invention is 0.01 to 0.8°, and if the full width at half maximum is 0.01° or less, The diameter becomes large and it is difficult to ensure transparency. Further, if the full width at half maximum exceeds 0.8°, it is difficult to express sufficient heat shielding properties. Further, a preferred lower limit of the full width at half maximum of the metal fine particles is 0.1, preferably an upper limit of 0.8, a more preferred lower limit of 0.2, and a more preferred upper limit of 0.5.

本發明中所使用之金屬微粒子之藉由BET(Brunauer-Emmett-Teller,比表面積檢測)法所測定之比表面積若為5~200 m3/g則較佳,更佳為10~150 m3/g,尤佳為10~100 m3/g。利用BET法所測定之比表面積小於5 m3/g者,由於 一次粒徑較大,因此於為片或膜、塗料、樹脂組合物之情形時,存在加工表面不平滑之虞。進而,存在產生無法期待透明性等之缺點之虞。另一方面,BET比表面積大於200 m3/g者,存在如下之虞:於製造上必需特殊之技術,且無法獲得充分之結晶度,從而損及熱線遮蔽性。再者,BET法係使大小已知之分子或離子吸附於粉體粒子表面,並根據其量測定試樣之比表面積之方法。 The metal microparticles used in the present invention have a specific surface area of 5 to 200 m 3 /g as measured by a BET (Brunauer-Emmett-Teller) method, and more preferably 10 to 150 m 3 . /g, especially preferably 10~100 m 3 /g. When the specific surface area measured by the BET method is less than 5 m 3 /g, since the primary particle diameter is large, in the case of a sheet or a film, a coating material, or a resin composition, there is a problem that the processed surface is not smooth. Further, there are disadvantages such as the inability to expect transparency and the like. On the other hand, in the case where the BET specific surface area is more than 200 m 3 /g, there is a problem that a special technique is required for the production, and sufficient crystallinity cannot be obtained, thereby impairing the heat ray shielding property. Further, the BET method is a method in which a molecule or ion having a known size is adsorbed on the surface of a powder particle, and the specific surface area of the sample is measured based on the amount.

所謂近紅外吸收色素,係吸收紅外線中最接近可見區域之近紅外線(波長約780~2000 nm)之色素之總稱,作為近紅外吸收色素之種類,可列舉偶氮系、銨系、蒽醌系、花青系、二亞銨系、二硫醇金屬錯合物系、方酸菁系、酞菁系、萘酞菁系等。就提高耐久性之觀點而言,較佳為酞菁系、萘酞菁系、二亞銨系,且就效率良好地遮斷熱線之觀點而言,較佳為萘酞菁系,尤佳為上述式(1)所表示之化合物。於上述式(1)中,M表示氫原子、金屬原子、金屬氧化物、金屬氫氧化物或金屬鹵化物。於M為氫原子以外之情形時,該M係表示式(1)中之萘酞菁環具有所謂之中心金屬。又,於M為氫原子之情形時,表示該萘酞菁環不具有中心金屬。 The near-infrared absorbing dye is a general term for a pigment that absorbs near-infrared rays (wavelengths of about 780 to 2000 nm) closest to the visible region in infrared rays. Examples of the types of near-infrared absorbing pigments include azo, ammonium, and lanthanides. A cyanine system, a diammonium system, a dithiol metal complex system, a squaraine system, a phthalocyanine system, a naphthalocyanine system, or the like. From the viewpoint of improving durability, a phthalocyanine system, a naphthalocyanine system, and a diimonium system are preferred, and from the viewpoint of efficiently blocking the heat line, a naphthalocyanine system is preferred, and particularly preferably A compound represented by the above formula (1). In the above formula (1), M represents a hydrogen atom, a metal atom, a metal oxide, a metal hydroxide or a metal halide. When M is other than a hydrogen atom, the M system means that the naphthalocyanine ring in the formula (1) has a so-called central metal. Further, when M is a hydrogen atom, it means that the naphthalocyanine ring does not have a central metal.

作為上述M中之金屬原子之具體例,例如可列舉:Li、Na、K、Mg、Ti、Zr、V、Nb、Ta、Cr、Mo、W、Mn、Fe、Co、Ni、Ru、Rh、Pd、Os、Ir、Pt、Cu、Ag、Au、Zn、Cd、Hg、Al、Ga、In、Si、Ge、Sn、Pb、Sb、Bi等。 Specific examples of the metal atom in the above M include Li, Na, K, Mg, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Ru, Rh. , Pd, Os, Ir, Pt, Cu, Ag, Au, Zn, Cd, Hg, Al, Ga, In, Si, Ge, Sn, Pb, Sb, Bi, and the like.

作為金屬氧化物,可列舉VO、GeO等。作為金屬氫氧化物,例如可列舉:Si(OH)2、Cr(OH)2、Sn(OH)2、AlOH等。作為金屬鹵化物,例如可列舉:SiCl2、VCl、VCl2、VOCl、FeCl、GaCl、ZrCl、AlCl等。該等中較佳為Fe、Co、Cu、Ni、Zn、Al、V等金屬原子,VO等金屬氧化物,AlOH等金屬氫氧化物等,更佳為Cu、VO。 Examples of the metal oxide include VO, GeO, and the like. Examples of the metal hydroxide include Si(OH) 2 , Cr(OH) 2 , Sn(OH) 2 , AlOH, and the like. Examples of the metal halide include SiCl 2 , VCl, VCl 2 , VOCl, FeCl, GaCl, ZrCl, and AlCl. Among these, metal atoms such as Fe, Co, Cu, Ni, Zn, Al, and V, metal oxides such as VO, metal hydroxides such as AlOH, and the like are preferable, and Cu and VO are more preferable.

作為使用上述M為Li、Na、K、Mg、Ti、Zr、V、Nb、Ta、Cr、Mo、W、Mn、Fe、Co、Ni、Ru、Rh、Pd、Os、Ir、Pt、Cu、Ag、Au、Zn、Cd、Hg、Al、Ga、In、Si、Ge、Sn、Pb、Sb、Bi之萘酞菁系化合物之甲苯分散液而製作之熱線遮蔽性黏著片,於熱線遮蔽性試驗中,使試驗中所使用之箱之箱內溫度降低,顯示出良好之熱線遮蔽性效果。又,尤其是於使用M為Cu之萘酞菁系化合物之情形時,使箱內溫度明顯降低,顯示出優異之熱線遮熱性效果,從而較佳。於使用M為VO之萘酞菁系化合物之情形時,亦使箱內溫度明顯降低,顯示出優異之熱線遮熱性效果,從而較佳。 As the above, M is Li, Na, K, Mg, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu. A heat-shielding adhesive sheet made of a toluene dispersion of a naphthalocyanine-based compound of Ag, Au, Zn, Cd, Hg, Al, Ga, In, Si, Ge, Sn, Pb, Sb, or Bi, shielded by a heat line In the sex test, the temperature inside the box used in the test was lowered, and a good heat ray shielding effect was exhibited. Further, in particular, when a naphthalocyanine-based compound in which M is Cu is used, the temperature inside the cell is remarkably lowered, and an excellent heat ray blocking effect is exhibited, which is preferable. In the case of using a naphthalocyanine-based compound in which M is VO, the temperature inside the cell is also remarkably lowered, and an excellent heat ray blocking effect is exhibited, which is preferable.

