TWI542816B - Average temperature luminous diode lamp - Google Patents

Description

Average temperature LED bulb

The invention relates to a uniform temperature light-emitting diode bulb, in particular to a uniform temperature light-emitting diode bulb with a heat source dispersion function and an improved heat dissipation efficiency.

Due to the trend of energy conservation and environmental protection, and the increasing maturity of LED lighting technology, the use of lighting technology using LED as a light source has become increasingly popular.

In the field of conventional LED bulb technology, heat dissipation of LED chips has been a problem that is quite difficult to solve. Conventional LED bulb structures, most of which are mounted on a substrate, and package the substrate together with the LED light-emitting chip in a sealed lamp housing. At the same time, the conventional LED bulb structure has an arrangement in which the LED chips are arranged on the substrate, and most of the LED chips are densely arranged on the substrate in a rectangular, circular or diamond arrangement, so that the LED chips are distributed in the center of the substrate. To the edge position.

The conventional LED bulb structure adopts a configuration in which the LED chips are disposed on the substrate in a concentrated manner, which causes the following problems:

1. Because the position of the LED chip is concentrated, the heat generated by the LED chip will be concentrated in the center position of the substrate, and the LED chip is sealed in the transparent housing, which will cause the LED chip to dissipate heat easily, so that the LED is affected. The life of the wafer.

2. Since the LED chips are concentrated at the center of the substrate, there is no extra space on the substrate on which the LED chips are mounted to install other circuit components, so that the driving circuit of the LED bulb must additionally arrange the mounting position, thereby causing the LED junction. The design is difficult and the overall volume is increased.

Therefore, how to improve the heat dissipation effect of LED bulbs by improving the structural design to overcome the above-mentioned shortcomings has become one of the important topics to be solved in this business.

Embodiments of the present invention provide a uniform temperature light-emitting diode bulb that can avoid temperature concentration of a light-emitting chip, increase heat dissipation efficiency, and improve service life.

The main embodiment of the uniform temperature light-emitting diode bulb of the present invention comprises: a base, a plurality of heat-dissipating fins, a substrate, a plurality of light-emitting chips, a light guiding shell, and a light reflecting layer. The base is a circular plate body, and the base has a front surface and a back surface; one end of the plurality of heat dissipation fins is connected to the back surface of the base, and the other end is connected with a power connector. One side of the substrate abuts against the front side of the base, and the other side has a bearing surface. The heat dissipation fins are disposed on a back surface of the base perpendicular to the base and arranged in a radial arrangement. The plurality of light-emitting wafers are arranged in an annular shape on the periphery of the bearing surface of the substrate, and the position at which each of the light-emitting chips is mounted is aligned with the position at which each of the heat-dissipating fins is connected to the base. The light guide housing is disposed on a front surface of the base. The light guide housing has a semi-spherical shape, and a light-incident surface that covers the surface of the plurality of light-emitting wafers is disposed on a side of the base. And a light reflecting layer disposed on an inner side surface of the light guiding housing. A plurality of the illuminating wafers surround the periphery of the light reflecting layer, and light generated by the plurality of illuminating wafers is generated from the light incident surface of the light guiding housing, and light generated by the plurality of the illuminating wafers is passed through The light incident surface enters the light guide housing such that light generated by the plurality of light emitting wafers is conducted in the light guide housing.

In a main embodiment of the present invention, a driving circuit is further disposed on the substrate carrying surface at a position inside the respective light emitting wafers, and has a protective cover completely covering the driving circuit.

In another embodiment of the present invention, the back surface of the base has an accommodating space, and a driving circuit is received in the accommodating space.

In another embodiment of the present invention, the light diffusing particles are further doped in the light guiding shell, and the microstructure having the light reflecting capability is disposed on the light reflecting layer.

The main effects of the present invention are:

1. The mounting method of the illuminating wafer of the invention enables the heat generated by the illuminating wafer to be evenly distributed on the periphery of the pedestal, avoids the phenomenon of heat concentration, and can improve the heat dissipation efficiency, and is beneficial to the design and arrangement of the heat dissipating structure.

2. The mounting position of the illuminating chip of the present invention is aligned with the position at which each of the heat dissipating fins is connected to the pedestal, so that the heat generated by the illuminating wafer can be conducted to the heat dissipating fins in a straight line direction, thereby improving the heat dissipating efficiency.

