TWI541518B - A high-speed substrate for transmitting the test signal of the test machine - Google Patents

Description

High-speed substrate for transmitting test signals of test machines

The invention relates to a test device for high-speed testing, in particular to a high-speed substrate capable of transmitting test signals of a test machine.

With the increasing demand for high-speed operation of electronic products, the integrated circuit components inside the electronic product are tested in the wafer, and the test probe card needs to take into account the spacing between the electronic component test pads, so that the probe card The probe can be precisely aligned when the test pad is touched, and the high-speed operation requirements of the electronic component must be considered. The high-speed test circuit can be designed on the probe card circuit board to match the operating conditions of the individual electronic component. Provide integrated circuit wafers to complete a test project to ensure the quality of the product.

However, the probe card manufacturer generally can quickly produce a test board which has a fixed position on the circuit board. The jumper structure is used as a signal transmission path between the test machine and the probe. Suitable for signal transmission test in general medium and low frequency bands; unless all transmission structures are designed for specific high frequency test conditions, including specific signal transmission impedance or specific transmission path in high frequency test, etc. The public board assembled probe card cannot be used for process technology components that are mixed with general medium and low frequency bands and high frequency test requirements. Even if the probe card provided by the fixed-board layout is designed for different wafer process products with the same frequency operation and even the same operating conditions as the integrated circuit, as long as the circuit layout of the process electronic components is changed, the high-speed electronic element is made. The relative transmission path of each signal in the device is changed or relatively changed with the signal transmission path of the general middle and low frequency bands, and the probe card manufacturer still has to redesign the probe card for the special board test corresponding to the circuit layout; For this reason, the probe card manufacturer has to spend considerable labor and production costs, especially when the process integrated circuit is more complicated and the circuit to be tested is more complicated, the relative special board production requires more labor and cost.

Even if it is as proposed in Taiwan Patent Publication No. I266882, it is suitable for transmission. A detection system consisting of a flexible wire for transmitting a high-frequency signal. However, the detection system is provided with an additional position on the circuit board to set a flexible wire to receive a high-frequency signal, and the high-frequency signal provided by the test head of the test machine is required. The test signals of the general frequency band are separated from the different signal receiving positions, which affects the circuit layout of the general frequency band test signal, and the circuit space occupied by the high frequency transmission path needs to be sacrificed. And extending the flexible wire from the edge of the circuit board to the probe structure with high density arrangement, for the micro-probe structure with specific elasticity requirements, directly inserting the flexible wire directly into the high-density probe directly causes The resistance to the elastic extension direction of the probe; so that when the test die touches the test pads of different components at the same time, the elastic contact force and the reaction force to the probe are completely different, after a period of time. After use, it will affect the elastic restoring force of different probes, causing the test plane of the probe tip to be uneven, which may cause excessive stress or poor electrical contact of the local test pads, resulting in lower reliability of the electrical test of the integrated circuit wafer. Furthermore, once each of the die to be tested has more high frequency components with different conditions, the test machine needs to output high frequency signals of different conditions with more test heads, and the above detection system needs to be more on the edge of the circuit board. Most flexible wires receive high frequency signals from test heads at different locations; not only are more flexible wires fully inserted between the high density probes, causing greater resistance to the elastic extension of all probes, And as long as it has been operated A slight touch on any flexible wire will cause all probes to be completely misaligned or even damaged. The probe card needs to be repaired and cannot be electrically tested.

Therefore, when the probe card manufacturer faces a fab to order a probe card, how can the manufacturing cost be reduced with the shortest delivery time, and the high-quality test line transmission structure can be considered for the integrated circuit wafer. High-reliability electrical test engineering is a big test for today's probe card manufacturers.

The main object of the present invention is to provide a high speed substrate that can transmit test signals provided by a test machine.

To achieve the foregoing objective, the present invention provides a high speed substrate comprising: an upper surface and a lower surface; one end having a plurality of through holes and a plurality of second test contacts, each of the through holes being available for the test machine One of the test heads passes, and each of the second test contacts is configured to transmit a test signal of the test machine; the other end is located at an opposite end of the one end, and has a plurality of probe contacts and at least one ground probe contact, each The probe contact is electrically connected to a high frequency probe, and the at least one ground probe contact is electrically connected to a ground probe; and the majority of the signal lines and the two ends of the signal line are respectively connected to the probe The pin contact is electrically connected to each of the test contacts; and at least one ground layer is electrically connected to the at least one ground probe contact.

