TWI546555B - Proximity Sensor and Manufacturing Method Thereof - Google Patents

Description

Proximity optical sensor and manufacturing method

The present invention relates to a proximity photosensor, and more particularly to a proximity photosensor having a closed accommodating space, and a method of fabricating the same.

The development of electronic products is diversified with the needs of use. Among them, various control input devices continue to develop, such as touch screens, gravity sensors, etc. Among them, proximity sensors are also one of the development priorities, and proximity light sensing The device is widely used in electronic products or other products. Regarding the use of the proximity photosensor, for example, when the user's face is close to the mobile phone for a call, the mobile phone can turn off the screen display function to save power and the like. The sensor actively senses the user's motion or product position change, etc., to control the system to generate corresponding actions.

Referring to FIG. 1 , the conventional proximity sensor 10 sends an optical signal L through the transmitting unit 11 and reflects the optical signal L to the receiving unit 12 via the object. The receiving unit 12 determines whether the received optical signal changes according to the strength or the like of the received optical signal. The change in the distance between the object and the proximity photosensor 10. The conventional proximity photosensor 10 has openings 13 and 14 in the structure, which provide an optical structure for the optical signal L and are respectively provided with an opening structure. However, due to the thin and light demand, the protection structure of the sensing component is gradually simplified and even removed, so that when dust or dirt penetrates into the product, it may interfere with the sensor's influence on the sensing quality factor. , the sensor characteristics are invalid (can not transmit or read signals, etc.). So how to use Jane The easy way to achieve the effect of separately protecting the transmitting unit 11 and the receiving unit 12 to prevent dust or dirt from affecting the sensing quality is one of the major issues in the related art of the proximity photosensor.

The invention provides a proximity photosensor, and in particular to a proximity photosensor with a closed receiving space.

The above and other objects and advantages of the present invention will be further understood from the technical features disclosed herein.

In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a proximity photosensor, comprising: a transmitting unit for transmitting an optical signal; and a receiving unit for Receiving the reflected optical signal, and determining the proximity state of an object according to the received optical signal; and an outer casing defining a receiving unit to close the accommodating space for accommodating the receiving unit, the outer casing defining the receiving unit to be closed The portion of the space has a sealed first light transmitting portion made of a light transmissive material, and the receiving unit can receive the light signal reflected from the object through the first light transmitting portion.

In an embodiment of the present invention, the outer casing may further define a transmitting unit to close the accommodating space to accommodate the transmitting unit, and the outer casing defines a portion of the transmitting unit that closes the accommodating space and has a sealing made of a light-transmitting material. The second light transmitting portion, the light signal sent by the transmitting unit can be projected to the object via the second light transmitting portion.

In an embodiment of the invention, the outer casing includes a portion made of a light shielding material and the first light transmitting portion made of a light transmissive material, or the first and second light transmitting portions.

In another embodiment of the present invention, the outer casing includes a portion made of a light transmissive material, and a surface thereof is adhered to a portion made of a light shielding material, wherein the light shielding material does not completely shield the light transmissive material to form the first through a light portion, or the first and second light transmitting portions.

In an embodiment of the invention, the outer casing includes a top cover and at least one partition. When the outer casing comprises a portion made of a light transmissive material and a surface thereof is adhered to a portion made of a light shielding material, the light shielding material includes a top light shielding layer attached to the top cover and at least one side wall light shielding layer attached to the spacer The top light shielding layer is attached to the upper surface and/or the lower surface of the top cover, and the side light shielding layer is attached to one side or both sides of the partition. In an embodiment of the invention, a matte structure is disposed between the sidewall light shielding layer and the top light shielding layer.

