TWI551353B - Nozzle device - Google Patents

Description

Array nozzle device

The present disclosure relates to an array head device.

A conventional droplet discharge apparatus includes a pressurizing device, a pressurizing chamber, a nozzle, and an injection hole. The nozzle communicates with the pressurized chamber. The injection hole is used to fill the liquid to the pressurized chamber. The pressurizing device applies pressure to the side wall of the pressurizing chamber to eject the liquid droplets.

Usually, after the droplet discharge device is designed, the droplet size is fixed and cannot be changed, and the use is inelastic.

In view of the above problems, the embodiments of the present patent disclose new array nozzle devices, respectively.

The array nozzle device according to an embodiment of the invention comprises an upper cover module, a plurality of piezoelectric modules, a plug module and a lower cover module. A plurality of piezoelectric chip modules are stacked and disposed between the upper cover module and the plug module. The plug module is located between the plurality of piezoelectric module and the lower cover module. The upper cover module defines a plurality of cavities or grooves for receiving a liquid or a gel. Each piezoelectric module comprises a substrate, a plurality of piezoelectric materials, a plurality of electrical connectors, a plurality of upper electrodes, and a plurality of lower electrodes. The substrate includes an upper surface, a lower surface, and a plurality of first through holes. A plurality of first through holes are provided corresponding to the plurality of grooves of the upper cover module. The piezoelectric material is disposed on the upper surface of the substrate. The electrical connector extends from the lower surface of the substrate through the substrate to the underside of the piezoelectric material. The upper electrode can extend over at least the piezoelectric material. The lower electrode is formed on the lower surface of the substrate and is connected to the electrical connector. The plug module includes a plurality of plug portions protruding downward, and a plurality of second through holes disposed corresponding to the plurality of first through holes. The lower cover module includes an opening, wherein the opening of the lower cover module is disposed corresponding to the plug portion of the plug module.

The array head device of the embodiment of the present disclosure uses a plurality of similar piezoelectric sheet molds Therefore, the number of the piezoelectric sheet modules can be arbitrarily changed, and the discharge amount of the liquid or the gel can be adjusted.

1, 1a‧‧‧Array nozzle device

11‧‧‧Quartz or glass upper cover module

11a‧‧‧Quartz or glass cover

11b‧‧‧Quartz or glass substrate

12‧‧‧ Piezoelectric Module

13‧‧‧矽 or quartz or glass plug module

14‧‧‧Quartz or glass lower cover module

15‧‧‧ Piezoelectric module

110‧‧‧矽 or glass substrate

111‧‧‧ Groove

112‧‧‧Bumps

113‧‧‧First through hole

114‧‧‧Electrical connection structure

120‧‧‧Platinum electrode layer

121‧‧‧矽 or glass substrate

122‧‧‧Piezoelectric materials

123‧‧‧Electrical connectors

124‧‧‧Upper electrode

125‧‧‧lower electrode, platinum electrode layer

126‧‧‧Insulation materials

131‧‧‧矽 or quartz or glass plug

132‧‧‧Second through hole

141‧‧‧ openings, spouts

142‧‧‧ Groove

151‧‧‧Quartz substrate

152‧‧‧electrode

153‧‧‧Insulation materials

1141‧‧‧Connecting parts

1211‧‧‧ upper surface

1212‧‧‧ lower surface

1141‧‧‧Connecting parts

1412‧‧‧Upper electrode

1413‧‧‧ lower electrode

1414‧‧‧Upper insulation

1415‧‧‧lower insulation

1511‧‧‧Part 1 of Piezoelectric Materials

1512‧‧‧ Piezoelectric material part two

1513‧‧‧through hole

1 is a schematic view of an array type head device according to an embodiment of the present invention.

2 is a schematic view of a cover module according to an embodiment of the present invention.

3 is a schematic view of a cover of a cover plate module according to an embodiment of the present invention.

4 is a schematic view of a base of a cover plate module according to an embodiment of the present invention.

FIG. 5 is a schematic view of a piezoelectric sheet module according to an embodiment of the present invention.

FIG. 6 is a schematic diagram of a plug module according to an embodiment of the present invention.

FIG. 7 is a schematic view of a cover module according to an embodiment of the present invention.