3. The present invention cooperates with the light reflecting layer by the light guiding shell, so that the light of the plurality of light emitting chips can be fused to each other to form a complete light source. In addition, the light-transmitting shell can be further doped with light-diffusing particles, and a microstructure having a light-reflecting capability is further disposed on the surface of the light-reflecting layer, thereby improving light guiding and reflection efficiency.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

10‧‧‧ Pedestal

11‧‧‧ Heat sink fins

12‧‧‧Power connector

13‧‧‧Inlet

14‧‧‧Protection tube

15‧‧‧ accommodating space

20‧‧‧Light guide housing

21‧‧‧Into the glossy surface

22‧‧‧Light diffusing particles

T1‧‧‧ thickness

T2‧‧‧ thickness

30‧‧‧reflective layer

31‧‧‧Microstructure

40‧‧‧Substrate

41‧‧‧ bearing surface

50‧‧‧Lighting chip

60‧‧‧ drive circuit

61‧‧‧Protection shell

62‧‧‧ wire

1 is a perspective assembled view of a first embodiment of the present invention.

Figure 2 is an exploded perspective view of the first embodiment of the present invention.

Figure 3 is an exploded perspective view of the first embodiment of the present invention taken from another angle.

Figure 4 is a sectional view showing the combination of the first embodiment of the present invention.

FIG. 5 is a top view of the first embodiment of the present invention in a state in which the light guide housing and the light reflecting layer are removed.

Figure 6 is a perspective view of a susceptor and a heat sink fin used in a second embodiment of the present invention.

Fig. 7 is a top plan view showing a state in which a light guiding case and a light reflecting layer are removed in a second embodiment of the present invention.

Figure 8 is a sectional view showing the combination of a third embodiment of the present invention.

Figure 9 is a partially enlarged cross-sectional view showing a light guiding case and a light reflecting layer according to a fourth embodiment of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 3 , the temperature-sensing LED bulb of the present invention mainly includes a base 10 , a plurality of heat dissipation fins 11 disposed on the back surface of the base 10 , a substrate 40 , and a plurality of The light emitting chip 50, a light guiding shell 20, and a light reflecting layer 30.

In this embodiment, the base 10 is a circular plate body made of aluminum alloy or other high thermal conductivity metal. The front surface of the base 10 is provided with a substrate 40, and one side of the substrate 40 abuts against the front surface of the base 10. The other side has a bearing surface 41. The plurality of the light-emitting wafers 50 are mounted on the bearing surface 41 of the substrate 40, and are arranged in an annular shape on the outer side of the bearing surface 41.

In this embodiment, the substrate 40 is a circular plate having a diameter slightly smaller than the base 10 and abutting against the front surface of the base 10. The substrate 40 can be made of an aluminum alloy or other heat conductive material to enhance the heat dissipation effect of the light emitting wafer 50. In addition to the light-emitting wafer 50, the substrate 40 is provided with circuitry for connecting the respective light-emitting wafers 50, as well as other circuit components.

In this embodiment, the susceptor 10 and the plurality of heat dissipating fins 11 are integrally formed by using aluminum alloy. One end of the plurality of heat dissipating fins 11 is connected to the back of the pedestal 10, and the other end is connected with a power connector 12. In this embodiment, the power connector 12 is a power connector in the form of a screw and is electrically coupled to the conductive traces on the substrate 40 and to the luminescent wafer 50 to provide the ambient temperature LED light source of the present invention.

As shown in FIGS. 2 and 3, the plurality of light-emitting wafers 50 of the present invention are arranged in an annular shape around the substrate 40. The main purpose of arranging the light-emitting wafers 50 of the present invention in this manner is to enable the light-emitting wafers 50 that generate heat sources to be dispersedly disposed close to the outer edges of the substrate 40 and the susceptor 10, so that the heat generated by the luminescent wafers can be evenly distributed. At the periphery of the susceptor 10, the phenomenon of heat concentration is avoided, and since the position at which the luminescent wafer 50 is mounted is distributed at a position near the outer side of the susceptor 10, each of the illuminating wafers 50 has a large pitch therebetween, thereby making the present invention The heat dissipation structure has a large heat dissipation space and area when designed.