The present invention also provides an embodiment of a method for fabricating a proximity photosensor, wherein the proximity photosensor utilizes a transmitting unit and a receiving unit on the substrate to transmit and receive an optical signal projected on an object, and according to Receiving the optical signal to determine the proximity state of the object, the method comprising: providing the substrate, the transmitting unit and the receiving unit are disposed thereon; and connecting an outer casing to the substrate to form at least one closed receiving space to accommodate the a receiving unit; and providing at least one sealed light-transmitting portion made of a light-transmitting material on the outer casing to allow the receiving unit to receive light outside the enclosed accommodating space.

In the manufacturing method of the proximity photosensor described above, the outer casing may include a portion made of a light shielding material and the light transmissive portion made of a light transmissive material or a portion made of a light transmissive material, The surface is adhered to a portion made of a light-shielding material, wherein the light-shielding material does not completely shield the light-transmitting material to form the light-transmitting portion. Moreover, the outer casing can form another closed accommodating space to accommodate the launching unit except that a closed accommodating space is formed to accommodate the receiving unit. At this time, the closed accommodation space accommodating the emission unit preferably has a light transmitting portion.

The above described features and advantages of the present invention will be more apparent from the following description.

10, 20, 30, 100a, 100b‧‧‧ proximity photosensors

11, 21, 31‧‧‧ launching unit

12, 22, 32‧‧‧ receiving unit

13, 14‧‧‧ openings

211‧‧‧ Launch unit

221‧‧‧ receiving unit

23‧‧‧ Launch unit closed accommodating space

231‧‧‧Second accommodating space

232‧‧‧ openings

24‧‧‧ Receiving unit closed accommodating space

241‧‧‧First accommodation space

242‧‧‧ openings

25, 26‧‧‧Transmission Department

251, 261‧‧

27‧‧‧Shell

271‧‧‧Top cover

272‧‧ ‧ partition

2721‧‧‧shell

2722‧‧‧ Cover

273‧‧‧Top shade layer

274‧‧‧ sidewall coating

275‧‧‧ inner wall

276‧‧‧ outer wall

28‧‧‧Adhesive zone

33‧‧‧Closed space

34‧‧‧Shell

341‧‧‧Top shade layer

342‧‧‧ sidewall coating

35‧‧‧Transmission Department

D‧‧‧ matting structure setting position

S, S1‧‧‧ substrate

L‧‧‧Optical signal

[Fig. 1] is a schematic view of a conventional proximity photosensor.

[Fig. 2] is a schematic view of a proximity photosensor according to an embodiment of the present invention.

[Fig. 3] is a schematic view of a proximity photosensor according to an embodiment of the present invention.

[Fig. 4] is a schematic view of a proximity photosensor according to an embodiment of the present invention.

[Fig. 5] is a schematic view of a proximity photosensor according to an embodiment of the present invention.

[Fig. 6] Fig. 6 is a schematic view of a proximity photosensor according to an embodiment of the present invention.

[Fig. 7] Fig. 7 is a schematic view of a proximity photosensor according to an embodiment of the present invention.

[8A, 8B, 8C, and 8D] is a schematic view showing a forming embodiment of the top cover of the present invention and the light-transmitting portion plug embedded in the top cover.

[Fig. 9] is a schematic view of a proximity photosensor according to another embodiment of the present invention.

[Fig. 10] Fig. 10 is a schematic view of a proximity photosensor according to another embodiment of the present invention.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

