TWI542410B - A method for preparing nanometer copper-based catalyst - Google Patents

A method for preparing nanometer copper-based catalyst Download PDF

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TWI542410B
TWI542410B TW101122894A TW101122894A TWI542410B TW I542410 B TWI542410 B TW I542410B TW 101122894 A TW101122894 A TW 101122894A TW 101122894 A TW101122894 A TW 101122894A TW I542410 B TWI542410 B TW I542410B
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copper
catalyst
based catalyst
nano copper
nano
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TW201400185A (en
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王詩涵
魏聰揚
甘金相
李文成
梁明在
杜佳簇
吳裕文
李彥勳
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行政院原子能委員會 核能研究所
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奈米銅基觸媒之製備方法 Preparation method of nano copper base catalyst

本發明係有關於一種奈米銅基觸媒之製備方法,尤指涉及一種以溶劑熱法(水熱或醇熱)於低溫反應合成具高轉化率之觸媒,特別係指可用於分解氨氣之奈米銅基觸媒。 The invention relates to a preparation method of a nano copper-based catalyst, in particular to a catalyst with high conversion rate synthesized by a solvothermal method (hydrothermal or alcoholic heat) at a low temperature reaction, in particular, it can be used for decomposing ammonia. Gas nano-copper based catalyst.

氨氣常見於各種工業廢氣中,會造成臭味與空氣污染,常使用之解決辦法為分解法,將氨氣分解為氮氣(N2)及氫氣(H2),但氫氣之產生會有安全上之顧慮。 Ammonia is common in various industrial waste gases, causing odor and air pollution. The commonly used solution is decomposition, which decomposes ammonia into nitrogen (N 2 ) and hydrogen (H 2 ), but the production of hydrogen is safe. Concerns.

另種常見之解決方法為氧化分解法,可使用具有選擇性之觸媒Pt/CuO/Al2O3,用於氨氣氧化過程,此過程會產生氮氣及水為主之蒸汽,雖然只需將水移除,即可完成去毒化及減容之效果,但於生成氮氣之同時,氮氣會繼續氧化成一氧化氮(NO)或二氧化氮(NO2),此二者會造成空氣污染,且製成觸媒Pt/CuO/Al2O3,其成本耗費較高,於環保及經濟上較不符合需求。 Another common solution is oxidative decomposition. A selective catalyst Pt/CuO/Al 2 O 3 can be used for the ammonia oxidation process, which produces nitrogen and water-based steam, although only By removing the water, the effect of detoxification and volume reduction can be achieved, but while nitrogen is generated, nitrogen will continue to oxidize to form nitric oxide (NO) or nitrogen dioxide (NO 2 ), which will cause air pollution. Moreover, the catalyst Pt/CuO/Al 2 O 3 is formed , which is costly and economically and economically incompatible with the demand.

上述方式,皆有不符合解決需求之處。常用之處理法以觸媒居多,因此,若能使用具有安全性、高選擇性、高轉化率及低製備成本之觸媒,最具發展潛力。 All of the above methods are not in line with the needs of the solution. The commonly used treatment method is mostly catalyst, so if it can use the catalyst with safety, high selectivity, high conversion rate and low preparation cost, it has the most development potential.

Sobczyk等人(Sobczyk,D.P.,Hensen,E.J.M.,de Jong,A.M.,van Santen,R.A.,"Low-temperature Ammonia Oxidation over Pt/gamma-alumina:the Influence of the Alumina Support",Top.Catal.,23,109(2003))及Gang等人(Gang,L.,Anderson,B.G.,van Grondelle,J.,van Santen,R.A.,van Gennip,W.J.H.,Niemantsverdriet,J.W.,Kooyman,P.J.,Knoester,A.,"Brongersma,H.H.Alumina-Supported Cu-Ag Catalysts for Ammonia Oxidation to Nitrogen at Low Temperature",J Catal,206,60(2002).)使用貴金屬鉑(Pt)、鈀(Pd)、釕(Ru)、銥(Ir)及銀(Ag)為觸媒,此類之觸媒活性高,可於較低溫度進行催化反應,但N2選擇性80%較差,且常有氮氧化物(NOx)生成,容易污染環境,又觸媒之製備成本高不符合經濟效益。 Sobczyk et al. (Sobczyk, DP, Hensen, EJM, de Jong, AM, van Santen, RA, "Low-temperature Ammonia Oxidation over Pt/gamma-alumina: the Influence of the Alumina Support", Top. Catal., 23, 109 ( 2003)) and Gang et al. (Gang, L., Anderson, BG, van Grondelle, J., van Santen, RA, van Gennip, WJH, Niemantsverdriet, JW, Kooyman, PJ, Knoester, A., "Brongersma, HHAlumina -Supported Cu-Ag Catalysts for Ammonia Oxidation to Nitrogen at Low Temperature", J Catal, 206, 60 (2002).) Use of noble metals platinum (Pt), palladium (Pd), ruthenium (Ru), iridium (Ir) and silver (Ag) is a catalyst. Such catalysts have high activity and can carry out catalytic reactions at lower temperatures, but N 2 selectivity is 80% poor, and nitrogen oxides (NOx) are often formed, which easily pollutes the environment and touches The high cost of preparation of the media is not economical.