As shown in FIG. 4, the light-emitting wafer 50 is mounted on the front surface of the susceptor 10 by the substrate 40, so that the heat generated by the luminescent wafer 50 is transmitted through the substrate 40 and the susceptor 10. The conduction is transmitted to the heat dissipation fins 11 and is brought into contact with the air by the heat dissipation fins to dissipate heat. As shown in FIG. 3, the heat dissipation fins 11 of the present invention are perpendicular to the back surface of the susceptor 10, and are disposed on the back surface of the susceptor 10 in a radial arrangement. Each of the heat radiating fins 11 is spaced apart from each other to form a gap through which the airflow flows. As shown in FIG. 2, in order to improve the heat dissipation effect of the susceptor 10, the susceptor 10 is provided with a plurality of positions from the front surface of the susceptor 10 at a position in the gap between each of the heat dissipation fins 11 and near the outside of the susceptor. The air guiding hole 13 to the back surface of the base allows the air on the front surface of the base to circulate through the air in the gap between the respective heat dissipation fins 11 through the plurality of air guiding holes 13 to improve the heat dissipation effect of the heat dissipation fins.

As shown in FIG. 5, in this embodiment of the present invention, the number of the light-emitting wafers 50 and the number of the heat-dissipating fins 11 are equal, and the plurality of light-emitting wafers 50 are mounted on the substrate 40 at a position connected to each of the heat-dissipating fins 11. The positions of the back surfaces of the susceptor 10 correspond to each other, so that each of the illuminating wafers 50 has a heat radiating fin 11 corresponding to each other, and since the position of each of the light emitting wafers 50 and the position of each of the heat radiating fins 11 correspond to each other, The heat generated by the luminescent wafer 50 can be conducted through the susceptor 10 to the heat dissipating fins 11 in the shortest path to increase the heat dissipation rate of the bulb of the present invention.

As shown in FIG. 1 to FIG. 4, since each of the light-emitting wafers 50 is mounted on the periphery of the substrate 40 in a dispersed manner, the present invention is further utilized in such a manner that light rays individually generated by the respective light-emitting wafers 50 can be fused into a single continuous light source. The light guide housing 20 and the light reflecting layer 30 cooperate with each other to facilitate conducting and mixing the light of the plurality of light emitting wafers 50 into a single light source.

As shown in FIG. 4, the light guide housing 20 used in the present invention is a cover body made of a light-transmissive transparent material (for example, acryl) and having a substantially semi-spherical shape. The light guide housing 20 is mounted on the front surface of the base, and has a light incident surface 21 on the side close to the base 10. The light incident surface is an annular plane surrounding the upper surface of each of the light emitting wafers 50, and each of the light emitting wafers 50 can be completely covered. The light incident surface 21 abuts against the surface of each of the light emitting wafers 50, so that light generated by each of the light emitting wafers 50 can be transmitted from the light incident surface 21 into the interior of the light guide housing 20.

The light guide housing has a recessed interior, and the reflective layer 30 is received in a recessed space inside the light guide housing 20. In this embodiment, the light reflecting layer 30 is a semicircular sphere that can reflect light and is housed inside the light guiding housing 20. The light reflecting layer 30 can be as close as possible to the inner side surface of the light guiding housing 20, so that the gap between the light reflecting layer 30 and the inner side of the light guiding housing 20 is minimized to reduce the loss of light conduction. The light reflecting layer 30 may be an independent component, or may be a reflective material or a reflective layer attached to the inner side surface of the light guiding housing 20 by attaching, coating, plating, vapor deposition or the like.

The light reflecting layer 30 is accommodated between the inner edges of the plurality of light emitting wafers 50 near the side of the susceptor 10. As shown in FIG. 4, after the light generated by the plurality of illuminating wafers 50 is transmitted into the interior of the light guiding housing 20, the light is transmitted along the inner material of the light guiding housing 20 by the conduction of the light guiding housing 20. When light passes through the outer surface of the light guide housing 20, a portion of the light is transmitted out of the outer side of the light guide housing 20, and a portion of the light is reflected back and reflected by the surface of the light guide housing 20. When the light generated by the luminescent wafer 50 touches the surface of the light reflecting layer 30, it is again reflected by the light reflecting layer 30 and is conducted along the light guiding housing 20. Therefore, by the mutual conduction and reflection of the light guiding shell 20 and the light reflecting layer 30, the light generated by each of the light emitting wafers 50 can be mixed with each other to form an integral light source.