2 is a schematic diagram of a proximity photosensor 20 according to an embodiment of the present invention, which transmits and receives an optical signal L projected on an object by a transmitting unit 21 and a receiving unit 22 on the substrate S, and according to The received optical signal L determines the proximity of the object. The proximity photosensor 20 can include: A transmitting unit closes the accommodating space 23 and a receiving unit closes the accommodating space 24. The position of the transmitting unit closing the accommodating space 23 is arranged on the substrate S. The transmitting unit closes the accommodating space 23 to be larger than the transmitting unit 21, and the optical signal L transmitted by the transmitting unit 21 can be projected through the transparent portion 25. object. The receiving unit closes the accommodating space 24 and is disposed on the substrate S. The receiving unit closes the accommodating space 24 to be larger than the receiving unit 22, and the receiving unit 22 receives the optical signal reflected from the object via a transparent portion 26. L. The transmitting unit closing accommodating space 23 and the receiving unit closing accommodating space 24 are defined, for example, as a part of the outer casing 27, respectively, and the transmitting unit closed accommodating space 23 and the receiving unit closed accommodating space 24 are not in communication with each other, but The invention is not limited thereto, and other embodiments may be used in the actual application due to the design of the outer casing 27. For example, when the outer casing 27 is connected by a top cover 271 and a partition 272 (refer to FIG. 3), between the top cover 271 and the partition 272 Due to factors such as production convenience and the like, there are voids, such as easy assembly, etc., so that the closed receiving space 23 of the transmitting unit and the closed receiving space 24 of the receiving unit are connected to each other. At this time, only attention should be paid to prevent excessive light from being emitted. The unit enclosed accommodating space 23 escapes to the receiving unit to close the accommodating space 24, so as to avoid sensing interference.

In Fig. 2, the outer casing 27 can be made of a light-shielding material, or can be other materials but covered with a light-shielding material on the surface, and the design is determined according to the convenience of production. The light transmissive portion 25 and the light transmissive portion 26 are both sealed, and may be respectively formed or integrated with the outer casing 27 through a light path formed by the light transmissive material (for example, as exemplified), the purpose of which is The transmitting unit 21 and the receiving unit 22 in the enclosed accommodating space are protected from dirt intrusion and the path of the optical signal L is provided to sense the proximity state of the object. When the distance between the object and the proximity photosensor 20 is relatively close, the receiving unit 22 can receive the optical signal L with higher intensity, so as to judge that it is close to the object. When the object is far away from the proximity photosensor 20, the receiving unit 22 can receive the optical signal L having a lower intensity, thereby judging that it is away from the object.

The transmitting unit closing accommodating space 23 in FIG. 2 may be surrounded by the substrate S, the light transmitting portion 25, and the outer casing 27, and the receiving unit closing accommodating space 24 may be surrounded by the substrate S, the light transmitting portion 26, and the outer casing 27. The formation (which may also be considered as the outer casing 27 includes the light transmitting portions 25 and 26). Wherein, the outer casing 27 and the substrate S are connected in such a manner as to be bonded (for example, the adhesive region 28 shown in FIG. 2), riveting, heat sealing, snapping, locking, bolting, splicing, pinning, welding, etc. The method must be determined according to the needs of use. The purpose is to protect the transmitting unit 21 and the receiving unit 22 in the enclosed accommodating space from intrusion, and to isolate the transmitting unit from the enclosed accommodating space 23 or the receiving unit to close the accommodating space 24 to prevent the stray light from interfering with the interpretation of the optical signal L.

FIG. 3 is another embodiment of the present invention, and similar to FIG. 2, wherein the proximity photosensor 20 closes the accommodating space 23 by the transmitting unit and the receiving unit closes the accommodating space 24 to respectively accommodate the emission therein. Unit 21 and receiving unit 22. The difference is that the outer casing 27 can be composed of a top cover 271 and a plurality of partition plates 272 (the partition plate 272 is a general name, including two partitions on the outer side of the closed accommodation space and two partitions on the inner side of the closed accommodation space, hereinafter It will be further distinguished) that if the outer casing 27 is designed in one piece (for example, not divided into the top cover 271 and the partition 272), the manufacturing of the outer casing 27 is often plagued by residual stress or deformation (plastic injection, metal injection, metal casting). This is possible with metal forging or the like. If the top cover 271 and the partition 272 are designed in part, the disadvantage can be improved. The connection of the top cover 271 and the partition 272 may be a common connection such as bonding (for example, the adhesive area 28 shown in FIG. 3), riveting, heat sealing, snapping, locking, bolting, splicing, pinning, welding, and the like. In this way, the connection method can be defined according to the needs of use.