1, 2, 3, 4‧‧‧ test modules

10‧‧‧ circuit board

102‧‧‧Test area

104‧‧‧ probe area

106‧‧‧Upper surface

108‧‧‧ lower surface

12‧‧‧First test contact

14‧‧‧First probe contact

16‧‧‧First signal line

30, 30', 70, 90‧‧‧ high speed substrates

300, 702, 704, 902, 904‧‧‧ flexible circuit boards

32‧‧‧Contact layer

322‧‧‧Second test contact

324‧‧‧ Grounding contacts

34‧‧‧ Grounding layer

34’‧‧‧Outer ground plane

340‧‧‧Blind hole

342‧‧‧through hole

344, 346‧‧‧ metal blocks

348‧‧‧welding materials

350‧‧‧Metal fasteners

36, 72, 74, 92, 94‧‧‧ signal lines

360‧‧‧Signal layer

362‧‧‧Second probe contact

364‧‧‧Ground probe contact

38‧‧‧Insulation

50‧‧‧ probe set

502‧‧‧ Fixed seat

504‧‧‧metal pieces

506‧‧‧Insulating rubber

508‧‧‧ conductive adhesive

52‧‧‧First probe

54, 58‧‧‧ second probe

56‧‧‧ Grounding probe

542, 582‧‧ ‧ metal needle

544‧‧‧Ground

584‧‧‧Metal casing

706‧‧‧Adapter

906‧‧‧ transmission line

The first figure is a top view of a first preferred embodiment of the present invention; the second figure is a partial bottom view of the first preferred embodiment; and the third figure is a schematic view of the first preferred embodiment. The fourth figure is a partial top view of the first preferred embodiment, showing a schematic view of the high-speed substrate disposed on the upper surface of the circuit substrate; the fifth drawing A and B are respectively connected to the fifth figure 5A-5A. FIG. 6 is a cross-sectional view of the connection of the 5B-5B; the sixth figure is a plurality of fastening methods of the high-speed substrate and the circuit substrate provided by the present invention, and indicates that the high-speed substrate connects the ground layer to the first test contact of the circuit substrate on the side. FIG. 7 and FIG. 7B are respectively a schematic cross-sectional view of the 7A-7A connection and the 7B-7B connection of the sixth figure; and the eighth diagram is another second probe of the probe set provided by the present invention. A schematic diagram of a transmission structure that is electrically connected to a high-speed substrate; the ninth diagram is a partial bottom view of the eighth diagram; and the tenth diagrams A and B are respectively the interlacing of the second probe inside the probe group shown in the second figure. Cascading configuration structure; Figure 11 and Figure A are the eighth The other second probe is shown in the interleaved and stacked configuration of the probe set; the twelfth is a schematic view of the second preferred embodiment of the present invention; A schematic cross-sectional view of an embodiment showing a schematic diagram of a high speed substrate disposed on an upper surface of a circuit substrate; Figure 14 is a schematic view showing the structure of a third preferred embodiment of the present invention; and Figure 15 is a schematic view showing the structure of a fourth preferred embodiment of the present invention.

In the following, a number of preferred embodiments are listed in conjunction with the drawings to illustrate the structure, fabrication and efficacy of the present invention. However, the embodiments of the present invention are only used to illustrate the use of the present invention in a specific structure and manufacturing method, and are not intended to limit the scope of the present invention; in the drawings, the shapes or sizes of the components are merely for convenience of labeling, and are not used for The structure of the present invention is limited.

Please refer to an integrated high-speed test module 1 according to the first preferred embodiment of the present invention as shown in the first to third figures, which is suitable for electronic components that are simultaneously operated in the general middle and low frequency bands and higher The high-speed electronic components operating in the frequency band perform the integrated circuit wafer level test, so the test machine can transmit the ground potential and the first test signal of the lower test frequency and the second test signal of the higher test frequency to the test module 1 through The die to be tested of the integrated circuit wafer is electrically tested. More specifically, the second test signal has a transmission structure conforming to the high frequency signal, so that the transmission path of each of the second test signals is accompanied by a ground potential. The test module 1 includes a circuit substrate 10, a high-speed substrate 30, and a probe set 50, wherein: in conjunction with the first to third figures, the circuit substrate 10 can be distinguished as being located outside, a test area 102 and a probe area 104 of the inner ring, and have a pair of upper surface 106 and a lower surface 108. The upper surface 106 is provided with a plurality of first test contacts 12 in the test area 102. The surface 108 is provided with a plurality of first probes in the probe region 104. Point 14 , the first test contact 12 is used to transmit the first test signal or the ground potential of the test machine, and is connected to the first probe through a plurality of external jumper structures or a first signal line 16 of the internal trace Point 14 is electrically conductive.

