TWI543277B - Packaging fixture - Google Patents

Description

Packing fixture

The present invention relates to a fixture, and more particularly to a package fixture.

After flipping the wafer, the flip chip packaging technology that bonds the flip chip to the substrate in a face-down manner has been widely used in components requiring high performance, high speed and high density, and small package size.

With the trend toward miniaturization and thinning of semiconductor devices, the thickness of the substrate is continuously thinned, and the spacing between the metal contacts for electrically connecting the wafer and the substrate is also gradually reduced. Therefore, in the process of flip chip bonding, the substrate is easily warped and deformed by external force or heat. If the amount of deformation of the substrate cannot be effectively controlled, the electrical contact between the flip chip and the substrate is likely to be ineffective. Bonding creates a non-contact condition, which is undoubtedly a major influence on the yield and reliability of the package.

The present invention provides a package jig that contributes to improved yield and reliability of a semiconductor package.

The invention provides a package fixture comprising a fixing seat, an air suction device and a gas valve. The mount is adapted to secure the substrate such that the plurality of wafers are respectively bonded to the plurality of crystallographic regions on the substrate. The fixing base has a groove, a first communication hole, a second communication hole and a plurality of third communication holes, wherein the first communication hole and the second communication hole communicate with the third communication holes. Each of the third communication holes is located in the corresponding crystal region, and the trench surrounds the periphery of each of the crystal regions. The air suction device is connected to the first communication hole. The gas valve is connected to the second communication hole.

In an embodiment of the invention, the fixing base further has at least one passage communicating with the first communication hole, the second communication hole and the third communication hole to form a cavity in the fixing seat.

In an embodiment of the invention, the air suction device includes a housing, an elastic member, and a seal. The housing is detachably assembled to the fixing seat and covers the first communication hole. The resilient member has opposing first and second ends, wherein the first end abuts the housing. The seal connects the second end of the elastic member and is adapted to be moved in or out of the first communication hole by the elastic member.

In an embodiment of the invention, when the air extracting device evacuates the chamber, the air valve is closed, the sealing member moves out of the first communication hole to discharge the gas in the chamber, and the elastic member is compressed to store the elastic position. can.

In an embodiment of the invention, when the air suction device stops pumping the chamber, the elastic position of the elastic member can be released to drive the seal into the first communication hole.

In an embodiment of the invention, the fixing base further has a recess connecting the groove and the third communication hole. The substrate is adapted to be received in the recess and to cover the trench and the third communication holes.

In an embodiment of the invention, the contour of the recess is complementary to the contour of the substrate.

In an embodiment of the invention, the trench has a plurality of longitudinal grooves and a plurality of lateral grooves that are staggered with each other. These third communication holes are located between any two adjacent longitudinal grooves and between any two adjacent lateral grooves.

In an embodiment of the invention, the orthographic projection of the wafer on the substrate overlaps with the orthographic projection of the third via in the corresponding crystal region on the substrate, and the orthographic projection of each wafer on the substrate falls in correspondence In the crystal zone.

Based on the above, the package jig of the present invention can fix the substrate flatly on the fixing seat by means of vacuum adsorption. Therefore, when the wafer-substrate bonding process is performed, the substrate is less susceptible to warping deformation due to external force or heat, so that The electrical contacts of the flip chip and the substrate can be effectively bonded without the occurrence of void soldering, thereby improving the yield and reliability of the semiconductor package.

On the other hand, the wafer is bonded to the crystal region on the substrate, wherein the trench surrounds the periphery of the crystal region, and the wafer does not extend beyond the corresponding crystal region, so after completing the subsequent wafer and substrate packaging process The singulation process can be performed along the trench without damage to the wafer, the circuit on the substrate, and the connection between the wafer and the substrate, thereby improving the efficiency and yield of the packaging process.

In order to make the above features and advantages of the present invention more apparent, the following is a special The embodiments are described in detail below in conjunction with the drawings.