4 is another embodiment of the present invention, similar to FIG. 2, wherein the proximity photosensor 20 closes the accommodating space 23 by the transmitting unit and the receiving unit closes the accommodating space 24 to respectively accommodate the emission therein. Unit 21 and receiving unit 22. The difference is that the outer casing 27 is a light transmissive material, and a light shielding material is attached to the surface of the outer casing 27, wherein the light shielding material does not completely shield the light transmissive material to form the light transmitting portion 25 and the light transmitting portion 26. In detail, the light-shielding material may be considered to include one or more top light-shielding layers 273 (the cross-sections are not connected but may be connected or not connected by a top view), and at least one sidewall light-shielding layer 274, wherein the top light-shielding layer 273 Attached to the top cover 271, the side wall light shielding layer 274 is attached to the side of the partition plate 272 (hereinafter referred to as the inner wall 275) between the emission unit closing accommodation space 23 and the receiving unit closing accommodation space 24. The top light shielding layer 273 may have at least one opening to form the light transmitting portion 25 or the light transmitting portion 26 (the light transmitting portion 25 and the light transmitting portion 26 may or may not be connected from a top view), and the side wall light shielding layer 274 A light shielding function is provided between the transmitting unit closing accommodating space 23 and the receiving unit closing accommodating space 24 to prevent the light from directly passing through the inner wall 275 to the receiving unit 22 without being reflected by the object, thereby interfering with the interpretation. In this embodiment, the top light shielding layer 273 is disposed above the outer casing 27, but is not limited thereto, and may be attached to the lower surface of the outer casing 27 or the upper and lower surfaces. On both sides of the inner wall 275, but not limited to this, it may be attached to only a single side of the inner wall 275. The top light shielding layer 273 and the side wall light shielding layer 274 may be connected or not connected, although a small amount of light leakage may occur when not connected, as long as the controllable leakage amount does not affect the interpretation. In order to reduce the illuminance, in an embodiment, a matting structure (for example, at the position D shown in the figure) may be disposed between the sidewall light shielding layer 274 and the top light shielding layer 273, and the extinction structure may increase the surface roughness therebetween. Designed with a light-shielding function, such as a light-shielding material and a heterogeneous light-shielding material (for example, two-shot injection). The method of forming the top light-shielding layer 273 and the side wall light-shielding layer 274 is, for example, a varnish, a printing, a plating, a light-shielding material, or the like, and the selection depends on the use requirements.

FIG. 5 is another embodiment of the present invention, and similar to FIG. 4 , wherein the proximity photo sensor 20 is also enclosed by the transparent housing 27 and the substrate S as a transmitting unit to close the accommodating space 23 and the receiving unit is closed. The space 24 is adapted to accommodate the transmitting unit 21 and the receiving unit 22 therein, respectively. The difference is that the sidewall light shielding layer 274 in FIG. 5 is attached not only to the side of the inner wall 275 between the transmitting unit 21 and the receiving unit 22, but also to the side of the outer partition 272 (hereinafter referred to as the outer wall 276). The effect of preventing stray light interference is another preferred embodiment of the sidewall light shielding layer 274. In this embodiment, the sidewall light shielding layer 274 is disposed on a single side of the outer wall 276, but is not limited thereto, and may be attached to both sides of the outer wall 276.

FIG. 6 is another embodiment of the present invention, wherein the proximity photosensor 30 transmits and receives an optical signal L projected on an object by a transmitting unit 31 and a receiving unit 32 on the substrate S, and Determining the proximity state of the object according to the received optical signal L, comprising: a closed accommodating space 33 connected to the substrate S, the closed accommodating space 33 is larger than the receiving unit 32, and the receiving unit 32 can be connected via a The light transmitting portion 35 receives the light signal L reflected from the object. Compared with FIG. 2, FIG. 3, FIG. 4 and FIG. 5, the embodiment of FIG. 6 is a relatively simple version. Because the proximity photosensor 30 is determined according to the intensity of the optical signal L reflected from the object, the receiving unit 32 must Surrounded by the closed accommodating space 33, on the one hand, it has a protective effect, and on the other hand, the stray light can be isolated, but the launching unit 31 can be placed in an open space without affecting the interpretation. The closed accommodating space 33 is formed by the substrate S, a casing 34, and a light-transmitting portion 35 embedded in the outer casing. The outer casing 34 can be made of an opaque material or a light-shielding material. instruction of.