The high-speed substrate 30 is used to transmit the second test signal of the test machine, and is disposed along the upper surface 106 of the circuit substrate 10 from the test area 102 to the probe area 104, and is disposed on the circuit board 10 The lower surface 108 extends to the center of the circuit substrate 10 to approximate the edge of the probe set 50, and the optimum number and position are configured according to the high frequency test requirements of the actual integrated circuit components. The high-speed substrate 30 can be made of a single flexible circuit board 300 as provided in the embodiment, so that the second test signal is transmitted to the test area 102 along the upper and lower surfaces 106 and 108 of the circuit board 10 in the flexible circuit board 300. And between the probe areas 104. Referring to the third figure, the high-speed substrate 30 covers a portion of the test area 102 on the upper surface 106 of the circuit substrate 10, and is provided with a contact layer 32, a ground layer 34, and a plurality of signal lines 36, so that the second test machine is The test signal is received by the contact layer 32 corresponding to the test substrate 102 of the circuit substrate 10, and transmitted to the probe set 50 via the signal line 36, wherein the structure of the contact layer 32, the ground layer 34 and the signal line 36 Features and functional applications are detailed below.

The contact layer 32 is provided with a plurality of second test contacts 322 and a plurality of ground contacts 324 on the upper surface 106 of the corresponding circuit substrate 10, and is provided as an insulation protection function for the surface of the high speed substrate 30; at least one of the ground contacts 324 and at least one of the second test contacts 322 are located on the first test contact 12 of the circuit substrate 10. Preferably, the second test contact 322 and the ground contact 324 are covered by reference to the fourth figure. The first test contact 12 is aligned with the first test contact 12, and the second test contact 322 is electrically connected to the first test contact 12 Insulation, so for the test machine, the position of the high frequency signal provided by the test head is maintained at the same position as the original first test contact 12, and the second test signal is completely transmitted by the high speed substrate 30 having the high frequency transmission specification. .

The ground layer 34 is electrically connected to the ground contacts 324 and the testing machine The grounding potential of the stage can be removed as shown in FIG. 5A, and the local contact layer 32 on the first test contact 12 is removed to form a blind hole 340 on the ground layer 34. The exposed portion 34 constitutes one of the ground contacts 324. Alternatively, the flexible circuit board 300 is disposed through the at least one through hole 342, and the positive contact is located on the first test contact 12, and then the local contact layer 32 at the edge of the through hole 342 is removed to make the ground layer 34 in the through hole 342. Exposed, the grounding layer 34 and the first test contact 12 are welded to each other in the through hole 342 by a conductive solder material, and the solder material is solidified to form a metal block 344 received in the through hole 342. The surface of the metal block 344 constitutes one of the ground contacts 324. Therefore, in addition to the grounding layer 34 receiving the ground potential provided by the testing machine, the high-speed substrate 30 has the first circuit board 10 for electrically connecting the grounding layer 34 disposed inside the flexible circuit board 300 to each other. The test contact 12 is characterized by a ground potential; and the ground layer 34 can be connected to the first test contact 12 of the circuit substrate 10 by soldering, and the high speed substrate 30 and the circuit substrate 10 are fixed to each other. Features. In addition, the setting of the through hole 342 can only be used to directly pass the test head of the test machine through the through hole 342 to receive the first test signal at the first test contact 12 or to pass the first test contact 12 through the through hole 342. The receiving ground potential can be effectively separated from the ground potential transmitted by the high-speed substrate 30 to avoid interference between the signals transmitted by the circuit substrate and the high-speed substrate; in particular, if the solder material is injected through the through hole 342, refer to FIG. After the solder material solidifies, one metal block 346 is formed to not only conduct the first test contact 12 to the surface of the high speed substrate 30, but also the test head of the test machine directly contacts the metal block 346, and the high speed substrate 30 and the circuit substrate 10 are also similarly Secure each other.

