TWI546714B - Pre-adjustment device - Google Patents

Description

Pre-force adjustment device

The present invention relates to a pre-force adjustment device; and more particularly to a pre-force adjustment device for providing a pre-force on a substrate above the touch device to maintain its withstand voltage capability, thereby achieving the purpose of thinning the thickness.

According to the improvement of the quality of life and the rapid development of technology, the touch device system has gradually become one of the necessary tools for modern people. Since touch devices are widely used, from the common cash dispensers, personal digital assistants (PDAs), to industrial touch computers, touch modules are a very intimate and vivid man-machine. Interface, since 2007, more and more smart phones have gradually introduced touch panels to make it easier for users to control.

Among them, the electronic table (i-Table) is one of the most recent application examples of touch products. In addition to the functions of the traditional table, it also has the touch function, and uses a simple and easy-to-understand operation interface. All users can easily get started. Because the i-Table hardware needs to form a touch function with a unique architecture to ensure that all operations are smooth and immediate, and maintain excellent system stability, in addition to the design considerations of the i-Table, In addition to the general structural security, it is also necessary to simultaneously consider the performance of its touch power. As shown in Fig. 1A, the design considerations are that when the table top of the electronic table 1 is pressed by a person 2, in order to meet the moderate pressure resistance requirement, a conventional glass substrate having a thickness of more than 5 mm is used as the upper substrate 3, For the pressure exerted by the loader. In addition, the structural design of the electronic table is as shown in FIG. 1B, and the upper substrate 3 and the touch module 5 must be joined together by a word of glue 4. The disadvantage of such a design is that the thickness of the touch device as a whole cannot be reduced, and the selection of the touch wafer is also limited. When the overall thickness of the touch device is too thick, the working wafer is electrically charged. Sexually unable to achieve 100% support. Furthermore, the optical effect of the package bonding after the use of the mouth-shaped glue is still much worse than the full-fit visual effect.

Therefore, in combination with the many shortcomings of the above prior art, the inventors have felt that the defects can be improved, and based on the relevant experience in this field for many years, carefully observed and studied, and with the use of academics, The present invention is directed to a novel design that effectively improves the above-mentioned deficiencies, and discloses a pre-force adjustment device that can be improved before thinning the thickness of the touch panel, and still maintains excellent pressure resistance capability, and its specific structure and The embodiment will be described in detail below.

In order to solve the problems of the prior art, an object of the present invention is to provide a pre-force adjustment device, which is provided by providing a pre-force to the upper substrate of the touch device to improve the withstand voltage capability of the upper substrate. This implementation can still maintain good pressure resistance before thinning the thickness of the upper substrate.

Another object of the present invention is to provide a pre-force adjustment device, wherein the pre-force can be compressive or tensile stress, and can be selected to be mounted on the bilateral or four sides of the substrate above the touch device based on the principle of force balance. On the side.

A further object of the present invention is to provide a pre-force adjustment device which can be designed according to the appearance of the actual touch device system, and is not limited to a specific size, so that it has better flexibility at the same time. ).

Therefore, the pre-force adjustment device according to the present invention includes at least two sets of pre-force adjustment units, wherein each pre-force adjustment unit has a structural adhesive disposed around the upper substrate; The structure is bonded to the structural adhesive such that the mechanical component is affixed to at least one side of the upper substrate through the structural adhesive; and a pre-force adjustment member coupled to the mechanical component. Wherein, the pre-force adjusting member is used to provide a pre-force so that the pre-force permeable member is applied to the upper substrate, thereby improving the pressure resistance of the upper substrate.

According to an embodiment of the invention, the upper substrate may be a cover glass of one of the touch devices. When the pre-force adjustment device taught by the present invention is applied to the touch device, the thickness of the glass substrate can be successfully reduced to less than 5 mm to achieve overall thickness reduction, and the wafer selection of the touch device is less susceptible to thickness. Thinning is limited.

Furthermore, the pre-force adjustment device disclosed in the present invention is more applicable to the latest type of touch device, such as an electronic table (i-Table). In addition to structural safety, the design consideration of the electronic table needs to simultaneously consider the performance of the touch electric power. When the pre-force adjusting device disclosed in the present invention is used on the bilateral or four sides of the electronic table, the glass base can be simultaneously satisfied. The advantage of thinner materials and better pressure resistance is industrially competitive.

The purpose, technical contents, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments and the accompanying drawings.

The above description of the present invention is intended to be illustrative and illustrative of the spirit and principles of the invention, and to provide further explanation of the scope of the invention. The features, implementations, and utilities of the present invention are described in detail with reference to the preferred embodiments.

The present invention is the first to disclose a novel pre-force adjustment device which can be used to simultaneously reduce the thickness of the glass substrate of the touch device, but the resistance to pressure is the same as that of a thick glass substrate. Not only can the overall thickness of the touch device be greatly reduced, but the selection of the touch wafer is also not easily limited by the thickness reduction.