10‧‧‧Substrate

11‧‧‧Setting area

20‧‧‧ wafer

21‧‧‧Flip-coated bumps

100‧‧‧Package fixture

110‧‧‧ fixed seat

110a‧‧‧室

111‧‧‧ trench

111a‧‧‧Longitudinal groove

111b‧‧‧lateral trench

112‧‧‧ first connecting hole

113‧‧‧second connecting hole

114‧‧‧ third connecting hole

115‧‧‧ channel

116‧‧‧ dent

120‧‧‧Exhaust device

121‧‧‧Shell

122‧‧‧Flexible parts

122a‧‧‧First end

122b‧‧‧second end

123‧‧‧Seal

130‧‧‧ gas valve

1 is a top plan view of a package jig according to an embodiment of the present invention.

2 is a top plan view showing the substrate after being fixed to the package fixture of FIG. 1.

Figure 3 is a cross-sectional view taken along line I-I of Figure 2;

4A to 4C are schematic views showing the operation of the air suction device of FIG. 3 for vacuuming the fixed seat.

1 is a top plan view of a package jig according to an embodiment of the present invention. 2 is a top plan view showing the substrate after being fixed to the package fixture of FIG. 1. Figure 3 is a cross-sectional view taken along line I-I of Figure 2; Referring to FIG. 1 to FIG. 3 , in the embodiment, the package jig 100 includes a fixing base 110 , an air extracting device 120 , and a gas valve 130 , wherein the fixing base 110 is adapted to fix the substrate 10 to respectively engage the plurality of wafers 20 . In a plurality of crystallizing regions 11 on the substrate 10.

The fixing base 110 has a groove 111, a first communication hole 112, a second communication hole 113, a plurality of third communication holes 114, and at least one channel 115 (a plurality of FIGS. 1 and 2 are schematically illustrated), wherein A communication hole 112, a second communication hole 113, and the third communication holes 114 communicate with each other through the passages 115 to form a chamber 110a in the fixing base 110. Generally, the mount 110 can be injection molded or mechanically added. It is fabricated by means of work, etc., wherein the fixing base 110 further has a recess 116. Moreover, since the outline of the recess 116 is complementary to the contour of the substrate 10, and the outline of the recess 116 is, for example, slightly larger than the outline of the substrate 10, when the substrate 10 is placed on the mount 110, the substrate 10 can be accommodated in the recess 116. The inner portion is fixed to the fixing base 110.

On the other hand, the recess 116 connects the trench 111 and the third via holes 114. In other words, the trenches 111 and the third via holes 114 are exposed to the recesses 116. However, after the substrate 10 is received in the recesses 116, the trenches 111 and the third via holes 114 are covered by the substrate 10. Generally, the substrate 10 may be a circuit substrate, such as a BT laminated substrate, an FR-4 substrate, an FR-5 substrate, a ceramic substrate, or a polyimide substrate, wherein each of the wafers 20 is permeable. The manner of crystal bonding is electrically connected to electrical contacts (not shown) in the corresponding crystallizing regions 11 , and each of the third via holes 114 is located in the corresponding crystal region 11 . Here, four third communication holes 114 are disposed in each of the crystallizing regions 11 as an example, but the invention is not limited thereto, and the number of the third communication holes 114 provided in each of the crystallizing regions 11 is not limited thereto. Adjusted depending on actual needs.

As shown in FIG. 1, the trench 111 surrounds the periphery of each of the crystallizing regions 11, wherein the trench 111 may have a plurality of longitudinal trenches 111a and a plurality of lateral trenches 111b interlaced with each other, and the third via holes 114 are located Any two adjacent longitudinal grooves 111a and between any two adjacent lateral grooves 111b. In other words, the crystallographic regions 11 on the substrate 10 are substantially coincident with the rectangular trenches 111a that are staggered with each other and the rectangular trenches defined by the lateral trenches 111b on the mount 110. That is, each of the crystallizing regions 11 has a rectangular shape, but the invention is not limited thereto.