FIG. 7 is another embodiment of the present invention, wherein the proximity photosensor 30 transmits and receives an optical signal L projected on an object by a transmitting unit 31 and a receiving unit 32 on the substrate S, and according to The received optical signal L determines the proximity of the object. Compared with FIG. 6, the same portion includes a closed accommodating space 33 connected to the substrate S. The closed accommodating space 33 is larger than the receiving unit 32, and the receiving unit 32 can receive the reflection through a transparent portion 35. The light signal L from the object. In contrast, the outer casing 34 of the present embodiment can be made of a light transmissive material, and a light shielding material is attached to the outer casing 34, and the light shielding material does not completely shield the light transmissive material. In detail, the light shielding material can be regarded as comprising a top light shielding layer 341 and at least one sidewall light shielding layer 342, the top light shielding layer 341 has an opening to form the light transmitting portion 35, and the sidewall light shielding layer 342 is attached to the transmitting unit 31 and the receiving unit 32. On the outer casing 34, a light shielding function is provided for the closed accommodation space 33. In addition, a light-extending structure may be disposed between the sidewall light-shielding layer 342 and the top light-shielding layer 341, and the matte structure may be provided with a surface roughness, a light-shielding material, and a heterochromatic light-shielding material (for example, double-ejected). The design.

Further, the method for forming the light-transmitting portion in the outer casing proposed in the drawings 2, 3, and 6 of the present invention may be a common connection method such as bonding, heat welding, splicing, or the like. Production. Referring to Figures 8A, 8B, 8C, and 8D, there is shown a top molding of the outer cover of the outer casing and a light transmissive portion thereof. In FIG. 8A, a carrier is provided, and a plurality of light transmissive bodies are disposed thereon, wherein the plurality of light transmissive bodies are made of a light transmissive material. Referring to FIG. 8B, a light-shielding material is coated or deposited on the carrier, adjacent to the periphery of the at least one light-transmitting body, and then the light-shielding material is cured to fix the light-shielding material and the at least one light-transmitting portion plug to form a cured member. . Referring to Figure 8C, the carrier is separated from the cured member located thereon to facilitate the next step. Referring to Figure 8D, the cured member is divided to form at least one top cover.

In addition, the present invention also provides an embodiment of a method for fabricating a proximity photosensor, wherein the proximity photosensor utilizes a transmitting unit and a receiving unit on the substrate to transmit and receive an optical signal projected on an object. And determining, according to the received optical signal, the proximity state of the object, the method comprising: providing the substrate, the transmitting unit and the receiving unit are disposed thereon; and connecting an outer casing to the substrate to form at least one closed receiving space, Accommodating the receiving unit; and providing at least one sealed transparent portion made of a light transmissive material on the outer casing to allow the receiving unit to receive light outside the enclosed accommodating space.

In the manufacturing method of the proximity photosensor described above, the outer casing may include a portion made of a light shielding material and the light transmissive portion made of a light transmissive material or a portion made of a light transmissive material, The surface is adhered to a portion made of a light-shielding material, wherein the light-shielding material does not completely shield the light-transmitting material to form the light-transmitting portion. Moreover, the outer casing can form another closed accommodating space to accommodate the launching unit except that a closed accommodating space is formed to accommodate the receiving unit. At this time, the closed accommodation space accommodating the emission unit preferably has a light transmitting portion.