中華民國專利第I237064號,使用奈米碳管並負載金屬觸媒,該觸媒含貴金屬及合金,於製程中須含有沉澱劑與還原劑,且於製備時,奈米碳管需於反應溫度400~600℃內合成,最後沉積金屬粒子亦需以350~500℃去除高分子及有機溶劑。該製備程序繁複,耗能亦較高,於經濟上較不符合節能需求。 The Republic of China Patent No. I237064 uses a carbon nanotube and is loaded with a metal catalyst. The catalyst contains precious metals and alloys, and must contain a precipitating agent and a reducing agent in the process, and the carbon nanotubes need to be at a reaction temperature of 400 during preparation. It is synthesized at ~600 °C, and finally the metal particles are deposited at 350~500 °C to remove the polymer and organic solvent. The preparation process is complicated, the energy consumption is also high, and it is economically inferior to the energy saving demand.

另外,中華民國專利第I259782號,係使用活性碳纖維、爐石或爐石粉做為多孔隙擔體,該擔體以銅金屬或銅氧化物為活性中心,製程上採離子交換法及煅燒法進行觸媒之製備,但於離子交換法後需進行24小時以上之乾燥程序;另煅燒法需使用惰性氣體於氣體流速150~250ml/min,進行4小時以上。而於氨氣分解之效果可達90%,但N22選擇性為85%,仍有生成氮之氧化物之疑慮。 故,一般習用者係無法符合使用者於實際使用時之所需。 In addition, the Republic of China Patent No. I259782 uses activated carbon fiber, hearth or hearth powder as a porous support, and the support is made of copper metal or copper oxide as an active center, and the process is carried out by ion exchange method and calcination method. The catalyst is prepared, but it needs to be dried for more than 24 hours after the ion exchange method; the other calcination method is carried out by using an inert gas at a gas flow rate of 150 to 250 ml/min for more than 4 hours. The effect of ammonia decomposition can reach 90%, but the selectivity of N 22 is 85%, and there are still doubts about the formation of nitrogen oxides. Therefore, the general practitioners cannot meet the needs of the user in actual use.

本發明之主要目的係在於,克服習知技藝所遭遇之上述問題並提供一種以溶劑熱法(水熱或醇熱)於低溫反應合成具高轉化率並可用於分解氨氣之奈米銅基觸媒。 The main object of the present invention is to overcome the above problems encountered in the prior art and to provide a nano-copper base which has a high conversion rate and can be used for decomposing ammonia gas by a solvothermal method (hydrothermal or alcoholic heat) at a low temperature reaction. catalyst.

本發明之次要目的係在於,提供一種以超臨界流體或次臨界流體之狀態下將該奈米銅沉積於多孔性氧化物表面之方法。 A secondary object of the present invention is to provide a method of depositing the nano copper on the surface of a porous oxide in the state of a supercritical fluid or a subcritical fluid.

本發明之另一目的係在於,提供一種以超臨界流體或次臨界流體配合溶劑熱法(水熱或醇熱),將奈米級之銅沉積在氧化鋁擔體上,增加奈米銅於氧化鋁擔體上之均勻度及活性,提高該奈米銅基觸媒對氨氣之轉化率之方法。 Another object of the present invention is to provide a supercritical fluid or a subcritical fluid in combination with a solvothermal method (hydrothermal or alcoholic heat) to deposit nano-grade copper on an alumina support to increase the nano-copper A method for increasing the conversion rate of the nano copper-based catalyst to ammonia gas by uniformity and activity on the alumina support.