One of the features of the light guiding housing 20 of the present invention is that the thickness of the light guiding housing 20 is the thickest at the position of the light incident surface 21, and then gradually becomes thinner toward the top end of the light guiding housing 20. As shown in FIG. 4, the thickness of the light guide housing 20 at one end of the light incident surface 21 is T1, and the thickness of the thinnest portion at the center of the top end of the light guide housing 20 is T2. The light guide housing 20 adopts a structure in which the thickness is gradually thinned from the light incident surface 21 toward the center of the top end, because the light of the light emitting wafer 50 is transmitted inside the light guide housing 20, and the intensity of the light is scattered due to scattering. The factor is gradually weakened, so that the thickness of the light guide housing 20 from the light entrance surface 21 to the center of the top end is thinned by the thickness of the present invention, so that the light guide housing 20 has a central top portion. The thinner thickness allows light to be transmitted to the central tip of the light guide housing 20 to be easily It is revealed here.

The uniform temperature light-emitting diode bulb of the present invention further integrates a driving circuit for driving the plurality of light-emitting wafers 50 into the bulb. In the embodiment shown in FIG. 4, a driving circuit 60 is mounted on the carrying surface 41 of the substrate 40 at a position between the plurality of light emitting wafers 50 and the inner side of the light reflecting layer 30. And a protective case 61, the protective case 61 is accommodated at a position between the plurality of light emitting chips 50 and the inner side of the light reflecting layer 30 and covers the outer side of the driving circuit 60, thereby protecting the driving circuit 60 to increase the average of the present invention. The safety of the use of a light-emitting diode bulb.

The driving circuit 60 is electrically connected between each of the light emitting chips 50 and the power connector 12 to provide a stable current of each of the light emitting chips. In addition, the back surface of the substrate 40 is connected with a protective tube 14 extending through the base 10 and extending to the power connector. The protective tube 14 is internally provided with a wire 62 connected to the power connector 12 and the driving circuit 60, so that the driving circuit and the driving circuit The power connector 12 is electrically connected. By guiding and protecting the protective tube 14, the wire 62 is not easily short-circuited and is not easily damaged by the conduction heat of the susceptor 10 and the heat-dissipating fins 11.

[Second embodiment]

In the first embodiment of the present invention, the position of each of the light-emitting wafers 50 corresponds to the position of each of the heat-dissipating fins 11, but in actual use, the number and mounting position of the light-emitting wafers 50 are not necessarily the same as the heat-dissipating fins 11. Correspondence.

As shown in FIG. 6, in the second embodiment of the present invention, in the second embodiment, a plurality of heat dissipation fins 11 are disposed on the back surface of the base 10. As shown in FIG. 7 , in this embodiment, the number of the heat dissipation fins 11 is greater than the number of the light emitting wafers 50 , so that the position of each of the light emitting wafers 50 and the positions of the plurality of heat dissipation fins 11 are adjacent to each other to achieve better. heat radiation.

[Third embodiment]

As shown in FIG. 8 , a third embodiment of the present invention has an accommodating space 15 between the back surface of the susceptor 10 and each of the heat dissipation fins 11 , and a driving circuit 60 is mounted in the accommodating space 15 . . The driving circuit 60 and the plurality of light emitting wafers 50 are electrically Connected and connected to the power connector 12 by wires 62. The wire is threaded through a protective tube extending from the power connector 12 to the drive circuit 60 such that the wire 62 is not easily short-circuited and is not easily damaged by the conduction heat of the base 10 and the heat dissipation fins 11.

[Fourth embodiment]

As shown in FIG. 4 and FIG. 9 , in the fourth embodiment of the present invention, the fourth embodiment is characterized in that the material of the light guide housing 20 is doped with a plurality of light diffusing particles 22 or is disposed on the surface of the light reflecting layer 30 . The light-reflecting microstructures 31 increase the light-conducting efficiency of the light-guide housing 20 and the light-reflecting layer 30 or increase the uniformity of light diffusion.

The light diffusing particles 22 inside the light guiding casing 20 may employ, for example, metal or metal compound particles having a light reflecting ability. The reflective microstructure 31 on the surface of the reflective layer 30 may be a stepped reflective pattern or a microstructure of tiny protrusions or depressions on the surface of the reflective layer.

