TWI550957B - Mobile communication device having an antenna - Google Patents
Mobile communication device having an antenna Download PDFInfo
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- TWI550957B TWI550957B TW104100704A TW104100704A TWI550957B TW I550957 B TWI550957 B TW I550957B TW 104100704 A TW104100704 A TW 104100704A TW 104100704 A TW104100704 A TW 104100704A TW I550957 B TWI550957 B TW I550957B
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Description
本發明係關於一種行動通訊裝置,特別是一種具有電容耦合天線架構之行動通訊裝置。The present invention relates to a mobile communication device, and more particularly to a mobile communication device having a capacitively coupled antenna architecture.
隨著無線通訊技術的快速演進,帶動了無線通訊產業的蓬勃發展,使得行動通訊裝置的輕、薄、短、小以及多頻帶操作的整合成為非常重要的設計目標,因此應用於行動通訊裝置的天線就必須具備小尺寸及多頻帶操作的要求。With the rapid evolution of wireless communication technology, the wireless communication industry has been booming, making the integration of light, thin, short, small and multi-band operation of mobile communication devices a very important design goal, so it is applied to mobile communication devices. Antennas must have small size and multi-band operation requirements.
然而,現有設置在行動通訊裝置(例如:手機)上的天線多為平面倒F(Planar Inverted F Antenna, PIFA)的天線架構,其所能產生的頻寬有限,因此,為滿足較大頻寬的需求,現有的技術須結合可調電路元件(例如:電容)的使用來切換天線低頻或高頻的共振頻率,才能達到理想中的共振頻寬。惟在有限的空間裡,可調電路元件的設置不僅會造成佈設上的困擾,也會增加成本負擔。However, the existing antennas disposed on mobile communication devices (eg, mobile phones) are mostly Planar Inverted F Antenna (PIFA) antenna architectures, which can generate a limited bandwidth, and therefore, to satisfy a large bandwidth. The need for existing technology must be combined with the use of tunable circuit components (eg, capacitors) to switch the resonant frequency of the antenna's low or high frequencies to achieve the desired resonant bandwidth. However, in a limited space, the setting of the tunable circuit components not only causes troubles in layout, but also increases the cost burden.
本發明之主要目的係在提供一種具有電容耦合天線架構之行動通訊裝置。The main object of the present invention is to provide a mobile communication device having a capacitively coupled antenna architecture.
為達成上述之目的,本發明之具有天線之行動通訊裝置包括有殼體、基板、接地面、接地路徑導體及饋入天線單元。殼體包括有金屬背蓋,金屬背蓋包括一輻射部及一非輻射部,該輻射部係與非輻射部電性隔絕。基板設置在殼體內部。接地面位於殼體內部。接地路徑導體之一端連接輻射部,而其另一端連接接地面。饋入天線單元包括有第一輻射件及第二輻射件。第一輻射件設置於基板上,且第一輻射件之一端為天線之饋入點。第二輻射件設置於輻射部與基板之間,第二輻射件連接第一輻射件,且與輻射部相隔一間距。藉此,輻射部藉由電容性耦合由饋入天線單元激發,以使輻射部與饋入天線單元共振產生一最低頻共振模態及一高階共振模態。To achieve the above object, the mobile communication device with an antenna of the present invention includes a housing, a substrate, a ground plane, a ground path conductor, and a feed antenna unit. The housing includes a metal back cover, and the metal back cover includes a radiating portion and a non-radiating portion, and the radiating portion is electrically insulated from the non-radiating portion. The substrate is disposed inside the casing. The ground plane is inside the housing. One end of the ground path conductor is connected to the radiating portion, and the other end is connected to the ground plane. The feeding antenna unit includes a first radiating element and a second radiating element. The first radiating member is disposed on the substrate, and one end of the first radiating member is a feeding point of the antenna. The second radiating member is disposed between the radiating portion and the substrate, and the second radiating member is coupled to the first radiating member and spaced apart from the radiating portion by a distance. Thereby, the radiating portion is excited by the feeding antenna unit by capacitive coupling, so that the radiating portion resonates with the feeding antenna unit to generate a lowest frequency resonant mode and a higher order resonant mode.
