TWI545378B - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
TWI545378B
TWI545378B TW104129227A TW104129227A TWI545378B TW I545378 B TWI545378 B TW I545378B TW 104129227 A TW104129227 A TW 104129227A TW 104129227 A TW104129227 A TW 104129227A TW I545378 B TWI545378 B TW I545378B
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Taiwan
Prior art keywords
light
circuit board
guide plate
backlight module
light guide
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TW104129227A
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Chinese (zh)
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TW201710760A (en
Inventor
曾建榮
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揚昇照明股份有限公司
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Publication of TWI545378B publication Critical patent/TWI545378B/en
Publication of TW201710760A publication Critical patent/TW201710760A/en

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Description

背光模組 Backlight module

本發明是有關於一種背光模組,尤其是有關於一種的可保持導光板內光線輝度的背光模組。 The present invention relates to a backlight module, and more particularly to a backlight module capable of maintaining the brightness of light in a light guide plate.

目前來說,背光模組(Back light module)為顯示裝置的關鍵零組件之一,舉例來說,顯示裝置可為液晶顯示裝置,由於液晶本身不發光,背光模組之功能即在於供應充足的亮度與分佈均勻的光源,使得顯示裝置能正常顯示影像。 At present, the backlight module is one of the key components of the display device. For example, the display device can be a liquid crystal display device. Since the liquid crystal itself does not emit light, the function of the backlight module is sufficient supply. A light source with uniform brightness and distribution enables the display device to display images properly.

習知的背光模組的組裝流程大多是將導光板的入光面靠近發光單元的發光面後,再利用雙面膠將導光板固定於承載發光單元的電路板的頂面上,但由於雙面膠設置於電路板的頂面,使得導光板在接近發光單元且尚未將導光板的入光面抵頂於發光單元的發光面時,容易誤黏於雙面膠上,使得導光板與發光單元之間存在過大的間隙,而影響進入導光板後的光線的整體輝度。 The assembly process of the conventional backlight module is mostly after the light-incident surface of the light guide plate is close to the light-emitting surface of the light-emitting unit, and then the double-sided adhesive is used to fix the light guide plate to the top surface of the circuit board carrying the light-emitting unit, but The surface adhesive is disposed on the top surface of the circuit board, so that when the light guide plate is close to the light-emitting unit and the light-incident surface of the light guide plate has not been pressed against the light-emitting surface of the light-emitting unit, it is easy to be mistakenly adhered to the double-sided tape, so that the light guide plate and the light-emitting plate There is an excessive gap between the cells, which affects the overall brightness of the light entering the light guide plate.

另外,因為雙面膠本身的厚度,當其黏合於導光板與電路板之間時,會墊高導光板的高度而導致導光板的入光面與發光單元的發光面因為錯位而無法完全耦合,使得發光單元發出的光線部分地會照射於雙面膠而減少進入導光板內的整體輝度。進一步地,在光線進入導光板後,導光板下 方的雙面膠還會因電路板及導光板的發熱而受熱膨脹而使得本身的厚度增加,使得發光單元發出的光線進入導光板後的整體輝度更進一步地受到影響而降低。另一方面,黏合於導光板下方的雙面膠的材質也會影響發光單元發出的光線進入導光板後的整體輝度。 In addition, because of the thickness of the double-sided tape itself, when it is bonded between the light guide plate and the circuit board, the height of the light guide plate is raised to cause the light-incident surface of the light guide plate and the light-emitting surface of the light-emitting unit to be completely coupled due to misalignment. The light emitted by the light emitting unit is partially irradiated to the double-sided tape to reduce the overall brightness entering the light guide plate. Further, after the light enters the light guide plate, under the light guide plate The double-sided tape of the square is also thermally expanded by the heat generated by the circuit board and the light guide plate to increase the thickness thereof, so that the overall luminance after the light emitted from the light-emitting unit enters the light guide plate is further affected and reduced. On the other hand, the material of the double-sided tape adhered to the lower side of the light guide plate also affects the overall brightness of the light emitted from the light-emitting unit after entering the light guide plate.

“先前技術”段落只是用來幫助了解本發明內容,因此在“先前技術”段落所揭露的內容可能包含一些沒有構成所屬技術領域中具有通常知識者所知道的習知技術。在“先前技術”段落所揭露的內容,不代表該內容或者本發明一個或多個實施例所要解決的問題,在本發明申請前已被所屬技術領域中具有通常知識者所知曉或認知。 The "Prior Art" section is only intended to aid in understanding the present invention, and thus the disclosure of the prior art paragraphs may contain some conventional techniques that are not known to those of ordinary skill in the art. The matters disclosed in the "Prior Art" section, which do not represent the subject matter or the problems to be solved by one or more embodiments of the present invention, are known or recognized by those of ordinary skill in the art prior to the present application.