X表示低級烷基、低級烷氧基、經取代之胺基、硝基、鹵基、羥基、羧基、磺酸基或磺醯胺基。A係二價之交聯基,例如可列舉碳數1~3之伸烷基、-CO2-、-SO2-、-SO2NH(CH2)a-(此處,a表示0~4),較佳為碳數1~3之伸烷基,a為0之-SO2NH-,更佳為碳數1~3之伸烷基。Y表示磺酸基、羧基、除去1~2級胺基之氮原子上之至少一個氫之殘基,或除去含氮雜環之氮原子上之至少一個氫之殘 基,例如可列舉:羧基、磺酸基、亦可具有取代基之鄰苯二甲醯亞胺基、亦可具有取代基之哌嗪基、亦可具有取代基之哌啶基等,較佳為羧基、磺酸基、亦可具有取代基之鄰苯二甲醯亞胺基,更佳為亦可具有取代基之鄰苯二甲醯亞胺基。再者,作為Y為亦可具有取代基之鄰苯二甲醯亞胺基、亦可具有取代基之哌嗪基、亦可具有取代基之哌啶基時之取代基,表示氫原子、低級烷基、低級烷氧基、經取代之胺基、硝基、鹵基、磺酸基,較佳為氫原子、鹵基。 X represents a lower alkyl group, a lower alkoxy group, a substituted amino group, a nitro group, a halogen group, a hydroxyl group, a carboxyl group, a sulfonic acid group or a sulfonylamino group. Examples of the cross-linking group of the A-type divalent group include an alkylene group having 1 to 3 carbon atoms, -CO 2 -, -SO 2 -, -SO 2 NH(CH 2 ) a - (here, a represents 0~ 4), preferably an alkylene group having 1 to 3 carbon atoms, a being -SO 2 NH- of 0, more preferably an alkylene group having 1 to 3 carbon atoms. Y represents a sulfonic acid group, a carboxyl group, a residue of at least one hydrogen on the nitrogen atom of the 1st to 2nd amino group, or a residue of at least one hydrogen on the nitrogen atom of the nitrogen-containing heterocyclic ring, and examples thereof include a carboxyl group. a sulfonic acid group, a phthalic acid imine group which may have a substituent, a piperazinyl group which may have a substituent, a piperidinyl group which may have a substituent, etc., preferably a carboxyl group, a sulfonic acid group, The phthalic acid imine group having a substituent may also be used, and more preferably an phthalimido group having a substituent. Further, Y is a substituent of a phthalimido group which may have a substituent, a piperazinyl group which may have a substituent, or a piperidinyl group which may have a substituent, and represents a hydrogen atom and a lower stage. The alkyl group, the lower alkoxy group, the substituted amine group, the nitro group, the halogen group, and the sulfonic acid group are preferably a hydrogen atom or a halogen group.

本發明中經取代之胺基並無特別限定,例如包含經低級烷基取代之胺基。又,低級烷基、低級烷氧基係分別指直鏈狀或分支狀之碳數為1~4之烷基及烷氧基。作為將近紅外吸收色素分散至有機溶劑中之方法,可使用先前之方法。亦即,可將近紅外吸收色素與有機溶劑以特定比率進行混合,視需要於該混合物中添加分散劑、界面活性劑等,使用砂磨機、磨碎機、珠磨機、均質機、輥磨機等分散裝置而對混合物進行分散。 The substituted amino group in the present invention is not particularly limited, and examples thereof include an amine group substituted with a lower alkyl group. Further, the lower alkyl group and the lower alkoxy group each represent a linear or branched alkyl group having 1 to 4 carbon atoms and an alkoxy group. As a method of dispersing the near-infrared absorbing pigment into an organic solvent, the prior method can be used. That is, the near-infrared absorbing pigment and the organic solvent may be mixed at a specific ratio, and a dispersant, a surfactant, etc. may be added to the mixture as needed, and a sand mill, a grinder, a bead mill, a homogenizer, a roll mill may be used. The mixture is dispersed by a dispersing device such as a machine.

作為分散有金屬微粒子與近紅外吸收色素之熱線遮蔽性黏著劑組合物或將該組合物加工為片狀而成之熱線遮蔽性黏著片,係以貼附於窗玻璃上,遮斷陽光中所含之波長中之熱線成分為目的而使用,因此首要條件是耐候性良好。因此,於該實施形態中使用之黏著樹脂較佳為耐候性良好之丙烯酸共聚物系黏著樹脂。丙烯酸共聚物系黏著劑通常可藉由聚合物之玻璃轉移點較低之主單體與玻璃轉移點較 高之共聚單體之共聚合而製成。 The heat ray-shielding adhesive sheet in which the metal microparticles and the near-infrared absorbing dye are dispersed or the heat-shielding adhesive sheet obtained by processing the composition into a sheet shape is attached to the window glass to block the sunlight. The hot wire component in the wavelength is used for the purpose, and therefore the first condition is that the weather resistance is good. Therefore, the adhesive resin used in the embodiment is preferably an acrylic copolymer-based adhesive resin having good weather resistance. Acrylic copolymer adhesives can usually be obtained by lowering the main monomer of the polymer with a lower glass transition point than the glass transition point. It is made by copolymerization of high comonomer.

作為成為丙烯酸共聚物系黏著劑之主成分之單體,可列舉:玻璃轉移點較低之烷基之碳數為2~14之丙烯酸烷基酯或者烷基之碳數為4至16之甲基丙烯酸烷基酯,可與主單體一併使用玻璃轉移點高於該等且可與該等共聚合之單體。 Examples of the monomer which is a main component of the acrylic copolymer-based adhesive include an alkyl acrylate having a carbon number of 2 to 14 in an alkyl group having a lower glass transition point or a carbon number of 4 to 16 in an alkyl group. The alkyl acrylate may be used in combination with the main monomer with a glass transition point higher than that and may be copolymerized with the monomers.

作為玻璃轉移點較低之丙烯酸烷基酯單體,可例示:丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙烯酸甲氧基乙酯、丙烯酸正丁酯、丙烯酸異丁酯、丙烯酸第二丁酯、丙烯酸-2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、丙烯酸異壬酯、丙烯酸異硬脂基酯等。 As the alkyl acrylate monomer having a lower glass transition point, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, methoxyethyl acrylate, n-butyl acrylate, isobutyl acrylate, acrylic acid can be exemplified. Dibutyl ester, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, isodecyl acrylate, isostearyl acrylate, and the like.

又,作為玻璃轉移點較低之甲基丙烯酸烷基酯單體,可例示甲基丙烯酸-2-乙基己酯、甲基丙烯酸正辛酯、甲基丙烯酸正月桂酯等。 Further, examples of the alkyl methacrylate monomer having a low glass transition point include 2-ethylhexyl methacrylate, n-octyl methacrylate, and n-lauryl methacrylate.