根據本發明之一實施例,本發明之行動通訊裝置更包括有分隔塊。分隔塊設置於第二輻射件與輻射部之間,以供第二輻射件附著設置。According to an embodiment of the present invention, the mobile communication device of the present invention further includes a partition block. The partitioning block is disposed between the second radiating member and the radiating portion for the second radiating member to be attached.
根據本發明之一實施例,本發明之行動通訊裝置更包括有導電開關,導電開關之一端連接接地面,而其另一端連接接地路徑導體。According to an embodiment of the invention, the mobile communication device of the present invention further includes a conductive switch, one end of the conductive switch is connected to the ground plane, and the other end is connected to the ground path conductor.
根據本發明之一實施例,本發明之行動通訊裝置更包括有一輻射導體,輻射導體設置於基板上,且輻射導體之一端連接接地面;輻射導體由饋入天線單元電容耦合激發,產生一共振模態。According to an embodiment of the present invention, the mobile communication device of the present invention further includes a radiation conductor, the radiation conductor is disposed on the substrate, and one end of the radiation conductor is connected to the ground plane; the radiation conductor is excited by the capacitive coupling of the feeding antenna unit to generate a resonance Modal.
根據本發明之一實施例,所述最低頻共振模態之頻寬涵蓋704~960 MHz,而高階共振模態及該共振模態合成之頻寬涵蓋1575~2700 MHz。According to an embodiment of the invention, the bandwidth of the lowest frequency resonant mode covers 704~960 MHz, and the high-order resonant mode and the resonant mode composite bandwidth cover 1575~2700 MHz.
根據本發明之一實施例,所述間距距離實質上為2毫米。According to an embodiment of the invention, the spacing distance is substantially 2 mm.
根據本發明之一實施例,所述金屬背蓋之厚度約為1毫米。According to an embodiment of the invention, the metal back cover has a thickness of about 1 mm.
根據本發明之一實施例,所述接地面為行動通訊裝置之系統接地面。According to an embodiment of the invention, the ground plane is a system ground plane of the mobile communication device.
為能讓 貴審查委員能更瞭解本發明之技術內容,特舉較佳具體實施例說明如下。In order to enable the reviewing committee to better understand the technical contents of the present invention, the preferred embodiments are described below.
請先一併參考圖1至圖4。其中圖1係本發明之行動通訊裝置之局部爆炸圖;圖2係本發明行動通訊裝置之殼體之金屬背蓋內側表面之俯視圖;圖3係本發明行動通訊裝置之殼體之前蓋內側表面之俯視圖;圖4係本發明之行動通訊裝置之側面剖視圖。Please refer to Figure 1 to Figure 4 together. 1 is a partial exploded view of the mobile communication device of the present invention; FIG. 2 is a plan view of the inner surface of the metal back cover of the housing of the mobile communication device of the present invention; FIG. 3 is a front cover inner surface of the housing of the mobile communication device of the present invention; 4 is a side cross-sectional view of the mobile communication device of the present invention.
如圖1所示,在本發明之一實施例中,本發明具有天線之行動通訊裝置1包括有殼體10、基板20、接地面30、接地路徑導體40、饋入天線單元50、分隔塊60、輻射導體70、通用序列匯流排連接埠U、音頻插座AJ及揚聲器SP。在本發明之具體實施例中,行動通訊裝置1為智慧型手機,但本發明不以此為限,行動通訊裝置1也可為平板電腦或其他具有通訊功能之電子產品。As shown in FIG. 1, in an embodiment of the present invention, a mobile communication device 1 having an antenna includes a housing 10, a substrate 20, a ground plane 30, a ground path conductor 40, a feeding antenna unit 50, and a partition block. 60. Radiation conductor 70, universal serial bus bar connection 埠U, audio socket AJ and speaker SP. In the specific embodiment of the present invention, the mobile communication device 1 is a smart phone, but the invention is not limited thereto, and the mobile communication device 1 can also be a tablet computer or other electronic products with communication functions.