The function of simultaneously connecting the ground layer 34 to the first test contact 12 of the circuit substrate 10 by soldering, and fixing the high speed substrate 30 and the circuit substrate 10 to each other may also be as shown in FIG. 6 and FIG. The surface of the flexible circuit board 300 adjacent to the first test contact 12 of the circuit board 10 is disposed on the side of the high-speed substrate 30, and the local contact layer 32 not provided with the second test contact 322 and the ground contact 324 is removed. The ground layer 34 is exposed at the edge, and the exposed ground layer 34 is connected to the adjacent first test contact 12 by the solder material 348, and the ground layer 34 can pass through the first test connection adjacent to the side of the high speed substrate 30. The point 12 and the circuit board 10 have characteristics of equal ground potential, and the solder material 348 has a function of fixing the side of the high speed substrate 30 and the circuit board 10 to each other. Therefore, the ground layer 34 does not need to be completely disposed to the edge of the through hole 342 and is not exposed in the through hole 342, so that a portion of the first test contact 12 covered by the high speed substrate 30 can pass through the through hole 342 or more by the metal block 346. The point contact contact of the test machine is electrically insulated from the ground layer 34, so that the first test contact 12 covered by the high speed substrate 30 can receive the first test signal of the test machine. In addition, referring to FIG. 7A, as long as the signal line 36 of the high speed substrate 30 is not disposed adjacent to the edge of the high speed substrate 30, the ground contact 324 of the high speed substrate 30 contact layer 32 can be located adjacent to the edge of the high speed substrate 30, through the through hole. The 342 and the metal block 344 disposed in the through hole 342 electrically connect the first test contact 12 of the circuit substrate 10 to the ground layer 34, and have the function of fixing the side of the high speed substrate 30 and the circuit substrate 10 to each other.

Even, as shown in FIG. 7B, the high speed substrate 30 is covered at the edge. After the through hole 342 is disposed on the first test contact 12, the local contact layer 32 of the edge of the through hole 342 is also removed to expose the ground layer 34 to the through hole 342, and then a metal fixing member 350 (such as a nail) The T-shaped pin passes through the through hole 342 to cause the metal fixture 350 to abut against the surface of the exposed ground layer 34 and break into the first test contact 12, and even pass through the first test contact 12 to the circuit substrate 10 The back side is fixed by welding; therefore, the metal fixing member 350 can not only form the grounding contact 324 on the contact layer 32, but also electrically connect the first test contact 12 of the circuit substrate 10 to the ground layer 34, and also has the side of the high speed substrate 30. The function of fixing the circuit board 10 to each other.

Of course, the high speed substrate 30 and the circuit substrate are disposed on both sides of the high speed substrate 30. 10, the manner of fixing each other may be achieved by different methods according to the two sides illustrated in the embodiment, or the two sides may be achieved by the same method in any manner, and may have the desired method of the present invention. The effect achieved is not limited to this.

Each of the signal lines 36 is disposed in the soft direction along the extending direction of the high speed substrate 30 The signal board 300 is disposed on a signal layer 360 and is separated from the ground layer 34 by an insulating layer 38. The signal layer 360 is made by the actual high frequency transmission specification of the second test signal. The insulating layer 38 is separated from the ground layer 34 by a specific thickness. Preferably, the signal lines 36 are partially disposed on the signal layer 360 and partially disposed inside or on the surface of the contact layer 32, and are changed by actual high frequency transmission specifications. The thickness of the layer 32 is such that the circuit space for high frequency signal transmission can be increased. One end of each signal line 36 is longitudinally connected to each of the second test contacts 322 of the contact layer 32 to transmit a second test signal of the test machine, and the other end of each signal line 36 extends to the probe set 50. Edge, corresponding A second probe contact 362 is formed at the end of each of the signal lines 36, and each of the second probe contacts 362 has a ground probe contact 364 electrically connected to the ground layer 34, which is referred to in the second figure; The grounding probe contact 364 can be electrically connected to the ground layer 34 through the insulating layer 38, or the local insulating layer 38 adjacent to the second probe contact 362 can be removed to form the exposed ground layer 34 to form the grounding probe. Point 364 can have the effect desired by the present invention, and thus is not limited thereto.

Of course, if there is a signal between the electronic components to be tested corresponding to each signal line 36 The timing line of the connection or synchronization process, the signal line 36 disposed on the high-speed substrate 30 can be made to have the same length of the signal line 36 by the precise path design, for example, the upper and lower layers of the contact layer 32 and the signal layer 360. The aligned signal line 36 meets the requirements of the same length, or the signal line 36 disposed on the same layer of the contact layer 32 or the signal layer 360 increases the routing path so that at least two signal lines 36 meet the requirements of the same length. The reference to the two figures can have the effect that the present invention intends to achieve, and thus is not limited thereto.