FIG. 8 is a schematic diagram of an array type head device according to another embodiment of the present invention.

FIG. 9 is a schematic view of a piezoelectric sheet module according to another embodiment of the present invention.

Referring to FIG. 1 , in at least some embodiments, an array head device 1 includes an upper cover module 11 , a plurality of piezoelectric modules 12 , a plug module 13 , and a lower cover module 14 . The plurality of piezoelectric module 12 are stacked and disposed between the upper cover module 11 and the plug module 13. The plug module 13 is located between the plurality of piezoelectric module 12 and the lower cover module 14. After the voltage is applied, the plurality of piezoelectric module 12 moves the plug module 13 , and the plug module 13 passes the liquid or colloid stored in the lower cover module 14 through the opening 141 of the lower cover module 14 . Send it out. The upper cover module 11 has a plurality of cavities or grooves 111 for storing a supplemental liquid or gel. The groove 111 can additionally be externally connected to the storage tank (not shown) through the one-way valve to continuously replenish the liquid or the colloid. The plurality of piezoelectric sheet modules 12 can be similar to each other. Adjusting the number of the plurality of piezoelectric sheet modules 12 can adjust the volume of the discharged droplets or colloids.

Referring to Figures 2 and 3, the upper cover module 11 includes a cover 11a and a base 11b. The cover 11a includes at least one groove 111 and at least one protrusion 112. The groove 111 can store a liquid or a gel, such as a polymer conductive paste. Or a mixture of gypsum and water. Or Thermosetting Plastic (Thermal Setting Plastic). Or germanium semiconductors with trivalent boron (boron) or pentavalent phosphorus (Phosphorous) and other mixtures of Doping Impurity and De-ionized Water. Or a mixture of metal powder and deionized water. The cover 11a may be provided with a plurality of first through holes for replenishing liquid or colloid to the groove 111 from outside the array head device 1. In some embodiments, the cover 11a is fabricated in a casting process. In some embodiments, the thickness of the cover 11a is between 1 and 2 cm (not limited to this creation), so that it is less susceptible to deformation. In some embodiments, the cover 11a is made of quartz or glass, and the advantages thereof are two aspects: one quartz or glass is a transparent material, and the contents of the inner filling can be seen from the outside, and whether there are bubbles or not affects the spraying effect. The other is a material which can be formed by pressing an anode welding process and a plurality of piezoelectric module 12, plug module 13 and lower cover module 14.

Referring to FIG. 4, in some embodiments, the substrate 11b includes at least one first through hole 113. The at least one first through hole 113 is disposed corresponding to the at least one groove 111, so that the liquid or the colloid in the groove 111 can be squeezed out by the expansion deformation of the piezoelectric material. In some embodiments, the substrate 11b includes at least one electrical connection structure 114 and a substrate 110. The at least one electrical connection structure 114 corresponds to at least one of the bumps 112 of the cover 11a. The electrical connection structure 114 includes an electrical connection member 1141, an upper electrode 1412, a lower electrode 1413, an upper insulating layer 1414, and a lower insulating layer 1415. The electrical connector 1141 penetrates the substrate 110 and has portions extending over the upper and lower surfaces of the substrate 110. The upper electrode 1412 covers the electrical connector 1141, a portion of the upper surface of the substrate 110. The lower electrode 1413 covers the electrical connector 1141 and is located on a portion of the lower surface of the substrate 110. The upper insulating layer 1414 covers the upper surface of the upper electrode 1412 and a portion of the substrate 110. The lower insulating layer 1415 covers not only the portion of the lower electrode 1413 (located on the lower surface of the electrical connection member 1141 on the lower surface of the substrate 110) but also the portion of the lower surface of the substrate 110. In some embodiments, substrate 110 comprises tantalum or glass. In some embodiments, the electrical connector 1141 comprises copper, and the upper electrode 1412 and the lower electrode 1413 comprise platinum, such that the upper electrode 1412 and the lower electrode 1413 prevent the electrical connector 1141 from being oxidized by exposure to air or other substances. On the other hand, the platinum material is advantageous for subsequently stacking the plurality of piezoelectric sheets by anodic bonding and soldering them into a piezoelectric sheet module 12. In some embodiments, the upper insulating layer 1414 and the lower insulating layer 1415 comprise hafnium oxide or tantalum nitride.