本發明的目的之一在提供一種背光模組,用以改善先前技術所造成的問題。 One of the objects of the present invention is to provide a backlight module for improving the problems caused by the prior art.

本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。 Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

為達上述之一或部份或全部目的或是其他目的,本發明提供一種背光模組包括電路板、發光單元以及導光板。電路板具有相對的第一面及第二面。發光單元配置於電路板的第一面上,發光單元具有第一出光面用以發出光線。導光板包括第二出光面、底面以及入光面。底面相對第二出光面設置。入光面連接第二出光面與底面。入光面具有凹陷部,且凹陷部凹入於入光面,凹陷部與第二出光面和底面之間分別具有間距,其中電路板一端部嵌入於凹陷部,且發光單元的第一出光面抵接於入光面。 In order to achieve one or a part or all of the above or other purposes, the present invention provides a backlight module including a circuit board, a light emitting unit, and a light guide plate. The circuit board has opposing first and second sides. The light emitting unit is disposed on the first surface of the circuit board, and the light emitting unit has a first light emitting surface for emitting light. The light guide plate includes a second light emitting surface, a bottom surface, and a light incident surface. The bottom surface is disposed opposite to the second light exit surface. The light entrance surface is connected to the second light emitting surface and the bottom surface. The light incident surface has a concave portion, and the concave portion is recessed in the light incident surface, and the concave portion and the second light emitting surface and the bottom surface respectively have a spacing, wherein one end portion of the circuit board is embedded in the concave portion, and the first light emitting surface of the light emitting unit Abuts on the entrance surface.

在本發明的一實施例中,凹陷部具有相對的第一內表面及第二內表面,且第二內表面位於第一內表面與底面之間,電路板的第二面位於第一面與凹陷部的第二內表面之間。 In an embodiment of the invention, the recess has an opposite first inner surface and a second inner surface, and the second inner surface is located between the first inner surface and the bottom surface, and the second surface of the circuit board is located on the first surface Between the second inner surfaces of the recesses.

在本發明的一實施例中,背光模組還包含膠體,設置於電路板的第二面與凹陷部的第二內表面之間。 In an embodiment of the invention, the backlight module further includes a glue disposed between the second surface of the circuit board and the second inner surface of the recess.

在本發明的一實施例中,背光模組還包含固定件,將電路板的一端部固定於凹陷部內。 In an embodiment of the invention, the backlight module further includes a fixing member for fixing one end of the circuit board in the recess.

在本發明的一實施例中,導光板的入光面完整地覆蓋發光單元的第一出光面。 In an embodiment of the invention, the light incident surface of the light guide plate completely covers the first light emitting surface of the light emitting unit.

在本發明的一實施例中,凹陷部與電路板形成腔體。 In an embodiment of the invention, the recess forms a cavity with the circuit board.

在本發明的一實施例中,背光模組還包含框體,容置發光單元、電路板及導光板,其中框體具有承載部,承載部承載電路板。 In an embodiment of the invention, the backlight module further includes a frame body for accommodating the light-emitting unit, the circuit board and the light guide plate, wherein the frame body has a carrying portion, and the carrying portion carries the circuit board.

在本發明的一實施例中,承載部抵接於導光板的入光面。 In an embodiment of the invention, the bearing portion abuts on the light incident surface of the light guide plate.

在本發明的一實施例中,凹陷部還具有第三內表面,第三內表面分別連接第一內表面及第二內表面,第三內表面與第二內表面形成鈍角。 In an embodiment of the invention, the recess has a third inner surface, the third inner surface connecting the first inner surface and the second inner surface, respectively, and the third inner surface forms an obtuse angle with the second inner surface.

在本發明的一實施例中,導光板形成可視區與不可視區,凹陷部位於不可視區內。 In an embodiment of the invention, the light guide plate forms a visible area and an invisible area, and the recessed portion is located in the invisible area.

在本發明的一實施例中,第二出光面位於不可視區具有反射結構組合。 In an embodiment of the invention, the second illuminating surface is located in the invisible area and has a combination of reflective structures.

