TWI548882B - Integrated circuit vertical probe card - Google Patents

Description

Integrated circuit vertical probe card

The present disclosure relates to an integrated circuit vertical probe card.

After the fabrication of the integrated circuit on the wafer, it will be tested in order to remove the Bad Die before packaging to avoid the bad die entering the package, resulting in unnecessary cost increase.

Generally, the wafer to be tested is in a high temperature environment of 80 to 150 ° C, and a 12-inch wafer (thermal expansion coefficient (CTE) of 2.8 ppm/K) is taken as an example. From the center of the wafer to the outermost edge, there are 23~ The amount of lateral expansion of 44 (μm), and the needle card made of FR-4 material (CTE 18ppm / K) as the substrate, there will be a lateral expansion of 150 ~ 283 (μm). This temperature effect can seriously affect the alignment accuracy of the probe card probe and the aluminum pad (Al pad) to be tested.

In addition, the probes of the existing card test cards, using a hard metal material, are liable to scratch the pads to be tested (Pads) or the metal layer under the bumps.

In view of the above problems, the patent embodiments of the present invention respectively disclose a new vertical probe card.

The integrated circuit probe card of an integrated circuit according to an embodiment of the invention comprises: a first flexible glass piece, a plurality of first vertical through holes, a plurality of first conductive polymer contacts, a second flexible glass piece, and a plurality of second vertical a via hole, a plurality of second conductive polymer contacts, at least one third flexible glass piece, a plurality of wires, and a plurality of third vertical via holes. A plurality of first vertical via holes are formed on the first flexible glass sheet. The plurality of first conductive polymer contacts are disposed on the first flexible glass sheet. The plurality of first conductive polymer contacts are electrically connected to the first vertical via holes. A plurality of second vertical via holes are formed on the second soft glass. A plurality of second conductive polymer contacts are formed on the second flexible glass sheet. a plurality of second vertical via holes corresponding to the second electrical connection Vertical vias. The first conductive polymer contacts are different from the second conductive polymer contacts. At least one third flexible glass piece is disposed between the first soft glass piece and the second soft glass piece. The third soft glass piece is directly bonded to the first soft glass piece and to the second soft glass piece. The plurality of wires and the plurality of third vertical via holes are formed on the third flexible glass sheet. The plurality of wires and the plurality of third vertical via holes electrically connect the first conductive polymer contacts to the corresponding second conductive polymer contacts.

1‧‧‧Integrated circuit vertical probe card

11‧‧‧First soft glass

12‧‧‧ Third soft glass

13‧‧‧Second soft glass

14‧‧‧First vertical via

15‧‧‧First conductive polymer joint

16‧‧‧Second vertical via

17‧‧‧Second conductive polymer joint

18‧‧‧ Third vertical via

19‧‧‧Wire

21‧‧‧ pads

22‧‧‧ pads

23‧‧‧ pads

24‧‧‧ pads

25‧‧‧ pads

30‧‧‧Opening

1 is a top plan view of an integrated circuit probe card of an integrated circuit according to an embodiment of the invention.

Figure 2 is a cross-sectional view taken along line 1000-1000 of Figure 1.

Referring to FIG. 1 and FIG. 2, the integrated circuit probe card 1 of at least one embodiment includes: a first flexible glass sheet 11, a plurality of first vertical conductive vias 14, and a plurality of first conductive highs. a molecular contact 15, a second flexible glass sheet 13, a plurality of second vertical vias 16, a plurality of second conductive polymer contacts 17, at least a third flexible glass sheet 12, a plurality of third vertical vias 18, and a plurality Wire 19.

A plurality of first conductive polymer contacts 15 are formed on the first flexible glass sheet 11. The plurality of first vertical via holes 14 are disposed on the first flexible glass sheet 11 corresponding to the plurality of first conductive polymer contacts 15 . Each of the first vertical via holes 14 is electrically connected to the corresponding first conductive polymer contact 15 . In some embodiments, the integrated circuit vertical probe card 1 includes a plurality of pads 21. The plurality of pads 21 correspond to a plurality of first conductive polymer contacts 15. Each of the first vertical via holes 14 is electrically connected to the corresponding pad 21 , and each of the first conductive polymer contacts 15 is disposed on the corresponding pad 21 .

The plurality of second conductive polymer contacts 17 are disposed on the second flexible glass sheet 13. The plurality of second vertical vias 16 correspond to the plurality of second conductive polymer contacts 17. Each of the second vertical via holes 16 is electrically connected to the corresponding second conductive polymer contact 17 . In some embodiments, the integrated circuit vertical probe card 1 includes a plurality of pads 22. The plurality of pads 22 correspond to a plurality of second conductive polymer contacts 17. Each of the second vertical vias 16 is electrically connected to the corresponding pad 22, and each second The conductive polymer contacts 17 are disposed on the corresponding pads 22.

The plurality of first conductive polymer contacts 15 and the plurality of second conductive polymer contacts 17 are arranged differently. The plurality of first conductive polymer contacts 15 and the plurality of second conductive polymer contacts 17 are electrically connected to the test machine and the wafer or wafer to be tested. The plurality of first conductive polymer contacts 15 are disposed in conjunction with the test machine, and the plurality of second conductive polymer contacts 17 are disposed in conjunction with the wafer to be tested or the device pads to be tested on the wafer. The plurality of first conductive polymer contacts 15 and the plurality of second conductive polymer contacts 17 are relatively elastic, so that the pads on the device to be tested or the metal layer under the bumps are not easily damaged during the test.

