TWI548723B - A composition of patterning etchant and patterning processes - Google Patents

Description

Electrochemical circuit patterned etchant and process for patterning conductive lines by using etchant

The present invention relates to a chemical composition of a conductive line patterning process and an etchant using chlorine dioxide as an etchant, and more particularly to a technique for applying a transparent conductive substrate structure and thereby forming a specific oxidized region patterning. Applications of the patterned transparent conductive trace patterned conductive substrate include Printed Electronics, Sensors, Displays, Organic Light Emitting Diodes (OLEDs), Touch Panels, and Electronics Electronic Circuit Board, Electrode, Cold Light (EL), Heater, Antenna, Solar Cell.

A conductive line patterning technique for a conventional conductive substrate, for example, US Pat. No. 8,252,386 B2 (Samsung Electronics Co., Ltd.) discloses a method of forming a conductive polymer film by mixing a photosensitive resin (Photosensitive Polymer Resin) with an oxidizing agent ( a mixture of oxidant, which is coated on a transparent substrate, and then formed into a conductive film on the surface of the oxidant mixture on the transparent substrate by means of Vapor-Phase Polymerization (VPP), and then irradiated with UV light. A photopolymer containing photosensitive acrylic (Epoxy Acrylate) or acrylic epoxy (Epoxy Acylate) to form a conductive line. Another U.S. Patent No. 6,649,327 discloses the formation of a layer of a conductive polymer compound on a substrate, and the use of a mask to distinguish between the blocks to be illuminated and not to be illuminated, followed by irradiation with radiant light, and then the reticle is removed, at the bottom. The desired pattern is formed on the material. Another U.S. Patent No. 5,200,032 discloses the use of chlorine dioxide gas to react with a metal copper layer of a wafer to form a vaporizable copper compound CuCl _x O _y and thereby remove copper. Layer electrical circuit patterning technology. Another U.S. Patent No. 6,340,496 (Agfa-Gevaert) discloses a printing solution containing ClO, BrO ^- , MnO ₄ ^- , Cr ₂ O7-, S ₂ O ₈ -, H ₂ O ₂ oxides to improve conductivity on the substrate. The electrical impedance of the polymer. The present invention utilizes the characteristic characteristics of the high oxidizing power of chlorine dioxide, whose oxidizing ability is not provided by a halogen-chlorine atom, but is provided by an oxygen atom in its structure, and is also safer than chlorine monoxide (ClO). And does not destroy the ozone layer of the atmosphere. In addition, when the patterning process and the etchant of the present invention react with other substances, chlorine dioxide does not chlorinate other substances to form organic halides (THMs) which are polluting to the environment, depleting the ozone layer or causing carcinogenicity. For example, chloroform, therefore, chlorine dioxide is often used for disinfection of drinking water. The inventors applied the high oxygen property of chlorine dioxide to apply to the patterning of transparent conductive lines, and found that it has a very excellent pattern. The patterning effect is small, and the difference in etching marks after etching is small and inconspicuous, and has considerable value for use in industries such as photovoltaics, electronics, and touch. The formed transparent conductive substrate can be applied to include printed electronic (Printed Electronics), sensors, displays, organic light emitting diodes (OLEDs), touch panels (Touch Panels), electronic circuit boards ( Electronic Circuit Board, Electrode, EL, Heater, Antenna, Solar Cell, etc., with very effective etching effect, easy control of oxidation, and simplified process There is no problem of the difference in the surface of the conductive film after etching, the difference in etching marks is small and not obvious, the safety to the user is high, and the production cost is low. This will effectively control the quality, avoiding the loss and reducing the manufacturing cost, and thus greatly improving the production efficiency.

The present invention provides a process for patterning a etchant containing chlorine dioxide and a conductive line, wherein the aqueous etchant containing chlorine dioxide has a pH (pH) of 8.0 or less, preferably 2.0 to 6.0, and the etching is performed. The agent is one of a gas, a liquid, and a paste. The process comprises covering a surface of a substrate with a transparent conductive layer containing one of a substantially conductive conjugated conductive polymer and silver nanowires, and etching the chlorine dioxide containing the above. The agent covers the predetermined conductive layer on the conductive layer to improve the contacted conductive layer, and a masking material may be used to cover a first region of the conductive layer that is required to be electrically conductive, so that the above-mentioned shielding material is not covered. Contacting a second region of the conductive layer with one of a gas containing chlorine dioxide and an aqueous etchant containing chlorine dioxide to increase the electrical impedance of the second region by more than 100 times to completely non-conductive to form a non-conducting layer The conductive region, and the first region outside the non-conductive region, form a desired conductive line.