又,作為可共聚合之單體,可例示:乙酸乙烯酯、丙烯腈、丙烯醯胺、苯乙烯、甲基丙烯酸甲酯、丙烯酸甲酯等。 Further, examples of the copolymerizable monomer include vinyl acetate, acrylonitrile, acrylamide, styrene, methyl methacrylate, and methyl acrylate.

除上述單體以外,為了獲得所需之黏著性能,亦可使用(甲基)丙烯酸、伊康酸、(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥丙酯、(甲基)丙烯酸二甲基胺基乙酯、丙烯醯胺、羥甲基丙烯醯胺、二甲基丙烯醯胺、甲基丙烯酸縮水甘油酯、順丁烯二酸酐等作為含有官能基之單體。 In addition to the above monomers, in order to obtain the desired adhesive properties, (meth)acrylic acid, itaconic acid, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, (meth)acrylic acid may also be used. Dimethylaminoethyl ester, acrylamide, methylol decylamine, dimethyl methacrylamide, glycidyl methacrylate, maleic anhydride or the like is used as a monomer having a functional group.

又,關於分子量,為了對金屬微粒子與近紅外吸收色素之分散性產生較大影響,丙烯酸系黏著劑之重量平均分子 量較佳為10萬~120萬。更佳為20萬~80萬。 Further, regarding the molecular weight, in order to have a large influence on the dispersibility of the metal fine particles and the near-infrared absorbing pigment, the weight average molecular weight of the acrylic adhesive The amount is preferably from 100,000 to 1.2 million. More preferably 200,000 to 800,000.

構成黏著劑之高分子材料之交聯度根據黏著劑(黏著劑組合物)之種類、組合等之各條件而不同,並無特別限定。黏著劑組合物亦可視需要含有塑化劑。作為該塑化劑,可列舉:鄰苯二甲酸酯、偏苯三甲酸酯、均苯四甲酸酯、己二酸酯、癸二酸酯、磷酸三酯或二醇酯等酯類,或處理油、液狀聚醚、液狀萜烯、其他液狀樹脂等,可使用該等中之一種或將該等中之兩種以上加以混合而使用。此種塑化劑較佳為與黏著劑之相溶性良好者。又,除上述塑化劑以外,黏著劑組合物可視需要而含有例如紫外線吸收劑或抗氧化劑等各種添加劑。 The degree of crosslinking of the polymer material constituting the adhesive is not particularly limited depending on various conditions such as the type and combination of the adhesive (adhesive composition). The adhesive composition may also contain a plasticizer as needed. Examples of the plasticizer include esters such as phthalic acid ester, trimellitic acid ester, pyromellitic acid ester, adipate, sebacate, phosphotriester or glycol ester. Alternatively, the oil, the liquid polyether, the liquid terpene, the other liquid resin, or the like may be used, or one of these may be used or a mixture of two or more of them may be used. Such a plasticizer is preferably one which is compatible with an adhesive. Further, in addition to the above plasticizer, the adhesive composition may contain various additives such as an ultraviolet absorber or an antioxidant as needed.

作為分散劑,代表性的是脂肪酸鹽(肥皂)、α-磺基脂肪酸酯鹽(MES)、烷基苯磺酸鹽(ABS)、直鏈烷基苯磺酸鹽(LAS)、烷基硫酸鹽(AS)、烷基醚硫酸酯鹽(AES)、烷基硫酸三乙醇之類的低分子陰離子性(anionic)化合物;脂肪酸乙醇醯胺、聚氧乙烯烷基醚(AE)、聚氧乙烯烷基苯醚(APE)、山梨醇、去水山梨醇之類的低分子非離子系化合物;烷基三甲銨鹽、二烷基二甲基氯化銨、烷基吡啶鎓氯化物之類的低分子陽離子性(cationic)化合物;烷羧基甜菜鹼、磺基甜菜鹼、卵磷脂之類的低分子兩性系化合物;或由萘磺酸鹽之福馬林縮聚物、聚苯乙烯磺酸鹽、聚丙烯酸鹽、乙烯基化合物與羧酸系單體之共聚物鹽、羧甲基纖維素、聚乙烯醇等所代表之高分子水系分散劑;聚丙烯酸部分烷基酯、聚伸烷基聚胺之類的高分子非水系分散劑;聚 伸乙基亞胺、甲基丙烯酸胺基烷基酯共聚物之類的高分子陽離子系分散劑,但只要可較佳地適用於本發明之粒子中,則並不排除具有此處所例示之形態者以外之結構者。 As the dispersing agent, representative are fatty acid salts (soap), α-sulfofatty acid ester salts (MES), alkylbenzenesulfonates (ABS), linear alkylbenzenesulfonates (LAS), and alkyl groups. Low-molecular anionic compound such as sulfate (AS), alkyl ether sulfate (AES), alkyl trisulfate; fatty acid ethanol decylamine, polyoxyethylene alkyl ether (AE), polyoxygen Low molecular nonionic compounds such as ethylene alkyl phenyl ether (APE), sorbitol, and sorbitan; alkyl trimethylammonium salts, dialkyl dimethyl ammonium chlorides, alkyl pyridinium chlorides, and the like a low molecular cationic compound; a low molecular amphoteric compound such as an alkanocarboxybetaine, a sulfobetaine or a lecithin; or a formalin polycondensate of a naphthalenesulfonate, a polystyrene sulfonate, Polyacrylate, copolymer salt of vinyl compound and carboxylic acid monomer, polymer aqueous dispersant represented by carboxymethyl cellulose, polyvinyl alcohol, etc.; polyalkyl acrylate partial alkyl ester, polyalkylene polyamine Polymer non-aqueous dispersant; A polymer cationic dispersant such as ethyl imine or an aminoalkyl methacrylate copolymer is used, but as long as it can be preferably used in the particles of the present invention, the form exemplified herein is not excluded. Other than the structure.