In some embodiments, the cover 11a and the base 11b are joined by anodic bonding to obtain a generally sealed groove 111.

In at least some embodiments, the method of fabricating the substrate 11b includes: using lithography techniques, as well as deep ion etching processes, inductive plasma etching, or Bosch deep reactive ion etching, A deep hole of 50 to 100 microns is etched into the substrate 110 (but this is not limited to this creation). Using a yellow light process and a sputtering process, a layer of copper is plated as a seed layer near a portion of the deep hole and its opening. Then, the copper is electroplated until the thickness of the copper on the surface of the substrate 110 is 10 to 50 μm (but this is not limited thereto). Thereafter, the bottom surface of the substrate 110 is polished by a chemical mechanical polishing (CMP) method until the copper in a portion of the deep holes is exposed. The other part of the deep hole is formed as a through hole through which the liquid or fluid can flow after the CMP. Next, another layer of copper is plated as a seed layer at and around each exposed copper end. Then, copper plating is performed to 1 to 5 micrometers (but not limited to this creation) to form an electrical connection member 1141. Thereafter, a platinum electrode layer is formed on the copper surface on the substrate 110. The platinum electrode layer acts as an electrode and prevents oxidation of the copper, facilitating subsequent bonding. In some embodiments, the platinum electrode layer on each of the electrical connectors 1141 can be respectively connected to the positive and negative electrodes (not shown) of different external voltage sources, and respectively controlled by the logic switching circuit. Wave shape to spray different volumes of liquid or colloid. If the relative movement is carried out in conjunction with the stage carrying the workpiece, liquid or colloid of different thicknesses and patterns can be formed on each layer of the workpiece, and the above actions can be repeated to spray the layers, and different third degrees can be completed on the workpiece. Spatial three-dimensional pattern.

Referring to FIG. 5, the piezoelectric module 12 includes a substrate 121, a piezoelectric material 122, an electrical connector 123, an upper electrode 124, and a lower electrode 125. The substrate 121 includes an upper surface 1211, a lower surface 1212, and a through hole 113. The through hole 113 is disposed corresponding to the groove 111 of the upper cover module 11 so that the liquid or colloid of the groove 111 can flow therethrough. The piezoelectric material 122 is disposed on the upper surface 1211 of the substrate 121. The electrical connector 123 passes from the lower surface 1212 of the substrate 121 through the substrate 121 to the underside of the piezoelectric material 122. The upper electrode 124 extends at least over the piezoelectric material 122. The lower electrode 125 is formed on the lower surface 1212 of the substrate 121 and electrically connected to the electrical connector 123. The upper electrode 124 and the lower electrode 125 are disposed along the upper and lower surfaces of the substrate 121. The upper electrode 124 can be connected to the positive pole of the external voltage power supply, and the lower electrode 125 can be connected to the negative pole of the external voltage power supply, and the voltage and mode (not shown) of the conduction voltage are controlled by the logic switch circuit respectively, and the upper electrode 124 is utilized. An electric field can be applied to the piezoelectric material 122 with the lower electrode 125 to be elongated in the direction of the electric field (in the present embodiment, the downward direction of the surface of the vertical substrate 121). In some embodiments, substrate 121 comprises tantalum or glass. In some embodiments, the upper electrode 124 comprises platinum. In some embodiments, the lower electrode 125 comprises platinum. In some embodiments, the electrical connector 123 includes a vertical through glass or a glass channel (Through Silicon (Glass) Via, TSV (TGV)). In some embodiments, the electrical connector 123 comprises copper.

Referring to FIG. 5, in some embodiments, portions of the electrical connector 123 extend over the upper surface 1211 of the substrate 121. In some embodiments, the portion of the electrical connector 123 that extends over the upper surface 1211 of the substrate 121 is covered by the piezoelectric material 122. In some embodiments, the upper electrode 124 covers the piezoelectric material 122. In some embodiments, another portion of the electrical connector 123 extends over the lower surface 1212 of the substrate 121.

Referring to FIG. 5, the piezoelectric sheet module 12 includes an insulating material 126. The insulating material 126 covers the upper surface 1211 and the lower surface 1212 of the substrate 121, and exposes only a portion of the upper electrode 124 and a portion of the lower electrode 125. The insulating material 126 comprises hafnium oxide or tantalum nitride.