For a better understanding of the technical idea of the present invention, please refer to FIG. 2 first, which mainly applies a pre-force to the side of the substrate 11 on the touch device 10, and provides the pre-force to raise the upper substrate. The upper substrate 11 is a glass substrate (or cover glass, hereinafter referred to as CG) which is commonly used in touch devices. According to an embodiment of the present invention, the principle of the pre-stress applied by the present invention is as shown in FIG. 3, that is, when the upper substrate (for example, a glass substrate) 11 is pressed by a person, bending deformation occurs, and CG is generated. A compressive stress is generated near the pressure receiving surface, and a tensile stress is generated when it is away from the pressure receiving surface. When the material of the CG cannot withstand the relative compressive stress or tensile stress, deformation or even cracking occurs, and pressure resistance is formed. Insufficient problems. Since the ability to withstand pressure is generally positively related to the thickness of the CG, in other words, the thicker the thickness, the stronger the withstand voltage resistance, so the pre-stress applied by the present invention can be used to reduce or offset the pulling of the CG side. The stress makes the CG with a thinner thickness able to achieve the compressive capacity of the thicker CG. For example, the pressure level of 4 mm CG can be achieved with 2 mm CG, which can make the paper more loadable than the two ends of the paper. The principle is general. In view of the above, the present invention discloses a pre-force adjustment mechanism, and thereby provides a suitable pre-stress to the CG side by the pre-force adjustment machine leakage, thereby increasing the pressure resistance of the CG.

According to an embodiment of the present invention, in order to conform to the principle of force balance, the pre-force applied should be bilateral or symmetrical on the substrate 11 above. The second embodiment of the present invention is shown as an example in which the symmetrical sides of the upper substrate 11 are applied. However, the present invention is not limited thereto, in other words, the pre-force can be simultaneously applied. On the four sides of the substrate 11, or when the shape of the upper substrate 11 is irregular, the designer can adjust the position of the applied force according to the principle of the force balance, but the spirit disclosed in the present invention Equal variations or modifications are still intended to be included within the scope of the invention.

Hereinafter, in order to explain the mechanism design of the present invention, the bilateral design of Fig. 2 is taken as an illustrative example. The pre-force adjustment device disclosed in the present invention includes two sets of pre-force adjustment units, wherein each pre-force adjustment unit is mounted on one side of the CG; When the pre-force is applied to the four sides of the CG, the pre-force adjustment device disclosed in the present invention includes four sets of pre-force adjustment units, and so on. The installation position of a group of pre-force adjustment units and the structure diagram thereof are shown in FIG. 4 and FIG. 5 respectively, wherein FIG. 5 is a side view of the pre-force adjustment unit 500, and FIG. 4 is a A schematic diagram of the mounting position of the pre-force adjustment unit 500 relative to an electronic table 400, as shown by the broken line A-A' in the figure, the pre-force adjustment unit 500 can be installed on opposite sides of the electronic table 400 or on the four sides at the same time. On the side. The electronic table 400 shown in FIG. 4 is an application scope of the present invention. The first upper substrate 11 of the touch device further extends at least three support legs 402. The support feet 402 are balanced to form an electronic table (i-Table) 400. Of course, the shape of the electronic table is not limited to this type, and the number of support legs can also be four support legs (as shown in FIG. 1), and the pre-force adjustment unit of the present invention can also be applied as in the first The bilateral or four sides of the electronic table shown in the figures are also within the scope of the invention.

In detail, as for the single pre-force adjustment unit 500, as shown in FIG. 5, the pre-force adjustment unit 500 includes a structural adhesive 51, a machine member 53, a pre-force adjustment member 55, and a housing 57. The structural adhesive 51 is disposed around the upper substrate (CG) 11; the mechanical member 53 is bonded to the structural adhesive 51 such that the mechanical member 53 can be attached to at least one side of the upper substrate 11 through the structural adhesive 51. The outer casing 57 is a cover machine member 53, and the pre-force adjustment member 55 is passed through the outer casing 57 and then connected to the machine member 53. Wherein, the machine member 53 and the outer casing 57 can be formed by joining or integrally forming.

According to the embodiment of the present invention, since the pre-stress adjusting member 55 can be, for example, a locking component (for example, a screw), the pre-force adjusting member 55 can be used when being locked in the direction of approaching the upper substrate 11. A pre-force is provided, in which case the pre-stress is a compressive stress, and the pre-force can be further applied to the upper substrate 11 through the machine member 53 to thereby increase the withstand voltage capability of the upper substrate 11. As for the other embodiments of the present invention, when the pre-force adjusting member 55 is loosened in a direction away from the upper substrate 11, the pre-force provided at this time is equivalent to a tensile stress, and the same can be utilized. The tensile stress is applied to the upper substrate 11 to increase its withstand voltage capability.