Please refer to the second and third figures for reference. One of the probe sets 50 is fixed on the base 502. A plurality of first and second probes 52, 54 and at least one grounding probe 56 are provided. The first probe 52 is electrically connected to the first probe contact 14 of the circuit substrate 10; the second probe 54 is a high frequency probe structure having high frequency transmission characteristics, having a metal pin 542 and the metal The pin 542 is adjacent to the electrically insulating grounding metal. The metal pin 542 is electrically connected to the signal line 36 of the high speed substrate 30. The grounding metal is electrically connected to the grounding layer 34 of the high speed substrate and the grounding probe 56, and the second probe. 54 can be made as a metal pin 542 and a ground wire 544 juxtaposed and electrically insulated from each other, so that the metal pin 542 is connected to the second probe on the high speed substrate 30. 362 electrical connection, the ground wire 544 is electrically connected to the ground probe contact 364 on the high speed substrate 30. Since the second probe provided by the present invention mainly cooperates with the structure of the second signal transmission path accompanied by the transmission ground potential, it can also be a coaxial transmission structure as shown in the eighth and ninth diagrams; wherein the probe The set 50 further has a second probe 58 having a metal pin 582 and a metal sleeve 584 coaxially surrounding the periphery of the metal pin 582, the metal sleeve 584 being formed adjacent to the metal pin 582 and The metal pin 582 is electrically connected to the second probe contact 362 of the high speed substrate 30. The metal sleeve 584 is electrically connected to the ground probe contact 364. Therefore, the high-speed substrate 30 transmits the high-frequency signal to the transmission structure of the probe set 50, and any grounding metal that is disposed adjacent to and electrically insulated by the metal needle for transmitting the high-frequency signal can have the effect desired by the present invention. And therefore not limited to this.

Of course, the grounding power accompanying the transmission of the high frequency signal to the second probe 54 The position of the probe group 50 is further provided on the fixing base 502, and a metal piece 504 is electrically connected to the grounding metal of the second probes 54. The metal needle 542 of the second probe 54 is connected. The metal strips 504 are adhered to each other through an insulating adhesive 506 to maintain a specific spacing, and the grounding probes 56 are disposed on the metal strips 504 to be electrically connected thereto. Alternatively, the metal strips 504 may be extended to the adjacent ones. The first probe 52 is directly electrically connected to the first test signal, so that the ground potential of the first test signal transmitted through the circuit board 10 can still be transmitted with the second test signal transmitted by the high speed substrate 30 when adjacent to the die to be tested. The ground potential is equipotential, so that all the ground potentials required for testing the die to be tested by the test module 1 can reach the equipotential function through the metal piece 504, so that the invention has the effect of ensuring the integrity of the circuit ground.

In addition, in order to enable the high speed substrate 30 to be effectively applied to high density high frequency For transmission requirements, the second probes 54, 58 of the probe set 50 can also be placed in a high-density spatial configuration to achieve the second as shown in FIG. 11A, B (or FIG. 11A, B), respectively. The probe 54 (or 58) satisfies the high-density high-frequency transmission requirement on the fixing base 502 in a staggered and laminated structure, wherein: the tenth figure A, B is the second probe of the metal needle 542 and the ground line 544. The distribution structure of the needle 54 on the mount 502. Since the insulating material 506 can fix the second probes 54 and the metal sheets 504 to each other at different longitudinal heights on the surface of the fixing base 502, the second probes 54 can be insulated by being attached to the fixing base 502. The glue 506 adheres the metal pins 542 adjacent to the metal piece 504 so as to be spaced apart from each other by a specific spacing, and further attaches the metal piece 504 to the ground wire 544 juxtaposed with the metal pins 542, and then fixes the lateral distance between the metal piece 504 and the fixing base 502. After the distribution structure of the probes 52, 54, 56 on the mount 502 is completed, the insulating rubber 506 is molded on the mount 502 according to its curable characteristics such as heat curing or UV curing. If the structure is disposed at a lower spatial density, the metal piece 504 can adhere the second probes 54 with the insulating rubber 506 only in a single side space, thereby reducing the thickness of the second probe 54 on the fixing base 502. Or as shown in FIG. 11A, the second probes 54 are alternately arranged on both sides of the metal piece 504 to reduce the influence of electrical interference between the metal pins 542; if the structure is arranged at a higher spatial density, Referring to FIG. 4B, the second probe 54 can be disposed at a specific position longitudinally spaced from both sides of the metal piece 504, and the two sides of the same portion of the metal piece 504 are provided with a plurality of overlapping structures of the second probes 54. Considering the influence of electrical interference between adjacent metal pins 542 in a high-density configuration, it is even more suitable for metal pins 542 and ground wires juxtaposed therewith. An insulating sleeve is disposed around the 544 to increase the integrity of the second test signal transmitted by the second probe 54.

