TWI538116B - Biosensor package and method of forming the same - Google Patents

Description

Sense wafer assembly and method of forming same

The present invention relates to sensing wafers, and more particularly to sensing wafer structures having microfluidic channels and methods of forming the same.

In biochemical analysis, a molecule that has been irradiated or fluorescently labeled is often used as a probe. When the probe molecule is combined with the corresponding molecule to be tested, the molecule to be tested can be observed by means of a marker.

Biochips use microelectromechanical technology to implant probe molecules into a wafer and perform various biochemical analyses through bio-binding properties, which can include genes, proteins or cell tissues, and can be applied to, for example, genes and proteins. Functional research, new drug development, clinical testing, strain testing, legal testing, and military surveillance.

Among them, micro-fluidics integrates various components required in the detection process on the same wafer, and then drives the sample or reagent to move in the micro-pipe connecting the components to complete the detection. In addition to the advantages of high sensitivity, high specificity, fast analysis speed, and small sample detection and reagents, this one-piece multi-function wafer can greatly simplify the analysis operation procedure and has become the focus of wafer technology research and development. In response to the development of fluid wafers, new fabrication structures and techniques are needed to improve the performance of fluid wafers, improve the dimensional accuracy of components or structures, and ensure the accuracy of wafer operations.

The present invention provides a sensing wafer package comprising: a printed circuit board; a bottom cover disposed on the printed circuit board, wherein the bottom cover has a first recess; the sensing wafer is disposed in the first recess, wherein the sensing The wafer has a plurality of backside pads; a top cover disposed on the bottom cover, wherein the top cover has a second recess toward the bottom cover to form a fluid passage; the back hole passes through the printed circuit board and the bottom cover to expose the back side connection a pad; a connecting structure electrically connecting the sensing chip and the printed circuit board via the back hole.

The present invention provides a method of forming a sensing wafer package, comprising: providing a bottom cover, wherein the bottom cover has a first recess; and the sensing wafer is disposed in the first recess, wherein the sensing wafer has a plurality of backside pads Providing a top cover on the bottom cover, wherein the top cover has a second recess toward the bottom cover to form a fluid passage; the printed circuit board is disposed to the bottom cover opposite to one side of the first recess; forming a connection structure through the exposed back The back holes of the side pads are electrically connected to the sensing wafer and the printed circuit board.

100‧‧‧Preferred microfluidic wafer assembly

101, 102‧‧‧ holes

110‧‧‧Wire structure

200‧‧‧Sensor wafer assembly

201‧‧‧ entrance

202‧‧‧Export

210‧‧‧Printed circuit board

220‧‧‧ bottom cover

222‧‧‧first groove

224‧‧‧Filling

230‧‧‧Sensor wafer

232‧‧‧Back side pads

240‧‧‧Top cover

250‧‧‧ fluid passage

260‧‧‧ Back hole

270‧‧‧ Connection structure

280‧‧‧Packaging materials

310‧‧‧ bottom cover

310a‧‧‧ upper surface

312‧‧‧First groove

314‧‧‧ openings

410‧‧‧Sensor wafer

410a‧‧‧ upper surface

412‧‧‧Back side pad

510‧‧‧Filling

510a‧‧‧ upper surface

610‧‧‧Top cover

612‧‧‧second groove

620‧‧‧ fluid passage

710‧‧‧Printed circuit board

720‧‧‧ Back hole

810‧‧‧ Connection structure

820‧‧‧Packaging materials

T1‧‧‧ thickness

D1‧‧ depth

H1‧‧‧section height

R1’‧‧‧ wafer area

R1, R2‧‧‧ reaction area

Figure 1 shows a conventional microfluidic wafer assembly.

Figure 2A shows a top view of the sensing wafer assembly in accordance with one embodiment of the present invention.

Fig. 2B is a cross-sectional view showing the A-A section of the sensing wafer structure in Fig. 2A.

3-8 are schematic cross-sectional views showing a process of sensing a wafer package in accordance with an embodiment of the present invention.

In order to make the objects, features and advantages of the present invention more comprehensible, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, it should be noted that the present invention provides many applications for development. Concept, which can be implemented in a variety of specific styles. The specific embodiments discussed herein are merely illustrative of specific ways of making and using the invention, and are not intended to limit the scope of the invention. Moreover, repeated numbers or labels may be used in different embodiments. These repetitions are merely for the purpose of simplicity and clarity of the invention and are not to be construed as a limitation of the various embodiments and/or structures discussed.