本發明實施例所述之背光模組的電路板可嵌入於導光板的凹陷部,使得配置發光單元的電路板的第一面直 接地接觸於導光板的底面且導光板的入光面可抵接於發光單元的入光面,之後才進一步固定導光板與電路板而完成背光模組的組裝。因此,導光板的底面與電路板的第一面之間不存在影響光線輝度的介質,而可保持發光單元發出的光線進入導光板內的整體輝度。另一方面,電路板嵌入導光板的凹陷部後,僅需將導光板的入光面抵接於發光單元的第一出光面並固定電路板及導光板即可完成背光模組的組裝,是故,本發明實施例的背光模組還具有避免固定電路板及導光板時產生發光單元與導光板之間的間隙的問題,還具有組裝簡單的優點。 The circuit board of the backlight module of the embodiment of the present invention can be embedded in the recessed portion of the light guide plate, so that the first surface of the circuit board on which the light emitting unit is disposed is straight. The grounding contact is connected to the bottom surface of the light guide plate, and the light incident surface of the light guide plate can abut the light incident surface of the light emitting unit, and then the light guide plate and the circuit board are further fixed to complete the assembly of the backlight module. Therefore, there is no medium that affects the brightness of the light between the bottom surface of the light guide plate and the first surface of the circuit board, and the overall brightness of the light emitted by the light-emitting unit into the light guide plate can be maintained. On the other hand, after the circuit board is embedded in the recessed portion of the light guide plate, the light-incident surface of the light guide plate needs to be abutted on the first light-emitting surface of the light-emitting unit, and the circuit board and the light guide plate are fixed to complete the assembly of the backlight module. Therefore, the backlight module of the embodiment of the invention has the problem of avoiding the gap between the light-emitting unit and the light guide plate when the circuit board and the light guide plate are fixed, and has the advantages of simple assembly.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。 The above and other objects, features and advantages of the present invention will become more <RTIgt;

100、200、300‧‧‧背光模組 100, 200, 300‧‧‧ backlight module

110‧‧‧電路板 110‧‧‧Circuit board

112‧‧‧第一面 112‧‧‧ first side

114‧‧‧第二面 114‧‧‧ second side

116‧‧‧端部 116‧‧‧End

120‧‧‧發光單元 120‧‧‧Lighting unit

122‧‧‧第一出光面 122‧‧‧The first glazing

122a‧‧‧頂邊 122a‧‧‧ top side

130‧‧‧導光板 130‧‧‧Light guide plate

130a‧‧‧可視區 130a‧‧ visible area

130b‧‧‧不可視區 130b‧‧‧Invisible area

131‧‧‧邊角 131‧‧‧ corner

132‧‧‧第二出光面 132‧‧‧Second glazing

132a‧‧‧反射結構組合 132a‧‧‧Reflective structure combination

134‧‧‧底面 134‧‧‧ bottom

136‧‧‧入光面 136‧‧‧Into the glossy surface

136a‧‧‧頂邊 136a‧‧‧ top side

138‧‧‧凹陷部 138‧‧‧Depression

138a‧‧‧第一內表面 138a‧‧‧First inner surface

138b‧‧‧第二內表面 138b‧‧‧Second inner surface

138c‧‧‧第三內表面 138c‧‧‧ third inner surface

139‧‧‧腔體 139‧‧‧ cavity

140‧‧‧膠體 140‧‧‧colloid

150‧‧‧固定件 150‧‧‧Fixed parts

160‧‧‧框體 160‧‧‧ frame

162‧‧‧承載部 162‧‧‧Loading Department

162a‧‧‧頂面 162a‧‧‧ top

162b‧‧‧側面 162b‧‧‧ side

170‧‧‧反射片 170‧‧‧reflector

d1‧‧‧第一間距 D1‧‧‧first spacing

d2‧‧‧第二間距 D2‧‧‧second spacing

θ‧‧‧鈍角 Θ‧‧‧oblate angle

圖1係繪示依照本發明一實施例的背光模組的俯視圖。 FIG. 1 is a top plan view of a backlight module according to an embodiment of the invention.

圖2係繪示依照圖1的背光模組沿剖面線A-A’的剖視圖。 2 is a cross-sectional view of the backlight module of FIG. 1 taken along section line A-A'.

圖3係繪示依照本發明另一實施例的背光模組的俯視圖。 3 is a top plan view of a backlight module in accordance with another embodiment of the present invention.

圖4係繪示依照本發明再一實施例的背光模組的俯視圖。 4 is a top plan view of a backlight module in accordance with still another embodiment of the present invention.

圖5係繪示依照圖4的背光模組沿剖面線B-B’的剖視圖。 Figure 5 is a cross-sectional view of the backlight module of Figure 4 taken along section line B-B'.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明並非用來限制本發明。 The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

請參照圖1及圖2,圖1係繪示依照本發明一實施例的背光模組的俯視圖,圖2係繪示依照圖1的背光模組沿剖面線A-A’的剖視圖。如圖1及圖2所示,本實施例的背光模組100包括電路板110、發光單元120以及導光板130。應了解到,本實施例的發光單元120為複數個,但不以此為限,在一些實施例中,發光單元120可僅為一個即可實施本發明。 1 and FIG. 2, FIG. 1 is a top view of a backlight module according to an embodiment of the invention, and FIG. 2 is a cross-sectional view of the backlight module according to FIG. 1 along a section line A-A'. As shown in FIG. 1 and FIG. 2 , the backlight module 100 of the present embodiment includes a circuit board 110 , a light emitting unit 120 , and a light guide plate 130 . It should be understood that the light-emitting unit 120 of the present embodiment is plural, but not limited thereto. In some embodiments, the light-emitting unit 120 can be implemented by only one.