In some embodiments, the thickness of the upper electrode 124 is between 10 and 50 nanometers (but not limited to this creation). In some embodiments, the thickness of the lower electrode 125 is between 10 and 50 nanometers (but not limited to this creation).

In some embodiments, piezoelectric material 122 comprises a lead zirconate Titanate (PZT). In some embodiments, piezoelectric material 122 comprises polyvinylidene fluoride (PVDF).

Referring to FIG. 3 and FIG. 5, in some embodiments, the piezoelectric module 12 includes a plurality of piezoelectric materials 122, and the upper cover module 11 is provided with a plurality of bumps 112, wherein the plurality of bumps 112 correspond to a plurality of piezoelectric materials. 122 settings.

Referring to FIG. 1, in some embodiments, the piezoelectric sheet module 12 can be pressed onto the upper cover module 11 by an anodic bonding process. In some embodiments, the plurality of piezoelectric module 12 can be pressed one by one and stacked on the upper cover module 11, wherein each piezoelectric module 12 is connected to the positive and negative electrodes of different voltage sources respectively. And the logic switching circuit is used to control the voltage and mode (not shown) of the conduction.

Referring to FIG. 5, the manufacturing method of the piezoelectric chip module 12 includes: etching 50 to 100 on the substrate 121 by using a lithography technique, a deep ion etching process, an inductive plasma etching, or a Bosch deep reactive ion etching. Micron deep holes (but this creation is not limited to this). A layer of copper seed layer is applied to a portion of the deep hole and its opening by a yellow light process and a sputtering process. Then, the copper is electroplated until the thickness of the copper on the surface of the substrate 121 is 10 to 50 μm (but this is not limited thereto). Thereafter, the bottom surface of the substrate 121 is polished by a chemical mechanical polishing method until the copper in a part of the deep holes is exposed. The other part of the deep hole is formed as a through hole through which the liquid or fluid can flow after the CMP. Next, a copper seed layer is plated at and around each exposed copper end. Then, copper plating to 10 to 50 microns (but not limited to this creation), forming an electrical connector 123. Thereafter, on the surface of the copper on the substrate 121, platinum electrode layers 120 and 125 are formed (thickness 10 to 50 nm, but this creation is not limited thereto). Thereafter, the piezoelectric material 122 is formed on the substrate 121 by a sol-gel method. Next, an upper electrode 124 is formed on the upper surface of the piezoelectric material 122. Next, an insulating material 126 such as hafnium oxide or tantalum nitride is deposited on both surfaces of the substrate 121. Then, a portion of the insulating material 126 is removed by a yellow light process to expose the via 113 and a portion of the lower electrode 125 and a portion of the upper electrode 124.

Referring to FIG. 6 , the plug module 13 includes at least one plug portion 131 protruding downward, and at least one second through hole 132 . The at least one second through hole 132 corresponds to the first through hole 113 of the upper cover module 11 or the through hole 113 of the corresponding piezoelectric piece module 12 . The second through hole 132 allows the liquid stored in the groove 111 to flow therethrough. The plug module 13 comprises crucible or quartz or glass. In some embodiments, the plug portion 131 comprises hafnium oxide. In some embodiments, the plug portion 131 comprises tantalum nitride.

The manufacturing method of the plug module 13 includes: applying SU-8 thick photoresist (400-500 micrometers, but not limited to this creation) with ruthenium or quartz or glass as a substrate, and then baking. An opening is developed at the second through hole 132 to be formed. Subsequent deep ion etching processes, inductive plasma etching, or Bosch deep reactive ion etching are used to etch deep holes of 50 to 100 microns on the substrate (but this is not limited to this). The photoresist is then removed. SU-8 thick photoresist (400~500 microns, but not limited to this creation) is applied to the back side of the substrate and then baked. Then, the position where the plug portion 131 is to be formed is exposed by the yellow light process. Thereafter, ruthenium dioxide or tantalum nitride is deposited (thickness 250-350 microns, but this creation is not limited to this). The SU-8 thick photoresist is then removed.