Next, the present invention further simulates the pre-stress of the 55吋i-Table and withstands the deformation difference under the load of 60 kg by the hands of the person, and the experimental object is respectively the electronic table 6 with the CG thickness of 5 mm in FIG. (The pre-force adjustment device is not applied), and the electronic table 7 in which the CG thickness is 2 mm in Fig. 7 but is applied to the pre-force adjustment device, wherein the pre-force is applied in a range of from zero to 200 MPa. Please refer to Table 1 below for the data result table for this simulation. It can be clearly seen from the table 1 provided by the present invention that the difference in pressure resistance of the i-Table after the pre-stressing of the CG is compared by the CAE numerical simulation, and the simulation results show that when the CG thickness is constant, the application of 200 MPa to the CG is applied. The stress can effectively reduce the deformation amount by about 41%. In other words, the application of the present invention can successfully increase the pressure resistance of the i-Table, and can even easily reduce the thickness of the CG to less than 5 mm, but still maintain a certain level of resistance. The degree of pressure. Table I

Therefore, in summary, the pre-force adjustment device disclosed in the present invention is a novel and unique structural design, which first passes through a substrate and a component of a structural adhesive contact control device. The machine member is joined or integrally formed with the system casing, and a pre-force adjustment member (for example, a screw or other locking member) is used to appropriately provide and adjust the pre-stress of the application, thereby improving the pressure resistance of the upper substrate.

Furthermore, the pre-force adjustment device disclosed in the present invention is mainly in accordance with the appearance of the actual touch device, and the size and size are not limited, and may be determined according to the actual product and application range. Therefore, compared with the prior art, the present invention not only has the advantages of low complexity and high versatility, but also greatly reduces the overall thickness of the touch device while maintaining compliance with the specifications. The degree of pressure resistance has an excellent competitive edge in the industry.

The embodiments described above are merely illustrative of the technical spirit and characteristics of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. Equivalent changes or modifications made by the spirit of the present invention should still be included in the scope of the present invention.

1‧‧‧Electronic table
2 ‧ ‧ personnel
3‧‧‧Upper substrate
4‧‧‧Words
5‧‧‧Touch Module
6‧‧‧Electronic table
7‧‧‧Electronic table
10‧‧‧ touch device
11‧‧‧Upper substrate
51‧‧‧Structural adhesive
53‧‧‧ machine components
55‧‧‧Pre-force adjustments
57‧‧‧Shell
400‧‧‧Electronic table
402‧‧‧Support feet
500‧‧‧Pre-force adjustment unit

Figure 1A is a schematic diagram of the pressure of the bearer of the electronic table. Figure 1B is a schematic cross-sectional view of the Xiyi electronic table. 2 is a schematic view of a substrate when a pre-force is applied to the upper substrate of the touch device according to an embodiment of the present invention. Fig. 3 is a schematic view showing the force applied to a glass substrate according to an embodiment of the present invention when subjected to stress. Figure 4 is a schematic view showing the installation position of the pre-force adjustment unit disposed on an electronic table according to an embodiment of the present invention. Figure 5 is a side view of a pre-force adjustment unit according to an embodiment of the present invention. Figure 6 is a schematic view of a touch device having an upper substrate thickness of 5 mm. Figure 7 is a schematic diagram of a touch device having an upper substrate thickness of only 2 mm in accordance with an embodiment of the present invention.

11‧‧‧Upper substrate

51‧‧‧Structural adhesive

53‧‧‧ machine components

55‧‧‧Pre-force adjustments

57‧‧‧Shell

500‧‧‧Pre-force adjustment unit

Claims (10)

A pre-force adjustment device is applied to a touch device, and the touch device has an upper substrate, and the pre-force adjustment device includes at least two sets of pre-force adjustment units, each of the pre-force adjustment units comprising: a structure a glue disposed around the upper substrate; a machine member coupled to the structural adhesive such that the machine member is mounted to at least one side of the upper substrate through the structural adhesive; and a pre-force adjustment And the pre-force adjusting member is configured to provide a pre-force so that the pre-force can be applied to the upper substrate through the machine member to improve the pressure resistance of the upper substrate. The pre-force adjustment device according to claim 1, wherein the pre-force is a compressive stress. The pre-force adjustment device according to claim 1, wherein the pre-force is a tensile stress. The pre-force adjusting device according to claim 1, wherein the pre-force adjusting member is a locking member. The pre-force adjustment device according to claim 4, further comprising a casing, wherein the casing is wrapped around the machine member, and the locking member is threaded through the casing. The pre-force adjusting device according to claim 5, wherein the machine member is formed integrally with the outer casing. The pre-force adjustment device according to claim 1, wherein the upper substrate is a glass substrate. The pre-force adjustment device of claim 7, wherein the glass substrate has a thickness of less than 5 mm. The pre-force adjustment device of claim 1, wherein the pre-force adjustment device further comprises four sets of the pre-force adjustment units for respectively mounting each set of the pre-force adjustment unit on the side of the upper substrate. The pre-force adjustment device of claim 1, wherein the upper substrate further extends at least three support legs to form an electronic table with the touch device.