Based on the above, the present invention can also provide a proximity photosensor 20, 30 including the substrate S, the aforementioned transmitting units 21, 31, the aforementioned receiving units 22, 32, and a package housing (as described above). The outer casing 27) is as described in the aforementioned FIGS. 2-7. Referring to FIG. 2 to FIG. 7 simultaneously, the transmitting units 21 and 31 are disposed on the substrate S and are adapted to provide a light beam (such as the aforementioned optical signal L). The receiving units 22, 32 are disposed on the substrate S, wherein when an object is adjacent to the proximity photosensors 20, 30, the receiving units 22, 32 are adapted to receive a beam of light reflected by the object. The package housing is disposed on the substrate S to define a first closed receiving space (such as the receiving unit closed receiving space 24) of the receiving receiving unit 22, 32. The package housing has a first light transmissive portion 26 made of a light transmissive material, wherein the receiving unit 22, 32 is adapted to pass through the first light transmissive portion 26 when an object is adjacent to the proximity photosensors 20, 30. Receives a beam of light reflected by an object.

Referring to FIG. 2 to FIG. 7 , the package housing further has a second enclosed accommodating space for accommodating the transmitting units 21 , 31 (such as the foregoing transmitting unit closing accommodating space 23 ), and the package housing has another or The second light transmitting portion 25 is made of the same light transmissive material. When an object approaches the proximity photo sensor 20, 30, the light beam provided by the emitting unit 21, 31 is adapted to be projected to the second light transmitting portion 25 to object. In addition, the first closed accommodating space and the second closed accommodating space are preferably not in communication with each other.

FIG. 9 is a schematic diagram of a proximity photosensor according to another embodiment of the present invention. Referring to FIG. 9, the proximity photosensor 100a of the present embodiment includes a substrate S1, a transmitting unit 211, a receiving unit 221, a housing 2721, and an outer cover 2711. The emitting unit 211 is disposed on the substrate S1 and is adapted to provide a light beam L1. The receiving unit 221 is disposed on the substrate S1, wherein when an object is close to the proximity photosensor 100a, the receiving unit 221 is adapted to receive the light beam L1 reflected by the object. In this embodiment, the substrate S1, the transmitting unit 211, and the receiving unit 221 are, for example, the above-mentioned structures and components, and are not described herein again.

In particular, the housing 2721 of the present embodiment is disposed on the substrate S1 to define a first receiving space 241 for receiving the receiving unit 221 and an opening 242 exposing the first receiving space 241, wherein the opening 242 can be It is a side that completely exposes the first accommodating space 241 (from the point of view of the present embodiment to the upper side) as shown in FIG. In other words, the housing 2721 of the present embodiment is simpler and easier to manufacture than the housing used in the conventional proximity photosensor 10. In addition, in order to effectively block some of the spurs The outer cover 2711 is disposed on the housing 2721 and has an opening 261 exposing the first accommodating space 241, wherein the area of the opening 261 of the outer cover 2711 is smaller than the optical performance of the proximity sensor. The area of the opening 242 of the housing 2721 is such that when an object approaches the proximity photosensor 100a, the receiving unit 221 is adapted to receive the light beam L1 reflected by the object via the opening 261 of the outer cover 2711. It should be noted that the outer cover 2711 can be disposed on the housing 2721 through a connection manner such as bonding or pasting, etc., in other words, the housing 2721 and the outer cover 2711 are not integrally formed, and the manufacturing is relatively simple. And the advantage of lower cost. Moreover, since the housing 2721 and the outer cover 2711 are not substantially integrally formed, the design of the outer cover 2711 can be arbitrarily adjusted and replaced without re-replacement of the entire package structure, and the advantages of large elastic space and cost saving are feature.