The specific elements and arrangements of the present invention are intended to be simplified and not limited thereto. For example, when the first element is formed on the second element, the first element may be directly in contact with the second element, and the additional element may be formed between the first element and the second element. The situation in which the first element and the second element are not in direct contact.

Moreover, various features of the drawings are not shown Conversely, the dimensions of various features may be arbitrarily expanded or reduced for simplicity or convenience of labeling. Furthermore, elements not shown or described in the figures may be in a form known to those of ordinary skill in the art.

Any two element dimensions (eg, thickness, height, or depth, etc.) as used herein means "substantially the same" means that the difference in size of the two components is less than 10% of the size of one of the components. For example, the difference in size between the two components is one of the components. 0-5% of the size; or any component size range is 90-110% of the size of the other component.

Figure 1 shows a conventional microfluidic wafer assembly 100. In this device, the flow system enters and exits the sensing wafer via the holes 101/102 on the diagonal (top left to the lower right), and the reaction area is limited to the reaction area R1 as shown in the figure, and the entire square wafer cannot be effectively utilized. Area (R1'). Furthermore, as shown in FIG. 1, the conventional microfluidic wafer assembly is more than the wafer surface connected to the wafer via the wire bonding structure 110. Unlike printed circuit boards, however, there are bare metal structures (eg, bond pads) on the sensing wafer that may react with the sample or reagent to initiate a metal corrosion that affects the operation of the fluid wafer. In addition, as the size of the sensed wafer is reduced, the tolerance requirements of the various components or structures are more stringent, and new fabrication techniques are needed to ensure dimensional accuracy of the component or structure.

In order to solve the above problems, the present invention provides a sensing wafer assembly and a method of forming the same. In the sensing wafer assembly, the fluid inlet and outlet are disposed on both sides of the sensing wafer to enhance the use efficiency of the fluid wafer; the wafer receiving space and the fluid channel are formed through the combination of the top cover and the bottom cover, and are formed on the wafer. The back side forms a wire bonding structure connecting the wafer and the printed circuit board, which can provide a smoother wafer accommodating space and ensure the accuracy of the fluid passage, and can effectively avoid metal corrosion problems.

2A is a top view of the sensing wafer assembly in accordance with an embodiment of the present invention; and FIG. 2B is a cross-sectional view showing the A-A section of the sensing wafer assembly in FIG. 2A. As shown in FIG. 2A, the sensing wafer assembly 200 of the present embodiment includes a printed circuit board 210, a bottom cover 220, a sensing wafer 230, and a top cover 240. In one embodiment, the top cover 240 includes an inlet 201 and an outlet 202, wherein fluid can be injected from the inlet 201, along the fluid channel 250 through the reaction zone R2 of the sense wafer 230, and then out of the outlet 202. As shown in FIG. 2A, the inlet 201 and the outlet 202 are respectively located on opposite sides of the sensing wafer 230, and the inlet 201 and the outlet 202 are located outside the area occupied by the sensing wafer, and the fluid can flow through the sensing wafer 230. The entire area, thereby expanding the reaction area of the sensing wafer to improve the performance of the sensing wafer.

The configuration of each component in the sense wafer assembly 200 is as shown in FIG. 2B. The bottom cover 220 is disposed on the printed circuit board 210, and the bottom cover 220 has There is a first groove 222. The sensing wafer 230 is disposed in the first recess 222, and the filler 224 is filled in the first recess 222 to sense a region other than the wafer 230. The top cover 240 is disposed on the bottom cover 220, and the top cover 240 has a second recess 242 facing the bottom cover 220 to form a fluid passage 250 above the sensing wafer. In addition, the sensing chip 230 has a plurality of back side pads 232. The back holes 260 pass through the printed circuit board 210 and the bottom cover 220 to expose the back side pads 232. The connecting structure 270 is electrically connected through the back holes 260. The wafer 230 and the printed circuit board 210, and the encapsulation material 280 are filled into the back hole 260 to cover the connection structure 270.

3-8 are schematic cross-sectional views showing a process of sensing a wafer package according to an embodiment of the present invention, and a method of forming a sensing wafer structure in an embodiment will be described below with reference to FIGS. 3-8.