本發明之再一目的係在於,提供一種可具體地提高該奈米銅基觸媒對氨氣之轉化率,並且降低該奈米銅基觸媒之反應溫度,可有效地減少能源耗費,以達節能減碳之目標之方法。 A further object of the present invention is to provide a method for specifically improving the conversion rate of the nano-copper-based catalyst to ammonia gas and reducing the reaction temperature of the nano-copper-based catalyst, thereby effectively reducing energy consumption. The method of achieving the goal of energy saving and carbon reduction.

為達以上之目的,本發明係一種奈米銅基觸媒之製備方法,係包含提供一氧化鋁擔體及一奈米銅粒子,該奈米銅粒子係以一超臨界流體溶媒反應,使該奈米銅粒子沉積於該氧化鋁擔體上形成奈米銅層,得到一奈米銅基觸媒,其中,該超臨界流體溶媒係可為水或正丁醇。 In order to achieve the above object, the present invention provides a method for preparing a nano copper-based catalyst, which comprises providing an alumina support and a nano copper particle, wherein the nano copper particles are reacted by a supercritical fluid solvent. The nano copper particles are deposited on the alumina support to form a nano copper layer to obtain a nano copper based catalyst, wherein the supercritical fluid solvent may be water or n-butanol.

於一較佳實施例中,當該超臨界流體溶媒係為水時,該奈米銅粒子係於壓力為250巴(Bar),溫度為350~400℃之條件下沉積於該氧化鋁擔體上。 In a preferred embodiment, when the supercritical fluid solvent is water, the nano copper particles are deposited on the alumina support at a pressure of 250 bar (Bar) at a temperature of 350 to 400 ° C. on.

於一較佳實施例中,當該超臨界流體溶媒係為正丁醇時,該奈米銅粒子係於壓力為100巴,溫度為250~300℃之條件下沉積於該氧化鋁擔體上。 In a preferred embodiment, when the supercritical fluid solvent is n-butanol, the nano copper particles are deposited on the alumina support at a pressure of 100 bar and a temperature of 250 to 300 ° C. .

1‧‧‧奈米銅基觸媒 1‧‧•Nylon copper-based catalyst

10‧‧‧氧化鋁擔體 10‧‧‧Alumina support

11‧‧‧奈米銅粒子 11‧‧‧Nano copper particles

12‧‧‧奈米銅層 12‧‧•Nylon copper layer

2‧‧‧觸媒分解裝置 2‧‧‧catalytic decomposition device

20‧‧‧打開氨氣瓶 20‧‧‧Open ammonia cylinder

21‧‧‧氬氣瓶 21‧‧‧ argon cylinder

22‧‧‧氧氣瓶 22‧‧‧Oxygen cylinder

23‧‧‧質量流量計 23‧‧‧Mass flow meter

24‧‧‧固定床反應器 24‧‧‧ fixed bed reactor

25‧‧‧紫外光 25‧‧‧ ultraviolet light

(a)‧‧‧超臨界水合成之觸媒之氨氣氧化轉化率 (a) ‧ ‧ ammonia gas oxidation conversion rate of catalyst for supercritical water synthesis

(b)‧‧‧次臨界水合成之觸媒之氨氣氧化轉化率 (b) Ammonia gas oxidation conversion rate of ‧ ‧ critical catalysts for critical water synthesis

(c)‧‧‧超臨界醇合成之觸媒之氨氣氧化轉化率 (c) ‧ ‧ ammonia gas oxidation conversion rate of catalyst for supercritical alcohol synthesis

(d)‧‧‧次臨界醇合成之觸媒之氨氣氧化轉化率 (d) Ammonia gas oxidation conversion rate of the ‧ ‧ critical alcohol synthesis catalyst

第1圖,係本發明奈米銅基觸媒之製備架構示意圖。 Fig. 1 is a schematic view showing the preparation structure of the nano copper-based catalyst of the present invention.

第2圖,係本發明用以將氨氣氧化之觸媒分解裝置示意圖。 Fig. 2 is a schematic view showing a catalyst decomposition apparatus for oxidizing ammonia gas of the present invention.