On the other hand, as shown in FIG. 2 and FIG. 3, after the wafer 20 is bonded into the corresponding crystallizing region 11, the orthographic projection of each wafer 20 on the substrate 10 and the third via hole in the corresponding crystallizing region 11 are formed. The orthographic projections on the substrate 10 overlap, and the orthographic projection of each wafer 20 on the substrate 10 falls within the corresponding crystallographic region 11. That is, the size of each of the wafers 20 is, for example, slightly smaller than the size of the corresponding crystallizing region 11. Since the trenches 111 surround the periphery of the crystallizing region 11 and the respective wafers 20 are not beyond the corresponding crystallizing regions 11, after the subsequent packaging process of the wafer 20 and the substrate 10 is completed, the trenches 111 can be along the trenches 111. The singulation process is performed without causing damage to the wafer 20, the wiring on the substrate 10 (not shown), and the connection relationship between the wafer 20 and the substrate 10, thereby improving the efficiency and yield of the packaging process.

With reference to FIG. 1 to FIG. 3 , in the present embodiment, the air extracting device 120 is connected to the first communication hole 112 , for example, and the gas valve 130 is connected to the second communication hole 113 , for example. The air pumping device 120 is, for example, a vacuum pump, and may include a housing 121, an elastic member 122, and a sealing member 123. The housing 121 is detachably assembled to the fixing base 110 and is adapted to cover the first communication hole 112. In order to facilitate the vacuum pumping. The resilient member 122 is, for example, a compression spring or other suitable resilient member having opposing first and second ends 122a, 122b, wherein the first end 122a of the resilient member 122 abuts the housing 121 and is second The end portion 122b is connected to the seal 123. Here, the sealing member 123 is, for example, a plug made of rubber or other suitable material, and is adapted to be moved in or out of the first communication hole 112 by the elastic member 122.

4A to 4C are schematic views showing the operation of the air suction device of FIG. 3 for vacuuming the fixed seat. First, referring to FIG. 4A, the wafer 20 is bonded to the substrate 10 Prior to the above, the substrate 10 is first placed in the recess 116 of the mount 110. At this time, the trench 111 and the third communication holes 114 are covered by the substrate 10. Next, the air extracting device 120 is assembled to the substrate 10 with the casing 121, and covers the first communication hole 112. Thereafter, the gas valve 130 is closed to perform the action of the real pumping. Since the gas in the chamber 110a is discharged from the first communication hole 112 to the chamber 110a, the elastic member 122 is compressed by the gas to be compressed. The seal 123 is moved out of the first communication hole 112 to discharge the gas outside the chamber 110a.

For example, the package jig 100 can further be provided with a gas pressure detector (not shown) in the chamber 110a for detecting the air pressure value in the chamber 110a. Therefore, when the air pressure detector (not shown) detects that the air pressure value in the chamber 110a approaches vacuum or reaches a vacuum, the air extracting device 120 immediately stops the pumping action. At this time, since the elastic member 122 is no longer pushed by the gas, the elastic position stored by the compressed elastic member 122 can be released to drive the sealing member 123 into the first communication hole 112, as shown in FIG. 4B. .

Finally, after the sealing member 123 is tightly packed in the first communication hole 112, the outside air cannot easily penetrate into the chamber 110a via the first communication hole 112, thereby effectively maintaining the vacuum state in the chamber 110a. In turn, the substrate 10 can be flatly fixed to the fixing base 110. As shown in FIG. 2, since the substrate 10 can be vacuum-adsorbed to the fixing base 110 in a flat manner, when the bonding process of the wafer 20 and the substrate 10 is performed, the substrate 10 is not easily affected by external force or heat and warped and deformed. The electrical contacts (not shown) of the crystal bumps 21 and the substrate 10 can be effectively bonded without the occurrence of void soldering, thereby improving the yield and reliability of the semiconductor package.