作為分散劑,若列舉具體的名稱,則已知有如下所述者。亦即,可例示:Flowlen DOPA-15B、Flowlen DOPA-17(共榮社化學股份有限公司製造);Solplus AX5、Solplus TX5、Solsperse 9000、Solsperse 12000、Solsperse 17000、Solsperse 20000、Solsperse 21000、Solsperse 24000、Solsperse 26000、Solsperse 27000、Solsperse 28000、Solsperse 32000、Solsperse 35100、Solsperse 54000、Solmics 250(日本Lubrizol股份有限公司製造);EFKA 4008、EFKA 4009、EFKA 4010、EFKA 4015、EFKA 4046、EFKA 4047、EFKA 4060、EFKA 4080、EFKA 7462、EFKA 4020、EFKA 4050、EFKA 4055、EFKA 4400、EFKA 4401、EFKA 4402、EFKA 4403、EFKA 4300、EFKA 4330、EFKA 4340、EFKA 6220、EFKA 6225、EFKA 6700、EFKA 6780、EFKA 6782、EFKA 8503(EFKA Additives公司製造);Ajisper PA111、Ajisper PB711、Ajisper PB821、Ajisper PB822、Ajisper PN411、FAMEX L-12(Ajinomoto Fine-Techno股份有限公司製造);TEXAPHOR-UV21、TEXAPHOR-UV61(Cognis Japan股份有限公司製造);DisperBYK101、DisperBYK102、DisperBYK106、DisperBYK108、DisperBYK111、DisperBYK116、DisperBYK130、 DisperBYK140、DisperBYK142、DisperBYK145、DisperBYK161、DisperBYK162、DisperBYK163、DisperBYK164、DisperBYK166、DisperBYK167、DisperBYK168、DisperBYK170、DisperBYK171、DisperBYK174、DisperBYK180、DisperBYK182、DisperBYK192、DisperBYK193、DisperBYK2000、DisperBYK2001、DisperBYK2020、DisperBYK2025、DisperBYK2050、DisperBYK2070、DisperBYK2155、DisperBYK2164、BYK220S、BYK300、BYK306、BYK320、BYK322、BYK325、BYK330、BYK340、BYK350、BYK377、BYK378、BYK380N、BYK410、BYK425、BYK430(BYK-Chemie Japan股份有限公司製造);Disparlon 1751N、Disparlon 1831、Disparlon 1850、Disparlon 1860、Disparlon 1934、Disparlon DA-400N、Disparlon DA-703-50、Disparlon DA-725、Disparlon DA-705、Disparlon DA-7301、Disparlon DN-900、Disparlon NS-5210、Disparlon NVI-8514L、HIPLAAD ED-152、HIPLAAD ED-216、HIPLAAD ED-251、HIPLAAD ED-360(楠本化成股份有限公司);FTX-207S、FTX-212P、FTX-220P、FTX-220S、FTX-228P、FTX-710LL、FTX-750LL、Ftergent 212P、Ftergent 220P、Ftergent 222F、Ftergent 228P、Ftergent 245F、Ftergent 245P、Ftergent 250、Ftergent 251、Ftergent 710FM、Ftergent 730FM、Ftergent 730LL、Ftergent 730LS、 Ftergent 750DM、Ftergent 750FM(Neos股份有限公司製造);AS-1100、AS-1800、AS-2000(東亞合成股份有限公司製造);Kaosera 2000、Kaosera 2100、KDH-154、MX-2045L、Homogenol L-18、Homogenol L-95、Rheodol SP-010V、Rheodol SP-030V、Rheodol SP-L10、Rheodol SP-P10(花王股份有限公司製造);Evan U103、Seanol DC902B、Noigen EA-167、Plysur fA219B、Plysur fAL(第一工業製藥股份有限公司製造);Megafac F-477、Megafac 480SF、Megafac F-482、(DIC股份有限公司製造);Sylface SAG503A、Dynol 604(日信化學工業股份有限公司製造);SN sperse 2180、SN sperse 2190、SN leveler-S-906(San Nopco股份有限公司製造);S-386、S-420(AGC Seimi Chemical股份有限公司製造)。 As a dispersing agent, if it has a specific name, it is as follows. That is, Flowlen DOPA-15B, Flowlen DOPA-17 (manufactured by Kyoeisha Chemical Co., Ltd.); Solplus AX5, Solplus TX5, Solsperse 9000, Solsperse 12000, Solsperse 17000, Solsperse 20000, Solsperse 21000, Solsperse 24000, Solsperse 26000, Solsperse 27000, Solsperse 28000, Solsperse 32000, Solsperse 35100, Solsperse 54000, Solmics 250 (manufactured by Lubrizol, Japan); EFKA 4008, EFKA 4009, EFKA 4010, EFKA 4015, EFKA 4046, EFKA 4047, EFKA 4060, EFKA 4080, EFKA 7462, EFKA 4020, EFKA 4050, EFKA 4055, EFKA 4400, EFKA 4401, EFKA 4402, EFKA 4403, EFKA 4300, EFKA 4330, EFKA 4340, EFKA 6220, EFKA 6225, EFKA 6700, EFKA 6780, EFKA 6782 EFKA 8503 (manufactured by EFKA Additives); Ajisper PA111, Ajisper PB711, Ajisper PB821, Ajisper PB822, Ajisper PN411, FAMEX L-12 (manufactured by Ajinomoto Fine-Techno Co., Ltd.); TEXAPHOR-UV21, TEXAPHOR-UV61 (Cognis Japan) Co., Ltd. manufacturing); DisperBYK101, DisperBYK102, DisperBYK106, DisperBYK108, Disper BYK111, DisperBYK116, DisperBYK130, DisperBYK140, DisperBYK142, DisperBYK145, DisperBYK161, DisperBYK162, DisperBYK163, DisperBYK164, DisperBYK166, DisperBYK167, DisperBYK168, DisperBYK170, DisperBYK171, DisperBYK174, DisperBYK180, DisperBYK182, DisperBYK192, DisperBYK193, DisperBYK2000, DisperBYK2001, DisperBYK2020, DisperBYK2025, DisperBYK2050, DisperBYK2070, DisperBYK2155, DisperBYK2164, BYK220S, BYK300, BYK306, BYK320, BYK322, BYK325, BYK330, BYK340, BYK350, BYK377, BYK378, BYK380N, BYK410, BYK425, BYK430 (manufactured by BYK-Chemie Japan Co., Ltd.); Disparlon 1751N, Disparlon 1831, Disparlon 1850, Disparlon 1860, Disparlon 1934, Disparlon DA-400N, Disparlon DA-703-50, Disparlon DA-725, Disparlon DA-705, Disparlon DA-7301, Disparlon DN-900, Disparlon NS-5210, Disparlon NVI-8514L, HIPLAAD ED- 152, HIPLAAD ED-216, HIPLAAD ED-251, HIPLAAD ED-360 (Nanben Chemical Co., Ltd.); FTX-207S, FTX-212P, FTX-220P, FTX-220S, FTX-228P, FTX-710LL, FTX- 750LL, Ftergent 212 P, Ftergent 220P, Ftergent 222F, Ftergent 228P, Ftergent 245F, Ftergent 245P, Ftergent 250, Ftergent 251, Ftergent 710FM, Ftergent 730FM, Ftergent 730LL, Ftergent 730LS, Ftergent 750DM, Ftergent 750FM (manufactured by Neos Co., Ltd.); AS-1100, AS-1800, AS-2000 (manufactured by Toagosei Co., Ltd.); Kaosera 2000, Kaosera 2100, KDH-154, MX-2045L, Homogenol L- 18. Homogenol L-95, Rheodol SP-010V, Rheodol SP-030V, Rheodol SP-L10, Rheodol SP-P10 (manufactured by Kao Co., Ltd.); Evan U103, Seanol DC902B, Noigen EA-167, Plysur fA219B, Plysur fAL (manufactured by First Industrial Pharmaceutical Co., Ltd.); Megafac F-477, Megafac 480SF, Megafac F-482, (manufactured by DIC Corporation); Sylface SAG503A, Dynol 604 (manufactured by Nissin Chemical Industry Co., Ltd.); SN sperse 2180, SN sperse 2190, SN leveler-S-906 (manufactured by San Nopco Co., Ltd.); S-386, S-420 (manufactured by AGC Seimi Chemical Co., Ltd.).