電路板110具有相對的第一面112及第二面114,且發光單元120配置於電路板110的第一面112上。發光單元120具有第一出光面122用以發出光線。應了解到,發光單元120的第一出光面122為發光單元120露出於電路板110且可發出光線的表面。在本實施例中,電路板110可為可撓式印刷電路板,且發光單元120可為發光二極體,但不以此為限。 The circuit board 110 has opposite first and second faces 112 and 114 , and the light emitting unit 120 is disposed on the first surface 112 of the circuit board 110 . The light emitting unit 120 has a first light emitting surface 122 for emitting light. It should be understood that the first light-emitting surface 122 of the light-emitting unit 120 is a surface on which the light-emitting unit 120 is exposed on the circuit board 110 and emits light. In this embodiment, the circuit board 110 can be a flexible printed circuit board, and the light emitting unit 120 can be a light emitting diode, but is not limited thereto.

另一方面,導光板130包括第二出光面132、底面134以及入光面136,其中底面134相對第二出光面132設置,且入光面136連接第二出光面132與底面134。在本實施例中,入光面136具有凹陷部138,且凹陷部138凹入於入光面136,且凹陷部138與第二出光面132和底面134之間分別具有一間距。詳細而言,凹陷部138具有相對的第一內表 面138a及第二內表面138b,且第二內表面138b位於第一內表面138a與底面134之間。是故,凹陷部138的第一內表面138a與導光板130的第二出光面132的間距可定義為第一間距d1,凹陷部138的第二內表面138b與導光板130的底面134的間距可定義為第二間距d2,在本實施例中,第一間距d1的長度大於第二間距d2的長度,但不以此為限。此外,本實施例的凹陷部138還可具有第三內表面138c,且第三內表面138c分別連接第一內表面138a及第二內表面138b,其中第三內表面138c與第二內表面138b形成鈍角θ,鈍角θ朝向導光板130的入光面136,但不以此為限。在本實施例中,導光板130具有Y字形剖面,也就是說,本實施例的導光板130由於凹陷部138的設置而形成Y字形剖面,但不以此為限。 On the other hand, the light guide plate 130 includes a second light-emitting surface 132, a bottom surface 134, and a light-incident surface 136. The bottom surface 134 is disposed opposite to the second light-emitting surface 132, and the light-incident surface 136 is connected to the second light-emitting surface 132 and the bottom surface 134. In this embodiment, the light incident surface 136 has a recessed portion 138, and the recessed portion 138 is recessed in the light incident surface 136, and the recessed portion 138 and the second light exiting surface 132 and the bottom surface 134 respectively have a spacing. In detail, the recess 138 has an opposite first inner surface Face 138a and second inner surface 138b, and second inner surface 138b is located between first inner surface 138a and bottom surface 134. Therefore, the distance between the first inner surface 138a of the recessed portion 138 and the second light-emitting surface 132 of the light guide plate 130 may be defined as a first pitch d1, a distance between the second inner surface 138b of the recessed portion 138 and the bottom surface 134 of the light guide plate 130. The length of the first spacing d1 is greater than the length of the second spacing d2, but is not limited thereto. In addition, the recess 138 of the embodiment may further have a third inner surface 138c, and the third inner surface 138c connects the first inner surface 138a and the second inner surface 138b, respectively, wherein the third inner surface 138c and the second inner surface 138b The obtuse angle θ is formed, and the obtuse angle θ faces the light incident surface 136 of the light guide plate 130, but is not limited thereto. In the present embodiment, the light guide plate 130 has a Y-shaped cross section, that is, the light guide plate 130 of the present embodiment forms a Y-shaped cross section due to the arrangement of the recessed portions 138, but is not limited thereto.