如圖1所示,在本發明之一實施例中,殼體10包括有前蓋11以及可與前蓋11可拆卸地相結合的金屬背蓋12,其中如圖2所示,金屬背蓋12包括有輻射部121及非輻射部122,輻射部121所在位置靠近金屬背蓋12之下側,且輻射部121與非輻射部122電性隔絕,亦即輻射部121與非輻射部122,彼此間並不電性連接。電性隔絕在具體實現上,可藉由在輻射部121與非輻射部122間設置一道塑膠間隙90(約2毫米寬),以隔絕兩邊之電性。在本發明之具體實施例中,金屬背蓋12之厚度約為1毫米(如圖4所示),但本發明不以此為限。As shown in FIG. 1, in an embodiment of the present invention, the housing 10 includes a front cover 11 and a metal back cover 12 detachably coupled to the front cover 11, wherein the metal back cover is as shown in FIG. 12 includes a radiation portion 121 and a non-radiation portion 122. The radiation portion 121 is located near the lower side of the metal back cover 12, and the radiation portion 121 is electrically isolated from the non-radiation portion 122, that is, the radiation portion 121 and the non-radiation portion 122. They are not electrically connected to each other. Electrical isolation can be achieved by providing a plastic gap 90 (about 2 mm wide) between the radiation portion 121 and the non-radiation portion 122 to isolate the electrical properties of both sides. In a specific embodiment of the invention, the metal back cover 12 has a thickness of about 1 mm (as shown in FIG. 4), but the invention is not limited thereto.
如圖3所示,在本發明之一實施例中,基板20設置在殼體10之內部,且位於前蓋11之內側表面上,並且其所在位置係與金屬背蓋12之輻射部121上下相對應。As shown in FIG. 3, in an embodiment of the present invention, the substrate 20 is disposed inside the casing 10 and located on the inner side surface of the front cover 11, and is located at a position opposite to the radiation portion 121 of the metal back cover 12. Corresponding.
在本發明之一實施例中,接地面30位於殼體10之內部,且設置在前蓋11上。接地面30包括有主板部31及延伸部32,其中延伸部32係由主板部31之一側朝前蓋11之一側邊方向延伸形成,其所在位置係與金屬背蓋12之輻射部121上下相對應,該接地面30為行動通訊裝置1之系統接地面。In an embodiment of the invention, the ground plane 30 is located inside the housing 10 and is disposed on the front cover 11. The grounding surface 30 includes a main plate portion 31 and an extending portion 32. The extending portion 32 is formed by one side of the main plate portion 31 extending toward a side of the front cover 11 and is located at a position of the radiating portion 121 of the metal back cover 12. Corresponding to the upper and lower sides, the ground plane 30 is the system ground plane of the mobile communication device 1.
如圖1、圖2、圖3及圖4所示,在本發明之一實施例中,接地路徑導體40包括有第一連接件41、第二連接件42及金屬件43。第一連接件41貼附連接在金屬背蓋12之輻射部121上。第二連接件42設置於基板20上,並且當前蓋11與金屬背蓋12相結合時,第二連接件42會與第一連接件41接觸。金屬件43佈設在基板20上,且為延長共振之路徑(亦即加長圖3所示路徑F-E距離),可視實際需求,使金屬件43經多次的彎折形成,但不以此為限;金屬件43之一端連接第二連接件42,而其另一端則連接接地面30,也就是說,金屬件43之一端為接地。在本發明之具體實施例中,第一連接件41及第二連接件為金屬彈片,但本發明不以此為限。As shown in FIG. 1, FIG. 2, FIG. 3 and FIG. 4, in one embodiment of the present invention, the ground path conductor 40 includes a first connecting member 41, a second connecting member 42, and a metal member 43. The first connecting member 41 is attached to the radiation portion 121 of the metal back cover 12. The second connecting member 42 is disposed on the substrate 20, and when the front cover 11 is combined with the metal back cover 12, the second connecting member 42 is in contact with the first connecting member 41. The metal member 43 is disposed on the substrate 20, and is a path for prolonging the resonance (that is, lengthening the path FE distance shown in FIG. 3), and the metal member 43 is formed by bending a plurality of times according to actual needs, but not limited thereto. One end of the metal member 43 is connected to the second connecting member 42, and the other end thereof is connected to the grounding surface 30, that is, one end of the metal member 43 is grounded. In a specific embodiment of the present invention, the first connecting member 41 and the second connecting member are metal elastic pieces, but the invention is not limited thereto.