通常情況下,金屬微粒子與分散劑之RED(Relative Energy Difference,相對能量差)越小,分散性越良好,較佳為成為1.5以下之組合。作為與金屬微粒子之RED成為1.5以下之分散劑,可列舉:DISPERBYK-116、DISPERBYK-142、DISPERBYK-145、DISPERBYK-163、DISPERBYK-2000、DSPERBYK-2155、BYK-P105、ANTI-TERRAU、EFKA-4010、DOPA-17HF。 In general, the smaller the RED (Relative Energy Difference) of the metal fine particles and the dispersant, the better the dispersibility, and it is preferably a combination of 1.5 or less. As a dispersing agent having a RED of 1.5 or less with metal fine particles, there are mentioned DISPERBYK-116, DISPERBYK-142, DISPERBYK-145, DISPERBYK-163, DISPERBYK-2000, DSPERBYK-2155, BYK-P105, ANTI-TERRAU, EFKA- 4010, DOPA-17HF.

使用Hansen考慮關於Hildebrand之溶解度參數(δ)之分散力、偶極相互作用、氫鍵之效果而提出之數式1所表示之溶解度參數,計算δD(分散力產生之作用;作為藉由利用分子碰撞所誘導之偶極之形成而產生之倫敦力或凡得瓦力 產生之作用而已知)、δP(極性相互作用產生之作用;係指於分子存在於溶液中之情形時,作為對象之分子所產生之永久偶極產生之作用)、δH(氫鍵產生之作用;表示特定之相互作用,例如表示氫鍵、酸/鹼鍵結及施體/受體鍵結產生之作用),進而使用數式2計算相互作用半徑R0、HSP間距離Ra,並根據數式3、R0、Ra,可算出RED(Relative Energy Difference,相對能量差)。 Using Hansen to consider the solubility parameter expressed by Equation 1 for the dispersive force, dipole interaction, and hydrogen bonding effect of Hildebrand's solubility parameter (δ), calculate δD (the effect of dispersive force generation; by using molecules London force or van der Waals generated by the formation of a dipole induced by a collision Known as the effect), δP (the effect of the polar interaction; the role of the permanent dipole produced by the molecule as the molecule in the case of the molecule), δH (the role of hydrogen bonding) ; indicates a specific interaction, such as the role of hydrogen bonding, acid/base bonding, and donor/acceptor bonding), and then using Equation 2 to calculate the interaction radius R0, the distance Ra between HSP, and according to the formula 3. R0 and Ra can calculate RED (Relative Energy Difference).

[數2](Ra)2=4(δ D2-δ D1)2+(δ P2-δ P1)2+(δ H2-δ H1)2 [Number 2] (R a ) 2 = 4 ( δ D2 - δ D1 ) 2 + ( δ P2 - δ P1 ) 2 + ( δ H2 - δ H1 ) 2

[數3]RED=Ra/Ro [Number 3] RED=R a /R o

熱線遮蔽性黏著劑組合物可藉由公知之方法而製作。例如,可將金屬微粒子或近紅外吸收色素分散至成為丙烯酸共聚物系黏著劑之主成分之單體中,繼而藉由將其進行聚合而獲得目標之熱線遮蔽性黏著劑組合物。又,存在如下方法:如專利文獻1般預先製作金屬微粒子或近紅外吸收色素之分散液,並與單體混合後進行聚合,藉此獲得目標之黏著劑。進而作為更簡便之方法,存在有藉由將金屬微粒子或近紅外吸收色素之分散液與直接黏著劑進行混合而獲得目標之黏著劑組合物之方法。又,將金屬微粒子及近紅外吸收色素與分散劑進行混合,並使其分散至黏著劑中,藉此亦可獲得黏著劑組合物。 The heat ray-shielding adhesive composition can be produced by a known method. For example, metal fine particles or a near-infrared absorbing pigment can be dispersed in a monomer which is a main component of an acrylic copolymer-based adhesive, and then a target heat-shielding adhesive composition can be obtained by polymerizing the same. Further, there is a method in which a dispersion of metal fine particles or a near-infrared absorbing dye is prepared in advance as in Patent Document 1, and the monomer is mixed and polymerized to obtain a target adhesive. Further, as a more convenient method, there is a method in which a target adhesive composition is obtained by mixing a dispersion of metal fine particles or a near-infrared absorbing pigment with a direct adhesive. Further, the metal fine particles and the near-infrared absorbing dye are mixed with a dispersing agent and dispersed in an adhesive, whereby an adhesive composition can also be obtained.

於熱線遮蔽性黏著片之製造中,黏著劑之塗佈之方法並無特別限定,可使用缺角輪塗佈機、棒式塗佈機、旋轉塗佈機、噴塗機、輥式塗佈機、凹版塗佈機、刮刀塗佈機或其他各種塗佈裝置。 In the manufacture of the heat-shielding adhesive sheet, the method of applying the adhesive is not particularly limited, and a notch coater, a bar coater, a spin coater, a spray coater, a roll coater can be used. , gravure coater, knife coater or other various coating devices.

金屬微粒子與近紅外吸收色素相對於丙烯酸共聚物系黏著劑之單體或黏著劑之分散比率由黏著層之塗佈厚度及遮蔽性能而決定。作為塗佈有熱線遮蔽性黏著劑之膜之光學性能,較理想為可見光穿透率較高,且太陽能穿透率較低者,通常兩者存在比例關係,根據重視哪個性能而決定光學性能。 The dispersion ratio of the metal fine particles and the near-infrared absorbing dye to the monomer or the adhesive of the acrylic copolymer-based adhesive is determined by the coating thickness and the shielding property of the adhesive layer. The optical properties of the film coated with the heat ray-shielding adhesive are preferably such that the visible light transmittance is high and the solar light transmittance is low, and generally there is a proportional relationship between the two, and the optical performance is determined depending on which performance is emphasized.

將該塗佈有熱線遮蔽性黏著劑之膜實際貼附於建築物及汽車之窗玻璃上,分別測定夏季及冬季之效果,得到如下結論:為了充分獲得夏季之溫度降低效果,太陽能穿透率較佳為80%以下,且為了使照明成本以及冬季之供暖成本之上升為最小限度,可見光穿透率較佳為50%以上。因此,塗佈有熱線遮蔽性黏著劑之膜之光學特性較佳為可見光穿透率為50%以上且太陽能穿透率為80%以下。 The film coated with the heat-shielding adhesive is actually attached to the window glass of the building and the automobile, and the effects of summer and winter are respectively measured, and the following conclusions are obtained: in order to fully obtain the temperature reduction effect in summer, the solar transmittance It is preferably 80% or less, and in order to minimize the increase in lighting cost and heating cost in winter, the visible light transmittance is preferably 50% or more. Therefore, the optical property of the film coated with the heat ray-shielding adhesive is preferably a visible light transmittance of 50% or more and a solar energy transmittance of 80% or less.