11th, A, B is a metal sleeve 584 coaxially surrounding the metal needle 582 The distribution structure of the fabricated second probe 58 on the mount 502. Since the metal pin 582 of the second probe 58 extends into the metal sleeve 584 and is electrically insulated from the metal sleeve 584 by a certain distance, the surface of the metal sleeve 584 is attached to the metal piece 504 by the insulating rubber 506. The purpose of electrically connecting the metal sleeve 584 to the metal piece 504 and fixing the metal needle 582 can be achieved; and if the contact area between the curved surface of the metal sleeve 584 and the metal piece 504 is reduced, the electrical connection effect is reduced. In this embodiment, the metal sleeve 584 is attached to the metal piece 504 by the conductive adhesive 508, and then the insulating material 506 is adhered to stabilize the second probe 58 on the fixing base 502. After the distribution of the pins 52, 54, 56, 58 is completed, the insulating rubber 506 is formed on the mount 502 according to its curable characteristics (such as heat curing or UV curing). If the structure is disposed at a lower spatial density, the metal piece 504 may adhere the second probes 58 with an insulating rubber 506 only in a single side space, or as shown in FIG. The probes 58 are staggered on both sides of the metal piece 504; if the structure is disposed at a higher spatial density, the second probe 58 can be disposed longitudinally spaced from the sides of the metal piece 504 with reference to FIG. In position, a plurality of overlapping structures of the second probes 58 are disposed on both sides of the same portion of the metal sheet 504.

In summary, the test module 1 of the present invention can receive the first test signal provided by the test machine by the first test contact 12 of the circuit substrate 10, and transmit the first test signal 16 of the circuit substrate 10 to detect The first probe of the needle set 50 is 52 points. The electronic component operating in the normal middle and low frequency bands of the die is touched; at the same time, the second test signal 322 provided by the flexible circuit board 300 of the high speed substrate 30 receives the second test signal provided by the test machine, and passes through the flexible circuit. One of the through holes 342 of the board 300 is aligned with the first test contact 12 of the circuit board 10, so that the position of the high frequency signal provided by the test head of the test machine remains the same as the position of the original first test contact 12. And the first test signal 12 or the ground potential can still be received by the first test contact 12 under the through hole 342 without sacrificing the circuit space occupied by the high frequency transmission path. In particular, if the metal blocks 344 and 346 formed through the through holes 342 are formed, not only the first test contact 12 can be electrically connected to the surface of the high speed substrate 30, but also the test head of the test machine directly contacts the metal blocks 344 and 346, and can reach The purpose of fixing the high speed substrate 30 to the circuit board 10 is as follows.

Furthermore, when the high-speed substrate 30 transmits the second test signal, the ground connection is transmitted through the ground. Point 324 receives the ground potential provided by the test machine, and the ground potential can be transmitted along the ground layer 34 of the high speed substrate 30 along with the second test signal to maintain the high frequency transmission characteristic impedance of the second test signal in the high speed substrate 30; or One of the through holes 342 passes through the grounding layer 34. The grounding layer 34 and the first testing contact 12 are further electrically connected to each other through the metal block 344 to fix the grounding layer. The first test contact 12, which is electrically connected to it 34, is characterized by an equal ground potential. Therefore, when the high-speed electronic component operating in the high frequency band of the die to be tested is touched by the second probe 54 of the probe set 50, the stable combination structure of the high-speed substrate 30 and the circuit substrate 10 can be integrated, and the integrated circuit wafer can be integrated. The electronic components of all the different operating bands of the die to be tested are simultaneously subjected to a complete electrical test.

Moreover, by the internal circuit layout structure of the high speed substrate 30, the height can be made high. The surface of the speed substrate 30 has a relatively large circuit space to add the remaining circuit components to adjust the capacitance or inductance characteristics of the second test signal transmitted by the high speed substrate 30. Therefore, the test component is electrically connected to the signal line 36 inside the high speed substrate 30. The ground layer 34 can elastically change the capacitance or inductance characteristic of the internal signal line 36 of the high-speed substrate 30 according to different specifications such as high-frequency signal transmission frequency or characteristic impedance of the electronic components in the die to be tested.