在本發明之一實施例中,饋入天線單元50包括有第一輻射件51以及第二輻射件52。第一輻射件51設置於基板20上,且其包含有第三連接件511及第一輻射件本體512,其中為增加共振路徑(亦即增加圖3所示路徑B-C),第一輻射件本體512之一端經過一次彎折後開路,而另一端則連接第三連接件511,該第三連接件511為天線之饋入點FP。第二輻射件52設置於輻射部121與基板20之間,且其包含有第四連接件521以及第二輻射件本體522,其中為延長共振路徑(亦即延長圖2所示路徑Q-R及路徑P-O-S),第二輻射件本體522之兩端寬度大於中間部分。第四連接件521連接第二輻射件本體522,且當前蓋11與金屬背蓋12相結合時,第四連接件521與第三連接件511接觸,以使第二輻射件52連接第一輻射件51,並與金屬背蓋12之輻射部121間相隔一間距,其中在具體實施例中,該間距距離為2毫米(如圖4所示),但本發明並不以此為限。在本發明之具體實施例中,第三連接件511及第四連接件521亦為金屬彈片,但本發明不以此為限。In an embodiment of the invention, the feed antenna unit 50 includes a first radiating element 51 and a second radiating element 52. The first radiating member 51 is disposed on the substrate 20 and includes a third connecting member 511 and a first radiating member body 512. The first radiating member body is added to increase the resonant path (that is, increase the path BC shown in FIG. 3). One end of the 512 is opened after being bent once, and the other end is connected to the third connecting member 511, which is the feeding point FP of the antenna. The second radiating element 52 is disposed between the radiating portion 121 and the substrate 20, and includes a fourth connecting member 521 and a second radiating member body 522, wherein the resonant path is extended (that is, the path QR and path shown in FIG. 2 are extended). POS), the width of both ends of the second radiator member 522 is larger than the intermediate portion. The fourth connecting member 521 is connected to the second radiating member body 522, and when the front cover 11 is combined with the metal back cover 12, the fourth connecting member 521 is in contact with the third connecting member 511 to connect the second radiating member 52 to the first radiation. The member 51 is spaced apart from the radiating portion 121 of the metal back cover 12 by a distance of 2 mm (as shown in FIG. 4), but the invention is not limited thereto. In the embodiment of the present invention, the third connecting member 511 and the fourth connecting member 521 are also metal elastic pieces, but the invention is not limited thereto.
如圖1所示,在本發明之一實施例中,分隔塊60設置於第二輻射件52之第二輻射件本體522與金屬背蓋12之輻射部121之間,分隔塊60係由非導電材質之材料製成。分隔塊60貼附在金屬背蓋12之輻射部121的內側表面,以提供第二輻射件52附著設置。由於在本實施例中,第二輻射件52與輻射部121間之間距距離約為2毫米,故分隔塊60厚度約略等於2毫米。As shown in FIG. 1, in one embodiment of the present invention, the partitioning block 60 is disposed between the second radiating member body 522 of the second radiating member 52 and the radiating portion 121 of the metal back cover 12, and the partitioning block 60 is Made of conductive material. A partitioning block 60 is attached to the inner side surface of the radiating portion 121 of the metal back cover 12 to provide a second radiating member 52 attachment setting. Since in the present embodiment, the distance between the second radiating member 52 and the radiating portion 121 is about 2 mm, the thickness of the partitioning block 60 is approximately equal to 2 mm.
在本發明之一實施例中,輻射導體70設置於基板20上,且輻射導體70之一端連接接地面30之延伸部32(亦即一端接地),而另一端則為開路。In one embodiment of the invention, the radiating conductor 70 is disposed on the substrate 20, and one end of the radiating conductor 70 is coupled to the extension 32 of the ground plane 30 (i.e., one end is grounded) and the other end is an open circuit.
在本發明之一實施例中,通用序列匯流排連接埠U設置在接地面30之延伸部32上。音頻插座AJ亦設置在該延伸部32上,並與通用序列匯流排連接埠U併排相鄰。揚聲器SP設置在基板20上,且其至少一側連接接地面30而接地。In one embodiment of the invention, the universal serial bus bar connection U is disposed on the extension 32 of the ground plane 30. The audio jack AJ is also disposed on the extension 32 and adjacent to the universal serial bus bar 埠U. The speaker SP is disposed on the substrate 20, and at least one side thereof is connected to the ground plane 30 to be grounded.