When the gas containing chlorine dioxide is used, the gas containing chlorine dioxide is brought into contact with the second region not covering the masking material, and then the masking material is removed.

After forming a desired conductive line on the surface of the first region, one of water, a pH solution having a pH lower than 7, a photoresist, and an organic solvent may be used to remove the remaining non-conductive region. A masking material for the above gas on the surface.

Preferably, the gas system containing chlorine dioxide is added to the acid by a Stabilized Chlorine Dioxide Solution, sodium chlorite (NaClO2), sodium chlorate (NaClO3), sodium chlorite (sodium chlorite) or added. The reducing agent (such as citric acid, hydrochloric acid, oxalic acid, hydrogen peroxide, sulfur dioxide, methanol) or the like may be produced by heating an aqueous solution of a stabilized chlorine dioxide dioxide precursor (Stabilized Chlorine Dioxide Precursor). The heating temperature is higher than 50 degrees C, preferably more than 65 degrees C.

Preferably, the above aqueous etchant containing chlorine dioxide further contains a water soluble solution And one of the resin and the tackifier, the water-soluble resin or the tackifier comprises at least polyvinyl alcohol (PVA), water-soluble cellulose (CMC), polyvinylpyrrolidone (PVP) and fumed citrate One of (Fumed Silica).

Preferably, the above aqueous etchant containing chlorine dioxide contains at least one alcohol And/or a water-soluble ketone such as one of methanol, ethanol, propanol, butanol, methyl ethyl ketone (MEK) and a surfactant (Surfactant).

Preferably, the pH of the above aqueous etchant containing chlorine dioxide is 8.0 or less.

In addition, an aqueous etchant containing chlorine dioxide is coated and contacted with the above conductive layer The methods include: Screen Printing, Transfer Printing, Gravure, Letterpress, Inkjet, Dipping, and Spin Coating. , Spray method, Comma coating, RDS coating, Lithography, Die coating, curtain coating Curtain Coating), one of Supersonic Spray Coating and Roller Coating.

Preferably, the above aqueous etchant containing chlorine dioxide contains carbonate as carbon One of sodium and sodium bicarbonate. The chlorine dioxide is produced by heating an aqueous solution of a stabilized chlorine dioxide precursor, and the heating temperature is higher than 50 ° C, preferably more than 65 ° C.

Furthermore, the masking material is photoresist and strippable. Ink/coating), one of protective film, soluble glue, soluble ink and coating. The above conductive wire The circuit contains an intrinsically conductive conjugated conductive polymer, including at least one of PEDOT/PSS, Polyaniline (PANI), and Polypyrrole (PPy) or Silver Nanowire.

Preferably, the chlorine dioxide content in the etching gas is 100 ppm or more, and the content of chlorine dioxide in the aqueous etchant containing chlorine dioxide and the gas is 15% or less.

Preferably, the conductive circuit is applied to one of a printed electronic device, a sensor, a display, an organic light emitting diode, a touch panel, an electronic circuit board, an electrode, a luminescent film, a hot plate, an antenna, and a solar cell.

The invention further provides an electronic device provided with a conductive substrate, comprising a substrate, and a conductive circuit having a patterned inductor function, which is disposed on the surface of the substrate and electrically connected to a circuit provided in the electronic device. The conductive line is transparent to one of a conjugated conductive polymer and a nano-silver wire containing one of chlorine dioxide and one of an aqueous etchant. Formed on the layer, the conductive layer is divided into a first region that needs to be electrically conductive and a second region that is not covered with a masking material, and the conductive line is formed in the first region.

Further, the present invention further provides an etchant for removing conductivity of a conductive line patterned on a transparent conductive substrate, which comprises chlorine dioxide.

Preferably, the etchant is one of a gas, a liquid, and a paste.

Preferably, the transparent conductive substrate comprises an intrinsically conductive conjugated conductive polymer comprising at least one of PEDOT/PSS, Polyaniline (PANI) and Polypyrrole (PPy).

Preferably, the transparent conductive substrate comprises a silver nanowire.