Referring to FIG. 7 , the lower cover module 14 includes at least one opening or nozzle 141 , wherein at least one opening 141 is disposed corresponding to at least one plug portion 131 of the plug module 13 . The lower cover module 14 includes a recess 142 for storing a liquid or a gel, and the plug portion 131 is positioned within the recess 142. The upper cover module 11 and the lower cover module 14 are fixed, and when an electric field is applied to the piezoelectric module 12, the piezoelectric material 122 is expanded and deformed, and the plug portion 131 is moved toward the corresponding opening 141. The portion of the liquid or gel located in the recess 142 is pressed to push the array head unit 1. In some embodiments, the area of the plug portion 131 is smaller than the area of the opening 141. To control the magnitude of the voltage applied to the ends of the piezoelectric material, the plug portion 131 will enter the opening 141, but the plug portion 131 does not. Will encounter the opening 141. In some embodiments, the area of the plug portion 131 is larger than the area of the opening 141, so that the magnitude of the voltage applied to both ends of the piezoelectric material is controlled so that the plug portion 131 does not hit the opening 141. In some embodiments, the lower cover module 14 comprises quartz or glass. In some embodiments The thickness of the middle and lower cover modules 14 is between 0.5 and 2 cm (but this is not limited to this creation).

In some embodiments, the method of manufacturing the lower deck module 14 includes using a casting method to make a quartz or glass container having a recess. Then, using lithography, deep ion etching, inductive plasma etching, or Bosch deep reactive ion etching, deep holes of 50 to 100 microns are etched (but not limited to this creation). Thereafter, the material under the deep hole is ground by a chemical mechanical polishing method to make the deep hole become the vertical through hole 141.

In some embodiments, the plug module 13 is assembled into the lower cover module 14 and sealed around to complete the combination of the array head devices 1.

Referring to FIG. 8, the array head device 1a of another embodiment of the present invention is similar to the array head device 1 described above, and mainly the piezoelectric sheet module 12 of the two is different from the piezoelectric sheet module 15.

Referring to FIG. 9, the piezoelectric sheet module 15 includes a quartz substrate 151 and two electrodes 152. The quartz substrate 151 includes at least a first portion 1511, at least a second portion 1512, and at least one through hole 1513. The first portion 1511 is thicker than the second portion 1512. The through hole 1513 is formed in the second portion 1512 and is disposed corresponding to the groove 111 of the upper cover module 11. The first portion 1511 is located between the two electrodes 152. In some embodiments, the electrode 152 covers the first portion 1511. In some embodiments, each electrode 152 extends from the first portion 1511 to the second portion 1512.

Referring to FIG. 8, in some embodiments, the piezoelectric sheet module 15 includes an insulating material 153, wherein the insulating material 153 covers the second portion 1512 and the side edges of the first portion 1511. In some embodiments, the piezoelectric sheet module 15 includes an insulating material 153, wherein the insulating material 153 covers the second portion 1512, the side edge of the first portion 1511, and the edge of the top surface of the first portion 1511, such that the piezoelectric sheet module 15 The upper cover module 11, the plug module 13 or the other piezoelectric module 15 is pressed by the insulating material 153.

The manufacturing method of the piezoelectric sheet module 15 includes: forming a quartz piezoelectric sheet by casting. The second portion 1512 and the vias 1513 are formed using a yellow light process and an etching process (eg, deep ion etching process, inductive plasma etching, or Bosch deep reactive ion etching). Then, on both sides of the thicker first portion 1511, a platinum electrode 152 (thickness 10 to 50 nm) is plated, but this creation is not limited thereto. Thereafter, an insulating material 153 (such as hafnium oxide or tantalum nitride) is vapor-deposited on both sides of the quartz piezoelectric sheet. Finally, a portion of the electrode 152 on both sides of the first portion 1511 is exposed by a yellow light process, and the rest is covered with an insulating material 153.

Referring to Fig. 8, on the upper cover module 11, a plurality of piezoelectric sheet modules 15 are repeatedly pressed by an anodic bonding process. Then, the plug module 13 is pressed against the piezoelectric sheet module 15 on the outermost (or lower) side. Finally, the plug module 13 is assembled into the lower cover module 14, and the combination is sealed to complete the combination of the array head devices 1a.