接著請一併參考圖2至圖5,其中圖5係本發明之行動通訊裝置具有之天線所產生的電壓駐波比(VSWR)量測結果圖。Next, please refer to FIG. 2 to FIG. 5 together, wherein FIG. 5 is a graph showing the voltage standing wave ratio (VSWR) measurement result generated by the antenna of the mobile communication device of the present invention.
如圖2、圖3所示,其分別表示金屬背蓋12及前蓋11兩相對應之內側表面之俯視圖。當金屬背蓋12與前蓋11相互結合後(即將圖2所示的金屬背蓋12翻面後,覆蓋在圖3所示的前蓋11上),圖3所示之B點會與圖2所示的P點相接觸(兩點分別為第三連接件511及第四連接件521設置位置),亦即第一輻射件51會連接第二輻射件52而形成一幅射單元,此一幅射單元的一端為天線的饋入點FP。另一方面,當金屬背蓋12與前蓋11相互結合後,第一連接件41會與第二連接件42接觸(在本實施例中,即G點會與N點相接觸,而F點會與M點相接觸),亦即金屬背蓋12之輻射部121會連接接地路徑導體40而形成另一幅射單元,此另一幅射單元的一端接地。由於第二輻射件52與金屬背蓋12之輻射部121間相隔一定距離以內的間距(又可稱為耦合間距),因此,由金屬背蓋12之輻射部121及接地路徑導體40所構成的輻射單元,即可藉由電容性耦合由饋入天線單元50形成的另一輻射單元激發,產生出一最低頻共振模態及一高階共振模態,同時由於輻射導體70亦與第二輻射件52相隔一定距離以內的間距,因此輻射導體70也會由饋入天線單元50電容耦合激發,產生出一共振模態,以增加天線之高階共振模態之操作頻寬。As shown in FIG. 2 and FIG. 3, it shows a plan view of the inner side surfaces of the metal back cover 12 and the front cover 11, respectively. After the metal back cover 12 and the front cover 11 are coupled to each other (i.e., after the metal back cover 12 shown in FIG. 2 is turned over, covering the front cover 11 shown in FIG. 3), the point B shown in FIG. The P point shown in FIG. 2 is in contact with each other (the two points are the positions of the third connecting member 511 and the fourth connecting member 521 respectively), that is, the first radiating member 51 is connected to the second radiating member 52 to form a radiation unit. One end of a radiation unit is the feed point FP of the antenna. On the other hand, when the metal back cover 12 and the front cover 11 are coupled to each other, the first connecting member 41 will be in contact with the second connecting member 42 (in this embodiment, the G point will be in contact with the N point, and the point F) The radiation portion 121 of the metal back cover 12 is connected to the ground path conductor 40 to form another radiation unit, and one end of the other radiation unit is grounded. Since the second radiating element 52 is spaced apart from the radiating portion 121 of the metal back cover 12 by a distance (also referred to as a coupling pitch), the radiating portion 121 of the metal back cover 12 and the ground path conductor 40 are formed. The radiating element, that is, excited by another radiating element formed by the feeding antenna unit 50, generates a lowest frequency resonant mode and a higher order resonant mode, and at the same time, the radiating conductor 70 and the second radiating element 52 is spaced apart by a certain distance, so the radiation conductor 70 is also excited by the capacitive coupling of the feeding antenna unit 50 to generate a resonant mode to increase the operating bandwidth of the high-order resonant mode of the antenna.