Preferably, when the etchant is the above aqueous etchant containing chlorine dioxide, it further contains at least one of an alcohol, a water-soluble ketone, and an interfacial surfactant.

Specific embodiments of the invention are further described below.

1‧‧‧Electrical substrate

2‧‧‧Electronic devices

10‧‧‧Substrate

20‧‧‧ Conductive layer

21‧‧‧ sensor

60‧‧‧Mask

201‧‧‧Non-conducting area

202‧‧‧Electrical circuit

S210~S260‧‧‧Steps

The first diagram is a schematic diagram of the structure of the present invention applied to an electronic device; the second diagram is a flowchart of a method according to an embodiment of the present invention; and the third diagram is a schematic diagram of a process according to an embodiment of the present invention.

The first figure is a schematic view of a configuration applied to an electronic device according to an embodiment of the present invention.

In the first figure, the conductive substrate 1 is applied to various electronic devices of different functions, such as the electronic device having the sensor 21 (Sensor) function shown in the first figure. In an embodiment, the conductive substrate 1 can also be applied to include Printed Electronics, a sensor, a display, an organic light emitting diode (OLED), a touch panel, and a touch panel. Electronic devices with different functions such as Electronic Circuit Board, Electrode, Cold Light (EL), Heater, Antenna, and Solar Cell.

In one embodiment, the substrate 10 can be a plastic film, such as a transparent PET film, a PI film, or the like, or an inorganic material such as glass or ceramic. In an embodiment, the transparent conductive layer may include one of a transparent conductive polymer or a nano-silver-containing wire and cover the surface of the substrate 10.

The second figure is a flow chart of a method in accordance with an embodiment of the present invention. In step S210, a transparent conductive layer containing a substantially conductive conjugated conductive polymer and/or nanosilver is coated on the surface of the substrate. In step S220, a masking material is used to cover a region of the conductive layer that is intended to be electrically conductive. In step S230, other regions not covered with the masking material are brought into contact with a gas containing chlorine dioxide and/or an aqueous etchant containing chlorine dioxide, thereby oxidizing to perform etching so as not to cover The electrical impedance of other areas of the masking material is increased by more than 100 times to completely non-conductive to form a non-conductive area. In step S240, the area covered with the masking material is a conductive layer area, and the desired patterned conductive line is formed in the conductive layer area. In step S250, the masking material is directly stripped or the masking material is removed using water or an organic solvent. In step S260, the gas and/or the residue of the aqueous etchant remaining on the surface of the non-conductive region are removed using one of water, an acidic solution having a pH of less than 7.0, and an organic solvent.

The third figure is a schematic diagram of a process in accordance with an embodiment of the present invention.

In the third figure, a conjugated conductive polymer and/or nanoparticle containing an intrinsically conductive A transparent conductive layer 20 of silver wire covers the surface of the substrate 10. The masking material 60 covers an area of the conductive layer 20 that is intended to be electrically conductive.

Next, other areas not covered by the masking material 60 are exposed to a gas containing chlorine dioxide. And/or an aqueous etchant containing chlorine dioxide, thereby oxidizing to etch, increasing the electrical impedance of other regions of the uncovered mask 60 by more than 100 times to being completely non-conductive to form the non-conductive region 201. The region covered with the masking material 60 is a conductive layer region, and the desired patterned conductive traces 202 are formed in the conductive layer region to further constitute the conductive substrate 1. The conductive line 202 is electrically connected to a circuit provided in the electronic device. In addition, the electrical impedance of the non-conductive region 201 that is not intended to be electrically conductive is more than 100 times that of the conductive layer region (ie, the conductive trace 202) to be completely non-conductive.

In an embodiment, the masking material 60 can be photoresist, peelable (strippable ink/coating/mask), one of protective film, soluble glue, soluble ink and paint. The transparent conductive layer line 20 contains an intrinsically conductive conjugated conductive polymer, including at least one of PEDOT/PSS, Polyaniline (PANI), and Polypyrrole (PPy).

The other areas that are not covered with the masking material 60 are exposed to a gas containing chlorine dioxide and/or Or an aqueous etchant containing chlorine dioxide and after forming the desired conductive line 202 in the conductive layer region, When the masking material used is a peelable rubber or a protective film, the masking material 60 is directly peeled off. When the masking material used is photoresist, soluble glue, soluble ink/coating, one of water, pH-lowering acidic solution, photoresist, and organic solvent is used to remove the non-conductive The above-mentioned masking material on the surface of the zone.