在本實施例中,導光板130可定義出可視區130a與不可視區130b,其中凹陷部138位於不可視區130b內。前述的可視區130a與不可視區130b係於製作成模組或裝置時,根據導光板130是否被遮蔽而無法出光至外界的區域而定義。另外,第二出光面132位於不可視區130b的部分具有反射結構組合132a,反射結構組合132a可將導光板130內射向不可視區130b的第二出光面132的光線反射回導光板130內,以進一步導引該光線自可視區130a的第二出光面132出光,但不以此為限。舉例來說,反射結構組合132a可為形成於第二出光面132上的數個反射結構,此外,反射結構組合132a可為形成於第二出光面132上的一反射層,但不以此為限。另一方面,由於導光板130於不可視區130b具有凹陷部138,由於凹陷部138無法傳導光線,僅能依靠導光板130於不可視區130b的其他部位傳導光線,導光板130於不可視區 130b的厚度須大致地大於導光板130於可視區130a的厚度,應了解到,前述的厚度可為第二出光面132與底面134的最短直線距離。進一步的說,導光板130於不可視區130b的厚度可朝遠離入光面136的方向逐漸遞減,但不以此為限。 In the present embodiment, the light guide plate 130 may define a visible area 130a and an invisible area 130b, wherein the recessed portion 138 is located in the invisible area 130b. When the visible area 130a and the invisible area 130b are formed into a module or a device, they are defined according to whether or not the light guide plate 130 is shielded from being exposed to the outside. In addition, the portion of the second light-emitting surface 132 located in the invisible area 130b has a reflective structure combination 132a, and the reflective structure combination 132a can reflect the light that is incident on the second light-emitting surface 132 of the invisible area 130b into the light-guide plate 130, to further reflect The light is guided from the second light-emitting surface 132 of the visible area 130a, but is not limited thereto. For example, the reflective structure combination 132a may be a plurality of reflective structures formed on the second light-emitting surface 132. Further, the reflective structure combination 132a may be a reflective layer formed on the second light-emitting surface 132, but limit. On the other hand, since the light guide plate 130 has the recessed portion 138 in the invisible area 130b, since the recessed portion 138 cannot conduct light, only the light guide plate 130 can be used to conduct light at other portions of the invisible area 130b, and the light guide plate 130 is in the invisible area. The thickness of 130b must be substantially greater than the thickness of the light guide plate 130 in the visible region 130a. It should be understood that the aforementioned thickness may be the shortest linear distance between the second light exit surface 132 and the bottom surface 134. Further, the thickness of the light guide plate 130 in the invisible area 130b may gradually decrease toward the light incident surface 136, but is not limited thereto.

此外,電路板110的一端部116嵌入於導光板130的凹陷部138,且發光單元120的第一出光面122抵接於導光板130的入光面136,同時地,電路板110的第二面114位於第一面112與凹陷部138的第二內表面138b之間。在電路板110的一端部116嵌入於導光板130的凹陷部138時,電路板110的第一面112可直接地貼合於凹陷部138的第一內表面138a,使得電路板110的第一面112與導光板130之間不存在額外的介質,也就是說,電路板110的第一面112與導光板130之間不存在習知技術中會影響進入導光板130內的光線的輝度的介質,如雙面膠,黏著劑等。 In addition, the one end portion 116 of the circuit board 110 is embedded in the recessed portion 138 of the light guide plate 130, and the first light emitting surface 122 of the light emitting unit 120 abuts the light incident surface 136 of the light guide plate 130, and at the same time, the second portion of the circuit board 110 The face 114 is located between the first face 112 and the second inner surface 138b of the recess 138. When the one end portion 116 of the circuit board 110 is embedded in the recess portion 138 of the light guide plate 130, the first surface 112 of the circuit board 110 can directly fit on the first inner surface 138a of the recess portion 138, so that the first surface of the circuit board 110 There is no additional medium between the surface 112 and the light guide plate 130. That is, there is no brightness between the first surface 112 of the circuit board 110 and the light guide plate 130 that affects the light entering the light guide plate 130. Medium, such as double-sided tape, adhesive, etc.

在本實施例中,導光板130的入光面136完整地覆蓋發光單元120的第一出光面122,同時,由於電路板110的第一面112可直接地貼合於凹陷部138的第一內表面138a,使得電路板110的第一面112與導光板130之間不存在習知技術中存在的間隙,是故,導光板130的入光面136與發光單元120的第一出光面122可完全耦合,使得自第一出光面122發出的光線可完整地進入導光板130的入光面136。 In this embodiment, the light incident surface 136 of the light guide plate 130 completely covers the first light emitting surface 122 of the light emitting unit 120, and at the same time, since the first surface 112 of the circuit board 110 can directly adhere to the first portion of the recessed portion 138 The inner surface 138a is such that there is no gap existing between the first surface 112 of the circuit board 110 and the light guide plate 130. Therefore, the light incident surface 136 of the light guide plate 130 and the first light exit surface 122 of the light emitting unit 120 It can be fully coupled, so that the light emitted from the first light-emitting surface 122 can completely enter the light-incident surface 136 of the light guide plate 130.

在本實施例中,第一出光面122的頂邊122a切齊入光面136的頂邊136a,但不以此為限。在其他實施例中,入光面的頂邊可高於第一出光面的頂邊。應了解到,前述的入光面136的頂邊136a及第一出光面122的頂邊122a為入 光面136及第一出光面122遠離電路板110的一邊。 In this embodiment, the top edge 122a of the first light-emitting surface 122 is cut into the top edge 136a of the light-incident surface 136, but is not limited thereto. In other embodiments, the top edge of the light incident surface may be higher than the top edge of the first light exit surface. It should be understood that the top edge 136a of the light incident surface 136 and the top edge 122a of the first light exit surface 122 are The smooth surface 136 and the first light exit surface 122 are away from one side of the circuit board 110.