在本實施例中,藉由輻射部121、金屬件43、第一輻射件51及第二輻射件52適當長度、寬度的搭配設計,並適當配置通用序列匯流排連接埠U、音頻插座AJ及揚聲器SP與該些元件之位置,例如以圖2及圖3所示為例,輻射部121及接地路徑導體40便有效地能與饋入天線單元50共振出頻寬涵蓋704~960 MHz之最低頻共振模態(圖5為本例電壓駐波比(VSWR)量測結果圖,其中操作頻帶1為最低頻共振模態),同時透過適當長度及寬度的輻射導體70與饋入天線單元50間的電容耦合激發,將可使高階共振模態加上由輻射導體70與饋入天線單元50所產生的共振模態之涵蓋頻寬大約達1575~2700 MHz(包含圖5所示操作頻帶2、3、4及5),所涵蓋應用頻帶包含有LTE700/EGSM900/DCS1800/PCS1900/UMTS2100/LTE2500。In this embodiment, the radiation portion 121, the metal member 43, the first radiation member 51, and the second radiation member 52 are appropriately designed in length and width, and the universal serial bus bar connection 埠U and the audio socket AJ are appropriately disposed. The position of the speaker SP and the components, for example, as shown in FIG. 2 and FIG. 3, the radiation portion 121 and the ground path conductor 40 can effectively resonate with the feed antenna unit 50 to cover a minimum bandwidth of 704 to 960 MHz. The frequency resonance mode (Fig. 5 is a voltage standing wave ratio (VSWR) measurement result diagram in which the operation frequency band 1 is the lowest frequency resonance mode), and simultaneously transmits the radiation conductor 70 and the feeding antenna unit 50 of an appropriate length and width. The capacitive coupling excitation will cause the high-order resonant mode to be added to the resonant mode generated by the radiating conductor 70 and the feeding antenna unit 50 to cover a bandwidth of about 1575 to 2700 MHz (including the operating band 2 shown in FIG. 5). , 3, 4 and 5), the application frequency bands covered include LTE700/EGSM900/DCS1800/PCS1900/UMTS2100/LTE2500.
進一步詳言之,饋入天線單元50之路徑A-B-O-P-Q-R與輻射部121及接地路徑導體40之路徑D-E-F-G-M-N,可使饋入天線單元50與輻射部121耦合共振出操作頻帶1之共振頻率(704~960 MHz)及操作頻帶3的共振頻率(操作頻帶1之共振頻率的二倍頻,約1710~1950MHz)。饋入天線單元50之路徑O-P-S之延伸,則可使饋入天線單元50與輻射部121共振出操作頻帶2的共振頻率,因而使產生的頻率可以涵蓋到1575MHz。輻射導體70(即路徑I-J)與輻射部121及接地路徑導體40所形成的輻射單元會耦合共振出操作頻帶4的共振頻率(約1950~2170MHz),同時透過調整輻射導體70與揚聲器SP間的寬度和長度,可使操作頻帶4之共振頻率涵蓋到1900MHz;此外,另可藉由調整揚聲器SP之一側與接地面30之延伸部32間之距離g,以增加輻射導體70之共振路徑。饋入天線單元50所延伸的路徑B-C,可使第一饋入天線單元50與輻射部121共振出操作頻帶5的共振頻率(2500~2700MHz)。Further, in detail, the path ABOPQR fed to the antenna unit 50 and the path DEFGMN of the radiating portion 121 and the ground path conductor 40 can cause the feeding antenna unit 50 and the radiating portion 121 to be coupled to resonate to the resonant frequency of the operating band 1 (704 to 960). MHz) and the resonant frequency of operating band 3 (double the frequency of the resonant frequency of operating band 1, approximately 1710 to 1950 MHz). The extension of the path O-P-S fed into the antenna unit 50 allows the feed antenna unit 50 and the radiating portion 121 to resonate out of the resonant frequency of the operating band 2, thus allowing the generated frequency to cover 1575 MHz. The radiating element formed by the radiating conductor 70 (ie, the path IJ) and the radiating portion 121 and the grounding path conductor 40 is coupled to resonate with the resonant frequency of the operating band 4 (about 1950 to 2170 MHz) while adjusting the relationship between the radiating conductor 70 and the speaker SP. The width and length allow the resonant frequency of the operating band 4 to be covered to 1900 MHz; in addition, the resonant path of the radiating conductor 70 can be increased by adjusting the distance g between one side of the speaker SP and the extension 32 of the ground plane 30. Feeding the path B-C extended by the antenna unit 50 allows the first feed antenna unit 50 and the radiating portion 121 to resonate with the resonant frequency (2500 to 2700 MHz) of the operating band 5.