第3圖,係本發明以Cu Ka1射線為光源之SEM分佈影像圖。 Fig. 3 is a SEM distribution image of the present invention using Cu Ka1 ray as a light source.

第4圖,係本發明之各種銅基觸媒之XRD圖譜。 Figure 4 is an XRD pattern of various copper-based catalysts of the present invention.

第5圖,係本發明使用不同方法合成銅基觸媒之銅2PXPS圖譜。 Figure 5 is a copper 2PXPS pattern of a copper-based catalyst synthesized by the present invention using different methods.

第6圖,係本發明比較不同製備方法所得之觸媒之氨氣氧化轉化率示意圖。 Figure 6 is a schematic diagram showing the ammonia oxidation conversion rate of the catalyst obtained by the different preparation methods in the present invention.

第7圖,係本發明之氨氣分解反應中所需滯留時間之結果示意圖。 Fig. 7 is a graph showing the results of the residence time required in the ammonia gas decomposition reaction of the present invention.

請參閱『第1圖』所示,係本發明奈米銅基觸媒之製備架構示意圖。如圖所示:本發明係一種奈米銅基觸媒之製備方法,係利用溶劑熱法,以水或正丁醇為溶劑製備奈米銅基觸媒,藉重水熱或醇熱之特性,直接將奈米粒子穩定沉積於多孔性氧化物之基材。當製備時,其包含提供一氧化鋁擔體(Al2O3)10及一奈米銅粒子11,該奈米銅粒子11係以一超臨界流體溶媒(例如:水或正丁醇)反應,使該奈米銅粒子11沉積於該氧化鋁擔體10上形成奈米銅層12,得到一奈米銅基觸媒1。該奈米銅基觸媒係用於分解氨氣,透過以奈米銅沉積於氧化鋁作為氨氣氧化觸媒以提升其反應活性,藉以降低反應溫度。 Please refer to FIG. 1 for a schematic diagram of the preparation structure of the nano copper-based catalyst of the present invention. As shown in the figure: the present invention is a preparation method of a nano copper-based catalyst, which uses a solvothermal method to prepare a copper-based catalyst using water or n-butanol as a solvent, and relies on the characteristics of hydrothermal or alcoholic heat. The nanoparticle is directly deposited on the substrate of the porous oxide. When prepared, it comprises providing an alumina support (Al 2 O 3 ) 10 and a nano copper particle 11 which is reacted in a supercritical fluid solvent (for example, water or n-butanol). The nano copper particles 11 are deposited on the alumina support 10 to form a nano copper layer 12, thereby obtaining a nano copper based catalyst 1. The nano copper-based catalyst is used for decomposing ammonia gas, and is deposited by using nano copper as an ammonia gas oxidation catalyst to enhance the reactivity thereof, thereby lowering the reaction temperature.

上述奈米銅基觸媒1中之氧化鋁擔體10表面至少有百分之1~3為該奈米銅層12。 At least 1 to 3 percent of the surface of the alumina support 10 in the above-mentioned nano copper-based catalyst 1 is the nano copper layer 12.

於一較佳實施例中,本發明於合成銅基觸媒時,係分別使用超臨界流體法以及微波法合成銅基觸媒,以g-Al2O3為觸媒擔體、硝酸 銅為前驅物,將銅沉積於g-Al2O3上,藉此分別比較次臨界、超臨界以及液態沉積反應之效果。 In a preferred embodiment, the present invention synthesizes a copper-based catalyst by using a supercritical fluid method and a microwave method, and uses g-Al 2 O 3 as a catalyst carrier and copper nitrate as a catalyst for synthesizing a copper-based catalyst. The precursor, which deposits copper on g-Al 2 O 3 , compares the effects of subcritical, supercritical, and liquid deposition reactions, respectively.

在水熱及醇熱系統中,分別以水及正丁醇作為溶劑,進行反應,其中,當於水熱反應中,其操作壓力為250巴(Bar),反應溫度為400℃、350℃;當於醇熱反應中,其操作壓力為100bar,反應溫度為300℃、250℃;於微波系統中,以水為溶劑,正丁醇為還原劑,在溫度為100℃、95℃下進行還原反應。 In the hydrothermal and alcohol thermal system, the reaction is carried out with water and n-butanol as solvents respectively, wherein, in the hydrothermal reaction, the operating pressure is 250 bar (Bar), the reaction temperature is 400 ° C, 350 ° C; In the alcohol thermal reaction, the operating pressure is 100 bar, the reaction temperature is 300 ° C, 250 ° C; in the microwave system, with water as the solvent, n-butanol as a reducing agent, at a temperature of 100 ° C, 95 ° C reduction reaction.