Please refer to another preferred embodiment of the present invention as shown in FIG. The test module 2 includes a high-speed substrate 30' disposed on the circuit substrate 10 as described above and extending to the adjacent probe set 50. The high-speed substrate 30' has a contact layer 32 and a ground layer as provided in the above embodiment. 34 and the signal layer 360, and the majority of the signal lines 36 are disposed on the signal layer 360 and partially disposed inside or on the surface of the contact layer 32; the difference is only that the signal layer 360 has a ground layer 34 and an outer ground layer 34 respectively. The second test signal transmitted by the signal line 36 of the contact layer 32 and the signal layer 360 has its corresponding ground signal loop passing through the ground layer 34 and the outer ground layer 34', respectively, to avoid defects in any high frequency path structure. The remaining high frequency paths are affected, and the dielectric loss of the surrounding dielectric material transmitted by the second test signal transmitted by the signal line 36 can be reduced.

As for the outer ground layer 34' and between, as shown in the thirteenth figure, the high speed The flexible circuit board 300 of the substrate 30' is provided with through holes 342 provided in the above embodiments, and the positive contact is located on the first test contact 12, and simultaneously removes the local contact layer 32 and the edge of the through hole 342. The edge of the hole 342 is adjacent to a partial surface of the flexible circuit board 300 of the circuit substrate 10, so that the ground layer 34 and the outer ground layer 34' are exposed in the through hole 342; therefore, the conductive material can be used in the through hole according to the above embodiment. In the hole 342, the ground layer 34 and the outer ground layer 34' are welded to the first test contact 12, and the solder material is solidified. The metal block 344 constitutes one of the ground contacts 324. Therefore, the grounding layer 34 and the external ground layer 34' receive the ground potential provided by the testing machine by the grounding contact 324, and the grounding layer 34 and the outer grounding layer 34' are connected to the first test contact 12 of the circuit substrate 10 by soldering. The function of the high-speed substrate 30' and the circuit board 10 is fixed to each other.

It is worth mentioning that the high speed substrate provided by the present invention can be as described in the above embodiment. It is made only by a single flexible circuit board, and the signal line corresponding to the high-frequency signal transmission position is planned in the flexible circuit board according to the circuit layout of the integrated circuit wafer; or as shown in the fourteenth and fifteenth figures respectively A test module 3, 4 provided for the third and fourth preferred embodiments of the present invention has a high speed substrate 70, 90 extending in a plurality of flexible circuit boards, respectively, as provided in the above embodiment. The circuit board 10 has upper and lower surfaces 106 and 108. Each of the high-speed substrates 70 and 90, like the one provided in the above embodiment, has a flexible circuit board 702, 902 covering the first test contact 12 of the circuit substrate 10, and extending from the upper surface 106 of the circuit substrate 10 from the test area 102 to The probe area 104 differs only in that the flexible circuit boards 702 and 902 are electrically connected to the other flexible circuit boards 704 and 904 in the probe area 104, and are connected to the flexible circuit boards 704 and 904 as in the above embodiment. The second probe 54 of the probe set 50 is provided, wherein: the high-speed substrate 70 shown in FIG. 14 is electrically connected to the flexible circuit boards 702 and 704 by an adapter 706, and the adapter 706 can be For the multi-matrix switching element, the majority of the signal lines 72 disposed on the flexible circuit board 702 corresponding to the upper surface 106 of the circuit substrate 10 are switched to the majority of the signal lines 74 of the flexible circuit board 704 corresponding to the lower surface 108 of the circuit substrate 10. One-to-one electrical conduction.

The high-speed substrate 90 shown in the fifteenth figure, the flexible circuit board 902, 904 A plurality of high frequency transmission lines 906 are electrically connected to jump a plurality of signal lines 92 disposed on the flexible circuit board 902 corresponding to the upper surface 106 of the circuit substrate 10 to a flexible circuit board corresponding to the lower surface 108 of the circuit substrate 10. Most of the signal lines 94 of 904 are electrically turned on one to one.

Therefore, the flexible circuit boards 702, 704 of the high speed substrate 70 (or 90) (or 902, 904) The signal lines 72, 74 (or 92, 94) of the fixed path may be prepared in advance, and the signal lines 72 corresponding to the upper and lower surfaces 106, 108 respectively according to the circuit layout of the actual integrated circuit wafer, 74 (or 92, 94) is turned on and off to accelerate the module manufacturing time of the test module 3 (or 4).

The above-mentioned embodiments are merely preferred embodiments of the present invention, and equivalent structural changes to the scope of the present invention and the scope of the claims are intended to be included in the scope of the present invention.