通常情況下,黏著層之塗佈厚度考慮對被黏著面之追隨性或黏著力及經濟性而通常採用10~50 μm之厚度,作為於該範圍內給予上述熱線遮蔽性之微粒子之量,較佳為(金屬微粒子+近紅外吸收色素):樹脂固形物=3:97~1:1(重量比)之範圍。其原因在於:於熱線遮蔽劑微粒子之比率少於此範圍之情形時,為了獲得所需之熱線遮蔽性,必需50 μm以上之膜厚,相反地,於多於此範圍之情形時,可見 光穿透率變得過小。進而,膜之濁度必需不損及玻璃之透明性,較佳為8%以下,更佳為3%以下。 In general, the coating thickness of the adhesive layer is usually 10 to 50 μm in consideration of the followability or adhesion to the adhesive surface and economy, and the amount of the heat-shielding fine particles is given in the range. Good (metal microparticles + near-infrared absorbing pigment): resin solids = 3:97~1:1 (weight ratio) range. The reason is that when the ratio of the heat shielding agent fine particles is less than this range, in order to obtain the desired heat ray shielding property, a film thickness of 50 μm or more is required, and conversely, when it is more than this range, it is visible. The light transmittance becomes too small. Further, the turbidity of the film must be such that it does not impair the transparency of the glass, and is preferably 8% or less, more preferably 3% or less.

[實施例] [Examples]

列舉下述實施例及比較例具體地說明本發明,但本發明並不限定於該等。 The present invention will be specifically described by way of the following examples and comparative examples, but the present invention is not limited thereto.

合成例1(金屬微粒子) Synthesis Example 1 (Metal Microparticles)

藉由將四氯化錫(SnCl4‧5H2O)5.9 g及氯化銦(InCl3)75.9 g溶解於水4000 ml中,以58分鐘於其中添加2%氨水,使pH最終為7.85,從而使氧化錫及氧化銦之水合物共沈澱。其間,將液溫維持為5℃。繼而,對該共沈澱物進行清洗後加以乾燥,進而於900℃下焙燒2小時,獲得含有錫之氧化銦(ITO,Indium Tin Oxide)微粉末(金屬微粒子)。 By dissolving 4.9 g of tin tetrachloride (SnCl 4 ‧5H 2 O) and 75.9 g of indium chloride (InCl 3 ) in 4000 ml of water, 2% aqueous ammonia was added thereto over 58 minutes to bring the pH to 7.85. Thereby, the hydrate of tin oxide and indium oxide is coprecipitated. In the meantime, the liquid temperature was maintained at 5 °C. Then, the coprecipitate was washed, dried, and further calcined at 900 ° C for 2 hours to obtain tin (Indium Tin Oxide) fine powder (metal fine particles).

合成例2(近紅外吸收色素) Synthesis Example 2 (near-infrared absorbing pigment)

藉由於多磷酸40份中添加釩氧2,3-萘酞菁(Aldrich公司製造)3.9份、鄰苯二甲醯亞胺(東京化成工業公司製造)5.0份、三聚甲醛1.0份,於140℃下攪拌8小時後,注入水300份,對析出之固體進行過濾,從而獲得萘酞菁系化合物7.5份。 By adding vanadium oxy 2,3-naphthalocyanine (manufactured by Aldrich Co., Ltd.) to 3.9 parts of polyphosphoric acid, 5.0 parts of phthalimide (manufactured by Tokyo Chemical Industry Co., Ltd.), and 1.0 part of paraformaldehyde, at 140 After stirring at ° C for 8 hours, 300 parts of water was poured, and the precipitated solid was filtered to obtain 7.5 parts of a naphthalocyanine-based compound.

製造例1(金屬微粒子分散液) Production Example 1 (Metal Microparticle Dispersion)

於甲苯溶液7 ml中添加合成例1中所獲得之ITO合成粒子1.12 g、乙醯丙酮0.7 g、及分散劑DisperBYK140 0.175 g,投入至分批式珠磨裝置(T.K.filmics 30-25型,primix(股)製造)之粉碎容器內。壓碎顆粒係使用平均粒徑為30 μm之氧化鋯顆粒,填充至粉碎容器體積之35%填充為止。 以輪緣速率成為6.8 m/s之方式設定馬達,並於壓碎時間為10分鐘之條件下進行壓碎。又,使用離心分離機(日立工機股份有限公司Himac CR18)於轉速為5000 rpm下對所獲得之分散體(金屬微粒子分散液)進行離心處理15分鐘。 To 7 ml of the toluene solution, 1.12 g of ITO synthetic particles obtained in Synthesis Example 1, 0.7 g of acetamidine acetone, and 0.175 g of dispersant DisperBYK140 were added, and the mixture was put into a batch type bead milling apparatus (TKfilmics Model 30-25, primix). (manufactured)) in the pulverization container. The crushed particles were zirconia particles having an average particle diameter of 30 μm, and filled to 35% of the volume of the pulverization container. The motor was set in such a manner that the rim rate became 6.8 m/s, and crushing was performed under the condition that the crushing time was 10 minutes. Further, the obtained dispersion (metal fine particle dispersion) was centrifuged at a number of revolutions of 5000 rpm for 15 minutes using a centrifugal separator (Himac CR18).

製造例2(近紅外線吸收色素分散液1) Production Example 2 (Near Infrared Absorbing Pigment Dispersion 1)

於甲苯溶液7 ml中添加合成例2中所獲得之近紅外吸收色素0.21 g、及分散劑DisperBYK140 0.21 g,投入至分批式珠磨裝置(T.K.filmics 30-25型,primix(股)製造)之粉碎容器內。壓碎顆粒係使用平均粒徑為30 μm之氧化鋯顆粒,填充至粉碎容器體積之70%填充為止。以輪緣速率成為10 m/s之方式設定馬達,並於壓碎時間為30分鐘之條件下進行壓碎。又,使用離心分離機(日立工機股份有限公司Himac CR18)於轉速為5000 rpm下對所獲得之分散體進行離心處理15分鐘,藉此獲得近紅外吸收色素分散液1。 0.2 μg of the near-infrared absorbing pigment obtained in Synthesis Example 2 and 0.21 g of the dispersing agent DisperBYK 140 were added to 7 ml of the toluene solution, and the mixture was placed in a batch type bead milling apparatus (TKfilmics Model 30-25, manufactured by Primix). The inside of the crushing container. The crushed particles were zirconia particles having an average particle diameter of 30 μm and filled to 70% of the volume of the pulverization container. The motor was set in such a manner that the rim speed became 10 m/s, and crushing was performed under the condition that the crushing time was 30 minutes. Further, the obtained dispersion was subjected to centrifugation at a number of revolutions of 5000 rpm for 15 minutes using a centrifugal separator (Higashi Industrial Co., Ltd. Himac CR18) to obtain a near-infrared absorbing pigment dispersion liquid 1.