請參閱『第2圖』所示,係本發明用以將氨氣氧化之觸媒分解裝置示意圖。如圖所示:當運用時,本發明係將前述所合成之觸媒填充於固定床反應器24中,以紫外光25為光源,利用一觸媒分解裝置2,打開氨氣瓶20、氬氣瓶21及氧氣瓶22,經由各別質量流量計23,分別將擬分解之氨氣(NH3),以氬氣(Ar)調整其流速,通入氧氣(O2)於反應溫度下進行催化反應,最後偵測NH3濃度變化,進而推算出合成出來之觸媒轉化率。 Please refer to FIG. 2, which is a schematic diagram of a catalyst decomposition apparatus for oxidizing ammonia gas according to the present invention. As shown in the figure, when used, the present invention fills the catalyst synthesized in the fixed bed reactor 24, and uses ultraviolet light 25 as a light source to open the ammonia cylinder 20 and argon by using a catalyst decomposition device 2. The gas cylinder 21 and the oxygen cylinder 22 respectively adjust the flow rate of the ammonia gas (NH 3 ) to be decomposed by argon gas (Ar) via the respective mass flow meters 23, and pass oxygen (O 2 ) to the reaction temperature. Catalytic reaction, and finally detect the change of NH 3 concentration, and then calculate the conversion rate of the synthesized catalyst.

請參閱『第3圖~第5圖』所示,係分別為本發明以Cu Ka1射線為光源之SEM分佈影像圖、本發明之各種銅基觸媒之XRD圖譜、以及本發明使用不同方法合成銅基觸媒之銅2PXPS圖譜。如圖所示:本發明係分別利用X光繞射儀(XRD)及X光光電子能譜儀(XPS)分別對超臨界流體法以及微波法合成銅基觸媒之結構作比較分析。將前述以多孔性g-Al2O3為觸媒擔體、硝酸銅為前驅物,將銅沉積於g-Al2O3上,由於g-Al2O3不容易沉積金屬,因此如第3圖所示掃描式電子顯微鏡(SEM)中Cu Ka1之分佈(Mapping)結果,其中圖(a)為操作於250bar、350℃之次臨界水分佈影像;(b)為操作於250bar、400℃之超臨界水分佈影像;以及(c)為操作於100bar之微波液相分佈影像。由第3圖中銅之分佈情形顯示 ,於次臨界及液相反應時,由於表面張力,導致金屬材料不易於孔洞中沉積;相對地,於第3圖中(b)顯示,於超臨界水之狀態下,所沉積之銅粒子較多且均勻分佈。此外,從其第4圖所示XRD圖譜中亦可得知,除了反應溫度為400℃之超臨界水外,其他之醇熱及水熱反應生成之銅含有氧化銅(CuO)、氧化亞銅(Cu2O)及Cu三種狀態。 Please refer to FIG. 3 to FIG. 5 for the SEM distribution image of Cu Ka1 ray as a light source, the XRD pattern of various copper-based catalysts of the present invention, and the different methods of the present invention. Copper 2PXPS map of copper-based catalyst. As shown in the figure, the present invention compares the structures of a copper-based catalyst by a supercritical fluid method and a microwave method, respectively, using an X-ray diffractometer (XRD) and an X-ray photoelectron spectrometer (XPS). The porous g-Al 2 O 3 is used as a catalyst carrier and copper nitrate is used as a precursor to deposit copper on g-Al 2 O 3 . Since g-Al 2 O 3 does not easily deposit metal, Figure 3 shows the results of the mapping of Cu Ka1 in a scanning electron microscope (SEM), where (a) is a subcritical water distribution image operating at 250 bar and 350 ° C; (b) is operated at 250 bar, 400 ° C. Supercritical water distribution image; and (c) is a microwave liquid distribution image operating at 100 bar. The distribution of copper in Fig. 3 shows that in the subcritical and liquid phase reactions, the metal material is not easily deposited in the pores due to the surface tension; relatively, in Fig. 3 (b), in the supercritical water. In the state, the deposited copper particles are more and evenly distributed. In addition, it can be seen from the XRD pattern shown in Fig. 4 that in addition to the supercritical water having a reaction temperature of 400 ° C, the copper formed by other alcohol heat and hydrothermal reaction contains copper oxide (CuO) and cuprous oxide. Three states (Cu 2 O) and Cu.