1‧‧‧Test module

10‧‧‧ circuit board

102‧‧‧Test area

104‧‧‧ probe area

106‧‧‧Upper surface

108‧‧‧ lower surface

12‧‧‧First test contact

16‧‧‧First signal line

30‧‧‧High speed substrate

300‧‧‧Soft circuit board

32‧‧‧Contact layer

322‧‧‧Second test contact

324‧‧‧ Grounding contacts

34‧‧‧ Grounding layer

36‧‧‧Signal line

360‧‧‧Signal layer

362‧‧‧Second probe contact

364‧‧‧Ground probe contact

38‧‧‧Insulation

50‧‧‧ probe set

502‧‧‧ Fixed seat

504‧‧‧metal pieces

506‧‧‧Insulating rubber

54‧‧‧second probe

542‧‧‧Metal Needle

544‧‧‧Ground

Claims (18)

A high-speed substrate for equipping a circuit substrate having a plurality of first test contacts for transmitting a low-frequency test signal provided by a test machine to transmit a high-frequency test signal provided by the test machine, the high-speed substrate The utility model has an upper surface and a lower surface; one end has a plurality of through holes and a plurality of second test contacts, each of the through holes is available for one of the test heads of the test machine, and each of the second test contacts is available Transmitting the high frequency test signal of the test machine; the other end is located at the opposite end of the one end, and has a plurality of probe contacts and at least one ground probe contact, and each of the probe contacts can be used for a high frequency probe The at least one grounding probe contact is electrically connected to a grounding probe; the majority of the signal lines, the two ends of each of the signal lines are respectively electrically connected to the probe contacts and the second test contacts And connecting at least one ground layer to the at least one grounding probe contact. The high speed substrate according to claim 1, wherein the high speed substrate has a signal layer, and each of the signal lines is located in the signal layer. The high speed substrate according to claim 1, wherein the high speed substrate has a contact layer, and each of the second test contacts is located at the contact layer. According to the high-speed substrate of claim 2, the high-speed substrate further has a contact layer, and the ground layer is provided between the contact layer and the signal layer. According to the high-speed substrate of claim 2, the high-speed substrate further has a contact layer, and the signal layer is provided between the contact layer and the ground layer. According to the high-speed substrate of claim 3, the signal line portions are disposed inside or on the surface of the contact layer. According to the high-speed substrate of claim 4, the high-speed substrate is further provided with an outer ground layer, and the signal layer is located between the ground layer and the outer ground layer. According to the high speed substrate of claim 7, the outer ground layer of the high speed substrate is exposed at least one of the through holes. The high-speed substrate according to any one of claims 4 to 5, wherein the contact layer and the signal layer respectively have a signal line overlapping with each other. The high speed substrate according to any one of claims 4 or 5, wherein the contact layer or the signal layer has at least two signal lines of the same length. According to the high-speed substrate of claim 1, the ground layer of the high-speed substrate is exposed adjacent to the probe contacts and forms the ground probe contact. The high-speed substrate according to claim 1, wherein the ground layer of the high-speed substrate is exposed to at least one of the through holes. The high speed substrate further includes at least one ground contact electrically connected to the at least one ground contact. According to the high speed substrate of claim 13, the at least one ground contact is located at one of the contact layers of the high speed substrate or the ground layer. According to the high-speed substrate of claim 14, the grounding layer of the high-speed substrate is provided with a blind hole, and the grounding contact is located on the grounding layer and exposed through the blind hole. According to the high-speed substrate of claim 1, the high-speed substrate further includes at least one circuit component disposed on a surface of the high-speed substrate for adjusting a capacitance or an inductance of the test signal transmitted by the high-speed substrate. characteristic. According to the high speed substrate of claim 1, the ground layer of the high speed substrate is exposed at the edge of the high speed substrate. A high-speed substrate for equipping a circuit substrate having a plurality of first test contacts for transmitting a low-frequency test signal provided by a test machine to transmit a high-frequency test signal provided by the test machine, the high-speed substrate The utility model has an upper surface and a lower surface; one end has a plurality of through holes and a plurality of second test contacts, each of the through holes is available for one of the test heads of the test machine, and each of the second test contacts is available Transmitting a high frequency test signal of the test machine, wherein at least one of the plurality of through holes is for one of the plurality of first test contacts of the circuit substrate; and the other end is located at an opposite end of the one end, A plurality of probe contacts are connected to at least one ground probe, and each of the probe contacts is electrically connected to a high frequency probe, and the at least one ground probe contact is electrically connected to a ground probe; Each of the signal lines is electrically connected to each of the probe contacts and each of the second test contacts; and at least one ground layer is electrically connected to the at least one ground probe contact.