在本實施例中,背光模組100還包含膠體140,設置於電路板110的第二面114與凹陷部138的第二內表面138b之間,膠體140可黏合電路板110的第二面114與凹陷部138的第二內表面138b,而將電路板110及導光板130彼此黏合固定。在本實施例中,膠體140可為一雙面膠帶或膠水等黏著劑,但不以此為限。此外,在其他實施例中,凹陷部138與電路板110形成腔體139,當膠體140為一液狀黏膠時,腔體139可容置電路板110及導光板130彼此黏合時所溢出的膠體140,但不以此為限。 In this embodiment, the backlight module 100 further includes a colloid 140 disposed between the second surface 114 of the circuit board 110 and the second inner surface 138b of the recess 138. The colloid 140 can be bonded to the second surface 114 of the circuit board 110. The circuit board 110 and the light guide plate 130 are bonded to each other and the second inner surface 138b of the recessed portion 138. In this embodiment, the adhesive 140 can be an adhesive such as a double-sided tape or glue, but is not limited thereto. In addition, in other embodiments, the recessed portion 138 and the circuit board 110 form a cavity 139. When the colloid 140 is a liquid adhesive, the cavity 139 can accommodate the overflow of the circuit board 110 and the light guide plate 130 when they are bonded to each other. Colloid 140, but not limited to this.

另外,電路板110及導光板130不限定僅可以膠體140黏合的方式固定。在一些實施例中,請參照圖3,繪示依照本發明另一實施例的背光模組的俯視圖。如圖3所示,本實施例的背光模組200可包含固定件150,且可不設置前述實施例的背光模組100的膠體140,固定件150可將電路板110的一端部116固定於凹陷部138內。舉例來說,固定件150可為一螺絲,在電路板110的一端部116嵌入導光板130的凹陷部138內後,固定件150可將電路板110的一端部116鎖固於導光板130的凹陷部138內,或是利用卡扣等方式鎖固,但不以此為限。進一步的說,本實施的固定件150的數量為二且分別設置於鄰近導光板130的入光面136的相對二邊角131的位置,但不以此為限。在其他實施例中,固定件150的數量可僅為一個。 In addition, the circuit board 110 and the light guide plate 130 are not limited to be fixed only by the bonding of the colloid 140. In some embodiments, referring to FIG. 3, a top view of a backlight module in accordance with another embodiment of the present invention is illustrated. As shown in FIG. 3, the backlight module 200 of the present embodiment may include a fixing member 150, and the colloid 140 of the backlight module 100 of the foregoing embodiment may not be disposed. The fixing member 150 may fix one end portion 116 of the circuit board 110 to the recess. In section 138. For example, the fixing member 150 can be a screw. After the one end portion 116 of the circuit board 110 is embedded in the recess portion 138 of the light guide plate 130, the fixing member 150 can lock the one end portion 116 of the circuit board 110 to the light guide plate 130. The recessed portion 138 is locked by a buckle or the like, but is not limited thereto. Further, the number of the fixing members 150 of the present embodiment is two, and is disposed at a position adjacent to the opposite two corners 131 of the light incident surface 136 of the light guide plate 130, but is not limited thereto. In other embodiments, the number of fasteners 150 can be only one.