[Possible effects of the examples]

In summary, the beneficial effects of the present invention are mainly as follows:

1. The illuminating wafer 50 of the present invention is mounted in such a manner that the heat generated by the illuminating wafer 50 can be uniformly distributed on the periphery of the susceptor 10 to avoid the phenomenon of heat concentration, and since each of the illuminating wafers 50 has a large spacing from each other, The heat dissipation structure of the present invention has a large heat dissipation space and area at the time of design.

2. The mounting position of the light-emitting chip 50 of the present invention is aligned with the position where each of the heat-dissipating fins 11 is connected to the susceptor 10, or each of the light-emitting chips 50 is adjacent to the plurality of heat-dissipating fins 11, so that the heat generated by the luminescent wafer 50 can be generated. It is conducted to the heat dissipation fins 11 in a linear direction, so that heat dissipation efficiency can be improved.

3. The present invention cooperates with the light reflecting layer 30 by the light guiding housing 20, so that the light of the plurality of light emitting chips 50 can be fused to each other to form a complete light source. In addition, the light-diffusing particles 22 may be further doped inside the light-guide housing 20; or the microstructure 31 having the light-reflecting ability may be further disposed on the surface of the light-reflecting layer 30, thereby improving the light diffusion effect.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

10‧‧‧ Pedestal

11‧‧‧ Heat sink fins

12‧‧‧Power connector

14‧‧‧Protection tube

20‧‧‧Light guide housing

21‧‧‧Into the glossy surface

T1‧‧‧ thickness

T2‧‧‧ thickness

30‧‧‧reflective layer

40‧‧‧Substrate

41‧‧‧ bearing surface

50‧‧‧Lighting chip

60‧‧‧ drive circuit

61‧‧‧Protection shell

62‧‧‧ wire

Claims (9)

A uniform temperature light-emitting diode bulb includes: a base, the base is a circular plate body, the base has a front surface and a back surface; a plurality of heat dissipation fins, and the plurality of heat dissipation fins One end is connected to the back of the base; a power connector is disposed on the back of the base and connected to the other end of the plurality of heat dissipation fins; a substrate, a side of the substrate Abutting on a front surface of the pedestal, the other side of the substrate has a bearing surface; a plurality of illuminating wafers, wherein the plurality of illuminating wafers are arranged in an annular shape on a periphery of the bearing surface of the substrate; a light guiding housing, the light guiding housing is disposed on a front surface of the base, and a side of the light guiding housing abutting the base has an inlet covering a plurality of the surface of the light emitting wafer a light reflecting surface; the light reflecting layer is disposed on an inner side surface of the light guiding housing; wherein the plurality of the light emitting wafers surround the light reflecting layer, and the light generated by the plurality of the light emitting wafers Entering into the light guiding housing via the light incident surface, so that a plurality of Said light emitting chip is produced within the conductive housing of the light guide; wherein the reflective layer has a microstructured surface for reflecting light. The uniform temperature light-emitting diode bulb according to claim 1, wherein the thickness of the light guiding shell is gradually reduced from the light-incident surface toward the center of the top end of the light guiding housing. . The uniform temperature light-emitting diode bulb according to claim 2, wherein a plurality of the heat dissipation fins are integrally formed with the base aluminum alloy, and the plurality of heat dissipation fins are Vertically and radially arranged on the back surface of the pedestal; each of the illuminating wafers is mounted at a position corresponding to each of the heat dissipating fins The position of the base. The uniform temperature light-emitting diode bulb according to claim 3, wherein the substrate is an aluminum substrate. The uniform temperature light-emitting diode bulb according to claim 4, wherein the pedestal position is located near the outer side at a position between each of the heat-dissipating fins, and a plurality of positions from the front surface of the susceptor are respectively The flow guiding hole on the back of the base. The uniform temperature LED lamp of claim 5, further comprising: a driving circuit, wherein the driving circuit is connected to the plurality of light emitting chips and the power connector to provide the light emitting chip current; A protective case covering the outer side of the driving circuit. The uniform temperature light-emitting diode bulb according to claim 6, wherein the driving circuit and the protective case are mounted on a surface of the substrate and located at a center of the plurality of light-emitting wafers. The uniform temperature light-emitting diode bulb according to claim 6, wherein the back surface of the base is provided with an accommodating space, and the driving circuit is installed in the accommodating space. The uniform temperature light-emitting diode bulb according to claim 7 or 8, wherein the material of the light guiding housing is doped with a plurality of light diffusing particles.