As shown in FIG. 3, a bottom cover 310 is first provided, wherein the bottom cover 310 has a first recess 312 and the first recess 312 includes an opening 314 that penetrates the bottom cover 310. The first recess 312 of the bottom cover 310 is used to carry the sensing wafer to provide a relatively stable accommodation space for the sensing wafer. That is, the sensing wafer structure of the present invention avoids directly placing the sensing wafer on the printed circuit board, which eliminates the problem of unevenness of the surface of the printed circuit board.

As shown in FIG. 4, the sensing wafer 410 is disposed in the first recess 312, wherein the sensing wafer 410 has a plurality of backside pads 412, and the backside pads 412 are exposed through the openings 314. The sensing wafer 410 can be secured in the first recess 312 via any suitable means. In some embodiments, the sensing wafer 410 is fixed in the first recess 312 via an adhesive, and suitable adhesives include: synthetic resin, epoxy, polyurethane (PU), or Polyacrylate.

In some embodiments, when the sensing wafer 410 is disposed in the first recess 312, the upper surface 310a of the bottom cover 310 and the upper surface 410a of the sensing wafer 410 are coplanar. In some embodiments, the thickness T1 of the sensing wafer 410 is substantially the same as the depth D1 of the first recess 312. When the sensing wafer 410 is disposed in the first recess 312, the upper surface 310a of the bottom cover 310 and the sense The height of the upper surface 410a of the wafer 410 is substantially the same.

As shown in FIG. 5, the filler 510 senses a region outside the wafer 410 in the first recess 312, which prevents fluid (eg, reagent or sample solution) from penetrating or flowing into the first recess 312 for sensing. A void other than the wafer 410. Accordingly, those skilled in the art will appreciate that the filler 510 can be any suitable filler material. In some embodiments, the filler 510 does not react with a fluid (eg, a reagent or sample solution). In some embodiments, the filler 510 is a chemical resistant filler material. In some embodiments, the filler 510 is a strong alkali resistant filler material. Specific materials of the filler 510 may include: polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyethylene (PE), synthetic resin, or epoxy. In some embodiments, the upper surface 510a of the filler 510 is coplanar with the upper surface 310a and the upper surface 410a, or the upper surface 510a of the filler 510 is substantially the same as the height of the upper surface 310a and the upper surface 410a.

As shown in FIG. 6, a top cover 610 is provided on the bottom cover 310, wherein the top cover 610 has a second recess 612 toward the bottom cover 310 to form a fluid passage 620. In some embodiments, the top cover 610 is secured to the bottom cover 310 via an adhesive, and suitable adhesives include: synthetic resin, epoxy, polyurethane, or polyacrylate. (polyacrylate).

In some embodiments, the top cover 610 is abutted on the sensing wafer 410, that is, the top cover 610 is disposed on the bottom cover 310 and the sensing wafer 410 based on the upper surface 410a of the sensing wafer 410. So that a fluid channel 620 is formed on the sensing wafer 410. In some embodiments, the fluid channel 620 has a cross-sectional height H1 of 90-110 [mu]m. In some embodiments, the fluid channel 620 has a cross-sectional height tolerance value of less than 10 [mu]m.

The sensing wafer assembly of the present invention forms a fluid channel 620 between the bottom cover 310 and the top cover 610 such that fluid (eg, reagent or sample solution) does not contact the printed circuit board, and the printed circuit board can be avoided. Problems such as corrosion or surface property change; and the design is based on sensing the wafer surface, assembling the top cover to form a fluid passage, helping to control the level of the device, avoiding fluid flow unevenness affecting the analysis result, and strengthening the bottom cover 310 And the tightness between the top cover 610 to avoid fluid leakage or moisture leakage; and to reduce device tolerances and ensure the accuracy of the fluid passage size.

The bottom cover 301 and the top cover 610 may be the same or different materials. In some embodiments, the material of the bottom cover 301 and the top cover 610 does not react with a fluid (eg, a reagent or a sample solution). In some embodiments, the material of the bottom cover 301 and the top cover 610 is chemically resistant. In some embodiments, the bottom cover 301 and the top cover 610 are made of a strong alkali resistant material. The material of the bottom cover 301 and the top cover 610 can be independently: polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), polyphenylene sulfide. (PPS), polyethylene (PE), acrylonitrile butadiene styrene (ABS), cyclic olefin copolymer polymer (COC), acrylic, epoxy, fiber reinforcement Fiber reinforced plastics (FRP), or a combination of the above. In some embodiments The top cover 610 is made of a transparent material for the detection method of the illuminating analysis.