另外,從第5圖所示XPS圖譜中可得知,無論水熱或醇熱法製備銅基觸媒,當溫度較高時,所沉積之Cu量較高,同時從第4、5圖中亦可得知,於超臨界醇中所得之銅除了些許之CuO外,更含有許多之CuO,與水熱所得之化學結構差異甚大。 In addition, it can be seen from the XPS spectrum shown in Fig. 5 that whether the copper-based catalyst is prepared by hydrothermal or mellow method, the amount of Cu deposited is higher when the temperature is higher, and from the fourth and fifth figures. It can also be seen that the copper obtained in the supercritical alcohol contains a lot of CuO in addition to a little Cu O , and the chemical structure obtained from the hydrothermal is very different.

請參閱『第6圖及第7圖』所示,係分別為本發明比較不同製備方法所得之觸媒之氨氣氧化轉化率示意圖、以及本發明之氨氣分解反應中所需滯留時間之結果示意圖。如圖所示:本發明比較不同製備方法所得之觸媒於第2圖之裝置中進行氨氣分解反應,其催化能力分析如第5圖所示,其中圖(a)為超臨界水合成之觸媒之氨氣氧化轉化率;(b)為次臨界水合成之觸媒之氨氣氧化轉化率;(c)為超臨界醇合成之觸媒之氨氣氧化轉化率;以及(d)為次臨界醇合成之觸媒之氨氣氧化轉化率。結果顯示,以微波反應生成之銅基觸媒於低溫(200℃)下之氨氣分解小於30%;於醇熱反應中,超臨界醇所得之催化結果較高,而由水熱反應所得之觸媒,無論於150℃或200℃,其所得之催化效果最佳,其中超臨界水合成之觸媒於200℃分解可達98.5%,而超臨界醇合成之觸媒於200℃操作下所得之轉化率亦可達90%以上。 Please refer to "Fig. 6 and Fig. 7" for the comparison of the ammonia oxidation conversion rate of the catalyst obtained by the different preparation methods of the present invention, and the result of the residence time required in the ammonia gas decomposition reaction of the present invention. schematic diagram. As shown in the figure: The present invention compares the catalyst obtained by the different preparation methods into the ammonia gas decomposition reaction in the apparatus of Fig. 2, and the catalytic ability analysis thereof is shown in Fig. 5, wherein (a) is supercritical water synthesis. The ammonia oxidation conversion rate of the catalyst; (b) the ammonia oxidation conversion rate of the catalyst for subcritical water synthesis; (c) the ammonia oxidation conversion rate of the catalyst for supercritical alcohol synthesis; and (d) Ammonia gas oxidation conversion rate of a catalyst for subcritical alcohol synthesis. The results show that the copper-based catalyst formed by microwave reaction decomposes ammonia gas at low temperature (200 ° C) less than 30%; in the alcohol thermal reaction, the supercritical alcohol obtains higher catalytic results, and the hydrothermal reaction results in Catalyst, whether at 150 ° C or 200 ° C, the catalytic effect is best, wherein the catalyst for supercritical water synthesis can be decomposed by 98.5% at 200 ° C, and the catalyst for supercritical alcohol synthesis is obtained at 200 ° C. The conversion rate can also reach over 90%.

另外,本發明亦針對超臨界水所合成之觸媒所需之觸媒於反應中所需滯留時間進行討論,如第7圖顯示,若欲有高於90%轉化率 之結果,所需使用之流體流率,需低於0.6cc/s。 In addition, the present invention also discusses the retention time required for the catalyst required for the catalyst synthesized by supercritical water in the reaction, as shown in Fig. 7, if more than 90% conversion is desired As a result, the fluid flow rate required to be used needs to be less than 0.6 cc/s.