製造例3(近紅外吸收色素分散液2) Production Example 3 (Near Infrared Absorbing Pigment Dispersion 2)

除了將合成例2中所獲得之近紅外吸收色素替換為2,3-萘酞菁(Aldrich公司製造)以外,以與製造例2相同之方式獲得近紅外色素分散液2。 The near-infrared pigment dispersion liquid 2 was obtained in the same manner as in Production Example 2, except that the near-infrared absorbing dye obtained in Synthesis Example 2 was replaced with 2,3-naphthalocyanine (manufactured by Aldrich Co., Ltd.).

合成例3(丙烯酸系黏著劑A) Synthesis Example 3 (Acrylic Adhesive A)

將作為單體之丙烯酸正丁酯291 g及丙烯酸9 g溶解於甲苯366 g中,添加偶氮二異丁腈0.15 g,於氮氣流下以70℃對該等之單體進行聚合6小時而獲得丙烯酸樹脂共聚物(重量平均分子量:Mw=32萬)。進而藉由甲苯進行稀釋,獲得固形物分率為29.36%、黏度為2700 mPas之丙烯酸樹脂 共聚物溶液。 291 g of n-butyl acrylate as a monomer and 9 g of acrylic acid were dissolved in 366 g of toluene, 0.15 g of azobisisobutyronitrile was added, and the monomers were polymerized at 70 ° C for 6 hours under a nitrogen stream. Acrylic resin copolymer (weight average molecular weight: Mw = 320,000). Further, by diluting with toluene, an acrylic resin having a solid content fraction of 29.36% and a viscosity of 2700 mPas was obtained. Copolymer solution.

熱線遮蔽性黏著劑及熱線遮蔽性黏著片之製作 Manufacture of heat-shielding adhesives and heat-shielding adhesive sheets 實施例1 Example 1

以使合成例3中所獲得之丙烯酸系黏著劑A 100重量份(丙烯酸丁酯:丙烯酸=97:3)、製造例1中所獲得之含有錫之氧化銦(ITO)之甲苯分散液144重量份、以及製造例2中所獲得之近紅外吸收色素之甲苯分散液14.7重量份變均勻之方式進行混合溶解,獲得熱線遮蔽性黏著劑。又,藉由缺角輪塗佈機將其塗佈於脫模片之聚酯膜(於單面側實施有聚矽氧處理者)(lintec公司製造3811厚度為38 μm)上而加以乾燥,並藉由脫模片之聚酯膜(於單面側實施有聚矽氧處理者)(lintec公司製造3801厚度為38 μm)進行覆蓋,藉此製作熱線遮蔽性黏著片(厚度為15 μm)。 100 parts by weight of the acrylic pressure-sensitive adhesive A obtained in Synthesis Example 3 (butyl acrylate: acrylic acid = 97:3), and the toluene dispersion liquid 144 containing tin oxide indium oxide (ITO) obtained in Production Example 1 was used. The mixture and the 14.7 parts by weight of the toluene dispersion liquid of the near-infrared absorbing dye obtained in Production Example 2 were mixed and dissolved to obtain a heat ray-shielding adhesive. Further, it was applied to a polyester film of a release sheet (manufactured by a polyxylene processor on one side) (manufactured by Lintec Co., Ltd., 3811 thickness: 38 μm) by a knurling coater, and dried. The heat-shielding adhesive sheet (thickness: 15 μm) was formed by covering the polyester film of the release sheet (manufactured by the lintec side with a polysiloxane treatment) (manufactured by Lintec Co., Ltd.) with a thickness of 38 μm. .

實施例2 Example 2

除了將近紅外吸收色素之甲苯分散液替換為製造例3中製作者以外,以與實施例1相同之方式製作熱線遮蔽性黏著劑及熱線遮蔽性黏著片。 A heat ray-shielding adhesive and a heat ray-shielding adhesive sheet were produced in the same manner as in Example 1 except that the toluene dispersion of the near-infrared absorbing dye was replaced with the Manufacturer of Production Example 3.

比較例1 Comparative example 1

除了於實施例1中並不混合近紅外吸收色素之甲苯分散液,並使用製造例1中所獲得之含有錫之氧化銦(ITO)之甲苯分散液144重量份及丙烯酸系黏著劑A 100重量份以外,以與實施例1相同之方式製作熱線遮蔽性黏著片(厚度為15 μm)。 Except that the toluene dispersion of the near-infrared absorbing pigment was not mixed in Example 1, and 144 parts by weight of the toluene dispersion containing tin indium oxide (ITO) obtained in Production Example 1 and the weight of the acrylic adhesive A 100 were used. A heat ray-shielding adhesive sheet (having a thickness of 15 μm) was produced in the same manner as in Example 1 except for the parts.

實施例3 Example 3

藉由下述所示之方法對實施例1、實施例2及比較例1中所製作之熱線遮蔽性黏著片實施熱線遮蔽性試驗。將其結果示於表1。 The heat shield properties of the heat ray-shielding adhesive sheets produced in Example 1, Example 2, and Comparative Example 1 were subjected to a heat ray shielding test by the method shown below. The results are shown in Table 1.

試驗方法 experiment method

試驗環境:準備內徑寬度150 mm×長度235 mm×高度110 mm之具有外部溫度遮斷性及氣密性之試驗箱,於該試驗箱頂中央部將紅外燈(100 V,250 W:東芝股份有限公司)設置於自上述試驗箱頂部起高度為40 cm之位置上,構成遮熱性評價用試驗裝置。其次,於試驗箱頂部分設置所製作之熱線遮蔽性黏著片,藉由膠帶貼附四角而固定。又,以並不與燈光直接接觸之方式將溫度計設置於該試驗箱內部之中央部。其後,將燈點亮,每隔10秒測定溫度,並測定30分鐘後之試驗箱內溫度。再者,上述試驗箱設置於25℃左右之房間內。於該試驗中,對使用比較例中所製作之熱線遮蔽性黏著片與使用本發明之熱線遮蔽性黏著片時之箱內溫度加以比較,若使用本發明之熱線遮蔽性黏著片之箱內溫度降低,則熱線遮蔽效果提高。再者,箱內溫度差之計算方法係藉由從使用比較例中所製作之熱線遮蔽性黏著片之箱內溫度減去使用本發明之熱線遮蔽性黏著片之箱內溫度而導出。 Test environment: Prepare a test chamber with an outer temperature width of 150 mm × length 235 mm × height 110 mm with external temperature occlusion and air tightness. In the center of the top of the test chamber, infrared light (100 V, 250 W: Toshiba) Co., Ltd.) is placed at a height of 40 cm from the top of the test chamber to constitute a test device for evaluating heat shielding properties. Next, the heat-shielding adhesive sheet produced in the top portion of the test box was fixed by attaching the four corners of the tape. Further, the thermometer was placed at the center of the inside of the test chamber so as not to be in direct contact with the light. Thereafter, the lamp was turned on, the temperature was measured every 10 seconds, and the temperature in the test chamber after 30 minutes was measured. Furthermore, the above test chamber is placed in a room of about 25 °C. In this test, the temperature inside the box when the heat ray-shielding adhesive sheet produced in the comparative example was used and the temperature of the heat ray-shielding adhesive sheet using the present invention were compared, and the temperature inside the box using the heat ray-shielding adhesive sheet of the present invention was used. When lowered, the heat line shielding effect is improved. Further, the calculation method of the temperature difference in the tank was derived by subtracting the temperature inside the tank using the heat ray-shielding adhesive sheet of the present invention from the temperature inside the tank using the heat ray-shielding adhesive sheet produced in the comparative example.