The third flexible glass piece 12 is disposed between the first soft glass piece 11 and the second soft glass piece 13. The third flexible glass sheet 12 is directly bonded to the first soft glass sheet 11, and the second soft glass sheet 13. In some embodiments, the first flexible glass sheet 11 and the third flexible glass sheet 12 are bonded by Anode Bonding. The second flexible glass sheet 13 and the third soft glass sheet 12 are bonded by an anodic bonding method.

The plurality of third vertical vias 18 and the plurality of wires 19 are electrically connected to the corresponding second conductive polymer contacts 17 . A plurality of third vertical via holes 18 are formed in the third flexible glass sheet 12. The plurality of wires 19 are formed on the third flexible glass sheet 12 and electrically connected to the corresponding third vertical via holes 18 and the second vertical via holes 16.

Referring to FIG. 2, in some embodiments, the second vertical vias 16 are bonded to the pads or wires 19 on the corresponding third flexible glass sheet 12 through the pads 23. The third vertical via 18 connects the pads or wires 19 on one side of the third flexible glass sheet 12 and the corresponding pads 24 on the other side. The pad 24 is bonded to the pad 25 on the first flexible glass sheet 11.

In some embodiments, the thickness of the first soft glass sheet 11, the second soft glass sheet 13, or the third soft glass sheet 12 is between 50 micrometers and 200 micrometers. In some embodiments, the first flexible glass sheet 11, the second soft glass sheet 13, or the third soft glass sheet 12 comprises an alkali metal-free borosilicate glass. In some embodiments, the surface roughness of at least one bonding surface of the first flexible glass sheet 11, the second flexible glass sheet 13, or the third soft glass sheet 12 is about 0.3 nm (but the invention does not Limited). In some embodiments, the surface height of the at least one bonding surface of the first flexible glass sheet 11, the second flexible glass sheet 13, or the third soft glass sheet 12 has a maximum error of about 0.4 nm (but the invention does not This is limited to). In some embodiments, the first flexible glass sheet 11, the second flexible glass sheet 13, or the third flexible glass sheet 12 has a coefficient of thermal expansion of about 2.8 ppm/K. In some embodiments, the first flexible glass sheet 11, the second flexible glass sheet 13, the third, or soft glass sheet 12, may be Willow ^TM glass of Corning.

In some embodiments, the first vertical via 14, the second vertical via 16, or the third vertical via 18 comprises copper. In some embodiments, the first vertical vias 14, the second vertical vias 16, or the third vertical vias 18 comprise electroplated copper. In some embodiments, in the first flexible glass sheet 11, the second soft glass sheet 13, or the third soft glass sheet 12, the opening 30 is formed by laser, and then copper is electroplated into the through hole to form a first vertical. The via hole 14 , the second vertical via hole 16 , or the third vertical via hole 18 .

In at least some embodiments, an integrated circuit vertical probe card uses a flexible glass sheet joined by a multilayer anodic bonding process. Since the soft glass sheet has the advantages of good flatness and low surface roughness, the performance and efficiency of the vertical probe card test of the integrated circuit can be greatly improved, and the test time can be shortened.

In some embodiments, the term "about" is used to indicate a range of 10% of the value. In some embodiments, the term "about" is used to indicate a range of 5% of the value.

The technical content and technical features of the present disclosure have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the present disclosure is not to be construed as being limited by the scope of

1‧‧‧Integrated circuit vertical probe card

11‧‧‧First soft glass

12‧‧‧ Third soft glass

13‧‧‧Second soft glass

14‧‧‧First vertical via

15‧‧‧First conductive polymer joint

16‧‧‧Second vertical via

17‧‧‧Second conductive polymer joint

18‧‧‧ Third vertical via

19‧‧‧Wire

21‧‧‧ pads

22‧‧‧ pads

23‧‧‧ pads

24‧‧‧ pads

25‧‧‧ pads

30‧‧‧Opening

Claims (8)

An integrated circuit vertical probe card comprising: a first soft glass piece; a plurality of first vertical through holes formed on the first flexible glass piece; and a plurality of first conductive polymer contacts disposed on the first softness The first vertical via hole is electrically connected to the glass sheet; a second flexible glass sheet; a plurality of second vertical via holes formed on the second soft glass; and a plurality of second conductive polymer contacts formed on the second flexible conductive sheet The second flexible glass plate is electrically connected to the second vertical via holes, wherein the first conductive polymer contacts are different from the second conductive polymer contacts; at least a third softness a glass sheet disposed between the first flexible glass sheet and the second flexible glass sheet and directly bonded to the first flexible glass sheet and the second flexible glass sheet; and a plurality of wires and a plurality of third vertical via holes, The first flexible conductive material is electrically connected to the corresponding second conductive polymer contact. The integrated circuit vertical probe card according to claim 1, wherein the first flexible glass piece, the second soft glass piece, or the third soft glass piece has a thickness of 50 micrometers to 200 degrees. Micron. The integrated circuit vertical probe card according to claim 1, wherein the first soft glass piece, the second soft glass piece, or the third soft Glass sheet containing borosilicate glass without alkali metal. The integrated circuit vertical probe card according to claim 1, wherein the first soft glass piece, the second soft glass piece and the third soft glass piece are bonded by an anodic bonding method. The integrated circuit vertical probe card according to claim 1, wherein the first flexible glass piece, the second flexible glass piece, or the third soft glass piece has a thermal expansion coefficient of about 2.8 ppm/ K. The integrated circuit vertical probe card of claim 1, wherein each of the first vertical vias, each of the second vertical vias, or each of the third vertical vias comprises copper. The integrated circuit vertical probe card of claim 1, wherein each of the first vertical vias, each of the second vertical vias, or each of the third vertical vias is formed in a The opening formed by the shot. The integrated circuit vertical probe card of claim 1, wherein each of the first vertical vias, each of the second vertical vias, or each of the third vertical vias comprises electroplated copper.