Among them, the gas system containing chlorine dioxide is composed of a stable aqueous solution of chlorine dioxide. (Stabilized Chlorine Dioxide Solution), sodium chlorite (NaClO2), sodium chlorate (NaClO3), sodium chlorite (sodium chlorite) added to the acid or added to its reducing agent (such as citric acid, hydrochloric acid, oxalic acid, hydrogen peroxide, sulfur dioxide, methanol And the like, that is, chlorine dioxide is produced by reducing chlorate ions by a chemical reducing agent. In addition, the aqueous etchant containing chlorine dioxide may also contain one of a water-soluble resin and a tackifier, and the water-soluble resin and/or tackifier includes at least polyvinyl alcohol (PVA) and water-soluble cellulose ( One of CMC), PVP (Polyvinylpyrrolidone) and Fumed Silica.

In an embodiment of the invention, the aqueous etchant containing chlorine dioxide contains Less alcohol and/or water soluble ketones. For example, alcohols include methanol, ethanol, propanol, butanol, while water soluble ketones include methyl ethyl ketone (MEK). Further, the aqueous etchant containing chlorine dioxide has a pH (pH) of 8.0 or less. In one embodiment, the aqueous etchant containing chlorine dioxide has a pH of between 2.0 and 6.0. In one embodiment, the aqueous etchant containing chlorine dioxide contains a carbonate which is one of sodium carbonate and sodium bicarbonate. In one embodiment, the chlorine dioxide is produced by heating an aqueous solution of a stabilized chlorine dioxide precursor at a temperature above 50 degrees C. In another embodiment, the temperature of the heating is preferably above 65 degrees C.

In one embodiment of the invention, two of the etching gases containing chlorine dioxide The content of the chlorine oxide is 100 ppm or more, preferably 5% or more. In aqueous etchants, chlorine dioxide The content is 15% or less. In addition, in the process of patterning the conductive layer by using an aqueous etchant or gas, the etching temperature can be increased to room temperature or higher to increase the strength and efficiency of the etching.

Method for covering and contacting the above conductive layer with an aqueous etchant containing chlorine dioxide Including: Screen Printing, Transfer Printing, Gravure, Letterpress, Inkjet, Dipping, Spin Coating, Spray (Spray) method, Comma Coating, RDS Coating, Lithography, Die Coating, Curtain Coating ), one of Supersonic Spray Coating, Roller Coating, and Dipping.

In an embodiment of the invention, an aqueous etchant containing chlorine dioxide is used. Cheng. Wherein, the aqueous etchant has a pH of 3 and contains carbonate, including sodium carbonate. Next, a PET protective film was used as a masking material over a specific area on the surface of a PEDOT/PSS transparent conductive polymer film (original electrical impedance of 90 ohm/sq.) which was intended to be electrically conductive. Then, the above-mentioned aqueous etchant containing chlorine dioxide is subjected to a printing method, such as a screen printing method, and the predetermined etching resistance of the PEDOT/PSS transparent conductive polymer film contacting the aqueous etchant to the masking material is not required to be conductive. a region that is oxidized by the etchant to be oxidized to form a non-conductive region 201, so that the transparent conductive polymer film in the region reduces its conductivity, and the resistance is greatly increased by 10 million times to more than 100 million times. , to about 10 x E+9~+10 ohm/sq. or above or not at all. Further, the conductive film covering a specific region of the masking material forms the conductive line 202. Among them, the etching strength and efficiency can be further improved by heating, and finally, the above aqueous etchant is removed by adhesion. If the etchant is soluble, use water or an acidic solution below pH 7.0. A cleaning solution such as a liquid or an organic solvent removes the etchant residue on the surface of the non-conductive region 201. Alternatively, the PET protective film can be removed by direct stripping or by adhesion.