It is worth mentioning that since the air extracting device 120 of the present embodiment is not fixed on the substrate 110, the air pressure value in the chamber 110a is brought close to the vacuum or the vacuum is reached, and the pumping is stopped to make the sealing member 123 After being tightly packed in the first communication hole 112, a part of the components of the air suction device 120 (for example, the housing 121) may be removed from the substrate 110, but the invention is not limited thereto. On the other hand, after the singulation process is completed, the gas valve 130 may be opened to allow outside air to flow into the chamber 110a. At this time, the pressure value in the chamber 110a will rise back to the outside air pressure, so as to facilitate the pick-up head (not shown) or the suction head (not shown) to remove the singulated package from the fixed seat 110. body.

In summary, the package jig of the present invention can fix the substrate flatly on the fixing seat by means of vacuum adsorption. Therefore, when the wafer-substrate bonding process is performed, the substrate is not easily affected by external force or heat and warp and deform. Therefore, the electrical contacts of the flip chip and the substrate can be effectively bonded without the occurrence of void soldering, thereby improving the yield and reliability of the semiconductor package.

On the other hand, the wafer is bonded to the crystal region on the substrate, wherein the trench surrounds the periphery of the crystal region, and the wafer does not extend beyond the corresponding crystal region, so after completing the subsequent wafer and substrate packaging process The singulation process can be performed along the trench without damage to the wafer, the circuit on the substrate, and the connection between the wafer and the substrate, thereby improving the efficiency and yield of the packaging process.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧Package fixture

110‧‧‧ fixed seat

111‧‧‧ trench

111a‧‧‧Longitudinal groove

111b‧‧‧lateral trench

113‧‧‧second connecting hole

114‧‧‧ third connecting hole

115‧‧‧ channel

116‧‧‧ dent

120‧‧‧Exhaust device

Claims (9)

A package fixture includes: a fixing base adapted to fix a substrate, wherein the plurality of wafers are respectively bonded to the plurality of crystallizing regions on the substrate, the fixing block having a groove and a first communication hole a second communication hole and a plurality of third communication holes, wherein the first communication hole, the second communication hole and the third communication holes communicate with each other, and each of the third communication holes is located in the corresponding crystal region The trench surrounds the periphery of each of the crystallographic regions, and each of the wafers does not extend beyond the corresponding crystallographic region to cut the substrate along the trench; an air extracting device is connected to the first interconnect a hole; and a gas valve connected to the second communication hole. The package fixture of claim 1, wherein the fixing base further has at least one passage connecting the first communication hole, the second communication hole and the third communication holes to be in the fixing seat The inside constitutes a chamber. The package fixture of claim 2, wherein the air suction device comprises: a housing detachably assembled to the fixing base and covering the first communication hole; an elastic member having a first end portion and a second end portion, wherein the first end portion abuts the housing; and a sealing member connecting the second end portion of the elastic member and being adapted to be provided by the elastic member To move in or out of the first communication hole. The package jig of claim 3, wherein when the air extracting device evacuates the chamber, the air valve is closed, and the seal moves out of the first connection The through hole is for discharging the gas in the chamber, and the elastic member is compressed to store an elastic potential energy. The package jig of claim 4, wherein the elastic position of the elastic member is released when the air suction device stops pumping the chamber to drive the seal into the first connection Through hole. The package fixture of claim 1, wherein the fixing base further has a recess connecting the groove and the third communication hole, the substrate is adapted to be received in the recess and cover the groove And the third communication holes. The package jig of claim 6, wherein the recess has a contour that is complementary to a contour of the substrate. The package jig according to claim 1, wherein the groove has a plurality of longitudinal grooves and a plurality of lateral grooves interlaced with each other, and the third communication holes are located at any two adjacent longitudinal grooves Between the slots and between any two adjacent lateral grooves. The package jig of claim 1, wherein the orthographic projection of each of the wafers on the substrate overlaps with an orthographic projection of the third communication holes in the corresponding crystal region on the substrate. And the orthographic projection of each of the wafers on the substrate falls within the corresponding crystallographic region.