此外,如圖3所示,在本發明另一實施例中,更可在行動通訊裝置1增設一導電開關80,導電開關80可為二極體或繼電器,導電開關80之一端連接地面30,而其另一端連接接地路徑導體40之第二連接件42。當導電開關80不導通時,共振路徑較長,可產生LTE700應用頻帶的頻寬(約700~800 MHz);當導電開關80導通時,路徑提早入地,共振路徑縮短,原LTE700應用頻帶的頻寬會被調整到GSM850和EGSM900應用頻帶的頻寬(850~900 MHz)。換句話說,導電開關80在此可用以調整低頻共振路徑之長短,進而調整所需要的頻寬範圍。In addition, as shown in FIG. 3, in another embodiment of the present invention, a conductive switch 80 may be further added to the mobile communication device 1. The conductive switch 80 may be a diode or a relay, and one end of the conductive switch 80 is connected to the ground 30. The other end is connected to the second connecting member 42 of the grounding path conductor 40. When the conductive switch 80 is not turned on, the resonant path is long, and the bandwidth of the LTE 700 application band (about 700 to 800 MHz) can be generated. When the conductive switch 80 is turned on, the path is advanced to the ground, and the resonant path is shortened. The original LTE 700 application band is used. The bandwidth is adjusted to the bandwidth of the GSM850 and EGSM900 application bands (850~900 MHz). In other words, the conductive switch 80 can be used here to adjust the length of the low frequency resonant path to adjust the desired bandwidth range.
經由以上說明可知,本發明具有天線之行動通訊裝置1可利用其金屬背蓋12之部分區域作為天線之輻射單元的一部分,同時由於本發明採取的是耦合共振的天線型態,因此較諸於PIFA天線架構,所能產生的低頻頻寬較大,且大幅縮減輻射單元設置於裝置內所需的空間,可使機身更為輕薄。As can be seen from the above description, the mobile communication device 1 having the antenna of the present invention can utilize a part of the metal back cover 12 as a part of the radiating unit of the antenna, and since the present invention adopts an antenna type that couples resonance, it is compared with The PIFA antenna architecture can generate a low frequency bandwidth and greatly reduce the space required for the radiating element to be placed in the device, which makes the body thinner and lighter.
綜上所陳,本發明無論就目的、手段及功效,在在均顯示其迥異於習知技術之特徵,懇請 貴審查委員明察,早日賜准專利,俾嘉惠社會,實感德便。惟應注意的是,上述諸多實施例僅係為了便於說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。To sum up, the present invention, regardless of its purpose, means and efficacy, shows its distinctive features of the prior art. You are requested to review the examination and express the patent as soon as possible. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the invention is intended to be limited by the scope of the claims.
1‧‧‧行動通訊裝置
10‧‧‧殼體
11‧‧‧前蓋
12‧‧‧金屬背蓋
121‧‧‧輻射部
122‧‧‧非輻射部
20‧‧‧基板
30‧‧‧接地面
31‧‧‧主板部
32‧‧‧延伸部
40‧‧‧接地路徑導體
41‧‧‧第一連接件
42‧‧‧第二連接件
43‧‧‧金屬件
50‧‧‧饋入天線單元
51‧‧‧第一輻射件
511‧‧‧第三連接件
512‧‧‧第一輻射件本體
FP‧‧‧饋入點
52‧‧‧第二輻射件
521‧‧‧第四連接件
522‧‧‧第二輻射件本體
60‧‧‧分隔塊
70‧‧‧輻射導體
80‧‧‧導電開關
90‧‧‧間隙
U‧‧‧通用序列匯流排連接埠
AJ‧‧‧音頻插座
SP‧‧‧揚聲器1‧‧‧Mobile communication device
10‧‧‧shell
11‧‧‧ front cover
12‧‧‧Metal back cover
121‧‧‧ Radiation Department
122‧‧‧Non-radiation department
20‧‧‧Substrate
30‧‧‧ Ground plane
31‧‧‧ Main Board
32‧‧‧Extension
40‧‧‧ Grounding path conductor
41‧‧‧First connector
42‧‧‧Second connector
43‧‧‧Metal parts
50‧‧‧Feed into the antenna unit
51‧‧‧First Radiation
511‧‧‧ Third connector
512‧‧‧First Radiation Body
FP‧‧‧Feeding point
52‧‧‧Second Radiation
521‧‧‧fourth connector
522‧‧‧Second Radiation Body
60‧‧‧Separate block
70‧‧‧radiation conductor
80‧‧‧conductive switch
90‧‧‧ gap
U‧‧‧Universal Sequence Bus Connections埠
AJ‧‧‧Audio socket
SP‧‧‧Speaker
圖1係本發明之行動通訊裝置之局部爆炸圖。 圖2係本發明行動通訊裝置之殼體之金屬背蓋內側表面之俯視圖。 圖3係本發明行動通訊裝置之殼體之前蓋內側表面之俯視圖。 圖4係本發明之行動通訊裝置之側面剖視圖。 圖5係本發明之行動通訊裝置具有之天線所產生的電壓駐波比(VSWR)量測結果圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partial exploded view of the mobile communication device of the present invention. 2 is a top plan view of the inner side surface of the metal back cover of the housing of the mobile communication device of the present invention. Figure 3 is a top plan view of the inside surface of the front cover of the housing of the mobile communication device of the present invention. Figure 4 is a side cross-sectional view of the mobile communication device of the present invention. Fig. 5 is a graph showing the results of voltage standing wave ratio (VSWR) measurement by an antenna provided in the mobile communication device of the present invention.