本發明係利用溶劑熱法於多孔性氧化鋁擔體上均勻地沉積奈米銅粒子之技術,分別以水及正丁醇為溶劑,於等壓之操作模式下,解析於超臨界流體及次臨界流體之狀態下沉積之狀況,並以XRD、SEM、UV-vis及XPS分析其物理化學結構,同時於固定床反應器中進行氨氣分解,其操作壓力為100bar,反應溫度為150~200℃,利用固定床進行觸媒分解能力之測試,分析不同型態之觸媒對於氨氣分解之影響,再與化學還原法所得之銅基觸媒進行比較;經實驗結果顯示,以溶劑熱法沉積所得之奈米銅粒子較為均勻,且於低反應溫度下即能達到90~99%之轉化率,顯示本發明成功地以溶劑熱法(水熱及醇熱)於低溫反應合成具高轉化率之銅基觸媒,使其適用於一般氨氣之分解,可有效地減少能源耗費,以達節能減碳之目標。 The invention utilizes a solvothermal method for uniformly depositing nano copper particles on a porous alumina support, and uses water and n-butanol as solvents in the isostatic operation mode to analyze the supercritical fluid and the secondary The state of deposition under the condition of critical fluid, and its physical and chemical structure is analyzed by XRD, SEM, UV-vis and XPS, and ammonia gas decomposition is carried out in a fixed bed reactor at an operating pressure of 100 bar and a reaction temperature of 150-200. °C, using a fixed bed to test the catalytic decomposition ability, analyze the influence of different types of catalyst on ammonia decomposition, and then compare with the copper-based catalyst obtained by chemical reduction method; the experimental results show that the solvothermal method The nano copper particles obtained by the deposition are relatively uniform, and the conversion rate of 90-99% can be achieved at a low reaction temperature, indicating that the present invention successfully synthesized by a solvothermal method (hydrothermal and alcoholic) at a low temperature reaction. The copper-based catalyst makes it suitable for the decomposition of general ammonia gas, which can effectively reduce energy consumption and achieve the goal of energy saving and carbon reduction.

綜上所述,本發明係一種奈米銅基觸媒之製備方法,可有效改善習用之種種缺點,係利用溶劑熱法製備奈米銅基觸媒,並成功地將觸媒應用於氨氣分解上,可於低溫下得到高轉化率,進而使本發明之產生能更進步、更實用、更符合使用者之所須,確已符合發明專利申請之要件,爰依法提出專利申請。 In summary, the present invention is a preparation method of a nano copper-based catalyst, which can effectively improve various disadvantages of the conventional use, is a solvothermal method for preparing a nano copper-based catalyst, and successfully applies a catalyst to ammonia gas. In the decomposition, high conversion rate can be obtained at low temperature, so that the production of the invention can be more advanced, more practical, and more in line with the requirements of the user. It has indeed met the requirements of the invention patent application, and the patent application is filed according to law.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。 However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.

1‧‧‧奈米銅基觸媒 1‧‧•Nylon copper-based catalyst

10‧‧‧氧化鋁擔體 10‧‧‧Alumina support

11‧‧‧奈米銅粒子 11‧‧‧Nano copper particles

12‧‧‧奈米銅層 12‧‧•Nylon copper layer

Claims (1)

一種奈米銅基觸媒之製備方法,係提供一氧化鋁擔體及一奈米銅粒子,該奈米銅粒子係以一超臨界流體溶媒反應,使該奈米銅粒子沉積於該氧化鋁擔體上,得到一奈米銅基觸媒,其中,該超臨界流體溶媒係可為水或正丁醇,當該超臨界流體溶媒為水時,該奈米銅粒子係於壓力為250巴(Bar),溫度為350~400℃之條件下沉積於該氧化鋁擔體上;當該超臨界流體溶媒為正丁醇時,該奈米銅粒子係於壓力為100Bar,溫度為250~300℃之條件下沉積於該氧化鋁擔體上。 A method for preparing a nano copper-based catalyst provides an alumina support and a nano copper particle, wherein the nano copper particles are reacted in a supercritical fluid to cause the nano copper particles to be deposited on the alumina On the support, a nano copper-based catalyst is obtained, wherein the supercritical fluid solvent can be water or n-butanol, and when the supercritical fluid solvent is water, the nano copper particles are at a pressure of 250 bar. (Bar), deposited on the alumina support at a temperature of 350 to 400 ° C; when the supercritical fluid solvent is n-butanol, the nano copper particles are at a pressure of 100 Bar and a temperature of 250 to 300 Deposited on the alumina support under the conditions of °C.
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