As shown in FIG. 7, the printed circuit board 710 is disposed opposite to the side of the first recess 312, wherein the opening 314 of the bottom cover 310 and the opening of the printed circuit board 710 form a back hole 720, and thus, the back The holes 720 pass through the printed circuit board 710 and the bottom cover 310 and expose the back side pads 412 of the sensing wafer 410.

Printed circuit board 710 can be provided to bottom cover 310 via any suitable means. In some embodiments, the printed circuit board 710 is secured to the bottom cover 310 via an adhesive. The printed circuit board 710 can be any suitable printed circuit board, such as a high-density printed circuit board, a high-level board, a soft and hard composite board, a flexible circuit board, and a suitable printed circuit board material can be selected according to requirements, wherein the organic substrate The material includes, for example, a paper substrate copper foil substrate (FR1, FR2 or FR3), a glass substrate copper foil substrate (FR4 or FR5), a composite copper foil substrate, a thermoplastic substrate, or a flexible substrate; and an inorganic substrate material such as Including: ceramic substrates such as alumina, aluminum nitride and tantalum carbide, metal substrates, tantalum substrates, or other suitable printed circuit boards.

As shown in FIG. 8, a connection structure 810 is formed and filled with an encapsulation material 820 in the back hole 720 to cover the connection structure 810, thereby completing the biosensing wafer assembly.

In some embodiments, the connection structure 810 electrically connects the sensing wafer 410 and the printed circuit board 710 via the back hole 720 exposing the back side pad 412. In some embodiments, the connection structure 810 is a wire bonding structure, and the encapsulation material 820 can include: an epoxy resin, a phenolic resin, or other suitable packaging material.

The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the scope of the appended claims.

210‧‧‧Printed circuit board

220‧‧‧ bottom cover

222‧‧‧first groove

224‧‧‧Filling

230‧‧‧Sensor wafer

232‧‧‧Back side pads

240‧‧‧Top cover

250‧‧‧ fluid passage

260‧‧‧ Back hole

270‧‧‧ Connection structure

280‧‧‧Packaging materials

Claims (12)

A sensing wafer assembly comprising: a printed circuit board; a bottom cover disposed on the printed circuit board, wherein the bottom cover has a first recess; a sensing wafer disposed in the first recess The sensing wafer has a plurality of backside pads; a top cover is disposed on the bottom cover, wherein the top cover has a second recess toward the bottom cover to form a fluid passage; a back hole, The back side pads are exposed through the printed circuit board and the bottom cover; a connecting structure is electrically connected to the sensing chip and the printed circuit board via the back hole. The sensing wafer assembly of claim 1, further comprising: a filler filling a region of the first recess other than the sensing wafer. The sensing wafer assembly of claim 1, further comprising: an encapsulating material filled in the back hole to encapsulate the connecting structure. The sensing wafer assembly of claim 1, wherein the top cover is attached to the bottom cover via an adhesive. The sensing wafer assembly of claim 1, wherein the top cover is against the sensing wafer. The sensing wafer assembly of claim 1, wherein an upper surface of the bottom cover and an upper surface of the sensing wafer are coplanar. The sensing wafer assembly of claim 1, wherein the fluid passage has a cross-sectional height of 90-110 μm. The sensing wafer assembly of claim 5, wherein the connecting structure is a wire bonding structure. The sensing wafer assembly of claim 1, wherein the material of the top cover and the bottom cover comprises: polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate ( PET), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyethylene (PE), acrylonitrile butadiene styrene (ABS), cyclic olefin copolymerization polymer (COC) ), acrylic, epoxy, fiber reinforced plastics (FRP), or a combination thereof. A method for forming a sensing wafer assembly, comprising: providing a bottom cover, wherein the bottom cover has a first recess; and a sensing wafer is disposed in the first recess, wherein the sensing wafer has a plurality of backs a side pad; a top cover is disposed on the bottom cover, wherein the top cover has a second recess toward the bottom cover to form a fluid passage; and a printed circuit board is disposed to the bottom cover opposite to the first recess One side of the slot; forming a connection structure electrically connecting the sensing chip and the printed circuit board via a back hole exposing one of the back side pads. The method for forming a sensing wafer package according to claim 11, further comprising: filling a region of the first recess in the first recess other than the sensing wafer. The method for forming a sensing wafer package according to claim 11, further comprising: filling a sealing material in the back hole to cover the connecting structure.