1‧‧‧行動通訊裝置 1‧‧‧Mobile communication device
10‧‧‧殼體 10‧‧‧shell
11‧‧‧前蓋 11‧‧‧ front cover
12‧‧‧金屬背蓋 12‧‧‧Metal back cover
20‧‧‧基板 20‧‧‧Substrate
30‧‧‧接地面 30‧‧‧ Ground plane
31‧‧‧主板部 31‧‧‧ Main Board
32‧‧‧延伸部 32‧‧‧Extension
40‧‧‧接地路徑導體 40‧‧‧ Grounding path conductor
41‧‧‧第一連接件 41‧‧‧First connector
42‧‧‧第二連接件 42‧‧‧Second connector
43‧‧‧金屬件 43‧‧‧Metal parts
50‧‧‧饋入天線單元 50‧‧‧Feed into the antenna unit
51‧‧‧第一輻射件 51‧‧‧First Radiation
511‧‧‧第三連接件 511‧‧‧ Third connector
512‧‧‧第一輻射件本體 512‧‧‧First Radiation Body
FP‧‧‧饋入點 FP‧‧‧Feeding point
52‧‧‧第二輻射件 52‧‧‧Second Radiation
521‧‧‧第四連接件 521‧‧‧fourth connector
522‧‧‧第二輻射件本體 522‧‧‧Second Radiation Body
60‧‧‧分隔塊 60‧‧‧Separate block
70‧‧‧輻射導體 70‧‧‧radiation conductor
U‧‧‧通用序列匯流排連接埠 U‧‧‧Universal Sequence Bus Connections埠
AJ‧‧‧音頻插座 AJ‧‧‧Audio socket
SP‧‧‧揚聲器 SP‧‧‧Speaker
Claims (7)
Priority Applications (1)
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TW104100704A TWI550957B (en) | 2015-01-09 | 2015-01-09 | Mobile communication device having an antenna |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW104100704A TWI550957B (en) | 2015-01-09 | 2015-01-09 | Mobile communication device having an antenna |
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TW201626637A TW201626637A (en) | 2016-07-16 |
TWI550957B true TWI550957B (en) | 2016-09-21 |
Family
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108281754A (en) * | 2017-01-05 | 2018-07-13 | 和硕联合科技股份有限公司 | Multi-antenna device |
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CN103178344A (en) * | 2013-04-01 | 2013-06-26 | 昆山睿翔讯通通信技术有限公司 | Multi-frequency-band rear metal cover mobile phone antenna |
US20130214986A1 (en) * | 2012-02-22 | 2013-08-22 | Jiang Zhu | Antenna with folded monopole and loop modes |
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US20130214986A1 (en) * | 2012-02-22 | 2013-08-22 | Jiang Zhu | Antenna with folded monopole and loop modes |
CN103178344A (en) * | 2013-04-01 | 2013-06-26 | 昆山睿翔讯通通信技术有限公司 | Multi-frequency-band rear metal cover mobile phone antenna |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108281754A (en) * | 2017-01-05 | 2018-07-13 | 和硕联合科技股份有限公司 | Multi-antenna device |
US10090581B2 (en) | 2017-01-05 | 2018-10-02 | Pegatron Corporation | Multiple antenna apparatus |
CN108281754B (en) * | 2017-01-05 | 2020-01-10 | 和硕联合科技股份有限公司 | Multi-antenna device |
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