In another embodiment of the invention, the use of a gas containing chlorine dioxide is conductive Line patterning process. Wherein, a masking material is used to cover a PEDOT/PSS transparent conductive polymer film (the original electrical impedance is 90 ohm/sq.) or a surface containing a nanowire transparent conductive film (the original electrical impedance is 20 ohm/sq.). It is scheduled to be on a specific area that needs to be electrically conductive. The etching gas containing chlorine dioxide is contacted with a region of the conductive film not covering the masking material to oxidize a region to be oxidized contacted by the etchant to form a non-conductive region 201, so that the transparent conductive polymer film in the region is lowered. Conductivity, resistance is greatly increased by 10 million times to more than 100 million times, to about 10 x E+9~+10 ohm/sq. or above. Further, the conductive film that is not in contact with a specific region of the etching gas forms the conductive line 202. Finally, if the masking layer used is a peelable/ink coating or a protective film, the above-mentioned aqueous etchant is removed by adhesion. If the masking layer is soluble, the masking layer on the surface of the non-conductive region 201 may be removed by using water or a cleaning solution such as an acidic solution, a photoresist or an organic solvent lower than pH 7.0.

The above description of the implementation and the drawings are one of the preferred embodiments of the present invention, and are not limited to the creation of the present invention. Therefore, any similar or similar structure to the structure, device, and features of the present creation should be It is the creation purpose of this creation and the scope of patent application, only this statement.

1‧‧‧Electrical substrate

2‧‧‧Electronic devices

10‧‧‧Substrate

21‧‧‧ sensor

202‧‧‧Electrical circuit

Claims (26)