如表1所示,使用比較例1中所製作之熱線遮蔽性黏著片時之箱內溫度為72.5℃。另一方面,使用本發明之實施例1、實施例2中所製作之熱線遮蔽性黏著片時之箱內溫度分別為68.4℃、68.0℃。亦即,本發明之實施例1、實施例2中所製作之熱線遮蔽性黏著片之箱內溫度與比較例中所製作之熱線遮蔽性黏著片之箱內溫度相比而言,分別低4.1℃、4.5℃。根據該結果可知:本發明之熱線遮蔽性黏著片之熱線遮蔽效果提高。 As shown in Table 1, the temperature inside the box when the heat ray-shielding adhesive sheet produced in Comparative Example 1 was used was 72.5 °C. On the other hand, in the case where the heat ray-shielding adhesive sheets produced in Example 1 and Example 2 of the present invention were used, the in-tank temperatures were 68.4 ° C and 68.0 ° C, respectively. That is, the temperature inside the box of the heat ray-shielding adhesive sheet produced in Example 1 and Example 2 of the present invention was lower than that in the case of the heat ray-shielding adhesive sheet produced in the comparative example, respectively. °C, 4.5 °C. According to the results, it is understood that the heat ray shielding effect of the heat ray-shielding adhesive sheet of the present invention is improved.

[產業上之可利用性] [Industrial availability]

本發明可藉由使用分散劑使熱線遮蔽性金屬微粒子與近紅外吸收色素分散至黏著劑中,從而與先前之熱線遮蔽性黏著片相比而言抑制由熱線所引起之溫度上升。藉此,本發明可抑制住宅或汽車之空間之溫度上升,並減輕空調機器之負荷,對節能或地球環境問題作出貢獻。 According to the present invention, the heat ray-shielding metal fine particles and the near-infrared absorbing pigment can be dispersed in the adhesive by using a dispersing agent, thereby suppressing the temperature rise caused by the heat line as compared with the conventional heat ray-shielding adhesive sheet. Accordingly, the present invention can suppress the temperature rise of the space of a house or a car, reduce the load of the air conditioner, and contribute to energy saving or global environmental problems.

Claims (6)

一種熱線遮蔽性黏著劑組合物,其含有(A)金屬微粒子、(B)丙烯酸系黏著劑、(C)分散劑及(D)近紅外吸收色素,其中上述(A)金屬微粒子之藉由X射線繞射(XRD)圖案所獲得之第一主峰之半高寬為0.01~0.8°,上述(B)丙烯酸系黏著劑之重量平均分子量為10萬~120萬,且上述(D)近紅外吸收色素係式(1)所表示之萘酞菁系化合物: [式(1)中,M表示金屬原子、金屬氧化物、金屬氫氧化物或者金屬鹵化物、或氫原子,X表示低級烷基、低級烷氧基、經取代之胺基、硝基、鹵基、羥基、羧基、磺酸基、磺醯胺基;A表示二價之交聯基,Y表示磺酸基、羧基、除去1~2級胺基之氮原子上之至少一個氫之殘基,或除去含氮雜環之氮原子上之至少一個氫之殘基;m及n均為平均值,m、n分別為0以上12以下,且m與n之和為0以上12以下]。 A heat ray-shielding adhesive composition comprising (A) metal fine particles, (B) an acrylic adhesive, (C) a dispersant, and (D) a near-infrared absorbing dye, wherein the (A) metal fine particles are represented by X The half-height width of the first main peak obtained by the diffraction pattern (XRD) is 0.01 to 0.8°, and the weight average molecular weight of the (B) acrylic adhesive is 100,000 to 1.2 million, and the above (D) near-infrared absorption A naphthalocyanine compound represented by the formula (1): [In the formula (1), M represents a metal atom, a metal oxide, a metal hydroxide or a metal halide, or a hydrogen atom, and X represents a lower alkyl group, a lower alkoxy group, a substituted amino group, a nitro group, a halogen group. a group, a hydroxyl group, a carboxyl group, a sulfonic acid group, a sulfonylamino group; A represents a divalent crosslinking group, and Y represents a sulfonic acid group, a carboxyl group, and a residue of at least one hydrogen on the nitrogen atom of the amine group 1 to 2 Or removing at least one hydrogen residue on the nitrogen atom of the nitrogen-containing heterocyclic ring; m and n are average values, and m and n are each 0 or more and 12 or less, and the sum of m and n is 0 or more and 12 or less]. 如請求項1之熱線遮蔽性黏著劑組合物,其中(A)金屬微粒子係選自氧化錫、氧化銦、氧化鋅之群之一種金屬微粒子。 The heat shielding adhesive composition of claim 1, wherein the (A) metal microparticles are selected from the group consisting of tin oxide, indium oxide, and zinc oxide. 如請求項1或2中任一項之熱線遮蔽性黏著劑組合物,其中(B)丙烯酸系黏著劑係羧基或者含有酸酐之單體之結構單元之比率為聚合物中之所有單體結構單元之1~5%之聚合物。 The heat shielding adhesive composition according to any one of claims 1 to 2, wherein the ratio of the (B) acrylic adhesive-based carboxyl group or the structural unit of the acid-containing monomer is all monomer structural units in the polymer. 1 to 5% of the polymer. 如請求項1之熱線遮蔽性黏著劑組合物,其中式(1)中之M為VO,A為碳數1~3之伸烷基,Y為亦可具有取代基之鄰苯二甲醯亞胺基。 The heat shielding adhesive composition of claim 1, wherein M in the formula (1) is VO, A is an alkylene group having 1 to 3 carbon atoms, and Y is an o-benzonitrile having a substituent. Amine. 如請求項1之熱線遮蔽性黏著劑組合物,其中式(1)中之M為Cu,A為碳數1~3之伸烷基,Y為亦可具有取代基之鄰苯二甲醯亞胺基。 The heat shielding adhesive composition according to claim 1, wherein M in the formula (1) is Cu, A is an alkylene group having 1 to 3 carbon atoms, and Y is an o-benzonitrile which may have a substituent. Amine. 一種熱線遮蔽性黏著片,其係塗佈如請求項1至5中任一項之熱線遮蔽性黏著劑組合物而成。 A heat ray-shielding adhesive sheet obtained by coating the heat ray-shielding adhesive composition according to any one of claims 1 to 5.
TW101140400A 2011-11-01 2012-10-31 Hotline Masking Adhesive Composition and Hot Wire Masking Adhesive Sheet TWI553071B (en)

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JP2005146143A (en) * 2003-11-17 2005-06-09 Seed Co Ltd Ultraviolet-curing heat-ray-shielding hard coat composition
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