請參照圖4及圖5,圖4係繪示依照本發明再一實施例的背光模組的俯視圖。圖5係繪示依照圖4的背光模組沿剖面線B-B’的剖視圖。如圖4及圖5所示,應了解到, 本實施例的背光模組300與圖1及圖2所示的實施例的背光模組100的構件大致相同,主要差異在於本實施例的背光模組300還包含框體160,框體160可容置發光單元120、電路板110及導光板130,其中框體160具有承載部162,其中承載部162的頂面162a可承載電路板110的第二面114,且承載部162的一側面162b可抵接於導光板130的入光面136。詳細而言,承載部160的側面162b可抵接於導光板130的凹陷部138與底面134之間的入光面136,而可增加背光模組300整體組裝完成後的穩固性並可增加背光模組300組裝時的便利性,但不以此為限。在本實施例中,承載部162可設置於框體160形成的容置空間內部,但不以此為限。於本實施例中,背光模組300更包含一反射片170,其中反射片170係設置於導光板130與框體160之間。於一實施例中,反射片170可係僅設置於導光板130的底面134與框體160之間。於另一實施例中,反射片170除了設置於導光板130的底面134與框體160之間,更朝向發光單元120延伸以作為發光單元120的反射燈罩。 Please refer to FIG. 4 and FIG. 5. FIG. 4 is a top view of a backlight module according to still another embodiment of the present invention. Figure 5 is a cross-sectional view of the backlight module of Figure 4 taken along section line B-B'. As shown in Figure 4 and Figure 5, it should be understood that The backlight module 300 of the embodiment is substantially the same as the backlight module 100 of the embodiment shown in FIG. 1 and FIG. 2 . The main difference is that the backlight module 300 of the embodiment further includes a frame 160 , and the frame 160 can be The light emitting unit 120, the circuit board 110 and the light guide plate 130 are accommodated, wherein the frame body 160 has a carrying portion 162, wherein the top surface 162a of the carrying portion 162 can carry the second surface 114 of the circuit board 110, and a side surface 162b of the carrying portion 162 The light incident surface 136 of the light guide plate 130 can be abutted. In detail, the side surface 162b of the carrying portion 160 can abut the light incident surface 136 between the recessed portion 138 and the bottom surface 134 of the light guide plate 130, thereby increasing the stability of the backlight module 300 after the assembly of the entire backlight module 300 and increasing the backlight. The convenience of assembling the module 300 is not limited thereto. In this embodiment, the carrying portion 162 can be disposed inside the accommodating space formed by the frame 160, but is not limited thereto. In this embodiment, the backlight module 300 further includes a reflective sheet 170, wherein the reflective sheet 170 is disposed between the light guide plate 130 and the frame 160. In one embodiment, the reflective sheet 170 can be disposed only between the bottom surface 134 of the light guide plate 130 and the frame 160. In another embodiment, the reflective sheet 170 is disposed between the bottom surface 134 of the light guide plate 130 and the frame 160, and further extends toward the light emitting unit 120 to serve as a reflector of the light emitting unit 120.

本發明實施例所述之背光模組的電路板可嵌入於導光板的凹陷部,使得配置發光單元的電路板的第一面直接地接觸於導光板的底面且導光板的入光面可抵接於發光單元的入光面,因此,導光板的底面與電路板的第一面之間不存在影響光線輝度的介質,而可保持發光單元發出的光線進入導光板內的整體輝度。另一方面,將承載發光單元的電路板嵌入於導光板的凹陷部後,僅需將導光板的入光面抵接於發光單元的第一出光面並固定電路板於導光板的凹陷部,即可完成背光模組的組裝,是故,本發明實施例的背光模組還 具有避免固定電路板及導光板時產生發光單元與導光板之間的間隙的問題,還具有組裝簡單的優點。 The circuit board of the backlight module of the embodiment of the present invention can be embedded in the recessed portion of the light guide plate, so that the first surface of the circuit board on which the light emitting unit is disposed directly contacts the bottom surface of the light guide plate and the light incident surface of the light guide plate can be abutted It is connected to the light incident surface of the light emitting unit. Therefore, there is no medium affecting the light intensity between the bottom surface of the light guide plate and the first surface of the circuit board, and the light emitted by the light emitting unit can be kept into the overall brightness of the light guide plate. On the other hand, after the circuit board carrying the light-emitting unit is embedded in the recessed portion of the light guide plate, the light-incident surface of the light guide plate needs to be abutted on the first light-emitting surface of the light-emitting unit and the circuit board is fixed on the recessed portion of the light guide plate. The assembly of the backlight module can be completed. Therefore, the backlight module of the embodiment of the present invention further The problem of avoiding the gap between the light-emitting unit and the light guide plate when the circuit board and the light guide plate are fixed is also provided, and the assembly is simple.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。此外,本說明書或申請專利範圍中提及的“第一”、“第二”等用語僅用以命名元件(element)的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. In addition, the terms "first", "second" and the like mentioned in the specification or the scope of the claims are only used to name the elements or distinguish different embodiments or ranges, and are not intended to limit the number of elements. Upper or lower limit.

100‧‧‧背光模組 100‧‧‧Backlight module

110‧‧‧電路板 110‧‧‧Circuit board

112‧‧‧第一面 112‧‧‧ first side

114‧‧‧第二面 114‧‧‧ second side

116‧‧‧端部 116‧‧‧End

120‧‧‧發光單元 120‧‧‧Lighting unit

122‧‧‧第一出光面 122‧‧‧The first glazing

122a‧‧‧頂邊 122a‧‧‧ top side

130‧‧‧導光板 130‧‧‧Light guide plate

130a‧‧‧可視區 130a‧‧ visible area

130b‧‧‧不可視區 130b‧‧‧Invisible area

132‧‧‧第二出光面 132‧‧‧Second glazing

132a‧‧‧反射結構組合 132a‧‧‧Reflective structure combination

134‧‧‧底面 134‧‧‧ bottom

136‧‧‧入光面 136‧‧‧Into the glossy surface

136a‧‧‧頂邊 136a‧‧‧ top side

138‧‧‧凹陷部 138‧‧‧Depression

138a‧‧‧第一內表面 138a‧‧‧First inner surface

138b‧‧‧第二內表面 138b‧‧‧Second inner surface

138c‧‧‧第三內表面 138c‧‧‧ third inner surface

139‧‧‧腔體 139‧‧‧ cavity

140‧‧‧膠體 140‧‧‧colloid

d1‧‧‧第一間距 D1‧‧‧first spacing

d2‧‧‧第二間距 D2‧‧‧second spacing

θ‧‧‧鈍角 Θ‧‧‧oblate angle

Claims (11)