In at least some embodiments, the array head device uses a plurality of similar piezoelectric sheet modules such that the number of piezoelectric sheet modules can be arbitrarily changed to adjust the amount of liquid or colloid squeezed.

The technical content and technical features of the present disclosure have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the present disclosure is not to be construed as being limited by the scope of

1‧‧‧Array nozzle device

11‧‧‧Upper cover module

11a‧‧‧Quartz or glass cover

11b‧‧‧Base

12‧‧‧ Piezoelectric Module

13‧‧‧ plug module

14‧‧‧Under cover module

111‧‧‧ Groove

112‧‧‧Bumps

113‧‧‧First through hole

141‧‧‧ openings, spouts

Claims (19)

An array head device includes: an upper cover module defining a recess for receiving a liquid; and a plurality of piezoelectric modules, each of the piezoelectric modules comprising: a substrate, including An upper surface, a lower surface, and a first through hole, wherein the first through hole is disposed corresponding to the groove; a piezoelectric material is disposed on the upper surface; and an electrical connection member passes through the base from the lower surface a material to the lower surface of the piezoelectric material; an upper electrode extending at least on the piezoelectric material; and a lower electrode formed on the lower surface and electrically connected to the electrical connector; a plug module a plug portion protruding downwardly and a second through hole corresponding to the first through hole; and a lower cover module comprising an opening, wherein the opening is disposed corresponding to the plug portion; The plurality of piezoelectric module is disposed between the upper cover module and the plug module; the plug module is located between the plurality of piezoelectric modules and the lower cover module . The array head device of claim 1, wherein the upper electrode covers the piezoelectric material. The array head device of claim 1, wherein the piezoelectric material covers the portion of the electrical connector that extends over the upper surface of the substrate. The array type head device according to claim 1, wherein the The substrate comprises tantalum or glass. The array head device of claim 1, wherein the piezoelectric chip module comprises an insulating material, wherein the insulating material covers the upper surface and the lower surface of the substrate, and only the upper electrode is A portion is exposed to a portion of the lower electrode. The array head device of claim 1, wherein the upper electrode or the lower electrode comprises platinum. The array head device of claim 1, wherein the upper cover module comprises a quartz or glass cover, wherein the quartz or glass cover has a thickness of 1 to 2 cm. The array head device of claim 7, wherein the upper cover module comprises a base, the base includes a through hole corresponding to the groove of the upper cover module, wherein the base is fixed to the quartz Or on the glass cover. The array head device according to claim 1, wherein the lower cover module comprises quartz or glass, and the thickness of the lower cover module is 0.5 to 2 cm. The array nozzle device according to claim 1, wherein the plug portion of the plug module is smaller than the opening of the lower cover module. The array nozzle device according to claim 1, wherein the plug portion of the plug module is larger than the opening of the lower cover module. An array head device includes: an upper cover module defining a recess for receiving a liquid; and a plurality of piezoelectric modules, each of the piezoelectric modules comprising: a quartz substrate Containing a first part, a second part, and a first a through hole, wherein the first portion is thicker than the second portion; the first through hole is located in the second portion and corresponds to the groove; and the two electrodes, wherein the first portion is located at the two electrodes a plug module comprising a downwardly projecting plug portion and a second through hole corresponding to the first through hole; and a lower cover module comprising an opening, wherein the opening corresponds to the opening The plug portion is disposed between the upper cover module and the plug module; the plug module is located in the plurality of piezoelectric modules and the lower cover module between. The array head device of claim 12, wherein each of the electrodes extends from the first portion to the second portion. The head device of claim 12, wherein each of the electrodes comprises platinum. The array head device of claim 12, wherein the upper cover module comprises a quartz or glass cover, wherein the quartz cover or glass has a thickness of 1 to 2 cm. The array head device of claim 15, wherein the upper cover module comprises a base, the base includes a through hole corresponding to the groove of the upper cover module, wherein the base is fixed to the quartz Or on the glass cover. The array head device according to claim 12, wherein the lower cover module comprises quartz or glass, and the thickness of the lower cover module is 0.5 to 2 cm. The array type head device according to claim 12, wherein The plug portion of the plug module is smaller than the opening of the lower cover module. The array head device of claim 12, wherein the plug portion of the plug module is larger than the opening of the lower cover module.