FIG. 10 is a schematic diagram of a proximity photosensor according to still another embodiment of the present invention. Referring to FIG. 9 and FIG. 10 simultaneously, the proximity photosensor 100b of the present embodiment and the proximity photosensor 100a adopt a similar concept and architecture, and the difference is that the housing 2721 is more capable. The second accommodating space 231 of the transmitting unit 211 and the opening 232 exposing the second accommodating space 231, wherein the opening 232 may be one side of the second accommodating space 231 completely exposed (from the illustration of the embodiment) The viewpoint is the upper side), as shown in FIG. In addition, in order to effectively improve the optical performance of the proximity photosensor 100b, the outer cover 2711 may also have an opening 251 exposing the second receiving space 231, wherein the opening 251 of the outer cover 2711 has an area smaller than the opening of the housing 2721. The area of 232 is shown in Figure 10.

Similarly, the outer cover 2711 can be disposed on the housing 2721 through a connection manner such as bonding or pasting, etc., in other words, the housing 2721 and the outer cover 2711 are not integrally formed, and the manufacturing is relatively simple and cost-effective. The advantage of being cheaper. Moreover, since the housing 2721 and the outer cover 2711 are not substantially integrally formed, the design of the outer cover 2711 can be arbitrarily adjusted and replaced without re-replacement of the entire package structure, and the advantages of large elastic space and cost saving are feature.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. For example, the above embodiments may be implemented in combination, and a part of the outer casing is made of a light-shielding material and is made of a light-transmitting material and another part of the outer casing of the light-shielding material is attached. For example, the top cover may be a light-transmitting material attached to the light-shielding material, and the partition plate It can be a shading material, or vice versa, and so on. For another example, the outer casing does not have to be clearly distinguishable to include a top cover and a partition. For example, if the junction between the top cover and the partition is arcuate, it may be difficult to distinguish between the two, so as long as there is a cover over and side The outer casing of the action shall be deemed to contain the top cover and the partition. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

20‧‧‧Close-up photo sensor

21‧‧‧ Launching unit

22‧‧‧ Receiving unit

23‧‧‧ Launch unit closed accommodating space

24‧‧‧ Receiving unit closed accommodating space

25, 26‧‧‧Transmission Department

27‧‧‧Shell

28‧‧‧Adhesive zone

S‧‧‧Substrate

L‧‧‧Optical signal

Claims (4)

A proximity photosensor includes: a substrate; a transmitting unit disposed on the substrate and adapted to provide a light beam; a receiving unit disposed on the substrate; a package housing disposed on the substrate The package housing has an accommodating space for accommodating the receiving unit, and the package housing has an opening, the opening is located above the receiving unit, and a light transmitting body is at least partially disposed in the opening and sealing the opening The light transmissive body forms a continuous plane with the package housing adjacent to the opening, wherein when an object is adjacent to the proximity photo sensor, the receiving unit is adapted to receive the light transmissive body after being reflected by the object. The beam. The proximity photosensor of claim 1, wherein the package housing is an opaque material. A proximity photosensor includes: a transmitting unit adapted to provide a light beam; a receiving unit; a package housing having an accommodating space for receiving the receiving unit, and the package housing has an opening, The opening exposes at least a portion of the receiving unit; and a light transmissive body is at least partially disposed in the opening and sealing the opening, the transparent body forming a continuous plane with the package housing adjacent to the opening, wherein an object is adjacent to the opening In the case of a proximity photosensor, the receiving unit is adapted to receive the light beam that is reflected by the object and passes through the light transmissive body. A proximity photosensor comprising: a substrate; a transmitting unit disposed on the substrate and adapted to provide a light beam; a receiving unit disposed on the substrate; a package housing disposed on the substrate, the package housing having a receiving space The receiving unit is disposed, and the package housing has an opening, the opening is located above the receiving unit, wherein the receiving unit and the package housing maintain an air gap; and a light transmitting body is at least partially disposed in the opening And sealing the opening, and the light transmissive body maintains an air gap with the receiving unit, wherein when an object is close to the proximity photo sensor, the receiving unit is adapted to receive the light transmissive body after being reflected by the object beam.