一種背光模組,包括:一電路板,具有相對的一第一面及一第二面;至少一發光單元,配置於該電路板的該第一面,該發光單元具有一第一出光面,用以發出一光線;以及一導光板,包括:一第二出光面;一底面,相對該第二出光面設置;以及一入光面,連接該第二出光面與該底面,該入光面具有一凹陷部,且該凹陷部凹入於該入光面,該凹陷部與該第二出光面和該底面之間分別具有一間距;其中該電路板一端部嵌入於該凹陷部,且該發光單元的該第一出光面抵接於該入光面。 A backlight module includes: a circuit board having an opposite first surface and a second surface; at least one light emitting unit disposed on the first surface of the circuit board, the light emitting unit having a first light emitting surface, And a light guide plate, comprising: a second light emitting surface; a bottom surface disposed opposite to the second light emitting surface; and a light incident surface connecting the second light emitting surface and the bottom surface, the light incident surface Having a recessed portion, and the recessed portion is recessed in the light incident surface, the recessed portion and the second light exiting surface and the bottom surface respectively have a spacing; wherein one end portion of the circuit board is embedded in the recessed portion, and the The first light-emitting surface of the light-emitting unit abuts on the light-incident surface. 如申請專利範圍第1項所述之背光模組,其中該凹陷部具有相對的一第一內表面及一第二內表面,且該第二內表面位於該第一內表面與該底面之間,該電路板的該第二面位於該第一面與該凹陷部的該第二內表面之間。 The backlight module of claim 1, wherein the recess has a first inner surface and a second inner surface, and the second inner surface is located between the first inner surface and the bottom surface The second face of the circuit board is between the first face and the second inner surface of the recess. 如申請專利範圍第2項所述之背光模組,還包含一膠體,設置於該電路板的該第二面與該凹陷部的該第二內表面之間。 The backlight module of claim 2, further comprising a colloid disposed between the second surface of the circuit board and the second inner surface of the recess. 如申請專利範圍第1項所述之背光模組,還包含至少一固定件,將該電路板的該端部固定於該凹陷部內。 The backlight module of claim 1, further comprising at least one fixing member, the end portion of the circuit board being fixed in the recess. 如申請專利範圍第1項所述之背光模組,其中該導光 板的該入光面完整地覆蓋該發光單元的該第一出光面。 The backlight module of claim 1, wherein the light guide The light incident surface of the panel completely covers the first light exiting surface of the light emitting unit. 申請專利範圍第1項所述之背光模組,其中該凹陷部與該電路板形成一腔體。 The backlight module of claim 1, wherein the recess forms a cavity with the circuit board. 如申請專利範圍第1項所述之背光模組,還包含一框體,用以容置該發光單元、該電路板及該導光板,其中該框體具有一承載部,該承載部承載該電路板。 The backlight module of claim 1, further comprising a frame for accommodating the light emitting unit, the circuit board and the light guide plate, wherein the frame body has a carrying portion, and the carrying portion carries the Circuit board. 如申請專利範圍第7項所述之背光模組,其中該承載部抵接於該導光板的該入光面。 The backlight module of claim 7, wherein the bearing portion abuts the light incident surface of the light guide plate. 申請專利範圍第2項所述之背光模組,其中該凹陷部還具有一第三內表面,該第三內表面分別連接該第一內表面及該第二內表面,該第三內表面與該第二內表面形成一鈍角。 The backlight module of claim 2, wherein the recess has a third inner surface, the third inner surface connecting the first inner surface and the second inner surface, respectively, the third inner surface and The second inner surface forms an obtuse angle. 如申請專利範圍第1項所述之背光模組,其中該導光板形成一可視區與一不可視區,該凹陷部位於該不可視區內。 The backlight module of claim 1, wherein the light guide plate forms a visible area and an invisible area, and the recessed portion is located in the invisible area. 如申請專利範圍第10項所述之背光模組,其中該第二出光面位於該不可視區具有一反射結構組合。 The backlight module of claim 10, wherein the second light exiting surface has a reflective structure combination in the invisible area.
TW104129227A 2015-09-03 2015-09-03 Backlight module TWI545378B (en)

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