An etchant for removing conductivity for patterning a conductive line of a transparent conductive substrate, comprising chlorine dioxide, wherein the etchant is one of a gas, a liquid, and a paste; the transparent conductive substrate a conjugated conductive polymer comprising an intrinsically conductive, comprising at least one of PEDOT/PSS, Polyaniline (PANI), and Polypyrrole (PPy); and when the etchant is the aqueous etchant containing chlorine dioxide, further comprising at least One of an alcohol, a water-soluble ketone, and an interfacial surfactant. An etchant for removing conductivity for patterning a conductive line of a transparent conductive substrate, comprising chlorine dioxide, wherein the transparent conductive substrate contains silver nanowire; when the etchant contains two The aqueous etchant for oxidizing chlorine further contains at least one of an alcohol, a water-soluble ketone, and an interfacial surfactant. A process for patterning a conductive line using an etchant containing chlorine dioxide, the process comprising: a transparent conductive layer containing one of a substantially conductive conjugated conductive polymer and a silver nanowire (Silver Nanowire) Covering a surface of a substrate; covering a predetermined non-conductive region of the conductive layer with an aqueous etchant containing chlorine dioxide to increase the electrical impedance of the region by more than 100 times to completely non-conductive to form a non- A conductive region, and a conductive layer outside the non-conductive region forms a desired conductive line. The process for patterning a conductive line using an etchant containing chlorine dioxide according to claim 3, wherein the aqueous etchant containing chlorine dioxide further comprises one of a water-soluble resin and a tackifier. The water-soluble resin and/or the above-mentioned tackifier include at least polyvinyl alcohol (PVA), water-soluble cellulose (CMC), polyvinylpyrrolidone (PVP), and citric acid. One of the salts (Fumed Silica). The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 3, wherein when the etchant is the aqueous etchant containing chlorine dioxide, further comprising at least one alcohol, One of water-soluble ketones and surfactants. The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 3, wherein the aqueous etchant containing chlorine dioxide has a pH (pH) of 8.0 or less. The process for patterning a conductive line using an etchant containing chlorine dioxide according to claim 3, wherein the method of covering and contacting the conductive layer with the aqueous etchant containing chlorine dioxide comprises: screen printing (Screen Printing), Transfer Printing, Gravure, Letterpress, Inkjet, Dipping, Spin Coating, Spray, Comma Coating, RDS Coating, Lithography, Die Coating, Curtain Coating, Ultrasonic Coating One of Supersonic Spray Coating, Roller Coating, and Dipping. The process for patterning a conductive line by using an etchant containing chlorine dioxide according to the third aspect of the patent application, wherein the etchant is an aqueous etchant, further containing a carbonate, which is one of sodium carbonate and sodium hydrogencarbonate. By. The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 3, wherein the conductive line contains an electrically conductive conjugated conductive polymer, including at least PEDOT/PSS, Polyaniline (PANI) ) and one of Polypyrrole (PPy). Conductive lines using an etchant containing chlorine dioxide as described in claim 3 A patterned process in which the content of chlorine dioxide is 15% or less in the above aqueous etchant containing chlorine dioxide. The process for patterning a conductive line by using an etchant containing chlorine dioxide as described in claim 3, wherein the conductive line is applied to printed electronics, sensors, displays, organic light-emitting diodes, touch panels, One of electronic circuit boards, electrodes, luminescent sheets, electric heating sheets, antennas, and solar cells. A process for patterning a conductive line by using an etchant containing chlorine dioxide, the process comprising: transparently conducting a conductive material comprising one of a substantially conductive conjugated conductive polymer and a silver nanowire (Silver Nanowire) The layer covers a surface of a substrate; a masking material is used to cover a first region of the conductive layer that is required to be electrically conductive; and a second region of the conductive layer not covering the masking material is contacted with a gas containing chlorine dioxide And one of an aqueous etchant containing chlorine dioxide, the electrical impedance of the second region is increased by more than 100 times to be completely non-conductive to form a non-conductive region, and the first region outside the non-conductive region is formed. The required conductive lines. The process for patterning a conductive line by using an etchant containing chlorine dioxide according to claim 12, wherein the second region not covering the masking material is contacted with the chlorine dioxide containing chlorine dioxide. After the gas and one of the aqueous etchants containing chlorine dioxide, the masking material is removed. The process for patterning a conductive line by using an etchant containing chlorine dioxide according to claim 13 of the patent application, wherein the method for removing the masking material comprises directly stripping, adhering, using water, and having a lower pH value. One of 7.0 acidic solutions, photoresists and organic solvents, except Go to the masking layer. The process for patterning a conductive line using a chlorine dioxide-containing etchant as described in claim 12, wherein the gas system containing chlorine dioxide is stabilized by a chlorine dioxide solution (Sabilized Chlorine Dioxide Solution), sodium Chlorite (NaClO2), sodium chlorate (NaClO3), sodium chlorite (sodium chlorite) are added to the acid or added with a reducing agent (such as citric acid, hydrochloric acid, oxalic acid, hydrogen peroxide, sulfur dioxide, methanol). The process for patterning a conductive line using an etchant containing chlorine dioxide according to claim 12, wherein the aqueous etchant containing chlorine dioxide further comprises one of a water-soluble resin and a tackifier. The water-soluble resin and/or the above-mentioned tackifier includes at least one of polyvinyl alcohol (PVA), water-soluble cellulose (CMC), polyvinylpyrrolidone (PVP), and fumed Silica (Fumed Silica). . The process for patterning a conductive line using an etchant containing chlorine dioxide according to claim 12, wherein when the etchant is the aqueous etchant containing chlorine dioxide, further comprising at least one alcohol, One of water-soluble ketones and surfactants. The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 17, wherein the alcohol is methanol, ethanol, propanol, butanol, and methyl ethyl ketone (MEK). One of them. The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 12, wherein the aqueous etchant containing chlorine dioxide has a pH (pH) of 8.0 or less. A process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 12, wherein the aqueous etchant containing chlorine dioxide covers and contacts the above The method of the conductive layer includes: Screen Printing, Transfer Printing, Gravure, Letterpress, Inkjet, Dipping, and Spin Coating (Spin) Coating), Spray Method, Comma Coating, RDS Coating, Lithography, Die Coating, Curtain Coating One of Curtain Coating, Supersonic Spray Coating, Roller Coating, and Dipping. The process for patterning a conductive line by using an etchant containing chlorine dioxide as described in claim 12, wherein when the etchant is an aqueous etchant, the carbonate further contains one of sodium carbonate and sodium hydrogencarbonate. By. The process for patterning a conductive line by using an etchant containing chlorine dioxide as described in claim 12, wherein the chlorine dioxide is generated by using an aqueous solution of a heated chlorine dioxide precursor, and the heating temperature is high. At 50 degrees C. The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 12, wherein the masking material is photoresist, strippable ink/coating/mask, protective film One of soluble glue, soluble ink and paint. The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 12, wherein the conductive line contains an electrically conductive conjugated conductive polymer, including at least PEDOT/PSS, Polyaniline (PANI) ) and one of Polypyrrole (PPy). The process for patterning a conductive line using an etchant containing chlorine dioxide as described in claim 12, wherein the content of chlorine dioxide in the aqueous etchant containing chlorine dioxide is 15% or less. Conductive wire using an etchant containing chlorine dioxide as described in claim 12 The circuit patterning process, wherein the conductive circuit is applied to one of a printed electronic device, a sensor, a display, an organic light emitting diode, a touch panel, an electronic circuit board, an electrode, a cold light sheet, a heating sheet, an antenna, and a solar battery. .